KR102117627B1 - RGB LED Module with optical lens - Google Patents

RGB LED Module with optical lens Download PDF

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KR102117627B1
KR102117627B1 KR1020180131087A KR20180131087A KR102117627B1 KR 102117627 B1 KR102117627 B1 KR 102117627B1 KR 1020180131087 A KR1020180131087 A KR 1020180131087A KR 20180131087 A KR20180131087 A KR 20180131087A KR 102117627 B1 KR102117627 B1 KR 102117627B1
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led chip
weight
diffusion lens
protective cover
module case
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KR20200048705A (en
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나정훈
라희석
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주식회사 인터원
라희석
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26—Materials of the light emitting region
    • H01L33/30—Materials of the light emitting region containing only elements of group III and group V of the periodic system
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
  • Led Device Packages (AREA)

Abstract

본 발명은 확산렌즈를 적용하여 발산되는 빛이 160도의 지향각을 갖도록 하되 확산렌즈의 내면에 다수의 요홈을 형성하여 확산렌즈를 통과하는 빛을 산란시켜 레드, 그린, 블루 빛이 서로 합쳐져 채널간판을 투과할 때 백색을 구현할 수 있도록 한 확산렌즈가 적용된 알지비 풀 컬러 엘이디 모듈을 개시한다.In the present invention, a diffused lens is applied so that the emitted light has a directivity of 160 degrees, but a plurality of grooves are formed on the inner surface of the diffused lens to scatter the light passing through the diffused lens, and red, green, and blue light are combined with each other to form a channel sign. Disclosed is an Algibi full color LED module to which a diffusing lens is applied so as to realize white when passing through.

Description

확산렌즈가 적용된 알지비 풀 컬러 엘이디 모듈{RGB LED Module with optical lens}RGB LED Module with optical lens

본 발명은 확산렌즈가 적용된 알지비 풀 컬러 엘이디 모듈에 관한 것으로, 더욱 상세하게는 확산렌즈를 적용하여 발산되는 빛이 160도의 지향각을 갖도록 하되 확산렌즈의 내면에 다수의 요홈을 형성하여 확산렌즈를 통과하는 빛을 산란시켜 레드, 그린, 블루 빛이 서로 합쳐져 채널간판을 투과할 때 백색을 구현할 수 있도록 한 확산렌즈가 적용된 알지비 풀 컬러 엘이디 모듈에 관한 것이다.The present invention relates to a full HD LED module with a diffusion lens applied, and more specifically, a diffusion lens is formed by applying a diffusion lens so that light emitted has a directivity of 160 degrees, but a plurality of grooves are formed on the inner surface of the diffusion lens. It is related to the Algibi full color LED module applied with a diffuser lens that scatters the light passing through and red, green, and blue light are combined with each other to realize white when passing through the channel sign.

일반적으로 엘이디(LED ; light-emitting diode)란 발광 다이오드 소자를 칭하는 것으로, GaP, GaAs 등의 화합물 반도체의 PN접합에 전류가 흐를 때 빛이 발생하는 현상을 이용한 소자를 말한다. 이러한 엘이디는 그 사용 범위가 광범위하며, 따라서 다양한 제품에 적용되고 있다. Generally, an LED (light-emitting diode) refers to a light-emitting diode device, and refers to a device using a phenomenon in which light is generated when a current flows through a PN junction of a compound semiconductor such as GaP and GaAs. These LEDs have a wide range of uses, and thus are applied to various products.

일례를 들면, 채널간판의 조명으로 사용되는 엘이디 모듈이 있다. 즉, 채널간판에 적용되는 엘이디 모듈은 입체문자 표현을 위하여 다양한 모양으로 절곡 형성되고 전면에는 빛이 투과할 수 있는 아크릴판이 구비된 채널간판의 내부에 설치되는 것으로, 채널간판 내에 소정 간격을 두고 여러 개가 설치되어 조명으로 사용된다.For example, there is an LED module used as a lighting for a channel sign. That is, the LED module applied to the channel sign is bent in various shapes for three-dimensional character expression and is installed inside the channel sign with an acrylic panel through which light can be transmitted. The dog is installed and used as lighting.

이를 좀더 설명하면, 채널간판에 적용되는 엘이디 모듈에 사용되는 모든 엘이디 칩은 지향각이 125도가 기본이며, 따라서 지향각을 고려하여 여러 개가 설치된다. 즉, 채널간판에 적용되는 엘이디 모듈의 설치 간격이 많이 떨어지게 되면 빛이 닿지 않는 부분에 음영이 생겨 어둡게 표현되는 증상이 나타나게 되며, 따라서 엘이디 모듈은 지향각을 고려하여 적당한 간격을 두고 여러 개가 설치된다.To explain this in more detail, all LED chips used in the LED module applied to the channel signboard have a basic angle of 125 degrees, so a plurality of LED chips are installed in consideration of the orientation angle. In other words, if the installation distance of the LED module applied to the channel sign is greatly reduced, a shadow appears on the part where the light does not reach, resulting in a dark expression. Therefore, several LED modules are installed at appropriate intervals in consideration of the directivity angle. .

그리고 채널간판에 적용되는 엘이디 모듈은 한 가지 색만을 발산하는 단색 제품과 빛의 삼원색인 레드, 그린, 블루 색상의 빛을 선택적으로 발산 및 혼합하여 다양한 색을 발산하는 알지비 풀 컬러 제품(RGB FULL COLOR LED)으로 구분되는 데, 최근에는 다양한 색상을 구현하기 위해 알지비 풀 컬러 엘이디 모듈이 많이 사용되고 있다.In addition, the LED module applied to the channel signage is a full-color product (RGB FULL) that emits a variety of colors by selectively emitting and mixing light in the primary, red, green, and blue colors that emit only one color. COLOR LED), and recently, the RGB full color LED module has been widely used to implement various colors.

그러나 알지비 풀 컬러 엘이디 모듈은 고가이기 때문에 채널간판 내에 많이 설치하게 되면 설치 비용 및 유지보수 비용이 많이 드는 문제점이 있다. However, because the RGB full color LED module is expensive, there is a problem in that installation cost and maintenance cost are high if it is installed in the channel signboard.

이러한 문제점을 해결하기 위해 채널간판에 적용되는 알지비 풀 컬러 엘이디 모듈에 확산렌즈를 적용하여 발산되는 빛의 지향각을 넓히는 개발이 연구되고 있다. 즉, 지향각을 160도로 넓혀주게 되면 30% 정도의 설치 비용 및 유지 비용이 절감되는 효과가 있다.In order to solve this problem, development of widening the directivity of the divergent light by applying a diffusion lens to the RGB full color LED module applied to the channel signboard is being studied. That is, if the directional angle is widened to 160 degrees, there is an effect of reducing installation and maintenance costs by about 30%.

그러나 채널간판에 적용되는 알지비 풀 컬러 엘이디 모듈에 종래의 일반적인 확산렌즈를 적용하여 지향각을 넓히게 되면, 도 1의 실험 사진에 도시된 바와 같이 채널간판의 전면에 무지개 색이 표현되는 문제점이 있다. 즉, 종래의 확산렌즈는 외면과 내면에 거칠기가 없이 매끄럽기 때문에 빛이 통과할 때 산란되지 않고 단순하게 굴절되어 통과하게 되는 데, 그러다 보니 레드, 그린, 블루 색상(RGB)의 빛을 함께 발산하게 되면 색이 합쳐지지 않는 부분이 생기며, 이 부분에서 도 1과 같이 무지개 색이 표현되어 채널간판에 불량이 생기는 문제점이 있다.However, when a conventional general diffusion lens is applied to an Algibi full color LED module applied to the channel sign to widen the viewing angle, there is a problem in that a rainbow color is expressed on the front surface of the channel sign as shown in the experimental picture of FIG. 1. . That is, the conventional diffusion lens is smooth without roughness on the outer surface and the inner surface, and is not scattered when light passes, but simply refracts and passes through it, so that red, green, and blue colors (RGB) are emitted together. When this is done, a part in which the colors do not merge occurs, and a rainbow color is expressed as shown in FIG. 1, whereby a defect occurs in the channel sign.

1) 대한민국 등록특허 제10-1078218호(등록일: 2011년10월25일), 발명의 명칭: "확산렌즈가 구비된 ＬＥＤ모듈"1) Republic of Korea Patent Registration No. 10-1078218 (Registration Date: October 25, 2011), Name of the invention: "Led module with diffuse lens" 2) 대한민국 등록특허 제10-1122220호(등록일: 2012년02월23일), 발명의 명칭: "간판용 ＬＥＤ 모듈 조립체"2) Republic of Korea Registered Patent No. 10-1122220 (Registration Date: February 23, 2012), Name of the invention: "LED module assembly for signboards" 3) 대한민국 등록특허 제10-1469820호(등록일: 2014년12월01일), 발명의 명칭: "간판용 LED 모듈 및 그 조립체"3) Korean Patent No. 10-1469820 (Registration Date: December 01, 2014), Name of the invention: "LED module for signboard and its assembly" 4) 대한민국 등록특허 제10-0807267호(등록일: 2008년02월19일), 발명의 명칭: "삼색 엘이디 칩을 이용한 광고간판 및 엘이디 모듈제어장치"4) Republic of Korea Registered Patent No. 10-0807267 (Registration Date: February 19, 2008), Name of the invention: "Advertising signboard and LED module control device using tricolor LED chip"

본 발명은 상술한 문제점을 개선하기 위해 제안된 것으로, 그 목적은 확산렌즈를 적용하여 발산되는 빛이 160도의 지향각을 갖도록 하되, 확산렌즈의 내면에 거칠기를 주기 위해 다수의 요홈을 형성하여 확산렌즈를 통과하는 빛이 산란되면서 레드, 그린, 블루 빛이 서로 합쳐져 채널간판에 표현될 때 백색을 구현할 수 있도록 한 확산렌즈가 적용된 알지비 풀 컬러 엘이디 모듈을 제공하는 데 있다.The present invention has been proposed to improve the above-mentioned problems, the purpose of which is to apply a diffusion lens so that the emitted light has a directivity of 160 degrees, but by forming a plurality of grooves to give roughness to the inner surface of the diffusion lens, diffusion It is to provide an Algibi full color LED module with a diffusion lens that allows white to be realized when red, green, and blue light are combined with each other as light passing through the lens is scattered.

상술한 목적은, 상면이 개구된 밀폐 형상을 갖는 모듈케이스와, 모듈케이스의 양측으로 관통되게 설치된 전선과, 모듈케이스 내부에서 전선과 전기적으로 연결되게 설치되고, 전선을 통해 전류가 공급되면 상방향으로 빛을 발산하며, 레드 LED 칩, 그린 LED 칩, 블루 LED 칩이 세트로 구성되어 신호에 따라 레드 LED 칩, 그린 LED 칩, 블루 LED 칩이 각각 개별적으로 또는 함께 빛을 발산하도록 설치된 LED 칩과, 모듈케이스의 상면에 씌워져 모듈케이스를 밀폐시키게 결합되고, LED 칩과 대응되는 위치에 LED 칩에서 발산되는 빛을 160도의 지향각을 갖도록 확산시키는 확산렌즈가 일체로 형성된 보호커버로 이루어지고, 채널간판의 내부에 설치되어 조명으로 사용되며, 상기 확산렌즈는 내면에 다수의 요홈을 형성하여 레드 LED 칩, 그린 LED 칩, 블루 LED 칩에서 발산되는 빛이 확산렌즈를 통과하면서 산란되어 레드, 그린, 블루 빛이 서로 합쳐져 채널간판에 표현될 때 백색을 구현할 수 있도록 구성되되, 상기 요홈은 0.1㎜ 직경으로 형성되되, 확산렌즈의 내면에 전체적으로 요홈이 형성되는 것을 100%로 보았을 때 46% 내지 49%가 골고루 분산되게 형성되도록 구성되며, 상기 보호커버는 사출성형으로 제조되되, 상기 사출성형에 사용되는 사출금형은 보호커버의 상면과 대응되는 홈부를 갖는 상부금형과 보호커버의 하면과 대응되는 돌부를 갖는 하부금형으로 이루어지고, 상기 하부금형에는 보호커버의 확산렌즈와 대응되는 부분에 다수의 미세돌기가 돌출 형성되어, 사출금형을 통해 확산렌즈가 일체로 형성된 보호커버를 사출할 때 확산렌즈의 내면에 하부금형의 미세돌기로 인해 다수의 요홈이 형성되게 구성되며, 상기 모듈케이스와 보호커버의 외면에 수지조성물을 스프레이방식으로 도포하여 항균방오층을 형성하되, 상기 수지조성물은 카본블랙 5중량%와, 0.1㎛의 입도를 갖는 일라이트분말 5중량%와, 포타슘실리케이트 5중량%와, 올레아미드 3.5중량%와, 인산에스테르나트륨염 2.5중량%와, 옥타메틸사이클로테트라실록산 5중량%와, 이산화티탄 4.5중량%와, 이소퀴놀린 알칼로이드 5중량%와, 노닐페놀 에톡시레이트 3.5중량% 및 나머지 중량%는 폴리프로필렌수지로 이루어진 것을 특징으로 하는 확산렌즈가 적용된 알지비 풀 컬러 엘이디 모듈에 의해 달성된다.The above-mentioned object is installed in a module case having a sealed shape with an open top surface, wires installed to penetrate both sides of the module case, and electrically connected to wires inside the module case, and when current is supplied through the wires, upward direction It emits light, and consists of a set of red LED chips, green LED chips, and blue LED chips. Depending on the signal, the red LED chips, green LED chips, and blue LED chips are individually or together installed to emit light. , It is composed of a protective cover integrally formed with a diffusion lens covering the upper surface of the module case to seal the module case, and diffusing the light emitted from the LED chip at a position corresponding to the LED chip so as to have a directivity of 160 degrees. It is installed inside the signboard and used as lighting. When blue light is combined with each other and expressed on the channel sign, it is configured to realize white, but the groove is formed with a diameter of 0.1 mm, and when viewed as 100%, the groove is formed on the inner surface of the diffusion lens at 46% to 49%. It is configured to be evenly distributed, the protective cover is manufactured by injection molding, the injection mold used in the injection molding is an upper mold having a groove corresponding to the upper surface of the protective cover and a protrusion corresponding to the lower surface of the protective cover It is made of a lower mold having a plurality of fine protrusions protrudingly formed in a portion corresponding to the diffusion lens of the protective cover, and the inner surface of the diffusion lens when injecting the protective cover in which the diffusion lens is integrally formed through the injection mold. A plurality of grooves are formed due to the fine protrusions of the lower mold, and the resin composition is applied to the outer surfaces of the module case and the protective cover by spraying to form an antibacterial antifouling layer, wherein the resin composition is 5% by weight of carbon black. Wow, 5% by weight of an illite powder having a particle size of 0.1 μm, 5% by weight of potassium silicate, 3.5% by weight of oleamide, 2.5% by weight of sodium phosphate sodium salt, and octamethyl 5% by weight of cyclotetrasiloxane, 4.5% by weight of titanium dioxide, 5% by weight of isoquinoline alkaloids, 3.5% by weight of nonylphenol ethoxylate, and the remaining weight% of polypropylene resin are used. It is achieved by a non-full color LED module.

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본 발명에 따른 확산렌즈가 적용된 알지비 풀 컬러 엘이디 모듈은 확산렌즈를 적용하여 발산되는 빛이 160도의 지향각을 갖도록 하였기 때문에 채널간판에 설치할 때 갯수를 줄여 설치 비용 및 유지보수 비용을 절감할 수 있는 효과가 있다. The RGB full color LED module to which the diffuser lens according to the present invention is applied is applied to the diffuser lens so that the emitted light has a directivity of 160 degrees, thereby reducing the number of installations on the channel signage, thereby reducing installation and maintenance costs. It has an effect.

또한, 본 발명에 따른 확산렌즈가 적용된 알지비 풀 컬러 엘이디 모듈은 확산렌즈의 내면에 다수의 요홈을 통해 거칠기를 주어 확산렌즈를 통과하는 빛이 산란되면서 레드, 그린, 블루 빛이 합쳐져 채널간판에 표현될 때 백색을 구현할 수 있는 효과가 있다. 즉, 본 발명을 채널간판에 적용하면 레드, 그린, 블루 색상을 선택적으로 표현할 수 있고, 백색도 표현할 수 있기 때문에 제품의 우수성이 향상되고 경쟁력을 갖게 되는 효과가 있다.In addition, the Algibi full color LED module to which the diffusion lens according to the present invention is applied is given a roughness through a plurality of grooves on the inner surface of the diffusion lens, and as the light passing through the diffusion lens is scattered, red, green, and blue light are combined to the channel signboard. When expressed, there is an effect that can realize white. In other words, when the present invention is applied to a channel sign, red, green, and blue colors can be selectively expressed, and white can also be expressed, thereby improving product excellence and competitive advantage.

도 1은 종래의 일반적인 확산렌즈가 적용된 알지비 풀 컬러 엘이디 모듈을 적용했을 때 RGB에서 함께 발산되는 색깔이 채널간판에 표시된 상태를 나타낸 실험 사진,
도 2는 본 발명에 따른 확산렌즈가 적용된 알지비 풀 컬러 엘이디 모듈을 나타낸 사시도,
도 3은 본 발명에 따른 확산렌즈가 적용된 알지비 풀 컬러 엘이디 모듈을 나타낸 단면도,
도 4는 본 발명의 제조방법을 설명하기 위해 사출금형을 개략적으로 나타낸 분리 단면도,
도 5는 본 발명에 따른 확산렌즈가 적용된 알지비 풀 컬러 엘이디 모듈을 적용했을 때 RGB에서 함께 발산되는 색깔이 채널간판에 표시된 상태를 나타낸 실험 사진.1 is an experimental photograph showing a state in which a color emitted from RGB is displayed on a channel signboard when an Algibi full color LED module with a conventional general diffusion lens is applied,
Figure 2 is a perspective view showing a full-color LED module of the RGB applied diffusion lens according to the present invention,
Figure 3 is a cross-sectional view showing the full-color LED module of the RGB applied diffusion lens according to the present invention,
Figure 4 is a separate cross-sectional view schematically showing the injection mold to explain the manufacturing method of the present invention,
FIG. 5 is an experimental photograph showing a state in which colors emitted from RGB are displayed on a channel signboard when the RGB full color LED module to which the diffusion lens according to the present invention is applied is applied.

첨부된 도면들을 참조하여 본 발명에 대해 상세히 설명하면 다음과 같다. The present invention will be described in detail with reference to the accompanying drawings.

도 2와 도 3을 참조하면, 본 발명에 따른 확산렌즈가 적용된 알지비 풀 컬러 엘이디 모듈은 채널간판의 내부에 설치되어 조명으로 사용되는 것으로, 모듈케이스(100)와, 모듈케이스(100)의 상면에 씌워지게 결합되는 보호커버(200)로 구성된다.2 and 3, the Algibi full color LED module to which the diffusion lens according to the present invention is applied is installed inside the channel signboard and is used as a lighting, the module case 100 and the module case 100 It is composed of a protective cover 200 that is coupled to be covered on the upper surface.

먼저, 모듈케이스(100)는 상면이 개구된 밀폐 형상을 갖도록 구성되며, 양측에는 전선(110)이 바닥을 관통하게 설치된다. 그리고 모듈케이스(100) 내부에는 인쇄회로기판(130)에 설치되어 전선(110)과 전기적으로 연결되고, 전선(110)을 통해 전류가 공급되면 상방향으로 빛을 발산하는 LED 칩(120)이 설치된다. 물론, LED 칩(120)은 레드 LED 칩(122), 그린 LED 칩(124), 블루 LED 칩(126)이 세트로 구성되어 신호에 따라 레드 LED 칩(122), 그린 LED 칩(124), 블루 LED 칩(126)이 각각 개별적으로 또는 함께 빛을 발산하는 RGB LED 칩이 적용된다.First, the module case 100 is configured to have a closed shape with an open top surface, and wires 110 are installed on both sides to penetrate the floor. And inside the module case 100 is installed on the printed circuit board 130 is electrically connected to the wire 110, when the current is supplied through the wire 110, the LED chip 120 that emits light upwards Is installed. Of course, the LED chip 120 is composed of a set of red LED chip 122, green LED chip 124, and blue LED chip 126, and the red LED chip 122, the green LED chip 124 according to the signal, RGB LED chips are applied in which the blue LED chips 126 emit light individually or together.

다음으로, 보호커버(200)는 모듈케이스(100)의 상면에 씌워져 모듈케이스(100)를 내부를 밀폐시키게 결합되는 것으로, LED 칩(120)과 대응되는 위치에 LED 칩(120)에서 발산되는 빛을 160도의 지향각을 갖도록 확산시키는 확산렌즈(210)가 일체로 형성된 구조를 갖는다.Next, the protective cover 200 is covered on the upper surface of the module case 100 to be coupled to seal the inside of the module case 100, and is emitted from the LED chip 120 in a position corresponding to the LED chip 120 It has a structure in which a diffusion lens 210 that diffuses light to have a directivity of 160 degrees is integrally formed.

특히, 본 발명은 확산렌즈(210)가 개선된 점에 특징이 있는 것으로, 본 발명에 적용된 확산렌즈(210)는 내면에 다수의 요홈(212)을 형성하여 레드 LED 칩(122), 그린 LED 칩(124), 블루 LED 칩(126)에서 발산되는 빛이 확산렌즈(210)를 통과할 때 산란되어 레드, 그린, 블루 빛(RGB)이 서로 합쳐져 채널간판에 표현될 때 백색을 구현할 수 있도록 구성된다.In particular, the present invention is characterized in that the diffusing lens 210 is improved, and the diffusing lens 210 applied to the present invention forms a plurality of grooves 212 on its inner surface to form a red LED chip 122 and a green LED. The light emitted from the chip 124 and the blue LED chip 126 is scattered when passing through the diffusion lens 210 so that red, green, and blue light (RGB) are combined with each other to realize white when expressed on the channel signboard. It is composed.

이를 위해, 상기 요홈(212)은 0.1㎜ 내지 0.2㎜ 사이의 직경을 갖도록 형성되고, 확산렌즈(210)의 내면에 전체적으로 요홈(212)이 형성되는 것을 100%로 보았을 때 46% 내지 49%가 골고루 분산되게 형성되도록 구성된다. To this end, the grooves 212 are formed to have a diameter between 0.1 mm to 0.2 mm, and 46% to 49% when 100% of the grooves 212 are formed on the inner surface of the diffusion lens 210 as a whole. It is configured to be evenly distributed.

바람직하게는, 상기 요홈(212)은 0.1㎜ 직경으로 형성되고, 요홈과 요홈 사이의 간격은 0.1㎜를 유지하여 요홈(212)이 전체적으로 46% 내지 49%가 형성되도록 골고루 분산되게 형성하는 것이 좋다.Preferably, the grooves 212 are formed to have a diameter of 0.1 mm, and the spacing between the grooves and the grooves is maintained at 0.1 mm so that the grooves 212 are evenly distributed such that 46% to 49% are formed as a whole. .

이는 실험을 통해 확인한 결과로, 확산렌즈(210)의 내면에 전체적으로 46% 내지 49%로 요홈(212)이 형성되었을 때 레드 LED 칩(122), 그린 LED 칩(124), 블루 LED 칩(126)에서 발산되는 빛이 확산렌즈(210)를 통과할 때 산란되어 레드, 그린, 블루 빛(RGB)이 서로 합쳐져 채널간판에 표현될 때 도 5와 같이 백색을 구현하는 것을 확인하였다.This is a result confirmed through experiments, when the recess 212 is formed with 46% to 49% on the inner surface of the diffusion lens 210, the red LED chip 122, the green LED chip 124, and the blue LED chip 126 When the light emitted from) passes through the diffusion lens 210 and is scattered, red, green, and blue light (RGB) are combined with each other, and when expressed on the channel signboard, it was confirmed that white is implemented.

그리고 확산렌즈(210)의 내면에 요홈(212)을 90% 내지 50%로 형성하였을 때는 산란 현상이 너무 심해서 채널간판으로 빛이 정확하게 투과되지 않는 문제점이 나타나는 것을 확인하였고, 요홈(212)을 45% 이하로 형성하였을 때는 투명도가 높아져 빛의 산란이 너무 약하기 때문에 도 1과 같은 문제점이 계속 있는 것을 확인하였다.In addition, when the grooves 212 were formed from 90% to 50% on the inner surface of the diffusion lens 210, it was confirmed that the scattering phenomenon was so severe that the light was not accurately transmitted to the channel sign, and the grooves 212 were 45 When it was formed below%, it was confirmed that the problem as shown in FIG. 1 continued because the transparency increased and the light scattering was too weak.

여기서, 확산렌즈(210)의 요홈(212)은 보호커버(200)를 사출성형할 때 형성되도록 하면 된다.Here, the groove 212 of the diffusion lens 210 may be formed when the protective cover 200 is injection molded.

즉, 도 4에 도시된 바와 같이 사출성형에 사용되는 사출금형은 보호커버(200)의 상면과 대응되는 홈부(12)를 갖는 상부금형(10)과, 보호커버(200)의 하면과 대응되는 돌부(22)를 갖는 하부금형(20)으로 이루어지고, 하부금형(20)에는 보호커버(200)의 확산렌즈(210)와 대응되는 부분에 다수의 미세돌기(24)가 돌출 형성되게 구성된다. That is, as shown in Figure 4, the injection mold used for injection molding corresponds to the upper mold 10 having a groove 12 corresponding to the upper surface of the protective cover 200 and the lower surface of the protective cover 200 It is made of a lower mold 20 having a protrusion 22, and the lower mold 20 is configured such that a plurality of fine protrusions 24 protrude from a portion corresponding to the diffusion lens 210 of the protective cover 200. .

따라서 사출금형을 통해 보호커버(200)가 사출될 때 하부금형(20)에 형성된 미세돌기(24)를 통해 확산렌즈(210)의 내면에 다수의 요홈(212)이 형성되는 것이다.Accordingly, when the protective cover 200 is injected through the injection mold, a plurality of grooves 212 are formed on the inner surface of the diffusion lens 210 through the fine protrusions 24 formed in the lower mold 20.

본 발명과 같이 보호커버(200)에 일체로 형성된 확산렌즈(210)의 내면에 전체적으로 46% 내지 49%로 요홈(212)을 형성하게 되면, 레드, 그린, 블루 빛이 서로 합쳐져 채널간판에 표현될 때 백색이 구현된다.When the concave grooves 212 are formed on the inner surface of the diffusion lens 210 integrally formed in the protective cover 200 as 46% to 49% as in the present invention, red, green, and blue light are combined with each other to express the channel signage. White is realized when possible.

한편, 본 발명은 모듈케이스(100)와 보호커버(200)의 외면에 방열, 방습, 방오성이 더욱 강화되도록 항균방오층을 추가로 형성한다. 이때, 항균방오층은 수지조성물을 스프레이방식으로 도포하여 코팅하면 된다.Meanwhile, the present invention further forms an antibacterial antifouling layer to further enhance heat dissipation, moisture resistance, and antifouling properties on the outer surfaces of the module case 100 and the protective cover 200. At this time, the antibacterial antifouling layer may be coated by applying a resin composition by a spray method.

여기서, 수지조성물은 카본블랙 5중량%와, 0.1㎛의 입도를 갖는 일라이트분말 5중량%와, 포타슘실리케이트 5중량%와, 올레아미드 3.5중량%와, 인산에스테르나트륨염 2.5중량%와, 옥타메틸사이클로테트라실록산 5중량%와, 이산화티탄 4.5중량%와, 이소퀴놀린 알칼로이드 5중량%와, 노닐페놀 에톡시레이트 3.5중량% 및 나머지 중량%는 폴리프로필렌수지로 이루어진다.Here, the resin composition is 5% by weight of carbon black, 5% by weight of illite powder having a particle size of 0.1㎛, 5% by weight of potassium silicate, 3.5% by weight of oleamide, 2.5% by weight of sodium phosphate ester salt, and Octa 5% by weight of methylcyclotetrasiloxane, 4.5% by weight of titanium dioxide, 5% by weight of isoquinoline alkaloids, 3.5% by weight of nonylphenol ethoxylate and the remaining weight% are made of polypropylene resin.

이때, 카본블랙은 내마멸성과 내연마성을 확보하고 경량화를 유지하기 위해 첨가되고, 일라이트분말은 원적외선 방사량이 탁월하여 탈취, 소취, 공기정화이 있고, 특히 바이러스, 박테리아, 곰팡이에 대한 정균작용이 우수한 것으로 알려져 있다. 그리고, 포타슘실리케이트는 내구성을 강화시키고 내열성을 높이기 위해 첨가되며, 올레아미드(Oleamide)는 도포시 원활한 흐름성과 도포성을 확보하기 위해 첨가된다. 또한, 인산에스테르나트륨염은 결정을 미세화하여 코팅층의 강성, 내열변형성을 강화하기 위해 첨가되고, 옥타메틸사이클로테트라실록산은 수지조성물의 분산 안정성과 방수성을 높이기 위한 것으로, 특히 옥타메틸사이클로테트라실록산이 방수성 유기물이기 때문에 발수성도 강화시키고 오염물질의 부착을 억제하기 위해 첨가된다. 뿐만 아니라, 이산화티탄은 자외선 광촉매반응을 일으켜 살균은 물론 유해물질 분해에 따른 탈취효과를 갖도록 하기 위해 사용된다. 이러한 이산화티탄은 자외선을 받아 O2 + e- → O2 -, H2O + h+ → -OH + H와 같이 광촉매반응하면서 살균하게 된다. 아울러, 이소퀴놀린 알칼로이드는 암팔라야(Bitter Melon), 황련 뿌리, 매발톱나무 뿌리에서 추출되는 추출물로서 곰팡이는 물론 살모넬라균 등 널리 알려진 균류에 대한 천연 항균제이다. 그리고, 노닐페놀 에톡시레이트는 수지와의 교합성을 증대시키면서 계면활성 기능을 제공하고, 특히 산화방지 효과를 얻기 위해 첨가된다. 또한, 폴리프로필렌수지는 접합성과 교합성을 높이면서 성분간 바인딩성을 증대시키기 위해 첨가된다.At this time, carbon black is added to secure abrasion resistance and abrasion resistance and maintain weight reduction, and the illite powder has excellent far-infrared radiation and has deodorization, deodorization, and air purification. Is known. In addition, potassium silicate is added to enhance durability and increase heat resistance, and oleamide is added to ensure smooth flow and applicability during application. In addition, sodium phosphate ester salt is added to refine the crystals to enhance the rigidity and heat resistance of the coating layer, and octamethylcyclotetrasiloxane is intended to increase the dispersion stability and waterproofness of the resin composition, particularly octamethylcyclotetrasiloxane. Because it is an organic material, it is added to enhance water repellency and suppress adhesion of contaminants. In addition, titanium dioxide is used to cause ultraviolet photocatalytic reactions to have sterilization and deodorization effects due to decomposition of harmful substances. This titanium dioxide is receiving ultraviolet O 2 + e - is sterilized while photocatalytic reaction, such as, H 2 O + h + → -OH + H - → O 2. In addition, the isoquinoline alkaloid is an extract extracted from Bitter Melon, Hwangnyeon Root, and Barberry Root, and is a natural antibacterial agent against fungi, such as Salmonella, as well as fungi. In addition, nonylphenol ethoxylate provides a surfactant function while increasing the interaction with the resin, and is particularly added to obtain an antioxidant effect. In addition, polypropylene resin is added to increase the binding property between components while increasing the bondability and crosslinking.

이상에서와같이 본 발명은 특정의 실시 예와 관련하여 도시 및 설명하였지만, 청구범위에 의해 나타난 발명의 사상 및 영역으로부터 벗어나지 않는 한도 내에서 다양한 개조 및 변화 가능하다는 것을 당 업계에서 통상의 지식을 가진 자라면 누구나 쉽게 알 수 있을 것이다.As described above, the present invention has been illustrated and described in connection with a specific embodiment, but various modifications and changes are possible within the limits without departing from the spirit and scope of the invention indicated by the claims, and have ordinary skill in the art. Anyone who grows up will know.

100: 모듈케이스 110: 전선
120: LED 칩 200: 보호커버
210: 확산렌즈 212: 요홈100: module case 110: electric wire
120: LED chip 200: protective cover
210: diffuse lens 212: groove

Claims (4)

상면이 개구된 밀폐 형상을 갖는 모듈케이스와, 모듈케이스의 양측으로 관통되게 설치된 전선과, 모듈케이스 내부에서 전선과 전기적으로 연결되게 설치되고, 전선을 통해 전류가 공급되면 상방향으로 빛을 발산하며, 레드 LED 칩, 그린 LED 칩, 블루 LED 칩이 세트로 구성되어 신호에 따라 레드 LED 칩, 그린 LED 칩, 블루 LED 칩이 각각 개별적으로 또는 함께 빛을 발산하도록 설치된 LED 칩과, 모듈케이스의 상면에 씌워져 모듈케이스를 밀폐시키게 결합되고, LED 칩과 대응되는 위치에 LED 칩에서 발산되는 빛을 160도의 지향각을 갖도록 확산시키는 확산렌즈가 일체로 형성된 보호커버로 이루어지고,
채널간판의 내부에 설치되어 조명으로 사용되며,
상기 확산렌즈는 내면에 다수의 요홈을 형성하여 레드 LED 칩, 그린 LED 칩, 블루 LED 칩에서 발산되는 빛이 확산렌즈를 통과하면서 산란되어 레드, 그린, 블루 빛이 서로 합쳐져 채널간판에 표현될 때 백색을 구현할 수 있도록 구성되되,
상기 요홈은 0.1㎜ 직경으로 형성되되, 확산렌즈의 내면에 전체적으로 요홈이 형성되는 것을 100%로 보았을 때 46% 내지 49%가 골고루 분산되게 형성되도록 구성되며,
상기 보호커버는 사출성형으로 제조되되,
상기 사출성형에 사용되는 사출금형은 보호커버의 상면과 대응되는 홈부를 갖는 상부금형과 보호커버의 하면과 대응되는 돌부를 갖는 하부금형으로 이루어지고,
상기 하부금형에는 보호커버의 확산렌즈와 대응되는 부분에 다수의 미세돌기가 돌출 형성되어, 사출금형을 통해 확산렌즈가 일체로 형성된 보호커버를 사출할 때 확산렌즈의 내면에 하부금형의 미세돌기로 인해 다수의 요홈이 형성되게 구성되며,
상기 모듈케이스와 보호커버의 외면에 수지조성물을 스프레이방식으로 도포하여 항균방오층을 형성하되,
상기 수지조성물은 카본블랙 5중량%와, 0.1㎛의 입도를 갖는 일라이트분말 5중량%와, 포타슘실리케이트 5중량%와, 올레아미드 3.5중량%와, 인산에스테르나트륨염 2.5중량%와, 옥타메틸사이클로테트라실록산 5중량%와, 이산화티탄 4.5중량%와, 이소퀴놀린 알칼로이드 5중량%와, 노닐페놀 에톡시레이트 3.5중량% 및 나머지 중량%는 폴리프로필렌수지로 이루어진 것을 특징으로 하는 확산렌즈가 적용된 알지비 풀 컬러 엘이디 모듈.A module case having a sealed shape with an open top surface, wires installed through both sides of the module case, and electric wires installed inside the module case, and when current is supplied through the wires, it radiates light upwards The red LED chip, the green LED chip, and the blue LED chip consist of a set, and the LED chip installed so that the red LED chip, the green LED chip, and the blue LED chip emit light individually or together depending on the signal, and the top surface of the module case. The cover is made of a protective cover integrally formed with a diffusion lens that is coupled to seal the module case, and diffuses light emitted from the LED chip to a position corresponding to the LED chip to have a directivity of 160 degrees,
It is installed inside the channel signboard and used as lighting.
When the diffusion lens forms a number of grooves on the inner surface, light emitted from the red LED chip, the green LED chip, and the blue LED chip is scattered while passing through the diffusion lens, and when the red, green, and blue light are combined with each other and expressed on the channel signboard It is configured to realize white,
The groove is formed with a diameter of 0.1 mm, is configured to be evenly distributed 46% to 49% when viewed as 100% that the groove is formed entirely on the inner surface of the diffusion lens,
The protective cover is manufactured by injection molding,
The injection mold used for the injection molding is composed of an upper mold having a groove portion corresponding to the upper surface of the protective cover and a lower mold having a projection portion corresponding to the lower surface of the protective cover,
The lower mold is formed with a plurality of fine protrusions protruding from a portion corresponding to the diffusion lens of the protective cover. Due to the formation of a number of grooves,
A resin composition is applied to the outer surfaces of the module case and the protective cover by a spray method to form an antibacterial antifouling layer,
The resin composition is 5% by weight of carbon black, 5% by weight of illite powder having a particle size of 0.1㎛, 5% by weight of potassium silicate, 3.5% by weight of oleamide, 2.5% by weight of sodium phosphate ester salt, and octamethyl 5% by weight of cyclotetrasiloxane, 4.5% by weight of titanium dioxide, 5% by weight of isoquinoline alkaloids, 3.5% by weight of nonylphenol ethoxylate, and the remaining weight% of polypropylene resin are used. Non full color LED module. 삭제delete 삭제delete 삭제delete
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KR101805382B1 (en) * 2016-11-29 2017-12-07 주식회사 퍼맥스 Antibacterial edge finishing materials, Method for manufacturing thereof and Furniture with the edge finishing materials

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