KR102196682B1 - Molten aluminum plating heat dissipation plate PCB substrate for LED luminaire and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a fusion aluminum plating heat dissipation plate PCB substrate for an LED lighting fixture and a manufacturing method thereof, in which the PCB substrate on which an LED device is mounted is manufactured with a fusion aluminum plated heat dissipation plate, so that corrosion resistance and workability are excellent, and heat dissipation capability is improved. The present invention includes: a carbon steel material; first and second alloy layers respectively formed on an upper surface and a rear surface of the carbon steel material; molten Al-Si-based first and second plating layers respectively formed on the surfaces of the first and second alloy layers; and a copper foil formed on the upper surface of the molten Al-Si-based first plating layer.

Description

TECHNICAL FIELD The molten aluminum plating heat dissipation plate PCB substrate for LED luminaire and manufacturing method thereof

The present invention relates to a hot-dip aluminum plated heat dissipation plate PCB substrate for LED luminaires, and a manufacturing method thereof, and in particular, to a hot-dip aluminum plated heat dissipation plate PCB substrate for LED luminaires having excellent corrosion resistance and workability, and a method of manufacturing the same.

In general, luminaires are installed on the ceiling of offices, homes, or various stores to illuminate the interior.The above luminaires are installed in close contact with and embedded in the ceiling compared to the existing direct ceiling lamps or hanging ceilings. It has an advantage in that it can be used, and since it does not infringe on the indoor space, it produces a feature that does not interfere with the field of view by the luminaire.

Accordingly, the luminaire as described above is installed for lighting a local part in the home or highlight lighting in a store, or lighting the entire indoor space through repetitive and continuous installation.

These luminaires are generally composed of a buried body that is fixed in a state of being inserted into the ceiling and a cover body that is coupled to the buried body to be exposed to the room, and a light source is combined inside the buried body. LED devices with excellent service life are being applied.

In addition, a translucent transparent plate is placed on the inner upper part of the cover body as described above, so that the illumination light of the LED element is reflected innumerable scattered by the transparent plate so that lighting in an even state is achieved, as well as the translucent transparent plate. This prevents the light source of the LED element from being directly exposed to the field of view.

In particular, fixing means such as spring bullets are coupled to both sides of the embeded body as described above, so that the embedding body is pushed into the installation hole of the ceiling finishing material from the indoor side, and the embedded body is attached to the ceiling finishing material through the fixing means. By being elastically fixed, it is possible to easily fix and install the embedded body, and is made to be easily separated by forcibly pulling the embedded body by an artificial force.

However, the LED luminaire as described above has a problem that heat is generated at a high temperature when it is turned on due to the heat generation characteristic of the LED element as the light source of the LED element is applied, and the lifespan of the LED element decreases due to the heat generated by the LED element. Since the lighting efficiency is deteriorated, most of the LED ceiling embedded lamps have various types of heat dissipation means for the embedded body, so that the heat generated from the LED element can be rapidly discharged.

For example, the embeded body as described above is manufactured using a material such as aluminum having excellent heat dissipation efficiency, and is heated by increasing the heat dissipation area by forming a radiating fin that protrudes in a repetitive arrangement with respect to the side and upper outer surfaces of the embedded body. It allows the heat of the embedded body to be quickly released.

Due to such heat dissipation measures, the LED luminaire as described above can maintain the designed or predicted lighting efficiency and service life.

However, since the heat dissipation means of the embedded body itself is merely increasing the heat dissipation area, the actual heat dissipation effect reaches a very weak level, and when the heat from the LED element is higher than the heat dissipation effect, it is still high temperature. It is a reality that there is a problem in that the lighting efficiency and service life of the LED element are deteriorated due to the heat generation of the LED.

In addition, due to the heat dissipation fins formed to increase the heat dissipation area, the overall size of the ceiling embedding becomes excessively large, and thus, there are cases in which the dimensions such as embedding that require a certain standard cannot be met.

Therefore, if the distance from the ceiling finishing material to the bottom of the ceiling slab is insufficient, there will be cases where it will not be possible to apply the heightened embedding, so simply increasing the size of the heat dissipation fin is not a practical and fundamental heat dissipation measure. In other words, more practical and efficient heat dissipation measures are urgently required in LED luminaires.

The present invention was conceived to solve the above problems, and the PCB board on which the LED element is mounted is made of a hot-dip aluminum plated heat-dissipating plate to provide excellent corrosion resistance and workability, and to improve heat dissipation capability. An object thereof is to provide a plate PCB substrate and a method of manufacturing the same.

In addition, another object of the present invention is to provide a hot-dip aluminum-plated heat-dissipating plate PCB substrate for LED luminaires and a method of manufacturing the same to reduce the overall weight by eliminating a separate heat-radiating means by using a hot-dip aluminum plated heat-radiating plate as a PCB substrate. have.

The hot-dip aluminum-plated heat dissipation plate PCB substrate for an LED lamp according to the present invention for achieving the above object includes a carbon steel material, first and second alloy layers formed on the upper and rear surfaces of the carbon steel, respectively, and the first and second 2 It is characterized in that it comprises a molten Al-Si-based first and second plating layers respectively formed on the surface of the alloy layer, and a copper foil formed on an upper surface of the molten Al-Si-based first plating layer.

In addition, the method of manufacturing a hot-dip aluminum-plated heat dissipation plate PCB substrate for LED lighting according to the present invention includes the steps of preparing a carbon steel material, forming first and second alloy layers on the top and rear surfaces of the carbon steel material, respectively, and the Forming molten Al-Si-based first and second plating layers on the surfaces of the first and second alloy layers, respectively, polishing the first and second plating layers to a predetermined thickness from the surface, and the polished agent It is characterized in that it is formed, including the step of forming a copper foil on at least one surface of the first and second plating layers.

The hot-dip aluminum plated heat dissipation plate PCB substrate for LED lighting according to an embodiment of the present invention and its manufacturing method have the following effects.

First, the PCB board on which the LED element is mounted is made of a hot-dip aluminum plated heat dissipation plate, so that corrosion resistance and workability are excellent, and heat dissipation capability can be improved.

Second, by using a hot-dip aluminum plated heat dissipation plate as a PCB substrate, a separate heat dissipation means can be eliminated, thereby reducing the overall weight of the LED luminaire.

Third, the LED luminaire uses a hot-dip aluminum plated heat dissipation plate with excellent high corrosion resistance, high heat resistance and thermal conductivity as a PCB substrate, thereby reducing the area of metal heat sinks such as aluminum and reducing the heat dissipation area of the luminaire, while obtaining excellent paralleling effects. I can.

Fourth, the formation of an aluminum oxide passivation film on the surface of the plating layer provides excellent corrosion resistance and prevents damage to the exterior of the plating layer and discoloration due to heat even when exposed to a high temperature of 400°C for a long time.

Fifth, since the heat dissipation plate has excellent metal, high corrosion resistance, high heat resistance, and thermal conductivity, if LED chips made of ceramics are mounted by soldering, the thermal shock of the thermal cycle is small and solder cracks can be prevented in advance. have.

Sixth, since the printed circuit board has a thickness of 0.4 to 0.5 mm, it is possible to improve the life and performance of the LED by providing an LED printed circuit board that can quickly transfer the heat of the LED to the outside.

1 is a cross-sectional view showing a hot-dip aluminum plating heat dissipation plate PCB substrate for an LED lamp according to the invention
2 to 6 are process cross-sectional views showing a method of manufacturing a hot-dip aluminum plating heat dissipation plate PCB substrate for an LED lamp according to the invention
7 and 8 are views comparing the corrosion resistance of the PCB substrate and the corrosion resistance of salt spray according to the conventional and the present invention
9 is a photograph showing a hot-dip aluminum plated heat dissipation plate PCB substrate for LED lighting according to the present invention

Hereinafter, the present invention will be described in more detail with reference to the drawings. It should be noted that the same elements in the drawings are indicated by the same reference numerals wherever possible. In addition, detailed descriptions of known functions and configurations that may unnecessarily obscure the subject matter of the present invention will be omitted.

The terms used in the present invention are only used to describe specific embodiments and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present application, terms such as "comprise" or "have" are intended to designate the presence of features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, but one or more other features. It is to be understood that the presence or addition of elements or numbers, steps, actions, components, parts, or combinations thereof, does not preclude in advance.

1 is a cross-sectional view showing a hot-dip aluminum plating heat dissipation plate PCB substrate for an LED lamp according to the present invention.

Hot-dip aluminum plated heat dissipation plate PCB substrate for LED lighting according to the present invention, as shown in Figure 1, the carbon steel 110, the first and second alloy layers formed on the upper and rear surfaces of the carbon steel 110, respectively (120, 130), molten Al-Si-based first and second plating layers 140 and 150 respectively formed on the surfaces of the first and second alloy layers 120 and 130, and the first and second plating layers First and second coating layers 160 and 170 formed on the surfaces of (140 and 150), respectively, an insulator 180 formed on the first coating layer 160, and an insulator 180 formed on the insulator 180 It comprises a copper foil 190.

Meanwhile, circuit patterns are formed on the copper foil 190 and the entire surface including the circuit pattern is plated to produce a PCB substrate.

In addition, a plurality of LED chips 200 are mounted on the plated PCB substrate at regular intervals.

Here, the carbon steel material 110 is made of a steel plate or a steel wire material containing alloy elements of C, Si, Mn, P, S, and Al.

On the other hand, the surface of the carbon steel 110 may be provided with an Al enriched layer in which 2% by weight to 20% by weight of Al is dissolved.

The first and second alloy layers 120 and 130 are formed to improve the plating properties of the carbon steel 110 and are made of at least one Fe-Al alloy among FeAl ₂ , FeAl ₃ and FeAl ₅ .

The content of Fe in the first and second alloy layers 120 and 130 is 45 to 60% by weight. If the amount of Fe ?t is less than 45% by weight, there is a concern that the Fe-Al alloy phase may not be formed uniformly on the surface of the carbon steel material, whereas if it exceeds 60% by weight, FeAl _{2 in the} Fe-Al intermetallic compound , There is a concern that an alloy phase other than FeAl ₃ and FeAl ₅ may be formed.

In addition, the first and second alloy layers 120 and 130 may be formed of an Fe-Al-Si alloy. At this time, the Si content is preferably 5 to 20% by weight. If the Si content is less than 5% by weight, there is a concern that the alloy phase may not be formed because the Si content required to form the Fe-Al-Si ternary alloy phase is insufficient. On the other hand, if it exceeds 20% by weight, Fe-Al-Si Si content exceeds the Si content required to form the ternary alloy phase, and there is a concern that Si forms an independent phase, thereby increasing the brittleness of the plating layer and deteriorating workability during molding.

The molten Al-Si-based first and second plating layers 140 and 150 contain 40 to 150 g/m 2 of Al, and are formed to have a thickness of 0.4 to 0.5 mm, respectively.

The first and second coating layers 160 and 170 are coated with chromium (Cr) or chromium free (Cr free) to prevent corrosion or intrusion of moisture, thereby preventing discoloration and improving corrosion resistance.

In the case of a prepreg, the insulator 180 has a thermal conductivity of 0.4 W/mK, and the lower the thickness of the insulator 180, the better the heat dissipation, but the lower the withstand voltage, so the present invention is 80-100 μm. Is formed in the thickness of.

The insulator 180 uses an epoxy or phenol-based resin for reinforcing insulation of 2KV or more. At this time, the insulator 180 may be formed of a ceramic material, which has excellent heat dissipation, but has an insulation of 1.5 KV, which is less insulating than an epoxy resin.

The copper foil 190 is formed to a thickness of 10 ~ 30㎛. The heat generated by the LED chip 200 mounted on the copper foil 190 to emit light is radiated to the heat sink plate including the copper foil 190, so that the attachment of a separate heat sink can be omitted or the thickness and volume of the heat sink can be effectively reduced. have.

At this time, the heat dissipation plate is used as a base of the printed circuit board, copper foil is laminated on the heat dissipation plate, and a printed circuit board is formed through a pattern.

Therefore, it can be applied to a printed circuit board having excellent heat dissipation performance by manufacturing the hot-dip aluminum plated heat dissipation plate PCB substrate for LED luminaires manufactured according to the present invention.

In addition, according to the present invention, the hot-dip aluminum plated heat dissipation plate PCB substrate for LED luminaires has a significantly lighter weight than that of a general metal printed circuit board, so it can be slimmer and lighter while improving conduction and heat dissipation performance. It can be widely applied.

In addition, it is possible to reduce the weight of the overall LED luminaire by omitting the attachment of a separate heat sink on the back of the PCB substrate.

2 to 6 are process cross-sectional views showing a method of manufacturing a hot-dip aluminum plated heat dissipation plate PCB substrate for an LED lamp according to the present invention.

The manufacturing method of the hot-dip aluminum plated heat dissipation plate of the PCB substrate for LED lighting according to the present invention, as shown in Figure 2, to prepare a carbon steel (110).

Here, the carbon steel material 110 is made of a steel plate or a steel wire material containing alloy elements of C, Si, Mn, P, S, and Al.

On the other hand, the surface of the carbon steel 110 may be provided with an Al enriched layer in which 2% by weight to 20% by weight of Al is dissolved.

Subsequently, first and second alloy layers 120 and 130 are formed on the upper and rear surfaces of the carbon steel 110, respectively.

Here, the first and second alloy layers 120 and 130 are formed to improve the plating properties of the carbon steel 110, and are made of at least one Fe-Al alloy among FeAl ₂ , FeAl ₃ and FeAl ₅ . consist of.

The content of Fe in the first and second alloy layers 120 and 130 is 45 to 60% by weight. If the amount of Fe ?t is less than 45% by weight, there is a concern that the Fe-Al alloy phase may not be formed uniformly on the surface of the carbon steel material, whereas if it exceeds 60% by weight, FeAl _{2 in the} Fe-Al intermetallic compound , There is a concern that an alloy phase other than FeAl ₃ and FeAl ₅ may be formed.

In addition, the first and second alloy layers 120 and 130 may be formed of an Fe-Al-Si alloy. At this time, the Si content is preferably 5 to 20% by weight. If the Si content is less than 5% by weight, there is a concern that the alloy phase may not be formed because the Si content required to form the Fe-Al-Si ternary alloy phase is insufficient. On the other hand, if it exceeds 20% by weight, Fe-Al-Si Si content exceeds the Si content required to form the ternary alloy phase, and there is a concern that Si forms an independent phase, thereby increasing the brittleness of the plating layer and deteriorating workability during molding.

As shown in FIG. 3, molten Al-Si-based first and second plating layers 140 and 150 formed on the surfaces of the first and second alloy layers 120 and 130, respectively, are formed.

Here, the molten Al-Si-based first and second plating layers 140 and 150 contain 40 to 150 g/m 2 of Al, and are formed to have a thickness of 0.4 to 0.5 mm, respectively.

Subsequently, the first and second plating layers 140 and 150 are cut or polished to a thickness of 40-50% from the surface. In order to improve the adhesion to the surface, a cutting or polishing operation is performed.

At this time, the polishing process proceeds to fuse the copper foil thereafter, and the polishing state is 50 to 70 g/m 2.

Subsequently, the scented or polished carbon steel 110 is subjected to ultrasonic wet cleaning, in which the ultrasonic wet cleaning is immersed in a cleaning liquid and a wet cleaning method is used in which the surface is cleaned by a chemical reaction with the cleaning liquid. do. In this wet cleaning method, the cleaning liquid is composed of several types of chemicals.

In particular, in the present invention, the method of wet cleaning is ultrasonic cleaning, jet cleaning, spray/shower cleaning, vacuum cleaning, deteriorating cleaning, solvent cleaning, barrel/vibration/brush cleaning, immersion/blasting/bubble cleaning, microbubble, fluid jet , Cryogenic aerosol, hot-air drying, vacuum drying, steam (Steam/Vapor) drying system, vacuum drying, suction drying, barrel, and spin drying through ultrasonic wet cleaning.

As shown in FIG. 4, the elastic steel material 110 on which the first and second plating layers 140 and 150 are formed is immersed in a chromium or chromium free solution to form the first and second plating layers 140 and 150. The first and second coating layers 160 and 170 are formed.

Meanwhile, the first and second coating layers 160 and 170 may be formed by coating with graphene or carbon nanotubes (CNT).

In addition, the first and second coating layers 160 and 170 may be formed by applying an electrically conductive graphene solution, a CNT solution, a graphene paste, or a CNT paste.

As shown in FIG. 5, an insulator 180 made of an epoxy or phenol resin is formed on the surface of the first coating layer 160. At this time, since the filling rate of the ceramic filler is approximately 45 to 65 vol%, the content of the epoxy resin is impregnated so as to be 40 to 60 vol% of the total insulator 180 to be formed. In addition, as the epoxy resin, at least one of bisphenol-based, novolac-based, and mesogen-based may be used, and a curing agent according to the type of epoxy used is mixed and a curing accelerator is added thereto. Can be.

In addition, by forming the insulator 180 by heat treatment so that the epoxy is completely impregnated into the first coating layer 160, the epoxy moves to the interface between the carbon steel material 110 and the filler layer by flow, thereby forming a sufficient film steel. To achieve the adhesive strength. The heat treatment temperature may be various temperatures known in the art to be suitable for the epoxy composition used, and may also vary depending on the amount of the curing agent used.

In addition, the process of forming the insulator 180 as described above may be repeatedly performed until a desired thickness is obtained.

As shown in FIG. 6, it is formed by plating a copper foil 190 on the insulator 180.

Meanwhile, the insulator 180 and the copper foil 190 are described to be formed only on one surface of the carbon steel material 110, but are not limited thereto and may be formed on both surfaces of the carbon steel material 110.

Here, the copper foil 190 is an electroless or electrolytic plating method, or a silk screen or a metal screen in which a pad of an area to be surface-treated with ink or paste is formed. It can also be formed by heat treatment by printing to a required thickness on an external circuit, which is an area to be surface-treated by a printing method or the like.

On the other hand, by forming the copper foil 190, a heat dissipation plate of the PCB substrate is formed, and the drawings are omitted, but a circuit pattern is formed on the copper foil 190, and an electroless copper plating treatment is performed on the entire surface including the circuit pattern. To fabricate the PCB board.

Here, the electroless copper plating process is called chemical or catalyst plating, and since the conductive copper is coated on the entire surface to give conductivity, PTH (Plated Through Hole) plating or plating is performed on the entire panel. Also called panel plating. At this time, the copper thickness to be plated is 0.5 to 1.0 μm, and the catalyst used is Pd.

In this case, the circuit pattern may be formed by a general method as well as a semi additive process (SAP) or a modified semi additive process (MSAP) method, and a method of forming a circuit pattern is not limited thereto.

7 and 8 are views comparing the corrosion resistance of the PCB substrate and the corrosion resistance of salt spray according to the conventional and the present invention.

7 and 8, compared with the prior art, the present invention provides no damage to the exterior of the plating layer and discoloration due to heat even when exposed to a high temperature of 400° C. for a long time. It can be seen that the corrosion resistance is excellent by formation.

9 shows a product photo of the hot-dip aluminum plating heat dissipation plate PCB substrate. After hot-dip aluminum plating, it is possible to secure a beautiful surface by suppressing spangle growth, has excellent gloss, and by plating aluminum plating components on various materials. It is possible to secure the upgraded quality.

Meanwhile, as described above, embodiments of the present invention have been described with reference to the accompanying drawings, but a person of ordinary skill in the art to which the present invention pertains does not change the technical spirit or essential features of the present invention, and other specific forms You will understand that it can be done with. Therefore, the embodiments described above are illustrative and non-limiting in all respects.

110: carbon steel 120: first alloy layer
130: second alloy layer 140: first plating layer
150: second plating layer 160: first coating layer
170: second coating layer 180: insulator
190: copper foil

Claims (16)

With carbon steel,
First and second alloy layers respectively formed on the upper and rear surfaces of the carbon steel material,
Molten Al-Si-based first and second plating layers respectively formed on the surfaces of the first and second alloy layers,
First and second coating layers respectively formed on the surfaces of the first and second plating layers,
An insulator formed on the first coating layer,
Consisting of including a copper foil formed on the insulator,
A hot-dip aluminum plating heat dissipation plate PCB substrate for LED lighting, characterized in that the content of Fe in the first and second alloy layers is 45 to 60% by weight, and the Si content is 5 to 20% by weight. The hot-dip aluminum plated heat dissipation plate PCB substrate according to claim 1, wherein the carbon steel material is made of a steel plate or a steel wire material containing alloy elements of C, Si, Mn, P, S, and Al. The hot-dip aluminum plating heat dissipation plate PCB substrate for LED lighting according to claim 1, wherein an Al enriched layer in which 2% to 20% by weight of Al is dissolved is provided on the surface of the carbon steel material. delete delete delete delete The hot-dip aluminum plated heat dissipation plate PCB substrate for LED lighting according to claim 1, wherein the insulator is made of an epoxy resin or ceramic material. Preparing a carbon steel material,
Forming first and second alloy layers on the upper and rear surfaces of the carbon steel, respectively,
Forming molten Al-Si-based first and second plating layers on the surfaces of the first and second alloy layers, respectively,
Polishing the first and second plating layers by a predetermined thickness from the surface,
Forming first and second coating layers on the surfaces of the first and second plating layers, respectively,
Forming an insulator on the surface of the first coating layer,
Including the step of forming a copper foil on the insulator,
A method of manufacturing a hot-dip aluminum plating heat dissipation plate PCB substrate for LED lighting, characterized in that the content of Fe in the first and second alloy layers is 45 to 60% by weight, and the Si content is 5 to 20% by weight. The method of claim 9, wherein the carbon steel material is formed of a steel plate or a steel wire material containing alloy elements of C, Si, Mn, P, S, and Al. . The method of claim 9, further comprising forming an Al-concentrated layer in which 2% to 20% by weight of Al is dissolved on the surface of the carbon steel material. . delete delete delete delete The method of claim 9, wherein the insulator is formed of an epoxy resin or ceramic material.

Images