KR102195738B1 - Method for fabricating direct light type backlight for module - Google Patents

Abstract

The present invention relates to a manufacturing method of a modular underneath backlight which can manufacture backlights of various shapes. To this end, the manufacturing method of a modular underneath backlight comprises: a step of connecting K (K is a natural number higher than or equal to 2) modular PCBs having n×m (n and m are natural numbers higher than or equal to 2) package chips for a light source mounted thereon and having a protruding connector and a grooved connector on sides thereof facing each other to connect the package chips mounted on the modular PCBs to form a whole PCB; a step of providing a plate for a partition frame having a size corresponding to the size of Kn×Km to be coupled to the whole PCB; a step of forming a partition frame by forming the plate for a partition frame to form partitions in four directions of the package chips for a light source when coupling the whole PCB and the plate for a partition frame; and a step of coupling the partition frame and the whole PCB.

Description

Modular direct-type backlight manufacturing method {METHOD FOR FABRICATING DIRECT LIGHT TYPE BACKLIGHT FOR MODULE}

The present invention relates to a method of manufacturing a modular direct-type backlight.

In recent years, according to the trend of thinning and high performance of image display devices, liquid crystal displays are widely used in TVs and monitors. Since the liquid crystal panel does not emit light by itself, the liquid crystal display device requires a separate light source unit, that is, a backlight unit.

A cold cathode fluorescent lamp (CCFL), which is cheap and easy to assemble, has been used as a light source of the backlight unit. However, the backlight unit using the CCFL has disadvantages such as environmental pollution due to mercury, a slow response speed, and difficulty in implementing partial driving. In order to overcome this, instead of CCFL, an LED has been proposed as a light source of the backlight unit. The backlight unit using the LED can compensate for the disadvantages of the conventional CCFL, and in particular, can implement a partial driving method such as local dimming or impulsive.

In general, the backlight unit is divided into a direct type type and a side type which is an edge type backlight unit. In the edge type, a bar-shaped light source is positioned at the side of the liquid crystal panel and irradiates light toward the liquid crystal panel through the light guide plate, whereas in the direct type, the liquid crystal panel is directly illuminated from a surface light source located under the liquid crystal panel.

In order to express an image more vividly, the liquid crystal panel of the liquid crystal display device may be divided into a plurality of areas, and the light source luminance value of the backlight unit may be adjusted for each divided area according to the gray level value of each divided area. This backlight unit driving method is called local dimming. That is, the LEDs in the backlight unit area corresponding to the brightly displayed part on the screen may be partially turned on, and the LEDs corresponding to the remaining screen parts may be turned on with low luminance or completely turned off. According to the local dimming driving method, a bright part becomes brighter and a dark part becomes darker, thereby realizing a more realistic image.

The structure of a general direct type backlight unit is a structure in which a plurality of light sources uniformly arranged, a diffuser plate formed on the top of the light source, and optical sheets such as a prism sheet are stacked, and a reflective sheet is provided on the rear side of the light source. .

A general direct type backlight unit operates in a manner that integrally lights all light sources or adjusts luminance as a whole.

When all the light sources of the direct type backlight unit having such a structure are turned on, a section in which light emitted from each light source overlaps occurs, and a uniform surface light source is provided as a whole.

On the other hand, when only the product logo is displayed at the center of the screen at the initial booting of the display device, only one light source may be turned on. In other words, in the direct type backlight unit, only some of the plurality of light sources may be turned on.

However, when a plurality of light sources are turned on as a whole, the backlight unit provides a uniform surface light source, but when only one light source is turned on, the light diffuses to the surroundings and light leakage occurs from the liquid crystal. Halo mura, where light spreads, occurs. That is, when only one light source is turned on, only the central circle should shine brightly, but the light leaks to the periphery and light spreads out to the periphery.

For this reason, if a partition wall is disposed at the boundary between light sources to reduce the halo-mura phenomenon, it is possible to reduce the halo-mura caused by diffusion of light to the periphery.

However, in order to form all the partition walls between a plurality of light sources, there is a problem in that the manufacturing cost increases.

Republic of Korea Patent Publication No. 10-2018-0062573 (published on June 11, 2018)

The present invention has a protrusion-type connector and a groove-type connector, and a plurality of module PCB boards combined with a light source package chip are connected to form an entire PCB board, and then, when combined with the entire PCB board, the light source package chip is isolated by a partition wall. By forming a partition frame and providing a backlight by combining the partition frame and the entire PCB board, it is easy to repair when the light source package chip in a specific area is fixed, and various types of backlights can be manufactured through the connection between the modular PCB boards. It provides a method of manufacturing a modular direct-type backlight.

In addition, the present invention provides a method for manufacturing a backlight of a modular direct type that can be coupled to the entire PCB substrate by forming a partition frame having an opening isolated by the partition wall or a recess having a light source insertion hole.

In addition, the present invention provides a method for manufacturing a backlight of a module-type direct type capable of increasing the business card ratio by forming the ends of the partition walls in a curved shape.

In order to solve the above-described problem to be solved, in the method of manufacturing a module-type direct-type backlight according to an embodiment of the present invention, n×m (n, m is a natural number greater than 2) package chips for light sources are mounted, and n× A light source package mounted on each of the modular PCB boards by connecting K (K is a natural number of 2 or more) modular PCB boards having m connectors, each having a protruding connector and a grooved connector on opposite sides The steps of forming an entire PCB substrate by interconnecting chips; providing a plate for a partition wall frame having a size corresponding to a size of Kn×Km that can be combined with the entire PCB substrate; and the entire PCB substrate and the partition wall frame The partition wall frame may be formed by forming the partition wall frame so that partition walls are formed on each of the light source package chips during the coupling between the light source package chips, and the step of combining the partition wall frame and the entire PCB substrate.

According to an embodiment of the present invention, in the forming of the partition frame, the partition wall frame plate is formed to have Kn×Km openings through which each of the light source package chips can be disposed when the entire PCB substrate and the plate for the partition wall frame are combined. The partition wall frame may be formed by molding.

According to an embodiment of the present invention, the forming of the partition wall frame includes forming a plurality of recess portions in which each of the plurality of light source package chips may be located, and a partition wall for mutually isolating each of the plurality of recess portions. Forming the plate for the partition wall frame so that the plate for the partition wall frame is formed, and when the entire PCB substrate and the plate for the molded partition wall frame are combined by removing a predetermined portion of the bottom surface of each of the recess portions, the light source package chip is inserted and And forming a partition wall frame by forming a protruding light source insertion hole, wherein the combining step includes the partition wall frame and the entire PCB substrate so that each package chip for the light source is inserted and protruded into the light source insertion hole. Can be combined.

According to an embodiment of the present invention, the partition wall may be formed as a slope or a six surface.

According to an embodiment of the present invention, the partition wall may have a curved end portion.

According to an embodiment of the present invention, the light source package chip includes an LED for a light source, a transistor formed on an insulating layer or mounted on a region formed by etching a portion of the insulating layer, and a lower surface of the insulating layer connected to the source of the transistor. A source pad connected to a portion, an LED pad formed between the light source LED and the insulating film and connected to another part of the lower surface of the insulating film, and a region between the source pad and the LED pad formed on the lower surface of the insulating film, A gate pad connected through a gate and a second circuit line to supply a predetermined power to the gate, a drain pad formed on the drain of the transistor and connecting the drain to the light source LED through a first circuit line; , A light-transmitting material layer covering the entire light source LED and the transistor, and a concave lens formed by etching an upper portion of the light-transmitting material layer formed on a portion corresponding to the light source LED in a semicircle shape.

In order to solve the above-described problem to be solved, in the method of manufacturing a module-type direct-type backlight according to an embodiment of the present invention, n×m (n, m is a natural number greater than 2) package chips for light sources are mounted, and n× Providing a plate for a partition wall frame having a size corresponding to n×m size, which is provided with m connectors, but which can be combined with a modular PCB board having a protruding connector and a groove type connector on opposite sides, Forming a partition frame by forming the partition wall frame so that partition walls are formed on each side of each of the light source package chips when the modular PCB substrate and the partition wall frame plate are coupled, and the partition wall frame and the modular PCB substrate are formed. Combining and connecting K pieces of the combined result to form a direct-type backlight, and the protrusion-type connector and the groove-type connector formed on the modular PCB substrate of the resultant are formed on another module-type PCB substrate. By connecting the connectors to each other, it is possible to form a light-type backlight.

According to the above-described embodiments of the present invention, a light source package chip is provided with a protrusion-type connector and a groove-type connector, and when a light source package chip is combined with the entire PCB substrate after forming an entire PCB substrate by connecting a plurality of module PCB substrates combined with the light source package chip. The partition frame is formed to be isolated by the partition wall, and by combining the partition frame and the entire PCB board to provide a backlight, it is easy to repair when the light source package chip in a specific area is fixed, as well as connection between the modular PCB boards. Through this, various types of backlights can be manufactured.

In addition, according to the above-described embodiments of the present invention, after forming a partition frame having an opening portion isolated by a partition wall having a curved end portion or a recess portion having a light source insertion hole, it is coupled to the entire PCB substrate. By doing so, it is possible to minimize the halo phenomenon of light generated from the light source package chip.

In addition, according to the above-described embodiments of the present invention, the transistor is integrally manufactured on the molded light source mounting plate, and the light source package chip having a concave lens formed on the top of the light source LED is mounted, thereby enabling individual driving. No, it can increase the cost of business cards.

1 is an exploded perspective view illustrating a method of manufacturing a modular direct-type backlight according to an embodiment of the present invention.
2 is a view for explaining a structure of a partition wall in a partition frame frame in a modular direct-type backlight according to an embodiment of the present invention.
3 is a view for explaining a structure of another type of partition wall frame applied to a modular direct type backlight according to an exemplary embodiment of the present invention.
4 is a view for explaining a structure of a partition wall in the structure of another type of partition wall frame of FIG. 3.
5 is an enlarged view of a package chip for a light source applied to a modular direct-type backlight according to an embodiment of the present invention.
6 is a view for explaining a structure of another type of partition wall frame according to an embodiment of the present invention.

Hereinafter, a specific embodiment of the present invention will be described with reference to the drawings. The following detailed description is provided to aid in a comprehensive understanding of the methods, devices, and/or systems described herein. However, this is only an example and the present invention is not limited thereto.

In describing the embodiments of the present invention, when it is determined that a detailed description of known technologies related to the present invention may unnecessarily obscure the subject matter of the present invention, a detailed description thereof will be omitted. In addition, terms to be described later are terms defined in consideration of functions in the present invention and may vary according to the intention or custom of users or operators. Therefore, the definition should be made based on the contents throughout this specification. The terms used in the detailed description are only for describing embodiments of the present invention, and should not be limiting.

Hereinafter, a method of manufacturing a surface-shaped backlight will be described with reference to the accompanying drawings.

1 is an exploded perspective view for explaining a method of manufacturing a module-type direct-type backlight according to an embodiment of the present invention, and FIG. 2 is an exploded perspective view illustrating a structure of a partition wall in a partition wall frame in a module-type direct-type backlight according to an embodiment of the present invention. 3 is a view for explaining a structure of another type of partition wall frame applied to a modular direct-type backlight according to an embodiment of the present invention, and FIG. 4 is a view for explaining the structure of another type of partition wall frame structure of FIG. It is a view for explaining the structure of the partition wall, FIG. 5 is an enlarged view of a package chip for a light source applied to a module-type direct-type backlight according to an embodiment of the present invention, and FIG. 6 is another form according to an embodiment of the present invention. It is a figure for demonstrating the structure of a partition wall frame.

First, as shown in FIGS. 1 and 2, the modular direct-type backlight 800 is manufactured in the form of n×m (n, m is a natural number of 2 or more), so that n×m light source package chips 10 A partition wall 710 and a light source package chip 10 formed to reduce interference between the entire PCB board 630 in which K modules mounted PCB board 600 are connected and the package chip 10 for a light source and the package chip 10 for the light source are formed at the partition wall 710 ) The partition wall frame 700 including Kn×Km openings 720 providing an area that can be arranged between them may be combined.

In an embodiment of the present invention, the PCB substrate 600 includes a circuit capable of providing power for driving the package chip 10 for a light source and a data signal for local dimming, and a plurality of protrusions on the sides facing each other. A type connector 610 or a groove type connector 620 is formed. Specifically, a protruding connector 610 may be formed on one side of the PCB substrate 600 facing each other, and a grooved connector 620 may be formed on the other side.

In an embodiment of the present invention, the protruding connector 610 and the grooved connector 620 may be male and female connectors for electrically interconnecting a plurality of PCB substrates 600. That is, the entire PCB board 630 for a backlight of a modular direct type by connecting the protruding connector 610 formed on one side of the PCB board 600 to the grooved connector 620 of the other PCB board 600 Can be formed.

The partition wall frame 710 includes a plurality of openings 720 and openings 720 for allowing the package chip 10 for a light source to protrude between the partition walls 710 when the PCB substrate 600 and the partition wall frame 710 are coupled. A partition wall 710 capable of isolating each of the package chips 10 for light sources protruding from) may be provided.

The partition wall frame 700 may be manufactured using a plate for forming a partition wall frame (not shown) having a predetermined thickness, that is, a thickness corresponding to the height of the partition wall 710. That is, the partition wall 710 and the opening 720 capable of protruding the plurality of light source package chips 10 may be formed by forming a plate for forming a partition frame using mold molding or injection molding.

In addition, in the embodiment of the present invention, the partition wall frame 700 is a whole PCB board composed of a modular PCB board 600 interconnected through a protruding and grooved connector 610 and 620 through a predetermined adhesive (not shown). It may be coupled to the 630 or may be coupled to the entire PCB substrate 630 and spaced apart by a predetermined distance.

On the other hand, in the embodiment of the present invention, it has been described for example that the backlight 800 of the modular direct type is formed using the partition wall frame 700 having the opening 720, but as another embodiment, the partition wall 710 Without completely opening the space, only a partial region may be opened so that the package chip 10 for the light source of the modular PCB substrate 600 can be inserted and protruded between the partition walls 710.

In this case, as shown in FIGS. 3 and 4, the partition wall frame 900 has a predetermined thickness, for example, a thickness greater than the height of the partition wall 910, and protrudes by inserting a plurality of light source package chips 10. It may be manufactured using a plate for forming a partition frame (not shown) capable of forming the partition frame 900 for the purpose. That is, a plurality of mounting holes for forming a light source insertion hole 920 capable of inserting and protruding a plurality of light source package chips 10 by molding a plate for forming a partition frame using mold molding or injection molding can be performed. A plurality of recessed portions 925 are formed.

Thereafter, a partition wall frame having a plurality of light source insertion holes 920 by forming a light source insertion hole 920 in each of the plurality of recesses 925 by removing a predetermined portion of the bottom surface of each of the plurality of recess portions 925 (900) can be formed.

Accordingly, each of the plurality of recess portions 925 is partitioned by the partition wall 910 to isolate the package chip 10 for light sources protruding through the light source insertion hole 920 in the recess portion 925. I can make it.

In the exemplary embodiment of the present invention, each of the plurality of recess portions 925 has a rectangular shape, and the partition wall 910 may be formed as a slope corresponding to the recess portion 925. Accordingly, it may have an open tetrahedral shape having an upper surface open and a bottom surface in which the recess portion 925 is formed.

In the embodiment of the present invention, the partition wall 910 is inserted into the light source insertion hole 920 of the recess portion 925 and protruded from the light generated from the light source package chip 10 and the adjacent recess portion 925 Interference between light generated from the light source package chip 10 inserted and protruded into the light source insertion hole 920 may be reduced.

The size of the partition wall frame 700 having such a structure, that is, the number of partition walls 710 and light source insertion holes 720 may be determined by the size of the entire PCB substrate 630 to which the modular PCB substrate 600 is coupled.

In the embodiment of the present invention, the partition walls 710 and 910 may have a curved upper portion (mountain peak shape) as illustrated in FIGS. 2 and 4.

The light source package chip 10 connected to the modular PCB substrate 600 having the structure as described above is a transistor-integrated LED chip, as shown in FIG. 5, and includes a concave lens 110, a transistor 200, A light source LED 300, a connection pad 400, first and second circuit lines 510 and 520, and a light-transmitting material layer 550 may be included.

The transistor 200 includes a gate 210 connected to the gate pad 410 of the connection pad 400, a source 220 connected to the source pad 420 of the connection pad 400, and a connection pad 400. ) May be composed of a drain 230 connected to the drain pad 430. The transistor 200 according to the embodiment of the present invention may be a CMOS transistor.

The transistor 200 may be formed inside the insulating layer 20, that is, in the TR mounting portion 401 by etching a partial region of the insulating layer 20. That is, the transistor 200 may be formed so that the source 220, the drain 230, and the gate 210 are exposed to the outside by etching a portion of the insulating layer 20.

In the embodiment of the present invention, the transistor 200 has been described as being formed inside the insulating film 20, but the transistor 200 is formed on the insulating film 20 in a partial area of the upper surface, for example, the LED 300 for a light source and a predetermined number. It may be formed in an area spaced apart by an interval.

The light source LED 300 has one terminal, e.g., a lower terminal, electrically connected to the LED terminal 430 of the LED pad 430, and the other terminal, e.g., an upper terminal, the transistor 200 through the first line 510. The drain 230 of the transistor 200 may be electrically connected to the drain pad 430 connected to the drain 230 of the transistor 200.

The connection pad 400 is connected to the drain 230 of the transistor 200, the drain pad 402 connected to the LED 300 for a light source and the first line 510, and the gate 210 of the transistor 200. ) And the gate pad 410 connected through the second line 520, the source pad 420 connected to the source 220 of the transistor 200, and the one terminal of the light source LED 300. It may be configured with an LED pad 440 or the like.

The first circuit line 510 electrically connects the LED 300 for a light source and the drain pad 430 connected to the drain 230 of the transistor 200 and the LED 300 for a light source, and the second circuit line 520 ) May connect the gate 210 of the transistor 200 and the gate pad 410.

The light-transmitting material layer 600 is formed in a form in which the transistor 200 and the light source LED 300 are completely buried on the insulating film 20 in which the transistor 200 and the light source LED 300 are formed, It may include a concave lens 110 formed by etching the light-transmitting material layer 550 formed in a region corresponding to the light source LED 300 in a semicircular shape.

Meanwhile, after forming the light-transmitting material layer 550 in the process of forming the light source package chip 10 according to an embodiment of the present invention, a light-transmitting material layer formed in a region spaced apart from the light source LED 300 by a predetermined distance By patterning 550, that is, by patterning the light-transmitting material layer 550 so that the upper portion of the drain pad 430 and the LED pad 440 is exposed, a hole is formed. A reflective wall 560 may be formed.

The light source package chip 10 having the structure as described above applies power to the gate 210 of the transistor 200 through the gate pad 410 to operate the transistor 200 to be connected to the drain 230. The light source LED 300 is operated, and light generated from the light source LED 300 may pass through the light-transmitting material layer 550 and radiate to the outside. At this time, the light may be condensed through the concave lens 110 and radiated to the outside, as well as the light spreading to both sides of the light generated from the light source LED 300 is reflected through the light reflecting wall 560 to be reflected through the concave lens ( 110) and can be emitted to the outside.

Accordingly, since light generated from the light source LED 300 can be radiated to the outside without loss, the efficiency of light can be improved.

In the embodiments of the present invention as described above, the barrier ribs 710 and 910 of the barrier rib frames 700 and 900 are implemented in a rectangular shape to isolate the package chips 10 for light sources adjacent to each other. However, as shown in FIG. 6, the partition wall 911 may be formed in a honeycomb shape, that is, a hexagonal shape. Accordingly, when the PCB substrate 600 and the partition wall frames 700 and 900 are coupled, a region in which the package chip 10 for a light source is located, for example, the inner shape of the opening and the recess may also have a hexagonal shape.

In other words, in another embodiment of the present invention, the partition wall 911 may be formed in a six surface. Accordingly, a partition wall frame having an open hexahedral shape having an open top surface and a bottom surface formed with an opening or a recess portion may be formed.

In addition, in embodiments of the present invention, the thickness of the partition walls 710, 910, and 911 may be 1-2 mm, and the width of the opening 720 and the recess portion 920 may be 5-20 mm, but the present invention is not limited thereto. .

The modular direct type backlight manufactured according to an embodiment of the present invention is located on the rear surface of a display panel (not shown) to supply light from the rear of the display panel, and from the circuit unit (including the backlight unit and the timing controller) The light source control signal may be received and driven in synchronization with the display panel (not shown).

A process of manufacturing a modular direct-type backlight using the modular PCB substrate 600 and the partition wall frames 700 and 900 to which the light source package chip 10 having the above-described configuration is coupled will be described below. .

First, n×m (n, m is a natural number greater than 2) light source package chips are mounted, and n×m connectors are provided, with a protruding connector 610 and a grooved connector 620 on the sides facing each other. The entire PCB board 630 is formed by connecting K (K is a natural number of 2 or more) to the modular PCB board 600 having the module-type PCB board and interconnecting the package chips for light sources mounted on each of the modular PCB boards, After providing a plate for a partition wall frame having a size corresponding to the size of Kn×Km that can be combined with the entire PCB substrate 630, the partition wall frame 700 as shown in FIG. 1 or the partition wall frame 700 as shown in FIG. To form the partition wall frame 900 as shown.

Then, by combining the partition wall frame 700 or 900 and the entire PCB substrate 630, a modular direct-type backlight may be manufactured.

Meanwhile, n×m (n, m is a natural number greater than 2) light source package chips are mounted, and n×m connectors are provided, but the protruding connector 610 and the grooved connector 620 on the sides facing each other After providing a modular PCB board 600 having a module type PCB board 600 and providing a plate for a partition wall frame having a size corresponding to an n×m size that can be combined with the modular PCB board 600 ) And the partition wall frame plate to form the partition wall frame 700 or 900 by forming the partition wall frame plate so that partition walls 710 and 910 are formed on each of the light source package chip 100 when the plate is combined.

Then, after combining the partition wall frame 700 or 900 and the modular PCB substrate 600, K pieces of the combined result may be connected to form a direct-type backlight. Specifically, the protrusion-type connector 610 and the groove-type connector 620 formed on the resulting modular PCB board 600, and the protrusion-type connector 610 and the groove-type connector 620 formed on the other modular PCB board 600. By connecting them to each other, it is possible to form a design type backlight.

The foregoing description of the present application is for illustrative purposes only, and those of ordinary skill in the art to which the present application pertains will be able to understand that it is possible to easily transform it into other specific forms without changing the technical spirit or essential features of the present application. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not limiting. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as being distributed may also be implemented in a combined form.

The scope of the present invention is indicated by the claims to be described later rather than the detailed description, and all changes or modified forms derived from the meaning and scope of the claims and their equivalent concepts should be interpreted as being included in the scope of the present application. .

10: light source package chip
600: Modular PCB board
610: protruding connector
620: grooved connector
630: entire PCB board
700, 900: bulkhead frame
710, 910, 911: bulkhead
720: opening
920: light source insertion hole
925: recess

Claims (6)

A modular PCB board with n×m (n, m being a natural number greater than 2) light source package chips and n×m connectors, with protruding connectors and groove connectors on opposite sides. Forming an entire PCB board by connecting K (K is a natural number of 2 or more) to interconnect package chips for light sources mounted on each of the modular PCB boards;
Providing a plate for a partition wall frame having a size corresponding to the size of Kn × Km that can be combined with the entire PCB substrate,
When the entire PCB substrate and the plate for the partition frame are combined, the plate for the partition frame is formed to form a partition wall so that partition walls are formed on each side of each of the package chips for the light source, and the partition frame plate is molded or injection molded to form the partition wall. Forming a frame,
Including the step of combining the partition wall frame and the entire PCB substrate,
The light source package chip,
LED for light source,
A transistor including a source, a drain, and a gate formed on the insulating layer or in a trent region formed by etching a portion of the insulating layer;
A source terminal connected to the source of the transistor and connected to a portion of the lower surface of the insulating film;
An LED terminal formed between the light source LED and the insulating film and connected to another part of the lower surface of the insulating film,
A gate terminal formed in a region between the source terminal and the LED terminal formed on the lower surface of the insulating film and connected to the gate of the transistor to supply predetermined power to the gate;
A drain terminal formed on the drain of the transistor and connecting the drain to the light source LED through a circuit connection line;
A light-transmitting material layer covering the entire LED and the transistor for the light source,
Modular direct-type backlight manufacturing method comprising a concave lens formed by etching a light-transmitting material layer formed on a portion corresponding to the light source LED in a semicircular shape.
The method of claim 1,
The step of forming the partition wall frame,
When the entire PCB substrate and the plate for the partition frame are combined, the plate for the partition frame is formed to have Kn×Km openings in which each of the package chips for the light source can be arranged, thereby forming the partition frame frame. Way.
The method of claim 1,
The step of forming the partition wall frame,
Forming a plurality of recess portions in which each of the plurality of light source package chips may be located, and forming the partition wall frame plate to form a partition wall for isolating each of the plurality of recess portions to each other;
The partition wall frame is formed by removing a predetermined portion of the bottom surface of each of the recesses to form a light source insertion hole through which the package chip for the light source can be inserted and protruded when the entire PCB substrate and the formed partition wall frame plate are combined. It includes the step of,
The combining step,
A method for manufacturing a backlight of a modular direct-type method in which the partition wall frame and the entire PCB substrate are coupled so that each of the light source package chips is inserted and protruded into the light source insertion hole.
The method of claim 1,
The partition wall is a modular direct-type backlight manufacturing method that is formed in a slope or a six surface.
The method of claim 1,
The bulkhead is a modular direct-type backlight manufacturing method having a curved end.
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