KR102218983B1 - Method for processing a cutting part of glass substrate and apparatus for processing a cutting part of glass substrate - Google Patents

Abstract

The present invention comprises the steps of: (a) fixing a glass substrate to a glass substrate support; (b) heating the heating member to a higher temperature than the Tg temperature of the glass substrate; And (c) contacting the heated heating member from one point of one edge of the vertical surface of the cooled glass substrate to one point of the opposite edge that is symmetrical at a time, and cutting the strip from the entire vertical surface while sequentially moving the contact points It relates to a method for processing a cut portion of a glass substrate including; and an apparatus for processing a cut portion of a glass substrate used in the method.

Description

TECHNICAL FIELD [Method for processing a cutting part of glass substrate and apparatus for processing a cutting part of glass substrate}

The present invention relates to a method for processing a cut portion of a glass substrate and a processing apparatus used therein.

Processing of a glass substrate used in a flat panel display device generally involves a process of removing sharp corners by grinding and/or polishing the edge of the cut glass substrate after cutting the glass substrate into a desired shape.

According to the general processing method as described above, since particles generated during processing of the edges of the glass substrate contaminate the surface of the glass substrate, cleaning and drying processes are required to clean them, thereby increasing the manufacturing cost of the glass substrate. do. In addition, particles and chips caught between the belt and the glass substrate during processing seriously damage the surface of the glass substrate, which often causes a cause of interrupting a series of processing steps.

In order to solve the above problems, a reinforcing process to remove or blunt fine cracks and chipping remaining inside the glass substrate after polishing the glass substrate using hydrofluoric acid or a reinforcing agent is being performed. However, this process has the disadvantage of increasing the number of processing steps for the glass substrate and increasing the production cost.

In Korean Patent Application No. 2012-0002573, as shown in FIG. 1, a method of cutting the edge into a strip shape by moving a heated member in contact with the edge of a cooled glass substrate is disclosed. This method is expected to be useful in this field as it can fundamentally prevent glass dust generated when polishing the edge of a glass substrate.

However, in the above method, as shown in FIG. 2, since only the edge of the cut portion is cut and the vertical surface is not processed, chipping and crack generated during cutting remain on the vertical surface as it is. . Therefore, the problem due to residual chipping is not completely solved, and the glass substrate may be damaged during the process due to cracks. In addition, even if no breakage occurs during the process, it has a disadvantage that the possibility of breakage of the glass substrate increases in the future as micro cracks gradually grow.

Korean Patent Application No. 2012-0002573

The present invention was devised to solve the above problems of the prior art,

It is an object of the present invention to provide a method for processing a cut portion of a glass substrate and an apparatus used therein that can economically provide a glass substrate with improved durability by removing chipping and cracks generated during cutting of a glass substrate from the entire cut surface by a simple method. do.

The present invention

(a) fixing the glass substrate to the glass substrate support;

(b) heating the heating member to a higher temperature than the Tg temperature of the glass substrate; And

(c) contacting the heated heating member from one point of one edge of the vertical surface of the cooled glass substrate cutting portion to one point of the opposite edge that is symmetrical at a time, and cutting the strip from the entire vertical surface while sequentially moving the contact points; It provides a cutting portion processing method of the glass substrate comprising a.

The processing method is

After the step (c), in order to further process the edge of the processed cut,

(d) It may further include the step of cutting the strip by sequentially contacting the heating member heated to a higher temperature than the Tg temperature of the glass substrate to the edge of the processed cut portion of the glass substrate.

In addition, it may further include the step of cutting the strip by sequentially contacting both edges of the glass substrate cutting portion with the heating member heated before step (c).

In addition, the present invention

And a heating member, the heating member support, and a glass substrate support,

In the cutting part processing apparatus of a glass substrate, at least one of the heating member support and the glass substrate support is movable so that the cutting part of the glass substrate fixed to the heating member and the glass substrate support can be sequentially contacted,

The heating member provides an apparatus for processing a cut portion of a glass substrate, wherein the heating member has a shape capable of contacting at a time from one point of one edge of the vertical surface of the cut portion of the glass substrate to one point of the opposite edge that is symmetrical.

According to the cutting part processing method of a glass substrate of the present invention, a glass substrate having improved durability can be economically provided by removing chipping and cracks from the entire cut surface by a simple method without performing cleaning, hydrofluoric acid treatment, reinforcing agent treatment, etc. have.

1 shows a method of cutting a corner of a glass substrate of the prior art,
2 is a view showing a problem of the method of cutting the edge of a glass substrate of the prior art,
3 is a diagram showing a method of processing a cut portion of a glass substrate of the present invention,
Figure 4 shows a photograph of the cut surface of the glass substrate processed by the prior art,
Figure 5 shows a photograph of the cut surface of the glass substrate processed by the present invention.
6 is a photograph taken of an apparatus for processing a cut portion of a glass substrate as an embodiment of the present invention.

Hereinafter, a preferred embodiment of the present invention will be described in detail. Prior to describing the present invention, when it is determined that a detailed description of related known functions and configurations may unnecessarily obscure the subject matter of the present invention, a description thereof will be omitted.

The description and drawings below illustrate specific embodiments so that those skilled in the art may readily implement the described apparatus and methods. Other embodiments may include structurally and logically different variations. Individual components and functions can generally be selected unless explicitly required, and the sequence of processes can vary. Parts and features of some embodiments may be included in or replaced by other embodiments.

The present invention,

(a) fixing the glass substrate to the glass substrate support;

(b) heating the heating member to a higher temperature than the Tg temperature of the glass substrate; And

(c) contacting the heated heating member from one point of one edge of the vertical surface of the cooled glass substrate cutting portion to one point of the opposite edge that is symmetrical at a time, and cutting the strip from the entire vertical surface while sequentially moving the contact points; It relates to a method for processing a cut portion of a glass substrate comprising a.

The method of processing the cut portion of the glass substrate uses the principle that when the heated heating member is brought into contact with the processing portion of the glass substrate, the strip is cut out from the contact portion due to a temperature difference inside the glass.

Since the processing method of the present invention processes the cut portion of the glass substrate by sequentially heating the entire vertical surface (cutting surface) of the cut portion of the glass substrate by a heating member and generating a strip for the entire vertical surface, the processing process is simple, and chipping and cracking It is characterized in that it is well removed to provide a durable glass substrate.

In the above, the Tg temperature of the glass varies from 750°C to 1300°C depending on the type of glass. In the practice of the present invention, the temperature of the heating member is preferably maintained higher than the Tg of the glass by 50° C., preferably 100° C. or more, and even more preferably 200-500° C. for proper cutting of the processed part. .

During the processing, the temperature of the glass substrate is heated above the Tg of the glass, so that even when the temperature of the glass substrate is 0 to 50°C, the strip can be cut out due to the temperature difference inside the glass.

However, it is also possible to cool the glass substrate in order to increase the effect of strip cutting. The "cooling" means that the temperature of the glass substrate is lower than that of the peripheral portion by a forced method.

The cooling may cool the entire glass substrate or selectively cool only the processed portion of the glass substrate, but it is preferable to cool the entire glass substrate for stable control.

The cooling of the glass substrate may be performed by placing the glass substrate in a working environment maintained at a low temperature for a certain period of time, and may also be performed by contacting the glass substrate with a cooling plate maintained at a low temperature. Preferably, the cutting operation is performed while being fixed to a cooling plate maintained at a constant temperature so as to avoid an increase in the temperature of the glass during operation.

In the present invention, the cooling temperature of the glass substrate is preferably cooled to a temperature lower than room temperature (25 °C), more preferably 10 °C or more lower than room temperature so that the glass substrate in contact with the heating member can be cut and separated without dust. . In the practice of the present invention, the temperature of the glass substrate is preferably 10 °C or less, and more preferably in the range of 0 to 10 °C to reduce energy consumed for excessive cooling.

When the temperature of the glass substrate is high, the amount to be cut from the edge increases, making it difficult to precisely cut the edge of the thin glass, and when the temperature of the glass substrate is too low, excessive energy consumption is caused, and certain process control becomes difficult. I can.

The processing method of the present invention,

After the step (c), in order to further process the edge of the processed cut,

(d) a step of cutting the strip by sequentially contacting the edge of the cut portion of the processed glass substrate with a heating member heated to a higher temperature than the Tg temperature of the glass substrate.

Also,

It is also possible to further perform the step of cutting the strip by sequentially bringing the heating member heated before step (c) into contact with both edges of the cut portion of the glass substrate.

That is, as shown in FIG. 3, the cut portion of the glass substrate may be processed in an order of processing the edge of the cut portion and then processing the vertical surface remaining unprocessed in the cut portion.

When processing the edge of the glass substrate cutting portion, a heating member having a shape in which a portion in contact with the edge of the glass substrate is tapered from the outer peripheral surface toward the central axis may be used (see steps 1 to 3 of FIG. 3). The shape tapered from the outer circumferential surface toward the center is not particularly limited, but a shape similar to a cone may be exemplified.

In the case of having a tapered shape as described above, it may be advantageous for contact with the edge of the glass substrate and for cornering.

The upper portion of the tapered portion is not particularly limited, but may have a cylindrical shape.

The present invention also, as shown in Figure 6,

And a heating member, the heating member support, and a glass substrate support,

In the cutting part processing apparatus of a glass substrate, at least one of the heating member support and the glass substrate support is movable so that the cutting part of the glass substrate fixed to the heating member and the glass substrate support can be sequentially contacted,

The heating member relates to an apparatus for processing a cut portion of a glass substrate, wherein the heating member has a shape capable of contacting at a time from one point of one edge of the vertical surface of the cut portion of the glass substrate to a point of the opposite edge that is symmetrical.

The heating member is not particularly limited, but a polygonal column shape such as a cylinder, a triangular column, a square column, a pentagonal column, etc. that is longer than the thickness of the vertical surface of the cut portion may be used, as shown in step 5 of FIG. Likewise, a cylindrical shape can be preferably used.

The above-described information in relation to the method of processing the cut surface of the glass substrate can be applied to all the processing apparatuses of the present invention.

The heating element may be heated by means commonly used in this field. For example, an electric resistance method, a high frequency induction heating method, or the like may be used. The high-frequency induction heating method refers to a method in which a heating member located in the middle of a coil through which a high-frequency current flows is heated by a method in which the heating element is rapidly heated by the eddy current (EDDYCURRENT) generated by the electromagnetic induction action and the heat loss of some HYSTERESIS.

The high-frequency induction heating method can effectively concentrate energy on the heating member penetrating the coil, enabling rapid temperature rise, and is particularly advantageous in preventing a decrease in temperature of the heating member due to contact with the cooling member. Can be used.

The heating member support is not particularly limited as long as it has a structure capable of fixing the heating member through a pressure member, and a form known in the art may be used.

The glass substrate support is a component capable of fixing the glass substrate, and may be provided with various types of fixing means known in the art. In particular, the glass substrate support may further include a cooling means for cooling the glass substrate. The cooling means may be, for example, a cooling plate in which a conduit through which a low-temperature refrigerant flows is formed on the bottom of the support.

In the present invention, the heating member and the glass substrate can be moved relatively. That is, the heating member may move, the glass substrate may move, or the glass substrate and the heating member may move simultaneously. The movement of the heating member and the glass substrate may be performed by operating the heating member support and the glass substrate support, respectively.

The moving speed of the heating member and/or the glass substrate may be adjusted in consideration of productivity, cutting depth, temperature difference, and pressure difference.

In the present invention, one of the heating member support and the glass substrate support may be fixed, and the other may be installed to move while maintaining contact between the heating member and the cutting portion of the glass substrate. Preferably, the heating member support is fixed and the glass substrate support is moved. This is because when the heating member support moves, a temperature change occurs in the heating unit due to convection caused by the movement, making it difficult to cut a uniform strip.

In the present invention, it is preferable that the contact between the heating member and the cutting portion of the glass substrate is made by pressing the heating member to apply a pressure of about 0.1-3.0 Kgf/cm2, more preferably about 0.5-1.5 Kgf/cm2.

Except for the contents described above, the structure, each component, and the like of the apparatus for processing a cut portion of a glass substrate of the present invention may be used without limitation, known in the art.

Hereinafter, the present invention will be described in more detail through examples. However, the following examples are for describing the present invention in more detail, and the scope of the present invention will be determined by the technical spirit of the claims to be described later.

Example One.

According to the process conditions of Table 1 below, a cut portion of a glass substrate having a thickness of 0.7 mm (sample: 5 Examples and 5 Comparative Examples) was processed. In the case of Examples 1 to 5, both the edge of the cut portion and the vertical surface were processed, and in the case of Comparative Examples 1 to 5, only the edge of the cut portion was processed.

In the above Examples and Comparative Examples, the elongation (%) of the glass substrate subjected to the cutting process was measured by the following method:

Two support spans were installed at the bottom of the glass substrate 2 cm apart from the center of the substrate, respectively, and a load was applied to the glass substrate from the upper part of the center to the upper span.

The distance from the point where the upper span touches the glass substrate to the point at which the glass substrate is broken was measured to evaluate the elongation represented by Equation 2 below, and the results are shown in Table 2 below.

[ Equation 2]

Elongation (%) = (6Tδ)/s ²

In the above formula, T is the thickness (unit) of the window substrate, δ is the crosshead displacement (unit), and s is the distance between the support spans (cm).

As can be seen from the test results in Table 2, the front of the cut part, that is, as shown in FIG. 3, the example in which both the corner part and the vertical plane were processed, compared with the case of the comparative example in which only the edge was processed (see FIG. 2). As a result, it showed approximately 2 to 4 times greater annual loss. From these results, it can be confirmed that the elongation of the glass substrate is remarkably improved by the processing method of the present invention.

The above results can be clearly predicted from the photos shown in FIGS. 4 and 5. That is, in the case of FIG. 4 in which only the edge of the cut portion is processed, the chipping and crack are still present on the cut surface (vertical surface), but in the case of FIG. 5 in which both the corner and the vertical surface are processed, the chipping and crack are not seen. Therefore, it can be easily predicted from FIGS. 4 and 5 that the results shown in Table 2 will be obtained in terms of elongation.

Claims (6)

(a) fixing the glass substrate to the glass substrate support;
(b) heating the heating member to a higher temperature than the Tg temperature of the glass substrate; And
(c) contacting the heated heating member from one point of one edge of the vertical surface of the cooled glass substrate cutting portion to one point of the opposite edge that is symmetrical at a time, and cutting the strip from the entire vertical surface while sequentially moving the contact points; Including,
Before or after the step (c), further comprising the step of sequentially contacting both corners of the glass substrate cutting portion with the heated heating member to cut the strip, processing both the vertical surface and the corners of the glass substrate cutting portion. How to process the cut part of the substrate. delete delete The method according to claim 1,
A method for processing a cut portion of a glass substrate, characterized in that the glass substrate has a surface temperature of 0 to 50°C. delete delete

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