KR102146331B1 - Harmful gas purification system - Google Patents

Abstract

The present invention relates to a toxic gas purification system, the configuration of which comprises a housing (2); When electricity is supplied, one side of the thermoelectric semiconductor device 3 becomes a cooling side by lowering the temperature and the other side becoming an 11e heat dissipating side; A cooling plate 4 that is cooled when the thermoelectric semiconductor device 3 is driven; A cooling rod (5) that is cooled with the cooling plate (4) by the thermoelectric semiconductor device (3) to lower the temperature of the air passing through the gaps to absorb and collect some of the harmful gases contained in the air; A filter 6 through which the filtration member 6a filters harmful gas contained in the air passing through the filtration member 6a through the gap of the cooling rod 5; A heat radiating plate 7 cooled by air cooling to cool the radiating surface of the thermoelectric semiconductor device 3; A first blowing fan 8 for cooling the heat sink 7 by pressure-feeding air through the heat sink 7; A cover 9 through which a plurality of inlets 9a are passed through the side and an outlet 9b is passed through the upper end so that harmful gases in the atmosphere can be supplied to the cooling rod 5 and the filter 6 accommodated in the storage space; Air is pumped so that external air can be discharged to the passage of the cover 9 through the hole in the cover 9, the gap in the cooling rod 5, the filter member 6a of the filter 6, and the flow path 6b. A second blowing fan 10; And driving the thermoelectric semiconductor device 3 so that water vapor contained in the air is not cooled below the dew point in the process of passing the outside air through the cooling rod 5 and the filter 6 to the outlet 9b of the cover 9 It includes; control means 11 for controlling the.

Description

Harmful gas purification system}

The present invention relates to a harmful gas purification system for collecting and filtering harmful gases evaporated during transport or storage immediately after production of semiconductor devices or LCD/OLED flat panel displays manufactured using gas in a high temperature environment, In particular, immediately after manufacturing, the air exposed to the product that evaporates harmful gases is forced to pass through the cooling rod and filtration filter, and in this process, the cooling rod cooled by the thermoelectric semiconductor element cools the compressed air to a temperature where condensation does not occur. , Harmful gas that can increase the efficiency of removing harmful gases by filtering out harmful gas particles contained in the air by being largely agglomerated by cooling and collecting the remaining harmful gas that has passed through the cooling bar by filtering it in the second filter. It relates to a purification system.

Flat panel displays, including semiconductors, are manufactured by using gases in a high temperature environment for a specific purpose in the manufacturing process. Since these manufactured products are manufactured using gas at high temperatures, they cannot be transported manually immediately after manufacturing, so they are moved to a temporary safe place at room temperature by a transport robot, and then moved to a storage room using a conveyor device. It is stored and loaded for a certain period of time.

As the products manufactured in a high-temperature environment are cooled during transport and storage immediately after manufacture, used residual gas and gas by-products continue to evaporate. When the evaporated gas is released into the atmosphere, it causes serious environmental pollution as well as seriously harms the health of workers in close proximity. Therefore, it is purged according to certain conditions according to the relevant laws and regulations, and the air that has undergone the purification process is discharged to the outside. .

In this way, the conventional air purifying apparatus that purifies the gas and by-products emitted from the product immediately after manufacture is equipped with a filter that can purify the gas, and the air contaminated with the gas is pumped through the filter using a blower. The air was purified by filtering contaminants.

However, since the conventional air purifier does not have a cooling means, the filter filters the polluted harmful gas that passes through the filter at the current temperature, and the current temperature is higher than the outside temperature due to the release of high-temperature harmful gas from the product. Therefore, there is a problem of polluting the environment by passing through a filter and being discharged into the atmosphere in part of the harmful gas because the particle state is activated due to the high temperature.

As for the patent document of the conventional air purifying apparatus, the air purifying apparatus of Patent Publication No. 10-2018-0000878 (published on January 04, 2018) has been disclosed. This technology includes a housing module in which an inlet hole is formed in the front part, a side discharge hole is formed in the side, and an upper discharge hole is formed in the upper part; A first fan provided at the lower inner portion of the housing module to suck air from the outside through the inlet hole, flow upward, and discharge a part of the air through the side discharge hole; A second fan provided at an upper portion of the housing module to discharge the air flowed by the first fan to the upper discharge hole; And a filter module that purifies air introduced from the outside through the inlet hole.

The conventional air purifying apparatus has the advantage of increasing the efficiency of discharging air by discharging air with an improved air volume in three directions using a plurality of fans and preventing eddy currents from being generated by rotation of the fan. Since there is no cooling means to lower the air, air particles do not clump together at low temperatures. Accordingly, contaminated air having fine particles activated at room temperature passes through the filter as it is, and thus the conventionally pointed out environmental pollution problem has not been solved.

Republic of Korea Patent Publication No. 10-2018-0000878

Accordingly, the present invention is to solve the problems of the conventional air purifying apparatus as described above, the object of which is to cool the air cooled by the cooling rod by the thermoelectric semiconductor device to a temperature at which condensation does not occur, Hazardous gas that can increase the efficiency of removing harmful gases by allowing harmful gas particles contained in the particles to be largely aggregated by cooling so that they are first collected by the cooling rod, and the remaining harmful gases that have passed through the cooling rod are secondarily filtered and removed by the filter filter. To provide a purification system.

The harmful gas purification system according to the present invention for achieving the above object comprises: a housing formed to allow air to enter and exit;

A thermoelectric semiconductor device accommodated in the housing, one side of which becomes a cooling surface when electricity is supplied, and the other side becomes a heat dissipation surface by increasing the temperature to radiate heat from the cooling surface;

A cooling plate having one side in close contact with the cooling surface of the thermoelectric semiconductor element to cool when the thermoelectric semiconductor element is driven;

A plurality of rod-shaped bodies are inserted and fixed to be arranged in a circular shape on the other side of the cooling plate with a gap, and cooled together with the cooling plate by the thermoelectric semiconductor element to lower the temperature of the air passing through the gap. A cooling rod that absorbs and collects some of the contained harmful gases;

A flow path passes through the center of the filtering member, is accommodated in the cooling rod arranged in a circular shape, and its lower end is placed on the cooling plate to close one end of the flow path, and in the air passing through the filtering member through the gap of the cooling rod A filter through which the filtering member filters the contained harmful gas;

A heat dissipating plate closely assembled with the radiating surface of the thermoelectric semiconductor device and cooled by air cooling to cool the radiating surface of the thermoelectric semiconductor device;

A first blower fan mounted on the housing so as to be disposed on one side of the heat sink and cooling the heat sink by pressure-feeding air through the heat sink when power is supplied, so that the heat sink can cool the heat radiating surface of the thermoelectric semiconductor device;

It is composed of a cup shape and is assembled to cover the cooling rod and filter in the storage space formed therein, and a plurality of inlets penetrate the side so that harmful gases in the atmosphere can be supplied to the cooling rod and filter accommodated in the storage space. And a cover through which an outlet passes through an upper end portion so that air flowing through the flow path through the filter member of the filter is discharged to the outside;

A second blower fan installed in the passage of the cover and configured to pressurize air so that external air can be discharged to the passage of the cover through the hole of the cover, the gap of the cooling rod, the filtering member of the filter and the passage; And

And a control means for controlling the driving of the thermoelectric semiconductor element so that water vapor contained in the air is not cooled below the dew point in the process of being discharged to the outlet of the cover after passing through the cooling rod and the filter after external air is inserted into the inlet of the cover.

The cooling rods of the present invention are arranged to overlap one or more rows concentrically at the center of the cooling plate, and adjacent cooling rods are arranged between the gaps so that noxious gas passing through the gaps is brought into contact.

The filter of the present invention uses a filter selected from a pre-filter, a medium filter, a HEPA filter, and a wool filter.

The control means for controlling the driving of the thermoelectric semiconductor device according to the present invention includes: a humidity sensor installed in the storage space of the cover and sensing the relative humidity of air passing through the cover;

A temperature sensor for sensing the temperature of air passing through the storage space of the cover; And

The comparison unit compares the relative humidity sensed by the humidity sensor and the current temperature sensed by the temperature sensor, and derives the corresponding dew point temperature from the pre-input storage unit, and the current temperature reaches the derived dew point temperature. And a control unit for controlling the thermoelectric semiconductor device to stop driving so that condensation does not occur in the storage space of the cover.

The present invention constituted as described above is to cool the air contaminated with the harmful gas using a thermoelectric semiconductor device so that the contaminated harmful gas particles are lumped together to be adsorbed and collected on the cooling rod, and the remaining harmful gas particles that have passed through the cooling rod There is an advantage of increasing the efficiency of removing harmful gases by filtering almost all of them in the filter.

In addition, the present invention is advantageous in that condensation can be prevented by not only cooling contaminated air to a low temperature state until it reaches the dew point to increase the efficiency of removing harmful gases, but also preventing condensation of water vapor contained in the air during use. There is this.

1 is a cross-sectional view of a harmful gas purification system according to the present invention
Figure 2 is a picture taken outside the harmful gas purification system according to the present invention
Figure 3 is another photograph taken outside the harmful gas purification system according to the present invention
Figure 4 is a photograph of the assembly state of the thermoelectric semiconductor device of the harmful gas purification system according to the present invention
Figure 5 is another photograph taken of the assembly state of the thermoelectric semiconductor device of the harmful gas purification system according to the present invention
6 is a photograph of a cooling plate and a cooling rod of the harmful gas purification system according to the present invention
7 is a photograph of the filter of the harmful gas purification system according to the present invention
Figure 8 is a photograph showing a first blowing fan by photographing the side of the harmful gas purification system according to the present invention
9 is a photograph taken inside the cover of the harmful gas purification system according to the present invention
10 is a photograph taken outside the cover of the harmful gas purification system according to the present invention
11 is a photograph in which the filter according to the present invention is assembled in a state accommodated in the cooling rod
12 is a system diagram of a control means of a harmful gas purification system according to the present invention
13 is a flow chart of the control means according to the present invention

Hereinafter, a configuration of a harmful gas purification system according to the present invention will be described in detail with reference to the accompanying drawings.

As shown in the drawing, the configuration of the harmful gas purification system 1 according to the present invention is largely a housing 2, a thermoelectric semiconductor device 3, a cooling plate 4 cooled by the thermoelectric semiconductor device 3, and the A cooling rod (5) assembled on a cooling plate (4), a filter (6) for filtering harmful gases, a heat sink (7) for cooling the thermoelectric semiconductor device (3), a first blown air for cooling the heat sink (7) A cover (9) that houses the fan (8), the cooling rod (5) and the filter (6), and a second that pressurizes the outside air so that outside air can pass through the cooling rod (5) and the filter (6). It includes a blowing fan 10, and a control means 11 for controlling the driving of the thermoelectric semiconductor device 3 above the dew point.

The housing (2) is to provide a skeleton capable of assembling by mounting and fixing the cooling plate (4) on the top, and accommodating the thermoelectric semiconductor element (3), the heat sink (7) and the first blowing fan (8) therein. . The housing 2 may be made of a metal material or a synthetic resin material having a thin thickness. The housing 2 has a structure in which air is introduced into the housing 2 and then discharged when the first blowing fan 8 is driven to pressurize the air to the heat sink 7.

The thermoelectric semiconductor element 3 is a cooling device that is assembled to be accommodated in the housing 2 and substantially cools the cooling rod 5. More specifically, in the thermoelectric semiconductor device 3 having a thin thickness, when electricity is supplied, one side becomes a cooling surface by lowering the temperature, and the other side becomes a heat dissipation surface by increasing the temperature to radiate heat from the cooling surface. This is by using endothermic or exothermic heat due to the Peltier effect. The thermoelectric semiconductor device 3 is a known technology.

One side of the cooling plate 4 is in close contact with the cooling surface of the thermoelectric semiconductor element 3 and is cooled when the thermoelectric semiconductor element 3 is driven. In the drawing, it is shown that the bottom surface is in close contact with the thermoelectric semiconductor device 3. A plurality of assembly holes 4a are formed on the upper surface of the cooling plate 4 to insert and fix the cooling rod 5. The assembly holes 4a are arranged to correspond to the outer shape of the filter 6 so as to accommodate the filter 6 in the center of the cooling plate 4. That is, since the filter 6 is configured in a cylindrical shape, the drawing shows that the assembly hole 4a is also arranged in a circular shape. Here, the assembly hole 4a in which the cooling rod 5 is assembled may be a simple assembly hole in which the cooling rod 5 is assembled in a force-fitting manner, and if a thread is formed in the cooling rod 5, the screw thread can be fastened. It may be an assembly hole with a tab formed to be able to do so.

Since the cooling plate 4 has a bottom surface in close contact with the thermoelectric semiconductor element 3 and an upper surface in close contact with the filter 6 bottom surface, it is preferable to have a flat plate shape having both sides thereof. In addition, the cooling plate 4 may be coated with a corrosion-preventing member on its unfolded surface so as to suppress or prevent corrosion from harmful gases.

Since the cooling plate 4 is cooled by the thermoelectric semiconductor element 3 and needs to transfer the cooling heat to the cooling rod 5 and the cover 9, it is preferable to be made of a metal material having good thermal conductivity. For example, the material of the cooling plate 4 may be made of silver, copper, aluminum, or the like, which has good thermal conductivity. Since silver is expensive, it can be applied thinly or coated on the aluminum surface to reduce its usage and increase thermal conductivity. Copper is cheaper than silver, but it can be recommended because its thermal conductivity is almost comparable to that of silver. Since aluminum is very cheap and easy to purchase, it is highly recommended as it can reduce manufacturing costs.

The cooling rod 5 is cooled by the thermoelectric semiconductor device 3 to cool and condense the air contaminated with harmful gas when the air contaminated with harmful gas passes through it, so that the harmful gas particles contained therein are aggregated to increase filtration efficiency. Is to do. The cooling rod 5 is arranged in a circular shape by being inserted into an assembly hole 4a formed on the other side of the cooling plate 4, that is, the upper surface of the drawing, with a gap in which a plurality of rod-shaped bodies have a gap, and the thermoelectric semiconductor device By cooling with the cooling plate 4 by (3), the temperature of the air passing through the gap is lowered to absorb and collect some of the harmful gas contained in the air. When noxious gases pass through the gap between the cooling rods 5, they are cooled by the cooling rods 5, and their particles aggregate to form large particles. It is also well filtered through the filter 6 passing through.

One end of the cooling rod 5 is inserted and fixed in an assembly hole 4a formed in the cooling plate 4. As described above, the assembly method varies depending on the assembly hole 4a formed in the cooling plate 4. If the assembly hole (4a) of the cooling plate (4) is a simple assembly hole, the cooling rod (5) is forcibly inserted and assembled, and if the tab is formed, a screw is formed at the end of the cooling rod (5), and these are fastened. Assembled.

As described above, when assembling the cooling rod 5 into the assembly hole 4a of the cooling plate 4, after assembling in a state in which a thermally conductive thermosetting adhesive is applied to the assembly part, the applied thermally conductive thermosetting adhesive at high temperature Cure Then, not only does the thermally conductive thermosetting adhesive firmly fix the cooling rod 5 with strong adhesion, but also heat from the cooling plate 4 is transferred to the cooling rod 5 as it is due to the excellent thermal conductivity of the thermally conductive thermosetting adhesive. You can reduce the loss. The thermally conductive thermosetting adhesive is a known element that is already widely used in the industrial field.

The cooling rods 5 are arranged to overlap one or more rows concentrically at the center of the cooling plate 4, and the neighboring cooling rods 5 are arranged between the gaps so that the harmful gas passing through the gaps is brought into contact. good. Since the cooling rod 5 has an area that is wider as the amount of use increases, harmful gas can be collected in proportion to the amount of use. In addition, too much use of the cooling rod 5 interferes with the air flow passing through it, so the quantity must be properly adjusted.

In addition, since the cooling rod 5 is exposed to air containing noxious gas for a long time, a corrosion preventing member is applied or coated on its surface to prevent rapid corrosion. Here, the corrosion prevention member applied to the present invention uses a known one.

In addition, the exposed end of the cooling rod 5 is rounded. When the end of the cooling rod 5 is rounded in this way, the harmful gas flowing into the filter 6 has the advantage of moving smoothly when it collides with the end of the cooling rod 5, and the corrosion preventing member is replaced with the cooling rod. When coating on 5), the ends can be coated with a uniform thickness.

Since the cooling rod 5 must be cooled by the thermoelectric semiconductor device 3, it is preferable to be made of a metal material having a good heat transfer rate, and the material may be silver, copper, aluminum, or the like.

The filter 6 filters noxious gas contained in the air passing through the cooling rod 5 while being accommodated in the cooling rod 5 so that clean air can be discharged to the outside. The filter 6 is configured in a hollow shape so that the flow path 6b is penetrated in the center of the filtering member 6a, is accommodated in the cooling rod 5, and its lower end is placed on the cooling plate 4, and the flow path 6b One end of) is closed. Accordingly, the filter 6 filters the harmful gas contained in the air passing through the filtering member 6a through the gap of the cooling rod 5 by the filtering member 6a.

More specifically, the filter 6 is blocked and closed because one end of the flow path 6b is assembled in close contact with the cooling plate 4, and the other end of the flow path 6b is connected to the outlet 9b of the cover 9 Communicate. Therefore, in the filter 6, the side filtering member 6a is opened, and the air passing through the filtering member 6a is discharged to the outlet 9b of the cover 9 via the flow path 6b.

As the filter 6, various types of filters 6 may be used according to the purpose of the present invention. For example, it is possible to select from a pre-filter, a medium filter, a HEPA filter, and a wool filter.

The pre-filter is made of non-woven fabric, can be washed with water, and has a characteristic that it can be used semi-permanently because there is no performance degradation even after a long period of use. The medium filter is a filter that keeps indoor cleanliness by filtering out fine dust and dust, and is widely used in general electronic parts companies, hospitals, and food manufacturing factories. The HEPA filter is a type of high-performance filter that removes fine particles from the air. According to the US Atomic Energy Commission's purification standards, if 99.97% of particles larger than 0.3μm (micron) can be removed, it is recognized as a HEPA filter. Hepa filters were first developed in the United States in the 1940s to remove and purify radioactive particles in the air, and have since been applied in various fields such as semiconductors, medical sciences, electronics, laboratories, and nuclear power. The HEPA filter has a structure similar to a net, allowing air to pass through and preventing particulates from passing through. The HEPA filter also filters pollen and cigarette smoke, including fine dust, and microbes such as fungi, bacteria, and viruses caught in the filter can also be destroyed and removed due to lack of moisture. On the other hand, the Ulpa filter is a material that can replace glass fiber, and is a next-generation filter that can also solve the environmental pollution problem that occurs when the glass fiber is discarded. It can be used as an air filter for air purification in semiconductor and LCD clean rooms, and as an air filter for automobiles. It is also applied as a material for ultra-light body armor or as a medical wound bandage. The Ulpa filter is a high-efficiency filter that can filter over 99.999% of ultra-fine particles of 100 nm size.

The radiating plate 7 is closely assembled with the radiating surface of the thermoelectric semiconductor device 3 and cooled by air cooling to cool the radiating surface of the thermoelectric semiconductor device 3. The heat sink 7 has a structure in which the body is cooled because the air is passed through in contact with the bent body when air is pumped. The heat sink 7 is a known one.

The first blowing fan 8 is mounted on the housing 2 so as to be disposed on one side of the heat sink 7, and when power is supplied, the air is cooled while passing through the heat sink 7 to cool the air to the heat sink 7 ). The first blowing fan 8 is also known in the art.

The cover 9 guides air to pass through the cooling rod 5 and filter 6 while protecting the cooling rod 5 and the filter 6 accommodated therein. This cover 9 is composed of a cup shape and is assembled to cover the storage space formed therein with the cooling rod 5 and the filter 6 received therein, and a cooling rod in which harmful gases in the atmosphere are accommodated in the storage space. (5) A plurality of inlets (9a) are passed through the side to be supplied to the filter (6), and the air flowing through the flow path (6b) through the filter member (6a) of the filter (6) is discharged to the outside. The outlet 9b is passed through the upper end to be able to.

The cover 9 has a flange 9c protruding so that it can be closely fixed to the cooling plate 4 at the front end of the receiving space. After covering the cooling rod 5 so that the cooling rod 5 is accommodated in the internal receiving space, and the flange 9c and the upper surface of the cooling plate 4 are in close contact with each other, the flange is fastened with a clamp (not shown). (9c) and the cooling plate (4) are fastened and fixed in close contact. Then, the cooling heat of the cooling plate 4 is transferred to the cover 9 so that the cover 9 is also cooled together with the cooling plate 4.

The second blowing fan 10 is installed in the passage of the cover 9, and external air is supplied through the hole of the cover 9, the gap of the cooling rod 5, the filtering member 6a of the filter 6 and the flow path ( It functions to pressurize air so that it can be discharged to the outlet 9b of the cover 9 via 6b). In the case of the second blowing fan 10, a known one is also used.

In addition, the control means 11 for controlling the driving of the thermoelectric semiconductor element 3 passes through the cooling rod 5 and the filter 6 after external air is inserted into the inlet 9a of the cover 9 In the process of being discharged to the outlet 9b of 9), it functions to control the driving of the thermoelectric semiconductor device 3 so that water vapor contained in the air is not cooled below the dew point.

The control means (11) is installed in the storage space of the cover (9), a humidity sensor (11a) for sensing the relative humidity of the air passing through the cover (9);

A temperature sensor (11b) for sensing the temperature of air passing through the storage space of the cover (9); And

The comparison unit 11c compares the relative humidity sensed by the humidity sensor 11a and the current temperature sensed by the temperature sensor 11b, and derives the corresponding dew point temperature from the pre-input storage unit 11d. Thus, when the current temperature reaches the derived dew point temperature, the thermoelectric semiconductor device 3 is stopped and the control unit 11e controls not to generate condensation in the storage space of the cover 9.

When air containing harmful gases passes through the inside of the cover 9, it is cooled by the cooling plate 4, the cooling rod 5 and the cover 9 cooled by the thermoelectric semiconductor element 3, and this process When supercooled in, condensation occurs due to condensation of water vapor contained in the air. When condensation occurs, the environment becomes a good environment for fungal bacteria to live, so workers are exposed to an unsanitary environment, so condensation should be prevented.

In order to keep the air passing through the cover 9 above the dew point, it is essential to sense the relative humidity and the current temperature. In other words, by comparing the sensed relative humidity and the current temperature, the dew point temperature corresponding to the previously inputted to the storage unit 11d is derived in advance, and the current temperature reaches the derived dew point temperature, and the controller 11e The driving of the semiconductor device 3 is stopped so that the air passing through the cover 9 is no longer lowered.

For reference, Table 1 below shows the dew point temperature according to the relative humidity and air temperature. The data of Table 1 is previously input to the storage 11d of FIG. 12.

For example, assuming that the humidity sensor 11a senses a relative temperature of 80% and the temperature sensor 11b senses the current temperature of 5°C, the dew point temperature at this time is 1.9°C. When the control unit 11e sends the humidity information sensed by the humidity sensor 11a and the degree of temperature at which the current temperature is sensed to the comparison unit 11c, the comparison unit 11c compares these humidity and temperature to determine the dew point at that time. When the temperature is deduced to be 1.9°C and sent to the control unit 11e, the control unit 11e operates thermoelectric power until the temperature of the air passing through the cover 9 reaches 1.9°C with the help of the temperature sensor 11b. The semiconductor device 3 is continuously driven, and when it reaches 1.9℃, the driving of the thermoelectric semiconductor device 3 is immediately stopped so that the air passing through the cover 9 does not fall below the dew point to prevent condensation. .

In the same way, assuming that the humidity sensor 11a senses a relative temperature of 60% and the temperature sensor 11b senses the current temperature at 0°C, the dew point temperature at this time is -6.5°C. When the control unit 11e sends the humidity information sensed by the humidity sensor 11a and the degree of temperature at which the current temperature is sensed to the comparison unit 11c, the comparison unit 11c compares these humidity and temperature to determine the dew point at that time. If the temperature is -6.5℃ and sent to the control unit 11e, the control unit 11e continues to drive the thermoelectric semiconductor device 3 until the temperature of the air passing through the cover 9 reaches -6.5℃. When it reaches -6.5℃, the driving of the thermoelectric semiconductor element 3 is immediately stopped so that the air passing through the cover 9 does not lower the dew point below to prevent condensation.

13 is a flowchart showing a series of control processes for controlling the thermoelectric semiconductor element 3 to prevent condensation as described above.

In the present invention, since the air being purified can be adjusted so that it does not fall below the dew point by using the control means 11 for controlling the driving of the thermoelectric semiconductor device 3, it is possible to prevent condensation during air purification, so that it can be managed hygienically. It has the advantage of being able to.

In the harmful gas purification system of the present invention configured as described above, the cooling rod 5 cooled by the thermoelectric semiconductor device 3 cools the air containing the harmful gas to largely aggregate the harmful gas particles, so that part of the cooling rod ( 5), and the lump of harmful gas with large particles passing through the cooling rod (5) is easily filtered by the filter (6), so that the efficiency of removing harmful gas can be improved, and the cooled air is below the dew point. Since it is not lowered and condensation does not occur, it is an advantageous invention that has more advancement than the conventional air purifier.

1: hazardous gas purification system 2: housing
3: thermoelectric semiconductor device 4: cooling plate
5: cooling rod 6: filter
7: heat sink 8: first blowing fan
9: cover 10: second ventilation fan
11: control means

Claims (4)

A housing 2 formed to allow air to enter and exit;
A thermoelectric semiconductor device (3) housed inside the housing (2), and one side becomes a cooling surface when electricity is supplied, and the other side becomes a heat dissipation surface by increasing the temperature to dissipate heat from the cooling surface. );
A cooling plate 4 whose one side is in close contact with the cooling surface of the thermoelectric semiconductor device 3 to cool when the thermoelectric semiconductor device 3 is driven;
A plurality of rod-shaped bodies are inserted and fixed to be disposed in a circular shape on the other side of the cooling plate 4 with a gap, and cooled together with the cooling plate 4 by the thermoelectric semiconductor element 3 to pass through the gaps. A cooling rod 5 that lowers the temperature of the air passing through it to absorb and collect some of the harmful gas contained in the air;
The flow path 6b penetrates the center of the filtering member 6a, and is accommodated in the cooling rod 5 arranged in a circular shape, and the lower end thereof is placed on the cooling plate 4, so that one end of the flow path 6b is closed. And, the filter 6 for filtering the harmful gas contained in the air passing through the filtering member 6a through the gap of the cooling rod 5 by the filtering member 6a;
A heat dissipation plate 7 that is closely assembled with the heat dissipation surface of the thermoelectric semiconductor device 3 and is cooled by air cooling to cool the heat dissipation surface of the thermoelectric semiconductor device 3;
It is mounted on the housing 2 so as to be disposed on one side of the heat sink 7 and when power is supplied, air is pushed through the heat sink 7 to cool the heat sink 7 so that the heat sink 7 is a thermoelectric semiconductor A first blowing fan 8 for cooling the radiating surface of the element 3;
It is assembled in a cup shape to cover the storage space formed therein with the cooling rod 5 and the filter 6 accommodated, and the cooling rod 5 and the filter ( A plurality of inlets (9a) are passed through the side to be supplied to 6), and the air flowing through the flow path (6b) passing through the filtration member (6a) of the filter (6) is discharged to the outside. A cover 9 through which 9b) passes;
It is installed in the passage of the cover 9, and external air passes through the hole of the cover 9, the gap of the cooling rod 5, the filtration member 6a of the filter 6 and the flow path 6b. ) A second blowing fan 10 for pumping air so that it can be discharged through the passage; And
Water vapor contained in the air is below the dew point in the process of being discharged to the outlet (9b) of the cover (9) after external air is inserted into the inlet (9a) of the cover (9), passes through the cooling rod (5) and the filter (6). Including; control means 11 for controlling the drive of the thermoelectric semiconductor element 3 so as not to be cooled by,

Here, the cooling rods 5 are arranged to overlap one or more rows concentrically at the center of the cooling plate 4, and the adjacent cooling rods 5 are disposed between the gaps so that the harmful gases passing through the gaps come into contact. and,

The filter 6 is selected from a pre-filter, a medium filter, a HEPA filter, and a wool filter,

The control means 11 for controlling the driving of the thermoelectric semiconductor device 3 is installed in the storage space of the cover 9, and a humidity sensor 11a that senses the relative humidity of air passing through the cover 9 );
A temperature sensor (11b) for sensing the temperature of air passing through the storage space of the cover (9); And
The comparison unit 11c compares the relative humidity sensed by the humidity sensor 11a and the current temperature sensed by the temperature sensor 11b, and the corresponding dew point temperature is derived from the pre-input storage unit 11d. Thus, when the current temperature reaches the derived dew point temperature, the thermoelectric semiconductor device 3 is stopped and the control unit 11e controls not to generate condensation in the storage space of the cover 9. Noxious gas purification system characterized by.
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