KR102218685B1 - High-strength and high-hardness capillary for wire bonding and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a capillary for wire bonding and a method for manufacturing the same, wherein the strength and fracture toughness are improved by optimizing the particle diameter and ratio of each of alumina and zirconia, and a capillary for wire bonding that improves wear resistance through DLC coating, and It relates to a manufacturing method.

Description

High-strength and high-hardness wire bonding capillary and its manufacturing method {HIGH-STRENGTH AND HIGH-HARDNESS CAPILLARY FOR WIRE BONDING AND MANUFACTURING METHOD THEREOF}

The present invention relates to a capillary for wire bonding and a method for manufacturing the same, wherein the strength and fracture toughness are improved by optimizing the particle diameter and ratio of each of alumina and zirconia, and a capillary for wire bonding that improves wear resistance through DLC coating, and It relates to a manufacturing method.

As shown in Fig. 1, which shows the concept of the wire bonding capillary and the wire bonding metal bonded thereto, the wire bonding capillary can transmit an electrical signal through a very fine wire between a silicon chip and a semiconductor device. It is an ultra-precision ceramic tool that connects to each other. Until now, the direction of development of capillary material has been improved abrasion resistance by focusing on hardness as in Korean Patent No. 10-0932636 because defects caused by abrasion were frequent. However, due to the super-integration of the semiconductor process, a capillary having a very fine micro-tip (<40 um) was required, resulting in a breakage defect due to cutting resistance and impact rather than wear. In addition, when bonding copper wires, abrasion and deposition of foreign substances also occur. ,

Accordingly, a capillary manufacturer has released a diamond-like carbon (DLC) coated capillary as disclosed in Korean Patent No. 10-0955420 or Japanese Patent Laid-Open No. 2005-340400, but is currently being turned away from the market. By coating DLC on a capillary material having low strength and fracture toughness, the problem of breaking has not been improved, and the problem of peeling during bonding has also occurred.

Therefore, there is a need to develop a ceramic composite material capillary that can prevent breakage in copper wire bonding and microminiature semiconductor processes.

Korean Patent Registration No. 10-0932636 (registered on Dec. 10, 2009) Korean Patent Registration No. 10-0955420 (registered on April 22, 2010) Japanese Patent Publication No. 2005-340400 (published on December 8, 2005)

An object of the present invention is to provide a capillary for wire bonding that has improved strength and hardness to prevent breakage and has excellent abrasion resistance in order to solve the above problems.

In addition, it is another object of the present invention to provide a method of manufacturing the wire bonding capillary.

The present invention can also aim to achieve these objects and other objects that can be easily derived by a person skilled in the art from the general description of the present specification, in addition to the above-described clear objects.

The capillary for wire bonding of the present invention is 45 to 80% by weight of alumina, preferably 50 to 70% by weight, more preferably 55 to 65% by weight, and 20 to zirconia in order to achieve the object as described above. It is characterized in that it comprises 55% by weight, preferably 30 to 50% by weight, more preferably 35 to 45% by weight.

In addition, the wire bonding capillary may be diamond-like carbon coating (DLC coating).

In addition, the average particle diameter of the alumina may be 0.1 to 0.6 ㎛, preferably 0.2 to 0.5 ㎛, more preferably 0.2 to 0.4 ㎛.

In addition, the average particle diameter of the zirconia may be 0.1 to 0.6 ㎛, preferably 0.2 to 0.5 ㎛, more preferably 0.2 to 0.4 ㎛.

In addition, the zirconia may be partially stabilized.

In addition, in the diamond-like carbon coating, a diamond-like carbon coating layer may be formed on the tip of the wire bonding capillary.

In addition, the diamond-like carbon coating layer may include a stress relief layer on the side of the capillary for wire bonding and a high hardness layer on the opposite side.

And, the hardness of the high-hardness layer may be 2400 to 2800 HV, preferably 2400 to 2700 HV, more preferably 2400 to 2600 HV.

In addition, the hardness of the stress relief layer may be 2100 to 2350 HV, preferably 2150 to 2300 HV, more preferably 2200 to 2300 HV.

In addition, the thickness of the high hardness layer may be 100 to 200 nm, preferably 110 to 180 nm, more preferably 120 to 160 nm.

In addition, the thickness of the stress relief layer may be 50 to 150 nm, preferably 60 to 140 nm, more preferably 70 to 130 nm.

In addition, the diamond-like carbon coating may be a carbon ion coating.

In addition, the carbon ions may be formed by arc discharge under vacuum.

In addition, the diamond-like carbon coating may be coated with carbon ions that have passed through an X-band filter.

In addition, the high hardness layer may be formed by a pulse voltage of the capillary for wire bonding of 50 to 250 V, preferably 70 to 200 V, and more preferably 80 to 150 V.

In addition, the stress relief layer may be formed by a wire bonding capillary pulse voltage of 300 to 800 V, preferably 320 to 600 V, and more preferably 350 to 500 V.

On the other hand, the manufacturing method of the capillary for wire bonding of the present invention

(A) 45 to 80% by weight of alumina, preferably 50 to 70% by weight, more preferably 55 to 65% by weight, and 20 to 55% by weight of zirconia, preferably 30 to 50% by weight, more preferably Mixture preparation step of mixing 35 to 45% by weight;

(B) a milling step of milling the mixture;

(C) a pressure molding step of compressing and molding the milled mixture;

(D) a degreasing step of heating the press-molded molding at 600 to 800° C. for 1 to 3 hours;

(E) a first heat treatment step of heating the degreased molding at 1400 to 1700° C. for 1 to 5 hours;

(F) a hot hydrostatic molding step of hydrostatic molding the first heat-treated molding at 1300 to 1500 °C and 1000 to 1500 kg _f /cm ² ;

(G) a second heat treatment step of heating the hot hydrostatic molded product at 1100 to 1300° C. for 5 to 10 hours;

(H) a cooling step of air-cooling the second heat-treated molding; And

(I) it characterized in that it comprises a coating step of coating a diamond-like carbon on the cooled molding.

The capillary for wire bonding according to the present invention is coated with diamond-like carbon at the tip to improve load resistance and abrasion resistance, and improve adhesion resistance. Accordingly, since the capillary for wire bonding according to the present invention can prevent cutting resistance and breakage due to impact when performing the wire bonding process, the replacement cycle due to the capillary defect is extended. This is a result that the capillary for wire bonding of the present invention increases the strength and fracture toughness by optimizing the particle size and ratio of each of alumina and zirconia, thereby enabling the production of a more compact capillary. The reduced hardness along with the strength improvement is helpful for precision processing, and in order to prevent excessive shortening of the capillary replacement cycle due to abrasion, the present invention improves abrasion resistance by applying a DLC coating to the tip of the capillary.

In particular, among the DLC coating methods, by adopting a carbon ion coating method that is not in the state of carbon atoms or molecules, it has high hardness due to high sp ³ components, and is coated at low speed at room temperature to reduce damage to the thin film. There is a diminishing advantage. In addition, the high incident energy provides excellent adhesion, the surface roughness is low due to the ion coating, and the uniformity and reproducibility of the thin film are improved. Above all, the present invention is advantageous in that the adhesion of the DLC coating film is remarkably improved by first forming a stress relief layer of low hardness and a high hardness layer by adjusting the voltage and coating time, and as a result, the service life of the capillary is extended. There is this.

1 is a conceptual diagram of a wire bonding capillary and a wire bonding metal bonded thereto.
2 is a photograph of a broken wire bonding capillary.
3 is a photograph of a wear phenomenon of the capillary for wire bonding.
4 is a photograph of a state in which the DLC coating of the wire bonding capillary is peeled off.
5 is a diagram illustrating an HF criterion used to determine the degree of adhesion.

Hereinafter, a preferred embodiment of the present invention will be described in detail. In addition, in the following description, a number of specific items such as specific components are described, which are provided only to help a more general understanding of the present invention, and the present invention can be practiced without these specific details. It is self-evident to those who have the knowledge of Further, in describing the present invention, when it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

The capillary for wire bonding of the present invention is alumina 45 to 80% by weight, preferably 50 to 70% by weight, more preferably 55 to 65% by weight, and zirconia 20 to 55% by weight, preferably 30 to 50 It is characterized in that consisting of weight%, more preferably 35 to 45% by weight. The conventional wire bonding capillary was mainly focused on improving hardness to improve wear resistance. However, as electronic products are rapidly miniaturized, the size of the wire bonding capillary has also decreased. As a result, the thickness of the capillary body has become significantly thinner, causing frequent breakages as shown in FIG. 2.

The present invention is characterized by improving the strength and fracture toughness by adjusting the mixing ratio of alumina and zirconia to solve this problem. Due to the improved strength and fracture toughness, there is an effect that the replacement cycle of the capillary is prolonged because it is not broken even by repeatedly applied force during bonding. In addition, the capillary having the above-described blending ratio lowers the hardness, resulting in an increase in machinability, which also has the advantage of making it easier to precisely process the miniaturized capillary.

In order to sufficiently express the above advantages, it is necessary to mix alumina and zirconia at the above-described blending ratio.If the content of zirconia is less than the above range, not only the strength of the capillary decreases, but also the workability of the product decreases, making it difficult to perform fine precision processing. There are drawbacks. Conversely, when the content of zirconia exceeds the above range, the wear resistance of the capillary decreases, thereby shortening the lifespan, and as a result, there is a problem that frequent replacement is required.

In order to improve strength and fracture toughness, in addition to the mixing ratio of alumina and zirconia, the average particle diameter of each particle is also important. In the present invention, the average particle diameter of alumina is preferably 0.1 to 0.6 μm, preferably 0.2 to 0.5 μm, more preferably 0.2 to 0.4 μm. If the average particle diameter is less than the above range, a large amount of pressure is required for capillary molding. It is required, and breakage occurs due to the springback phenomenon that attempts to return to the shape before deformation during pressure molding. On the contrary, when the average particle diameter exceeds the above range, there is a problem in that the molding density is lowered and the physical property value after the final sintering is lowered.

Likewise, the average particle diameter of zirconia is preferably 0.1 to 0.6 µm, preferably 0.2 to 0.5 µm, more preferably 0.2 to 0.4 µm, but if the average particle diameter is less than the above range, dispersion is difficult during wet ball milling and a uniform mixture If the average particle diameter exceeds the above range, on the contrary, there is a disadvantage in that an excessively high temperature is required for complete densification during sintering. In addition, the zirconia may be partially stabilized.

As described above, the blending ratio and average particle diameter optimized to improve strength and fracture toughness inevitably lead to a decrease in hardness, and this decrease in hardness inevitably leads to a shortened replacement cycle due to wear as shown in FIG. 3. . Another major feature of the present invention is that diamond-like carbon coating (DLC coating) is performed to solve the problem of lowering hardness. Diamond-like carbon is one of the solid carbon films having physical and chemical properties similar to diamond having high hardness, and diamond-like carbon coating is a coating method that improves surface hardness by forming a carbon film having a structure similar to diamond. This can increase wear resistance and extend its life.

The diamond-like carbon coating is particularly characterized in that a diamond-like carbon coating layer is formed on the tip of the wire bonding capillary. The tip of the capillary indicates the end of the substrate side where the wire is bonded. Since a force is intermittently applied to this area, abrasion occurs severely, and in order to prevent this, a diamond-like carbon coating is especially applied to this area.

The diamond-like carbon coating includes a method of coating carbon atoms such as PVD (sputtering) method, a physical coating method, a method of coating carbon molecules such as CVD method, a chemical coating method, and a method of coating carbon ions such as FCVA method. . In the present invention, a method of coating carbon ions is particularly preferred, because incorporation of other ions such as hydrogen is effectively suppressed during carbon ions coating, thereby increasing the probability of coating only carbon ions on the capillary. This lowers the proportion of sp ² and increases the proportion of sp ³ , resulting in a diamond-like structure in more areas of the coating as a whole. The carbon ions may be formed by arc discharge under vacuum such as, for example, FCVA (Filter Cathode Vacuum Arc) method. In this case, sp ³ components having the same structure as diamond occupy 70% or more, thereby achieving a high hardness value.

Furthermore, it is more preferable that the carbon ions pass through an X-bend filter to minimize microparticles that degrade coating quality. In addition, in the FCVA method, the coating is performed at low speed at room temperature to reduce damage to the thin film, and high incidence energy provides excellent adhesion. In addition, due to the ion coating, the surface roughness is low, and thin film uniformity and reproducibility are high.

In addition, the diamond-like carbon coating layer formed by the FCVA method has the advantage that the synthesis temperature is low and the surface is smooth, so that it is easy to control physical properties. And, the coefficient of friction is very low, so it has excellent adhesion resistance and chemical stability. In addition, it has excellent wear resistance and durability. Accordingly, when performing the wire bonding process in which the diamond-like carbon coating layer is formed on the surface according to the manufacturing method of the present invention, the exchange period due to capillary defects is extended.

In the present invention, the DLC coating layer may be a single layer, but it is more preferable to first form a stress relief layer having low hardness on the capillary and then form a high hardness layer thereon. When the double layer is formed in this way, the adhesion is increased to prevent peeling of the DLC coating layer. In particular, as the hardness of the DLC coating layer was higher, there was a problem that peeling was easily performed as shown in FIG. 4, but this problem was solved due to the introduction of the double layer, and as a result, high hardness and high wear resistance of the capillary could be realized. It is the main characteristic of

Specifically, the hardness of the high-hardness layer may be 2400 to 2800 HV, preferably 2400 to 2700 HV, more preferably 2400 to 2600 HV, and when it is within the above range, sufficient hardness and wear resistance can be exhibited while preventing peeling. I can.

In addition, the hardness of the stress relief layer may be 2100 to 2350 HV, preferably 2150 to 2300 HV, more preferably 2200 to 2300 HV, and when it is within the above range, the above-described adhesive force is exerted to prevent peeling. It works.

The thickness of the high-hardness layer may be 100 to 200 nm, preferably 110 to 180 nm, more preferably 120 to 160 nm, and when it is within the above range, sufficient hardness and abrasion resistance are prevented while preventing peeling or breaking during the process. Can be demonstrated.

The thickness of the stress relief layer may be 50 to 150 nm, preferably 60 to 140 nm, and more preferably 70 to 130 nm.When it is within the above range, it shows an appropriate residual stress value to prevent peeling due to stress relaxation. Can be sufficiently expressed.

The high hardness layer may also be formed by a capillary pulse voltage for wire bonding of 50 to 250 V, preferably 70 to 200 V, more preferably 80 to 150 V, and when it is within the above range, the aforementioned A range of hardness can be achieved.

Likewise, the stress relief layer may be formed by a capillary pulse voltage for wire bonding of 300 to 800 V, preferably 320 to 600 V, and more preferably 350 to 500 V. When it is within the above range, peeling Is avoided and an appropriate hardness value can be obtained.

On the other hand, the manufacturing method of the capillary for wire bonding of the present invention is, first, alumina 45 to 80% by weight, preferably 50 to 70% by weight, more preferably 55 to 65% by weight, and zirconia 20 to 55% by weight, preferably It starts from the step of preparing a mixture of 30 to 50% by weight, more preferably 35 to 45% by weight. When blended in the above range, the best strength and fracture toughness values can be obtained as described above.

Subsequently, a milling step of milling the mixture is performed. Through this process, the densification of the capillary molded body for wire bonding is maximized, and the milling is performed, for example, by ball milling the mixture.

The milled mixture is subjected to a pressure molding step of compressing and molding.Through this process, an appropriate molding density can be obtained, as a result, the desired mechanical properties are ensured, and the risk of causing cracks in the molded body by preventing the occurrence of springback. Can be prevented.

The pressure-molded molding is then subjected to a degreasing step of heating at 600 to 800° C. for 1 to 3 hours, and through this process, stable primary mechanical properties are implemented to have optimal mechanical properties during hot hydrostatic molding. There is an advantage to be able to.

Then, the degreased molding is subjected to a first heat treatment step of heating at 1400 to 1700°C for 1 to 5 hours, through this process, an appropriate level of mechanical properties is ensured, and carbonization due to oversintering is prevented, It is preferable in terms of production efficiency and manufacturing cost.

The first heat-treated molding is subjected to a hot hydrostatic molding step of hydrostatic molding at 1300 to 1500 °C and 1000 to 1500 kg _f /cm ² , through which the structure of the molded product is made dense and pore defects in the molded product are removed. .

The hot hydrostatic molding is then subjected to a second heat treatment by heating at 1100 to 1300° C. for 5 to 10 hours, and then cooled through air cooling or the like.

The hardness of the wire bonding capillary of the present invention can be increased by coating a diamond-like carbon on the cooled molding. The DLC coating layer may be a single layer, but as described above, it is preferable to provide a stress relief layer inside the high hardness layer. More preferable.

To this end, a capillary pulse voltage for wire bonding of 300 to 800 V, preferably 320 to 600 V, more preferably 350 to 500 V is first applied to the cooled molding, and a thickness of 50 to 150 nm, preferably A stress relief layer of 60 to 140 nm, more preferably 70 to 130 nm, and hardness 2100 to 2350 HV, preferably 2150 to 2300 HV, more preferably 2200 to 2300 HV is formed.

A capillary pulse voltage for wire bonding of 50 to 250 V, preferably 70 to 200 V, more preferably 80 to 150 V is applied on the stress relief layer, and a thickness of 100 to 200 nm, preferably 110 to 180 nm, more preferably 120 to 160 nm, and a hardness of 2400 to 2800 HV, preferably 2400 to 2700 HV, more preferably 2400 to 2600 HV to form a high hardness layer.

By forming the double DLC coating layer in this way, it is possible to sufficiently realize the advantages of the present invention in which peeling or breaking does not occur while exhibiting high hardness.

Hereinafter, an embodiment of the present invention will be described.

Example

Example 1: DLC coated wire bonding capillary

60 g of alumina (SUMITIMO, Japan) having an average particle diameter of 0.4 μm and 40 g of zirconia (TOSOH, Japan) having an average particle diameter of 0.3 μm were mixed and milled. The milled mixture was press-molded in a capillary form for 10 seconds at a pressure of 1 ton using a pressure molding machine (Core Precision, Korea). The molded product was degreased by heating at 700° C. for 2 hours, heated at 1600° C. for 3 hours to perform a first heat treatment, and then hot hydrostatic molding at 1400° C. and 1300 kg _f /cm ² . The second heat treatment was performed by heating it again at 1200° C. for 8 hours, followed by air cooling, and then DLC coating the tip of the capillary with an FCVA DLC coating system (NANOFILM, Singapore) at 100 V for 2000 seconds, and the capillary for wire bonding of the present invention Lee was produced. The bending strength of the capillary was 1020 MPa, the fracture toughness was 5.2 MPa·m ^1/2 , and the hardness was 2450 HV.

Example 2: DLC coating of double layers

The same procedure as in Example 1 was followed, but the FCVA DLC coating system was coated at 400 V for 1500 seconds and then at 100 V for 2000 seconds. In this case, the thickness of the stress relief layer in contact with the capillary was 104 nm, and the thickness of the high hardness layer in contact with the stress relief layer was 139 nm. The hardness of the capillary prepared in this example was 2600 HV, the uniformity of the thin film was less than 4%, the surface roughness was 9.7 nm or less, the friction coefficient was 0.0165, and the adhesion was HF1 level, and the DLC coating was perfect by the etching process. Appeared to be removed. The adhesion was determined according to the HF standard shown in FIG. 5.

Comparative Example 1: Excessive alumina and insufficient zirconia

The same procedure as in Example 1 was performed, but 90 g of alumina and 10 g of zirconia were used. The bending strength of the capillary prepared in this comparative example was 710 MPa, the fracture toughness was 3.6 MPa·m ^1/2 , and the hardness was 1900 HV.

Comparative Example 2: Excessive Alumina and Excessive Zirconia

The same procedure as in Example 1 was performed, but 20 g of alumina and 80 g of zirconia were used. The bending strength of the capillary prepared in this comparative example was 1370 MPa, the fracture toughness was 4.3 MPa·m ^1/2 , and the hardness was 1000 HV.

Comparative Example 3: Excessive alumina particle size

The same procedure as in Example 1 was carried out, but alumina having an average particle diameter of 1.0 μm was used. The bending strength of the capillary prepared in this comparative example was 840 MPa, the fracture toughness was 4.5 MPa·m ^1/2 , and the hardness was 2400 HV.

Comparative Example 4: Insufficient alumina particle size

The same procedure as in Example 1 was performed, but alumina having an average particle diameter of 0.01 μm was used. The bending strength of the capillary prepared in this comparative example was 910 MPa, the fracture toughness was 5.3 MPa·m ^1/2 , and the hardness was 2450 HV.

Comparative Example 5: Excessive zirconia particle size

The same procedure as in Example 1 was performed, but zirconia having an average particle diameter of 1.0 μm was used. The bending strength of the capillary prepared in this comparative example was 950 MPa, the fracture toughness was 4.3 MPa·m ^1/2 , and the hardness was 1650 HV.

Comparative Example 6: Insufficient zirconia particle size

The same procedure as in Example 1 was performed, but zirconia having an average particle diameter of 0.01 μm was used. The bending strength of the capillary prepared in this comparative example was 1260 MPa, the fracture toughness was 6 MPa·m ^1/2 , and the hardness was 1600 HV.

Preparation Example 1: Excessive Thickness of High Hardness Layer

The same procedure as in Example 2 was followed, but the operating conditions of the FCVA DLC coating system were coated at 400 V for 1500 seconds, followed by coating at 100 V for 3000 seconds. The hardness of the capillary prepared in this preparation example was 2350 HV, but the adhesion according to FIG. 5 was reduced to the level of HF4.

Preparation Example 2: Insufficient Thickness of High Hardness Layer

The same procedure as in Example 2 was performed, but the operating conditions of the FCVA DLC coating system were coated at 400 V for 1500 seconds, and then at 100 V for 500 seconds. The hardness of the capillary prepared in this preparation example was as low as 2300 HV, and above all, it was found that the thickness of the high-hardness layer was too thin to function as a high-hardness layer.

Preparation Example 3: Excessive thickness of stress relief layer

The same procedure as in Example 2 was followed, but the operating conditions of the FCVA DLC coating system were coated at 400 V for 2500 seconds, followed by coating at 100 V for 2000 seconds. The hardness of the capillary prepared in this preparation example was 2100 HV, and the adhesion according to FIG. 5 was reduced to the level of HF3.

Preparation Example 4: Insufficient thickness of the stress relief layer

The same procedure as in Example 2 was followed, but the operating conditions of the FCVA DLC coating system were coated at 400 V for 500 seconds, followed by coating at 100 V for 2000 seconds. The hardness of the capillary prepared in this preparation example was as low as 2050 HV, and above all, it was found that the thickness of the stress relief layer was too thin to perform the function as a stress relief layer, so that a uniform layer could not be formed.

Preparation Example 5: Excessive Voltage of High Hardness Layer

The same procedure as in Example 2 was performed, but the operating conditions of the FCVA DLC coating system were coated at 400 V for 1500 seconds, and then at 350 V for 2000 seconds. The hardness of the capillary prepared in this preparation example was as low as 2250 HV, and the adhesion according to FIG. 5 was reduced to the level of HF3 out of the optimum deposition conditions for the high hardness layer.

Preparation Example 6: Insufficient Voltage of High Hardness Layer

The same procedure as in Example 2 was followed, but the operating conditions of the FCVA DLC coating system were coated at 400 V for 1500 seconds, followed by coating at 10 V for 2000 seconds. The hardness of the capillary prepared in this preparation example was as low as 2200 HV, and the adhesion according to FIG. 5 was reduced to the level of HF3 out of the optimum deposition conditions for the high-hardness layer.

Preparation Example 7: Excessive voltage of stress relief layer

The same procedure as in Example 2 was followed, but the operating conditions of the FCVA DLC coating system were coated at 950 V for 1500 seconds, and then at 100 V for 2000 seconds. The hardness of the capillary prepared in this preparation example was as low as 2000 HV, and the adhesive force according to FIG. 5 was reduced to the level of HF3 out of the optimum deposition condition of the stress relief layer.

Preparation Example 8: Insufficient Voltage of Stress Relief Layer

The same procedure as in Example 2 was followed, but the operating conditions of the FCVA DLC coating system were coated at 150 V for 1500 seconds, followed by coating at 100 V for 2000 seconds. The hardness of the capillary prepared in this preparation example was as low as 1950 HV, and the adhesion force according to FIG. 5 was reduced to the level of HF4, out of the optimum deposition conditions of the stress relief layer.

Claims (7)

As a capillary for wire bonding,
55 to 65% by weight of alumina and
Zirconia 35 to 45% by weight
Including,
The wire bonding capillary has a diamond-like sp ³ structure carbon coating (Diamond-like Carbon Coating, DLC coating) layer formed at its tip,
The diamond-like sp ³ structure of the carbon coating layer is formed by coating carbon ions,
The diamond-like sp ³ structure of the carbon coating layer includes a stress relief layer on the side of the capillary for wire bonding and a high hardness layer on the opposite side,
The thickness of the stress relief layer is 50 to 150 nm,
The thickness of the high hardness layer is 100 to 200 nm,
The hardness of the high hardness layer is 2400 to 2800 HV,
The hardness of the stress relief layer is 2100 to 2350 HV, wire bonding capillary. delete The method according to claim 1,
The average particle diameter of the alumina is 0.1 to 0.6 ㎛, characterized in that, wire bonding capillary. The method according to claim 1,
The average particle diameter of the zirconia is 0.1 to 0.6 ㎛, characterized in that, wire bonding capillary. The method according to claim 1,
The zirconia is characterized in that the partially stabilized, wire bonding capillary. delete (A) a mixture preparation step of mixing 55 to 65% by weight of alumina and 35 to 45% by weight of zirconia;
(B) a milling step of milling the mixture;
(C) a pressure molding step of compressing and molding the milled mixture;
(D) a degreasing step of heating the press-molded molding at 600 to 800° C. for 1 to 3 hours;
(E) a first heat treatment step of heating the degreased molding at 1400 to 1700° C. for 1 to 5 hours;
(F) a hot hydrostatic molding step of hydrostatic molding the first heat-treated molding at 1300 to 1500 °C and 1000 to 1500 kg _f /cm ² ;
(G) a second heat treatment step of heating the hot hydrostatic molded product at 1100 to 1300° C. for 5 to 10 hours;
(H) a cooling step of air-cooling the second heat-treated molding; And
(I) a coating step of coating diamond-like carbon on the cooled molding,
In the coating step, a carbon coating layer having a diamond-like sp ³ structure is formed by coating carbon ions,
In the coating step, a stress relief layer having a thickness of 50 to 150 nm is coated on the cooled molding, and a high hardness layer having a thickness of 100 to 200 nm is coated thereon,
The hardness of the high hardness layer is 2400 to 2800 HV,
The hardness of the stress relief layer is 2100 to 2350 HV, characterized in that the manufacturing method of the capillary for wire bonding.

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