KR102194401B1 - Method and system for fabricating high frequency cavity filter - Google Patents

Abstract

Disclosed are a system and method for manufacturing a high frequency cavity filter. According to one embodiment of the present invention, the system for manufacturing a high frequency cavity filter including a filter body made of a conductive material and a plurality of resonators protruding from a resonator hole to the inside of the filter body, wherein the resonator hole is provided in a base plate of the filter body, includes a first assembly device for coupling a frequency control unit to each resonator of the filter body. The first assembly device includes a first input unit into which the filter body is inputted, a second input unit into which the frequency control unit is inputted, and a coupling unit coupling the frequency control unit inputted from the second input unit to each resonator of the filter body inputted through the first input unit.

Description

Manufacturing method and system of high frequency cavity filter TECHNICAL FIELD [METHOD AND SYSTEM FOR FABRICATING HIGH FREQUENCY CAVITY FILTER}

An embodiment of the present invention relates to a technique for manufacturing a high frequency cavity filter.

In general, high frequency filters are used in most transmission/reception communication equipment such as mobile communication base stations or repeaters. Among them, a cavity filter having a cavity structure is mainly used in devices requiring high power such as a mobile communication base station. The cavity filter has a structure in which a plurality of cavities are formed inside the filter and a resonator is installed inside the cavity, and is a filter that performs filtering through resonance in each cavity. Existing high frequency cavity filters have a problem that is difficult to assemble due to many parts, consumes a lot of manufacturing cost and manufacturing time, and is not suitable for mass production due to many tuning points.

Korean Patent Publication No. 10-2009-0036327 (2009.04.14)

An embodiment of the present invention is to provide a method and system for manufacturing a high frequency cavity filter, which has a simple manufacturing process and can be mass-produced.

The manufacturing system according to the disclosed embodiment includes a filter body made of a conductive material, and a high frequency cavity filter including a plurality of resonators protruding into the filter body from a resonator hole provided in a base plate of the filter body. A manufacturing system, comprising: a first assembling device for coupling a frequency adjusting part to each resonator of the filter body, the first assembling device comprising: a first input part into which the filter body is inserted; A second input unit into which the frequency adjustment unit is input; And a coupling part for coupling a frequency adjusting part input from the second input part to each resonator of the filter body input through the first input part.

The frequency control unit includes an insertion hole into which an end of the resonator is inserted, a frequency control body having a diameter larger than an outer diameter of the resonator, and a pinch coupling unit protruding from an edge of the insertion hole, and the second input The part may align the direction of the frequency adjusting part so that the parting part of the frequency adjusting part faces the resonator, and the parting part may be fitted by pressing the parting part into an end of the resonator.

The second input unit may provide a frequency adjusting unit equal to the number of resonators of the filter body as the coupling unit, and may be arranged to arrange an arrangement according to a type of the frequency adjusting unit.

The second input unit may be provided as the coupling unit by disposing the first type frequency adjusting unit first and last, and the second type frequency adjusting unit disposed between the first and the last.

The high frequency cavity filter manufacturing system may further include a second assembly device receiving the filter body coupled to the resonator by the frequency control unit and coupling the notch filter unit to an inner side of the filter body.

The high frequency cavity filter manufacturing system may further include a third assembly device receiving the filter body to which the notch filter unit is coupled, and coupling the cover unit to the filter body.

The third assembly device performs a press-fitting process by disposing the first coupling hole of the cover part to correspond to the press protrusion of the filter body, and disposing the second coupling hole of the cover part to correspond to the coupling protrusion of the filter body, A plurality of press protrusions may be provided to be spaced apart from each other along an edge of the filter body, and the coupling protrusions may extend and protrude from an end of a partition wall provided between the resonator and the resonator in the filter body.

The high frequency cavity filter manufacturing system may further include a printer device receiving a substrate tray including a plurality of substrates and applying solder cream to a predetermined portion of each of the substrates.

The high frequency cavity filter manufacturing system may further include a fourth assembly device for mounting a filter body to which the cover part is coupled to each substrate on the substrate tray.

The high frequency cavity filter manufacturing system may further include a reflow device for bonding each substrate to the filter body by performing a reflow treatment on a portion of the substrate tray to which the solder cream is applied.

The high frequency cavity filter manufacturing system may further include a cutting device for cutting and separating the high frequency cavity filters to which the substrate and the filter body are bonded in the substrate tray.

An end of the resonator is provided with a tuning part spaced apart from the inner wall of the resonator and connected to the resonator through a tuning connection part, and the high frequency cavity filter manufacturing system inserts a tuning screw through the resonator hole of the high frequency cavity filter and the tuning It may further include a tuning device that presses the part and stretches it downward.

The manufacturing method according to the disclosed embodiment includes a filter body made of a conductive material, and a high frequency cavity filter including a plurality of resonators protruding from the resonator hole provided in the base plate of the filter body to the inside of the filter body. A manufacturing method, comprising: coupling a frequency adjusting unit to each resonator of the filter body in a first assembly device; Coupling a notch filter unit to an inner side of the filter body in a second assembly device; Coupling the cover to the filter body in a third assembly device; Applying a solder cream to a predetermined portion of each substrate in a substrate tray including a plurality of substrates in a printer apparatus; Mounting the filter body on each substrate on the substrate tray in a fourth assembly device; Performing a reflow treatment on a portion of the substrate tray to which the solder cream has been applied in a reflow device to bond each substrate to the filter body; Cutting and separating the high-frequency cavity filters to which the substrate of the substrate tray and the filter body are bonded by a cutting device; And tuning a tuning unit provided at an end of the resonator of the high frequency cavity filter in the tuning device.

According to the disclosed embodiment, as the filter body and the cover portion are combined through a pressing process, assembly between parts of a high frequency cavity filter is easy and the number of parts is reduced, thereby reducing manufacturing cost and manufacturing labor.

In addition, as the tuning unit is provided at the end of each resonator, the number of resonators and the number of tuning units are the same, so that the time required for tuning can be reduced.

In addition, since the inside of the resonator is empty and tuning is performed by pressing the tuning unit through the tuning screw, the appearance of the resonator such as scratches is not affected. In addition, there is a gap between the resonator and the tuning unit so that condensation due to moisture disappears.

1 is an exploded perspective view of a high frequency cavity filter according to an embodiment of the present invention
2 is a perspective view of a combination of a high frequency cavity filter according to an embodiment of the present invention
3 is a view showing the inside of the filter body in the high frequency cavity filter according to an embodiment of the present invention
4 is a view showing a state in which a filter body and a cover part are combined in a high frequency cavity filter according to an embodiment of the present invention
5 is a view showing a state in which a frequency adjusting unit is coupled to a resonator in a high frequency cavity filter according to an embodiment of the present invention
6 is a perspective view showing a resonator of a high frequency cavity filter according to an embodiment of the present invention
7 is a diagram showing a tuning method of a resonator through a tuning unit in a high frequency cavity filter according to an embodiment of the present invention
8 is a graph showing an S parameter of a high frequency cavity filter according to an embodiment of the present invention
9 is a graph showing unnecessary waves of a high frequency cavity filter according to an embodiment of the present invention
10 is a schematic diagram showing a manufacturing system and a manufacturing sequence of a high frequency cavity filter according to an embodiment of the present invention
11 is a photograph showing a state in which a set of frequency control units are fitted to each resonator of a filter body in an embodiment disclosed
12 is a photograph showing a state in which a notch filter unit is coupled to an inner side of a filter body in an embodiment disclosed
13 is a photograph showing a state in which the cover part is coupled to the filter body in the disclosed embodiment
14 is a photograph showing a substrate tray according to an embodiment disclosed
15 is a photograph showing a state in which solder cream is applied to each substrate of the substrate tray in the disclosed embodiment
16 is a photograph showing a state in which a filter body is mounted on each substrate on the substrate tray according to the disclosed embodiment
17 is a photograph showing a high frequency cavity filter cut by a cutting device in an embodiment disclosed

Hereinafter, a specific embodiment of the present invention will be described with reference to the drawings. The following detailed description is provided to aid in a comprehensive understanding of the methods, devices, and/or systems described herein. However, this is only an example and the present invention is not limited thereto.

In describing the embodiments of the present invention, when it is determined that a detailed description of a known technology related to the present invention may unnecessarily obscure the subject matter of the present invention, a detailed description thereof will be omitted. In addition, terms to be described later are terms defined in consideration of functions in the present invention and may vary according to the intention or custom of users or operators. Therefore, the definition should be made based on the contents throughout this specification. The terms used in the detailed description are only for describing embodiments of the present invention, and should not be limiting. Unless explicitly used otherwise, expressions in the singular form include the meaning of the plural form. In this description, expressions such as "comprising" or "feature" are intended to refer to certain features, numbers, steps, actions, elements, some or combination thereof, and one or more other than those described. It should not be construed to exclude the presence or possibility of other features, numbers, steps, actions, elements, any part or combination thereof.

Meanwhile, directional terms such as upper side, lower side, one side, and the other side are used in relation to the orientation of the disclosed drawings. Since the constituent elements of the embodiments of the present invention may be positioned in various orientations, the directional terminology is used for illustrative purposes, but is not limited thereto.

In addition, terms such as first and second may be used to describe various components, but the components should not be limited by the terms. These terms may be used for the purpose of distinguishing one component from another component. For example, without departing from the scope of the present invention, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component.

1 is an exploded perspective view of a high frequency cavity filter according to an embodiment of the present invention, FIG. 2 is a combined perspective view of a high frequency cavity filter according to an embodiment of the present invention, and FIG. 3 is a high frequency cavity filter according to an embodiment of the present invention. A view showing the inside of a filter body in a cavity filter, and FIG. 4 is a view showing a state in which a filter body and a cover part are combined in a high frequency cavity filter according to an embodiment of the present invention.

1 to 4, the high frequency cavity filter 100 may include a filter body 102, a resonator 104, a cover part 106, and a substrate 108.

The filter body 102 may be formed to form a cavity space therein. In an exemplary embodiment, the filter body 102 may be formed in a rectangular parallelepiped shape with an open bottom surface, but the shape is not limited thereto. The filter body 102 may be made of a conductive material. The filter body 102 may include a base plate 102a, a first side plate 102b, a second side plate 102c, a front plate 102d, and a rear plate 102e.

The base plate 102a may be a portion forming the upper surface of the high frequency cavity filter 100. The base plate 102a may be formed in a rectangular plane having a predetermined length and width, but the shape is not limited thereto.

The first side plate 102b may be provided downward from one side of the base plate 102a. The first side plate 102b may be provided along one edge of the base plate 102a.

The second side plate 102c may be provided downward from the other side of the base plate 102a. The second side plate 102c may be provided along the other side edge of the base plate 102a. The second side plate 102c may be provided to face the first side plate 102b.

The front plate 102d may be provided from the front end to the bottom of the base plate 102a. The front plate 102d may be provided along the front edge of the base plate 102a. The front plate 102d may be connected to one end of the first side plate 102b and the second side plate 102c, respectively.

The rear plate 102e may be provided from the rear end of the base plate 102a to the bottom. The rear plate 102e may be provided along the edge of the rear end side of the base plate 102a. The rear plate 102e may be connected to the other ends of the first side plate 102b and the second side plate 102c, respectively. The rear plate 102e may be provided to face the front plate 102d.

On the other hand, the lower end of the filter body 102 may be provided with an edge portion 111 along the edge of the filter body 102. That is, the rim 111 may be provided along the lower ends of the first side plate 102b, the second side plate 102c, the front plate 102d, and the rear plate 102e. The rim 111 may be provided thicker than the thickness of the filter body 102.

A plurality of press protrusions 111a may be provided on one surface of the edge portion 111 (ie, a surface facing the cover portion 106). A plurality of press projections 111a may be provided to be spaced apart from each other along the edge portion 111.

In addition, one or more partition walls 113 may be provided inside the filter body 102. The partition wall 113 may be provided between the resonator 104 and the resonator 104 in the filter body 102. One end of the partition wall 113 may be connected to the first side plate 102b, and the other end of the partition wall 113 may be connected to the second side plate 102c. That is, the partition wall 113 may be provided within the filter body 102 along the width direction of the filter body 102. In an exemplary embodiment, the partition wall 113 may be provided integrally with the filter body 102.

The partition wall 113 may control electrical coupling between the resonator 104 and the resonator 104. A window 113a may be provided in the partition wall 113 to control electrical coupling between the resonator 104 and the resonator 104. The window 113a may be provided by partially cutting the partition wall 113. The electrical coupling between the resonator 104 and the resonator 104 is adjusted according to the size of the window 113a, so that the frequency bandwidth of the resonator 104 can be adjusted. For example, as the size of the window 113a increases, the frequency bandwidth of the resonator 104 increases, and as the size of the window 113a decreases, the frequency bandwidth of the resonator 104 decreases.

The partition wall 113 may be provided with a coupling protrusion 115 extending from and protruding from the end of the partition wall 113. The coupling protrusion 115 may serve to couple the filter body 102 and the cover part 106.

In addition, an input terminal portion 131 and an output terminal portion 133 may be provided inside the filter body 102, respectively. The input terminal part 131 may be provided on one side of the inside of the filter body 102. The input terminal part 131 may be provided to protrude downward from the base plate 102a. The input terminal part 131 may be provided to protrude downward from the lower end of the filter body 102. A signal received by an antenna of a communication system may be input to the input terminal unit 131.

The output terminal part 133 may be provided on the other side of the filter body 102. The output terminal portion 133 may be provided to protrude downward from the base plate 102a. The output terminal part 133 may be provided to protrude downward from the lower end of the filter body 102. A signal filtered through the high frequency cavity filter 100 may be output to the output terminal unit 133.

A plurality of resonators 104 may be provided in the filter body 102 to be spaced apart from each other. When a plurality of resonators 104 are formed, each resonator 104 may be provided to be spaced apart at a predetermined interval. The number of resonators 104 may be set to an appropriate number according to the performance of the communication system using the high frequency cavity filter 100 and the frequency selectivity required by the communication system.

In an exemplary embodiment, the resonator 104 may be provided integrally with the filter body 102. Specifically, a resonator hole 117 may be provided in the base plate 102a at a position corresponding to the resonator 104. The resonator 104 may be provided to protrude downward from the edge of the resonator hole 117 of the base plate 102a. That is, the resonator 104 may be provided downward from the filter body 102. In an exemplary embodiment, the resonator 104 may have a cylindrical shape, but the shape is not limited thereto.

The inside of the resonator 104 may be provided in an empty form. Accordingly, the inside of the resonator 104 may be provided in communication with the outside through the resonator hole 117. A tuning part 119 may be provided at an end of the resonator 104. The tuning unit 119 may be provided to tune the resonant frequency of the resonator 104.

The frequency adjusting unit 121 may be coupled to the resonator 104. 5 is a view showing a state in which the frequency adjusting unit 121 is coupled to the resonator 104 in the high frequency cavity filter according to an embodiment of the present invention.

Referring to FIG. 5, at an end of the resonator 104, a frequency adjustment coupling portion 104a to which a frequency adjustment portion 121 is inserted and coupled may be provided. The frequency adjustment coupling part 104a may have an outer diameter smaller than the outer diameter of the resonator 104 body. The inner diameter of the frequency control coupling portion 104a may be provided equal to the inner diameter of the resonator 104 body. Accordingly, a stepped step may be formed at the boundary between the main body of the resonator 104 and the frequency adjustment coupling portion 104a.

The frequency adjustment unit 121 may be coupled to an end of the resonator 104. The frequency control unit 121 may be provided to face the cover unit 106 in a state coupled to the end of the resonator 104. The frequency adjusting unit 121 may serve to adjust the resonant frequency of the resonator 104 to decrease as the capacitance value is increased by increasing the area facing the cover unit 106. Accordingly, the overall size (height) of the high frequency cavity filter 100 can be reduced. In addition, due to the frequency adjusting unit 121, the capacitance value is greater than the inductance value of the resonator 104, thereby improving the spurious characteristics.

The frequency control unit 121 may include a frequency control body 121a and a pinch coupling unit 121b. The frequency control body 121a may be provided to face the cover part 106. In an exemplary embodiment, the frequency control body 121a may be formed of a circular plate, but the shape is not limited thereto, and may be formed in various shapes (eg, a square, etc.). An insertion hole 121a-1 may be provided in the frequency control body 121a. The insertion hole 121a-1 may be provided in the center of the frequency control body 121a.

The frequency control body 121a may have a larger diameter than the outer diameter of the resonator 104. In addition, the frequency control body 121a may be provided parallel to the cover part 106. Accordingly, the resonator 104 may increase an area facing the cover part 106 through the frequency adjusting part 121.

The pinching coupling portion 121b may be provided to protrude toward the resonator 104 from the edge of the insertion hole 121a-1. The pinching coupling portion 121b may be pinched to the outside of the frequency adjusting coupling portion 104a. The inner diameter of the pinching coupling portion 121b may be provided smaller than the outer diameter of the frequency adjusting coupling portion 104a. Accordingly, by pressing the frequency adjustment unit 121, the pinching coupling portion 121b may be pinched to the outside of the frequency adjustment coupling portion 104a.

On the other hand, the frequency control body 121a of the frequency control unit 121 coupled to the resonator 104 (ie, the first and last resonators) adjacent to the input terminal unit 131 and the output terminal unit 133 is The diameter may be larger than the frequency control body 121a of the frequency control unit 121 coupled to the resonator 104 (ie, a resonator positioned between the first and last resonators).

Hereinafter, the frequency adjusting unit 121 coupled to the input terminal unit 131 and the output terminal unit 133 and the resonator 104 adjacent to the output terminal unit 133 may be referred to as a first type of frequency adjusting unit. In addition, the frequency adjusting unit 121 coupled to the resonator 104 other than that may be referred to as a second type of frequency adjusting unit.

The cover part 106 may be provided under the filter body 102. The cover part 106 may be coupled to the filter body 102 at the lower portion of the filter body 102. As the cover part 106 is coupled to the filter body 102, a cavity is formed in the filter body 102 and the cover part 106. The cover part 106 may be made of a conductive material.

The cover part 106 may be provided to cover the open lower surface of the filter body 102. In an exemplary embodiment, the cover part 106 may be formed in a plate shape. A plurality of first coupling holes 106a may be provided on the edge of the cover part 106. A plurality of first coupling holes 106a may be provided along the edge of the cover part 106 to be spaced apart from each other. The first coupling hole 106a may be provided corresponding to the press protrusion 111a.

The cover part 106 may be coupled to the filter body 102 through a press. Specifically, in a state in which the cover part 106 is located under the filter body 102 so that the first coupling hole 106a of the cover part 106 corresponds to the press protrusion 111a of the filter body 102, respectively. When the cover part 106 is pushed up toward the filter body 102, the press protrusion 111a is inserted into the first coupling hole 106a to protrude toward the opposite surface of the cover part 106. At this time, when the pressing process is performed, the protruding press protrusion 111a is pressed and pressed against the opposite surface of the cover part 106, so that a firm coupling between the cover part 106 and the filter body 102 is achieved.

In addition, a second coupling hole 106b may be provided in the cover part 106. The second coupling hole 106b may be provided to correspond to the coupling protrusion 115 of the partition wall 113. Here, as the coupling protrusion 115 is fitted into the second coupling hole 106b, coupling between the cover portion 106 and the filter body 102 is made.

In addition, a first terminal insertion hole 106c and a second terminal insertion hole 106d may be provided in the cover part 106, respectively. The input terminal portion 131 may be inserted into the first terminal insertion hole 106c and exposed downward. The output terminal portion 133 may be inserted into the second terminal insertion hole 106d and exposed downward.

Here, diameters of the first terminal insertion hole 106c and the second terminal insertion hole 106d may be provided larger than the diameters of the input terminal portion 131 and the output terminal portion 133, respectively. Therefore, the input terminal portion 131 and the output terminal portion 133 are inserted into the first terminal insertion hole 106c and the second terminal insertion hole 106d, respectively, and the first terminal insertion hole 106c and the second terminal It may be spaced apart from the insertion hole (106d), respectively.

The substrate 108 may be provided under the cover part 106. The substrate 108 may be provided with a first connection portion 108a electrically connected to the input terminal portion 131 and a second connection portion 108b electrically connected to the output terminal portion 133, respectively.

Meanwhile, the high frequency cavity filter 100 may further include a notch filter unit 123. The notch filter unit 123 may be provided to remove a frequency band adjacent to the used frequency band of the high frequency cavity filter 100. That is, the notch filter unit 123 uses the frequency band of the high frequency cavity filter 100 in the signal of the high frequency cavity filter 100 in order to prevent the signal of the high frequency cavity filter 100 from interfering with the signal in the adjacent frequency band. It may serve to remove the frequency band adjacent to. The notch filter unit 123 may be mounted inside the filter body 102.

6 is a perspective view illustrating a resonator of a high frequency cavity filter according to an embodiment of the present invention, and FIG. 7 is a diagram illustrating a method of tuning a resonator through a tuning unit in a high frequency cavity filter according to an embodiment of the present invention. FIG. 7A is a diagram showing a state before tuning, and FIG. 7B is a diagram illustrating a state after tuning.

6 and 7, a tuning part 119 may be provided at an end of the resonator 104. The tuning unit 119 may be provided at an end of the resonator 104 to be spaced apart from the inner wall of the resonator 104. That is, the tuning unit 119 may have a diameter smaller than the inner diameter of the resonator 104.

The tuning unit 119 may be connected to the resonator 104 through the tuning connection unit 141. A plurality of tuning connection parts 141 may be provided to be spaced apart from each other. In an exemplary embodiment, the tuning connection part 141 may be provided at intervals of 120 degrees to connect the tuning part 119 to the inner wall of the resonator 104, but is not limited thereto. In this case, the tuning part 119 is connected to the inner wall of the resonator 104 through the tuning connection part 141 at three points, and a gap is formed between the inner wall of the resonator 104 at other parts.

Here, when the tuning screw 50 is inserted through the resonator hole 117 and then the tuning part 119 is pressed, the tuning part 119 extends downward due to the toughness of the metal. Accordingly, the distance between the tuning unit 119 and the cover unit 106 is narrowed, so that the capacitance value of the resonator 104 can be adjusted.

According to the disclosed embodiment, as the tuning unit 119 is provided at the end of each resonator 104, the number of resonators 104 and the number of tuning units 119 are the same, so that the time required for tuning can be reduced. There will be. That is, the conventional high frequency cavity filter has a tuning unit that is approximately twice the number of resonators, so it takes a lot of time for tuning, but in the disclosed embodiment, the number of resonators and the number of tuning units are the same. You can save time.

In addition, since the inside of the resonator 104 is empty and tuning is performed by pressing the tuning unit 119 through the tuning screw 50, the appearance of the resonator 104 such as scratches is not affected. In addition, there is a gap between the resonator 104 and the tuning unit 119, so that condensation due to moisture disappears.

8 is a graph showing an S parameter of a high frequency cavity filter according to an embodiment of the present invention. . Here, it is shown that the frequency band used of the high frequency cavity filter 100 is 3.6 to 3.7 GHz.

Referring to FIG. 8, it can be seen that the high frequency cavity filter 100 exhibits a notch characteristic in a band adjacent to the 3.6 GHz and 3.7 GHz bands that are used frequency bands. This is a result of causing the notch filter unit 123 to exhibit a notch characteristic in the vicinity of the frequency band used of the high frequency cavity filter 100. Through this, the high frequency cavity filter 100 can prevent interference with signals in adjacent frequency bands.

9 is a graph showing unnecessary waves of a high frequency cavity filter according to an embodiment of the present invention.

Referring to FIG. 9, it can be seen that the high frequency cavity filter 100 has an unwanted wave at 4.8 times or more of the center frequency (ie, 3.6 GHz). That is, in general, the unwanted wave is generated at twice the center frequency, but in the disclosed embodiment, the capacitance becomes larger than the inductance of the resonator 104 due to the frequency control unit 121, so that it is 4.8 times or more of the center frequency (that is, 3.6 GHz). The spurious wave appears in, and as a result, the spurious characteristics are improved.

10 is a schematic diagram showing a manufacturing system and manufacturing sequence of a high frequency cavity filter according to an embodiment of the present invention.

Referring to FIG. 10, the high frequency cavity filter manufacturing system 200 includes a first assembly device 202, a second assembly device 204, a third assembly device 206, a printer device 208, and a fourth assembly device. 210, a reflow device 212, a cutting device 214, and a tuning device 216 may be included. In the high frequency cavity filter manufacturing system 200, movement between devices may be performed through a conveyor or the like.

The first assembly device 202 may couple the frequency control unit 121 to the resonator 104 of the filter body 102 (①). Specifically, the filter body 102 and the frequency control unit 121 may be respectively introduced into the first assembly device 202. Hereinafter, it will be described as an example that six resonators 104 are formed in the filter body 102.

The first assembly device 202 includes a first input unit (not shown) into which the filter body 102 is injected, a second input unit (not shown) into which the frequency control unit 121 is injected, and the filter body 102 It may include a coupling unit (not shown) for fitting and coupling the frequency adjustment unit 121. Here, the second input unit (not shown) may align the direction of the input frequency control unit 121.

That is, the second input unit (not shown) is a coupling unit (not shown) by aligning the direction of the frequency adjusting unit 121 input so that the pinching unit 121b of the frequency adjusting unit 121 faces the resonator 104 ) Can be provided. When the second input unit (not shown) is located in the opposite direction to the resonator 104, the pinch coupling portion 121b of the frequency adjustment portion 121 is fitted in the direction of the frequency adjustment portion 121 Can be changed to face the resonator 104. The second input unit (not shown) may provide one set (ie, six) of the frequency adjustment unit 121 as a coupling unit (not shown).

In this case, the second input unit (not shown) may be provided as a coupling unit (not shown) by arranging the frequency adjusting units 121 in a line according to the type of the frequency adjusting unit 121. In an exemplary embodiment, when the second input unit (not shown) provides one set (that is, six) of the frequency control unit 121 as a combination unit (not shown), the first type of frequency control unit ( 121) is disposed in the first and last (ie, sixth), and the second type of frequency adjusting unit 121 is disposed in the second, third, fourth, and fifth to form a coupling unit (not shown). Can provide.

The coupling unit (not shown) may fit and couple the frequency control unit 121 of one set to each resonator 104 of the filter body 102. The coupling part (not shown) may be fitted by pressing the coupling part 121b of the frequency adjusting part 121 of one set into the end of the resonator 104. 11 is a photograph showing a state in which a set of frequency control units 121 are fitted to each resonator 104 of the filter body 102 in the disclosed embodiment.

The second assembly device 204 may couple the notch filter unit 123 inside the filter body 102 (②). Specifically, the second assembly device 204 may receive the filter body 102 to which the frequency control unit 121 is coupled from the first assembly device 202. The second assembly device 204 may include a third input unit (not shown) into which the notch filter unit 123 is injected.

In an exemplary embodiment, the second assembly device 204 positions the notch filter unit 123 on the inner side of the filter body 102 and then press-fits the notch filter unit 123 and the filter body 102. Can be combined. 12 is a photograph showing a state in which the notch filter unit 123 is coupled to an inner side of the filter body 102 in one disclosed embodiment.

The third assembly device 206 may couple the cover part 106 to the filter body 102 (③). Specifically, the third assembly device 206 may be supplied with the filter body 102 to which the notch filter unit 123 is coupled from the second assembly device 204. The third assembly device 206 may include a fourth input unit (not shown) into which the cover unit 106 is inserted.

In an exemplary embodiment, the third assembly device 206 is in a state in which the cover part 106 is disposed on the upper part of the filter body 102, and the cover part 106 is pressed into the filter body 102 and the cover part ( 106) can be combined. The third assembly device 206 allows the first coupling hole 106a of the cover part 106 to correspond to the press protrusion 111a of the filter body 102, and the second coupling hole 106b of the cover part 106 ) May be disposed to correspond to the coupling protrusion 115 of the filter body 102 and then press-fitting may be performed. 13 is a photograph showing a state in which the cover part 106 is coupled to the filter body 102 in the disclosed embodiment.

The printer device 208 can apply (print) solder cream to the substrate 108 (④). In an exemplary embodiment, when a substrate tray including a plurality of substrates 108 is inserted, the printer device 208 may apply solder cream to a predetermined portion of each substrate 108, respectively. 14 is a photograph showing the substrate tray 152 according to the disclosed embodiment, and FIG. 15 is a photograph showing a state in which solder cream is applied to each substrate 108 of the substrate tray 152 in the disclosed embodiment to be.

14 and 15, the substrate tray 152 may include eight substrates 108. In the substrate tray 152, eight substrates 108 may be arranged in two rows. Here, as an example, eight substrates 108 are arranged on the substrate tray 152, but the present invention is not limited thereto, and the substrate tray 152 may include a variety of other substrates 108. One or more markers 154 may be provided on the substrate tray 152. For example, the markers 154 may be provided at each corner of the substrate tray 152. The marker 154 may be for the printer device 208 to recognize the position and direction of the substrate tray 152.

The fourth assembly device 210 may mount the substrate 108 on the filter body 102 to which the cover part 106 is coupled (⑤). The fourth assembly device 210 may receive the filter body 102 on which the cover part 106 is mounted from the third assembly device 206. In addition, the fourth assembly device 210 may receive a substrate tray 152 (ie, a substrate tray 152 including a plurality of substrates 108 to which solder cream is applied) from the printer device 208.

The fourth assembly device 210 may arrange the filter body 102 corresponding to each substrate 108 of the substrate tray 152. That is, the fourth assembly device 210 may arrange eight filter bodies 102 corresponding to each of the substrates 108 of the substrate tray 152. The fourth assembly device 210 may mount the filter body 102 on each substrate 108 of the substrate tray 152. At this time, the cover part 106 of the filter body 102 may be opposed to the substrate 108. 16 is a photograph showing a state in which the filter body 102 is mounted on each substrate 108 on the substrate tray 152 according to the disclosed embodiment.

The reflow device 212 may perform reflow processing of the portion of each substrate 108 to which the solder cream is applied (⑥). The reflow device 212 may receive the substrate tray 152 in which the filter body 102 is mounted on each of the substrates 108 from the fourth assembly device 210. The reflow device 212 may perform a reflow treatment on a portion of the substrate tray 152 to which the solder cream is applied to bond each of the substrates 108 and the filter body 102. Here, as the substrate 108 and the filter body 102 are bonded to each other, the high frequency cavity filter 100 is formed. At this time, a plurality of high frequency cavity filters 100 are formed on the substrate tray 152.

The cutting device 214 may cut each high frequency cavity filter 100 in the substrate tray 152 (⑦). The cutting device 214 may receive a substrate tray 152 to which each of the substrates 108 and the filter body 102 are bonded from the reflow device 212. The cutting device 214 may cut each high frequency cavity filter 100 in the substrate tray 152 and separate it into individual high frequency cavity filters 100. 17 is a photograph showing the high frequency cavity filter 100 cut by the cutting device 214 in the disclosed embodiment.

The tuning device 216 may tune the tuning unit 119 of the high frequency cavity filter 100 (⑧). In an exemplary embodiment, a plurality of tuning devices 216 may be provided. Each tuning device 216 may receive an individual high frequency cavity filter 100 from the cutting device 214. The tuning device 216 may insert the tuning screw 50 through the resonator hole 117 and then press the tuning unit 119 to perform a tuning operation.

Although the exemplary embodiments of the present invention have been described in detail above, those of ordinary skill in the art to which the present invention pertains will understand that various modifications may be made to the above-described embodiments without departing from the scope of the present invention. . Therefore, the scope of the present invention is limited to the described embodiments and should not be determined, and should not be determined by the claims to be described later, but also by those equivalents to the claims.

100: high frequency cavity filter
102: filter body
102a: base plate
102b: first side plate
102c: second side plate
102d: front plate
102e: back plate
104: resonator
104a: frequency control coupling unit
106: cover
106a: first coupling hole
106b: second coupling hole
106c: first terminal insertion hole
106c: second terminal insertion hole
108: substrate
108a: first connection
108b: second connection
111: frame part
111a: press projection
113: bulkhead
113a: Windows
115: coupling protrusion
117: resonator hole
119: tuning unit
121: frequency control unit
121a: frequency control body
121a-1: insertion hole
121b: pinch joint
123: notch filter unit
131: input terminal part
133: output terminal part
141: tuning connection
200: high frequency cavity filter manufacturing system
202: first assembly device
204: second assembly device
206: third assembly device
208: printer device
210: fourth assembly device
212: reflow device
214: cutting device
216: tuning device

Claims (13)

A system for manufacturing a high frequency cavity filter including a filter body made of a conductive material and a plurality of resonators protruding from the resonator hole provided in the base plate of the filter body to the inside of the filter body,
And a first assembly device for coupling a frequency adjusting unit to each resonator of the filter body,
The first assembly device,
A first input unit into which the filter body is inserted;
A second input unit into which the frequency adjustment unit is input; And
And a coupling part for coupling a frequency adjusting part input from the second input part to each resonator of the filter body input through the first input part,
The frequency control unit includes an insertion hole into which an end of the resonator is inserted, a frequency control body having a diameter larger than an outer diameter of the resonator, and a pinch coupling unit protruding from an edge of the insertion hole,
The second input unit,
Aligning the direction of the frequency adjusting part so that the pinching coupling part of the frequency adjusting part faces the resonator,
The coupling portion, the high frequency cavity filter manufacturing system for fitting by pressing the coupling portion to the end of the resonator.
delete The method according to claim 1,
The second input unit,
A high frequency cavity filter manufacturing system, provided with the coupling part as the number of frequency adjusting parts equal to the number of resonators of the filter body, and arranged to arrange an arrangement order according to the type of the frequency adjusting part.
The method of claim 3,
The second input unit,
A system for manufacturing a high frequency cavity filter, wherein the first type of frequency adjusting unit is disposed first and last, and the second type of frequency adjusting unit is disposed between the first and last to provide the coupling unit.
The method according to claim 1,
The high frequency cavity filter manufacturing system,
The frequency control unit receiving the filter body coupled to the resonator, further comprising a second assembly device for coupling a notch filter unit to the inner side of the filter body, high frequency cavity filter manufacturing system.
The method of claim 5,
The high frequency cavity filter manufacturing system,
A system for manufacturing a high frequency cavity filter, further comprising a third assembly device receiving the filter body to which the notch filter part is coupled, and coupling the cover part to the filter body.
The method of claim 6,
The third assembly device,
The first coupling hole of the cover part is arranged to correspond to the press protrusion of the filter body, and the second coupling hole of the cover part is arranged to correspond to the coupling protrusion of the filter body to perform a press-fitting process,
The press protrusion is provided in a plurality of spaced apart from each other along the rim of the filter body,
The coupling protrusion extends and protrudes from an end portion of a partition wall provided between the resonator and the resonator in the filter body.
The method of claim 6,
The high frequency cavity filter manufacturing system,
A system for manufacturing a high frequency cavity filter, further comprising a printer device receiving a substrate tray having a plurality of substrates and applying solder cream to a predetermined portion of each of the substrates.
The method of claim 8,
The high frequency cavity filter manufacturing system,
A system for manufacturing a high frequency cavity filter, further comprising a fourth assembly device for mounting a filter body to which the cover part is coupled to each substrate on the substrate tray.
The method of claim 9,
The high frequency cavity filter manufacturing system,
A system for manufacturing a high frequency cavity filter, further comprising a reflow device for bonding each substrate and the filter body by performing a reflow treatment on a portion of the substrate tray to which the solder cream is applied.
The method of claim 10,
The high frequency cavity filter manufacturing system,
A system for manufacturing a high frequency cavity filter further comprising a cutting device for cutting and separating the high frequency cavity filters to which the substrate and the filter body are bonded in the substrate tray.
The method of claim 11,
An end of the resonator is provided with a tuning part spaced apart from the inner wall of the resonator and connected to the resonator through a tuning connection part,
The high frequency cavity filter manufacturing system,
A system for manufacturing a high frequency cavity filter, further comprising a tuning device for inserting a tuning screw through a resonator hole of the high frequency cavity filter and pressing the tuning unit to extend downward.
A method of manufacturing a high frequency cavity filter comprising a filter body made of a conductive material and a plurality of resonators protruding from the resonator hole provided in the base plate of the filter body to the inside of the filter body,
Coupling a frequency adjusting unit to each resonator of the filter body in a first assembly device;
Coupling a notch filter unit to an inner side of the filter body in a second assembly device;
Coupling the cover to the filter body in a third assembly device;
Applying a solder cream to a predetermined portion of each substrate in a substrate tray including a plurality of substrates in a printer apparatus;
Mounting the filter body on each substrate on the substrate tray in a fourth assembly device;
Performing a reflow treatment on a portion of the substrate tray to which the solder cream is applied, and bonding each substrate to the filter body in a reflow device;
Cutting and separating a high frequency cavity filter to which the substrate of the substrate tray and the filter body are bonded by a cutting device; And
A method of manufacturing a high frequency cavity filter comprising the step of tuning a tuning unit provided at an end of a resonator of the high frequency cavity filter in a tuning device.

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