KR102258798B1 - Cutting chip snack and preparation method thereof - Google Patents

Abstract

The present embodiments disclose a processed chip snack and a method of manufacturing the same. The disclosed processing snack and its manufacturing method include a core of a topping portion formed on one surface of a processed chip and a peripheral portion surrounding the core, and a height of the core from one surface of the processed chip is higher than the height of the peripheral portion. Through this, it is possible to make the processed chip snack look more eatable, add flavor, and improve the setting property of the topping part.

Description

Processed chip snack and its manufacturing method {CUTTING CHIP SNACK AND PREPARATION METHOD THEREOF}

The present embodiments relate to a processed chip snack and a method of manufacturing the same.

Processed chips, which can be enjoyed lightly as a snack, are generally made by thinly sliced ingredients and fried in oil. Snacks using these ingredients are very important in terms of flavor and visual aspects.

Conventionally, when going through a complicated snack manufacturing process, the flavor of the snack changes or worsens compared to initially expected, and it does not look appetizing, resulting in a problem that the taster is reluctant.

In addition, there was a problem in that the topping portion was separated or smeared in the distribution stage after packaging the processed chip snack.

Japanese Patent Publication No. 2008-527982

The present embodiments are intended to solve the above-described problems, and to provide a processed chip snack and a method of manufacturing the same, which looks delicious, improves flavor, and does not separate or spread a topping portion.

A processed chip snack according to an embodiment and a manufacturing method thereof include a processed chip in which raw materials are sliced and fried, a plurality of topping portions provided on at least one side of the processed chip, and at least two of the plurality of topping portions are spaced apart from each other, The topping portion includes a core and a peripheral portion surrounding the core, and the height of the core from one surface of the processed chip is higher than the height of the peripheral portion.

A processed chip snack according to another embodiment and a manufacturing method thereof include a processed chip in which raw materials are sliced and fried, a plurality of topping portions provided on at least one side of the processed chip, and a topping portion including a first material and a second material, and topping The portion includes a core and a peripheral portion surrounding the core, and the content of the first material included in the core may be greater than the content of the first material included in the peripheral portion.

A processed chip snack according to another embodiment and a method of manufacturing the same include processing raw materials to produce a sliced processed product, frying the processed product to produce processed chips, and mixing the first material and the second material to make the topping in a slurry state. And coating a plurality of topping portions on at least one surface of the processed chip by dropping the topping on the processed product, and the topping portion coated on the processed chip includes a first material and a second material, and the topping portion is a core And a peripheral portion surrounding the core, and the content of the first material included in the core of the topping portion may be greater than the content of the first material included in the peripheral portion.

In the processed chip snack and its manufacturing method according to the present embodiments, a plurality of spaced topping portions are irregularly formed on the surface of the processed chip in the processed chip snack, thereby obtaining a visual effect of making the processed chip snack look more eatable.

In addition, the processed chip snack and the method of manufacturing the same according to the present embodiments are made of a core and a peripheral portion surrounding the core, respectively, so that when the taster tastes the portion of the processed chip snack where the topping portion is present, it is improved. You can get a taste effect that allows you to feel the flavor of the topping.

In addition, since the mixing ratio of various materials included in the topping material has a specific condition, the setting property of the topping part can be improved so that a plurality of spaced topping parts do not spread to distribution after packaging of the processed chip snack.

1 is a view showing a processed chip snack according to the present embodiment.
FIG. 2 is a cross-sectional view taken along AB of FIG. 1.
3 is a cross-sectional view taken along the CD of FIG. 1.
4 is a view showing a processed chip snack according to another embodiment.
5 is a cross-sectional view taken along EF of FIG. 4.
6 is a flowchart of a method of manufacturing a processed chip snack according to the present embodiment.
7 is a manufacturing apparatus used to coat a topping material on a processed chip according to the present embodiments.
FIG. 8 is a diagram specifically showing part X of FIG. 7.
9 is a diagram illustrating a processed chip snack according to a comparative example.
FIG. 10 is a diagram cut along GH of FIG. 9.

Hereinafter, some embodiments of the present invention will be described in detail with reference to exemplary drawings. In adding reference numerals to elements of each drawing, the same elements may have the same numerals as possible even if they are indicated on different drawings. In addition, in describing the present invention, when it is determined that a detailed description of a related known configuration or function may obscure the subject matter of the present invention, the detailed description may be omitted.

In addition, in describing the constituent elements of the present invention, terms such as first, second, A, B, (a) and (b) may be used. These terms are only for distinguishing the component from other components, and the nature, order, order, or number of the component is not limited by the term. When a component is described as being "connected", "coupled" or "connected" to another component, the component may be directly connected or connected to that other component, but other components between each component It should be understood that "interposed" or that each component may be "connected", "coupled" or "connected" through other components.

1 is a view showing a processed chip snack according to the present embodiment. FIG. 2 is a cross-sectional view taken along line A-B of FIG. 1.

1 and 2, the processed chip snack 100 according to the present embodiment includes a processed chip 110 and a topping part 120.

The processing chip 110 may be in a state in which raw materials are sliced and fried.

Here, the raw material may be vegetables or fruits. Vegetables may be any one of potatoes, sweet potatoes, taro, yams, onions, sweet pumpkins, zucchini, and carrots, and fruits are any one of apples, sweet potatoes, pears, melon, watermelon, strawberries, melon, bananas, mangoes, and papayas. However, the types of vegetables and fruits are not limited thereto.

In the following description, for convenience of explanation, the processing chip 110 is a sliced and fried potato, that is, a potato chip.

A plurality of topping portions 120 may be provided on at least one surface of the processed chip 110. Meanwhile, in FIGS. 1 and 2, a configuration in which a plurality of topping portions 120 are provided on at least one surface of the processed chip 110 is illustrated, but the present invention is not limited thereto, and at least one of the plurality of topping portions 120 One topping part 120 may penetrate to the inside of the processed chip 110.

The plurality of topping units 120 may be made of a topping material including a first material and a second material, and the topping unit 120 of the manufactured processed chip snack 100 also includes a first material and a second material. can do.

Here, the first material may be a solid powder and the second material may be a mixed oil.

In this embodiment, the first material is a seasoning of a solid powder having a very low moisture content (e.g., less than 3% moisture content), and the mixed oil is at least two types of oils, for example, the first oil and the second oil. It may be a mixed oil containing.

Seasoning may be a material that tastes the topping part 120. Seasoning according to the present embodiment may include at least one seasoning of tomato ketchup flavor and chili flavor seasoning. However, the present embodiment is not limited thereto, and seasonings other than tomato ketchup flavor seasoning and chili flavor seasoning may be included. In addition, the moisture content of the seasoning described above is only an example, and it is sufficient if it has a moisture content suitable for forming the topping part 120.

The mixed oil is a material that allows the aftertaste of the processed chip snack 100 to have a savory taste. The mixed oil may contain the first oil and the second oil in various ratios. For example, the mixed oil may include a first oil and a second oil in a ratio of 1:1. Further, the melting point of the first oil and the melting point of the second oil may be different, and the melting point of each oil may be selected from 18°C to 37°C.

The mixed oil may be selected as an oil type having a high degree of harmony between the first material and taste without impairing the taste of the first material. For example, the first oil may be hardened palm oil that gives off a clean oily taste, and the second oil may be palm olein oil that can make the aftertaste of snacks savory. That is, the mixed oil may contain hardened palm oil and palm olein oil in various ratios. For example, the mixed oil may contain hardened palm oil and palm olein oil in a ratio of 1:1.

In addition, the melting point of the hardened palm oil may be higher than the melting point of palm olein oil. Specifically, the melting point of the hardened palm oil may be 36°C to 37°C, and the melting point of palm olein oil may be 18°C to 22°C.

Since the melting point of the coconut hardened oil is 36°C to 37°C, it has a property of rapidly hardening at room temperature (in this specification, room temperature is defined as 15°C to 25°C). This feature makes the setting of the topping part 120 excellent. The setting property of the topping part 120 means the fixing force of the topping part 120 to the processed chip 110.

In addition, palm olein oil may be in a semi-solid state at room temperature, and this characteristic may play a role of controlling the hardening temperature of the topping material together with the semi-solid coconut oil at room temperature.

The topping material made of the first material and the second material as described above may be a mixture in which seasoning as a solute is mixed with a mixed oil as a solvent.

This topping material may be in a slurry state at 23.5°C to 41°C.

In particular, since the melting point of the formulation 1 oil and the second oil is selected in the range of 18° C. to 37° C., the topping material may exist in a slurry state at 23.5° C. to 41° C., and topping by coating the topping material on the processed chip 110 After forming the portion 120, the topping portion 120 may exist in a solid state in the distribution stage of the processed chip snack 100.

That is, in the present embodiment, the mixed oil serves to maintain the topping material in a slurry state before coating the processing chip 110, and to allow the topping part 120 to exist in a solid state after the topping part 120 is formed. I can.

The topping material may further include a third material. The third material may be sauces. Here, the sauces may be configured to include at least one of ketchup sauce and chili sauce, but the present embodiment is not limited thereto.

The sauce may contain an appropriate amount of moisture, and may add the flavor of the first taste of the processed chip snack 100.

The topping material may contain a content of the third material less than that of the first and second materials.

For example, the content ratio of the first to third materials included in the topping material may be 1:1:0.008. In this case, the second material does not impair the taste of the first and second materials, and the degree of harmony of the taste of each material can be improved, but the content ratio of the first to third materials of the present embodiment is not limited thereto. .

The topping part 120 may be formed by dropping a topping material in a slurry state onto at least one surface of the processed chip 110. Each of the plurality of topping portions 120 formed on at least one surface of the processed chip 110 includes a core 121 and a peripheral portion 122 surrounding the core. The periphery 122 may extend from the core 121.

The content of the first material included in the core 121 of the plurality of topping portions 120 is greater than the content of the first material included in the peripheral portion 122.

Accordingly, as shown in FIG. 2, the height of the core 121 of the plurality of topping portions 120 may be higher than the height of the peripheral portion 122. Here, the height of the core 121 and the height of the peripheral portion 122 may be defined as a length from one surface of the processed chip 110 to one surface of the topping portion 120.

In addition, at least two of the topping portions 120 may be spaced apart from each other. That is, a topping portion and an untopping portion may exist on at least one surface of the processed chip 110 provided with the plurality of topping portions 120.

In this way, since a plurality of spaced topping portions 120 are irregularly formed on the surface of the processed chip 110, a visual effect of making the processed chip snack 100 look more tasty can be obtained. In addition, since a plurality of topping portions 120 are composed of a core 121 and a peripheral portion 122 surrounding the core, when the taster tastes the portion where the topping portion 120 is present in the processed chip snack 100, You can get a taste effect that allows you to feel the flavor of the enhanced topping.

In addition, a plurality of topping portions 120 may be irregularly arranged on the processing chip 110 as shown in FIG. 1. Accordingly, the taster may taste the processed chip snack 100 in the region including the topping part 120 even if he tastes any portion of the processed chip snack 100. That is, the taster may feel the taste of the processed chips 110 and the plurality of topping units 120 harmonized.

Meanwhile, in FIG. 2, a configuration in which the topping portion 120 is formed only on one surface of the processed chip 110 is illustrated, but the processed chip snack 100 according to the present embodiment is not limited thereto.

A detailed review of the processed chip snack 100 according to the present embodiment with reference to FIG. 3 cut from the processed chip snack 100 of FIG. 1 at different positions is as follows.

3 is a cross-sectional view taken along line C-D of FIG. 1.

Referring to FIG. 3, the topping part 120 may be formed on at least two surfaces of the processed chip 110. In this way, a plurality of topping portions 120 are formed on at least two surfaces of the processed chip 110, so that the taster can further feel the flavor of the topping.

On the other hand, in this embodiment, by explaining a configuration in which the processed chip 110 is a potato chip as an example, the thickness of the processed chip 110 is shown to be thin, but when the thickness of the processed chip 110 is thick, a plurality of topping portions ( 120) may be formed on at least three sides.

Next, a review of the processed chip snack according to another embodiment with reference to FIGS. 4 and 5 is as follows.

4 is a view showing a processed chip snack according to another embodiment. 5 is a cross-sectional view taken along E-F of FIG. 4.

4 and 5, a plurality of topping portions 420 are formed on at least one surface of the processed chip 110 according to another embodiment. The topping part 420 may include a first material and a second material, and may further include a third material in some cases.

Each of the plurality of topping portions 420 includes a core 421 and a peripheral portion 422 surrounding the core 421.

The core 421 may include a first core 421a and a second core 421b extending from the first core 421a. In addition, the peripheral portion 422 may be formed to surround the first core 421a and the second core 421b.

Here, the content of the first material included in the first core 421a is greater than the content of the first material included in the second core 421b and the peripheral portion 422. In addition, the content of the first material included in the second core 421b is greater than the content of the first material included in the peripheral portion 422.

That is, the content of the first material may be increased in the order of the first core 421a, the second core 421b, and the peripheral portion 422.

Accordingly, the heights of the first core 421a, the second core 421b, and the peripheral portion 422 are also different. Specifically, the height of the first core 421a having the highest content of the first material is the highest, and the height of the peripheral portion 422 having the lowest content of the second material is the lowest.

On the other hand, in FIGS. 4 and 5, the content of the first material included in the second core 421b has been described with a focus on the configuration less than the content of the first material included in the first core 421a. The present invention is not limited thereto, and the content of the first material included in each of the first core 421a and the second core 421b may be the same. However, even in this case, the content of the first material included in each of the first core 421a and the second core 421b is greater than the content of the first material included in the peripheral portion 422.

That is, in the processed chip snack 100 according to another embodiment, one topping part 120 may include a plurality of cores 421a and 421b.

The content of the first material included in the plurality of cores 421a and 421b may be greater than the content of the first material included in the peripheral portion 422. Through this, when the taster tastes the portion of the processed chip snack 100 in which the topping part 420 is present, a taste effect that can feel the flavor of the enhanced topping can be obtained.

A method of forming a processed chip snack according to the present embodiments will be reviewed with reference to FIG. 6 as follows.

6 is a flowchart of a method of manufacturing a processed chip snack according to the present embodiment.

The processed chip snack manufacturing method according to the present embodiments includes a raw material processing step (S600), a processed chip production step (S610), a mixed solution addition step (S620), a topping material manufacturing step (S630), a topping coating step (S640), and It includes a packaging step (S60).

As described above, the raw material may be vegetables or fruits that can be prepared as snacks. For example, the vegetable may be any one of potato, sweet potato, taro, yam, onion, sweet pumpkin, zucchini, and carrot, and the fruit may be apple, sweet persimmon, pear, melon, watermelon, strawberry, melon, banana, mango and papaya. It may be any one of, but the type of vegetables and fruits in the present embodiment is not limited thereto.

The step of processing the raw material is a step of producing a processed product to facilitate frying the raw raw material. For example, the input raw material may be peeled, the peeled raw material may be properly trimmed and then sliced, washed and dried so that the water is less than a certain condition, and foreign substances may be removed. However, it is not limited thereto.

In the processing chip production step (S610), an operation of frying the workpiece for a specific temperature and a predetermined time may be performed by receiving oil. The frying method may be a frying method, but is not limited thereto.

The step of adding the mixed solution (S620) is a step of adding the mixed solution to the processed chip. In order to add the mixed solution to the processing chip, an air spray method that sprays in one or all directions may be used, but the present embodiment is not limited thereto.

Here, the mixed solution may be a solution containing raw material powder in one or more oils. The concentration of the raw material powder included in the mixed solution may be 6% to 10%. Meanwhile, the preferred concentration at which the taster can feel the appropriate flavor may be about 7%, but the present embodiment is not limited thereto.

For example, a solvent is formed from an oil in which palm olein oil and sunflower oil are mixed at a ratio of 7:3, and a mixed solution having a concentration of about 7% can be prepared using potato powder (if the raw material is potato) as a solute.

In this case, the mixed solution may be applied to be about 2% of the volume of the processed chip, but the present embodiment is not limited thereto.

The topping material manufacturing step S630 is a step of preparing a topping material by mixing the first material and the second material.

As described above, the first material may be a solid powder that gives taste, and the second material may be a mixed oil. Here, the first material may be seasoning, and the second material may be an oil in which at least two types of oil are mixed.

The mixed oil may be prepared by mixing the first oil and the second oil in various ratios. For example, it can be prepared in a ratio of 1:1.

Here, the first oil may be hardened palm oil, and the second oil may be palm olein oil. The melting point of the hardened palm oil may be 36°C to 37°C, and the melting point of palm olein oil may be 18°C to 22°C. Since the melting point of hardened palm oil is 36°C to 37°C, it has a property of rapidly hardening at room temperature. And, since the melting point of palm olein oil is 18 ℃ to 22 ℃ it may be in a semi-solid state at room temperature.

The hardened palm oil can play a role in improving the setting properties of the topping material coated on the processed chip, and palm olein oil can play a role in controlling the hardening temperature of the topping material.

The kind and melting point of the mixed oil as described above improves the setting property of the topping part to be formed later, so that the topping part does not spread until the flow stage after packaging.

Meanwhile, in the above description, the first oil is the hardened palm oil and the second oil is palm olein oil, but the present embodiment is not limited thereto, and the first oil improves the setting properties of the topping material. It is an oil that plays a role, and any oil may be applied as long as the second oil is an oil capable of controlling the hardening temperature of the topping material.

The topping material according to the present embodiment may be a mixture in which a first material as a solute and a second material as a solvent are mixed in various ratios. For example, it may be a mixture in which the first material and the second material are mixed in a ratio of 1:1.

This topping material exists in a slurry state at 23.5°C to 41°C due to the melting point characteristics of the first oil and the second oil constituting the mixed oil. In addition, the temperature of the manufacturing site may be maintained at 35° C. or lower so that the topping material is maintained in a slurry state (a state in which the temperature of the topping material is 23.5° C. to 41° C.) until it is set in the processed chip.

Maintaining the temperature of the topping material affects the state of the topping material and the shape of the topping portion formed later. When the temperature of the topping material is maintained at 23.5°C to 41°C, the topping material may be maintained in a slurry state in a later step of coating the topping material (S640). It can be manufactured in a shape including.

For example, when the first material of the topping material is tomato ketchup flavor seasoning, the temperature of the prepared topping material may be maintained in a temperature range of 23.5°C to 40°C, and the first material of the topping material is chili sauce In the case of flavor seasoning, the temperature of the prepared topping material may be maintained in a temperature range of 24.5°C to 41°C.

The topping material coating step S640 is a step of coating the topping material on the processed chip.

The step of coating the topping material on the processed chip uses the manufacturing apparatus shown in FIG. 7. 7 is a manufacturing apparatus used to coat a topping material on a processed chip according to the present embodiments.

Referring to FIG. 7, the manufacturing apparatus 750 includes a container 760, a roller 770, and a wing part 780. Some or all of the rollers 770 may be located within the container 760. In addition, at least one wing portion 780 is connected to the roller 770.

7 illustrates a configuration in which the roller has a cylindrical shape, but the present embodiment is not limited thereto, and may be, for example, a polygonal column shape. In addition, the wing portion 780 may be formed in various shapes such as a bar and a W shape.

In addition, although not shown in FIG. 7, an electronic device may be connected to the roller 770. The roller 770 may be driven by an electronic device. Specifically, when a signal is transmitted from the electronic device, the roller 770 Can rotate.

Inside the container 760, the topping material 720 prepared in the topping material manufacturing step (S630) is contained. When the roller 770 of the manufacturing apparatus 750 rotates, the topping material 720 moves along the surface of the roller 770 due to the adhesion of the topping material 720.

Even in the topping material coating step (S640), the temperature of the manufacturing place may be maintained at 35°C or less. Accordingly, the temperature of the topping material 720 in the topping material coating step S640 in which the manufacturing apparatus 750 is used may be lower than the temperature of the topping material prepared in the topping material manufacturing step S630.

However, since the temperature of the manufacturing site is maintained appropriately, the topping material 720 may be in the form of a slurry even while the topping material 720 moves along the surface of the roller 770.

The topping material 720 is also transferred to the surface of the wing portion 780 connected to the roller 770. The topping material 720 delivered to the wing portion 780 falls on at least one surface of the plurality of processed chips 110 located under the wing portion 780 and falls on at least one surface of the processed chip 110.

A process in which the topping material 720 falls on the surface of the processed chip 110 will be described in detail with reference to FIG. 8 as follows.

FIG. 8 is a diagram specifically showing part X of FIG. 7.

Referring to FIG. 8, the shape of the topping material 720 falling from the wing portion of the manufacturing apparatus may be a water droplet shape. However, the shape of the topping material 720 falling in this embodiment is not limited thereto, and may be a spherical or elliptical spherical shape.

The topping material 720 falling from the wing portion of the manufacturing apparatus is still maintained in the form of a slurry, whereby the topping material 720 has adequate flowability. Accordingly, the topping material 720 may fall in a droplet shape or the like.

This topping material 720 falls on one surface of the processing chip 110 and is hardened. At this time, due to the mixed oil contained in the topping material 720, the topping material 720 falls on one side of the processed chip 110 and has a slight spreading property.

The topping material 720 formed on one surface of the processed chip 110 becomes a solid state topping portion 120 made of a core 121 and a peripheral portion 122.

The topping portion 120 may include a core 121 and a peripheral portion 122 surrounding the core 121, wherein the core 121 has a larger area of the first material than the peripheral portion. The first material is a solid powder, and the solid powder is difficult to spread over a large area even in a state where it is mixed with the mixed oil, so that the core 121 of the topping part 120 is formed on the processing chip 110.

Thereafter, as shown in FIG. 6, a final product is produced through a packaging step (S650) of packaging processed chip snacks having a topping portion formed on the surface of the processed chip. The topping portion of the processed chip snack made into the final product remains solid.

In this embodiment, the temperature of the topping material 720 and the temperature of the manufacturing place may be controlled so that the topping material 720 is maintained in a form having appropriate flowability until immediately before falling on the surface of the processed chip 110, The mixing ratio of various materials included in the topping material 720 may be adjusted.

In addition, the mixing ratio of the various materials included in the topping material 720 determines the shape, setting, and taste of the topping portion 120 formed on the surface of the processed chip 110.

However, when the temperature of the topping material 720 according to the present embodiment and the temperature condition of the manufacturing place are deviated from the temperature conditions, a topping portion as shown in FIGS. 9 and 10 is formed.

9 is a diagram illustrating a processed chip snack according to a comparative example, and FIG. 10 is a view taken along G-H of FIG. 9.

9 and 10, in the processed chip snack 900 according to the comparative example, a topping portion 920 that cannot distinguish between a core and a peripheral portion is formed on one surface of the processed chip 910. In addition, the processed chip snack 900 according to the comparative example is formed such that a plurality of topping portions 920 are in contact with each other. For this reason, the taster cannot feel the flavor of the topping portion 920 when tasting the portion where the topping portion 920 is present in the processed chip snack 900.

In the manufacturing process for forming the topping portion 920 on the processed chip 910 according to the comparative example, the temperature of the topping material may be less than 23.5°C or higher than 41°C. In addition, the temperature of the manufacturing place where the topping material is formed on the processing chip 910 may be higher than 35°C.

That is, the temperature of the topping material manufactured to form the topping part 920 according to the comparative example and the temperature of the manufacturing place are different from the temperature of the topping material according to the present embodiments and the temperature of the manufacturing place. In addition, the topping material of the comparative example does not include the first material and the second material of the topping material of the present examples, and therefore, the mixing ratio of each material is also different from the topping material of the present examples. Accordingly, the topping portion 920 of the processed chip snack 900 according to the comparative example cannot be manufactured in a configuration corresponding to the core of the topping portion according to the present embodiments.

However, the processed chip snack according to the present embodiments is manufactured under the above-described conditions, so that a plurality of spaced topping portions may be irregularly formed on the surface of the processed chip, thereby making the processed chip snack look more eatable. You can get a visual effect.

In addition, since each of the plurality of topping portions is composed of a core and a peripheral portion surrounding the core, when the taster tastes the portion of the processed chip snack where the topping portion is present, a taste effect that can feel the flavor of the enhanced topping can be obtained. have. In addition, since the mixing ratio of various materials included in the topping material has a specific condition, setting properties may be excellent so that a plurality of spaced topping portions do not spread to distribution after packaging of the processed chip snack.

The description above and the accompanying drawings are merely illustrative of the technical idea of the present invention, and those of ordinary skill in the technical field to which the present invention pertains, combinations of configurations within the scope not departing from the essential characteristics of the present invention. Various modifications and variations, such as separation, substitution, and alteration, will be possible. Accordingly, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but to explain the technical idea, and the scope of the technical idea of the present invention is not limited by these embodiments. The scope of protection of the present invention should be construed by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

100: processed chip snack
110: processing chip
120: topping part
121: core
122: periphery

Claims (15)

Processed chips in which raw materials are sliced and fried;
A plurality of topping portions irregularly arranged in dots on at least one surface of the processed chip; And
At least two of the topping portions are spaced apart from each other,
The topping portion includes a core and a peripheral portion surrounding the core, and the height of the core from one surface of the processed chip is higher than the height of the peripheral portion,
The topping part includes a first material, a second material and a third material, the first material is a solid powder, the second material is a mixed oil, and the third material is a sauce,
The first material is a seasoning of the taste of the third material, the content of the third material is less than the content of the first material and the second material,
The second material includes a first oil and a second oil, the melting points of the first oil and the second oil are different from each other, and the melting point of each oil is selected from the range of 18°C to 37°C. Processed Chip Snack. The method of claim 1,
The core of the topping part includes a first core and a second core,
A processed chip snack having the same or different heights of the first core and the second core. delete delete delete delete delete Processed chips in which raw materials are sliced and fried;
A plurality of topping portions irregularly arranged in dots on at least one surface of the processed chip; And
The topping portion includes a first material, a second material and a third material, the first material is a solid powder, the second material is a mixed oil, and the third material is a sauce,
The first material is the seasoning of the taste of the third material, the content of the third material is less than the content of the first material and the second material,
The second material includes a first oil and a second oil, the melting points of the first oil and the second oil are different from each other, the melting point of each oil is selected from the range of 18 ℃ to 37 ℃, ,
The topping portion includes a core and a peripheral portion surrounding the core, and the content of the first material included in the core is greater than the content of the first material included in the peripheral portion. delete Processing raw materials to produce a sliced workpiece;
Frying the workpiece to produce a processed chip;
A first material that is seasoning; And a second material that is a mixed oil having a first oil and a second oil selected from the range of 18° C. to 37° C., each having a different melting point, and a topping in a slurry state having a temperature of 23.5° C. Manufacturing steps; And
Including the step of coating a plurality of topping portions irregularly arranged in dots on at least one surface of the processed chip by dropping the topping on the workpiece at a temperature of 35°C or less,
The topping portion coated on the processed chip includes the first material and the second material, the topping portion includes a core and a peripheral portion surrounding the core, and the content of the first material included in the core of the topping portion is A method of manufacturing a processed chip snack that is greater than the content of the first material included in the peripheral part. delete delete delete delete The method of claim 10,
At least two topping portions of the plurality of topping portions are spaced apart from each other.

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