KR102172211B1 - Electronic element module and package for the same - Google Patents

Abstract

An electronic device module according to an embodiment of the present invention includes a housing for mounting the electronic device; A module input terminal formed on one surface of the housing and connected to the input terminal of the electronic device; And a module output terminal formed on the other surface disposed in a direction opposite to the one surface of the housing and connected to the output terminal of the electronic device.

Description

Electronic device module and electronic device module package {ELECTRONIC ELEMENT MODULE AND PACKAGE FOR THE SAME}

The present invention relates to an electronic device module and an electronic device module package, and more particularly, to an electronic device module and an electronic device module package for simplifying an optical circuit configuration by modularizing an optical device.

In the case of experiments using various types of optical fiber-based sensors, optical devices such as optical switches, optical wavelength dividers, optical couplers, and circulators are connected together and used according to the characteristics of physical quantities to be measured in a laboratory environment or on an external site.

According to the prior art, since an optical device is sold in a single unit form, when wiring is connected to an optical device in a single unit form, a problem occurs in that the interconnections are complicatedly entangled as shown in FIG. 1. Referring to FIG. 1, it can be seen that wirings for connecting optical devices are intertwined and arranged.

In this case, it is difficult to easily grasp the connection status of which optical device's input is connected to the output of which optical device, and when trying to determine the cause of a problem during an experiment, it may be a problem of analysis.

In addition, as the wiring is complicatedly entangled, there is always a risk of damage due to the material characteristics of the optical device.

In addition, when the wires are separated after the use of the optical device is terminated, the wires are twisted or are already entangled, which can cause many difficulties in management and use in terms of the experimenter's management of the experimental equipment.

Korean Patent Registration No. 10-1436787 (announcement date: 2014.09.11)

The present invention is to solve the problems of the prior art described above, by mounting optical devices formed with different standards or specifications in a housing of the same standard to modularize, thereby improving device management and experimentation convenience for experimenters. There is a purpose.

As a technical means for achieving the above technical problem, an electronic device module according to an embodiment of the present invention includes: a housing for mounting the electronic device; A module input terminal formed on one surface of the housing and connected to the input terminal of the electronic device; And a module output terminal formed on the other surface disposed in a direction opposite to the one surface of the housing and connected to the output terminal of the electronic device.

In addition, the number of module input terminals and module output terminals is formed in different numbers depending on the type of electronic device mounted in the housing.

In addition, the number of each of the module input terminals and the module output terminals is formed to correspond to the number of input terminals and output terminals of the electronic device mounted in the housing.

In addition, the number of the module input terminals and the module output terminals is formed in a plurality of the same number as the number of input terminals or the number of output terminals of the electronic device mounted in the housing, and is mounted in the housing. Each of the input terminals and output terminals of the electronic device is connected to some module input terminals and some module output terminals among the plurality of module input terminals and the plurality of module output terminals.

Further, the module input terminal and the module output terminal include an indicator that is turned on when the input terminal and the output terminal of the electronic device are connected to the module input terminal and the module output terminal.

In addition, the housing may have a rectangular parallelepiped shape.

In addition, the housing includes a circuit diagram of the mounted electronic device displayed on an upper surface of between the one surface and the other surface.

On the other hand, an electronic device module package according to another embodiment of the present invention includes at least one electronic device module according to any one of claims 1 to 7; And a case for mounting the at least one electronic device module through the opening space.

Further, the at least one electronic device module is arranged in the case such that, when there are two or more electronic device modules, a module input terminal of one electronic device module is adjacent to a module output terminal of a neighboring electronic device module.

In addition, the electronic device module package includes a module input terminal of a neighboring electronic device module so that an output signal of an electronic device included in an electronic device module is input to an input terminal of an electronic device included in a neighboring electronic device module. And a wire connecting the module output terminal and the.

In addition, the electronic device module package includes a plurality of opening spaces corresponding to a standard of a housing of each electronic device module so that each electronic device module is slide-inserted.

In addition, the electronic device module package is formed of a material whose upper surface can be erased through an erase means after any character or picture is written through a writing means.

In addition, the electronic device module package is formed such that a circuit diagram showing a connection structure of electronic devices included in the electronic device module is displayed on an upper surface.

In the present invention, the optical device is modularized and the modules are packaged, so that an experimenter can connect wires to only one object (ie, electronic device module package), and connection wires between neighboring optical devices can be short and easily connected. Through this, since the wiring connection structure between each electronic device module is very simple, the efficiency of configuring an optical circuit for various measurements can be improved. In addition, not only the experimenter who made the optical circuit, but also the experimenter who saw the optical circuit for the first time can easily understand the optical circuit intuitively, and can easily change the connection structure of the intermediate optical element in the optical circuit. Through this, the connection efficiency of the optical sensor for field application can be greatly improved.

1 is a photograph showing an optical device experiment environment according to the prior art.
2 is an equivalent circuit diagram of optical devices for an optical switch, an optical wavelength divider, a circulator, and an optical coupler.
3A and 3B are perspective views of an electronic device module according to an embodiment of the present invention.
4A is a front perspective view of an electronic device module package in which a plurality of electronic device modules are mounted according to an embodiment of the present invention.
4B is a rear perspective view of the electronic device module package of FIG. 4A.
5 is a plan view of an electronic device module package to which interconnections between modules are connected according to an embodiment of the present invention.
6 is an example of a circuit diagram formed on an upper surface of a case of an electronic device module package according to an embodiment of the present invention.
7A is a conceptual diagram illustrating an example of an optical circuit configuration through an electronic device module package according to an embodiment of the present invention.
7A is a conceptual diagram illustrating another example of an optical circuit configuration through an electronic device module package according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those of ordinary skill in the art can easily implement the present invention. However, the present invention may be implemented in various different forms and is not limited to the embodiments described herein. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and similar reference numerals are assigned to similar parts throughout the specification.

Throughout the specification, when a part is said to be "connected" to another part, this includes not only "directly connected" but also "electrically connected" with another element interposed therebetween. . In addition, when a part "includes" a certain component, it means that other components may be further included rather than excluding other components unless specifically stated to the contrary.

First, an electronic device referred to in an embodiment of the present invention refers to an electronic component formed in an arbitrary standard, and may be, for example, a small electronic component such as various sensors, switches, and couplers. In particular, the electronic device may be an optical device. For example, an optical device may be an optical switch, an optical coupler, a circulator, or an optical wavelength divider.

Each optical device can be represented by a simple equivalent circuit as shown in FIG. 2. Specifically, the optical switch is an optical device that changes the direction of an optical signal through spatial division or wavelength division, and may be configured to have one input terminal and a plurality of output terminals. The optical wavelength divider is an element that divides one optical wavelength into several optical wavelengths, and may be configured to have one input terminal and a plurality of output terminals. The circulator is an element that outputs an optical signal inputted through any one port to a neighboring port, and the neighboring port may be a port disposed adjacent to the clockwise direction. The circulator has three ports, each of which can perform input and output functions. An optocoupler is an element that distributes and propagates one light into two or more, or, conversely, combines two or more light propagated into one, and may consist of, for example, one input terminal and a plurality of output terminals. . Alternatively, on the contrary, it may be composed of a plurality of input terminals and one output terminal.

These optical devices are often used in experiment and test environments, but can also be used in the field of using optical cables. The optical elements are connected to each other through wiring. According to an embodiment of the present invention, the optical elements are modularized to simplify wiring connections between optical elements and to facilitate identification by a user.

3A and 3B, an electronic device module 100 according to an embodiment of the present invention includes an electronic device 110, a housing 120, a module input terminal 130, and a module output terminal 140. do.

The electronic device 110 is mounted in the housing 120. The electronic device 110 may be any electronic component as described above.

The housing 120 is a structure standardized to a specific size in which the electronic devices 110 formed in a predetermined standard are embedded. The housing 120 may include an internal structure for mounting the electronic device 110. In addition, the internal structure includes a generous space in which the electronic device 110 can be mounted so that the electronic device 110 of different sizes can be accommodated, but the electronic device 110 does not move within the housing 120. It may further include a fixing portion to be fixed.

The housing 120 may be formed to a certain standard. That is, the housings 120 on which different electronic devices 110 are mounted may all be formed in the same standard. In this case, the housing 120 may be formed in a hexahedral shape. However, it is not necessarily limited thereto, and may be formed in various polyhedral shapes such as a rectangular parallelepiped and a regular cube.

The module input terminal 130 is formed on one surface of the housing 120 and is electrically connected to the input terminal of the electronic device 110 in the housing 120. Accordingly, when the external wiring 220 is connected to the module input terminal 130, the module input terminal 130 may allow the electronic device 110 and the wiring 220 to be connected to each other.

The module output terminal 140 is formed on the other surface of the housing 120 in which the module input terminal 130 is formed, and is electrically connected to the output terminal of the electronic device 110 in the housing 120. . Accordingly, when the external wiring 220 is connected to the module output terminal 140, the module output terminal 140 may allow the electronic device 110 and the wiring 220 to be connected to each other. On the other hand, the module output terminal 140 is preferably formed on the other surface disposed in the opposite direction of the housing 120, but may be formed on the other surface of the housing 120 as necessary.

The module input terminal 130 and the module output terminal 140 may be formed in different numbers depending on the type of the electronic device 110 mounted in the housing 120. For example, when the optical switch, optical wavelength divider, and optical coupler shown in FIG. 2 are mounted in the housing 120, the module input terminal 130 and the module output terminal 140 of the electronic device module 100 are shown in FIG. 3A. It can be formed of one or four, respectively. Alternatively, when the circulator shown in FIG. 2 is mounted in the housing 120, the electronic device module 100 input terminal and the module output terminal 140 may be formed of eight or four, respectively, as shown in FIG. 3B. . That is, the module input terminal 130 and the module output terminal 140 may be formed to correspond to the number of input terminals and output terminals of the electronic device 110, respectively.

In addition, the number of module input terminals 130 and module output terminals 140 may be the same. If the module input terminal 130 and the module output terminal 140 of each electronic device module 100 are manufactured differently for each type of the mounted electronic device 110, the manufacturing process becomes complicated and the product cost increases. As a result, the terminals of all electronic device modules 100 may always be formed to have the same number. In this case, the module input terminal 130 and the module output terminal 140 are formed in a sufficient number so that the number of input terminals or the number of output terminals of the electronic device 110 mounted in the housing 120 is equal to or larger. desirable. In this case, each of the input terminals and output terminals of the electronic device 110 is limited to only some module input terminals 130 and some module output terminals 140 of the plurality of module input terminals 130 and the plurality of module output terminals 140. Can be connected.

In the above case, the user should be able to check where the input terminal or output terminal of the electronic device 110 connected to some of the plurality of module input terminals 130 or the plurality of module output terminals 140 is located. It will be possible to easily connect the wiring 220 between modules. Therefore, each module input terminal 130 and the module output terminal 140, when the input terminal and the output terminal of the electronic device 110 is connected to the module input terminal 130 and the module output terminal 140, the indicator that is turned on. Can include. For example, the indicator light may be formed to surround the outer peripheral surface of the module input terminal 130 or the module output terminal 140, but is not limited thereto.

Hereinafter, an electronic device module package 200 according to an embodiment of the present invention will be described in detail with reference to FIGS. 4A, 4B, and 5.

The electronic device module package 200 includes at least one electronic device module 100, a case 210, and a wiring 220.

The case 210 may be formed to include an opening space for mounting at least one electronic device module 100. For example, as shown in FIGS. 4A and 4B, the case 210 includes a plurality of opening spaces corresponding to the standard of the housing 120 of each electronic device module 100 so that each electronic device module 100 is slide inserted. It may be formed to include. Alternatively, the case 210 may be formed to include one opening space through which a plurality of electronic device modules 100 can be mounted at a time. Alternatively, the opening space may be formed to penetrate the rectangular parallelepiped case 210 in the form of a hole as shown in FIGS. 4A and 4B, but in the form of FIGS. 4A and 4B, the upper surface of each opening space is formed in an open groove shape. It could be. In the case of being formed in a groove shape, the electronic device module 100 is not inserted in a slide manner, but the module is inserted from the top to the bottom. Therefore, from the user's point of view, the inside of the case 210 of the electronic device module 100 Mounting can also be made more convenient.

In FIGS. 4A and 4B, an optical switch module, an optical wavelength divider module, a circulator module, and an optical coupler module are mounted in the case 210. Each of the electronic device modules 100 is formed in different numbers according to the characteristics of the optical device on which the module input terminal 130 and the module output terminal 140 are mounted. Therefore, the shape of the module input terminal 130 and the module output terminal 140 when viewed from the front and the rear of the electronic device module package 200 is different from each other.

At this time, in order to achieve the convenience of connecting the wiring 220 between the electronic device modules 100, the electronic device modules 100 are provided with the module input terminal 130 of the electronic device module 100 as shown in FIG. It is arranged in the case 210 so as to be adjacent to the module output terminal 140 of the neighboring electronic device module 100. In simple terms, input terminals and output terminals of each electronic device module 100 arranged in the electronic device module package 200 are arranged in a zigzag form. In addition, the wiring 220 is so that the output signal of the electronic device 110 included in any one electronic device module 100 is input to the input terminal of the electronic device 110 included in the neighboring electronic device module 100. , Connect the module input terminal 130 and the module output terminal 140 of the neighboring electronic device module 100. Accordingly, it is sufficient if the length of the wiring 220 is formed to connect the terminals of the electronic device module 100 adjacent to each other. When each electronic device module 100 is connected with the short wiring 220 as described above, entanglement of the wiring 220 may be eliminated. Accordingly, analysis of the cause of a problem or management of the wiring 220 through an experimenter's test can be performed conveniently and quickly.

Meanwhile, as an additional embodiment, referring to FIG. 6, the electronic device module package 200 may be formed on an upper surface of the case 210 or other arbitrary surface by a user so that a circuit diagram can be drawn and erased through a writing means. It may be formed of a material that can be erased through an erasing means after the characters or pictures of For example, it may be formed of an acrylic material. In addition, as it is formed of an erasable material, when another electronic device module 100 is disposed in the case 210, the experimenter immediately erases the previously drawn circuit diagram and based on the currently mounted electronic device module 100 You can draw the schematic again. Alternatively, the upper surface of the case 210 may be manufactured in a state in which a circuit diagram of the electronic device 110 already mounted in the case 210 is engraved.

That is, as shown in FIG. 6, when the circuit diagram can be displayed on the upper surface of the electronic device module package 200, the experimenter sees only the upper surface of the electronic device module package 200, and what electronic device 110 is disposed therein. Whether or not, when considering the characteristics of each electronic device 110, it is easy to grasp at a glance what kind of equivalent connection relationship the entire circuit has. In addition, when a user other than the first experimenter configuring the circuit diagram sees the electronic device module package 200, it is possible to provide easy circuit information at a glance. In addition, when an experimenter manages with several electronic device module packages 200, when it is necessary to grasp the contents of any one electronic device module package 200, it is possible to easily grasp the circuit configuration only by looking at the circuit diagram. .

Meanwhile, the upper surface of each electronic device module 100 may also be formed of a material that can be erased after being written by an experimenter. Alternatively, each electronic device module 100 may be manufactured in a state in which the circuit diagram of the mounted electronic device 110 is already engraved on the upper surface. In this case, the upper surface of the case 210 is preferably formed of a transparent material to show the circuit diagram engraved on the electronic device module 100 to the experimenter, or is formed to be open to the area in which the electronic device module 100 is mounted. Do.

Hereinafter, an example of application of an embodiment of the present invention will be described in detail with reference to FIGS. 7A and 7B.

7A is an optical circuit that performs measurement through a total of 8 sensors (i.e., 2 accelerometer sensors, 5 strain gauge sensors, 2 temperature sensors, and 1 displacement sensor) to analyze the behavior of a railroad bridge when passing a railroad vehicle. A configuration example is shown. Specifically, the electronic device module package 200 mounts an optical switch module, a circulator module, and two optical coupler modules from the left. First, the light source is connected to the module input terminal 130 of the optical switch module disposed on the front of the package 200 to input an optical signal. At the rear of the package 200, two of the four module output terminals 140 of the optical switch module and two of the eight module input terminals 130 of the neighboring circulator module are connected to each other by a wiring 220. In addition, the other two module input terminals 130 of the circulator module are connected through a detector and a wire 220. Subsequently, on the front surface of the package 200, the two module output terminals 140 of the circulator module are connected through the module input terminals 130 and the wiring 220 of the two optocoupler modules, respectively. Finally, the four module output terminals 140 of each optical coupler are respectively connected to a sensor, so that an optical signal passing through an optical switch, a circulator, and an optical coupler is input to the sensor.

7B shows an example of an optical circuit configuration for a concrete curing monitoring test using an optical sensor. In general, concrete requires a curing process for a total of 28 days to develop final strength, so a test for curing monitoring is required for concrete quality control. Specifically, the electronic device module package 200 mounts an optical switch module, a circulator module, and an optical coupler module from the left. First, from the front of the package 200, the light source is connected to the module input terminal 130 of the panel optical switch module to input an optical signal, and the module input terminal 130 of the optical coupler module is connected to the detector to receive the signal. do. In the rear of the package 200, the wiring 220 extending from the four module output terminals 140 of the optical switch module and the four module output terminals 140 of the optocoupler module is provided with the eight module input terminals of the circulator module. Connected to 130. Accordingly, at the front of the package 200, four sensors are connected to the four module output terminals 140 of the circulator module, and a final output signal is input to the sensors.

As in the example above, when the optical device is modularized and the modules are packaged 200, the experimenter only needs to connect the wiring 220 to one object (ie, the electronic device module package 200), and each electronic Since the wiring 220 connection structure between the device modules 100 is very simple, the efficiency of configuring an optical circuit for various measurements can be improved. In addition, not only the experimenter who made the optical circuit, but also the experimenter who saw the optical circuit for the first time can easily understand the optical circuit intuitively, and can easily change the connection structure of the intermediate optical element in the optical circuit. Through this, the connection efficiency of the optical sensor for field application can be greatly improved.

Although the methods and systems of the present invention have been described in connection with specific embodiments, some or all of their components or operations may be implemented using a computer system having a general-purpose hardware architecture.

The above description of the present invention is for illustrative purposes only, and those of ordinary skill in the art to which the present invention pertains will be able to understand that it can be easily modified into other specific forms without changing the technical spirit or essential features of the present invention. will be. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not limiting. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as being distributed may also be implemented in a combined form.

The scope of the present invention is indicated by the claims to be described later rather than the detailed description, and all changes or modified forms derived from the meaning and scope of the claims and their equivalent concepts should be interpreted as being included in the scope of the present invention. do.

100: electronic device module 110: electronic device
120: housing 130: module input terminal
130: module output terminal 200: electronic device module package
210: case 220: wiring

Claims (13)

delete delete delete delete delete delete delete In the optical device module package,
A plurality of optical device modules; And
Includes; a case for mounting the plurality of optical device modules through the opening space,
Each of the optical device modules,
A housing formed in a standard for mounting a single optical element;
A module input terminal formed only on one surface of the housing and connected to the input terminal of the optical device; And
And a module output terminal formed only on the other surface disposed in a direction opposite to one surface of the housing, and connected to the output terminal of the optical device,
The plurality of optical device modules are arranged so that only the side surfaces of the housing connecting the one surface and the other surface face each other, but when the types of optical devices included in the optical device modules arranged adjacently are different, the module input terminal and the module Output terminals are arranged to be adjacent, and module input terminals are arranged to be adjacent to each other when the types of optical elements are the same, and a plurality of wires are connected to the adjacently arranged module input terminals and module output terminals,
Each of the wirings is formed to have a length corresponding to the distance between adjacent terminals so as not to be entangled with the wirings arranged adjacently in the up and down directions,
The case,
Each optical device module includes a plurality of opening spaces corresponding to the standard of the housing of each optical device module so that each optical device module is slide-inserted, wherein the plurality of opening spaces are partitioned by a plurality of partition walls, and a plurality of opening spaces passing through the case It is configured in the form of a hole, and is formed to mount one optical device module in each opening space, and each optical device module is formed into a rectangular parallelepiped of the same standard for insertion of the slide,
The optical device module further includes a fixing part for fixing the optical device in the housing,
The optical device is any one of an optical switch, an optical wavelength divider, an optical coupler, and a circulator,
For each optical device module, the module input terminal and the module output terminal are formed in a larger number than the input terminal and output terminal of the mounted optical device, so that the input terminal and the output terminal of the optical device correspond to some of the module input terminal and the module output terminal. The connection state between the terminal of the optical device module and the terminal of the optical device is displayed through an indicator light formed to surround the outer peripheral surface of each terminal of the optical device module,
The number of the module input terminal and the module output terminal is formed in a different number according to the type of the optical device mounted in the housing,
The upper surface of the case is formed of a material that can be erased through an erasing means after any character or picture is written through the writing means,
The upper surface of the housing of each optical device module is manufactured with the circuit diagram of the mounted optical device engraved, and the upper surface of the case corresponding to the upper surface of the housing is so that the user can check the connection relationship between the mounted optical device. The optical device module package is formed of a transparent material. delete delete delete delete The method of claim 8,
The optical device module package,
An optical device module package formed to display a circuit diagram showing a connection structure of the optical devices included in the optical device module on an upper surface.

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