KR102234000B1 - Antenna module and electronic device using it - Google Patents

Abstract

Various embodiments of the present disclosure relate to an antenna module supporting a high frequency band and an electronic device using the same. To this end, a portable communication device, which is one of the electronic devices, may include a processor positioned on a first printed circuit board, a radio frequency integrated circuit (RFIC), and an antenna module. The antenna module includes a second printed circuit board, first and second antennas located on the second printed circuit board, and a plurality of front-end chips located on the second printed circuit board. can do. Here, the plurality of front-end chips include a first front-end chip electrically connecting the RFIC and the first antenna, and a second front-end chip electrically connecting the RFIC and the second antenna. Can include.

Description

Antenna module and electronic device using the same {ANTENNA MODULE AND ELECTRONIC DEVICE USING IT}

Various embodiments of the present disclosure relate to an antenna module supporting a high frequency band and an electronic device using the same.

The 5G communication system may be implemented in a high frequency band (eg, millimeter wave (mmWave)) in order to achieve a high data rate. In particular, in 5G communication systems, beamforming, massive multi-input multi-output (massive MIMO), and full dimensional multiple input/output (full dimensional) are used to mitigate path loss and increase transmission distance in high frequency bands. MIMO: FD-MIMO), an array antenna, an analog beam-forming, or a large scale antenna technology is being discussed.

In addition, a communication method using various mmWave bands such as 802.11ay and 802.11ad has been defined. Since the characteristics of the mmWave band are different from the frequency band within 6GHz, a front end structure to support the mmWave frequency band is being developed.

As the trend of demanding more functions in electronic devices increases, and the use of the mmWave frequency band becomes a reality, an antenna module that generates a radio frequency (RF) signal of the mmWave frequency band within a limited space of the electronic device and radiates through an array antenna. It is becoming difficult to secure space for placement.

According to various embodiments of the present disclosure, in order to reduce the size of the antenna module, an antenna module having a structure capable of minimizing a mounted unit circuit and a portable communication device using the same may be provided.

The technical problems to be achieved in this document are not limited to the technical problems mentioned above, and other technical problems that are not mentioned can be clearly understood by those of ordinary skill in the technical field to which the present invention belongs from the following description. There will be.

According to various embodiments of the present disclosure, a portable communication device includes a processor positioned on a first printed circuit board, a radio frequency integrated circuit (RFIC), and an antenna module, and the antenna module includes: 2 a printed circuit board, a plurality of antennas disposed on the second printed circuit board, and a plurality of front-end chips disposed on the second printed circuit board, wherein the plurality of front The end chips include a first front-end chip electrically connecting the RFIC and a first antenna among the plurality of antennas, and a second front electrically connecting the RFIC and a second antenna among the plurality of antennas. -May contain end chips.

An arrangement structure according to various embodiments and an electronic device using the arrangement structure may secure a space of the electronic device by implementing and providing an antenna module having a small size.

In addition, the arrangement structure according to various embodiments and the electronic device using the arrangement structure can reduce waste of circuit components while simply implementing antenna modules having various combinations of shapes using an optimized unit antenna module.

The effects obtainable in the present disclosure are not limited to the effects mentioned above, and other effects not mentioned may be clearly understood by those of ordinary skill in the technical field to which the present disclosure belongs from the following description. will be.

1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.
2 is a diagram illustrating a transmission/reception structure using an antenna module according to an embodiment of the present disclosure.
3 is a diagram 400 for showing improved performance of an antenna module according to various embodiments of the present disclosure.
FIG. 4 is a diagram 500 illustrating a structure of an antenna module included in an electronic device (eg, the electronic device 101 of FIG. 1) according to an embodiment of the present disclosure.
5 is a diagram 600 illustrating a structure in which an antenna array is disposed in an electronic device (eg, the electronic device 101 of FIG. 1) according to various embodiments of the present disclosure.
6 is a diagram 600 illustrating a transmission/reception structure using an antenna module in an electronic device (eg, the electronic device 101 of FIG. 1) according to an embodiment of the present disclosure.
7 is a diagram 700 illustrating a transmission/reception structure using an antenna module in an electronic device (eg, the electronic device 101 of FIG. 1) according to an embodiment of the present disclosure.
FIG. 8 is a diagram illustrating a structure of an RFIC 800 (eg, RFIC 780 of FIG. 7) in an electronic device (eg, the electronic device 101 of FIG. 1) according to an embodiment of the present disclosure.
9 is a diagram illustrating a structure of an RFIC 900 (eg, RFIC 780 of FIG. 7) in an electronic device (eg, the electronic device 101 of FIG. 1) according to an embodiment of the present disclosure.
10 is a diagram 1100 illustrating a structure of a unit FEM included in an electronic device (eg, the electronic device 101 of FIG. 1) according to an embodiment of the present disclosure.
11 to 13 are diagrams 1100, 1200, and 1300 illustrating the configuration of an antenna module in an electronic device (eg, the electronic device 101 of FIG. 1) according to various embodiments of the present disclosure.
14 is a diagram illustrating examples in which a plurality of antenna modules are disposed in an electronic device (eg, the electronic device 101 of FIG. 1) according to an embodiment of the present disclosure.
15 is a diagram 1500 illustrating an implementation example of an antenna module in the electronic device 101 according to various embodiments of the present disclosure.
16A to 16L are diagrams illustrating arrangement examples of an antenna array included in an antenna module in the electronic device 101 according to various embodiments.
In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

Hereinafter, various embodiments will be described in detail with reference to the accompanying drawings.

1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments of the present disclosure.

Referring to FIG. 1, in a network environment 100, the electronic device 101 communicates with the electronic device 102 through a first network 198 (for example, a short-range wireless communication network), or a second network 199 It is possible to communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108. According to an embodiment, the electronic device 101 includes a processor 120, a memory 130, an input device 150, an audio output device 155, a display device 160, an audio module 170, and a sensor module ( 176, interface 177, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196, or antenna module 197 ) Can be included. In some embodiments, at least one of these components (for example, the display device 160 or the camera module 180) may be omitted or one or more other components may be added to the electronic device 101. In some embodiments, some of these components may be implemented as a single integrated circuit. For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented while being embedded in the display device 160 (eg, a display).

The processor 120, for example, executes software (eg, a program 140) to configure at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and can perform various data processing or operations. According to an embodiment, as at least a part of data processing or operation, the processor 120 may transfer commands or data received from other components (eg, the sensor module 176 or the communication module 190) to the volatile memory 132 It is loaded into, processes commands or data stored in the volatile memory 132, and the result data may be stored in the nonvolatile memory 134. According to an embodiment, the processor 120 includes a main processor 121 (eg, a central processing unit or an application processor (AP), and a coprocessor 123 that can be operated independently or together with the main processor 121 (eg, a graphics processing unit). It may include a device, an image signal processor, a sensor hub processor, or a communication processor (CP). Additionally or alternatively, the auxiliary processor 123 uses lower power than the main processor 121, or The auxiliary processor 123 may be configured to be specific to a function, and the auxiliary processor 123 may be implemented separately from the main processor 121 or as a part thereof.

The co-processor 123 is, for example, in place of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, executing an application). ) While in the state, together with the main processor 121, at least one of the components of the electronic device 101 (for example, the display device 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the functions or states associated with it. According to an embodiment, the coprocessor 123 (eg, an image signal processor or CP) may be implemented as a part of other functionally related components (eg, the camera module 180 or the communication module 190). .

The memory 130 may store various types of data used by at least one component of the electronic device 101 (eg, the processor 120 or the sensor module 176 ). The data may include, for example, software (eg, the program 140) and input data or output data for commands related thereto. The memory 130 may include a volatile memory 132 or a nonvolatile memory 134.

The program 140 may be stored as software in the memory 130, and may include, for example, an operating system 142, middleware 144, or an application 146.

The input device 150 may receive a command or data to be used for a component of the electronic device 101 (eg, the processor 120) from outside (eg, a user) of the electronic device 101. The input device 150 may include, for example, a microphone, a mouse, a keyboard, or a digital pen (eg, a stylus pen).

The sound output device 155 may output an sound signal to the outside of the electronic device 101. The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used to receive incoming calls. According to an embodiment, the receiver may be implemented separately from or as a part of the speaker.

The display device 160 may visually provide information to the outside of the electronic device 101 (eg, a user). The display device 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to an embodiment, the display device 160 may include a touch circuitry set to sense a touch, or a sensor circuit (eg, a pressure sensor) set to measure the strength of a force generated by the touch. .

The audio module 170 may convert sound into an electrical signal, or conversely, may convert an electrical signal into sound. According to an embodiment, the audio module 170 acquires sound through the input device 150, the sound output device 155, or an external electronic device (for example, an external electronic device directly or wirelessly connected to the electronic device 101). Sound can be output through the electronic device 102) (for example, a speaker or headphones).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101, or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support at least one designated protocol that may be used to connect the electronic device 101 directly or wirelessly to an external electronic device (eg, the electronic device 102). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that a user can perceive through tactile or motor sensations. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture a still image and a video. According to an embodiment, the camera module 180 may include at least one lens, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101. According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 includes a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It is possible to support establishment and communication through the established communication channel. The communication module 190 operates independently of the processor 120 (eg, an AP) and may include at least one CP supporting direct (eg, wired) communication or wireless communication. According to an embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg : A local area network (LAN) communication module, or a power line communication module) may be included. Among these communication modules, a corresponding communication module is a first network 198 (for example, a short-range communication network such as Bluetooth, WiFi direct or IrDA (infrared data association)) or a second network 199 (for example, a cellular network, the Internet, or It may communicate with the external electronic device 104 through a computer network (for example, a telecommunication network such as a LAN or WAN). These various types of communication modules may be integrated into a single component (eg, a single chip), or may be implemented as a plurality of separate components (eg, multiple chips). The wireless communication module 192 uses subscriber information stored in the subscriber identification module 196 (eg, International Mobile Subscriber Identifier (IMSI)) within a communication network such as the first network 198 or the second network 199. The electronic device 101 can be checked and authenticated.

The antenna module 197 may transmit a signal or power to the outside (eg, an external electronic device) or receive from the outside. According to an embodiment, the antenna module may include one antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas. In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is, for example, provided by the communication module 190 from the plurality of antennas. Can be chosen. The signal or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna. According to some embodiments, components other than the radiator (for example, a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module 197.

At least some of the components are connected to each other through a communication method (e.g., a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI))) between peripheral devices and a signal ( E.g. commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199. Each of the external electronic devices 102 and 104 may be a device of the same or different type as the electronic device 101. According to an embodiment, all or part of the operations executed by the electronic device 101 may be executed by at least one of the external electronic devices 102, 104, or 108. For example, when the electronic device 101 needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device 101 In addition or in addition, a request may be made to at least one external electronic device to perform the function or at least part of the service. At least one external electronic device receiving the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101. The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this, for example, cloud computing, distributed computing, or client-server computing technology may be used.

FIG. 2 is a diagram 200 illustrating a transmission/reception structure using an antenna module in an electronic device (eg, the electronic device 101 of FIG. 1) according to an embodiment of the present disclosure.

Referring to FIG. 2, an electronic device according to an embodiment may be an electronic device that transmits or receives a signal in a millimeter wave frequency band (mmWave). The electronic device is, for example, a baseband (baseband). ; BB) may have a structure in which a signal is first up-converted to an intermediate frequency (IF) signal, and the first up-converted IF signal is secondly up-converted to a radio frequency (RF) signal. As described above, the structure for up-converting the BB signal to the RF signal through the IF signal may be, for example, a structure according to the sliding-IF method.

According to an embodiment, an electronic device supporting the mmWave band may have a structure different from that of an electronic device supporting a frequency band of 6 GHz or less than 6 GHz. This is because the transmission/reception structure of the electronic device may be different depending on the supported frequency band. For example, in an electronic device supporting the mmWave band, it is preferable to adopt a sliding-IF method, but in an electronic device supporting a frequency band of 6 GHz or less than 6 GHz, it may be preferable to adopt the zero-IF method. An electronic device employing the zero-IF method may have a structure in which a BB signal is directly up-converted into an RF signal.

An electronic device supporting a high frequency (20 GHz or more) such as the mmWave band may have difficulty adopting a zero-IF structure for the following reasons.

(1) In the case of a high frequency (20 GHz or more) such as the mmWave band, it may be difficult to generate a local oscillator (LO) signal to be supplied to the IQ mixer in the zero-if structure.

(2) When a high frequency signal such as a mmWave band signal propagates through a transmission line on a flame retardant 4 (FR4) PCB, attenuation may increase. In order to reduce the attenuation in the transmission line, a PCB having a relatively small dielectric loss (eg, less than 0.002) compared to the FR4 PCB can be used, but this may not be practical due to problems such as high price.

Accordingly, an electronic device supporting a high frequency band may adopt a sliding-IF method rather than a zero-IF method.

When adopting the sliding-IF method, the electronic device includes, for example, a configuration for generating a BB signal (eg, CP) and a first up-conversion of the BB signal to an IF signal in order to reduce attenuation in a transmission line. Afterwards, a second up-converting component to an RF signal may be independently disposed on a printed circuit board (PCB). That is, a component that generates a BB signal (eg, CP) may be disposed on the first PCB, and a component (eg, a mixer) that up-converts the BB signal to an RF signal may be disposed on the second PCB. In this case, signal attenuation due to the high frequency frequency may be limited only in the transmission line in the second PCB, but the size of the second PCB may increase.

In the case of adopting the sliding-IF method, the electronic device includes, as another example, a configuration for generating a BB signal (eg, CP) and a configuration for up-converting the BB signal to an IF signal (eg, an intermediate frequency integrated circuit). An integrated circuit (IFIC) may be disposed on the first PCB, and a configuration (eg, RFIC) for up-converting the IF signal to an RF signal may be disposed on the second PCB. For example: 9GHz band) signal may be transmitted, and a signal of a relatively high frequency (eg, 20GHz or higher band) such as mmWave band signal may be transmitted from the second PCB, which up-converts the IF signal into an RF signal. It is possible to prevent an excessive increase in the size of the second PCB on which the antenna module including the configuration (eg, RFIC) is to be placed.. In addition, to reduce signal attenuation due to the high frequency frequency, the second PCB has a small dielectric loss ( For example, a PCB (less than 0.002) can be used.

Looking in more detail, the IFIC 230 may be mounted on the PCB 250 with a configuration that up-converts the BB signal to an IF signal, and the antenna module 241 or 243 up-converts the IF signal into an RF signal. The RFIC 261 or 263 may be mounted. The antenna module 241 or 243 may be included in the PCB. An RFIC (261 or 263) may be positioned or disposed on one side of the PCB including the antenna module (241 or 243), and antenna elements are disposed on the opposite side of the side on which the RFIC (261 or 263) is positioned or disposed. It can be located or placed. The RFIC 261 or 263 may transmit or receive mmWave signals through the antenna elements.

According to an embodiment, at least one processor and IFIC 230 may be located on the PCB 250. The at least one processor may be at least one of the AP 210 (eg, the main processor 121 in FIG. 1) or the CP 220 (eg, one of the sub-processors 120 in FIG. 1 ). The AP 210 located on the PCB 250 may perform various data processing or calculations, and through this, at least one other component constituting an electronic device (eg, the electronic device 101 of FIG. 1) ( Example: CP 220) can be controlled. The CP 220 located on the PCB 250 may generate a BB signal for direct communication or wireless communication, and transmit the generated BB signal to the IFIC 230. The IFIC 230 located on the PCB 250 up-converts the BB signal transmitted from the CP 220 to an IF signal and transmits it to the antenna module 243 through the PCB-module interface or the PCB-module interface. The IF signal transmitted from the antenna module 243 may be down-converted to a BB signal and transmitted to the CP 220.

According to an embodiment, a power management integrated circuit (PMIC) 271 or 273 may be located on a PCB included in the antenna module 241 or 243. The PMIC 271 or 273 may generate power for driving the RFIC 261 or 263. When the PMIC 271 or 273 is located on the PCB included in the antenna module 241 or 243, the number of pins according to the PCB-module interface between the PCB 250 and the antenna module 241 or 243 is reduced. Can be In particular, power drop due to a power line connecting between the PCB 250 and the antenna module 241 or 243 may be reduced.

According to an embodiment, for signal exchange and/or other power supply, the PCB 250 uses an antenna module 241 or 243 using a flexible printed circuit board (FPCB), a flexible RF cable (FRC), or an interposer. ) Can be connected. The FRC may be defined as, for example, a cable having flexibility so as not to be broken even if it is folded or bent, and is impedance matched for transmitting an RF signal.

As an example, in mounting the antenna module 241 or 243 in an electronic device, the antenna module 241 or 243 may be horizontally mounted on the PCB 250. In this case, the physical space occupied by the antenna module 241 or 243 in the electronic device may be large. For that reason, by using a CMOS process for the antenna module 241 or 243, a front-end circuit (e.g., a power amplifier (PA), a low noise amplifier (LNA)), a phase shifter ( This is because the RFIC (261 or 263) including the phase shifter)) may be located.

According to various embodiments, in order to reduce the size of the antenna module 241 or 243, the front end circuit may be separated from the RFIC 261 or 263 included in the antenna module 241 or 243. The front end module (FEM) including the front end circuit may be implemented as a single chip using a compound (eg, SiGe or GaAS) process. The FEM implemented using the compound process can increase the maximum output that can be obtained with one PA by about 6dB compared to the case of using the CMOS process. In addition, it is possible to reduce the number of antenna elements necessary to obtain the same performance.

According to an embodiment, a 1x4 mmWave array antenna structure can obtain a gain of 12 dB by generating constructive interference in a desired beam direction using an array antenna and an array transmission chain structure. In this case, it is possible to overcome the limitation of output power (eg 11dBm) due to one mmWave CMOS PA.

According to an embodiment, when a separation structure that implements FEM using a compound (SiGe or GaAS) process is used, the maximum output that can be obtained with one PA can be increased by 6 dB compared to a PA using a CMOS process, and the same performance is achieved. The number of antenna elements included in the array antenna required to obtain can be reduced by half.

3 is a diagram 400 for showing improved performance of an antenna module according to various embodiments of the present disclosure.

Referring to FIG. 3, the equivalent isotropic radiated power of a 1x4 array antenna module using a CMOS process (hereinafter referred to as'existing antenna module') and a 1x2 array antenna module using a compound process (hereinafter referred to as'improved antenna module') Isotropic radiated power (EIRP) and spherical coverage were compared. The existing antenna module, for example, may have a structure in which a front-end circuit is included in an RFIC, and the improved antenna module, for example, may have a structure in which the front-end circuit is separated from the RFIC and included in the FEM. have. As a result, it can be seen that the improved antenna module has improved EIRP and old coverage compared to the existing antenna module in terms of performance. For example, in the case of EIRP, at the point where the cumulative distribution function (CDF) is the maximum, the EIRP of the existing antenna module is 29.4, whereas the EIRP of the improved antenna module is improved to 30.1, and the existing antenna at the point where the CDF is 50%. The EIRP of the module is 24.4, while the EIRP of the improved antenna module is improved to 25.1. Meanwhile, according to various embodiments, when implementing an antenna module in which RFIC and FEM are separated by using different processes, the size of the antenna module may be further reduced.

FIG. 4 is a diagram 500 illustrating a structure of an antenna module included in an electronic device (eg, the electronic device 101 of FIG. 1) according to an embodiment of the present disclosure.

Referring to FIG. 4, (a) shows an example of a structure of an existing antenna module using a CMOS process, and (b) shows an example of a structure of an improved antenna module using a compound process. have. An improved antenna module having a structure in which the front-end circuit shown in (a) is included in the RFIC includes a 1x4 antenna array, and the front-end circuit shown in (b) is separated from the RFIC. Contains a 1x2 antenna array.

The size of the existing antenna module is determined by a horizontal length of 19.1 mm and a vertical length of 4.85 mm, and the size of the improved antenna module may be determined by a horizontal length of 10 mm and a vertical length of 5.6 mm.

4A illustrates an example in which four antenna elements (first to fourth antennas 411, 412, 413, and 414) are located on the PCB 410 included in the antenna module.

Referring to FIG. 4A, the PCB 410 may include two surfaces (eg, a front surface and a rear surface). First to fourth antenna elements 411, 412, 413, 414 may be positioned on one side 410-a (eg, the front side) of the PCB 410, and the other side of the PCB 410 An FPCB connector 415, a PMIC 416, a passive element 417, and an RFIC 418 may be located at (410-b) (the opposite side of one side 610-a) (eg, the back side).

At least one of the first to fourth antenna elements 411, 412, 413, and 414 may be used to transmit and receive a radio signal based on (a) of FIG. 4 according to an embodiment, and the remaining at least One antenna element can be used to receive a radio signal.

FIG. 4B illustrates an example in which two antenna elements (first and second antenna elements 421 and 422) are located on the PCB 420 included in the antenna module.

Referring to FIG. 4B, the PCB 420 according to an embodiment may include two surfaces (eg, a front surface and a rear surface). First and second antenna elements 421 and 422 may be positioned on one side 420-a (for example, the front side) of the PCB 420, and the other side 420-b of the PCB 420 ) (The opposite side of one side 410-a) (eg, the back side) at least one FEM (eg, the first FEM 424 and/or the second FEM 425) may be positioned. In FIG. 4B, an RFIC 423 and a PMIC 426 may be further positioned on the other side 420-b of the PCB 420. The one or more FEMs 424 and 425 may be, for example, a front end chip. The RFIC 423 may be electrically connected to at least one of the first FEM 424 and/or the second FEM 425, for example.

Based on (b) of FIG. 4 according to an embodiment, one of the first and second antenna elements 421 and 422 (for example, the first antenna 421) is used to transmit and receive a radio signal. The other antenna element (eg, the second antenna 422) may be used to receive a radio signal.

According to an embodiment, when one FEM (eg, one of the first FEM 424 or the second FEM 425) is positioned on the other side 420-b of the PCB 420, the one FEM May be electrically connected to the first and second antenna elements 421 and 425. The one FEM may be electrically connected to the first and second antenna elements 421 and 425 through, for example, a via hole.

According to an embodiment, when the first and second FEMs 424 and 425 are positioned on the other side 420-b of the PCB 420, the first FEM 424 is the first antenna element 421 May be electrically connected to, and the second FEM 425 may be electrically connected to the second antenna element 422. The first FEM 424 may be electrically connected to the first antenna element 421 through, for example, a via hole. The second FEM 425 may be electrically connected to the second antenna element 422 through, for example, a via hole.

According to an embodiment, when the PCB has a multilayer structure in FIGS. 4A and 4B, at least two antenna elements may be located on the upper surface of the upper plate in the multilayer PCB, and the multilayer structure At least two front-end chips can be located on the top of the lower plate on the PCB.

According to an embodiment, although not shown in FIG. 4(b), a passive element (for example, the passive element 417 of FIG. 4(a)) may be located on the PCB 420 included in the antenna module, but this It may not be limited. The passive element may be disposed on, for example, a PCB where an IFIC is located (eg, the PCB 250 of FIG. 2 ).

According to an embodiment, in (b) of FIG. 4, the RFIC 423 and/or the PMIC 426 are shown to be located on the other side 420-b of the PCB 420, but the PCB where the IFIC is located (For example, it may be disposed on the PCB 250 of FIG. 2).

5 is a diagram 600 illustrating a structure in which an antenna array is disposed in an electronic device (eg, the electronic device 101 of FIG. 1) according to various embodiments of the present disclosure.

Referring to FIG. 5, (a) shows an example in which an antenna module 510 including a 1x4 array antenna is disposed in an electronic device. For example, four antenna elements 511, 513, 515, and 517 constituting one antenna array may be arranged in a row in an up-down direction 519 (a direction indicated by an arrow) on the right side of the rear side of the electronic device. When the four antenna elements 511, 513, 515, and 517 arranged in the vertical direction constitute one antenna module 510, the electronic device 101 may control the beam direction only in the vertical direction. have.

According to an embodiment, (b) shows an example in which two antenna modules 520-a and 520-b including a 1x2 array antenna are disposed in an electronic device. The first antenna module 520-a, which is one of the two antenna modules 520-a and 520-b, includes first and second antenna elements 521 and 523 constituting a first antenna array. I can. The second antenna module 520-b, which is the other one of the two antenna modules 520-a and 520-b, includes third and fourth antenna elements 525 and 527 constituting a second antenna array. can do.

According to an embodiment, (b) shows an example in which two antenna arrays 520-a and 520-b including a 1x2 array antenna are disposed in an electronic device. The two antenna arrays 520-a and 520-b may be located in one antenna module. Accordingly, the antenna module may include first to fourth antenna elements 521, 523, 525, and 527 constituting the two antenna arrays 520-a and 520-b. The first and second antenna elements 521 and 523 of the first to fourth antenna elements 521, 523, 525, and 527 constitute a first antenna array 520-a, and the first to fourth antenna elements 521, 523, 525, and 527 The third and fourth antenna elements 525 and 527 among the antenna elements 521, 523, 525, and 527 constitute a second antenna array 520-b.

According to an embodiment, the first and second antenna elements 521 and 523 may be arranged in a row in a vertical direction 529-a (direction indicated by an arrow) on the right side of the rear surface of the electronic device, and the third and fourth antenna elements 521 and 523 may be arranged in a row. The antenna elements 525 and 527 may be arranged in a row in the left and right directions 529-b (directions indicated by arrows) on the left side of the rear side of the electronic device. As proposed, when the two antenna arrays are separated and the two separated antenna arrays are arranged in different directions, the electronic device 101 may control the beam direction in the vertical and/or left and right directions. have.

According to the above-described exemplary embodiment, the antenna module in which the size of the FEM is separated from the RFIC to be reduced may increase the degree of freedom of placement. For example, as shown in (b) of FIG. 5, it is possible to arrange antenna modules, so that an area in which a communication service is available may be expanded.

6 is a diagram 600 illustrating a transmission/reception structure using an antenna module in an electronic device (eg, the electronic device 101 of FIG. 1) according to an embodiment of the present disclosure.

Referring to FIG. 6, an electronic device 600 (eg, the electronic device 101 of FIG. 1) according to an embodiment is a PCB 250 on which an AP 210, a CP 220, and an IFIC 230 are disposed. And, a first antenna module 660 and/or a second antenna module 670 may be included. The electronic device 600 may include, for example, one or both of the first antenna module 660 and the second antenna module 670. The first and second antenna modules 660 and 670 have a structure in which RFIC and FEM are separated.

According to an embodiment, the first antenna module 660 may include a first PCB. The first RFIC 661 and the FEM 663 may be separated and positioned on the first PCB included in the first antenna module 660. The first RFIC 661 may be formed by, for example, a CMOS process. The FEM 663 may be formed by, for example, a compound process. In this case, the first RFIC 661 may include a first semiconductor formed of a first material, and the FEM 663 may include a second semiconductor formed of a second material different from the first material. .

According to an embodiment, the first antenna module 660 may include one or a plurality of 1x2 array antennas. The first antenna module 660 may further include a first interface 667 for signal connection with the PCB 250. The first interface 667 may be configured using, for example, one of an FPCB connector, an FRC connector, or an interposer.

According to an embodiment, the second antenna module 670 may include a second PCB. In the second PCB included in the second antenna module 670, the second RFIC 671 and a plurality of FEMs (eg, FEM#1(673) .... FEM#n(675)) are separated and positioned. Can be. The second RFIC 671 may be formed by, for example, a CMOS process. The FEM#1 (673) to the FEM#n 675 may be formed by, for example, a compound process. In this case, the second RFIC 671 may include a first semiconductor formed of a first material, and the FEM#1 673 to FEM#n 675 are a second material different from the first material. It may include a second semiconductor formed of.

According to an embodiment, the second antenna module 670 may include N antenna elements (not shown). The N antenna elements may form a plurality of array antennas. The second antenna module 670 may form two array antennas using, for example, N antenna elements. In this case, one array antenna may be electrically connected to the FEM#1 673, and the other array antenna may be electrically connected to the FEM#n 675. The second antenna module 670 may further include a second interface 679 for signal connection with the PCB 250. The second interface 679 may be configured using one of an FPCB connector, an FRC connector, or an interposer.

According to an embodiment, the FEM 663 located in the first antenna module 660 may have the same structure as the FEM#1 673 to FEM#n 675 located in the second antenna module 670. have. The FEM 663 positioned on the first antenna module 660 and the FEM#1 673 to FEM#n 675 positioned on the second antenna module 670 may be configured as front end chips.

According to an embodiment, a first front-end chip located in the second antenna module 670 may include first and second transmission/reception chains, and a second front-end located in the second antenna module 670 The chip may include third and fourth transmit/receive chains. For example, a first transmission/reception chain may electrically connect the RFIC 671 and a first antenna element, and a second transmission/reception chain may electrically connect the RFIC 671 and a third antenna array, and a third transmission/reception chain The chain may electrically connect the RFIC 671 and the second antenna element, and the fourth transmission/reception chain may electrically connect the RFIC 671 and the fourth antenna element. The first antenna element and the third antenna element may be configured to operate as a first antenna array for, for example, a radio signal to be transmitted by the RFIC 671 or a radio signal to be received by the RFIC 671. I can. The second antenna element and the fourth antenna element may be configured to operate as a second antenna array for, for example, a radio signal to be transmitted by the RFIC 671 or a radio signal to be received by the RFIC 671. I can.

According to an embodiment, the first and third antenna elements set to operate as the first antenna array may be positioned orthogonally to the second and fourth antenna elements set to operate as the second antenna array on the PCB included in the antenna module. have.

According to an embodiment, the CP 220 positioned on the PCB 250 includes a first front-end chip (eg, FEM#1 673) positioned on the second antenna module 670 and a first antenna array. It may be set to form a first beam using a second front-end chip (for example, FEM#n 675) and a second antenna array to form a second beam. The CP 220 may be configured to perform an operation of forming the first beam and an operation of forming the second beam so that the first beam and the second beam have the same frequency. The first beam may be formed to face, for example, a first surface of the electronic device, and the second beam may be formed to face, for example, a second surface different from the first surface. .

According to an embodiment, antenna elements electrically connected to the FEM 673 located on the first antenna module 660 may be disposed to face different surfaces of the electronic device, and are located on the second antenna module 670. Antenna elements electrically connected to the FEM#1 673 to FEM#n 775 may also be disposed to face different surfaces of the electronic device. The FEM 673 located on the first antenna module 660 and the FEM#1 673 to FEM#n 775 located on the second antenna module 670 have opposite surfaces to the surface facing the antenna element. It can be arranged facing.

According to an embodiment, the PCB included in the second antenna module 670 connects a first rigid circuit board portion, a second rigid circuit board portion, and the first rigid circuit board portion and the second rigid circuit board portion. It may include a flexible circuit board. In the first rigid circuit board portion, for example, FEM#1 (773) included in the second antenna module 670 and one or more antenna elements electrically coupled to the FEM#1 (773) are located. can do. In the second rigid circuit board portion, for example, FEM#n 775 included in the second antenna module 670 and one or a plurality of antenna elements electrically coupled to the FEM#n 775 are located. can do.

7 is a diagram 700 illustrating a transmission/reception structure using an antenna module in an electronic device (eg, the electronic device 101 of FIG. 1) according to an embodiment of the present disclosure.

Referring to FIG. 7, the electronic device 700 (eg, the electronic device 101 of FIG. 1) according to an embodiment includes an AP 210, a CP 220, an IFIC 230, an RFIC 780, and a PMIC. The PCB 250 on which the 790 is disposed and a plurality of antenna modules 760 and 770 may be included.

According to an embodiment, the first antenna module 760 includes a plurality of first antenna elements forming an array antenna, a first unit front end module (FEM) 763 and/or a first interface 761 can do. The first interface 761 may include, for example, at least one of an interposer or an FRC.

According to an embodiment, the second antenna module 770 may include a plurality of second antenna elements, FEM#1 771 to FEM#n 773 and/or a second interface 775. The second interface 775 may include, for example, at least one of an interposer or an FRC.

According to an embodiment, the RFIC 780 and/or the PMIC 790 may be located on the PCB 250. The RFIC 780 positioned on the PCB 250 may up-convert the IF signal into an RF signal and transmit it to all or part of a plurality of antenna elements disposed on the plurality of antenna modules 760 and 770. The PMIC 790 located on the PCB 250 may supply power for driving the plurality of antenna modules 760 and 770.

In FIG. 7, in place of the RFIC 661 or 671 and the PMIC 665 or 677 located in the antenna module 660 or 670 in FIG. 6, a single RFIC 780 and/or a PMIC 790 is replaced with a PCB ( 250). Such a proposal can secure a surplus space or reduce the size of the antenna module by reducing the number of circuits and components in the antenna module 760 or 770. As another example, by implementing the FEMs 771, 773, or 763 using compound semiconductors (GaAs, SiGe), power consumed by a single PA can be reduced compared to a PA using a CMOS process. Accordingly, the power current supplied to the antenna module 760 or 770 may be reduced.

According to an embodiment, when the RFIC 780 is disposed on the PCB 250, a high-frequency band radio signal (eg, mmWave band signal) generated by the RFIC 780 has a high loss (eg, dielectric). Loss of about 0.02) may be transmitted to the antenna modules 760 and 770 through the PCB 250. In this case, in order to compensate for the loss due to signal attenuation, as more power is used in the PA or LNA of the transmit and/or receive chain, the power consumption may increase. However, according to the experimental results, when the antenna modules 760 and 770 are disposed within about 2 cm from the RFIC 780, the loss experienced by the high-frequency band radio signal (eg, mmWave band signal) is about 10 dB. Can be. The loss of about 10 dB level may be compensated through, for example, an FEM produced by a compound process having excellent gain and linear characteristics.

According to an embodiment, the antenna modules 760 and 770 receive two or more RF signals (eg, RF1, RF2) and transmit them to a plurality of antenna elements corresponding to each RF signal, thereby transmitting a plurality of array antennas. It can also be implemented in one antenna module.

FIG. 8 is a diagram illustrating a structure of an RFIC 800 (eg, RFIC 780 of FIG. 7) in an electronic device (eg, the electronic device 101 of FIG. 1) according to an embodiment of the present disclosure.

Referring to FIG. 8, the RFIC 800 according to an embodiment may be an RFIC for a mmWave frequency band mounted on a PCB (eg, the PCB 250 of FIG. 7 ). The RFIC 800 is, for example, a local oscillator (LO) 810, a mixer (821, 823), buffers (831, 833), distribution and combining unit 840, phase shift A unit 850 and/or a switch unit 860 may be included.

The LO 810 according to an embodiment may generate a local oscillation frequency for up-converting an IF signal into an RF signal and/or down-converting an RF signal into an IF signal. The LO 810 may have, for example, a structure of a phase lock loop (PLL) circuit including a voltage controlled oscillator (VCO).

According to an embodiment, the LO 810 may generate signals having a plurality of local oscillation frequencies for up-converting a plurality of IF signals having different characteristics into an RF signal. The plurality of IF signals having different characteristics may include, for example, an IF signal IF_H having a horizontal polarization characteristic and an IF signal IF_V having a vertical polarization characteristic. In this case, the LO 810 is an RF signal having a vertical polarization characteristic of the first local oscillation frequency and IF_V for up-converting IF_H into an RF signal (radio frequency horizontal, RFH) having a horizontal polarization characteristic. , RFV) may generate a second local oscillation frequency for up-conversion.

According to an embodiment, the LO 810 may generate signals having a plurality of local oscillation frequencies for down-converting a plurality of RF signals having different characteristics into an IF signal. The plurality of RF signals having different characteristics may include, for example, RFH and RFV. In this case, the LO 810 may generate a first local oscillation frequency for down-converting RFH to IF_H and a second local oscillation frequency for down-converting RFV to IF_V.

According to an embodiment, the first mixer 821 may up-convert and output IF_H to RFH using the first local oscillation frequency supplied from the LO 810 or down-convert and output RFH to IF_H.

According to an embodiment, the second mixer 823 may up-convert and output IF_V to RFV using the second local oscillation frequency supplied from the LO 810 or down-convert and output the RFV to IF_V.

According to an embodiment, the distribution and combination unit 840 distributes an RF signal for transmission through antenna elements in consideration of the number of antenna elements or combines RF signals received from the antenna elements to provide at least one RF signal. It can be output as a signal. The RF signal for transmission may be, for example, an RF signal generated by the first mixer 821 and/or the second mixer 823 and input through the buffers 831 and 833. The RF signals received from the antenna elements may be, for example, RF signals received by the antenna elements and then phase-shifted through the phase shifter 850 to be input.

As an embodiment, in the case of transmitting an RF signal through antenna elements supporting N double polarizations included in an antenna module (for example, the second antenna module 770 of FIG. 7 ), the distribution and combination unit 840 May distribute the RF signal (RFH or RFV) input for transmission to 2N RF signals (RFH 1, RFH 2, ... RFH N and/or RFV 1, RFV 2, ... RFV N). The RFH and the RFV may be transmitted to one antenna element and radiated through the one antenna element. To this end, at least one processor (for example, the AP 210 or CP 220 of FIG. 2) is included in the distribution and combination unit 840 so that the number of distribution and combination components through which the RF signal passes is the same. Switches can be controlled.

According to an embodiment, the distribution and combination unit 840 may include independent distribution and combination circuits 842 and 844 for each type of RF signal. The first distribution and combination circuit 842 included in the distribution and combination unit 840 includes, for example, RFH, which is an RF signal input through the first buffer 831, and N RFHs for N antenna elements. The first buffer by combining N RF signals (RFH 1, RFH 2, ... RFH N) distributed as (RFH 1, RFH 2, ... RFH N) or received through the N antenna elements into one RFH It can be printed as (831). The second distribution and combination circuit 844 included in the distribution and combination unit 840 includes, for example, RFV, which is an RF signal input through the second buffer 833, and N RFVs for N antenna elements. The second buffer by combining N RF signals (RFV 1, RFV 2, ... RFV N) distributed as (RFV 1, RFV 2, ... RFV N) or received through the N antenna elements into one RFV You can print it as (833).

As an embodiment, when an antenna module (for example, to transmit an RF signal through two antennas included in the first antenna module 760 of FIG. 7 ), the distribution and combination unit 840 A transmission path may be formed so that the signal is output as two RF signals (eg, RFH 1 and RFH N).

According to an embodiment, the phase shifter 850 may shift the phase of RF signals to be transmitted to form a beam for transmission, or shift the phase of RF signals received through a beam formed for reception. The switch unit 860 forms a transmission path for transmitting the RF signal transmitted from the phase shift unit 850 to an antenna module (eg, the first and second antenna modules 760 or 770 of FIG. 7 ), or the antenna module (For example, a receiving path for receiving a received RF signal from the first and second antenna modules 760 or 770 of FIG. 7 may be formed.

According to an embodiment, the phase shifter 850 included in the RFIC 800 (for example, the RFIC 780 in FIG. 7) is attached to an antenna module (for example, the first and second antenna modules 860 or 870). It may be disposed in the included FEM (eg, the first to third FEMs 763, 771, 773 of FIG. 7).

According to an embodiment, when the RFIC 800 having the structure shown in FIG. 8 is mounted on a PCB (eg, the PCB 250 in FIG. 7 ), an antenna module (eg, the first and second antennas of FIG. 7) FEMs (eg, the first to third FEMs 763, 771, and 773 of FIG. 7) positioned on the module 760 or 770 may include a PA or an LNA. The FEM (for example, the first to third FEMs 763, 771, and 773 of FIG. 7) positioned in the antenna module (for example, the first and second antenna modules 760 or 770 in FIG. 7) is a phase shifting unit. (For example, the phase shifting unit 850 of FIG. 8) may be included. In this case, components and/or circuits mounted on the antenna module (eg, the first and second antenna modules 760 or 770 of FIG. 7) can be reduced, thereby reducing the size of the antenna module.

According to an embodiment, when the RFIC 800 having the structure shown in FIG. 8 is mounted on an antenna module (eg, the first and second antenna modules 760 or 770 of FIG. 7), a PCB (eg, FIG. The IF signal from the PCB 250 of 7 may be provided to the antenna module. In this case, the IF signal provided by the PCB is up-converted to an RF signal by the RFIC 800 mounted on the antenna module, and then an FEM positioned in the antenna module (e.g., 1st to 3rd FEM (763, 771, 773). The FEM may include PA or LNA. The FEM may include a phase shifting unit (eg, the phase shifting unit 850 of FIG. 8 ). In this case, components and/or circuits mounted on the antenna module (eg, the first and second antenna modules 760 or 770 of FIG. 7) can be reduced, thereby reducing the size of the antenna module.

9 is a diagram illustrating a structure of an RFIC 900 (eg, RFIC 780 of FIG. 7) in an electronic device (eg, the electronic device 101 of FIG. 1) according to an embodiment of the present disclosure.

Referring to FIG. 9, the RFIC 900 according to an embodiment may be an RFIC for a mmWave frequency band mounted on a PCB (eg, the PCB 250 of FIG. 7 ). The RFIC 900 may have a structure in which a transmission/reception chain is independently provided for each polarization characteristic. The RFIC 900 includes, for example, a first transmission/reception circuit and a second mixer 923 including a first mixer 921, a first buffer 931, and a first switch/distribution and coupling unit 941 , A second transmission/reception circuit including a second buffer 933 and a second switch/distribution and coupling unit 943 may be included. The first and second switches/distribution and combination units 941 and 943 included in the first and second transmission/reception circuits are, for example, distribution and combination units (eg, in FIG. 8 ), as shown in FIG. The first or second distribution and combining circuits 842 and 844), a phase shifting unit (eg, a part of the phase shifting unit 850 of FIG. 8) and/or a switch unit (eg, a part of the switching unit 860) It may include.

The operation according to the structure proposed as an embodiment of the RFIC 900 in FIG. 9 is only different from the operation of the RFIC 800 having the structure shown in FIG. 8 and the arrangement of components, and the operation may be the same. have. Therefore, a detailed description of the operation by the RFIC 900 shown in FIG. 9 will be omitted.

10 is a diagram 1100 illustrating a structure of a unit FEM included in an electronic device (eg, the electronic device 101 of FIG. 1) according to an embodiment of the present disclosure.

Referring to FIG. 10, a unit FEM 1001 or 1003 according to an embodiment may be configured such that one RF input signal RF_H is divided into two signals RF1 and RF2 for two antenna elements. .

According to an embodiment, the unit FEM (1001 or 1003) is a buffer (1011 or 1013), a distribution and coupling unit (1021 or 1023), a phase shift unit (1031 or 1033), PA (1041 to 1044), or LNA ( 1051 to 1054).

According to an embodiment, the distribution and combination unit 1021 or 1023 may vary according to the number of maximum antenna elements capable of distributing an RF signal.

In FIG. 10, (a) shows a unit FEM capable of distributing an RF signal to a maximum of 8 antenna elements, and (b) shows a unit FEM capable of distributing an RF signal to a maximum of four antenna elements. I'm doing it. The maximum number of supportable antenna elements may be determined by the configuration of the unit FEM distribution and coupling unit 1021 or 1023.

Referring to FIG. 10A, in order to distribute the RF signal to up to 8 antenna elements, the distribution and combination unit 1021 connects the three distribution and combination elements 1061a, 1061b, and 1061c to the components. It may include a plurality of switches 1081a, 1081b and 1081c for controlling and terminals 1071a, 1071b, 1071c, 1071d, and 1071e for connection with distribution and coupling portions of other unit FEMs.

Referring to (b) of FIG. 10, in order to distribute the RF signal to up to four antenna elements, the distribution and combination unit 1023 controls the connection between the two distribution and combination elements 1063a and 1063b and the components. It may include a plurality of switches 1083a and 1083b and/or terminals 1073a, 1073b, and 1073c for connection with a distribution and coupling portion of another unit FEM.

For example, a unit FEM including k distribution and coupling elements may be connected to other unit FEMs to transmit signals to up to 2k antenna elements, and may include 2k-1 terminals and k switches. For example, each of the k switches may include a single pole double throw (STDP) type switch or three switches of a single pole single throw (SPST) type capable of transmitting an RF signal. As an example, each switch may be implemented with semiconductor logic.

11 to 13 are diagrams 1100, 1200, and 1300 illustrating the configuration of an antenna module in an electronic device (eg, the electronic device 101 of FIG. 1) according to various embodiments of the present disclosure.

These are drawings 1100, 1200, and 1300 showing the configuration of an antenna module supporting a plurality of antenna elements using a plurality of unit FEMs.

The antenna module illustrated in FIGS. 11 to 13 may support a plurality of antenna elements using a plurality of unit FEMs. The antenna module may be configured to distribute the RF_H signal to a plurality of antenna elements. Although not shown, the antenna module for distributing the RF_V signal to a plurality of antenna elements may have different input signals and may be substantially the same as the configurations illustrated in FIGS. 11 to 13. In addition, an RF_V signal may be input to the antenna module illustrated in FIGS. 11 to 13 together with an RF_H signal. In this case, the antenna module may also distribute the RF_V signal to a plurality of antenna elements. That is, one antenna element may receive and radiate an RF_H signal and an RF_V signal.

Referring to FIG. 11, the antenna module according to an embodiment may distribute a received RF_H signal to signals RF1 to RF8 for eight antenna elements. The signals RF1 to RF 8 for the eight antenna elements may be generated through the three distribution and combining elements of the RF_H signal. In this case, since signal attenuation occurs, for example, by about 3 dB each time passing through the distribution and combining element, signals RF1 to RF 8 for all antenna elements may have the same signal strength.

According to an embodiment, the antenna module may include first to fourth unit FEMs, which are four unit FEMs 1110, 1120, 1130, and 1140 to generate signals RF1 to RF8 for eight antenna elements. .

In the first unit FEM 1110, for example, the RF_H signal passes through the first distribution and combination element 1111a, the second distribution and combination element 1111b, and the third distribution and combination element 1111c, and RF1 And it is possible to connect the switches (parts marked with ○) so that the RF2 signal is generated.

In the second unit FEM 1120, for example, the RF_H signal input through the seventh terminal 1123b passes through the fifth distributing and combining element 1121b and the sixth distributing and combining element 1121c. And it is possible to connect the switches (parts marked with ○) so that the RF4 signal is generated. The RF_H signal input through the seventh terminal 1123b is input to the first unit FEM 1110 and then output to the fourth terminal 1113d (for example, a terminal connected to the first distribution and coupling element 1111a). It may be a signal. Accordingly, RF3 and RF4 are the first distributing and combining element 1111a of the first unit FEM 1110, the fifth distributing and combining element 1121b of the second unit FEM 1120, and the sixth distributing and combining element 1121c. ) Can be produced through three distributing and coupling elements.

The third unit FEM 1130 connects switches so that, for example, the RF_H signal input through the thirteenth terminal 1133c passes through the ninth distribution and coupling element 1131c to generate RF5 and RF6 signals. (Parts marked with ○) can be done. The RF_H signal input through the thirteenth terminal 1133c is input to the seventh terminal 1123b of the second unit FEM 1120 and then the tenth terminal 1113d (for example, the first distribution and coupling element 1111a ) And a terminal connected to)).

Accordingly, RF5 and RF6 are the first distributing and combining element 1111a of the first unit FEM 1110, the second distributing and combining element 1121b of the second unit FEM 1120, and the third unit FEM 1130. It may be generated through the three distributing and combining elements of the third distributing and combining element 1131c of.

In an embodiment, the fourth unit FEM 1140 transmits a signal output from the fifth terminal 1113e connected to the second distribution and coupling element 1111b of the first unit FEM 1110 to the third terminal 1143c. In order to receive input and pass through the third distributing and combining element 1141c to generate RF6 and RF7 signals, a switch may be connected (a part marked with ○). Accordingly, RF7 and RF8 are the first distributing and combining elements 1111a of the first unit FEM 1110, the second distributing and combining elements 1111b, and the third distributing and combining elements of the fourth unit FEM 1140 ( 1141c) can be generated through the three distributing and coupling elements.

All of the signals RF1 to RF8 transmitted to the eight antenna elements through the connection as described above may be signals after the RF_H signal passes through the three distributing and combining elements. At this time, the adjustment of the inside of each unit FEM (1110, 1120, 1130, 1140) is possible through a switch connection, and the connection between each unit FEM may be connected by a line on the PCB of the antenna module.

According to an embodiment, the antenna module may include 8 unit FEMs and 8 antenna elements. The eight antenna elements may be disposed, for example, on the first surface of the antenna module, and the eight unit FEMs may be disposed, for example, on the second surface of the antenna module. In addition, the antenna module may form a 1x8 array antenna, a 2x4 array antenna, or an array antenna configuration of another shape according to the arrangement structure of the antenna elements. Here, the 8 unit FEMs divide the input RF_H signal to generate signals (RF1 to RF8) for the 8 antenna elements and supply them to the antenna elements. It can be divided into four unit FEMs that generate signals for antenna elements and supply them to antenna elements. The electronic device (eg, the electronic device 101 of FIG. 1) may include, for example, 8 FEMs for 8 antenna elements. The eight FEMs may be composed of four RF-H FEMs and four RF-V FEMs.

Referring to FIG. 12, according to an embodiment, the RF_H signal received by the antenna module may be distributed as signals RF1 to RF4 for four antenna elements. In this case, the signals RF1 to RF4 for the antenna elements may be generated through the RF_H signal through the two distribution and coupling elements. For example, since a signal attenuation of about 3 dB occurs every time it passes through the distribution and coupling element, the input signal RF_H is in order for all the signals RF1 to RF 4 for the antenna element to have the same signal strength. ) Must be configured to pass the same number of distributing and coupling elements.

According to an embodiment, in order to generate signals RF1 to RF4 for four antenna elements, two unit FEMs 1210 and 1220 may be included. In one embodiment, among the two unit FEMs, the first unit FEM 1210 has an RF_H signal bypassing the second distribution and coupling element 1211b, and the first distribution and coupling element 1211a and the third distribution and coupling element In order to configure the RF1 and RF2 signals to be generated through (1211c), a switch is connected (the part marked with ○), and the second terminal 1213b and the third terminal 1213c can be connected to the PCB line of the antenna module. have.

In one embodiment, the second unit FEM 1220 transmits a signal output from the fourth terminal 1213d connected to the first distribution and coupling element 1111a of the first unit FEM 1210 to the third terminal 1223c. In order to receive input and pass through the third distribution and coupling element 1221c to generate RF3 and RF4 signals, a switch may be connected (a part marked with ○). Accordingly, RF3 and RF4 are two distributing and combining elements of the first distributing and combining element 1211a of the first unit FEM 1210 and the third distributing and combining element 1221c of the second unit FEM 1220. Can be produced by

The signals RF1 to RF4 transmitted to the four antenna elements through the connection as described above may be signals after the RF_H signal passes through the two distribution and coupling elements. At this time, the internal adjustment of each unit FEM (1210, 1220) is possible through a switch connection, and the connection between each unit FEM may be connected by a line on the PCB of the antenna module.

According to an embodiment, four antenna elements may be disposed on the first surface of the antenna module, and four unit FEMs may be disposed on the second surface of the antenna module. The four unit FEMs arranged on the second side of the antenna module are two RF-H unit FEMs for processing an RF-H signal, and two RF-V units for processing an RF-V signal. May include FEMs. The two RF-H unit FEMs, for example, divide the input RF_H signal into signals for four antenna elements (RF1 to RF4), and divide the divided signals (RF1 to RF4) into an antenna module It can be supplied to the four RF_H antenna elements included in the. The two RF-V unit FEMs, for example, divide the input RF_V signal into signals for four antenna elements (RF5 to RF8), and divide the divided signals (RF5 to RF8) into an antenna module It can be supplied to four RF_V antenna elements included in.

According to an embodiment, the antenna module may have a different structure according to the arrangement of the antenna. The antenna module may have an antenna configuration such as, for example, a 1x4 array antenna, a 2x2 array antenna, an array antenna in a region ('a') shape, or an array antenna in a cross ('+') shape.

Referring to FIG. 13, according to an embodiment, the antenna module may distribute an RF_H signal to be transmitted as signals RF1 and RF2 for two antenna elements. In this case, the signals RF1 and RF2 for the antenna elements may be generated through a single distribution and combining element of the RF_H signal. For example, since a signal attenuation of about 3 dB occurs every time it passes through the distribution and coupling element, the input signal RF_H is required for the signals RF1 and RF2 for the antenna elements to have the same signal strength. It should be configured to pass the same number of distributing and coupling elements.

According to an embodiment, in order to generate signals RF1 and RF2 for two antenna elements, one unit FEM 1310 may be included. In the unit FEM 1310, the RF_H signal bypasses the first distribution and combination element 1311a and the second distribution and combination element 1311b, and passes through the third distribution and combination element 1311c, so that the RF1 and RF2 signals are Switches can be connected (parts marked with ○) to configure them to be created. In this case, the first terminal 1313a may be connected to the third terminal 1313c through the PCB line of the antenna module.

The signals RF1 and RF2 transmitted to the two antenna elements through the connection as described above may be signals after the RF_H signal passes through one distribution and combination element. At this time, the internal adjustment of the unit FEM 1310 is possible only with a simple switch connection, and connection between terminals can be performed using a line on the PCB of the antenna module to bypass the internal distribution and coupling elements.

According to an embodiment, the two antennas by dividing the RF_H signal to be transmitted, generating signals RF1 and RF2 for two antenna elements, and dividing one unit FEM and RF_V signal supplied to the antenna elements. One unit FEM that generates signals for the elements and supplies them to the antenna elements may be disposed on the second surface of the antenna module. By arranging two antenna elements on the first surface of the antenna module, a 1x2 array antenna may be configured.

In addition, referring to FIG. 9, an RFIC (eg, RFIC 780 of FIG. 7) divides signals IF_H and IF_V from an IFIC (eg, IFIC 230 of FIG. 2) into a plurality of RF signals. It may include a distributing and coupling portion (eg, first and second switches/distributing and coupling portions 941 and 943). In this case, an array antenna structure having various shapes may be formed according to a structure in which a plurality of antenna modules are disposed in the electronic device (eg, the electronic device 101 of FIG. 1 ).

14 is a diagram illustrating examples in which a plurality of antenna modules are disposed in an electronic device (eg, the electronic device 101 of FIG. 1) according to an embodiment of the present disclosure.

Referring to FIG. 14, a structure of an array antenna according to an embodiment is an antenna module 1410a, 1410b, 1420a, 1420b, 1430a to 1430d, 1440a to 1440d, 1450a to 1450d, 1460a to 1460d, 1470a in a 1x2 array antenna configuration. , 1470b, 1480a to 1480c). Examples of the structure of the array antenna may be variously arranged in addition to those shown.

According to an embodiment, by using an antenna module including a 1x2 array antenna to position the electronic device 101 in various ways, a 2x2 array such as 1x4 array antennas 1410a, 1410b, and (b) as shown in (a). 2x4 or 4x2 array antennas (1430a, 1430b, 1430c, 1430d or 1440a, 1440b, 1440c, 1440d) such as antennas 1420a, 1420b, (c) or (d), 1x8 such as (e) or (f), or 8x1 array antennas 1450a, 1450b, 1450c, 1450d or 1460a, 1460b, 1460c, 1460d), or array antennas 1470a, 1470b or 1480a, 1480b having the same structure as (g) and (h) may be formed.

In various embodiments illustrated in FIG. 14, it is disclosed to use an antenna module having the same shape, but in other various embodiments, an array antenna structure having various shapes may be formed using antenna modules having different shapes.

In addition, although the description was made based on the fact that only one RFIC is located on the PCB (for example, the PCB 250 of FIG. 2) in the above description, a plurality of RFICs are arranged, and each RFIC transmits a signal for at least one antenna module. By generating and transmitting, it may be possible to transmit an array antenna of various shapes and a plurality of frequency bands.

15 is a diagram 1500 illustrating an implementation example of an antenna module in the electronic device 101 according to various embodiments of the present disclosure.

15(a), (b), (c) and (d) show examples of implementing an antenna module (eg, mmW module) using one PCB (1510, 1520, 1530, 1540). . Examples of implementations shown in (a), (b), (c) and (d) of FIG. 15 are one side (e.g., front side) 1510-b, 1520 in one PCB 1510, 1520, 1530, 1540. -b, 1530-b, 1540-b) two frontend chips (1516 & 1517, 1524 & 1525, 1536 & 1537, 1546 & 1547) can be placed on the other side (e.g. back side) (1510 A plurality of antenna elements 1511 to 1514, 1521 to 1522, 1531 to 1534, and 1541 to 1544 may be disposed on -a, 1520-a, 1530-a, and 1540-a. The two front-end chips may be electrically connected to the plurality of antenna elements 1511 to 1514, 1521 to 1522, 1531 to 1534, and 1541 to 1544. The plurality of antenna elements 1511 to 1514, 1521 to 1522, 1531 to 1534, and 1541 to 1544 disposed on each PCB may constitute, for example, one or two antenna arrays.

15E and 15F illustrate examples of implementing an antenna module (eg, mmW module) using a plurality of PCBs 1550a-c and 1660a-c. Examples of implementations shown in (e) and (f) of FIG. 15 are one side (e.g., the front side) of some of the PCBs 1550a, 1550b, and 1560a among a plurality of PCBs 1550a & 1550b & 1550c, 1560a & 1560b & 1560c. Front-end chips (1555, 1556, 1565) can be placed on (1550a-2, 1550b-2, 1560a-2), and some of the plurality of PCBs (1550a & 1550b & 1550c, 1560a & 1560b & 1560c) (1550a, 1550b, 1560a, 1560b) on the other side (e.g., rear) (1550a-1, 1550b-1, 1560a-1, 1560b-1) a plurality of antenna elements (1551 ~ 1554, 1561 ~ 1564) Can be placed. The front-end chips 1555, 1556, and 1565 may be electrically connected to a plurality of antenna elements 1551 to 1554, 1561 to 1564. Some antenna elements 1563 and 1564 among the plurality of antenna elements 1551 to 1554 and 1561 to 1564 may be electrically connected to a front end chip 1565 disposed on another PCB 1560a. The plurality of antenna elements 1551 to 1554 and 1561 to 1564 disposed on each PCB may constitute, for example, one antenna array. Some of the PCBs 1550a, 1550b, 1560a, 1560b on which the antenna elements 1551 to 1554, 1561 to 1564 and/or the front end chips 1555, 1556, and 1565 are disposed may be connected by a flexible PCB (FPCB). .

Referring to (a), (b), (c), (d), (e) and (f) of FIG. 15, an antenna module according to an embodiment includes a plurality of antenna elements and at least one front-end chip. It may include at least one PCB (1510, 1520, 1530, 1540, 1550a-c, 1660a-c) including.

FIG. 15A according to an embodiment shows an example in which an antenna module including a PCB 1510 includes four antenna elements (first to fourth antennas 1511, 1512, 1513, and 1514). I did it.

Referring to FIG. 15A, the PCB 1510 according to an embodiment may include two surfaces (eg, a front surface and a rear surface). In FIG. 15A, first to fourth antenna elements 1511, 1512, 1513, and 1514 may be positioned on one side 1510-a (eg, the front side) of the PCB 1510. The other side 1510-b (the opposite side of one side 1510-a) of the PCB 1510 (e.g., the back side) has the first front end chips 1516 or the second front end chips 16161 17 (eg. : FEM#1 673 and FEM#n 675 of FIG. 6 may be located. In FIG. 15A, an RFIC 1515 and a PMIC 1518 may be further positioned on the other side 1510-b of the PCB 1510.

At least one of the first to fourth antenna elements 1511, 1512, 1513, and 1514 may be used to transmit and receive a radio signal based on (a) of FIG. 15 according to an embodiment, and the remaining at least One antenna element can be used to receive a radio signal.

According to an embodiment, the first front end chip 1516 may be electrically connected to the first antenna element 1511 and the second antenna element 1512 based on FIG. 15A, and the second front end The chip 16161 17 may be electrically connected to the third antenna element 1513 and the fourth antenna element 1514. For example, the first front end chip 1516 may be electrically connected to the first antenna element 1511 and the second antenna element 1512 through a via hole. In addition, the second front end chip 16161 17 may be electrically connected to the third antenna element 1513 and the fourth antenna element 1514 through a via hole.

FIG. 15B according to an embodiment shows an example in which an antenna module including the PCB 1520 includes two antenna elements (first and second antenna elements 1521 and 1522). .

Referring to FIG. 15B, the PCB 1520 according to an embodiment may include two surfaces (eg, a front surface and a rear surface). In FIG. 15B, first and second antenna elements 1521 and 1522 may be positioned on one side 1520-a (eg, the front side) of the PCB 1520. The other side 1520-b (the opposite side of one side 1510-a) of the PCB 1520 (e.g., the back side) has a first front end chip 1524 or a second front end chip 1525 ( Example: FEM#1 673 and FEM#n 675 of FIG. 6 may be located. In FIG. 15B, an RFIC 1523 and a PMIC 1526 may be further positioned on the other side 1520-b of the PCB 1520.

Based on (b) of FIG. 15 according to an embodiment, one of the first and second antenna elements 1521 and 1522 (for example, the first antenna 1521) is used to transmit and receive a radio signal. The other antenna element (eg, the second antenna 1522) may be used to receive a radio signal.

According to an embodiment, in the case of (b) of FIG. 15, the first front-end chip 1524 may be electrically connected to the first antenna element 1521, and the second front-end chip 1525 is a second antenna. It may be electrically connected to element 1522. For example, the first front end chip 1524 may be electrically connected to the first antenna element 1521 through a via hole. Also, the second front end chip 1525 may be electrically connected to the second antenna element 1522 through a via hole.

According to an embodiment, when the PCB has a multilayer structure in FIGS. 15A and 15B, at least two antenna elements may be located on the upper surface of the upper plate in the multilayer PCB, and the multilayer structure At least two front-end chips can be located on the top of the lower plate on the PCB.

FIG. 15C according to an embodiment shows that the antenna module including the PCB 1530 includes four antenna elements (eg, first to fourth antennas 1531, 1532, 1533, 1534). It shows an example.

Referring to FIG. 15C, the PCB 1530 according to an embodiment may include two surfaces (eg, a front surface and a rear surface). In FIG. 15C, first to fourth antenna elements 1531, 1532, 1533, and 1534 may be positioned on one side 1530-a (eg, the front side) of the PCB 1530. The other side (1530-b) of the PCB 1530 (the opposite side of one side (1530-a)) (eg, the back side) has a first front-end chip (1536) or a second front-end chip (16161537) (eg : FEM#1 673 and FEM#n 675 of FIG. 6 may be located. In FIG. 15C, an RFIC 1535 and a PMIC 1538 may be further positioned on the other side 1530-b of the PCB 1530.

The first and fourth antenna elements 1531, 1532, 1533, and 1534, which are arranged in the horizontal (x-axis) direction (horizontal direction) from the bottom of the first to fourth antenna elements 1531, 1532, 1533, and 1534 according to an exemplary embodiment. The second antenna elements 1531 and 1532 may be used to transmit and receive wireless signals, and the third and fourth antenna elements 1533 and 1534 disposed in the vertical axis (y-axis) direction (vertical direction) from the right side are the radio signals. Can be used to receive As another example, the third and fourth antenna elements 1533 and 1534 arranged in the vertical axis (y-axis) direction (vertical direction) from the right side may be used to transmit and receive wireless signals, and the horizontal axis (x-axis) direction from the bottom side The first and second antenna elements 1531 and 1532 disposed in the (horizontal direction) may be used to receive a radio signal.

According to an embodiment, the first front-end chip 1536 may be electrically connected to the first and second antenna elements 1531 and 1532 based on FIG. 15C, and the second front-end chip 16161537 ) May be electrically connected to the third and fourth antenna elements 1533 and 1534. For example, the first front end chip 1536 may be electrically connected to the first and second antenna elements 1531 and 1532 through a via hole. In addition, the second front-end chip 16161537 may be electrically connected to the third and fourth antenna elements 1533 and 1534 through a via hole.

Based on (c) of FIG. 15 according to an embodiment, the RFIC 1535 and the first front end chip 1536 may be disposed in the horizontal axis (x-axis) direction (horizontal direction) from the top, and the second front end The chip 16161537 and the PMIC 1538 may be disposed in the vertical (y-axis) direction (vertical direction) from the right.

According to an embodiment, (d) of FIG. 15 shows another example including four antenna elements (eg, first to fourth antennas 1541, 1542, 1543, 1544) including the PCB 1540. It is shown.

Referring to FIG. 15D, the PCB 1540 according to an embodiment may include two surfaces (eg, a front surface and a rear surface). In FIG. 15D, first to fourth antenna elements 1541, 1542, 1543, and 1544 may be positioned on one side 1540-a (eg, the front side) of the PCB 1540. The other side (1540-b) of the PCB 1540 (the opposite side of one side (1540-a)) (e.g., the back side) has a first front end chip (1546) or a second front end chip (16161547) (example : FEM#1 673 and FEM#n 675 of FIG. 6 may be located. In FIG. 15D, an RFIC 1545 and a PMIC 1548 may be further positioned on the other side 1540-b of the PCB 1540.

According to an embodiment of the first to fourth antenna elements 1541, 1542, 1543, 1544 based on (d) of FIG. 15 according to an embodiment, the first and the first and fourth antenna elements arranged in the horizontal (x-axis) direction (horizontal direction) from the top The second antenna elements 1541 and 1542 may be used to transmit and receive wireless signals, and the third and fourth antenna elements 1543 and 1544 disposed in the vertical axis (y-axis) direction (vertical direction) from the right side are the radio signals. Can be used to receive As another example, the third and fourth antenna elements 1543 and 1544 arranged in the vertical axis (y-axis) direction (vertical direction) from the right side may be used to transmit and receive wireless signals, and the horizontal axis (x-axis) direction from the top The first and second antenna elements 1541 and 1542 disposed in the (horizontal direction) may be used to receive a radio signal.

According to an embodiment, based on (d) of FIG. 15, the first front end chip 1546 may be electrically connected to the first and second antenna elements 1541 and 1542, and the second front end chip 16161547 ) May be electrically connected to the third and fourth antenna elements 1543 and 1544. For example, the first front end chip 1546 may be electrically connected to the first and second antenna elements 1541 and 1542 through a via hole. In addition, the second front-end chip 16161547 may be electrically connected to the third and fourth antenna elements 1543 and 1544 through a via hole.

Based on (d) of FIG. 15 according to an embodiment, the RFIC 1545 and the first front end chip 1546 may be disposed in the horizontal axis (x axis) direction (horizontal direction) from the bottom, and the second front end The chip 16161547 and the PMIC 1548 may be disposed in the vertical (y-axis) direction (vertical direction) from the right.

According to an embodiment, when the PCB has a multilayer structure in FIGS. 15C and 15D, at least two antenna elements may be located on the upper surface of the upper plate in the multilayer PCB, and the multilayer structure At least two front-end chips can be located on the top of the lower plate on the PCB.

FIG. 15E according to an embodiment shows that an antenna module including three PCBs 1550a, 1550b, and 1550c includes four antenna elements (eg, first to fourth antennas 1551, 1552, 1553, 1554)).

Referring to FIG. 15E, the antenna module according to an embodiment may include a plurality of PCBs 1550a, 1550b, and 1550c including a plurality of antennas and one or a plurality of front end chips. Each of the plurality of PCBs 1550a, 1550b, and 1550c may include two surfaces (eg, a front surface and a rear surface). In FIG. 15E, the first PCB 1550a and the second PCB 1550b may have a structure connected by a third PCB 1550c. The third PCB 1550c may be, for example, a flexible PCB (FPCB).

According to an embodiment, first and second antenna elements 1551 and 1552 are provided on the first surface 1550a-1 (eg, the front surface) corresponding to one surface of the first PCB 1550a in FIG. 15E. ) Can be located. The first front-end chip 1555 may be located on the second surface 1550a-2 (the opposite surface of one surface 1550a-1) corresponding to the other surface of the first PCB 1550a (e.g., the rear surface). have. The first and second antenna elements 1551 and 1552 may be connected to the first front end chip 1555. On the second side 1550a-2 of the first PCB 1550a, an RFIC (e.g., RFIC 1515 in FIG. 15A or RFIC 1523 in FIG. 15B) and PMIC (eg: A PMIC 1518 in FIG. 15A or a PMIC 1526 in FIG. 15B may be further positioned. As another example, a connection member (connector) for connecting the main PCB (eg, the PCB 250 of FIG. 6) to the second surface 1550a-2 of the first PCB 1550a may be further positioned.

According to an embodiment, the third and fourth antenna elements 1553 and 1554 are provided on the first surface 1550b-1 (eg, the front surface) corresponding to one surface of the second PCB 1550b in FIG. 15E. ) Can be located. The second front end chip 1556 is located on the second side 1550b-2 (the opposite side of one side 1550b-1) corresponding to the other side of the second PCB 1550b (e.g., the back side). I can. The third and fourth antenna elements 1553 and 1554 may be connected to the second front end chip 1556. On the second side 1550b-2 of the second PCB 1550b, for example, an RFIC (eg, RFIC 1515 in FIG. 15A or RFIC 1523 in FIG. 15B) and A PMIC (eg, a PMIC 1518 in FIG. 15A or a PMIC 1526 in FIG. 15B) may be further located. As another example, a connection member (connector) for connecting the main PCB (eg, the PCB 250 of FIG. 6) to the second surface 1550b-2 of the second PCB 1550b may be further positioned.

15(f) according to an embodiment, an antenna module including three PCBs 1560a, 1560b, and 1560c includes four antenna elements (eg, first to fourth antennas 1561, 1562, 1563, 1564)).

Referring to FIG. 15F, the antenna module according to an embodiment may include a plurality of PCBs 1560a, 1560b, and 1560c including a plurality of antennas and one or a plurality of front end chips. Each of the plurality of PCBs 1560a, 1560b, and 1560c may include two surfaces (eg, a front surface and a rear surface). In (f) of FIG. 15, the first PCB 1560b and the second PCB 1560b may have a structure connected by a third PCB 1560c. The third PCB 1560c may be, for example, a flexible PCB (FPCB).

According to an embodiment, the first and second antenna elements 1561 and 1562 are provided on the first surface 1560a-1 (eg, the front surface) corresponding to one surface of the first PCB 1560a in FIG. 15F. ) Can be located. In (f) of FIG. 15, the third and fourth antenna elements 1563 and 1564 (receiving antennas) are provided on the first side 1560b-1 (eg, the front side) corresponding to one side of the second PCB 1560b. Can be located. The first front-end chip 1565 and the second side are provided on the second side 1560a-2 (the opposite side of one side 1560a-1) corresponding to the other side of the first PCB 1560a (e.g., the back side). A front-end chip 1566 may be located. The first and second antenna elements 1561 and 1562 may be connected to the first front end chip 1565. The third and fourth antenna elements 1563 and 1564 may be connected to the second front end chip 1566.

For example, in FIG. 15(f), the second side 1560a-2 of the first PCB 1560a has an RFIC (eg, RFIC 1515 in FIG. 15(a) or RFIC in FIG. 15(b)). (1523)) and PMIC (eg, PMIC 1518 in FIG. 15A or PMIC 1526 in FIG. 15B) may be further located. As another example, a connection member (connector) for connecting the main PCB (eg, the PCB 250 of FIG. 6) to the second surface 1560a-2 of the first PCB 1560a may be further positioned. As another example, a connection member connecting the RFIC, PMIC, and the main PCB may be located on the second surface 1560b-2 of the second PCB 1560b in FIG. 15F.

16A to 16L are diagrams illustrating arrangement examples of an antenna array included in an antenna module in the electronic device 101 according to various embodiments of the present disclosure.

According to various embodiments, the first antenna array and the second antenna array are one side of one or more PCBs included in the antenna module (e.g., the front side 1510 of the PCB in FIG. b) can be located on the front side of the PCB (1530)). The first antenna array and the second antenna array may include a plurality of antenna elements. In FIG. 16, for convenience of description, it is assumed that the first antenna array includes two antenna elements, and the second antenna array also includes two antenna elements.

In FIG. 16, positions in which one or a plurality of PCBs included in an antenna module are disposed inside an electronic device (for example, the electronic device 101 of FIG. 1 ), and a first antenna array and a first antenna array are provided on the one or more PCBs. Various embodiments of examples in which the second antenna array is located are shown. In the drawing, a form in which one or a plurality of PCBs are disposed inside the electronic device is indicated by a dotted line, and a first antenna array and a second antenna array located on the one or more PCBs are indicated by a solid line on the corresponding PCB. The shape of one or more PCBs indicated by a dotted line may not be completely the same as the actual implemented shape, but may have a shape that is bent by a plurality of PCBs according to the positions of the first antenna array and the second antenna array. In addition, FIG. 16 shows various examples of different positions in which two antenna elements are disposed in the first and second antenna arrays on the PCB.

In describing the arrangement of a plurality of antenna arrays disposed on the electronic device 101 in various embodiments to be described later, a Cartesian coordinate system may be used. For example, the direction in which the X-axis of the Cartesian coordinate system is directed refers to the horizontal direction of the electronic device 101, the direction toward which the Y-axis is directed refers to the vertical direction of the electronic device 101, and the direction that the Z-axis is directed is electronic. It may be the thickness direction of the device 101. For example, the X-axis and Z-axis may be in a horizontal direction, and the Y-axis may be in a vertical direction.

According to an embodiment, the electronic device 101 includes a front surface (a first plate) facing in the Z(+) axis direction (for example, the display device 160 of FIG. 1) and a rear surface facing in the Z(-) axis direction ( A second plate) (eg, a back cover), and a plurality of side surfaces (eg, side members) facing in the X-axis and Y-axis directions surrounding the front and rear surfaces. For example, the plurality of side surfaces are the upper side toward the Y(+) axis direction, the lower side toward the Y(-) axis direction, the right side toward the X(+) axis direction, and the left side toward the X(-) axis direction. Can include.

Referring to FIG. 16A, one side of the PCB 1610a in which the first and second antenna arrays 1611a and 1613a are located inside the electronic device 101 according to an embodiment (for example, the front side or the back side) The electronic device 101 may be arranged to face in the Z (-) axis direction (eg, the rear surface). According to an embodiment, the first and second antenna arrays 1611a and 1613a may be disposed close to each other in one corner area of the electronic device 101.

According to an embodiment, two antenna elements included in the first antenna array 1611a positioned on the PCB 1610a may be disposed in a vertical direction (Y-axis direction), and Two antenna elements included in the 2 antenna array 1613a may be disposed in a horizontal direction (X-axis direction). For example, a direction in which two antenna elements included in the first antenna array 1611a are disposed and a direction in which two antenna elements included in the second antenna array 1613a are disposed may be perpendicular to each other.

Referring to FIG. 16B, one side (eg, front or rear side) of the PCB 1610b in which the first and second antenna arrays 1611b and 1613b are located inside the electronic device 101 according to an exemplary embodiment. The electronic device 101 may be arranged to face in the Z (-) axis direction (eg, the rear surface). According to an embodiment, the first and second antenna arrays 1611b and 1613b may be disposed close to each other in one corner area of the electronic device 101.

According to an embodiment, two antenna elements included in the first antenna array 1611b positioned on the PCB 1610b may be disposed in a horizontal direction (X-axis direction), and a first antenna element positioned on the PCB 1610b. Two antenna elements included in the 2 antenna array 1613b may be disposed in a vertical direction (Y-axis direction). For example, a direction in which two antenna elements included in the first antenna array 1611b are disposed and a direction in which two antenna elements included in the second antenna array 1613b are disposed may be perpendicular to each other.

Referring to FIG. 16C, a first portion of the PCB 1610c in which the first antenna array 1611c is located inside the electronic device 101 according to an exemplary embodiment (eg, in FIG. 15E ). Place the first PCB (1550a), (f) so that one side (eg, front or rear) of the first PCB (1560a) faces in the Z (-) axis direction (eg, rear) of the electronic device 101 And the second part of the PCB 1610c where the second antenna array 1613c is located (eg, the second PCB 1550b in FIG. 15(e) and the second PCB 1560b in (f)) One side (eg, the front or rear side) of the electronic device 101 may be disposed to face in the X (+) axis direction (eg, the right side) of the electronic device 101. According to an embodiment, the first and second antenna arrays 1611c and 1613c may be disposed close to each other in one corner area of the electronic device 101. According to an embodiment, although not clearly distinguished in the drawings, the first part and the second part of the PCB 1610c are a third part (e.g., the third PCB 1550c, (f) in FIG. 15(e)). It may be connected by a third PCB (1560c).

According to an embodiment, two antenna elements included in the first antenna array 1611c positioned at the first portion of the PCB 1610c may be disposed in a vertical direction (Y-axis direction), and the PCB 1610c The two antenna elements included in the second antenna array 1613c positioned at the second portion of) may be disposed in the front and rear horizontal directions (Z-axis direction). For example, a direction in which two antenna elements included in the first antenna array 1611c are disposed and a direction in which two antenna elements included in the second antenna array 1613c are disposed may be perpendicular to each other.

Referring to FIG. 16D, a first part of the PCB 1610d in which the first antenna array 1611d is located inside the electronic device 101 according to an embodiment (eg, in FIG. 15E) Place the first PCB (1550a), (f) so that one side (eg, front or rear) of the first PCB (1560a) faces in the Z (-) axis direction (eg, rear) of the electronic device 101 The second part of the PCB 1610d on which the second antenna array 1613d is located (e.g., the second PCB 1550b in (e) of FIG. 15, and the second PCB 1560b in (f)) One side (eg, the front or rear side) of the electronic device 101 may be disposed to face in the X (+) axis direction (eg, the right side) of the electronic device 101. According to an embodiment, the first and second antenna arrays 1611d and 1613d may be disposed close to each other in one corner area of the electronic device 101. According to an embodiment, although not clearly separated in the drawings, the first part and the second part of the PCB 1610d are the third part (e.g., the second PCB 1550c, (f) in FIG. 15(e)). It may be connected by a third PCB (1560c).

According to an embodiment, two antenna elements included in the first antenna array 1611d positioned at the first portion of the PCB 1610d may be disposed in a horizontal direction (X-axis direction), and the PCB 1610d The two antenna elements included in the second antenna array 1613d positioned at the second portion of) may be disposed in a vertical direction (Y-axis direction). For example, a direction in which two antenna elements included in the first antenna array 1611d are disposed and a direction in which two antenna elements included in the second antenna array 1613d are disposed may be perpendicular to each other.

Referring to FIG. 16E, a first portion of the PCB 1610e in which the first antenna array 1611e is located inside the electronic device 101 according to an embodiment (e.g., in FIG. 15E) Place the first PCB (1550a), (f) so that one side (eg, front or rear) of the first PCB (1560a) faces in the Z (-) axis direction (eg, rear) of the electronic device 101 The second part of the PCB 1610e on which the second antenna array 1613e is located (eg, the second PCB 1550b in FIG. 15E and the second PCB 1560b in FIG. 15E) One side (eg, the front or rear side) of the electronic device 101 may be disposed to face in the Z (+) axis direction (eg, the front side) of the electronic device 101. According to an embodiment, the first and second antenna arrays 1611e and 1613e may be disposed to face opposite directions to one corner area of the electronic device 101. According to an embodiment, although not clearly distinguished in the drawings, the first and second parts of the PCB 1610e are the third parts (e.g., the third PCBs 1550c and (f) in FIG. 15(e). It may be connected by a third PCB (1560c).

According to an embodiment, two antenna elements included in the first antenna array 1611e positioned at the first portion of the PCB 1610e may be disposed in a horizontal direction (X-axis direction), and the PCB 1610e The two antenna elements included in the second antenna array 1613e positioned at the second portion of) may be disposed in a vertical direction (Y-axis direction). For example, a direction in which two antenna elements included in the first antenna array 1611e are disposed and a direction in which two antenna elements included in the second antenna array 1613e are disposed may be oriented perpendicular to each other.

Referring to (f) of FIG. 16, a first part of the PCB 1610f in which the first antenna array 1611f is located inside the electronic device 101 according to an embodiment (for example, in FIG. 15(e)) Place the first PCB (1550a), (f) so that one side (eg, front or rear) of the first PCB (1560a) faces in the Z (-) axis direction (eg, rear) of the electronic device 101 And the second part of the PCB 1610f where the second antenna array 1613f is located (eg, the second PCB 1550b in FIG. 15(e) and the second PCB 1560b in (f)) One side (eg, the front side or the back side) of the electronic device 101 may be disposed to face in the Z (+) axis direction (eg, the front side) of the electronic device 101. According to an embodiment, the first and second antenna arrays 1611f and 1613f may be disposed to face opposite directions to one corner area of the electronic device 101. According to an embodiment, although not clearly distinguished in the drawings, the first part and the second part of the PCB 1610f are the third part (e.g., the third PCB 1550c, (f) in FIG. 15(e)). It may be connected by a third PCB (1560c).

According to an embodiment, two antenna elements included in the first antenna array 1611f positioned at the first portion of the PCB 1610f may be disposed in a vertical direction (Y-axis direction), and the PCB 1610f The two antenna elements included in the second antenna array 1613f positioned at the second portion of) may be disposed in a horizontal direction (X-axis direction). For example, a direction in which two antenna elements included in the first antenna array 1611f are disposed and a direction in which two antenna elements included in the second antenna array 1613f are disposed may be perpendicular to each other.

Referring to FIG. 16G, a first part of the PCB 1610g in which the first antenna array 1611g is located inside the electronic device 101 according to an embodiment (eg, in FIG. 15E ). The first PCB (1550a), (f) with one side (e.g., front or rear) of the first PCB (1560a) facing the Y (+) axis direction (e.g., upper side) of the electronic device 101 The second part of the PCB 1610g on which the second antenna array 1613g is located (e.g., a second PCB 1550b in FIG. 15E and a second PCB 1560b in FIG. 15E) ) May be disposed such that one side (eg, the front side or the back side) of the electronic device 101 faces in the X (+) axis direction (eg, the right side). According to an embodiment, the first and second antenna arrays 1611g and 1613g may be disposed close to each other in one corner area of the electronic device 101. According to an embodiment, although not clearly distinguished in the drawings, the first part and the second part of the PCB 1610g are the third part (e.g., the third PCB 1550c, (f) in FIG. 15(e)). It may be connected by a third PCB (1560c).

According to an embodiment, two antenna elements included in the first antenna array 1611g positioned at the first portion of the PCB 1610g may be disposed in a front and rear horizontal direction (Z-axis direction), and the PCB 1610g The two antenna elements included in the second antenna array 1613g positioned at the second portion of) may be disposed in a vertical direction (Y-axis direction). For example, a direction in which two antenna elements included in the first antenna array 1611g are disposed and a direction in which two antenna elements included in the second antenna array 1613g are disposed may be perpendicular to each other.

Referring to FIG. 16(h), a first part of the PCB 1610h where the first antenna array 1611h is located inside the electronic device 101 according to an embodiment (e.g., in FIG. 15(e)) The first PCB (1550a), (f) with one side (e.g., front or rear) of the first PCB (1560a) facing the Y (+) axis direction (e.g., upper side) of the electronic device 101 The second part of the PCB 1610h on which the second antenna array 1613h is located (e.g., a second PCB 1550b in FIG. 15E and a second PCB 1560b in FIG. 15E) ) May be disposed such that one side (eg, the front side or the back side) of the electronic device 101 faces in the X (+) axis direction (eg, the right side). According to an embodiment, the first and second antenna arrays 1611h and 1613h may be disposed close to each other in one corner area of the electronic device 101. According to an embodiment, although not clearly distinguished in the drawings, the first part and the second part of the PCB 1610h are the third part (e.g., the third PCB 1550c, (f) in FIG. 15(e)). It may be connected by a third PCB (1560c).

According to an embodiment, two antenna elements included in the first antenna array 1611h positioned at the first portion of the PCB 1610h may be disposed in a horizontal direction (X-axis direction), and the PCB 1610h The two antenna elements included in the second antenna array 1613h positioned at the second portion of) may be disposed in the front and rear horizontal directions (Z-axis direction). For example, a direction in which two antenna elements included in the first antenna array 1611h are disposed and a direction in which two antenna elements included in the second antenna array 1613h are disposed may be perpendicular to each other.

Referring to FIG. 16(i), a first part of the PCB 1610i in which the first antenna array 1611i is located inside the electronic device 101 according to an exemplary embodiment (for example, in FIG. 15(e)) Place the first PCB (1550a), (f) so that one side (eg, front or rear) of the first PCB (1560a) faces in the Z (-) axis direction (eg, rear) of the electronic device 101 And the second part of the PCB 1610i where the second antenna array 1613i is located (eg, the second PCB 1550b in FIG. 15(e) and the second PCB 1560b in (f)) One side (eg, the front or rear side) of the electronic device 101 may be disposed to face in the X (+) axis direction (eg, the right side) of the electronic device 101. According to an embodiment, the first and second antenna arrays 1611i and 1613i may be disposed close to each other in one corner area of the electronic device 101. According to an embodiment, although not clearly distinguished in the drawings, the first part and the second part of the PCB 1610i are the third part (e.g., the third PCB 1550c, (f) in FIG. 15(e)). It may be connected by a third PCB (1560c).

According to an embodiment, two antenna elements included in the first antenna array 1611i positioned on the first portion of the PCB 1610i may be disposed in a vertical direction (Y-axis direction), and the PCB 1610i The two antenna elements included in the second antenna array 1613i positioned at the second portion of) may be disposed in a vertical direction (Y-axis direction). For example, a direction in which two antenna elements included in the first antenna array 1611i are disposed and a direction in which two antenna elements included in the second antenna array 1613i are disposed may be parallel to each other.

Referring to FIG. 16(j), a first part of the PCB 1610j in which the first antenna array 1611j is located inside the electronic device 101 according to an exemplary embodiment (for example, in FIG. 15(e)) Place the first PCB (1550a), (f) so that one side (eg, front or rear) of the first PCB (1560a) faces in the Z (-) axis direction (eg, rear) of the electronic device 101 The second part of the PCB 1610j where the second antenna array 1613j is located (e.g., the second PCB 1550b in (e) of FIG. 15, and the second PCB 1560b in (f)) One side (eg, the front or rear side) of the electronic device 101 may be disposed to face in the X (+) axis direction (eg, the right side) of the electronic device 101. According to an embodiment, the first and second antenna arrays 1611j and 1613j may be disposed close to each other in one corner area of the electronic device 101. According to an embodiment, although not clearly distinguished in the drawings, the first part and the second part of the PCB 1610j are the third part (e.g., the third PCB 1550c, (f) in FIG. 15(e)). It may be connected by a third PCB (1560c).

According to an embodiment, two antenna elements included in the first antenna array 1611j positioned on the first portion of the PCB 1610j may be disposed in a horizontal direction (X-axis direction), and the PCB 1610j The two antenna elements included in the second antenna array 1613j positioned at the second portion of) may be disposed in the front and rear horizontal directions (Z-axis direction).

Referring to FIG. 16(k), a first part of the PCB 1610k in which the first antenna array 1611k is located inside the electronic device 101 according to an embodiment (for example, in FIG. 15(e)) The first PCB (1550a), (f) with one side (e.g., front or rear) of the first PCB (1560a) facing the Y (+) axis direction (e.g., upper side) of the electronic device 101 A second portion of the PCB 1610k on which the second antenna array 1613k is located (e.g., a second PCB 1550b in FIG. 15E and a second PCB 1560b in FIG. 15E) ) May be disposed such that one side (eg, the front side or the back side) of the electronic device 101 faces in the X (+) axis direction (eg, the right side). According to an embodiment, the first and second antenna arrays 1611k and 1613k may be disposed close to each other in one corner area of the electronic device 101. According to an embodiment, although not clearly separated in the drawings, the first part and the second part of the PCB 1610k are the third part (e.g., the third PCB 1550c, (f) in FIG. 15(e)). It may be connected by a third PCB (1560c).

According to an embodiment, two antenna elements included in the first antenna array 1611k positioned at the first portion of the PCB 1610k may be disposed in a horizontal direction (X-axis direction), and the PCB 1610k The two antenna elements included in the second antenna array 1613k positioned at the second portion of) may be disposed in a vertical direction (Y-axis direction).

Referring to FIG. 16(l), a first part of the PCB 1610l in which the first antenna array 1611l is located inside the electronic device 101 according to an embodiment (eg, in FIG. 15(e)) The first PCB (1550a), (f) with one side (e.g., front or rear) of the first PCB (1560a) facing the Y (+) axis direction (e.g., upper side) of the electronic device 101 A second portion of the PCB 1610l on which the second antenna array 1613l is located (e.g., a second PCB 1550b in FIG. 15E and a second PCB 1560b in FIG. 15E) ) May be disposed such that one side (eg, the front side or the back side) of the electronic device 101 faces in the X (+) axis direction (eg, the right side). According to an embodiment, the first and second antenna arrays 1611l and 1613l may be disposed close to each other in one corner area of the electronic device 101. According to an embodiment, although not clearly distinguished in the drawings, the first part and the second part of the PCB 1610l are the third part (e.g., the third PCB 1550c, (f) in FIG. 15(e)). It may be connected by a third PCB (1560c).

According to an embodiment, two antenna elements included in the first antenna array 1611l positioned at the first portion of the PCB 1610l may be disposed in a front and rear horizontal direction (Z-axis direction), and the PCB 1610l The two antenna elements included in the second antenna array 1613l positioned at the second portion of) may be disposed in the front and rear horizontal directions (Z-axis direction). For example, a direction in which two antenna elements included in the first antenna array 1611l are disposed and a direction in which two antenna elements included in the second antenna array 1613l are disposed may be oriented in a horizontal direction parallel to each other.

Although various embodiments of FIG. 16 disclose the use of the antenna modules having the same shape, in other various embodiments, antenna array structures having various shapes may be formed using antenna modules having different shapes.

As an embodiment, FIG. 16 shows examples of implementing an antenna array using a 1x2 array antenna and/or a 2x1 array antenna in combination, but as another example, two antenna modules using array antennas of various sizes are proposed. According to various embodiments described above, the antenna array may be implemented by placing it on the electronic device 101.

According to an embodiment, a portable communication device (eg, the electronic device 101 of FIG. 1) is located on a first printed circuit board (eg, the PCB 250 of FIG. 6 or the PCB 250 of FIG. 7). A processor (eg, CP 220 of FIG. 6 or CP 220 of FIG. 7); A radio frequency integrated circuit (e.g., RFICs 661 and 671 of FIG. 6 or RFIC 780 of FIG. 7); and an antenna module (e.g., antenna modules 660 and 670 of FIG. 6 or 7 Antenna modules (760, 770)), and the antenna module includes: a second printed circuit board (eg, the PCB 420 of FIG. 4); a plurality of antennas (eg, the second printed circuit board) : First and second antenna elements (521, 523) of FIG. 5; and a plurality of front-end chips (eg, the first FEM of FIG. 4) positioned on the second printed circuit board. 424 and/or the second FEM 425 or the FEMs 673 and 675 of FIG. 6 or the FEM#1 771 to FEM#n 773 of FIG. 7 ), wherein the plurality of front surfaces -End chips are a first front-end chip that electrically connects the RFIC and a first antenna among the plurality of antennas (for example, the first FEM 424 of FIG. 4 or the FEM 673 of FIG. 6 or FIG. 7 FEM#1 (771) and a second front-end chip electrically connecting the RFIC and a second antenna among the plurality of antennas (for example, the second FEM 425 of FIG. 4 or The FEM 675 or FEM#1 773 of FIG. 7 may be included.

According to an embodiment, the RFIC may be located on the first printed circuit board.

According to an embodiment, the RFIC may be located on the second printed circuit board.

According to an embodiment, a third antenna (eg, the third antenna elements 525 of FIG. 5) among the plurality of antennas is electrically connected to the RFIC by the first front-end chip, and the plurality of A fourth antenna (eg, the fourth antenna elements 527 of FIG. 5) among the antennas of FIG. 5 may be electrically connected to the RFIC by the second front-end chip.

According to an embodiment, the first front-end chip includes a first transmission/reception chain and a second transmission/reception chain, and the first transmission/reception chain electrically connects the RFIC and the first antenna, and the second transmission/reception chain The chain electrically connects the RFIC and the third antenna, the second front-end chip includes a third transmission/reception chain and a fourth transmission/reception chain, and the third transmission/reception chain includes the RFIC and the second antenna. It is electrically connected, and the fourth transmission/reception chain may electrically connect the RFIC and the fourth antenna.

According to an embodiment, the first antenna and the third antenna are configured to operate as a first antenna array for a radio frequency signal to be transmitted by the RFIC or a radio frequency signal to be received by the RFIC, and the second antenna The antenna and the fourth antenna may be configured to operate as a second antenna array for a radio frequency signal to be transmitted by the RFIC or a radio frequency signal to be received by the RFIC.

According to an embodiment, the first antenna and the third antenna set to operate as the first antenna array may be positioned orthogonally to the second antenna and the fourth antenna set to operate as the second antenna array. .

According to an embodiment, the processor forms at least a part of a communication processor, wherein the communication processor forms a first beam using the first front-end chip and the first antenna array, and the first 2 It may be set to form a second beam using the front-end chip and the second antenna array.

According to an embodiment, the communication processor may be configured to perform an operation of forming the first beam and an operation of forming the second beam so that the first beam and the second beam have the same frequency. .

According to an embodiment, the communication processor performs an operation of forming the first beam so that the first beam faces a first surface of the portable communication device, and the second beam is different from the first surface. It may be set to perform an operation of forming the second beam to face the second surface.

According to an embodiment, the first antenna faces a first surface of the portable communication device, the second antenna faces a second surface different from the first surface, and the first front-end chip is the first It may be positioned to face the third side opposite to the side.

According to an embodiment, the second front-end chip may be positioned to face a fourth surface opposite to the second surface.

According to an embodiment, the second printed circuit board includes a first rigid circuit board portion, a second rigid circuit board portion, and a flexible circuit board portion connecting between the first rigid circuit board portion and the second rigid circuit board portion. Includes; The first antenna and the first front-end chip may be located on the first rigid circuit board, and the second antenna and the second front-end chip may be located on the second rigid circuit board.

According to an embodiment, the first antenna and the second antenna may be configured to operate as an antenna array for a radio frequency signal to be transmitted by the RFIC or a radio frequency signal to be received by the RFIC.

According to an embodiment, the RFIC includes a first semiconductor formed of a first material, and the first front-end chip or the second front-end chip is formed of a second material different from the first material. It may include a semiconductor.

In the present invention, it is suggested that antenna modules or antenna modules of various shapes can be configured using a unit FEM, and thereby, it will be possible to quickly and easily respond to changes in the shape of the antenna.

In addition, by minimizing the size of the antenna module proposed in the present invention, it is possible to solve the space-related problems caused in the conventional mounting of the antenna module in an electronic device.

In addition, by combining the antenna modules proposed in the present invention and arranging them in an electronic device and controlling them together, it is possible to configure array antennas of various shapes without changing the shape of the antenna module.

An electronic device according to various embodiments disclosed in this document may be a device of various types. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a notebook computer, a personal digital assistant (PDA), a portable multimedia device, and a portable medical device. The electronic device according to the exemplary embodiment of the present document is not limited to the above-described devices.

Various embodiments of the present document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutes of the corresponding embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one item or a plurality of items, unless clearly indicated otherwise in the related context. In this document, “A or B”, “at least one of A and B”, “at least one of A or B”, “A, B or C”, “at least one of A, B and C” and “A, Each of phrases such as "at least one of B or C" may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish the component from other Order) is not limited. Some (eg, first) component is referred to as “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When mentioned, it means that one component can be connected to another component directly (eg, by wire), wirelessly, or via a third component.

The term "module" used in this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic blocks, parts, or circuits. The module may be an integrally configured component or a minimum unit of a component or a part thereof that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of the present document include at least one stored in a storage medium (eg, internal memory 136 or external memory 138) that can be read by a machine (eg, electronic device 101). It may be implemented as software (eg, program 140) including instructions. For example, the processor (eg, the processor 120) of the device (eg, the electronic device 101) may call and execute at least one command among one or more commands stored from a storage medium. This enables the device to be operated to perform at least one function according to the at least one command invoked. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here,'non-transient' only means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and this term refers to the case where data is semi-permanently stored in the storage medium. It does not distinguish between temporary storage cases.

According to an embodiment, a method according to various embodiments disclosed in this document may be provided by being included in a computer program product. Computer program products can be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a device-readable storage medium (e.g. compact disc read only memory (CD-ROM)), or through an application store (e.g. Play StoreTM) or two user devices (e.g., compact disc read only memory (CD-ROM)). It can be distributed (e.g., downloaded or uploaded) directly between, e.g. smartphones), online. In the case of online distribution, at least a part of the computer program product may be temporarily stored or temporarily generated in a storage medium that can be read by a device such as a server of a manufacturer, a server of an application store, or a memory of a relay server.

According to various embodiments, each component (eg, module or program) of the above-described components may include a singular number or a plurality of entities. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or program) may be integrated into one component. In this case, the integrated component may perform the same or similar to that performed by the corresponding component among the plurality of components prior to integration of one or more functions of each component of the plurality of components. According to various embodiments, operations performed by a module, program, or other component may be sequentially, parallel, repeatedly, or heuristically executed, or one or more of the operations may be executed in a different order. , Omitted, or one or more other operations may be added.

Claims (15)

In the portable communication device,
A processor located on the first printed circuit board;
Radio frequency integrated circuit (RFIC); And
Including an antenna module,
The antenna module,
A second printed circuit board;
A plurality of antennas positioned on the second printed circuit board; And
Including a plurality of front-end chips (front-end chips) located on the second printed circuit board,
Here, the plurality of front-end chips,
A first front-end chip electrically connecting the RFIC and a first antenna among the plurality of antennas, and a second front-end chip electrically connecting the RFIC and a second antenna among the plurality of antennas That is, a portable communication device.
The method of claim 1,
The portable communication device, wherein the RFIC is located on the first printed circuit board.
The method of claim 1,
The portable communication device, wherein the RFIC is located on the second printed circuit board.
The method of claim 1,
A third of the plurality of antennas is electrically connected to the RFIC by the first front-end chip, and a fourth of the plurality of antennas is electrically connected to the RFIC by the second front-end chip. Connected, portable communication device.
The method of claim 4,
The first front-end chip includes a first transmission/reception chain and a second transmission/reception chain, the first transmission/reception chain electrically connecting the RFIC and the first antenna, and the second transmission/reception chain Electrically connect the third antenna,
The second front-end chip includes a third transmission/reception chain and a fourth transmission/reception chain, the third transmission/reception chain electrically connecting the RFIC and the second antenna, and the fourth transmission/reception chain A portable communication device electrically connecting a fourth antenna.
The method of claim 4,
The first antenna and the third antenna are configured to operate as a first antenna array for a radio frequency signal to be transmitted by the RFIC or a radio frequency signal to be received by the RFIC,
The second antenna and the fourth antenna are configured to operate as a second antenna array for a radio frequency signal to be transmitted by the RFIC or a radio frequency signal to be received by the RFIC.
The method of claim 6,
The first antenna and the third antenna configured to operate as the first antenna array are positioned orthogonally to the second antenna and the fourth antenna configured to operate as the second antenna array.
The method of claim 6,
The processor forms at least part of a communication processor,
Here, the communication processor,
A portable communication device configured to form a first beam by using the first front-end chip and the first antenna array, and to form a second beam by using the second front-end chip and the second antenna array .
The method of claim 8,
The portable communication device, wherein the communication processor is configured to perform an operation of forming the first beam and an operation of forming the second beam so that the first beam and the second beam have the same frequency.
The method of claim 8,
The communication processor performs an operation of forming the first beam so that the first beam is directed toward a first surface of the portable communication device, and the second beam is directed toward a second surface different from the first surface. A portable communication device configured to perform an operation of forming the second beam.
The method of claim 1,
The first antenna faces a first surface of the portable communication device,
The second antenna faces a second surface different from the first surface,
The first front-end chip is positioned to face a third surface opposite to the first surface.
The method of claim 11,
The second front-end chip is positioned to face a fourth side opposite to the second side.
The method of claim 1,
The second printed circuit board includes a first rigid circuit board portion, a second rigid circuit board portion, and a flexible circuit board portion connecting between the first rigid circuit board portion and the second rigid circuit board portion;
The first antenna and the first front-end chip are located on the first rigid circuit board, and the second antenna and the second front-end chip are located on the second rigid circuit board. Device.
The method of claim 1,
The first antenna and the second antenna are configured to operate as an antenna array for a radio frequency signal to be transmitted by the RFIC or a radio frequency signal to be received by the RFIC.
The method of claim 1,
The RFIC includes a first semiconductor formed of a first material,
The first front-end chip or the second front-end chip includes a second semiconductor formed of a second material different from the first material.

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