KR102131342B1 - Aesa radar cooling device and aesa radar comprising thereof - Google Patents

Abstract

AESA radar cooling apparatus according to an embodiment of performing a cooling of a radar having a TR module array having a plurality of TR modules installed so that a part is exposed to the front, a plurality of each contacting the rear of the plurality of TR modules It may include a thermoelectric element array having a thermoelectric element and a control unit that is electrically connected to the plurality of thermoelectric elements to apply a current.

Description

AESA radar cooling device and AESA radar including the same {AESA RADAR COOLING DEVICE AND AESA RADAR COMPRISING THEREOF}

The present invention relates to an AESA radar cooling device and an AESA radar comprising the same.

An active electronically scanned array (AESA) radar includes a plurality of TR modules (transmit/receive modules, TRMs) arranged on an antenna surface and arranged in an array. It is a radar device capable of forming beams in a desired direction.

Here, a plurality of TR modules can transmit/receive signals and generate electromagnetic energy on their own. In addition, each TR module can be individually controlled to steer the emitted beam and adjust the width of the beam.

Follow, the AESA radar has no mechanical drive, has a low failure rate, high reliability, and has excellent characteristics that can detect multiple targets with high resolution through multiple beam control.

However, in the AESA radar, since hundreds or thousands of TR modules are generally arranged, it was an important task to cool the heat generated by each TR module.

Conventionally, a method in which a plurality of TR modules cools the entire module using a cooling water circulating device has been used, but when cooling the module using only the cooling water, there is a problem that the size of the cooling water circulating device becomes large and heavy.

In addition, a plurality of TR modules have different frequencies and can be operated independently, so that a difference in heat generation can be formed for each TR module. However, there was a problem in that the operation of the cooling was inefficient because the conventional method could not supply the proper cooling.

Accordingly, the need for developing an AESA radar cooling device capable of reducing the size and weight of the AESA radar by reducing the dependence of the existing cooling water circulation device and supplying the required cooling for each TR module is increasing.

The above-described background technology is possessed or acquired by the inventor during the derivation process of the present invention, and is not necessarily a known technology disclosed to the public before the filing of the present invention.

The purpose of one embodiment is to provide an AESA radar cooling device and an AESA radar comprising the same.

AESA radar cooling apparatus according to an embodiment of performing a cooling of a radar having a TR module array having a plurality of TR modules installed so that a part is exposed to the front, a plurality of each contacting the rear of the plurality of TR modules A thermoelectric element array having thermoelectric elements; And a control unit electrically connected to the plurality of thermoelectric elements to apply a current.

The control unit may individually cool the plurality of TR modules by applying current to each of the plurality of thermoelectric elements.

The control unit may measure a difference in voltage formed in the thermoelectric element, and measure the heat generation amount of the TR module contacting the thermoelectric element based on the difference in voltage.

The controller may individually adjust the amount of heat absorbed by each thermoelectric element by selectively controlling the amount of current applied to each thermoelectric element based on the heat generation amount of each TR module.

The AESA radar cooling apparatus according to an embodiment is installed to contact the cooling water circulating device and the thermoelectric element array for cooling the cooling water for cooling the thermoelectric element array, and supplying the cooling water, and supplied from the cooling water circulating device A cooling pipe for circulating cooling water may be further included, and the control unit may control the cooling water circulating device to control the temperature and flow rate of the cooling water.

The thermoelectric element includes a P-type semiconductor; An N-type semiconductor spaced apart from the P-type semiconductor; An endothermic electrode connecting between one surface of the P-type semiconductor and the N-type semiconductor; A heat radiation electrode formed on the other surfaces of the P-type semiconductor and the N-type semiconductor and electrically connected to the control unit; A first insulating plate attached to one surface of the heat absorbing electrode and the other surface of the TR module; And a second insulating plate connected between one exposed surface of each of the heat dissipation electrodes and in contact with the cooling pipe, and a portion of the section of the cooling pipe contacting the second insulating plate includes the P-type semiconductor and N The type semiconductor may proceed along a spaced apart direction.

The cooling pipe may be formed of a plurality of cooling pipes that individually circulate the cooling water of the cooling water circulation device, and may be installed for each of the plurality of thermoelectric elements, and the control unit may individually control the flow rate of cooling water flowing in the plurality of cooling pipes. Can be adjusted.

The control unit selectively adjusts the flow rate of the cooling water of the cooling pipes installed in each thermoelectric element based on the amount of heat generated by each TR module or the amount of current applied to each thermoelectric element, so that the Heat dissipation can be individually adjusted.

The cooling pipe may be formed of a plurality of cooling pipes for individually circulating the cooling water of the cooling water circulation device, and the plurality of cooling pipes may be installed for each group of at least two adjacent thermoelectric elements among the plurality of thermoelectric elements. The control unit may individually control flow rates of cooling water flowing in the plurality of cooling pipes.

The control unit may individually adjust the heat dissipation amount of each thermoelectric element by selectively adjusting the flow rate of the cooling water of the cooling pipe installed in the group of thermoelectric elements based on the heat amount of each TR module.

AESA radar according to an embodiment of the present invention includes a TR module array having a plurality of TR modules installed to expose a portion of the front; And the above-described AESA radar cooling device that performs cooling of the TR module array.

According to the AESA radar cooling apparatus of an embodiment, since the method using the cooling water and the thermoelectric element are used at the same time, the size and weight of the cooling water circulation device can be easily designed.

According to the AESA radar cooling device according to an embodiment, since it is possible to detect the amount of heat generated by each TR module, only necessary cooling for each TR module can be supplied through individual control of the cooling water circulation device and the plurality of thermoelectric elements.

According to the AESA radar cooling apparatus according to an embodiment, a plurality of cooling pipes may be individually or grouped to be connected to a plurality of thermoelectric elements to form independent cooling water circulation paths, thereby efficiently providing the required amount of heat dissipation for each thermoelectric element. have.

1 is a view showing the state of the aircraft.
2 is a view showing an AESA radar device according to an embodiment.
3 is a view showing a TR module array and an AESA radar cooling device according to an embodiment.
4 is a view showing a thermoelectric element according to an embodiment.
5 is a block diagram showing an AESA radar cooling apparatus according to an embodiment.
6 is a block diagram showing an AESA radar cooling device according to another embodiment.

Hereinafter, embodiments will be described in detail through exemplary drawings. It should be noted that in adding reference numerals to the components of each drawing, the same components have the same reference numerals as possible, even if they are displayed on different drawings. In addition, in describing the embodiments, when it is determined that detailed descriptions of related well-known configurations or functions interfere with understanding of the embodiments, detailed descriptions thereof will be omitted.

In addition, in describing the components of the embodiment, terms such as first, second, A, B, (a), (b), and the like can be used. These terms are only for distinguishing the component from other components, and the nature, order, or order of the component is not limited by the term. When a component is described as being "connected", "coupled" or "connected" to another component, that component may be directly connected to or connected to the other component, but another component between each component It should be understood that may be "connected", "coupled" or "connected".

Components included in any one embodiment and components including common functions will be described using the same name in other embodiments. Unless there is an objection to the contrary, the description described in any one embodiment may be applied to other embodiments, and a detailed description will be omitted in the overlapped range.

1 is a view showing the appearance of a vehicle, FIG. 2 is a view showing an AESA radar device according to an embodiment, FIG. 3 is a view showing a TR module array and an AESA radar cooling device according to an embodiment, and FIG. 4 is an embodiment FIG. 5 is a block diagram showing an AESA radar cooling device according to an embodiment.

1 to 5, the AESA radar cooling apparatus 1 according to an embodiment is an AESA radar 8 disposed in a radome 92 formed in the foremost portion of the fuselage 91 of the air vehicle 9 It may be a device for cooling.

For example, the AESA radar 8 includes a TR module array 81 composed of a plurality of transmit/receive modules 811 (hereinafter referred to as TR modules) having a transmit/receive function by itself on the front side. It may be an active electronically scanned radar (Active Electronically Scanned Array Radar, hereinafter referred to as AESA radar).

For example, the plurality of TR modules 811 may be formed in a number of hundreds to thousands or more, and may be uniformly arranged along the front surface of the AESA radar 8 to form the TR module array 81. For example, the plurality of TR modules 811 may have an array shape spaced apart at regular intervals along the horizontal and vertical directions from the front surface of the AESA radar 8.

The AESA radar cooling apparatus 1 according to an embodiment may cool the heat generated when a plurality of TR modules 811 of the TR module array 81 provided in the AESA radar 8 is operated.

For example, the AESA radar cooling device 1 may include a thermoelectric element array 11, a cooling water circulation device 13, a cooling pipe 14 and a control unit 15.

The thermoelectric element array 11 is disposed in the AESA radar 8 and is attached to the rear of the TR module array 81 based on the traveling direction of the vehicle 9 to absorb heat generated by the plurality of TR modules 811 can do.

For example, the thermoelectric element array 11 may be formed of an array of a plurality of thermoelectric elements 111, and the plurality of thermoelectric elements 111 may be arranged to be attached to the rear surface of the plurality of TR modules 811. have. Accordingly, the shape of the arrangement in which the plurality of thermoelectric elements 111 are disposed is the same as the shape of the arrangement in which the plurality of TR modules 811 are disposed, and the number may also be the same.

Here, the thermoelectric element (111) is a device using the effect of the interaction of heat and electricity, Seebeck effect, which generates electromotive force due to the temperature difference, and Peltier, which absorbs or generates heat by electric current. It may be a device that generates an effect (Peltier effect).

For example, the plurality of thermoelectric elements 111 may be operated by being electrically connected to the control unit 15, respectively. For example, the thermoelectric element 111 may induce an endothermic reaction by one side of the thermoelectric element 111 generated by receiving a current in one direction from the control unit 15, and induce an exothermic reaction on the other side. have. Therefore, the thermoelectric element 111 may cool the TR module 811 by generating an endothermic reaction at a portion attached to the TR module 811.

For example, the plurality of thermoelectric elements 111 may detect an exothermic reaction occurring in the TR module 811. For example, when the TR module 811 is operated and heat is generated, electromotive force may be generated due to a temperature difference formed in the thermoelectric element 111, and accordingly, the control unit 15 may be operated from the thermoelectric element 111. By detecting the amount of power applied or changed, the presence or absence of heat generated by the TR module 811 and the amount of heat generated can be measured.

For example, the thermoelectric element 111 includes a P-type semiconductor 1111, an N-type semiconductor 1112, an endothermic electrode 1113, a heat radiating electrode 1114, a first insulating plate 1115, and a second insulating plate 1116 ).

The P-type semiconductor 1111 may be a semiconductor whose number of holes is increased by adding a group 3 element having three outermost electrons to the semiconductor.

The N-type semiconductor 1112 may be a semiconductor in which the number of electrons is increased by adding a group 5 element having 5 outermost electrons to the semiconductor. For example, the P-type semiconductor 1111 and the N-type semiconductor 1112 may have the same size to each other, and may be disposed spaced apart at regular intervals in parallel with each other in one direction.

The endothermic electrode 1113 may connect between one surface of each of the P-type semiconductor 1111 and the N-type semiconductor 1112 in parallel. For example, the endothermic electrode 1113 may be in contact with the first insulating plate 1115 between the rear surfaces of the TR module 811 to absorb heat generated by the TR module 811.

The heat dissipation electrode 1114 may be formed on the other surface on which the endothermic electrode is not formed, according to directions in which the P-type semiconductor 1111 and the N-type semiconductor 1112 are disposed in parallel. For example, the heat dissipation electrode 1114 of each of the P-type semiconductor 1111 and the N-type semiconductor 1112 is electrically connected to the control unit 15 to generate a thermoelectric effect according to current or heat interaction.

The first insulating plate 1115 may be formed to cover the exposed surface of the heat absorbing electrode 1113, thereby preventing leakage of electric current passing through the heat absorbing electrode 1113. For example, the outer surface of the first insulating plate 1115 may directly contact the rear surface of the TR module 811.

The second insulating plate 1116 is formed to heat the exposed surface of the heat dissipation electrode 1114 to prevent leakage of current passing through the heat dissipation electrode 1114. For example, a cooling pipe 14 for dissipating heat discharged from the heat-dissipating electrode 1114 portion of the thermoelectric element 111 may be contacted and installed on the outer surface of the second insulating plate 1116.

The cooling water circulating device 13 may supply cooling water capable of dissipating or absorbing heat absorbed by the thermoelectric element array 11 in the TR module array 81.

For example, the coolant circulation device 13 may be disposed within the AESA radar 8, but a configuration in which the coolant circulation device 13 is located outside the AESA radar 8 may also be possible. For example, the cooling water circulation device 13 may be driven by the control unit 15. For example, the cooling water circulating device 13 may maintain the temperature of the cooling water constant, and may form a pressure for circulating the cooling water through the cooling pipe 14.

The cooling pipe 14 is a pipe through which the cooling water supplied from the cooling water circulating device 13 circulates, is in contact with the rear surface of the thermoelectric element 111, that is, the second insulating plate 1116, and the heat of the thermoelectric element 111 It can function as an absorption source.

For example, the cooling pipe 14 cools the cooling water from the discharge pipe 141 and the discharge pipe 141 from the portion receiving the cooling water from the cooling water circulation device 13 to the portion contacting the thermoelectric element 111. It may include a recovery pipe 142 to recover to the circulation device (13).

For example, a plurality of cooling pipes 14 may be formed and installed to contact the second insulating plate 1116 of each of the plurality of thermoelectric elements 111. In this case, the plurality of cooling pipes 14 may be independently connected to each other from the cooling water circulation device 13 to form a circulation path for individual cooling water.

For example, the cooling pipe 14 may include an overall flow path of the plurality of cooling pipes 14 or a valve configuration for controlling individual flows of the cooling pipes 14.

A portion of the section of the cooling pipe 14 installed on the second insulating plate 1116 may be placed along the longitudinal direction of the thermoelectric element 111, as shown in FIG. 4. In other words, a portion of the cooling pipe 14 installed on the second insulating plate 1116 follows the direction in which the P-type semiconductor 1111 and the N-type semiconductor 1112 are spaced apart from each other on the second insulating plate 1116. It can be installed in close contact.

For example, the shape of the cooling pipe 14 contacting the thermoelectric element 111 is a part of the cooling pipe 14 from the edge portion of one side of the second insulating plate 1116 along the longitudinal direction of the thermoelectric element 111 After being contacted and extended to the other edge portion on the opposite side according to the longitudinal direction of the thermoelectric element 111, and then bent toward the opposite direction from the other edge portion, the second insulating plate 1116 again along the longitudinal direction of the thermoelectric element 111 ) May have a shape extending toward one edge portion.

For example, as shown in FIG. 4, the cooling pipe 14 may be bent once and circulated along the length direction of the thermoelectric element 111, as well as the length direction of the thermoelectric element 111 twice or more. Accordingly, the structure may be stacked by reciprocating multiple times.

In general, since a single thermoelectric element 111 is small, it may be difficult to form a circulation path in which the cooling pipe 14 is bent and stacked multiple times in the second insulating plate 1116.

However, according to the above structure, since the cooling pipe 14 has a path extending from the rear surface of the thermoelectric element 111 mainly along the longitudinal direction of the thermoelectric element 111, the longest possible cooling water that can be structurally acceptable A circulation path can be formed, so that high heat exchange performance can be achieved.

The control unit 15 can apply power to the AESA radar cooling device 1, and can control the overall operation. For example, the control unit 15 controls the AESA radar 8 capable of processing through signals measured in the TR module array 81 and controlling the frequency of electromagnetic waves formed by the plurality of TR modules 811. You can also do

For example, the control unit 15 may be electrically connected to the plurality of thermoelectric elements 111 to apply a current. For example, the control unit 15 may individually apply a current to each of the plurality of thermoelectric elements 111, and the amount of the current may be adjusted to cool the plurality of TR modules 811 individually. .

For example, the control unit 15 may detect that a voltage difference is formed between the heat dissipation electrodes 1114 of the thermoelectric element 111 or the applied voltage changes according to the heat generated by the TR module 811, , Through this, it is possible to check the presence or absence of heat generation of the TR module 811. In addition, it is possible to measure the amount of heat generated by the TR module 811 based on the difference in voltage.

According to the above structure, the control unit 15 may be capable of measuring the amount of heat generated by each of the plurality of TR modules 811 of the TR module array 81, and according to the presence or absence of heat generated by each TR module 811 and the amount of heat generated. By adjusting the amount of current applied to the thermoelectric element 111 corresponding to each, it is possible to adjust the cooling performance of the thermoelectric element 111 in proportion to the amount of heat generated by the TR module 811.

For example, the control unit 15 may be connected to the cooling water circulation device 13 to control the temperature of the cooling water, and individually flow rate of cooling water supplied from the cooling water circulation device 13 to the plurality of cooling pipes 14 Can be adjusted.

For example, the control unit 15 controls the flow rate of cooling water flowing into the plurality of cooling pipes 24 based on the amount of heat generated by the plurality of TR modules 811 or the amount of current applied to the plurality of thermoelectric elements 111. Can.

According to the above structure, the heat dissipation electrode 1114 of the thermoelectric element 111 is proportional to the amount of heat generated by each TR module 811 or the amount of heat absorbed by the heat absorbing electrode 1113 of the thermoelectric element 111 corresponding to each. Since it may be possible to control the size of heat dissipation to be formed, it is possible to keep the cooling efficiency of the individual thermoelectric elements 111 constant, and it is possible to efficiently manage energy consumed for driving the cooling water circulation device 13. .

As a result, the AESA radar cooling device 1 according to an embodiment of the present invention is used to measure the individual heat values of the plurality of TR modules 811 in cooling the TR module array 81 where local heat generation differences may occur. By controlling the amount of heat absorbed by the thermoelectric element 111 accordingly, it may be possible to cool the TR module array 81 effectively and efficiently.

Compared to the AESA radar cooling apparatus 1 according to an embodiment and a conventional cooling apparatus that performs cooling using only cooling water without a thermoelectric element, it is possible to reduce the dependence of cooling water on the cooling of the TR module array 11 Therefore, in the design of the AESA radar 8, it is advantageous to achieve compactness and light weight, since the volume and weight of the coolant circulation device 13, which occupies a relatively large volume and weight in the AESA radar 8, can be effectively reduced. Can.

6 is a block diagram showing an AESA radar cooling device according to another embodiment.

Referring to FIG. 6, the AESA radar cooling device 2 having a configuration of a cooling pipe 24 different from the cooling pipe 14 of the AESA radar cooling device 1 according to the embodiment shown in FIGS. 1 to 5 is confirmed. Can.

For example, the AESA radar cooling device 2 may include a thermoelectric element array 11, a cooling water circulation device 23, a cooling pipe 24, and a control unit 25.

The thermoelectric element array 11 may be composed of a plurality of thermoelectric elements 111, and each thermoelectric element 111 may contact the rear surface of each TR module 811.

The cooling water circulation device 23 may circulate cooling water for absorbing heat discharged from the thermoelectric element 111 through the cooling pipe 24.

The cooling pipe 24 may be a heat sink that contacts the plurality of thermoelectric elements 111 and cools the heat emitted from the thermoelectric elements 111 with cooling water.

For example, a plurality of cooling pipes 24 may be formed. In this case, the plurality of cooling pipes 24 may circulate the cooling water individually or independently from the cooling water circulation device 23.

Unlike the plurality of cooling pipes 14 shown in FIGS. 1 to 5 individually connected 1:1 to each of the plurality of thermoelectric elements 111, the plurality of cooling pipes 24 according to the embodiment of FIG. At least two or more of the plurality of thermoelectric elements 111 may be connected to each group G formed of adjacent thermoelectric elements 111.

In other words, one cooling pipe 24 may be configured to be responsible for heat dissipation of at least two or more thermoelectric elements 111. Specifically, one cooling pipe 24 having a single circulation path may be configured to continuously circulate each insulating layer of two or more thermoelectric elements 111.

In this case, the control unit 25 controls the cooling water circulation device 23 to individually or independently control the amount of cooling water flowing into the plurality of cooling pipes 24 connected to each group G of the plurality of thermoelectric elements 111. Can be adjusted.

Meanwhile, as illustrated in FIG. 6, two thermoelectric elements 111 are illustrated as forming one group G, but not only two, but also three or more thermoelectric elements 111 are formed as one group ( It should also be understood that G) can be formed.

For example, the control unit 25 controls the flow rate of cooling water flowing into the plurality of cooling pipes 24 based on the amount of heat generated by the plurality of TR modules 811 or the amount of current applied to the plurality of thermoelectric elements 111. Can. For example, the control unit 25, the cooling pipe circulating each group (G) based on the average value of the heat value of the plurality of TR modules 811 connected to each group (G) of the plurality of thermoelectric elements 111 ( The flow rate of the cooling water of 24) can be adjusted.

For example, the control unit 25, the cooling water for each cooling pipe 24 circulating each group (G) based on the average value of the amount of current applied to each group (G) of the plurality of thermoelectric elements 111 The flow rate can be adjusted.

According to the above structure, the cooling pipes 14 connected 1:1 as shown in FIGS. 1 to 5 can reduce the number of cooling pipes 24 and the circulation path of cooling water than the configuration of the thermoelectric element 111. This can be simplified.

Accordingly, since the control configurations of the cooling water circulating device 23 and the control unit 25 for circulating the cooling water individually through the cooling pipe 24 can also be simplified, the AESA radar cooling device 2 is relatively manufactured and It can be more efficient in operation.

Although the embodiments have been described by the limited drawings as described above, a person skilled in the art can make various modifications and variations from the above description. For example, the described techniques may be performed in a different order than the described method, and/or components such as the structure, device, etc. described may be combined or combined in a different form from the described method, or may be applied to other components or equivalents. Even if replaced or substituted by, appropriate results can be achieved.

Claims (11)

In the AESA radar cooling device for performing the cooling of the radar having a TR module array having a plurality of TR modules that are installed to expose a portion in the front,
An array of thermoelectric elements having a plurality of thermoelectric elements which are arranged in an array corresponding to the plurality of TR modules in a 1:1 relationship, and which respectively contact the rear surfaces of the plurality of TR modules;
A cooling water circulation device that cools cooling water for cooling the thermoelectric element array and supplies the cooling water;
A plurality of cooling pipes which are installed for each group of at least two or more adjacent thermoelectric elements among the plurality of thermoelectric elements and circulates cooling water supplied from the cooling water circulation device individually; And
It is electrically connected to the plurality of thermoelectric elements to apply a current, and includes a control unit for controlling the cooling water circulation device,
The control unit may measure a) a difference in voltage formed in the thermoelectric element, and measure the calorific value of each TR module in contact with the thermoelectric element based on the difference in voltage, and b) the respective Based on the heat generation amount of the TR module, the amount of current applied to each thermoelectric element is selectively controlled to individually adjust the heat absorption of the plurality of thermoelectric elements, and c) based on the amount of current applied to the group of thermoelectric elements. AESA radar cooling device for controlling the heat dissipation of the plurality of thermoelectric elements for each group by adjusting the flow rate of the cooling water of the cooling pipe installed for each group of the thermoelectric elements.
delete delete delete delete According to claim 1,
The thermoelectric element
P-type semiconductor;
An N-type semiconductor spaced apart from the P-type semiconductor;
An endothermic electrode connecting between one surface of the P-type semiconductor and the N-type semiconductor;
A heat radiation electrode formed on the other surfaces of the P-type semiconductor and the N-type semiconductor and electrically connected to the control unit;
A first insulating plate attached to one surface of the heat absorbing electrode and the other surface of the TR module; And
A second insulating plate connected between exposed surfaces of each of the heat radiation electrodes and in contact with the cooling pipe,
AESA radar cooling apparatus, characterized in that a part of the section of the cooling pipe contacting the second insulating plate proceeds along a direction in which the P-type semiconductor and the N-type semiconductor are spaced apart.
delete delete delete delete A TR module array having a plurality of TR modules installed to expose a portion of the front; And
An AESA radar comprising the AESA radar cooling device of claim 1 that performs cooling of the TR module array.

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