KR102234511B1 - Self-Healing Polymer Encapsulated Conductive Fibers and Production Method thereof, Self-Healing Polymer Encapsulated Conductive Fibers Interconnect - Google Patents

Abstract

According to the present invention, disclosed are: self-healing polymer encapsulated conductive fibers which has improved electrical stability and mechanical properties for tensile strength compared to conventional conductive fibers by wrapping a self-healing polymer in a spandex fiber containing silver (Ag) nanoparticles; a manufacturing method thereof; and a self-healing polymer encapsulated conductive fiber interconnect.

Description

Self-Healing Polymer Encapsulated Conductive Fibers and Production Method thereof, Self-Healing Polymer Encapsulated Conductive Fibers Interconnect}

The present invention relates to a conductive fiber and a method for producing the same, and more particularly, to a self-healing polymer encapsulated conductive fiber and a method for producing the same.

Conductive fibers can transmit power and signals from wearable devices applied to clothing, and are in great demand as core parts of wearable devices. In particular, it is widely used in the field of high-functional smart wear where IT technology and fashion are fused.

This conductive fiber has excellent electrical conductivity and needs a wearable function, so it must have excellent elasticity. In addition, even if the expansion and contraction are repeatedly performed, the electrical conductivity is maintained as it is, and durability that does not break must be maintained.

Existing technologies have a problem in that a number of cracks are formed due to accumulated stress through repetitive deformation.

Accordingly, there is a need for a technology capable of sufficiently performing the role of an interconnector, which is a basic component of a wearable device, with higher electrical/mechanical stability than a conductive fiber using a conventional chemical reduction method.

An object of the present invention is to develop a conductive fiber interconnect that is excellent electrically and mechanically by wrapping a self-healing polymer in a spandex fiber containing silver nanoparticles (Ag nanoparticles).

In addition, a silver shell is abundantly formed on the outside of the fiber by using a butanol solvent, and the inside of the fiber maintains the existing spandex properties. There is another purpose to improve it.

Other objects not specified of the present invention may be additionally considered within a range that can be easily deduced from the following detailed description and effects thereof.

In order to solve the above problem, the self-healing polymer encapsulated conductive fiber according to an embodiment of the present invention includes a core formed of a polymer as a core-shell structure, and an electrically conductive shell surrounding the core. It includes a fiber and a self-healing polymer component, and includes a polymer capsule layer covering the conductive fiber with at least one layer.

Here, the polymer capsule layer includes a first polymer capsule layer surrounding one side of the conductive fiber and a second polymer capsule layer surrounding the other side of the conductive fiber, and bonded to both ends of the first polymer capsule layer.

Here, the boundary region of the core in contact with the electrically conductive shell further includes a precursor absorbing layer through which the metal precursor solution is absorbed, and the electrically conductive shell absorbs the metal precursor solution into the precursor absorbing layer and is absorbed by using a reducing agent. It is produced by reducing the formed metal precursor to metal particles.

Here, the core includes a fiber having a urethane bond, the metal precursor solution includes a silver (Ag) precursor solution, and the electrically conductive shell absorbs the silver (Ag) precursor solution in the precursor absorption layer And, it is produced by reducing the absorbed silver (Ag) precursor to silver nanoparticles using a reducing agent.

Here, the silver (Ag) precursor solution is prepared by mixing a silver (Ag) precursor and a hydroxy group solvent at a predetermined ratio.

Here, the hydroxy group solvent is a solvent having an alkyl group molecular weight of 70 to 140 g/mol.

A method of manufacturing a self-healing polymer encapsulated conductive fiber according to an embodiment of the present invention includes preparing a conductive fiber and bonding the conductive fiber with at least one polymer capsule layer, and preparing the conductive fiber Includes the steps of absorbing a metal precursor solution into a polymer layer of a fiber having a urethane bond, and reducing the absorbed metal precursor using a reducing agent to form an electrically conductive shell.

Here, the metal precursor includes silver (Ag), and the metal precursor solution is prepared by mixing a silver (Ag) precursor and a hydroxy group solvent at a predetermined ratio.

Here, in the bonding of the conductive fibers, the polymer capsule layer is attached to fix a portion of the conductive fiber on which the electrically conductive shell is formed.

Here, the reducing agent is one or two or more selected from hydrazine-based, hydride-based, borohydride-based, sodium phosphate-based and ascrobic acid.

Here, the hydroxy group solvent is a solvent having an alkyl group molecular weight of 70 to 140 g/mol.

The self-healing polymer encapsulated conductive fiber interconnect according to an embodiment of the present invention has a structure in which a first polymer conductive fiber and a second polymer conductive fiber are arranged in a lattice structure, and the first polymer conductive fiber and the second polymer conductive fiber are , A polymer capsule comprising a core formed of a polymer as a core-shell structure, a conductive fiber including an electrically conductive shell surrounding the core, and a self-healing polymer component, and covering the conductive fiber with at least one layer Includes layers.

Here, the first polymeric conductive fiber and the second polymeric conductive fiber are easily attached because self-bonding between the fibers is possible, and weaving is possible.

Here, the boundary region of the core in contact with the electrically conductive shell further includes a precursor absorbing layer through which the metal precursor solution is absorbed, and the electrically conductive shell absorbs the metal precursor solution into the precursor absorbing layer and is absorbed by using a reducing agent. It is produced by reducing the formed metal precursor to metal particles.

Here, the hydroxy group solvent is a solvent having an alkyl group molecular weight of 70 to 140 g/mol.

Here, the core includes a fiber having a urethane bond, the metal precursor solution includes a silver (Ag) precursor solution, and the electrically conductive shell absorbs the silver (Ag) precursor solution in the precursor absorption layer And, it is produced by reducing the absorbed silver (Ag) precursor to silver nanoparticles using a reducing agent.

As described above, according to the embodiments of the present invention, a self-healing polymer is wrapped in a spandex fiber containing silver nanoparticles to provide excellent electrical and mechanical conductivity. You can develop connectors.

In addition, a silver shell is abundantly formed on the outside of the fiber by using a butanol solvent, and the inside of the fiber maintains the existing spandex properties. Can improve.

Even if it is an effect not explicitly mentioned herein, the effect described in the following specification expected by the technical features of the present invention and the provisional effect thereof are treated as described in the specification of the present invention.

1 is a view showing a conductive fiber according to an embodiment of the present invention.
2 is a view showing the structure of a self-healing polymer encapsulated conductive fiber according to an embodiment of the present invention.
3 is a view showing a microscopic image of a self-healing polymer encapsulated conductive fiber according to an embodiment of the present invention.
4 to 7 are views for explaining the properties of the conductive fiber according to an embodiment of the present invention.
8 is a view for explaining the properties of the self-healing polymer encapsulated conductive fiber according to an embodiment of the present invention.
9 and 10 are views showing a self-healing polymer encapsulated conductive fiber interconnect according to an embodiment of the present invention.
11 is a flowchart illustrating a method of manufacturing a self-healing polymer encapsulated conductive fiber according to an embodiment of the present invention.

Hereinafter, a self-healing polymer-encapsulated conductive fiber, a method of manufacturing the same, and a self-healing polymer-encapsulated conductive fiber interconnect according to the present invention will be described in more detail with reference to the drawings. However, the present invention may be implemented in various different forms, and is not limited to the described embodiments. In addition, in order to clearly describe the present invention, parts irrelevant to the description are omitted, and the same reference numerals in the drawings indicate the same members.

When a component is referred to as being "connected" or "connected" to another component, it is understood that it may be directly connected or connected to the other component, but other components may exist in the middle. It should be.

The suffixes “module” and “unit” for the constituent elements used in the following description are given or used interchangeably in consideration of only the ease of preparation of the specification, and do not themselves have distinct meanings or roles.

Terms such as first and second may be used to describe various components, but the components should not be limited by terms. The above terms are used only for the purpose of distinguishing one component from another component.

The present invention relates to a self-healing polymer encapsulated conductive fiber, a method for manufacturing the same, and a self-healing polymer encapsulated conductive fiber interconnect.

1 is a view showing a conductive fiber according to an embodiment of the present invention.

The manufacturing process of the conductive fiber will be described with reference to FIG. 1. In an embodiment of the present invention, a conductive fiber is manufactured using a chemical reduction method.

Referring to FIG. 1, the conductive fiber 100 of the polymer encapsulated conductive fiber according to an embodiment of the present invention has a core-shell structure, and has a core 110 formed of a polymer and an electrical conductivity surrounding the core 110. It includes a shell (120).

Specifically, the electrically conductive shell 120 absorbs a silver (Ag) precursor solution in the polymer layer of the fiber 101 having a urethane bond, and the silver (Ag) precursor absorbed by using a reducing agent is converted into silver nanoparticles. It is produced by reducing to, and contains silver (Ag) according to an embodiment of the present invention.

Specifically, the boundary region of the core in contact with the electrically conductive shell further includes a precursor absorbing layer 102 in which a metal precursor solution is absorbed, and the electrically conductive shell absorbs the metal precursor solution in the precursor absorbing layer, and a reducing agent It is produced by reducing the absorbed metal precursor to metal particles.

Here, the precursor absorbing layer 102 is not provided separately from the core, and may be provided differently according to the absorption rate of the precursor solution, and the precursor solution is not simply coated with an electrically conductive shell on the fiber, and the precursor solution is at least a part of the outer side of the fiber. It means that the rapid particles are reduced in the absorbed and absorbed state.

Fiber 101 having a urethane bond of FIG. 1 is preferably a spandex fiber, and undergoes a swelling process, which is a process of absorbing a silver precursor solution into the polymer layer 102.

The spandex fiber is a fiber in which the chemical structure of a molecular chain having a urethane bond occupies 85% of the fiber, and the present invention can produce a self-healing polymer conductive fiber using various types of spandex fiber.

It can also be applied to spandex fibers produced by dry, wet, melt, and chemical spinning methods using polyurethane.

The silver (Ag) precursor solution is prepared by mixing a silver (Ag) precursor (Silver heptafluorobutyrate) and a hydroxy group solvent at a predetermined ratio, and the hydroxy group solvent is a solvent having an alkyl group molecular weight of 70 to 140 g/mol. And, in an embodiment of the present invention, it is preferably a butanol solvent.

In one embodiment of the present invention, the preset ratio is preferably prepared by mixing a silver precursor (Silver heptafluorobutyrate) and butanol as a hydroxy group solvent in an amount of 5 to 45 wt%, and if it is less than 5 wt%, the content of the silver precursor is lowered. If it exceeds 45wt%, it may be difficult to absorb the solution.

Thereafter, the absorbed silver (Ag) precursor is reduced to silver nanoparticles using a reducing agent, and the reducing agent is one or two or more selected from hydrazine-based, hydride-based, borohydride-based, sodium phosphate-based and ascrobic acid. Can be used.

More specifically, the reducing agent may be one or more hydrazine-based reducing agents selected from hydrazine, hydrazine anhydride, hydrazine hydrochloride, hydrazine sulfate, hydrazine hydrate and phenyl hydrazine, and in one embodiment of the present invention, hydrazine hydrate is used. It is desirable.

Specifically, in an embodiment of the present invention, the silver precursor absorbed in the spandex fiber is reduced to silver nanoparticles using a _{diluted Hydrazine hydrate (N 2} H _{2) solution.}

As shown in FIG. 1, the electrically conductive shell is intensively formed on the outer periphery of the fiber having the urethane bond with silver nanoparticles.

In addition, the number of filaments of the fibers to be used is 1 to 100, and the average filament diameter is preferably 70 um to 600 um.

The conductive fiber according to an embodiment of the present invention has a rich silver shell (Ag shell) on the outside of the fiber by using a butanol solvent, and the inside of the fiber is able to maintain the existing spandex properties, thereby preventing the existing conductive fiber. Compared to that, electrical stability and mechanical properties against tensile can be improved.

2 is a view showing the structure of a self-healing polymer encapsulated conductive fiber according to an embodiment of the present invention.

Figure 2 (a) is a side view showing a self-healing polymer encapsulated conductive fiber according to an embodiment of the present invention, Figure 2 (b) is a cross-sectional view.

Referring to FIG. 2, a polymer encapsulated conductive fiber 10 according to an embodiment of the present invention includes a conductive fiber 100 and a polymer capsule layer 200.

The self-healing polymer encapsulated conductive fiber 10 according to an embodiment of the present invention is a conductive fiber produced by wrapping a self-healing polymer in a spandex fiber containing silver nanoparticles (Ag nanoparticles). As a result, it is possible to develop an electrical and mechanically excellent conductive fiber interconnector.

The self-healing polymer is a polymer that can recognize and heal cracks in a material due to external stress, and when using it to manufacture fibers, there is an advantage that there is no need for repair even if cracks occur in the fibers.

The self-healing method according to an embodiment of the present invention is a sulfur compound having a self-healing function that returns to its original state over time even when external stress such as scratches or cutting occurs at room temperature of 20 to 30 degrees, and the surrounding polymer chemical structure. Design. Specifically, it may be used including a new elastomo material, which is an elastomer that uses a method of adding a sulfur compound to a thermoplastic polyurethane, and can improve self-healing efficiency and mechanical strength at room temperature.

In various embodiments of the present invention, an intelligent self-healing polymer technology can be applied.For example, when a certain stimulus is given again when deformation or damage occurs, an intelligent polymer capable of regaining its original shape, and high mechanical properties can be used repeatedly. It is possible to apply a damage-sensing polymer that can self-aggregate phase-separated polymers capable of healing and detect the damage site and degree by using chemical reactions that are mechanically activated by external stimuli and perform appropriate treatments according to the situation. .

In addition, the self-healing polymer greatly improves the self-healing efficiency when heat is applied, and the self-healing phenomenon is possible even in water, so that it can be used when washing.

The conductive fiber 100 has a core-shell structure, and includes a core formed of a polymer and an electrically conductive shell surrounding the core.

The polymer capsule layer 200 covers the conductive fibers 100 with at least one layer.

The polymer capsule layer 200 includes a self-healing polymer, the first polymer capsule layer 210 surrounding one side of the conductive fiber and the other side of the conductive fiber, and the first polymer capsule layer and both ends are bonded to each other. It includes 2 polymer capsule layer 220.

3 is a view showing a microscopic image of a self-healing polymer encapsulated conductive fiber according to an embodiment of the present invention.

The self-healing polymer encapsulated conductive fiber according to an embodiment of the present invention uses a silver precursor solution prepared by mixing a silver (Ag) precursor (Silver heptafluorobutyrate) and a hydroxy group solvent at a preset ratio, and the hydroxy group solvent is , A solvent having an alkyl group molecular weight of 70 to 140 g/mol is used, and in an embodiment of the present invention, it is preferably a butanol solvent. Here, the molecular weight indicates the maximum molecular weight of the hydroxy group solvent having a high molecular weight while having a melting point of 0 degrees or less.

Specifically, FIG. 3 shows SEM, EDS, and contour map images according to the hydroxy group solvent, respectively, and the hydroxy group solvent includes methanol, ethanol, IPA, and butanol. Was used.

Comparing the molecular weights of the hydroxy-group solvents, Methanol (32.04 g/mol) <Ethanol (46.07 g/mol) <IPA (60.10 g/mol) <Butanol (74.12 g/mol) increases in the order, and according to an embodiment of the present invention As a result of using butanol, it can be seen that silver nanoparticles are intensively formed on the outer surface of the fiber when a butanol solvent is used. Accordingly, the interior can be manufactured to have high conductivity due to the rich silver shell (Ag rich shell) while maintaining the polymer properties.

When using the hydroxy group solvent, when the molecular weight of the alkyl group is less than 70 g/mol, silver nanoparticles cannot be intensively formed on the outer surface of the fiber, and when it exceeds 140 g/mol, it is difficult to prepare a precursor solution with a melting point exceeding 0°C. It is difficult.

4 to 7 are views for explaining the properties of the conductive fiber according to an embodiment of the present invention.

4 is a view showing the mechanical properties of the conductive fiber according to an embodiment of the present invention.

Specifically, Figure 4 shows by measuring the mechanical hysteresis (Mechanical hysteresis) according to the hydroxy group solvent.

Figure 4 (a) is methanol (Methanol), Figure 4 (b) is ethanol (Ethanol), Figure 4 (c) is IPA, Figure 4 (d) is the result of using butanol (Butanol), Figure 4(e) is a result of spandex fiber.

4F is a 3D graph of overlapping 500% hysteresis curves of each solvent and spandex.

When comparing (a) to (d) of FIG. 4 and (e) of FIG. 4, respectively, it can be seen that the butanol solvent-based conductive fiber has the most similar mechanical properties to the original spandex fiber.

5 is a diagram showing electrical/mechanical properties of a conductive fiber according to an embodiment of the present invention.

Figure 5 (a) is a comparison of the Young's modulus by measuring the stress on the strain.

When comparing the Young's modulus (the slope of the graph), butanol (65850 Pa) <IPA (84536Pa) <Ethanol (104348Pa) <Methanol (124762 Pa) appears in the order, and the cracking point of the conductive fiber made using a butanol solvent ( It can be seen that the rupture point) occurs at the highest strain (7000%).

When the Young's modulus is large, it means that the resistance to deformation is large and robust, and when the Young's modulus is small, it means that the resistance to deformation is small and it is flexible.

The Young's modulus of the spandex fiber is 42353 Pa, through which it can be seen that the butanol solvent-based conductive fiber most maintains the inherent mechanical properties of spandex.

Figure 5 (b) is a comparison of the conductivity (conductivity) for the strain.

It shows that the butanol solvent-based conductive fiber maintains the highest conductivity, specifically 30485.12 Scm ^-1 at 300% strain.

5C is a result of TGA analysis (thermogravimetric analysis).

Thermogravimetric analysis was performed to determine the amount of silver particles generated in the conductive fiber, and as a result, the amount of silver nanoparticles formed inside the conductive fiber for each solvent does not differ significantly, but the butanol solvent-based conductive fiber has the highest conductivity.

6A and 6B are views showing electrical characteristics of a conductive fiber according to an embodiment of the present invention.

6A and 6B are results of an electrical hysteresis measurement experiment.

The conductivity of the conductive fiber made using the chemical reduction method is affected by the Ag rich shell formed on the outside of the fiber.

In the case of the butanol solvent-based conductive fiber, it can be seen that it has the largest and thickest Ag rich shell.

As a result of measuring electrical hysteresis, it can be seen that the hysteresis loop area of the butanol solvent-based conductive fiber is the smallest. It can be confirmed that it is the most stable.

7 is a view showing the penetration characteristics of the silver component of the conductive fiber according to an embodiment of the present invention.

It can be seen that the range in which the silver precursor solution penetrates and the silver nanoparticles are formed by 60% or more is within 2.5 μm from the outer edge of the single fiber.

Table 1 is a schematic diagram for each solvent used after measuring the silver content (Ag content) of four points in a single filament, and averaged.

8 is a view for explaining the properties of the self-healing polymer encapsulated conductive fiber according to an embodiment of the present invention.

The self-healing polymer encapsulated conductive fiber according to an embodiment of the present invention encapsulates a butanol solvent-based conductive fiber using a self-healing polymer, and, as shown in FIG. 8, when compared with the conductive fiber before encapsulation, electrical stability is improved. I can confirm.

Specifically, based on a 100% tensile strain, the resistance decreases by 35% compared to the non-encapsulated conductive fiber, and through 1000 tensile tests, it can be confirmed that the value is kept constant at 50% reduced resistance than the conventional conductive fiber. .

This increases electrical stability by effectively controlling the crack of the nanoparticle film located on the spandex surface due to the high toughness of the self-healing polymer.

9 and 10 are views showing a self-healing polymer encapsulated conductive fiber interconnect according to an embodiment of the present invention.

9 is a view showing a self-healing polymer encapsulated conductive fiber interconnect structure according to an embodiment of the present invention.

The self-healing polymer encapsulated conductive fiber interconnect according to an embodiment of the present invention provides excellent electrical and mechanical performance by wrapping a self-healing polymer in a spandex fiber containing nanoparticles (Ag nanoparticles). Have.

9, a polymer encapsulated conductive fiber interconnect 20 according to an embodiment of the present invention includes a first polymer conductive fiber 21 and a second polymer conductive fiber 22 including a self-healing polymer in a lattice structure. It is a structure that is arranged as.

The first polymeric conductive fibers 21 and the second polymeric conductive fibers 22 include conductive fibers 310 and 330 and polymer capsule layers 320 and 340 covering the conductive fibers with at least one layer, respectively. .

Here, the conductive fiber is a core-shell structure, the core formed of a polymer; And an electrically conductive shell surrounding the core.

10 is a view showing a process of manufacturing a self-healing polymer encapsulated conductive fiber interconnect according to an embodiment of the present invention.

An interconnect having a lattice structure is manufactured using self-healing polymer-encapsulated conductive fibers, and it can be confirmed that the light of the bulb stably enters even at 200% strain.

11 is a flowchart illustrating a method of manufacturing a self-healing polymer encapsulated conductive fiber according to an embodiment of the present invention.

Referring to FIG. 11, a method of manufacturing a self-healing polymer encapsulated conductive fiber according to an embodiment of the present invention includes preparing a conductive fiber (S100) and bonding the conductive fiber with at least one polymer capsule layer (S200). ).

Specifically, in the step (S100) of preparing the conductive fiber, the metal precursor solution is absorbed in the polymer layer of the fiber having a urethane bond in step S110.

Here, the metal precursor includes silver (Ag), and the metal precursor solution is prepared by mixing a silver (Ag) precursor and a hydroxy group solvent at a predetermined ratio.

The hydroxy group solvent is used with a different molecular weight, and is preferably a butanol solvent.

In step S120, the absorbed metal precursor is reduced using a reducing agent to form an electrically conductive shell.

Specifically, the reducing agent is one or two or more selected from hydrazine-based, hydride-based, borohydride-based, sodium phosphate-based and ascrobic acid.

In more detail, first, a silver precursor solution is absorbed into the polymer layer of the spandex fiber by using a chemical reduction method. The silver precursor solution is prepared by mixing a silver precursor (Silver heptafluorobutyrate) and butanol, a hydroxy group solvent, in 40 wt%. After that, the silver precursor absorbed in the spandex fiber is reduced to silver nanoparticles using a diluted Hydrazine hydrate (N- ₂ H _{2) solution.}

An ethanol solvent is used for the conductive fiber by the conventional chemical reduction method, but in an embodiment of the present invention, a butanol solvent is used so that silver nanoparticles are more actively formed outside the fiber than before. When a butanol solvent is used to make a silver precursor solution, a silver shell is formed on the outside of the fiber in abundance, and the inside of the fiber can maintain the existing spandex properties. Therefore, electrical stability and mechanical properties against tension are improved compared to the conventional conductive fiber.

In the step of bonding the conductive fibers (S200), a polymer capsule layer is attached to fix a portion of the conductive fiber on which the electrically conductive shell is formed.

In the self-healing polymer according to an embodiment of the present invention, chemical bonding between self-healing polymer materials is possible with simple attachment at room temperature, and when heat is applied, the chemical bonding is further improved and elasticity is increased. This is largely distinguished from the existing self-healing polymers containing capsules.

Specifically, the conductive fiber is encapsulated using a self-healing polymer (SHP). After placing the OTS-treated wafer or Teflon tape on a plate in the order of SHP/conductive fiber/SHP, heat it on a hot plate at 70°C for about 30 minutes. In this process, the sample is pressed with a thin iron plate at the beginning of heating to prevent the sample from floating and to ensure good adhesion between the SHP and the conductive fiber.

Finally, through self-healing polymer encapsulation, the electrical stability of the conductive fiber against the tensile strain is improved. This is to secure the electrical path stably against tensile deformation by the self-healing polymer firmly holding the crack of the Ag shell, which is the electrical path of the conductive fiber.

Self-healing polymer encapsulated conductive fibers are used to form a lattice structure (Weaving), which can be used in wearable electronics.

The self-healing polymer encapsulated conductive fiber according to an embodiment of the present invention can secure electrical stability while showing that the resistance is reduced by 35% compared to the non-encapsulated conductive fiber on the basis of a tensile strain of 100%. In addition, even through 1000 tensile tests, it shows that the value is kept constant at a resistance that is 50% lower than that of the conventional conductive fiber. As the electrical/mechanical stability is higher than that of the conductive fiber using the conventional chemical reduction method, it can sufficiently perform the role of an interconnector, which is a basic component of a wearable device. The first polymeric conductive fiber and the second polymeric conductive fiber are easily attached because self-bonding between the fibers is possible, and since weaving is possible, a circuit between the existing fibrous wearable devices by using fibers as interconnects Problems that were difficult to configure can be solved. Since the fibers are self-bondable, they can be easily attached and weaving (weaving) is possible, which has a great advantage in applying wearable devices. Conventional fibrous devices (ex.supercapacitor, ion-battery, light emitting diode) have been difficult to apply to fibrous devices with the method of configuring circuits by patterning them on the device. Although difficult, it is possible to configure a circuit between fibrous devices by using the technology (using fibers as interconnects) according to an embodiment of the present invention. This was demonstrated by driving the bulb under tensile strain using self-healing polymer encapsulated conductive fibers.

The above description is only an embodiment of the present invention, and those of ordinary skill in the art to which the present invention pertains may be implemented in a modified form without departing from the essential characteristics of the present invention. Therefore, the scope of the present invention is not limited to the above-described embodiments, and should be construed to include various embodiments within the scope equivalent to those described in the claims.

Claims (16)

Conductive fibers including a core formed of a polymer as a core-shell structure and an electrically conductive shell surrounding the core; And
Includes a polymer capsule layer comprising a self-healing polymer component and covering the conductive fiber with at least one layer,
The polymer capsule layer may include a first polymer capsule layer surrounding one side of the conductive fiber; And a second polymer capsule layer enclosing the other side of the conductive fiber and bonded to both ends of the first polymer capsule layer.
The boundary region of the core in contact with the electrically conductive shell further includes a precursor absorbing layer through which a metal precursor solution is absorbed, wherein the electrically conductive shell absorbs the metal precursor solution into the precursor absorbing layer, and the metal absorbed by using a reducing agent. Produced by reducing the precursor to metal particles,
The polymer capsule layer is a polymer encapsulated conductive fiber, characterized in that it improves electrical stability against tensile deformation by controlling cracks of the metal particles, which are electrical passages of the electrically conductive shell. delete delete The method of claim 1,
The core includes fibers having a urethane bond, and the metal precursor solution includes a silver (Ag) precursor solution,
The electrically conductive shell is produced by absorbing the silver (Ag) precursor solution in the precursor absorbing layer and reducing the absorbed silver (Ag) precursor to silver nanoparticles using a reducing agent. The method of claim 4,
The silver (Ag) precursor solution,
Polymer encapsulated conductive fiber, characterized in that produced by mixing a silver (Ag) precursor and a hydroxy group solvent in a predetermined ratio. The method of claim 5,
The hydroxy group solvent is a polymer encapsulated conductive fiber, characterized in that the alkyl group molecular weight is a solvent having a molecular weight of 70 to 140 g/mol. Preparing a conductive fiber; And
Including; bonding the conductive fibers with at least one polymer capsule layer,
The step of preparing the conductive fiber,
Absorbing the metal precursor solution into the polymer layer of the fiber having urethane bonds; And
Reducing the absorbed metal precursor into metal particles using a reducing agent to form an electrically conductive shell; includes,
The bonding of the conductive fibers may include attaching a first polymer capsule layer to one side of the conductive fiber and a second polymer capsule layer to which the first polymer capsule layer and both ends are bonded to the other side of the conductive fiber. Fixing the portion where the electrically conductive shell is formed,
The polymer capsule layer is a method of manufacturing a self-healing polymer encapsulated conductive fiber, characterized in that it improves electrical stability against tensile deformation by controlling cracks of the metal particles, which are electrical passages of the electrically conductive shell. The method of claim 7,
The metal precursor includes silver (Ag),
The metal precursor solution is prepared by mixing a silver (Ag) precursor and a hydroxy group solvent in a predetermined ratio. delete The method of claim 7,
The reducing agent is a polymer encapsulated conductive fiber manufacturing method, characterized in that one or two or more selected from hydrazine-based, hydride-based, borohydride-based, sodium phosphate-based and ascrobic acid. The method of claim 8,
The hydroxy group solvent is a polymer encapsulated conductive fiber manufacturing method, characterized in that the alkyl group molecular weight is a solvent of 70 to 140 g / mol. It is a structure in which the first polymeric conductive fiber and the second polymeric conductive fiber are arranged in a lattice structure,
The first polymeric conductive fiber and the second polymeric conductive fiber,
Conductive fibers including a core formed of a polymer as a core-shell structure and an electrically conductive shell surrounding the core; And
Includes a polymer capsule layer comprising a self-healing polymer component and covering the conductive fiber with at least one layer,
The polymer capsule layer may include a first polymer capsule layer surrounding one side of the conductive fiber; And a second polymer capsule layer enclosing the other side of the conductive fiber and bonded to both ends of the first polymer capsule layer.
The boundary region of the core in contact with the electrically conductive shell further includes a precursor absorbing layer through which a metal precursor solution is absorbed, wherein the electrically conductive shell absorbs the metal precursor solution into the precursor absorbing layer, and the metal absorbed by using a reducing agent. It is produced by reducing the precursor to metal particles,
The polymer encapsulation layer is a polymer encapsulated conductive fiber interconnect, characterized in that to improve electrical stability against tensile deformation by controlling cracks of the metal particles, which are electrical passages of the electrically conductive shell. The method of claim 12,
The polymer encapsulated conductive fiber interconnect, characterized in that the first polymeric conductive fiber and the second polymeric conductive fiber are easily attached because self-bonding between the fibers is possible, and weaving is possible. delete The method of claim 12,
The metal precursor solution is prepared by mixing a silver (Ag) precursor and a hydroxy group solvent at a predetermined ratio, and the hydroxy group solvent is a solvent having an alkyl group molecular weight of 70 to 140 g/mol. Encapsulated conductive fiber interconnect. The method of claim 12,
The core includes fibers having a urethane bond, and the metal precursor solution includes a silver (Ag) precursor solution,
The electrically conductive shell is formed by absorbing the silver (Ag) precursor solution in the precursor absorbing layer and reducing the absorbed silver (Ag) precursor to silver nanoparticles by using a reducing agent. .

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