KR102139185B1 - Thermal Reversible binder material for electronic parts and Manufacturing Method of Molded Inductor - Google Patents

Abstract

The present invention mixes a binder material that solidifies at room temperature, softens at a predetermined temperature, and is irreversibly deformed at a high temperature, and a powder material for molding, and thus has an effect of easily manufacturing electronic parts of various shapes and uses, and improving process efficiency by reducing the number of processes by adopting a bobbin for winding a coil as a mold material.

Description

Thermal reversible binder material for electronic parts and manufacturing method of molded inductor using same {Thermal Reversible binder material for electronic parts and Manufacturing Method of Molded Inductor}

The present invention relates to a thermoreversible binder material for electronic components and a method of manufacturing a molded inductor using the same. More specifically, it is solidified at room temperature and softened at a predetermined temperature so that electronic components of various shapes and functions can be manufactured very easily. In the range, a binder material that is irreversibly deformed is formed, and the bobbin for winding the coil itself is adopted as a mold material to improve process efficiency during the process of the molded inductor, and a method of manufacturing a molded inductor using the same About.

In recent years, the demand for integrated inductors for mounting is increasing according to the trend of high performance and slimming of various electronic devices and parts. In particular, improved power supply to stably perform many functions in notebooks, mobile devices, LCD TVs/monitors, and computer devices. Means are being demanded.

Here, various power circuits such as a DC-DC converter, a buck converter, and a boost converter are used as the power supply means. In the case of supplying power to a terminal device, a boosted and stepped DC voltage is supplied using a DC-DC converter. Is done.

An inductor is used in such a power circuit. In general, an inductor is one of the most important components that make up an electric circuit along with a resistor and a capacitor, and a solenoid wrapped in an insulating material, such as copper or aluminum, and wound several times in a screw shape, or a coil wound multiple times. It is the most basic circuit component and circuit element formed by.

Recently, the development of inductors with excellent low loss characteristics and DC superimposition characteristics has been requested, and magnetic metal powder and coil elements coated with insulation with an inductor in response to these requests are placed in a mold and press-molded to form a magnetic core, that is, the inductor body. A molded inductor in which a coil element is embedded inside is being developed.

Korean Patent Registration No. 10-1481414 registered by the present applicant has been disclosed as a technical document for such a conventional molded inductor, and FIG. 1 is a process diagram showing a method of manufacturing a conventional molded inductor.

Here, looking at the manufacturing method of the conventional mold-type inductor, as shown in FIG. 1, the first molding material supply process (S1) for mounting the first mold molding material M1 formed of the mold molding powder material MP into a predetermined shape. )and; Press this to the first pressurized molding material (M2) Molded A first compression step (S2); A pressurization port removing step (S3) of removing the pressurization port; A coil seating step (S4) of seating the air core coil (C) on the upper surface of the lower mold (10); A coil fixing step (S5) for fixing with the upper mold 20; A second molding material supply step (S6) of inputting a second mold molding material (M3); And a second pressing step (S7) of pressing and molding the air core coil (C) provided between the second mold forming member (M3) and the first pressing member (M2).

However, in the conventional method of manufacturing a molded inductor, the air core coil (C) is seated on the lower mold (10), and the air core coil (C) is held in a flat plate shape so that the air core coil (C) can be pressed and fixed with the upper mold (20). There is a problem in that a fixed frame or mold for holding the air core coil C must be separately manufactured.

In addition, in the conventional method of manufacturing a molded inductor, the air core coil (C) is not located in the center of the mold molding material during the second compression process (S7) of compressing the air core coil (C), and the phenomenon of being pulled in one direction There was a problem that caused the efficiency of the product to decrease.

On the other hand, in the conventional method of manufacturing a molded inductor, once the molded material is molded, it is impossible to reshape it, so all defective products in which the air core coil (C) is oriented in one direction are discarded, resulting in a significant decrease in production efficiency. there was.

The present invention was created to solve the problems of the prior art as described above. The object of the present invention is to mix a binder material and a powder material for molding that are solidified at room temperature, softened at a predetermined temperature, and irreversibly deformed at a high temperature. , A thermoreversible binder material for electronic parts that can easily manufacture electronic parts of various shapes and uses, and improve process efficiency by reducing the number of processes by adopting the bobbin itself for winding the coil as a mold material, and a molded inductor using the same. To provide a manufacturing method of.

The thermoreversible binder material for electronic parts according to the present invention for achieving the above object is a thermoreversible binder material for electronic parts that is solidified at room temperature and softened at a predetermined temperature, and is a first epoxy having epihalohydrin functional groups. Agents having 50 to 89% by weight, 5 to 10% by weight of a second epoxy made of bisphenol epoxy, 5 to 30% by weight of a first solidifying agent having a functional group of amides, and a functional group of polyacylenepolyamines 2 It is characterized by consisting of 1 to 10% by weight of the solidifying agent.

The epihalohydrins of the first epoxy may be any of epichlorohydrin, epibromohydrin, epifluorohydrin, and epiiodiohydrin. It is characterized by being formed into one.

The diglycidyls of the first epoxy are diglycidyl ether, diglycidyl ether 1,3-butanediol, 1,2, It is characterized in that it is formed of any one of 5,6-diepoxyhexane (1,2,5,6-diepoxyhexane) and aliphatic diepoxide.

The first solidifying agent is characterized in that it is formed of dicyandiamide.

The second solidifying agent is diethylenetriamine, triethylenetetramine, tetraethylenepentamine, dipropylenetriamine, dihexamethylenetriamine, (dihexamethylenetriamine), pentaethylene It is characterized in that it is formed of any one of hexaamine (pentaethylenehexamine).

In order to achieve the above object, the method of manufacturing a molded inductor using a thermoreversible binder material for electronic components according to the present invention is: i) After mixing 90 to 98% by weight of magnetic powder and 2 to 10% by weight of the binder material, at room temperature A material preparation step of solidifying; ii) a material shaping step of shaping the solidified material into a bobbin shape; iii) a coil winding step of winding a coil on the outer peripheral surface of the molded bobbin; iv) a material supply step of introducing the coiled bobbin into a press mold; v) a press molding step of heating the press mold to a predetermined temperature and then pressing it to soften the physical properties of the bobbin to mold the coil into the bobbin; vi) It is characterized in that it consists of a product completion step in which the inductor molded in v) is pulled out and then heated to a predetermined temperature to irreversibly solidify.

v) It is characterized in that the predetermined temperature in the press molding step is formed at 100 ~ 140 ℃.

vi) It is characterized in that the predetermined temperature in the product completion stage is formed at 140~220℃.

As described above, the thermoreversible binder material for an electronic component and a method of manufacturing a molded inductor using the same according to the present invention have the following effects.

First, by providing a binder material mixed with a powder material for molding at a predetermined weight ratio, a reversible molding material that solidifies at room temperature and softens at a prescribed temperature, and a molding material that is irreversibly deformed at a high temperature is formed in various shapes and uses. Of electronic components can be manufactured very easily,

Second, after forming the powder material for molding mixed with the binder material into a bobbin shape, winding the coil on the outer circumference of the bobbin and press-molding the coiled bobbin itself at a predetermined temperature, after separately preparing the existing mold material and the coil. By adopting the bobbin itself for winding the coil, not the method of molding, as a mold material, process efficiency can be greatly improved by reducing the number of processes.

Third, by inserting the coil into the outer circumferential surface of the bobbin having a predetermined strength and then press molding, the coil position can be placed in the center by preventing the coil from being pulled in one direction during press molding, thereby improving the efficiency of the inductor. have.

1 is a process chart showing a method of manufacturing a conventional molded inductor,
2 is a flowchart showing a method of manufacturing a molded inductor using a thermoreversible binder material for electronic components according to the present invention.

Hereinafter, an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

The thermoreversible binder material for electronic parts according to the present invention is a thermoreversible binder material for electronic parts that is solidified at room temperature and softened at a predetermined temperature. 50 to 89% by weight of the first epoxy having epihalohydrin functional groups, 5 to 10% by weight of a second epoxy made of bisphenol epoxy, 5 to 30% by weight of a first solidifying agent having a functional group of amides, and 1 to 10% by weight of a second solidifying agent having a functional group of polyacylenepolyamines It consists of %.

On the other hand, the epihalohydrin is composed of epihalohydrin having a short chain and a long chain, and the first epoxy and the second epoxy are formed as a product with a wide interval between the heat deformation temperature and the heat treatment temperature. It is desirable to be.

In addition, the solvent to which a solvent is selectively added to make a uniform liquid by mixing the first and second epoxy and the first and second solidifying agents is a ketone solvent such as acetone and MEK, and isopropyl alcohol ( It is preferable to use alcohol solvents such as isopropyl alcohol) n-butyl alcohol and ethyl alcohol individually or in combination.

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In addition, the epihalohydrins of the first epoxy are epichlorohydrin, epibromohydrin, epifluorohydrin, and epiiodiohydrin. It is formed in any one of.

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In addition, the first solidifying agent is formed of dicyandiamide.

In addition, the second solidifying agent is diethylene triamine, triethylene tetramine, tetraethylene pentamine, di propylene triamine, dihexa It is formed by any one of methylene triamine (dihexa methylene triamine) and penta ethylene hexamine (penta ethylene hexamine).

Meanwhile, the second solidifying agent is diethylene triamine, triethylene tetramine, tetraethylene pentamine, di propylene triamine, and dihexa. It is also preferable to use a mixture of methylene triamine (dihexa methylene triamine) and penta ethylene hexamine (penta ethylene hexamine).

Here, the second solidifying agent is formed in the following structure.

Here, R is hydrogen, C1-C4 alkyl or C-C hydroxyalkyl, R is an alkylene having 2 to 6 carbon atoms independently of other R, and x is an integer of 1 to 5.

The method of manufacturing a molded inductor using a thermoreversible binder material for electronic parts according to the present invention is as shown in FIG. 2, i) at room temperature after mixing 90 to 98% by weight of magnetic powder and 2 to 10% by weight of the binder material. A material preparation step of solidifying (S10); ii) a material shaping step (S20) of shaping the solidified material into a bobbin shape; iii) a coil winding step (S30) of winding the coil (C) on the outer peripheral surface of the molded bobbin (B); iv) a material supply step (S40) of introducing the bobbin (B) on which the coil (C) is wound into the press mold (P); v) Press molding step (S50) of heating the press mold (P) to a predetermined temperature and then pressurizing to soften the physical properties of the bobbin (B) to mold the coil (C) inside the bobbin (B) Wow; vi) A product completion step (S60) in which the inductor (I) molded in v) is pulled out and then heated to a predetermined temperature to irreversibly solidify.

On the other hand, in order to improve the characteristics of the product to be made, it is preferable to mix a thermoset magnetic body or a sintered magnetic body prepared in advance in a separate process with a powder mixture of a thermoreversible binder material and magnetic powder, and mold it into a bobbin type material.

Herein, the binder material is preferably mixed with the magnetic powder in a solid state rather than a liquid state, and after adding another process to the inductor (I) pressed before the product completion step (S60), irreversible It may also be desirable to solidify with.

Here, the binder material can perform reversible and irreversible actions by temperature even through mixing with various solid materials such as powdered metals, ceramics, and engineering plastics other than the magnetic powder.

And, v) the predetermined temperature of the press molding step (S50) is formed to 100 ~ 140 ℃, vi) the predetermined temperature of the product completion step (S60) is formed to 140 ~ 220 ℃.

The operation of the thermoreversible binder material for electronic parts according to the present invention having the above-described configuration is as follows.

The thermally reversible binder material for electronic parts includes 50 to 89 wt% of the first epoxy having epihalohydrin functional groups, 5 to 10 wt% of the second epoxy composed of bisphenol epoxy, and amide functional groups. By consisting of 5 to 30% by weight of the first solidifying agent and 1 to 10% by weight of the second solidifying agent having a functional group of polyacylenepolyamines, a binder material that is solidified at room temperature and softened at a predetermined temperature is completed.

Here, after mixing the binder material and the molding powder material such as magnetic powder mixed at the predetermined weight ratio, it is heated to a temperature of 100 to 140°C to soften it to the extent that the injection process is possible, and it is high enough to allow precise mechanical processing by cooling at room temperature. Since it becomes possible to repeat the conversion, it is possible to very easily mold electronic parts of various shapes and uses.

Here, room temperature refers to the average temperature formed at 15°C to 25°C.

Meanwhile, after mixing the binder material and the molding powder material, it is molded into an electronic component of a predetermined shape, and then heated to a temperature of 180°C to 220°C to finally transform it into an irreversible property, thereby producing a final product. You will be able to.

The operation of the thermoreversible binder material for electronic components according to the present invention having the above configuration and the method of manufacturing a molded inductor using the same is as follows.

In the method of manufacturing a molded inductor according to the present invention having the above configuration, as shown in FIG. 2, a coil winding step (S30) of winding a coil (C) on the outer circumferential surface of the bobbin (B) formed of a binder material proceeds. As a result, the process efficiency is greatly improved by reducing the number of processes by adopting the bobbin (B) that winds the coil (C) as a mold material instead of a method of individually preparing the existing mold material and the coil (C) and then molding. You can make it.

Here, in the conventional method of manufacturing a molded inductor, in order to wind the coil C in the form of a first coil, a coil C is prepared in advance through a winding mold, and the mold material is prepared up and down, and the coil C is interposed therebetween. The process of preparing by winding a coil and preparing a mold material are unnecessary, and the process efficiency can be greatly improved.

Meanwhile, since the coil C is disposed on the outer circumferential surface of the bobbin B having a predetermined strength, it is possible to prevent the coil C from being pulled in one direction when it is pressed at a predetermined temperature.

In addition, v) the inductor (I) molded in the press molding step (S50) is pulled out and then heated to a predetermined temperature to irreversibly solidify the product, thereby proceeding to the product completion step (S60), where softening and solidification were repeatedly reversible. By irreversibly solidifying the product, it is possible to prevent the product from being deformed at a predetermined temperature during use.

The present invention is not limited to the specific preferred embodiments described above, and any person having ordinary knowledge in the technical field to which the present invention pertains without departing from the gist of the present invention claimed in the claims can implement various modifications Of course, such changes will fall within the scope of the claims description.

<Description of symbols for major parts of drawings>
C: coil B: bobbin
P: Press mold I: Inductor
S10: material preparation step S20: material shaping step
S30: coil winding step S40: material supply step
S50: Press forming step S60: Product completion step

Claims (8)

In the thermoreversible binder material for electronic parts that is solidified at room temperature and softened at a predetermined temperature,
50 to 89 wt% of the first epoxy having epihalohydrin functional groups, 5 to 10 wt% of the second epoxy consisting of bisphenol epoxy, and 5 to 30 wt% of the first solidifying agent having functional groups of amides And 1 to 10% by weight of a second solidifying agent having a functional group of polyalkylene polyamines. The method of claim 1,
The epihalohydrins of the first epoxy may be any of epichlorohydrin, epibromohydrin, epifluorohydrin, and epiiodiohydrin. Thermoreversible binder material for electronic parts, characterized in that formed as one. delete The method of claim 1,
The first solidifying agent is a thermoreversible binder material for electronic parts, characterized in that formed of dicyandiamide. The method of claim 1,
The second solidifying agent is diethylenetriamine, triethylenetetramine, tetraethylenepentamine, dipropylenetriamine, dihexamethylenetriamine, (dihexamethylenetriamine), pentaethylene Thermoreversible binder material for electronic components, characterized in that formed by any one of hexaamine (pentaethylenehexamine). In the method of manufacturing a molded inductor using the binder material of any one of claims 1, 2, 4 and 5,
i) a material preparation step (S10) of mixing 90 to 98% by weight of magnetic powder and 2 to 10% by weight of the binder material and solidifying at room temperature;
ii) a material shaping step (S20) of shaping the solidified material into a bobbin shape;
iii) a coil winding step (S30) of winding a coil (C) on the outer peripheral surface of the molded bobbin (B);
iv) a material supply step (S40) of introducing the bobbin (B) on which the coil (C) is wound into the press mold (P);
v) Press molding step (S50) of heating the press mold (P) to a predetermined temperature and then pressurizing to soften the physical properties of the bobbin (B) to mold the coil (C) inside the bobbin (B) Wow;
vi) A method of manufacturing a molded inductor, characterized in that it comprises a product completion step (S60) in which the inductor (I) molded in v) is pulled out, heated to a predetermined temperature, and solidified irreversibly. The method of claim 6,
The method of manufacturing a molded inductor, characterized in that the predetermined temperature in the v) press molding step (S50) is formed at 100 to 140°C. The method of claim 6,
The method of manufacturing a molded inductor, characterized in that the predetermined temperature in the vi) product completion step (S60) is formed at 140 to 220°C.

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