KR102168821B1 - Liquid level measuring device and method of manufacturing the same - Google Patents

Abstract

The present invention relates to a continuous level measuring apparatus and a manufacturing method thereof. More specifically, the present invention relates to the continuous level measuring apparatus having excellent versatility, which a user can quickly and accurately measure a height of a liquid and can use in various fields such as chemistry, food, medicine, pharmaceuticals, and semiconductors, and the manufacturing method thereof. The present invention comprises: a pipe unit including a plurality of inlet grooves recessed upward with intervals along the circumference at a lower end, and an air outlet hole formed on the upper side and passing through the inside and the outside; a sensor unit provided at the lower end of the pipe unit to generate an ultrasonic wave and detect a reflected wave of the ultrasonic wave to generate a measurement signal; and a fixing unit protruding outward from the upper side of the pipe unit and having a screw thread formed on the outer circumference thereof.

Description

Continuous level measuring device and its manufacturing method TECHNICAL FIELD [LIQUID LEVEL MEASURING DEVICE AND METHOD OF MANUFACTURING THE SAME}

The present invention relates to a continuous level measuring device and a method of manufacturing the same, and more particularly, it is possible to quickly and accurately measure the height of a liquid, and has excellent versatility that can be used in various fields such as chemistry, food, medicine, pharmaceuticals, and semiconductors. It relates to a continuous level measuring device and a method of manufacturing the same.

In various fields such as chemistry, food, medicine, pharmaceuticals, and semiconductors, there is a need for technologies that can quickly, conveniently and accurately measure the height of a liquid.

In order to store liquids in various fields such as chemistry, food, medicine, pharmaceuticals, and semiconductors more easily, they were stored in containers such as sealed tanks, but the height of the liquid stored in the container is not intuitively visible. A method was used to measure the height of the liquid against the scale marked on the rod through the soaked liquid.

Such a conventional method has a large error, and in order to compensate for the above-described conventional method, Korean Patent Publication No. 10-2018-0065838 (hereinafter referred to as the prior art) introduced a measuring tube having a U-shaped bend.

To explain the prior art more specifically, the liquid level measurement system of the underground liquid tank for measuring the liquid height of the underground liquid tank 10, which is installed at a location lower than the measurement location and spaced apart from the measurement location, and is provided with a supply pipe and a discharge pipe In,

The connection pipe 40 is formed so as to communicate from the inside of the underground liquid tank 10 to the measurement location,

A measuring tube 50 having a U-shaped bent portion is formed at the end of the connecting pipe installed at the measuring site and connected, and the bent portion has a higher specific gravity than the liquid filled inside the connecting pipe, and the pressure change of the liquid filled inside the connecting pipe By measuring the liquid height of the liquid tank according to the moving distance of the liquid liquid by filling the liquid liquid 55 that can be moved in the measuring tube, the invention is an underground liquid tank installed at a position lower than the measuring place and separated from the measuring place. There is an effect that the height of the liquid can be measured at a measurement location such as a management room without directly accessing the underground liquid tank.

However, in this prior art, a connection pipe having various lengths according to the size of the tank is required, and since the measuring pipe must be disposed above the liquid tank, measurement is difficult when the liquid tank is disposed at a high position. That is, the conventional technology has a problem in that versatility is not good, and since the height of the measuring tube must also be directly measured by a person, the height of the liquid cannot be accurately measured.

The present invention was conceived to solve the above problems, and it is an object of the present invention to provide a continuous level measuring device and a method for manufacturing the same, which is easy to install and use, has excellent versatility, and can more accurately measure the height of a liquid. .

In addition, it is an object of the present invention to provide a continuous level measuring apparatus and a manufacturing method thereof that are easy to manufacture.

The present invention for the purpose of solving the above problems has the following configurations and features.

A pipe portion including a plurality of inlet grooves recessed upward at intervals from the bottom to the circumference, and air outlet holes formed on the upper side and passing through the inside and outside, and is provided at the bottom of the pipe portion to generate ultrasonic waves, and the ultrasonic wave And a sensor unit for generating a measurement signal by detecting the reflected wave of the pipe unit, and a fixing unit protruding outward from the upper side of the pipe unit and having a screw thread formed on the outer circumference thereof.

In addition, the present invention provides a method for manufacturing a continuous level measuring device, comprising: installing the housing of the sensor unit having an opening at the lower side thereof on the pipe unit, and forming an epoxy upper layer by filling a predetermined epoxy in the receiving space of the housing. The step of, mounting a piezoelectric element on the top of the inserting portion of the jig inserted into the receiving space, inserting the inserting portion into the receiving space so that the piezoelectric element is inserted into the receiving space, and curing the epoxy upper layer, and And separating the jig from the piezoelectric element, and forming and curing an epoxy underlayer by filling the receiving space with epoxy.

In addition, the jig is provided under the insertion portion, a body portion having a larger diameter than the insertion portion, and protruding upward from an upper end of the insertion portion, but having a diameter smaller than the insertion portion, corresponding to the through hole of the piezoelectric element And an insertion protrusion protruding upward from an upper end of the fitting protrusion so as to be inserted into a through hole formed on an upper side of the housing, and the body portion may include a receiving portion recessed inward in an up-down direction. have.

The present invention having the above configuration and features includes a sensor unit provided at the bottom of the pipe unit to generate ultrasonic waves and to detect the reflected waves of the ultrasonic waves to generate measurement signals, so that installation and use are easy, and thus versatility is excellent, and the height of the liquid ( Level) can be measured more precisely.

In addition, the present invention has the effect of inducing liquid inflow into the inner space by reducing the air pressure in the inner space of the pipe part by including the inlet groove through which the liquid is introduced and the air discharge hole formed on the upper side.

In addition, since the present invention includes a fixing portion, installation is easy, and in particular, even when the height of the liquid is so low that the sensor portion is not charged with the liquid, the height of the liquid can be measured. In addition, it has the effect that the height of the liquid can be more accurately measured by fixing the position of the pipe part.

In addition, the present invention includes an epoxy upper layer forming step, an epoxy upper layer curing step, and a sealing step of filling an epoxy in the receiving space of the housing of the sensor unit in which the piezoelectric element is installed, thereby suppressing the generation of bubbles and measuring the liquid height more accurately. Has.

In addition, the present invention includes a piezoelectric element jig mounting step of inserting a piezoelectric element into an accommodation space of a housing through a jig including an insertion protrusion and a fitting protrusion, and a piezoelectric element insertion step and an epoxy upper layer curing step of curing the epoxy upper layer. It has the effect that the device can be installed more precisely inside the housing.

1 is a diagram showing a continuous level measuring apparatus according to an embodiment of the present invention.
2 is a state diagram of a continuous level measuring device connected to a controller in use.
3 is a diagram illustrating a housing of a sensor unit connected to a tube.
4 is a view for explaining that a piezoelectric element is installed on an epoxy upper layer cured in a housing.
5 is a view for explaining a sealed housing.
6 is a schematic block diagram illustrating a method of manufacturing a continuous level measuring device.
7 is a diagram for explaining a piezoelectric element mounted on a jig.
8 is a view for explaining that a piezoelectric element is inserted into a housing by a jig.
9 is a view for explaining a further embodiment of the present invention.

The present invention will be described in detail in the text of the bar, implementation (態樣, aspect) (or embodiment) that can apply various changes and can have various forms. However, this is not intended to limit the present invention to a specific form of disclosure, and it should be understood that all changes, equivalents, and substitutes included in the spirit and scope of the present invention are included.

The terms used in the present specification are only used to describe specific embodiments (sun, 態樣, aspect) (or examples), and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present application, terms such as ~include~ or ~consist~ are intended to designate the presence of features, numbers, steps, actions, components, parts, or a combination thereof described in the specification, but one or more other features It is to be understood that the presence or addition of elements or numbers, steps, actions, components, parts, or combinations thereof, does not preclude in advance the possibility of being added.

Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs. Terms as defined in a commonly used dictionary should be interpreted as having a meaning consistent with the meaning in the context of the related technology, and should not be interpreted as an ideal or excessively formal meaning unless explicitly defined in this application. Does not.

The ~1~, ~2~, etc. described in the present specification will only be referred to to distinguish different constituent elements, and are not limited to the order of manufacture, and the names in the detailed description and claims of the invention It may not match.

Throughout the present specification, when a part is said to be "connected (coupled)" with another part, it is not only the case that "directly connected (coupled)" or "electrically connected (coupled)" It also includes the case of being "indirectly connected (coupled)" or "indirectly connected (coupled)" between elements.

1 is a diagram showing a continuous level measuring apparatus according to an embodiment of the present invention, and FIG. 2 is a state diagram of use of a continuous level measuring apparatus connected to a controller. The continuous level measurement apparatus according to an embodiment of the present invention is for measuring (measurement) the height (level) of a liquid. Hereinafter, the continuous level measurement apparatus CL according to an embodiment of the present invention will be described as'this. It will be referred to as'device'.

This apparatus (continuous level measuring apparatus CL) includes a pipe part 1, a sensor part 2, and a fixing part 3.

The pipe portion 1 may have a length in the vertical direction, and a plurality of inlet grooves 11 recessed upward at intervals along the circumference at the bottom, and air outlet holes formed on the upper side and passing through the inner and outer sides ( 12).

It may be a pipe in which an inner space in which gas and liquid are accommodated and moved inside the pipe part 1 is formed. The above-described vertical direction may mean an up-down direction based on FIG. 1, the inner side refers to a direction from the pipe part 1 toward the inner space, and the outer side is an outer radius at a center line parallel to the vertical direction of the inner space. It may mean a direction, but the same will be applied in the following description.

The pipe unit 1 includes a plurality of inlet grooves 11 recessed upward along the perimeter from the lower end, and the inlet groove 11 is formed even if the sensor unit 2 to be described later is provided at the lower end of the pipe unit 1 Through the liquid can be introduced into the inner space of the pipe portion (1). Here, the circumference may mean the circumference of the cross section of the lower end of the pipe portion 1 when viewed from the lower side.

The air discharge hole 12 is for discharging gas in the inner space of the pipe part 1 when the liquid flows into the inner space of the pipe part 1 through the inlet groove 11. The gas may be discharged from the inner space through the air discharge hole 12 so that the height (level) of the liquid in the container or the like and the height of the liquid in the inner space of the pipe unit 1 are the same.

At this time, a plurality of inlet grooves 11 are provided along the periphery of the pipe portion 1 to allow liquid to flow into the inner space from multiple directions. In addition, since a plurality of inlet grooves 11 are formed along the circumference at the lower end of the pipe portion 1, a plurality of leg portions 11a provided between neighboring inlet grooves 11 are provided to increase the coupling force with the sensor unit 2. Can be maintained. Although it will be described in more detail in the following description, the pipe unit 1 and the sensor unit 2 may be coupled to each other by fitting, welding, or the like.

As described above, it was said that liquid flows into the inner space of the pipe part 1 through the inlet groove 11, and the pipe part 1 is the ultrasonic wave generated by the sensor part 2 to be described later and the reflected wave of the ultrasonic wave. It can play a role of guiding in the inner space.

Likewise, the leg portion 11a not only forms an inlet groove 11 for introducing or discharging liquid into the inner space, but also serves to guide the ultrasonic waves and reflected waves in the inner space like the pipe unit 1 described above. Thus, since the concentricity of the ultrasonic wave and the reflected wave is maintained and the wavelength is kept constant, the device can more accurately measure the height of the liquid.

3 is a view for explaining a housing of a sensor unit connected to a tube, FIG. 4 is a view for explaining that a piezoelectric element is installed on an epoxy upper layer cured in the housing, and FIG. 5 is a view for explaining a sealed housing . 1 to 5, the sensor unit 2 is provided at the lower end of the pipe unit 1 to generate ultrasonic waves, and detects a reflected wave of the ultrasonic waves to generate a measurement signal.

More specifically, the sensor unit 2 may include a housing 21 connected (coupled) to the lower end of the pipe unit 1. The housing 21 may include an inlet opened at the lower side so that the piezoelectric element 22 of the sensor unit 2 is inserted and installed in the inner receiving space 211. The accommodation space 211 may be a space formed by an upper side surface in a direction opposite to the opened inlet and a side wall extending downward along an edge of the upper side surface.

The housing 21 may have a cylindrical shape as an example, and the piezoelectric element 22 inserted into the receiving space 211 may be a ring shape. The piezoelectric element 22 may be electrically connected to the controller CT through an electric wire. At this time, a through hole 212 may be formed on the upper side (upper side) of the housing 21 to discharge the wire connected to the piezoelectric element 22 upward so that the wire connected to the piezoelectric element 22 can be connected to the controller CT.

The controller CT is connected to the piezoelectric element 22 through an electric wire to apply a voltage to the piezoelectric element 22, and the piezoelectric element 22 generates vibration by the voltage applied by the controller CT. Ultrasound can be generated by this vibration.

The ultrasonic wave may proceed in one medium (e.g., liquid) and be reflected at the interface between the other medium (e.g., gas) and the one medium due to a difference in density, etc., to form a reflected wave. .

The reflected wave may contact the piezoelectric element 22 again to cause the piezoelectric element 22 to vibrate again to generate a voltage, and a voltage formed by the reflected wave may be transmitted to the controller CT. The measurement signal is the difference between the time when the controller CT applies a voltage and the piezoelectric element 22 generates an ultrasonic wave, and the difference between the time when the piezoelectric element 22 generates the voltage by receiving the reflected wave (hereinafter, reciprocating travel time). , May mean the intensity of a voltage generated by the piezoelectric element 22 by the diffuse reflection wave. The strength of the voltage may mean the speed of the reflected wave.

The controller CT may receive a measurement signal from the sensor unit 2 and calculate and display the height (level) of the liquid through the speed of the reflected wave and the reciprocating travel time.

As described above, the present invention includes a sensor unit 2 provided at the bottom of the pipe unit 1 to generate an ultrasonic wave and detect a reflected wave of the ultrasonic wave to generate a measurement signal, thereby more accurately measuring the height (level) of the liquid. The advantage is that you can do it.

If the height of the liquid is low or the volume of the tank in which the liquid is accommodated is so large that the sensor unit 2 provided at the lower end of the pipe unit 1 is not charged into the liquid, the sensor unit 2 provides ultrasonic waves to the gas. Is generated, and the sensor unit 2 may generate a measurement signal by receiving the reflected wave of the ultrasonic wave reflected from the interface between the gas and the liquid.

Since the above process corresponds to the above-described process in which the sensor unit 2 generates ultrasonic waves from a liquid, a more detailed description will be omitted.

As described above, the present invention has an advantage in that the height of the liquid can be accurately measured even when the height of the liquid is low or the size of the container in which the liquid is accommodated is large, so that it is convenient to install and use, and thus has excellent versatility.

On the other hand, the tube 4 to be described later may be coupled to the sensor unit 2 so as to extend upward from the center of the upper side of the sensor unit 2 (combined to communicate with the through hole 212 on the upper side of the housing 21). have. At this time, the sensor unit 2 (the upper side of the housing 21 and the upper side of the piezoelectric element 22) and the lower end of the pipe unit 1 (the lower end of the leg 11a) are parallel to the horizontal direction, respectively. , The upper side (upper side of the housing 21) of the sensor unit 2 may include a recessed fitting groove (not shown) so that the lower end of the pipe unit 1 is inserted and fitted. Here, the horizontal direction is a direction parallel to the ground and means a left-right direction based on FIG. 2, and the same will be applied in the following description.

Such a fitting groove (not shown) may be formed along an outer radial direction centered on the upper side of the sensor unit 2. Exemplarily, the pipe portion 1 may have a circular columnar shape with a circular bottom cross section, and the fitting groove (not shown) is centered on the upper side of the upper side of the sensor unit 1 when viewed from the upper side. It can be circular.

In this way, the sensor unit 2 includes a fitting groove (not shown) into which the lower end of the pipe unit 1 is fitted, so that the pipe unit forming the inner space at any height (at any point in the vertical direction) ( The distance between the inner wall circumference of 1) and the circumference of the tube 4 may be the same, and the horizontal direction and the sensor unit 2 perpendicular to the longitudinal direction of the inner space, which is the movement path of ultrasonic waves and reflected waves in the pipe unit 1 ) (The upper side of the piezoelectric element 22) can be kept parallel (to prevent the sensor unit 2 from being inclined with respect to the pipe unit 1), so that the height of the liquid can be measured more accurately and precisely. There is an advantage.

1 and 2, the fixing part 3 is provided to protrude outward from the upper side of the pipe part 1, and a thread is formed on the outer circumference thereof. The fixing part 3 may be detachably coupled with a fixing member (not shown) provided on the upper side of the container in which the liquid is accommodated, for example, a male thread is formed on the outer periphery of the fixing part 3 , In the fixing member (not shown), the fixing part 3 is inserted through and a female thread is formed in the inner circumference, so that the fixing part 3 and the fixing member (not shown) may be screwed together.

As described above, since the present apparatus includes the fixing part 3, the position of the pipe part 1 to which the sensor part 2 is connected is fixed, so that the height of the liquid can be more accurately and accurately measured. In addition, there is an advantage that it is possible to set (calibrate) the reference height of the sensor unit 2 in the container in which the liquid is accommodated while the device is fixed by the fixing unit 3. That is, the controller CT may calculate and display the height of the liquid after receiving the measurement signal with reference to the reference height.

When the hole of the container through which the pipe part 1 is inserted is smaller than the outer diameter of the fixing part 3, the fixing part 3 is provided to protrude outward from the outer circumference of the pipe part 1, so that the container is a fixing member ( It goes without saying that the fixing part 3 may be fixed to the top of the container even if it is not provided.

Meanwhile, referring to FIGS. 1 to 5, the apparatus may include a tube 4 inserted into and received in the inner space of the pipe unit 1. The tube 4 accommodates a part of the electric wire connected to the piezoelectric element 22 inside, and is for inducing discharge upward so that the electric wire connected to the piezoelectric element 22 is connected to the controller CT.

The tube 4 may be a conduit like the pipe part 1, and the tube 4 is coupled to the sensor part 2 at the lower end in a manner such as welding, and the tube 4 is connected to the pipe part 1 They can be combined with each other by welding or the like.

Meanwhile, hereinafter, a method of manufacturing a continuous level measuring apparatus according to an embodiment of the present application (hereinafter, the present method) will be described. However, since this method is a manufacturing method of the present device described above, and includes the same or corresponding technical features as the present device, the same reference numerals are used for configurations that are the same or similar to those of the previous salpin configuration, and the overlapping description is simplified I will omit it.

6 is a schematic block diagram illustrating a method of manufacturing a continuous level measuring device. 1 to 6, the method includes an installation step (S1), an epoxy upper layer formation step (S2), a piezoelectric device jig mounting step (S3), a piezoelectric device insertion and curing step (S4), and a sealing step (S5). Includes.

The installation step (S1) is a step of installing the housing 21 of the sensor unit 2, which is opened at the lower side and has an inlet, on the pipe unit 1. The housing 21 is mutually coupled with the tube 4 by welding or the like so that the through hole 212 through which the wire connected to the piezoelectric element 22 passes through the upper side (upper side) communicates with the hollow of the tube 4 Can be.

Thereafter, the lower end of the pipe part 1 and the upper side (upper side) of the sensor part 2 and the housing 21 are fitted and welded while the tube 4 is inserted into the inner space of the pipe part 1 and received. They can be combined with each other in such a way. The pipe portion 1 and the tube 4 may be welded to each other to be combined.

In the installation step (S1), the pipe part 1 is inserted through the fixing part 3 and can be joined by welding each other. At this time, a gasket can be fitted so that the fixed part 3 is not damaged.

The epoxy upper layer forming step (S2) is a step of forming an epoxy upper layer by filling a predetermined epoxy in the receiving space 211 of the housing 21. In the epoxy upper layer forming step (S2), the epoxy may fill the receiving space 211 of the housing 21 to the extent that it is not completely filled by the epoxy.

7 is a diagram for explaining a piezoelectric element mounted on a jig. 1 to 7, the piezoelectric element jig mounting step S3 is a step of mounting the piezoelectric element 22 on the top of the insertion portion J1 of the jig J inserted into the accommodation space 211. The shape and size of the insertion part J1 is preferably formed to correspond to the shape and size of the accommodation space 211.

8 is a view for explaining that a piezoelectric element is inserted into a housing by a jig. 1 to 8, in the piezoelectric element insertion and curing step (S4), the insertion portion J1 is inserted into the receiving space 211 so that the piezoelectric element 22 is inserted into the receiving space 211 (inserting the piezoelectric element Step (S41)), and curing the epoxy upper layer (epoxy upper layer curing step (S42)).

Referring to FIGS. 7 and 8, when the jig J is described in more detail, the jig J is provided at the lower portion (or lower end) of the insertion portion J1, and has a larger diameter than the insertion portion J1. The branch may include a body portion (J2).

In addition, the jig (J) is provided with an upward protrusion from the top of the insertion portion (J1), has a diameter smaller than the insertion portion (J1), and includes a fitting protrusion (J3) having a diameter corresponding to the through hole of the piezoelectric element 22 can do.

As described above, it was said that the piezoelectric element 22 may be a ring-shaped body, but a through hole through which the upper and lower surfaces may be formed may be formed inside. The fitting protrusion (J3) is formed to correspond to the through hole of the piezoelectric element 22 so that the fitting protrusion (J3) is inserted through the through hole of the piezoelectric element 22, and the insertion portion (J1) larger than the diameter of the fitting protrusion (J3) By supporting the piezoelectric element 22, the piezoelectric element 22 may be mounted on the jig J. Here, the diameter of the insertion portion J1 is preferably formed to correspond to the outer diameter of the piezoelectric element 22.

In the piezoelectric element insertion step (S41) and the epoxy upper layer curing step (S42), the piezoelectric element 22 is interposed between the insertion part (J1) and the epoxy upper layer in a state of being inserted into the fitting protrusion (J3), and the epoxy upper layer is cured. The element 22 may be fixed to the housing 21 by epoxy.

In addition, the jig J may include an insertion protrusion J4 protruding upward from the upper end of the fitting protrusion J3 so as to be fitted into the through hole 212 formed on the upper side of the housing 21. Insertion protrusion (J4) can be inserted into the hollow of the tube (4). The diameter of the insertion protrusion J4 may be formed to correspond to the diameter of the through hole 212 and the hollow of the tube 4.

As described above, in this method, since the jig J includes the insertion portion J1 and the fitting protrusion J3 and supports the piezoelectric element 22 in the inserted state, the piezoelectric element 22 can be mounted more easily. .

In addition, in this method, since the jig (J) includes the insertion portion (J1) and the insertion protrusion (J4), the piezoelectric element insertion and curing step (S4) suppresses the jig (J) from tilting toward the central axis in the vertical direction. Thus, the piezoelectric element 22 can be easily installed in the housing 21 by fixing the position of the jig J during the curing process of the epoxy upper side.

In particular, there is a problem in that the height of the piezoelectric element 22 is changed so that the height of the liquid cannot be accurately measured if the jig J is tilted in a gel state before curing. At this time, since the insertion protrusion J4 in the jig J is fitted into the through hole 212 and the hollow of the tube 4, the piezoelectric element 22 can be more stably disposed until the gel-like epoxy upper side is cured. .

In addition, it includes a body part (J2). If the upper end of the device and the lower end of the body part (J2) are parallel to the ground, the piezoelectric element 22 is pressed by pressing the upper end of the device and the lower end of the body part (J2). It can be installed in the housing 21 so that the height is constant along the circumference.

On the other hand, the body portion (J2) may include a receiving portion (J21) recessed inward in the vertical direction. Here, the inner side is the side facing the center line parallel to the vertical direction like the inner side of the device. As described above, the piezoelectric element 22 is coupled with an electric wire, and since the body portion J2 includes the receiving portion J21, the piezoelectric element in the piezoelectric element jig mounting step (S3) and the piezoelectric element insertion and curing step (S4) The wire combined with the element 22 is inserted and accommodated in the receiving portion J21, so that the wire can be more easily managed.

1 to 8, in the sealing step (S5), the jig (J) and the piezoelectric element 22 are separated (the jig removal step (S51)), and an epoxy underlayer is formed by filling the receiving space 211 with epoxy. And curing (hardening the under epoxy layer (S52)).

When the epoxy upper layer is cured after the epoxy upper layer curing step (S42), the epoxy upper layer is fixed to the accommodation space 211 of the housing 21 and the piezoelectric element 22 disposed on the epoxy upper layer is also fixed, and the piezoelectric element ( 22) is installed in the receiving space 211 of the housing 21.

At this time, the wire connected to the piezoelectric element 22 is inserted into the hole formed by the insertion protrusion J4 and communicates with the hollow of the through hole 212 and the tube 4, and the wire is inserted into the through hole 212 and the tube. It can be pulled out to the upper side of the device through the hollow of (4) so as to be connected to the above-described controller (CT).

In the sealing step (S5), the jig J and the piezoelectric element 22 may be separated, and the receiving space 211 may be filled with epoxy to form an epoxy lower layer. When filling the epoxy in the sealing step (S5), the cork can be filled together.

The sealing step (S5) is a state in which the entrance of the housing 21 is covered through the cover 23 after the epoxy underlayer is cured, and the housing space 211 is sealed by welding the cover 23 and the housing 21. I can.

In this way, since the receiving space 211 of the housing 21 in which the piezoelectric element 22 of the sensor unit 2 is installed is filled with epoxy and cured, the generation of air bubbles is suppressed (for example, the receiving space 211 ) By suppressing the occurrence of air bubbles), the height of the liquid can be more accurately and accurately measured (measured).

On the other hand, in the present apparatus, installation and uninstallation are repeatedly performed in various containers having various shapes and sizes in which liquid is accommodated, and as the installation and installation are repeatedly performed, there is a risk of hitting the container and the like and causing scratches.

Therefore, the pipe part (1) of this device can be formed of a metal material to suppress damage such as scratches and improve durability.This device is for measuring (measurement) the height (level) of the liquid. , There is a risk of corrosion because it always comes in contact with moisture, water vapor, etc.

When damage such as scratches occurs on the outer surface of the pipe part 1, crack corrosion may occur, thereby promoting corrosion. In addition, when corrosion occurs on the outer surface of the pipe portion 1, there is a problem in that stress is concentrated and stress corrosion cracking may occur, thereby promoting cracking and breakage.

1, 2 and 9, the pipe portion 1 may include a coating film G provided on the outer surface as a means for solving the above problem. The coating film (G) is in contact with the outer surface of the pipe part (1), but the adhesive layer (G1) that is softened in the first temperature range, the heating layer (G2) provided on the adhesive layer (G1), the heating layer (G2) A protective layer (G4) provided on the intermediate layer (G3) that is softened in a second temperature range higher than the first temperature range, and a protective layer (G4) provided on the intermediate layer (G3) and softened at a third temperature higher than the second temperature range. ) Can be included.

This coating film (G) includes a protective layer (G4), so that the surface is high in hardness and abrasion resistance is excellent, thereby suppressing the occurrence of scratches on the pipe part (1), and having water repellency, so that the pipe part (1) is corroded. It can be suppressed from becoming. In particular, the coating film (G) includes an adhesive layer (G1) and an intermediate layer (G3) that are softened at a lower temperature in the first temperature range and the second temperature range, respectively, unlike the protective layer G4 on the surface, so that the surface of the coating film (G) While maintaining the physical and chemical properties of the protective layer (G4) provided on the surface, it is possible to more effectively remove the residual stress of the coating film (G) due to external environments such as thermal expansion and bending, thereby suppressing damage such as peeling, thereby reducing the service life. Because it can be extended, the pipe portion 1 can be protected from the external environment for a longer time.

In a specific embodiment, the adhesive layer G1 may include polybutylacrylate (PBA) and polymethyl methacrylate (PMMA). When the thickness of the adhesive layer G1 is thick, a temperature gradient between the heat-generating layer G2 and the outer surface of the pipe portion 1, which will be described later, occurs, and the portion of the adhesive layer G1 that contacts the outer surface of the pipe portion 1 Since softening may not be performed smoothly, the thickness is preferably 0.020mm to 0.150mm.

Exemplarily, the adhesive layer G1 may be formed by heat-coating polybutyl acrylate and polymethyl methacrylate. The softening temperature of the adhesive layer G1 is 90°C to 100°C, corresponding to the first temperature range.

As described above, since the adhesive layer G1 in the coating film G is softened in the first temperature range, which is the lowest temperature, peeling is suppressed due to excellent adhesion to the outer surface of the pipe unit 1.

The heating layer G2 is provided on the adhesive layer G1 and includes polyacetylene and iodine. Polyacetylene does not have a gap through which electrons flow in the conjugated double bond state, but since the gap can be widened by incorporating heterogeneous low molecules such as iodine, electrons flow, and when electricity is applied, heat is generated by electrical resistance.

In this way, by including the heating layer (G2), since there is no need to apply a large voltage to soften the adhesive layer (G1) and the intermediate layer (G3) to be described later, the service life of the coating film (G) is more economically extended. There is an advantage that you can do it.

The intermediate layer G3 may include 100 parts by weight of the cellulose acetate butyrate and 200 parts by weight of the carboxylate acrylic copolymer. If the weight ratio is out of the above, the adhesive strength between the adhesive layer G1 and the protective layer G4 may be insufficient, and thus, film peeling may occur during use. The softening temperature of the intermediate layer G3 is 150° C. to 160° C., corresponding to the second temperature range.

The protective layer (G4) may include 50 parts by weight of polymethylphenylsiloxane in toluene, 50 parts by weight of silicon-containing fibers, 50 parts by weight of silicon carbide, 6 parts by weight of manganese oxide, and 18 parts by weight of an organosilicon-titanium compound. have.

When the amount of polymethylphenylsiloxane is less than 50 parts by weight, the softening temperature decreases, the difference from the second temperature range decreases, the hardness decreases, and when it exceeds 50 parts by weight, it is not economical. When the content of the silicone-containing fiber is less than 50 parts by weight, the water repellency is deteriorated, and when it exceeds 50 parts by weight, the water repellency is not significantly improved, so it is not economical. If silicon carbide is less than 50 parts by weight, the abrasion resistance is reduced, and if it exceeds 50 parts by weight, the abrasion resistance is not significantly improved, so it is not economical. If the organosilicon-titanium compound is less than 18 parts by weight, surface hardness and abrasion resistance are reduced, and if it exceeds 18 parts by weight, the degree of hardening is not clear, which is not economical.

As such, the softening temperature of the protective layer G4 is 650° C. (the third temperature), which maintains hardness even at a temperature lower than the third temperature, which is higher than the second temperature range, to maintain abrasion resistance and water repellency. The pipe part 1 can be effectively protected from the external environment.

As described above, the coating film G is provided on the outer surface of the pipe portion 1, and residual stresses such as compressive stress and tensile stress due to the difference in the coefficient of thermal expansion from the pipe portion 1, bending by shape and external force, etc. It may be generated, and when such residual stress is generated, the coating film G may cause microincontinence, cracks, hillocks, wrinkling, fractures, etc., which are called crazing.

Therefore, by applying electricity to the heating layer G2 so that the adhesive layer G1 and the intermediate layer G3 reach the first temperature range and the second temperature range, respectively, residual stress is removed in each of the adhesive layer G1 and the intermediate layer G3. Thus, it is to suppress the occurrence of fracture or the like due to residual stress.

At this time, it is important that the heating layer G2 generates heat below the third temperature so that the protective layer G4 does not soften, so the adhesive layer G1 and the intermediate layer G3 reach the first temperature range and the second temperature range, respectively. Thus, even during the softening process, the protective layer G4 is not softened, and thus properties such as excellent hardness, abrasion resistance, and water repellency can be maintained.

In particular, when the heating layer G2 generates heat at a temperature adjacent to the first temperature range (e.g., 150°C) in the second temperature range, the softening degree of the intermediate layer G3 is less than that of the adhesive layer G1, and the intermediate layer G3 Since it serves as a buffer between the adhesive layer G1 and the protective layer G4, it can serve as a bridge between the adhesive layer G1 and the protective layer G4.

In other words, since the residual stress of the coating film (G) can be effectively dispersed and relaxed while maintaining the physical and chemical properties of the protective layer (G4), it is possible to continuously protect the pipe part (1) from external environments such as scratches and corrosion. There is an advantage that you can.

The present invention described above with reference to the accompanying drawings can be variously modified and changed by a person skilled in the art, and such modifications and changes should be construed as being included in the scope of the present invention.

Continuous level measuring device: CL
Pipe part: 1 Inlet groove: 11
Air outlet hole: 12 Sensor part: 2
Housing: 21 Accommodating space: 211
Piezoelectric element: 22 Cover: 23
Part: 3 Tube: 4
Controller: CT Jig: J
Insertion: J1 Body: J2
Receiving part: J21 Fitting protrusion: J3
Insertion protrusion: J4

Claims (4)

A pipe portion including a plurality of inlet grooves recessed upward at intervals along the circumference at the lower end, and air outlet holes formed on the upper side and passing through the inner and outer sides;
A sensor unit provided at the lower end of the pipe unit to generate an ultrasonic wave and detect a reflected wave of the ultrasonic wave to generate a measurement signal; And
A fixing part protruding outwardly from the upper side of the pipe part and having a thread formed on the outer circumference thereof;
Including,
The pipe portion includes a coating film provided on an outer surface thereof, wherein the coating film contacts the outer surface of the pipe portion and is softened in a first temperature range, a heating layer provided on the adhesive layer, and provided on the heating layer, the first An intermediate layer softened in a second temperature range higher than a temperature range, and a protective layer provided on an upper portion of the intermediate layer and softened at a third temperature or higher than the second temperature range,
The adhesive layer includes polybutyl acrylate and polymethyl methacrylate, but has a thickness of 0.020 mm to 0.150 mm,
The heating layer includes polyacetylene and iodine,
The intermediate layer includes 100 parts by weight of cellulose acetate butyrate and 200 parts by weight of carboxylate acrylic copolymer,
The protective layer comprises 50 parts by weight of polymethylphenylsiloxane in toluene, 50 parts by weight of silicon-containing fibers, 50 parts by weight of silicon carbide, 6 parts by weight of manganese oxide, and 18 parts by weight of an organosilicon-titanium compound. Continuous level measurement device. delete A pipe portion including a plurality of inlet grooves recessed upward at intervals along the circumference at the lower end, and air outlet holes formed on the upper side and passing through the inner and outer sides;
A sensor unit provided at the lower end of the pipe unit to generate an ultrasonic wave and detect a reflected wave of the ultrasonic wave to generate a measurement signal; And
In the manufacturing method of the continuous level measuring apparatus comprising a fixing portion provided to protrude outward from the upper side of the pipe portion, the outer periphery threaded,
Installing the housing of the sensor unit with an inlet open at the lower side of the pipe unit;
Forming an epoxy upper layer by filling a predetermined epoxy in the receiving space of the housing;
Mounting a piezoelectric element on an upper end of the insertion portion of the jig inserted into the accommodation space;
Inserting the insertion part into the receiving space so that the piezoelectric element is inserted into the receiving space, and curing the epoxy upper layer; And
Separating the jig from the piezoelectric element and filling the receiving space with epoxy to form an epoxy underlayer and curing;
Method for manufacturing a continuous level measuring device comprising a. The method of claim 3,
The jig,
A body portion provided below the insertion portion and having a larger diameter than the insertion portion;
A fitting protrusion provided upwardly protruding from an upper end of the insertion portion, having a diameter smaller than that of the insertion portion, and having a diameter corresponding to the through hole of the piezoelectric element; And
An insertion protrusion protruding upward from an upper end of the fitting protrusion so as to be inserted into a through hole formed on the upper side of the housing;
Including,
The method of manufacturing a continuous level measuring device, characterized in that the body portion comprises a receiving portion recessed inward along the vertical direction.

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