KR102303533B1 - Light emitting diode array and backlight unit having the same - Google Patents

Abstract

LED array according to an embodiment of the present invention, a plurality of LEDs comprising a first COB (Chip On Board) type substrate, an LED chip disposed on the first substrate, and a silicon cover disposed on the first substrate a package and a second substrate on which the plurality of LED packages are mounted, wherein the silicon cover includes an upper surface facing the upper surface of the LED chip, first side surfaces facing each other, and second side surfaces facing each other, , The LED package further includes a reflective layer disposed on the second side.

Description

LED array and backlight unit including same {LIGHT EMITTING DIODE ARRAY AND BACKLIGHT UNIT HAVING THE SAME}

The present invention relates to an LED array, and more particularly, to an LED array, a backlight unit including the same, and a liquid crystal display device.

In general, a liquid crystal display is a device that displays a desired image by adjusting the light transmittance of liquid crystal cells arranged in a matrix form according to image signal information. An image is formed on the panel. The liquid crystal display device using this principle has a tendency to gradually expand its application range due to features such as light weight, thin shape, and low power consumption driving. And according to this trend, liquid crystal display devices are being used for office automation equipment, audio/video equipment, and the like. In such a liquid crystal display device, a desired image is displayed on a screen by adjusting the amount of light transmission according to signals applied to a plurality of control switches arranged in a matrix form. Recently, liquid crystal display devices have been widely applied to not only computer monitors and televisions, but also display devices of vehicle navigation systems, and portable display devices such as notebook computers and mobile phones. A general liquid crystal display device converts a specific molecular arrangement of a liquid crystal into a different molecular arrangement by applying a voltage, and visually observes changes in optical properties such as birefringence, optical rotation, dichroism and light scattering characteristics of a liquid crystal cell that emits light by this molecular arrangement. It is a light-receiving type display device that displays information using modulation of light by a liquid crystal cell. Since such a liquid crystal display device is a light-receiving device, it includes a backlight unit that provides light to express an image, and the backlight unit is classified into a direct type and an edge type according to the arrangement of the light source. .

The direct type backlight unit is a method in which a plurality of light sources are arranged at regular intervals directly under the liquid crystal display panel and irradiate directly under the liquid crystal display panel. It is a method of irradiating light to the liquid crystal display panel by

Recently, a light emitting diode (LED) has been in the spotlight as a light source used in a backlight unit. Since LED has high light conversion efficiency, power consumption is relatively low, response speed is fast, lighting circuit is simple, and it is widely used for indoor and outdoor lighting because of its excellent safety advantages. In general, LED lighting can be largely divided into a side type using a light guide plate and a direct type in which the light emitted from the LED is directly emitted. At this time, a plurality of LED packages are mounted on a printed circuit board, and a diffusion plate is provided thereon and manufactured.

Figure 1 is a cross-sectional view of a conventional top view (Top View) type LED, Figure 2 is a top view of a conventional COB (Chip on board) type LED.

Referring to FIG. 1 , a conventional top view type LED 10 has a limited light directing angle (typically 120 degrees) due to an inner wall indicated by a dotted line. Therefore, since light is not dispersed to the side of the LED 10 , when a plurality of LEDs 10 are spaced apart from each other by a predetermined interval or more, light is concentrated in the vicinity of the LED 10 to cause a hot spot.

Referring to FIG. 2 , the conventional COB type LED 20 emits light in all directions (360 degrees) in the direction of the arrow, so that the light is dispersed and the light efficiency is low.

In addition, in order to solve a hot spot, etc., there is a problem in that at most about 100 LEDs or more must be mounted, so that the manufacturing cost increases. Furthermore, since room lighting installed and used on the ceiling of a living room or room of a house is relatively inexpensive, when manufactured using an existing LED package, the manufacturing price increases significantly, which is not suitable.

In an embodiment according to the present invention, an LED array capable of reducing the total number of LED packages and a backlight unit including the same can be increased by increasing the distance between the LED packages by adjusting the beam angle of the light emitted from the LED (LIGHT EMITTING DIODE) chip. can provide

In addition, the embodiment according to the present invention may provide an LED array capable of solving a phenomenon in which luminance is concentrated in the vicinity of a light source by adjusting the beam angle of light emitted from the LED chip, and a backlight unit including the same.

LED array according to an embodiment of the present invention, a plurality of LEDs comprising a first COB (Chip On Board) type substrate, an LED chip disposed on the first substrate, and a silicon cover disposed on the first substrate a package and a second substrate on which the plurality of LED packages are mounted, wherein the silicon cover includes an upper surface facing the upper surface of the LED chip, first side surfaces facing each other, and second side surfaces facing each other, , The LED package further includes a reflective layer disposed on the second side. In addition, the backlight unit according to an embodiment of the present invention includes the LED array and a bottom cover accommodating the LED array, and the LED array is disposed on a bottom or a side surface of the bottom cover. When the plurality of LED packages are disposed on the second substrate, when the short-axis surfaces of the plurality of LED packages face each other, a diffusion layer is disposed on the short-axis surface and a reflective layer is disposed on the long-axis surface, and the long-axis surfaces of the plurality of LED packages face each other In the case of facing each other, by disposing a diffusion layer on the long axis surface and a reflective layer on the short axis surface, the amount of light emitted to the short axis surface or the long axis surface of the plurality of LED packages can be further increased, thereby increasing the distance between the plurality of LED packages. Thus, there is an effect of reducing the number of total LED packages.

Also, in the LED array according to another embodiment of the present invention, the first side surfaces include facing corresponding surfaces between adjacent LED packages mounted on one second substrate. In addition, the LED package further includes a patterned layer or diffusion layer disposed on the first side surfaces, and the LED package further includes a patterned layer or diffusion layer disposed on the upper surface of the silicon cover, The upper surface includes a pattern-formed region and a pattern-unformed region, the pattern-unformed region faces the upper surface of the LED chip, and the pattern layer or the diffusion layer is disposed in the pattern-formed region. And also, the upper surface and the first side surfaces of the silicon cover integrally form one inclined surface. In addition, the second side surfaces of the silicone cover have inclined surfaces, and the distance between the second side surfaces facing each other increases from the rear surface to the upper surface of the silicone cover. A portion of the light emitted from the first and second sides of the silicon cover may be blocked and reflected therein. In addition, the amount of light emitted to the third and fourth side surfaces and the upper surface may be increased. That is, the light beam direction can be adjusted by reducing the amount of light emitted from the first and second side surfaces and increasing the amount of light emitted to the third and fourth side surfaces and the upper surface. In addition, the reflective layer lowers the light extraction rate through internal reflection of light, and the first and second pattern layers improve the light extraction rate, thereby designating a path of light in the LED package to increase the amount of light emitted through a designated path.

In an embodiment according to the present invention, by controlling the orientation angle of the light emitted from the LED chip, it is possible to prevent the luminance from being concentrated in the vicinity of the light source and increase the distance between the LED packages, thereby reducing the total number of LED packages. An array and a backlight unit including the same may be provided.

1 is a cross-sectional view of a conventional top view (Top View) type of LED.
Figure 2 is a top view of a conventional COB (Chip on board) type LED.
3 is a perspective view of a first substrate including an LED chip according to an embodiment of the present invention;
4 is a perspective view of a silicone cover according to an embodiment of the present invention.
5 and 6 are perspective views of an LED package according to a first embodiment of the present invention.
7 is a perspective view of an LED package according to a second embodiment of the present invention.
8 is a perspective view of an LED package according to a third embodiment of the present invention;
9 is a perspective view of an LED package according to a fourth embodiment of the present invention;
10 is a cross-sectional view taken along line AB of FIG. 9 ;
11 is a perspective view of an LED package according to a fifth embodiment of the present invention;
Fig. 12 is a cross-sectional view taken along the dotted line of the CD of Fig. 11;
13 is a perspective view of an LED package according to a sixth embodiment of the present invention;
14 is a perspective view of an LED package according to a seventh embodiment of the present invention;
15 is a cross-sectional view taken along line EF of FIG. 14 .
16 is a perspective view of an LED array according to a first embodiment of the present invention.
17 is a perspective view of an LED array according to a second embodiment of the present invention.
18 is a perspective view of a liquid crystal display according to an embodiment of the present invention;
19 is a view showing the density of the light beam angle in the long axis direction of the conventional top view type LED and the light beam angle density in the long axis direction of the LED package according to the embodiment of the present invention.
20 is a view showing the density of the light directivity angle in the minor axis direction of the conventional top view type LED and the light directivity angle density in the minor axis direction of the LED package according to the embodiment of the present invention.

Hereinafter, an LED array according to an embodiment of the present invention and a backlight unit including the same will be described in detail with reference to the drawings. The embodiments introduced below are provided as examples so that the spirit of the present invention can be sufficiently conveyed to those skilled in the art. Accordingly, the present invention is not limited to the embodiments described below and may be embodied in other forms. And, in the drawings, the size and thickness of the device may be exaggerated for convenience. Like reference numbers refer to like elements throughout.

Advantages and features of the present invention and methods of achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various different forms, and only these embodiments allow the disclosure of the present invention to be complete, and common knowledge in the art to which the present invention pertains It is provided to fully inform those who have the scope of the invention, and the present invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout. The sizes and relative sizes of layers and regions in the drawings may be exaggerated for clarity of description.

Reference to an element or layer to another element or “on” or “on” includes not only directly on the other element or layer, but also with other layers or other elements interposed therebetween. do. On the other hand, reference to an element "directly on" or "directly on" indicates that there are no intervening elements or layers.

Spatially relative terms "below, beneath", "lower", "above", "upper", etc. are one element or component as shown in the drawings. and can be used to easily describe the correlation with other devices or components. The spatially relative terms should be understood as terms including different orientations of the device during use or operation in addition to the orientation shown in the drawings. For example, if an element shown in the figures is turned over, an element described as "beneath" or "beneath" another element may be placed "above" the other element. Accordingly, the exemplary term “below” may include both directions below and above.

The terminology used herein is for the purpose of describing the embodiments, and thus is not intended to limit the present invention. As used herein, the singular also includes the plural unless specifically stated otherwise in the phrase. As used herein, “comprise” and/or “comprising” refers to the presence of one or more other components, steps, operations, and/or elements mentioned. or addition is not excluded.

The LED array 2000 according to an embodiment of the present invention is of a COB (Chipon Board) type, and the LED package 2100 is mounted on a second substrate 2200 which is a chip-on-board (COB) substrate in plurality.

The COB type is a technology for directly mounting an LED chip on a PCB substrate, and has the advantage of reducing the path through which heat generated from the chip escapes, thereby increasing the heat dissipation effect, and reducing the height of the package itself to enable miniaturization.

<First substrate according to the embodiment>

3 is a perspective view of a first substrate including an LED chip according to an embodiment of the present invention.

Referring to FIG. 3 , a first substrate 2110 according to an embodiment of the present invention is a rectangular substrate and may include a base substrate 2111 and an LED chip 2112 . In addition, the base substrate 2111 has an upper surface 2113 , a rear surface 2114 facing the upper surface 2113 , a first side surface 2115 , and a second side surface 2116 facing the first side surface 2115 . ), a third side surface 2117 , and a fourth side surface 2118 facing the third side surface 2117 , and an LED chip 2112 on the upper surface 2113 of the first substrate 2110 . This can be placed In addition, the first and second side surfaces 2115 and 2116 may become long axis surfaces, and the third and fourth side surfaces 2117 and 2118 may become short axis surfaces.

Electrical wiring may be patterned on the upper surface 2113 and the lower surface 2114 of the first substrate 2110 , and the patterned wiring and the LED chip formed on the upper surface 2113 of the first substrate 2110 . 2112 may be connected.

<Silicone cover according to the embodiment>

4 is a perspective view of a silicone cover according to an embodiment of the present invention.

Referring to FIG. 4 , the silicon cover 2120 may have a rectangular shape, and may have a shape corresponding to the shape of the first substrate 2110 . The silicone cover 2120 has an upper surface 2121, a rear surface 2122 facing the upper surface 2121, a first side surface 2123, and a second side surface 2124 facing the first side surface 2123. , a third side surface 2125 and a fourth side surface 2126 facing the third side surface 2125 may be included. In addition, the first and second side surfaces 2123 and 2124 may be long axis surfaces, and the third and fourth side surfaces 2125 and 2126 may become short axis surfaces. The rear surface of the silicone cover 2120 ( The size of the area 2122 may vary according to the area of the upper surface 2113 of the first substrate 2110 , and an area equal to or smaller than the area of the upper surface 2113 of the first substrate 2110 . can have

The silicon cover 2120 may be formed by injecting silicon on the first substrate 2110 .

<LED package according to the first embodiment>

5 and 6 are perspective views of an LED package according to a first embodiment of the present invention.

Referring to FIG. 5 , the LED package 2100 according to the first embodiment of the present invention may include a first substrate 2110 and a silicon cover 2120 .

The first substrate 2110 includes a base substrate 2111 and an LED chip 2112 disposed on the base substrate 2111 , and the silicon cover 2120 is disposed on the base substrate 2111 . to cover the entire LED chip 2112 .

Referring to FIG. 6 , a reflective layer 2130 may be formed on at least one of the first to fourth side surfaces 2123 , 2124 , 2125 , and 2126 of the silicon cover 2120 . In this case, the reflective layer 2130 may be an Ag Coating layer.

Among the side surfaces 2123 , 2124 , 2125 , and 2126 of the silicon cover 2120 , the side on which the reflective layer 2130 is disposed may function to internally reflect the light emitted from the internal LED chip 2112 .

6 , the reflective layer 2130 is disposed on the first and second side surfaces 2123 and 2124 of the silicone cover 2120 . In this case, the first and second side surfaces 2123 and 2124 of the silicone cover 2120 . A part of the light emitted from the light can be blocked and reflected inside. In addition, the amount of light emitted to the third and fourth side surfaces 2125 and 2126 and the upper surface 2121 may be increased. That is, by reducing the amount of light emitted from the first and second side surfaces 2123 and 2124 and increasing the amount of light emitted to the third and fourth side surfaces 2125 and 2126 and the upper surface 2121, the light beam angle can be adjusted. have.

On the other hand, when the plurality of LED packages 2100 are disposed on a second substrate, which will be described later, when the short-axis surfaces of the plurality of LED packages 2100 face each other, the reflective layer 2130 is disposed on the long-axis surfaces, and the plurality of LEDs When the long axis surfaces of the packages 2100 face each other, the reflective layer 2130 is disposed on the short axis surface to increase the amount of light emitted to the short axis surface or the long axis surface of the plurality of LED packages 2100 to increase the amount of the plurality of LEDs. The distance between the packages 2100 may be increased. Thus, there is an effect that can reduce the number of the entire LED package (2100).

<LED package according to the second embodiment>

7 is a perspective view of an LED package according to a second embodiment of the present invention.

Referring to FIG. 7 , the LED package 2100 according to the second embodiment of the present invention may include a first substrate 2110 and a silicon cover 2120 . In addition, a reflective layer 2130 may be formed on at least one side of the first to fourth side surfaces 2123, 2124, 2125, and 2126 of the silicon cover 2120, and a pattern layer 2140 may be formed on the other side surface. have.

The pattern layer 2140 may increase the amount of light emitted to the outside of the silicon cover 2120 , that is, the light extraction efficiency from the side surface of the silicon cover 2120 .

When the plurality of LED packages 2100 are disposed on a second substrate to be described later, when the short-axis surfaces of the plurality of LED packages 2100 face each other, the pattern layer 2140 is formed on the short-axis surface, and the reflective layer is formed on the long-axis surface ( 2130), and when the long axis surfaces of the plurality of LED packages 2100 face each other, the pattern layer 2140 is disposed on the long axis surface and the reflective layer 2130 is disposed on the short axis surface of the plurality of LED packages 2100. The distance between the plurality of LED packages 2100 may be increased by further increasing the amount of light emitted to the short or long axis of the LED packages. Thus, there is an effect that can reduce the number of the entire LED package (2100).

<LED package according to the third embodiment>

8 is a perspective view of an LED package according to a third embodiment of the present invention.

Referring to FIG. 8 , the LED package 2100 according to the third embodiment of the present invention may include a first substrate 2110 and a silicon cover 2120 . In addition, a reflective layer 2130 may be formed on at least one side of the first to fourth side surfaces 2123, 2124, 2125, and 2126 of the silicon cover 2120, and the diffusion layer 2160 may be coated on the other side. .

The diffusion layer 2160 can increase the amount of light emitted to the outside of the silicon cover 2120 , that is, increase the light extraction efficiency from the side surface of the silicon cover 2120 , and can remove the non-uniformity of the light flux. And the diffusion layer 260 may be Tio2 (titanium dioxide).

When the plurality of LED packages 2100 are disposed on a second substrate to be described later, when the short-axis surfaces of the plurality of LED packages 2100 face each other, the diffusion layer 2160 is formed on the short-axis surface and the reflection layer 2130 is formed on the long-axis surface. ), and when the long axis surfaces of the plurality of LED packages 2100 face each other, a diffusion layer 2160 on the long axis surface and a reflective layer 2130 on the short axis surface are arranged on the short axis of the plurality of LED packages 2100 The distance between the plurality of LED packages 2100 may be increased by further increasing the amount of light emitted to the surface or the long axis. Thus, there is an effect that can reduce the number of the entire LED package (2100).

<LED package according to the fourth embodiment>

9 is a perspective view of an LED package according to a fourth embodiment of the present invention. And FIG. 10 is a cross-sectional view taken along line A-B of FIG. 9 .

9 and 10 , the LED package 2100 according to the fourth embodiment of the present invention may include a first substrate 2110 and a silicon cover 2120 . A reflective layer 2130 may be formed on at least one of the first to fourth side surfaces 2123 , 2124 , 2125 , and 2126 of the silicon cover 2120 , and a diffusion layer 2160 or a pattern layer 2140 on the other side surface of the silicon cover 2120 . ) can be placed. In addition, a pattern layer 2150 may be formed on the upper surface 2121 of the silicon cover 2120 . In this case, if the pattern layer 2140 formed on the side surface is referred to as a first pattern layer 2140 , the pattern layer 2150 formed on the upper surface 2121 may be referred to as a second pattern layer 2150 .

The reflective layer 2130 lowers the light extraction rate through internal reflection of light, and the first and second pattern layers 2140 and 2150 improve the light extraction rate. The amount of light can be increased.

<LED package according to the fifth and sixth embodiments>

11 is a perspective view of an LED package according to a fifth embodiment of the present invention. And FIG. 12 is a cross-sectional view taken along line C-D of FIG. 11 . And FIG. 13 is a perspective view of an LED package according to a sixth embodiment of the present invention.

11 and 12 , the LED package 2100 according to the fifth and sixth embodiments of the present invention may include a first substrate 2110 and a silicon cover 2120 . A pattern layer 2150 may be disposed on the upper surface 2121 of the silicon cover 2120 as shown in FIG. 11 or a diffusion layer 2160 may be disposed as shown in FIG. 13 . In addition, a reflective layer 2130 may be formed on the first to fourth side surfaces 2123 , 2124 , 2125 , and 2126 of the silicon cover 2120 . In this case, the first to fourth side surfaces 2123 , 2124 , 2125 , and 2126 may be inclined surfaces. Specifically, the first to fourth side surfaces 2123 , 2124 , 2125 , and 2126 may have a larger area of the upper surface 2121 of the silicon cover 2120 than the area of the rear surface 2122 of the silicon cover 2120 . Since it has an inclination to allow the first and second side surfaces 2123 and 2124 to each other, the distance from the rear surface 2122 of the silicon cover 2120 to the upper surface 2121 of the silicon cover 2120 is long. and the distance between the third and fourth side surfaces 2125 and 2126 may increase from the rear surface 2122 of the silicon cover 2120 to the upper surface 2121 of the silicon cover 2120 .

The light emitted from the LED chip 2112 is reflected toward the upper surface by the reflective layer 2130 formed on the first and second side surfaces 2123 and 2124 of the silicon cover 2120 to extract light from the upper surface 2121 . efficiency can be increased.

In addition, a reflective layer 2130 may be formed on at least one side of the first to fourth side surfaces 2123 , 2124 , 2125 , and 2126 of the silicon cover 2120 , and a diffusion layer 2160 or a pattern layer 2140 on the other side surface. ) can be placed. At this time, the side on which the reflective layer 2130 is formed has an inclination of the above-described shape to increase the emitted light to the upper surface 2121 , and the side on which the diffusion layer 2160 or the pattern layer 2140 is formed has a silicon cover 2120 . ) to be perpendicular to the rear surface 2122 to increase light extraction efficiency from the side where the diffusion layer 2160 or the pattern layer 2140 is formed.

Meanwhile, the upper surface 2121 of the silicon cover 2120 may include a pattern-formed region 2121a and a non-patterned region 2121b, and the pattern-unformed region 2121b faces the LED chip 2112 . area can be By not forming the pattern layer 2121 on the upper surface 2121 of the silicon cover 2120 facing the LED chip 2112, the light concentration in the region directly above the LED chip 2112 is prevented, The pattern layer 2121 may be formed on the upper surface 2121 of the silicon cover 2120 that does not face the LED chip 2112 to increase light extraction efficiency from the upper surface 2121 .

<LED package according to the seventh embodiment>

14 is a perspective view of an LED package according to a seventh embodiment of the present invention. And FIG. 15 is a cross-sectional view taken along line E-F of FIG. 14 .

14 and 16 , the LED package 2100 according to the seventh embodiment of the present invention may include a first substrate 2110 and a silicon cover 2120 . The silicon cover 2120 may include an upper inclined surface 2127 , and the upper inclined surface 217 includes the upper surface 2121 and the third and fourth side surfaces 2125 and 2126 of the silicon cover 2120 . It is made of one side. A reflective layer 2130 is formed on the first and second side surfaces 2123 and 2124 of the silicon cover 2120, and a pattern layer or a diffusion layer may be disposed on the upper inclined surface 2127 of the silicon cover 2120. have.

By varying the degree of curvature of the upper inclined surface 2127 to adjust the beam angle, the light emission direction and the light emission amount in a specific direction can be adjusted according to the number and arrangement relationship of the LED packages 2100 .

<LED array according to the first embodiment>

16 is a perspective view of the LED array according to the first embodiment of the present invention.

Referring to FIG. 16 , the LED array 2000 according to the first embodiment of the present invention may include an LED package 2100 and a second substrate 2200 . A wiring pattern for driving the LED package 2100 may be formed on the second substrate 2200 , the wiring pattern formed on the second substrate 2200 and the first substrate 2110 of the LED package 2100 . ), the LED package 2100 may be mounted on the second substrate 2200 to be electrically connected to the wiring pattern formed on the rear surface. The LED array 2000 according to the first embodiment of the present invention may be a top view type. That is, it may be disposed on the bottom of the bottom cover to be described later and serve to provide light in the upper direction. The LED packages 2100 formed on the second substrate 2200 may be arranged in a form in which short-axis surfaces face each other, and the light extraction efficiency from the short-axis surfaces of each of the LED packages 2100 is high, so that the LED package ( 2100) may increase the distance l1 between each other, and accordingly, the number of the LED packages 2100 may be reduced.

<LED array according to the second embodiment>

17 is a perspective view of an LED array according to a second embodiment of the present invention.

Referring to FIG. 17 , the LED array 2000 according to the second embodiment of the present invention may be a side view type. The LED array 2000 according to the second embodiment may be disposed on the side of the bottom cover to be described later. The LED packages 2100 formed on the second substrate 2200 may be arranged in a form in which short-axis surfaces face each other, and the light extraction efficiency from the short-axis surfaces of each of the LED packages 2100 is high, so that the LED package ( 2100 ) may increase the distance l2 between each other, and accordingly, the number of the LED packages 2100 may be reduced.

Meanwhile, in the case of the silicon cover 2120 in the LED array 2000 according to the first and second embodiments, the third and fourth side surfaces 2125 and 2126 and the third and fourth side surfaces 2125 and 2126 of the first substrate 2110 ( 2117 and 2118 may be surfaces facing each other between the plurality of LED packages 2100 mounted on one second substrate 2200, and these sides may be referred to as corresponding surfaces.

<Liquid crystal display device according to the embodiment>

18 is a perspective view of a liquid crystal display according to an embodiment of the present invention.

As shown in FIG. 18 , the liquid crystal display 1000 includes a liquid crystal panel 1100 , a backlight unit 1200 , and a support main 1300 , a bottom cover 1500 , and a top cover 1400 .

The liquid crystal panel 1100 includes a color filter array substrate 1120 and a TFT array substrate 1140 and a liquid crystal layer (not shown) interposed therebetween, and the color filter array substrate 1120 and the TFT array substrate ( A polarizing plate (not shown) is attached to the outer surface of the 1140 , respectively.

In the liquid crystal panel 1100 , liquid crystal cells constituting a pixel unit are arranged in a matrix form, and the liquid crystal cells adjust light transmittance according to image signal information transmitted from a driver driving circuit to form an image.

Specifically, on the inner surface of the TFT array substrate 1140, a plurality of gate lines and data lines intersect to define a pixel, and a thin film transistor (TFT) is provided at each intersection to form a pixel. It is connected to the transparent pixel electrode in a one-to-one correspondence.

In addition, on the inner surface of the color filter array substrate 1120, a color filter of red (R), green (G), and blue (B) colors as an example corresponding to each pixel, and a gate line surrounding each of them A black matrix for covering non-display elements such as the data line and the thin film transistor is provided. In addition, a transparent common electrode covering them is provided.

At least along one edge of the liquid crystal panel 1100, the gate and the data printed circuit board 1170 are connected via a connecting member 1160 such as a flexible circuit board, so that in the modularization process, the side or bottom cover of the support main 1300 It is in close contact with the back side of (1500).

The driving signal of the liquid crystal panel 1100 provided from the gate and data printed circuit board 1170 on one side of the liquid crystal panel 1100 is supplied to a plurality of gate wires and a plurality of data wires of the liquid crystal panel 1100 . and the liquid crystal panel 1100 is driven. When the liquid crystal panel 1100 controls the voltage of the data signal applied to the pixel electrode while the voltage is applied to the common electrode, the liquid crystal layer rotates by dielectric anisotropy according to the electric field between the common electrode and the pixel electrode, An image is displayed by transmitting or blocking light for each pixel area.

In addition, although not clearly shown in the drawing, an alignment film that determines the initial molecular arrangement direction of the liquid crystal is interposed at the boundary between the color filter array substrate 1120 and the TFT array substrate 1140 of the liquid crystal panel 1100 and the liquid crystal layer. , a seal pattern is formed along the edges of the color filter array substrate 1120 and the TFT array substrate 1140 to prevent leakage of the liquid crystal layer filled therebetween.

A backlight unit 1200 for supplying light is provided on the rear surface of the liquid crystal panel 1100 so that the difference in transmittance indicated by the liquid crystal panel 1100 is expressed to the outside.

The backlight unit 1200 includes an LED array 2000 arranged along the longitudinal direction of at least one edge of the support main 1300 , a white or silver reflective plate 1250 , and a light guide plate 1230 mounted on the reflective plate 1250 . ) and may include an optical sheet 3000 interposed thereon.

The LED array 2000 is a light source of the backlight unit 1200, and is located on one side of the light guide plate 1230 to face the light incident surface of the light guide plate 1230, and this LED array 2000 includes a plurality of LED packages ( 2100 ) and a second substrate 2200 which is a printed circuit board on which a plurality of LED packages 2100 are mounted to be spaced apart from each other by a predetermined interval.

The light emitted from the plurality of LED packages 2100 is provided to the liquid crystal panel 1100 via the light guide plate 1230 . When the backlight unit 1200 is a direct type, the backlight unit 1200 may include the LED array 2000 according to the first embodiment of FIG. 16 , and the backlight unit 1200 is an edge In the case of an edge type, the backlight unit 1200 may include the LED array 2000 according to the second embodiment of FIG. 17 .

As a material of the light guide plate 1230, polymethy-methacrylate (PMMA), which has high strength, is not easily deformed or broken, and has good transmittance, may be used. Here, the light guide plate 1230 may be provided in a wedge shape with an inclined lower surface and a flat upper surface, or a plate type in which both the lower surface and the upper surface are parallel. In addition, the light guide plate 1230 may be formed to have a relatively larger thickness at the light incident part side.

The light guide plate 1230 may include a light collecting pattern (not shown) on its upper surface.

An emission angle of the light emitted to the upper surface of the light guide plate 1230 may be adjusted according to the density of the light collecting pattern.

The optical sheet 3000 may be composed of one optical sheet or a plurality of optical sheets. In addition, the optical sheet 3000 may be formed by bonding a plurality of optical sheets to be integrated. The optical sheet 3000 may include a diffusion sheet, a prism sheet, and a protective sheet. In some cases, it may be provided with two diffusion sheets and two prism sheets. In this case, the diffusion sheet may be composed of a base plate and a bead-shaped coating layer formed on the base plate.

The diffusion sheet serves to diffuse the light from the light guide plate 1230 and supply it to the liquid crystal panel 1100 . The diffusion sheet may be used by overlapping two or three sheets. In addition, the prism sheet may be formed with a constant arrangement of triangular prism-shaped prisms on the upper surface. The prism sheet may serve to condense light diffused from the diffusion sheet in a direction perpendicular to the plane of the upper liquid crystal panel 1100 . Two prism sheets may be used, and the micro prisms formed on each prism sheet form a predetermined angle. Accordingly, most of the light passing through the prism sheet travels vertically to provide a uniform luminance distribution. The protective sheet located at the top protects the prism sheet, which is weak against scratches.

The reflector 1250 is located on the rear surface of the light guide plate 1230 and reflects the light passing through the rear surface of the light guide plate 1230 toward the liquid crystal panel 1100 to improve the luminance of the light.

The liquid crystal panel 1100 and the backlight unit 1200 are modularized through the top cover 1400, the support main 1300 and the bottom cover 1500, and the top cover 1400 is the upper edge of the liquid crystal panel 1100 and Constructed to cover the sides.

Here, the top cover 1400 has a rectangular frame shape in which a cross section is bent in an “a” shape to cover the upper surface and side edges of the liquid crystal panel 1100, and the liquid crystal panel 1100 by opening the front of the top cover 1400 It is configured to display the image implemented in .

In addition, the bottom cover 1500, on which the liquid crystal panel 1100 and the backlight unit 1200 are seated, which is the basis for assembling the entire liquid crystal display device, includes a bottom portion and a sidewall whose edges are vertically bent. And, seated on the bottom cover 1500 and having one edge of the liquid crystal panel 1100 and the backlight unit 1200 open, a rectangular frame-shaped support main 1300 with an open top cover 1400 and the bottom It is coupled with the cover 1500 .

At this time, the top cover 1400 is also referred to as a case top or top case, the support main 1300 is also referred to as a guide panel, a main support, or a mold frame, and the bottom cover 1500 is also referred to as a lower cover.

19 is a view showing the density of the light beam angle in the long axis direction of the conventional top view type LED and the light beam angle density in the long axis direction of the LED package according to the embodiment of the present invention. And FIG. 20 is a view showing the density of the light directivity angle in the minor axis direction of the conventional top view type LED and the light directivity angle density in the minor axis direction of the LED package according to the embodiment of the present invention.

19 and 20, compared to the conventional top-view type LED (ref), the LED package 2100 according to the embodiment of the present invention shows that light is emitted even around the central axis, and the embodiment of the present invention It can be seen that in the LED package 2100 according to the example, the amount of light extracted in the short axis direction is larger than the long axis direction. Accordingly, it can be seen that the amount of light on the short axis surface on which the reflection layer 2130 is not formed is increased compared to the long axis surface on which the reflection layer 2130 is formed in the LED package 2100, and accordingly, as described with reference to FIGS. 16 and 17 , the second Intervals l1 and l2 between the LED packages 2100 disposed on the substrate 2200 may be increased. In addition, since the LED package 2100 slightly lowers the amount of light on the central axis, it is possible to prevent light from being concentrated on the central axis of the LED package 2100 . Thus, it is possible to reduce the manufacturing cost by reducing the number of LED packages 2100 mounted on the LED array 2000, and the reflective layer 2130 and the pattern layer ( 2140) or by adjusting the beam angle of light using the diffusion layer 2160, the light is not concentrated on the LED package 2100, thereby preventing a hot spot problem.

In the detailed description of the present invention described above, it has been described with reference to preferred embodiments of the present invention, but those skilled in the art or those having ordinary knowledge in the technical field of the present invention described in the claims to be described later It will be understood that various modifications and variations of the present invention can be made without departing from the spirit and scope of the present invention. Accordingly, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be defined by the claims.

10 Conventional top view type LED
20 Conventional COB type LED
1100 LCD panel
1120 color filter array substrate
1140 TFT Array Substrate
1160 Connection member
1170 printed circuit board
1200 backlight unit
1230 light guide plate
1250 reflector
1300 support main
1400 top cover
1500 bottom cover
2000 LED Array
2100 LED Package
2110 first substrate
2111 base board
2112 LED Chip
2113 The top surface of the base substrate
2114 back side of base board
2115 first side of base substrate
2116 second side of the base substrate
3rd side of the 2117 base substrate
4th side of the 2118 base substrate
2120 silicone cover
2121 top surface of silicone cover
2121a pattern forming area
2121b pattern non-formed area
2122 Silicone cover back
2123 first side of silicone cover
2124 second side of silicone cover
3rd side of 2125 silicone cover
4th side of the 2126 silicone cover
2127 upper slope
2130 reflective layer
2140 pattern layer, first pattern layer
2150 second pattern layer
2160 diffusion layer
2200 printed circuit board, second board
3000 optical sheet

Claims (8)

a COB (Chip On Board) type first substrate and an LED (LIGHT EMITTING DIODE) chip disposed on the first substrate; and a silicon cover disposed on the first substrate; a plurality of LED packages each including; and
a second substrate on which the plurality of LED packages are mounted;
The plurality of LED packages are arranged in a predetermined direction on the second substrate,
The silicon cover of each of the plurality of LED packages includes an upper surface facing the upper surface of the LED chip, first side surfaces facing each other in the one direction, and second side surfaces facing each other in a direction crossing the one direction, and ,
In each of the plurality of LED packages,
The light of the LED chip is emitted through at least a portion of the upper surface of the silicon cover and the first side surfaces of the silicon cover,
A pattern layer or a diffusion layer is disposed on the first side surfaces of the silicon cover,
A reflective layer is disposed on the second side surfaces of the silicon cover. delete delete According to claim 1,
In each of the plurality of LED packages,
An LED array in which the pattern layer or the diffusion layer is further disposed on at least a portion of the upper surface of the silicon cover. 5. The method of claim 4,
The upper surface of the silicon cover includes a pattern-formed region and a pattern-unformed region,
The pattern non-formation region faces the upper surface of the LED chip,
The pattern layer or the diffusion layer is an LED array disposed in the pattern formation region of the upper surface of the silicon cover. According to claim 1,
An LED array in which the upper surface and the first side surfaces of the silicon cover integrally form one inclined surface. According to claim 1,
The second side surfaces of the silicone cover have an inclined surface,
A distance between the second side surfaces facing each other increases from the rear surface to the upper surface of the silicon cover. an LED array according to any one of claims 1 and 4 to 7; and
Including; a bottom cover for accommodating the LED array;
The LED array is a backlight unit disposed on a bottom portion or a side surface of the bottom cover.

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