KR102241746B1 - Tactile sensor and Forcep sensor based crystal silicon nano membrane - Google Patents

Abstract

The present invention relates to a tactile sensor based on a single-crystal silicon nanomembrane, a force sensing forceps device for robot-assisted minimally invasive surgery (RMIS) using a tactile sensor, and a manufacturing method thereof. More specifically, the present invention relates to a manufacturing method which comprises: a step of transcribing a single-crystal silicon layer on a polyimide (PI) film; a step of etching the silicon layer, generating a plurality of sensor units, and manufacturing an electrode wire through a metalizing process; a step of coating the PI film with the sensor unit and the electrode wire with PDMS, and manufacturing a tactile sensor; a step of coating a bump mold with PDMS, hardening the same, and manufacturing a bump; a step of bonding the bump to the tactile sensor; a step of attaching a transformation layer to each of one side on an inner surface of a pair of end effectors of an RMIS robot; and a step of bonding the tactile sensor engaged with the bump to each of the transformation layers. The present invention aims to provide a tactile sensor based on a single-crystal silicon nanomembrane, force sensing forceps device for RMIS using the tactile sensor, and a manufacturing method thereof, which are able to measure the tactile information obtained from the end effectors.

Description

A tactile sensor based on a single crystal silicon nanomembrane, and a forcep sensor device for RMIS using the tactile sensor, and a manufacturing method thereof {Tactile sensor and Forcep sensor based crystal silicon nano membrane}

The present invention relates to a single crystal silicon nano-membrane-based tactile sensor, a forceps sensor device for RMIS using the tactile sensor, and a method of manufacturing the same. More specifically, it is about a tactile sensor that can be applied to RMIS (Robot assisted Minimally Invasive Surgery), an application technology that requires haptic feedback (Force feedback + Tactile feedback).

Recently, various surgeries have been performed using robots, and this surgical method is called RMIS (Robot-assisted Minimally Invasive Surgery).

RMIS is a surgical method similar to previously known MIS, and there is a difference in who handles surgical instruments. In the case of MIS, surgical instruments are directly handled by the surgeon, but in the case of RMIS, the surgical instruments are handled by a robot controlled by a surgeon, not a surgeon.

The reason for the increasing proportion of surgical procedures to RMIS is that RMIS has the advantages of existing MIS (e.g., small incisions, less bleeding, faster recovery time and reduced scarring), but the limitations of MIS (e.g., This is because it is a surgical method that overcomes the fulcrum effect, limitation on degree of freedom for hand, loss of intuitiveness, etc.).

However, limitations still remain (eg, large space, longer operating time and lack of haptic feedback).

In particular, lack of haptic feedback is an issue to be resolved. Haptic feedback (Tactile feedback + kinesthetic feedback) is the sense of touch the surgeon feels when handling organs while performing surgery.

In particular, tacile information (3-axis force detection, force distribution) obtained from the end-effector, which is a part that deals with organs, could not be transmitted to the surgeon, so excessive force was applied when handling organs, resulting in internal injuries and trauma. In the case of suturing, the thread is broken and the operation is delayed.

For this reason, it often causes complications in patients after surgery. Therefore, in order to deliver haptic feedback to the surgeon, a tactile sensor is required to measure haptic information generated between an organ and a surgical tool (tool-tissue interaction).

Republic of Korea Patent Publication No. 2012-0030174 Korean Registered Patent No. 1169943 Korean Registered Patent No.1785751

Therefore, the present invention was conceived to solve the conventional problems as described above, and according to an embodiment of the present invention, when a robot handles an organ using a surgical tool in RMIS, an end effector that is a part that directly contacts the organ An object of the present invention is to provide a tactile sensor and a device manufacturing method based on a single crystal silicon nanomembrane capable of measuring tactile information (3-axis force detection, force distribution) obtained from the device.

According to an embodiment of the present invention, an object of the present invention is to ultimately deliver the obtained tactile information to a surgeon who handles a robot to solve the limitation of haptic feedback, which has been a problem.

On the other hand, the technical problems to be achieved in the present invention are not limited to the technical problems mentioned above, and other technical problems that are not mentioned are clearly to those of ordinary skill in the technical field to which the present invention belongs from the following description. It will be understandable.

A first object of the present invention is a method of manufacturing a tactile sensor, comprising: transferring a single crystal silicon layer onto a polymer film layer; Etching the silicon layer to generate a plurality of sensor units, and fabricating electrode wiring through a metal deposition process; And coating a protective layer on the polymer film layer on which the sensor unit and the electrode wiring are formed.

The transferring step may be characterized in that the single crystal silicon layer having the array pattern is separated from the silicon wafer by the area of the polydimethylsiloxane (PDMS) medium, and the single crystal silicon layer is transferred to the polymer film layer.

In addition, the sensor unit may be a three-axis sensor, consisting of four separated by a specific distance from each other, and the electrode wiring may be characterized in that the electric connection of the sensor unit.

In addition, the coating may be characterized in that the protective layer is formed using PDMS.

In addition, the polymer film layer may be made of a polyimide (PI) film, and the electrode wiring may be made of gold or chromium.

The second object of the present invention can be achieved as a tactile sensor based on a single crystal silicon nanomembrane, characterized in that it is manufactured by the manufacturing method according to the aforementioned first object.

The third object of the present invention can be achieved as a forceps sensor device for RMIS using a tactile sensor, characterized in that a tactile sensor according to the aforementioned second purpose is attached to each of the inner surfaces of a pair of end effectors of the RMIS robot. have.

A fourth object of the present invention is a method of manufacturing a forceps sensor device for RMIS using a tactile sensor, comprising: transferring a single crystal silicon layer onto a polyimide (PI) film; Etching the silicon layer to generate a plurality of sensor units, and fabricating electrode wiring through a metal deposition process; Manufacturing a tactile sensor by coating PDMS on the PI film on which the sensor unit and the electrode wiring are formed; Coating and curing the PDMS solution on the bump mold to produce a bump; Bonding the bump and the tactile sensor; Attaching a deformation layer to each of the inner surfaces of the pair of end effectors of the RMIS robot; And manufacturing a forceps sensor by adhering a tactile sensor to which bumps are bonded to each of the deformable layers. It can be achieved as a method of manufacturing a forceps sensor device for RMIS using a tactile sensor comprising a.

In addition, the PDMS solution may be characterized in that the PDMS: curing solvent is mixed in a ratio of 5: 0.5 to 1.5.

In addition, it may be characterized in that the bump and the tactile sensor are bonded through a plasma process.

In addition, the end effector includes a first end effector and a second end effector facing each other, and the forceps sensor is attached at different positions on the inner surface of the first end effector and the inner surface of the second end effector. I can.

According to an embodiment of the present invention, the fabricated single crystal silicon nanomembrane-based tactile sensor is relatively less sensitive to electromagnetic interference (EMI) generated while the robot is driven than other driving methods (capacitive type, piezoelectric type) sensors. Since it was manufactured using the strain gauge method, which is a driving method, it has the advantage of being suitable for RMIS, an application engineer using a robot.

In addition, according to an embodiment of the present invention, since the characteristics of the sensor used in RMIS are directly related to human life, single-crystalline silicon having high sensitivity and stability can be used to have low hysteresis and repetition errors. Has an effect.

And according to the embodiment of the present invention, in relation to the characteristics of the tactile sensor required by RMIS, two 1 Cell sensors were attached to be placed at different positions of the end effector in order to detect the force distribution, and the manufactured tactile sense Direct contact is possible by designing the sensor to be placed on the end effector, which is a part that directly contacts the organ. In addition, 3-axis force is more enhanced by using an artificial structure bump using PDMS (Polydimethylsiloxane), which is harmless to the human body. It has an effect that can be accurately detected.

On the other hand, the effects obtainable in the present invention are not limited to the above-mentioned effects, and other effects not mentioned will be clearly understood by those of ordinary skill in the art from the following description. I will be able to.

The following drawings attached to the present specification illustrate a preferred embodiment of the present invention, and serve to further understand the technical idea of the present invention together with the detailed description of the present invention. It is limited and should not be interpreted.
1 is a flowchart of a method of manufacturing a forceps sensor device for RMIS using a single crystal silicon nanomembrane-based tactile sensor according to an embodiment of the present invention;
2 is a block diagram showing a flow of a method of manufacturing a tactile sensor based on a single crystal silicon nanomembrane according to an embodiment of the present invention;
3 is a plan view of a sensor unit according to an embodiment of the present invention,
4 is a block diagram showing a bump manufacturing process according to an embodiment of the present invention;
5 is an exploded perspective view of a forceps sensor device for RMIS using a single crystal silicon nanomembrane-based tactile sensor according to an embodiment of the present invention,
6 is a side view of the end effector of the robot in RMIS,
7A is a photograph of a forceps sensor device for RMIS using a tactile sensor manufactured according to an embodiment of the present invention,
7B is an enlarged view of part A of FIG. 7A;
8A is a front perspective view of a forceps sensor device for RMIS using a single crystal silicon nanomembrane-based tactile sensor according to an embodiment of the present invention,
8B is a rear perspective view of a forceps sensor device for RMIS using a single crystal silicon nanomembrane-based tactile sensor according to an embodiment of the present invention,
9A is a graph of an output value of an applied force measured in a forceps sensor device for RMIS using a tactile sensor manufactured according to an embodiment of the present invention;
9B is a graph of an output value repeatedly measured in a forceps sensor device for RMIS using a tactile sensor manufactured according to an embodiment of the present invention;
10 is a graph showing output values in the X and Y directions when a force is applied in the X direction according to an embodiment of the present invention.

The above objects, other objects, features, and advantages of the present invention will be easily understood through the following preferred embodiments related to the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided so that the disclosed content may be thorough and complete, and the spirit of the present invention may be sufficiently conveyed to those skilled in the art.

In the present specification, when a component is referred to as being on another component, it means that it may be formed directly on the other component or that a third component may be interposed therebetween. In addition, in the drawings, the thickness of the components is exaggerated for effective description of the technical content.

Embodiments described herein will be described with reference to cross-sectional views and/or plan views, which are ideal exemplary views of the present invention. In the drawings, thicknesses of films and regions are exaggerated for effective description of technical content. Therefore, the shape of the exemplary diagram may be modified by manufacturing technology and/or tolerance. Accordingly, embodiments of the present invention are not limited to the specific form shown, but also include a change in form generated according to the manufacturing process. For example, the area shown at a right angle may be rounded or may have a shape having a predetermined curvature. Accordingly, regions illustrated in the drawings have properties, and the shapes of regions illustrated in the drawings are for exemplifying a specific shape of the region of the device and are not intended to limit the scope of the invention. In various embodiments of the present specification, terms such as first and second are used to describe various elements, but these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. The embodiments described and illustrated herein also include complementary embodiments thereof.

The terms used in the present specification are for describing exemplary embodiments and are not intended to limit the present invention. In this specification, the singular form also includes the plural form unless specifically stated in the phrase. As used in the specification, "comprises" and/or "comprising" does not exclude the presence or addition of one or more other components.

In describing the specific embodiments below, a number of specific contents have been prepared to explain the invention in more detail and to aid understanding. However, a reader who has knowledge in this field enough to understand the present invention can recognize that it can be used without these various specific contents. In some cases, it is mentioned in advance that parts that are commonly known in describing the invention and are not largely related to the invention are not described in order to prevent confusion without any reason in describing the invention.

Hereinafter, a configuration and manufacturing method of the forceps sensor device 100 for RMIS using a single crystal silicon nanomembrane-based tactile sensor according to an embodiment of the present invention according to an embodiment of the present invention will be described. 1 is a flowchart illustrating a method of manufacturing a forceps sensor device 100 for RMIS using a single crystal silicon nanomembrane-based tactile sensor according to an embodiment of the present invention.

First, the configuration of the tactile sensor 10 manufactured for the forceps sensor device 100 for RMIS and a manufacturing method thereof will be described.

2 is a block diagram showing a flow of a method of manufacturing a tactile sensor 10 based on a single crystal silicon nanomembrane according to an embodiment of the present invention.

As shown in FIG. 2, a single crystal silicon layer 12 having an array pattern to form a strain gauge, which is a sensor unit 13, is transferred onto the polymer film layer 11. The single crystal silicon layer 12 is transferred onto the polymer film layer 11 through a dry transfer method (S1).

Specifically, as shown in the first left side of FIG. 2, the single crystal silicon layer 12 having an array pattern is separated from the silicon wafer by the area of the polydimethylsiloxane (PDMS) medium (PDMS stamp), and the second left side is shown. As described above, the single crystal silicon layer 12 is transferred to the polymer film layer 11. At this time, the single crystal silicon layer 12 having an array pattern is transferred to and laminated to the polymer film layer 11 stacked on the carrier wafer with the sacrificial layer therebetween. Here, the polymer film layer 11 is formed of a polyimide (PI) thin film layer, and the sacrificial layer is coated with polymethyl acrylate (PMMA, acrylic resin). Also, the single crystal silicon layer having the array pattern has a thickness of about 100 nm in a specific embodiment.

Then, the silicon layer 12 transferred to the PI film layer 11 is etched and etched to form four sensor units as shown in the third left side of FIG. 2 (S3). 3 shows a plan view of the sensor unit 13 according to an embodiment of the present invention. As shown in FIG. 4, it can be seen that the sensor unit 13 is configured in a ∩ shape and is configured as a 3-axis strain gauge.

Then, as shown in the third left of FIG. 2 through a metallization process (Metallization), an electrode wiring 20 for electrically connecting the sensor units 13 is manufactured (S4). That is, the electrode wiring 20 is formed by metal evaporation of gold or chromium.

And finally, by coating the protective layer 30 on the polymer film layer 11 on which the sensor unit 13 and the electrode wiring 20 are formed, the tactile sensor 10 is manufactured (S4). This protective layer 30 may be composed of a polydimethylsiloxane (hereinafter, PDMS) protective layer 30. The tactile sensor 10 manufactured in the embodiment of the present invention has a thickness of about 25 μm.

Hereinafter, a configuration and manufacturing method of the forceps sensor device 100 for RMIS using a tactile sensor according to an embodiment of the present invention will be described.

4 is a block diagram showing the manufacturing process of the bump 40 according to an embodiment of the present invention. And Figure 5 is an exploded perspective view of the forceps sensor device 100 for RMIS using a single crystal silicon nano-membrane-based tactile sensor according to an embodiment of the present invention. And Figure 6 shows a side view of the end effector 2 of the robot for RMIS.

First, in order to manufacture the forceps sensor device 100 for RMIS using a tactile sensor, a bump 40 is manufactured (S5). As shown in FIG. 4, the bump 40 was spin-coated with PDMS of 5:1 (base: curing agent) on the bump mold 41, followed by oven curing (70° C., 2 hours) to bump 40 You can see that it will be produced. The bump 40 manufactured according to the embodiment of the present invention has a thickness of about 500 μm.

Then, the tactile sensor 10 manufactured on the bump 40 is adhered (S6). In an embodiment of the present invention, the tactile sensor 10 and the manufactured pump are bonded through a plasma process.

Then, the strained layer 50 is fabricated using PDMS of 5:1 (base:curing agent). The strained layer 50 manufactured according to the embodiment of the present invention has a thickness of about 500 μm. This deformation layer 50 is attached to the inner surface of the end effector 2 of the RMIS robot (1) (S7), and the tactile sensor 10 to which the bump 40 is coupled to the attached deformation layer 50 is combined. (S8).

7A is a photograph of a forceps sensor device 100 for RMIS using a tactile sensor manufactured according to an embodiment of the present invention, and FIG. 7B is an enlarged view of part A of FIG. 7A.

And Figure 8a is a front side perspective view of the end effector 2 to which the forceps sensor device 100 for RMIS using a single crystal silicon nanomembrane-based tactile sensor according to an embodiment of the present invention is attached, and Figure 8b is the present invention. It is a rear perspective view of the end effector 2 to which the forceps sensor device 100 for RMIS using a single crystal silicon nanomembrane-based tactile sensor according to an embodiment of is attached.

The end effector 2 is coupled to the RMIS robot 1 by a connection plate 4, as shown in FIGS. 6, 8A and 8B, and two end effectors facing each other at the ends of the arm 3 (2-1, 2-2), that is, a first end effector (2-1) and a second end effector (2-2_) are included, and the forceps sensor device 100 for RMIS according to an embodiment of the present invention. ) Is attached to each of the inner surface of the first end effector 2-1 and the inner surface of the second end effector 2-2, as shown in Fig. 8A. The forceps sensor device 100 attached to the inner surface of the and the forceps sensor device 100 attached to the inner surface of the second end effector 2-2 are attached to be placed in different positions and placed in direct contact with the organ. As a result, the 3-axis force and force distribution can be more accurately detected, and the 3-axis force can be more accurately detected by using the artificial structure bump 40 using polydimethylsiloxane (PDMS), which is harmless to the human body. There will be.

In addition, the arm 3 and the connection plate 4 are provided with a plurality of FPCBs 5 as shown in FIG. 8B, and wires may be connected through the through holes 6 formed on the FPCB 5 Can be seen.

9A is a graph showing an output value graph of an applied force measured by the forceps sensor device 100 for RMIS using a tactile sensor manufactured according to an embodiment of the present invention. As shown in FIG. 9A, when the same force is repeatedly applied 5 times to the forceps sensor device 100 attached to the end effector 2, the same output value is obtained, thereby ensuring high accuracy.

9B shows a graph of output values repeatedly measured in the forceps sensor device 100 for RMIS using a tactile sensor manufactured according to an embodiment of the present invention. As shown in FIG. 9B, as a result of repeated measurements of 1000 times for various forces, it can be seen that the repetition error is very low.

10 is a graph showing output values in the X and Y directions when a force is applied in the X direction according to an embodiment of the present invention. As shown in FIG. 10, when a force is applied in the X direction, the output in the Y direction does not appear, indicating very high accuracy in the measurement of the force distribution.

In addition, the above-described apparatus and method are not limitedly applicable to the configuration and method of the above-described embodiments, but all or part of each of the embodiments may be selectively combined so that various modifications may be made to the above-described embodiments. It can also be configured.

1:RMIS robot
2: end effector
2-1: first end effector
2-2: 2nd end effector
3: dark part
4: connection plate
5:FPCB
6.FPCB through hole
10: tactile sensor
11: Polymer film layer
12: single crystal silicon layer
13: sensor part
20: electrode wiring
30: protective layer
40: bump
41: bump mold
50: deformation layer
100: Forceps sensor device for RMIS using a tactile sensor

Claims (11)

In the method of manufacturing a forceps sensor device for RMIS using a tactile sensor,
Transferring the single crystal silicon layer onto the polymer film layer;
Etching the silicon layer to generate a plurality of sensor units, and fabricating electrode wiring through a metal deposition process;
Manufacturing a tactile sensor by coating PDMS on the polymer film layer on which the sensor unit and the electrode wiring are formed to form a protective layer;
Coating and curing the PDMS solution on the bump mold to produce a bump;
Bonding the bump and the tactile sensor;
Attaching a deformation layer composed of PDMS to each of the inner surfaces of the pair of end effectors of the RMIS robot; And
Including, the step of producing a forceps sensor by bonding a tactile sensor to which a bump is coupled to each of the deformable layers,
In the transferring step, the single crystal silicon layer having the array pattern is separated from the silicon wafer by the area of the polydimethylsiloxane (PDMS) medium, and the single crystal silicon layer is transferred to the polymer film layer,
The sensor unit is a three-axis sensor and consists of four spaced apart from each other by a specific distance, and the electrode wiring electrically connects the sensor unit,
A method of manufacturing a forceps sensor device for RMIS using a single crystal silicon nanomembrane-based tactile sensor, characterized in that the bump and the tactile sensor are adhered through a plasma process.
delete delete delete The method of claim 1,
The polymer film layer is composed of a polyimide (PI) film,
The method of manufacturing a forceps sensor device for RMIS using a single crystal silicon nanomembrane-based tactile sensor, wherein the electrode wiring is made of gold or chromium.
delete delete delete The method of claim 1,
The PDMS solution is a method of manufacturing a forceps sensor device for RMIS using a tactile sensor, characterized in that the PDMS: curing solvent is mixed in a ratio of 5: 0.5 to 1.5.
The method of claim 1,
The end effector includes a first end effector and a second end effector opposite to each other, and the forceps sensor is attached at different positions on the inner surface of the first end effector and the inner surface of the second end effector. A method of manufacturing a forceps sensor device for RMIS using a tactile sensor.
A forceps sensor device for RMIS using a tactile sensor, characterized in that manufactured by the manufacturing method according to any one of claims 1, 5, 9, and 10.

Images