KR102283098B1 - Manufacture method of chip for fluid analysis - Google Patents

Abstract

The present invention is to provide a method of manufacturing a chip for fluid analysis using a mold provided with an intaglio groove of a high-precision fine pattern through laser processing. According to the disclosed present invention, the method of manufacturing a chip for fluid analysis comprises: a preparatory step of preparing a core to be machined; a processing step of processing an intaglio groove by irradiating a laser to the core; and a post-processing step of post-processing the core. In the processing step, a mold is prepared by irradiating a laser repeatedly at least once within a preset intensity range to process an intaglio groove in the core.

Description

How to fabricate a chip for fluid analysis

The present invention relates to a method of manufacturing a chip for fluid analysis using a mold manufactured by laser processing.

Diagnosis technology through the analysis of fluid samples such as blood and body fluids collected from patients is widely used in the fields of chemistry and biotechnology. In order to expand the applicability by improving the simplicity of the analysis of the fluid sample, miniaturized analysis and diagnostic equipment has been disseminated in recent years.

Fluid analysis chip, one of miniaturized analysis and diagnostic equipment, is a lab-on-the-chip (lab-on-the-chip) that implements various analysis processes such as sample separation, purification, mixing, labeling, analysis and cleaning into a miniaturized chip using microfluidics technology. (lab-on-a-chip) is a diagnostic device applied This fluid analysis chip flows a fluid sample through a microchannel formed inside the chip, thereby observing and counting the analyte material in the fluid sample, or interacting with the fluid sample It is possible to diagnose a disease by whether it reacts with the antibody protein immobilized inside the chip or other various samples.

On the other hand, a high-precision manufacturing technology is applied to the fluid analysis chip for accurate analysis of a fluid sample flowing therein. In particular, high-quality microgrid patterning is required for observation and counting accuracy of samples in a chamber of a fluid analysis chip. Accordingly, in recent years, various studies are being conducted to improve the fluid analysis accuracy by improving the manufacturing quality of the manufactured fluid analysis chip.

Domestic Registered Patent No. 10-1474256 Domestic Registered Patent No. 10-1590075

An object of the present invention is to provide a method of manufacturing a chip for fluid analysis using a mold provided with an intaglio groove of a high-precision fine pattern through laser processing.

The method of manufacturing a chip for fluid analysis according to the present invention for achieving the above object includes a preparation step of preparing a core to be processed, a processing step of patterning an intaglio groove by irradiating a laser with the core, and the intaglio groove and a post-processing step of post-processing the prepared core, wherein the laser includes a femto second or pico second laser, but the laser has a maximum intensity of 4 W, and the preparation step is flat To provide the core of a high hardness metal material within 30um and HRC 40 or higher, the processing step is by repeatedly irradiating the laser to the core 1 to 30 times within an intensity range of 20 to 80%, and the intaglio groove in the core In patterning processing, the processing step includes a stabilization step of stabilizing the laser, a setting step of setting the processing environment of the laser, and an engraving step of patterning the intaglio groove on the core in the processing environment set in the setting step Including, wherein the setting step sets the focus of the laser and the stage on which the core is placed, when the processing zone of the core is divided, sets the movement of the stage on which the core is placed, and the intaglio step is the The laser is irradiated to the surface of the core while the laser moves along a preset path, and the width and depth of the intaglio grooves formed in the core are adjusted while controlling the intensity and speed of the laser, and the width of the intaglio grooves to be patterned In the method of manufacturing a chip for fluid analysis by using a mold manufactured by the mold manufacturing method by laser processing in which the laser processing is performed in the order of the pattern in which the width decreases from the large pattern, between the mold and the sub mold Injection of the injection molding, filling the intaglio groove formed in the mold, and when the injection molding between the mold and the sub-mold is cured, the mold and the sub-mold are removed to form a embossed protrusion Comprising the step of manufacturing a chip for analysis, both sides of the upper end of the embossed protrusion is formed in a curved surface.

In addition, in the stabilization step, the power of the laser may be turned on 24 hours before.

In addition, in the post-treatment step, the core may be cleaned in an ultrasonic cleaning method using deionized water (DI) within 10 minutes or more and within 120 minutes.

A method of manufacturing a chip for fluid analysis according to another aspect of the present invention includes a core having a flatness within 30 μm and a high hardness metal material of at least HRC 40 or higher, and an intaglio groove patterned by laser processing on the core. And, the laser includes a femtosecond (Femto second) or picosecond (Pico second) laser, but the laser has a maximum intensity of 4W, and the intaglio groove is 20 to 80% of the laser intensity within the range of 1 to 30 times. The core is repeatedly irradiated and processed, but the laser is irradiated to the surface of the core while the laser moves along a preset path, and the width and depth of the intaglio groove formed in the core while controlling the intensity and speed of the laser Adjustment, the laser processing is performed in the order of the pattern in which the width of the intaglio groove to be patterned is large in the pattern in which the width is reduced, and before processing the intaglio groove, the focus of the laser and the stage where the core is placed are set and, in the method of manufacturing a chip for fluid analysis using a mold in which the movement of the stage is set when the processing zone of the core is divided, injecting an injection product between the mold and the sub mold; The steps of filling the formed intaglio groove with the injection-molded material, and when the injection-molded material injected between the mold and the sub-mold is cured, removing the mold and the sub-mold to prepare a chip for analyzing the fluid in which the embossed protrusion is formed. And, both sides of the upper end of the embossed protrusion is formed in a curved surface.

In addition, the laser can process the engraved groove after the power is turned on and stabilized before 24 hours.

In addition, deionized water (DI) may be ultrasonically sprayed to the core within 10 minutes or more and within 120 minutes to clean the intaglio grooves.

According to the present invention having the above configuration, first, it is possible to engraving a high-quality fine pattern on the core using laser processing, it is possible to manufacture a high-quality mold under various conditions.

Second, it is possible to repeatedly irradiate the femtosecond laser a plurality of times within a preset intensity range, so that a uniform and fine pattern can be manufactured on the mold, resulting in excellent productivity.

Third, micro-to-nano-scale embossed protrusions can be injection-molded using the intaglio grooves provided by the femtosecond laser.

Fourth, a plurality of embossed protrusions for accommodating cells in the microchannel of a small fluid analysis chip to which the lab-on-the-chip technology is applied can be manufactured with high quality, thereby improving diagnostic accuracy.

1 is a flowchart schematically illustrating a mold manufacturing method by laser processing according to an embodiment of the present invention.
FIG. 2 is a flowchart schematically illustrating the processing steps shown in FIG. 1 .
FIG. 3 is a perspective view schematically illustrating the engraving step shown in FIG. 2 .
4 is a diagram schematically illustrating a mold manufactured by a femtosecond laser having an intensity lower than a preset range.
5 is a diagram schematically illustrating a mold manufactured by a femtosecond laser having an intensity higher than a preset range.
6 is a diagram schematically illustrating a mold manufactured by an appropriate intensity and repeated processing of a femtosecond laser.
7 is a flowchart schematically illustrating a method for manufacturing a chip for fluid analysis using a mold manufactured by the method for manufacturing a mold shown in FIG. 1 .
FIG. 8 is a cross-sectional view schematically illustrating the injection process shown in FIG. 1 .
9 is a cross-sectional view schematically illustrating a state in which the mold shown in FIG. 8 is separated from the object and the embossed protrusion is provided on the object.
10 is a graph schematically illustrating a processing rate according to a distance between a processing plane and a focal plane of a mold manufactured by the mold manufacturing method shown in FIG. 1 .
11 is a perspective view schematically illustrating a chip for fluid analysis that can be manufactured into a mold manufactured by the method for manufacturing a mold by laser processing shown in FIG. 1 . And,
12 is a sectional view schematically enlarged by cutting area AA of FIG. 11 .

Hereinafter, a preferred embodiment of the present invention will be described with reference to the accompanying drawings. However, the spirit of the present invention is not limited to such embodiments, and the spirit of the present invention may be proposed differently by adding, changing, and deleting components constituting the embodiment, but this is also included in the scope of the present invention. will become

Referring to FIG. 1 , a method ( 1 ) for manufacturing a mold by laser processing according to a preferred embodiment of the present invention includes a preparation step ( 10 ), a processing step ( 20 ) and a post-processing step ( 30 ).

For reference, the mold manufacturing method (1) described in the present invention is a fluid analysis chip 100 (Fig. 11) shown and illustrated as manufacturing a mold (M) (see FIG. 8) for manufacturing, but is not limited thereto.

The preparation step 10 prepares the core M to be processed (see FIG. 3 ). Here, the core M is provided with a material advantageous for micro-to-nano-scale mirror processing, and thus, it is preferable to improve the light transmittance of the injected fluid analysis chip. That is, the cleaner the processing surface of the core (M), the smoother surface injection molding of the plastic injection molded product is possible. In addition, since the core M is made of a metal material having a flatness of less than 30 μm, it is possible to provide constant processing conditions without changing the laser focus condition even when the stage for laser processing a large area pattern is moved.

In addition, the core (M) is processed by a laser (R) (see FIG. 3) capable of femto-second laser processing, and HRC (Rockwell Hardness measured on the C scale, Rockwell hardness) for femto-second laser processing. It is provided with a metal material having a high hardness of 40 or more. The core M may include any one of heat-treated metal steel materials such as heat-treated STAVAX, NAK55, NAK80, KP-4M, DHA1, and heat-treated ASSAB 718. The material of the core (M) is strong against corrosion, and has the advantage that dents by fine particles do not occur, and is advantageous for resin penetration problems, shortening of production time, and reduction of manufacturing costs. Accordingly, it is possible to significantly reduce the production cost during injection molding due to the core (M) including the heat-treated steel material.

Here, heat treatment STAVAX, which is one of the metal materials that can be employed as the core (M), is a premium stainless steel tool steel, and has excellent corrosion resistance, mirror surface property, wear resistance and machinability, and has good dimensional stability during heat treatment. In the case of the core (M) including such heat treatment STAVAX, the hardness is the latter half of HRC 50, about 60, and most mold materials have a hardness of less than about HRC 65. Accordingly, the hardness of the core (M) described in the present invention is preferably about 65 or less.

On the other hand, the laser (R) for processing the core (M) is not limited to only the femtosecond laser (R), processing using a picosecond (Pico second) laser is also possible. In the case of an embodiment described in the present invention, it is possible to implement high-quality processing through laser processing at the femtosecond to several picosecond level by solving the existing problem of difficult laser processing for the core (M), which is a metal material with high hardness of HRC 40 or higher. there is.

In this embodiment, it is exemplified as a core (M) made of a star box material having a flatness that is advantageous for a relatively nano-scale mirror processing, and the core (M) made of a star box material is prepared by polishing the surface before the processing step (20) can be

On the other hand, the core (M) provided in the preparation step 10 is shown and illustrated as having a rectangular parallelepiped shape having a width, a width and a height of 20 mm, 6 mm, and 30 mm, respectively, but it is of course not limited thereto. That is, the core M can be deformed into various shapes and sizes to correspond to the object O (see FIG. 8 ), for example, the chip 100 for fluid analysis in the present embodiment.

In the processing step 20, as shown in FIG. 3, a laser is irradiated to the core M, and processing is performed into a core M provided with an intaglio groove I as shown in FIG. Here, the processing step 20 uses a femtosecond laser (R) (see FIG. 3) to pattern an intaglio groove (I) in the core (M).

Femtosecond laser (R) has a ^{pulse width of more than femtosecond (10 -15} to 10 ^-18 ) and is one of the equipment capable of high-power processing. This femtosecond laser (R) has the advantage that high-precision cutting is possible, micro-to-nano-scale fine patterning is possible on the core (M).

For reference, the intaglio groove (I) patterned on the core (M) in the processing step (20) is illustrated and illustrated as having a lattice pattern, but is not necessarily limited thereto.

The processing step 20 according to the present invention includes a stabilization step 21 , a setting step 22 and an engraving step 23 as shown in FIG. 2 .

In the stabilization step 21, the processing environment using the femtosecond laser (R) is preset and stabilized. In this stabilization step 21, it is good for the operator to stabilize by turning on the power of the femtosecond laser (R) at least 24 hours before.

The setting step 22 sets the processing conditions of the femtosecond laser (R). In this setting step 22, a processing environment such as a laser focus of the femtosecond laser R and a stage (not shown) on which the core M is placed is set to suit the processing conditions. At this time, when the processing environment of the femtosecond laser (R) does not meet the processing conditions, the alignment of the laser processing may be misaligned.

In addition, in the setting step 22 , when processing of the large-area core M is required, the stage on which the core M is placed may be set to move so that the processing zone of the core M is divided.

The engraving step 23 is to pattern the engraved pattern on the core (M) in the processing environment set in the setting step 22 to manufacture the engraved groove (I). Here, the engraving step 23 is to pattern the engraved groove (I) for the core (M) while checking the processing conditions of the femtosecond laser (R). In this engraving step 23, as shown in FIG. 3, the femtosecond laser (R) is moved to face the core (M) fixed to the stage (not shown), and the laser is applied to the processing surface of the facing core (M). is irradiated to form an intaglio groove (I) in the shape of a fine grid.

In this case, the femtosecond laser (R) or the stage (not shown) may irradiate the laser to the surface of the core (M) while moving along a preset path. While controlling the laser intensity and speed of the femtosecond laser (R), the width and depth of the intaglio groove (I) formed in the core (M) can be adjusted.

On the other hand, the engraving step 23 repeatedly irradiates the femtosecond laser (R) within a preset laser intensity range at least once or more to engrave the core (M)DP engraving groove (I). Here, the femtosecond laser (R) described in the present invention has a wavelength of 1030 nm, a beam quality of 1.3, a maximum power of 4W, a maximum pulse energy of 4, and a repetition rate. It is exemplified as 100KHz ~ 10MHz and 400fs ~ 5ps, which is a pulse duration, but is not limited thereto.

The intensity range of the femtosecond laser (R) irradiated to the core (M) in the engraving step 23 using such a femtosecond laser (R) is 20 to 80%, and repeated 1 to 30 times to repeatedly irradiate the core (M). Thus, a core (M) provided with an intaglio groove (I) is manufactured. More preferably, in the engraving step 23, the femtosecond laser (R) is preferably irradiated with the laser to the core (M) by repeating 6 or more times with an intensity of approximately 37% in contrast to the maximum intensity of 4W.

For reference, the reason for repeatedly irradiating the femtosecond laser (R) in the engraving step 23 is that it may be difficult to process the core (M) up to the desired maximum depth with one processing, and to prevent defects due to excessive processing. am. In addition, if the femtosecond laser (R) is irradiated repeatedly for a certain number of times or more, for example, 30 times or more while maintaining the focus, the processing does not proceed any more and the surface of the core (M) may be deformed by heat. Accordingly, by repeating the number of repetitions of the femtosecond laser (R) within a preset range, that is, 1 to 30 times, it is preferable to process the intaglio groove (I) of a desired depth.

On the other hand, within the range (20 to 80%) of the laser intensity irradiated to the core (M) in the engraving step 23, the lower the laser intensity, the higher the number of repetitions within the range (1 to 30 times) of the number of repetitions, and the laser By reducing the number of repetitions as the intensity increases, a similar processing effect can be realized within the laser intensity range. In this case, as the number of repetitions of the femtosecond laser R increases, the depth of the intaglio groove I may become deeper. In addition, when the focus of the femtosecond laser (R) is located above the processing surface of the core (M), the processing width is reduced, and when the laser focus is located below the processing surface of the core (M), the processing width can be increased. there is.

If the laser intensity range and the number of times of the femtosecond laser (R) are out of the preset range, defects in the intaglio groove (I) manufactured as shown in FIGS. 4 and 5 are caused.

More specifically, as shown in Figure 4, when the intensity of the femtosecond laser (R) is irradiated with an intensity lower than a preset range, such as 20% or less, it is difficult to process the intaglio groove (I) with a sufficient depth of 0.5um or more. Therefore, in the case of the intaglio groove (I) manufactured with a low laser intensity, as shown in FIG. For reference, even if the number of irradiation is increased in a state where the laser intensity of the femtosecond laser (R) is low, it does not affect the quality improvement of the intaglio groove (I).

On the other hand, when the intensity of the femtosecond laser (R) is higher than the preset range by 80% or more, the fragments damaged by thermal energy on the surface of the core (M) as shown in FIG. It causes deterioration of quality sticking to the periphery of I). That is, as shown in (b) of Figure 5, while the intaglio groove (I) of non-uniform depth is processed, contamination around the intaglio groove (I) due to debris may occur.

On the other hand, as shown in FIG. 6, when the femtosecond laser (R) irradiates the laser repeatedly with a preset intensity range, for example, an intensity of about 37%, the intaglio groove (I) is formed to a uniform depth. do. In addition, there is no contamination of impurities such as debris around the intaglio groove (I), so that a high-quality core (M), that is, a mold in which the intaglio groove (I) is provided can be manufactured. Here, laser processing may be performed in the order of the pattern having the largest width of the grating to the pattern having the smallest width of the grating among the fine grating patterns that the femtosecond laser (R) engraves. It is possible to adjust the width and depth of the intaglio groove (I) formed on the surface of the core (M) by adjusting the intensity and movement speed of the laser output according to each processing of the femtosecond laser (R).

Post-processing step 30 is to post-process the core (M) provided with the intaglio groove (I). In this post-treatment step 30, deionized water (DI) is sprayed onto the core M provided with the intaglio groove I for 25 minutes or more to be cleaned. In the present embodiment, it is exemplified by ultrasonically spraying deionized water having a temperature of approximately 90 degrees into the intaglio groove I of the core M in the post-treatment step 30 for 30 minutes or more, but is not limited thereto. That is, the deionized water sprayed in the post-treatment step 30 may have a temperature of room temperature. However, it is recommended that deionized water be ultrasonically sprayed for 10 minutes or more and within 120 minutes. Here, if the spraying time of deionized water is shorter than 10 minutes, the residue may not be sufficiently removed, so it is preferable to ultrasonically spray for at least 10 minutes.

In this post-treatment step 30, the core M is cleaned in an ultrasonic cleaning method to remove residues such as deposits and burrs existing in the core M and the intaglio groove I. At this time, the residue that is not removed from the core M even in the post-processing step 30 is produced by high temperature and high pressure in the fluid analysis chip manufacturing method 100 (see FIG. 7 ) including an injection step 40 to be described later. can be removed.

For reference, when high-temperature alcohol, not deionized water, is used in the post-treatment step 30, rust may be generated due to the material properties of the core M including the starbox having high corrosion resistance. However, the deionized water does not interfere with the material of the core M including the starbox, and the core M can effectively remove the residue for cleaning.

7 shows a method 100 for manufacturing a chip for fluid analysis using the core M, which is a mold manufactured through the preparation step 10, the processing step 20, and the post-processing step 30 as described above.

Referring to FIG. 7 , in the manufacturing method 100 of the chip for fluid analysis, when the core M, which is a mold, is manufactured by the mold manufacturing method 1 shown in FIG. 1 , the chip for fluid analysis is manufactured by injection molding. It includes an injection step (40). In this injection step 40, as shown in FIG. 8, the injection material is injected between the core M, which is a mold in which the intaglio groove I is processed by the laser R, and the sub mold SM facing the core M. , the injection material (W) is filled in the intaglio groove (I). At this time, the space between the core M and the sub mold SM is in a vacuum state, and the injection product W includes a liquid high-temperature plastic resin.

When the injection-molded product W injected between the core M and the sub-mold SM is cured, the core M and the sub-mold SM are removed as shown in FIG. 9 to mold the object O. As shown in FIG. After the embossed protrusion (E) is injection molded into the object (O), the core (M) is removed, so that the object (O) provided with the embossed protrusion (E) corresponding to the intaglio groove (I) can be finally manufactured. do.

Meanwhile, referring to FIG. 10 , the processing rate according to the distance between the processing surface of the core M and the laser R is schematically illustrated. As shown in FIG. 10 , it can be seen that the machining rate measured while varying the distance between the machining surface of the core M and the laser R is rapidly reduced at 30 μm or more. Here, the processing rate is a value measured on the basis of 100% of the processing depth when the processing surface of the core (M) and the focal plane of the laser (R) coincide.

As described above, when the distance between the processing surface of the core M and the laser R is 30 μm or more, the processing quality deteriorates, and the flatness of the core M is preferably 30 μm or less. For reference, the core M according to the present embodiment is exemplified as having a flatness of 10 μm.

In the present invention, the subject O includes a fluid analysis chip 100 capable of analyzing a fluid sample, and an example of the fluid analysis chip 100 is shown in FIG. 11 . As shown in FIG. 11 , in the fluid analysis chip 100 , the upper plate 110 and the lower plate 120 are stacked with each other, and the upper plate 110 has an inlet 111 and an outlet through which a fluid sample can be introduced and discharged ( 112) is provided. Also, as shown in FIG. 12 , the fluid sample introduced into the inlet 111 is discharged to the outlet 112 via the microchannel 130 provided between the upper plate 110 and the lower plate 120 .

At this time, a plurality of embossed protrusions E are provided in the microchannel 130 to form a plurality of cell receiving grooves for analysis of a fluid sample flowing in the microchannel 130 . The plurality of embossed protrusions (E) is a lower plate through injection molding as in FIGS. 120) is formed.

Since the analysis of a fluid sample using the chip 100 for fluid analysis having such embossed protrusions E is not the gist of the present invention, detailed illustration and description will be omitted.

As described above, although described with reference to preferred embodiments of the present invention, those skilled in the art can variously modify and change the present invention without departing from the spirit and scope of the present invention as set forth in the following claims. You will understand that it can be done.

C: core
R: Femtosecond laser
I: engraved groove
E: embossed
O: object

Claims (6)

A preparation step of preparing a core to be machined;
A processing step of patterning an intaglio groove by irradiating a laser to the core; and
a post-processing step of post-processing the core provided with the intaglio groove;
includes,
The laser includes a femtosecond (Femto second) or picosecond (Pico second) laser, but the laser has a maximum intensity of 4W,
The preparation step is to prepare the core of a high hardness metal material having a flatness within 30um and HRC 40 or higher,
In the processing step, the laser is repeatedly irradiated to the core 1 to 30 times within an intensity range of 20 to 80%, and the intaglio groove is patterned on the core,
The processing step is
stabilizing the laser;
a setting step of setting the processing environment of the laser; and
an engraving step of patterning the engraved groove on the core in the machining environment set in the setting step;
including,
In the setting step, the focus of the laser and the stage on which the core is placed are set, and when the processing zone of the core is divided, the movement of the stage on which the core is placed is set,
In the engraving step, the laser is irradiated to the surface of the core while moving along a preset path, adjusting the width and depth of the engraved groove formed in the core while controlling the intensity and speed of the laser, and patterning In the method of manufacturing a chip for fluid analysis by using a mold manufactured by a mold manufacturing method by laser processing in which the laser processing is performed in the order of the pattern in which the width of the intaglio groove is large in the pattern,
injecting an injection product between the mold and the sub mold;
filling the injection-molded material in the engraved groove formed in the mold; and
When the injection-molded product injected between the mold and the sub-mold is cured, removing the mold and the sub-mold to manufacture a fluid analysis chip having embossed protrusions;
including,
A method of manufacturing a chip for fluid analysis, characterized in that both sides of the upper end of the embossed protrusion are formed in a curved surface. According to claim 1,
The stabilization step is a method of manufacturing a chip for fluid analysis by laser processing in which the power of the laser is turned on 24 hours before. According to claim 1,
The post-processing step is a method of manufacturing a chip for fluid analysis by laser processing in which the core is cleaned in an ultrasonic cleaning method within 10 minutes or more and within 120 minutes using deionized water (DI). A core having a flatness of less than 30um and comprising a high-hardness metal material of at least HRC 40 or higher; and
an intaglio groove patterned by laser processing on the core;
includes,
The laser includes a femtosecond (Femto second) or picosecond (Pico second) laser, but the laser has a maximum intensity of 4W,
The intaglio groove is processed by repeatedly irradiating the laser to the core 1 to 30 times within an intensity range of 20 to 80%, and irradiating the laser to the surface of the core while the laser moves along a preset path, the laser Adjusting the width and depth of the intaglio groove formed in the core while controlling the intensity and speed of the laser processing is performed in the order of the pattern in which the width of the intaglio groove is patterned from a large pattern to a small width,
Before machining the intaglio groove, the focus of the laser and the stage on which the core is placed are set, and when the processing area of the core is divided, the fluid analysis chip is used using a mold in which the movement of the stage is set. In the manufacturing method,
injecting an injection product between the mold and the sub mold;
filling the injection-molded material in the engraved groove formed in the mold; and
manufacturing a fluid analysis chip having embossed protrusions formed by removing the mold and the sub mold when the injection molded product between the mold and the sub mold is cured;
including,
A method of manufacturing a chip for fluid analysis, characterized in that both sides of the upper end of the embossed protrusion are formed in a curved surface. 5. The method of claim 4,
The laser is turned on (ON) before 24 hours and after stabilization, a method of manufacturing a fluid analysis chip for processing the intaglio groove. 5. The method of claim 4,
A method of manufacturing a chip for fluid analysis in which deionized water (DI) is ultrasonically sprayed into the core within 10 minutes or more and within 120 minutes to clean the intaglio grooves.

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