KR102094329B1 - Structural adhesives with excellent flame retardancy - Google Patents

Structural adhesives with excellent flame retardancy Download PDF

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KR102094329B1
KR102094329B1 KR1020180039521A KR20180039521A KR102094329B1 KR 102094329 B1 KR102094329 B1 KR 102094329B1 KR 1020180039521 A KR1020180039521 A KR 1020180039521A KR 20180039521 A KR20180039521 A KR 20180039521A KR 102094329 B1 KR102094329 B1 KR 102094329B1
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weight
parts
silane
structural adhesive
treated
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KR20190116635A (en
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권성헌
정연수
이상화
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주식회사 제일화성
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/5046Amines heterocyclic
    • C08G59/5053Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/36Silica
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L9/00Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
    • C08L9/06Copolymers with styrene
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/011Nanostructured additives

Abstract

난연성이 우수한 구조용 접착제에 대하여 개시한다.
본 발명에 따른 구조용 접착제는 비스페놀계 에폭시 수지 100중량부에 대하여, 에폭시기를 포함하는 반응성 희석제 1~20중량부, 산무수물계 화합물 20~40중량부, 이미다졸계 유도체를 포함하는 경화 촉진제 1~15중량부, 제1실란으로 표면처리 된 실리카 입자 10~20중량부, 제2실란으로 표면처리 된 할로이사이트 나노튜브(HNT, Halloysite NanoTube) 1~20중량부, 및 실리콘계 소포제와 실리콘계 레벨링제 중 1종 이상을 포함하는 첨가제 0.1~2중량부를 포함하는 것을 특징으로 한다.
Disclosed is a structural adhesive excellent in flame retardancy.
Structural adhesive according to the present invention is 1 to 20 parts by weight of a reactive diluent containing an epoxy group, 20 to 40 parts by weight of an acid anhydride-based compound, curing accelerator containing an imidazole derivative, based on 100 parts by weight of a bisphenol-based epoxy resin Among 15 parts by weight, 10 to 20 parts by weight of silica particles surface-treated with the first silane, 1 to 20 parts by weight of Halloysite NanoTube (HNT) surface-treated with the second silane, and silicon-based antifoaming agent and silicon-based leveling agent It characterized in that it contains 0.1 to 2 parts by weight of additives containing one or more.

Description

난연성이 우수한 구조용 접착제{STRUCTURAL ADHESIVES WITH EXCELLENT FLAME RETARDANCY}Structural ADHESIVES WITH EXCELLENT FLAME RETARDANCY

본 발명은 구조용 접착제에 관한 것으로, 보다 상세하게는 HNT를 포함하여 난연성이 우수한 구조용 접착제에 관한 것이다. The present invention relates to a structural adhesive, and more particularly, to a structural adhesive having excellent flame retardancy, including HNT.

구조용 접착제는 목재, 복합재 또는 금속과 같은 다른 고강도 재료들을 접착시키는데 사용되는 재료로 정의될 수 있다. 구조용 접착제는 자동차 및 항공우주 산업 등과 같은 다양한 분야에 사용될 수 있다. 또한, 나사, 볼트, 못, 스테이플 및 납땜(soldering)과 같은 종래의 체결 기법을 대체하거나 보강하기 위해 사용될 수 있다.Structural adhesives can be defined as materials used to bond other high strength materials such as wood, composites or metals. Structural adhesives can be used in a variety of applications, such as the automotive and aerospace industries. It can also be used to replace or reinforce conventional fastening techniques such as screws, bolts, nails, staples, and soldering.

구조용 접착제는 유기 물질이라서 산소의 존재 하에 충분히 높은 온도에 노출될 경우, 연소될 수 있다. 구조용 접착제는 주로 용접 단계에서 연소되기 때문에 구조용 접착제의 개선을 통해 점화에 대한 저항성을 증가시키는 것이 바람직하다. 또한, 구조용 접착제로서 적합하기 위해서는 높은 기계적 강도와 내충격성을 가져야 한다.Structural adhesives are organic and can burn when exposed to sufficiently high temperatures in the presence of oxygen. Since the structural adhesive is mainly burned in the welding step, it is desirable to increase the resistance to ignition through improvement of the structural adhesive. In addition, in order to be suitable as a structural adhesive, it must have high mechanical strength and impact resistance.

한편, 난연제인 알루미나 삼수화물을 포함하는 구조용 접착제에 대한 연구가 이루어지고 있다. 그러나, HFDC 용접 공정 중 발생하는 고온에서 구조용 접착제의 기능이 효과적으로 작용하기 위해서는, 매우 높은 농도의 알루미나 삼수화물이 필요하다. 또한, 알루미나 삼수화물의 높은 농도는 용접 공정을 방해하는 것으로 알려져 있다. Meanwhile, research has been conducted on structural adhesives containing alumina trihydrate, which is a flame retardant. However, in order for the function of the structural adhesive to effectively function at high temperatures generated during the HFDC welding process, a very high concentration of alumina trihydrate is required. It is also known that high concentrations of alumina trihydrate interfere with the welding process.

따라서, 난연성, 기계적 강도와 내충격성이 우수한 구조용 접착제의 개발이 요구되고 있다.Accordingly, there is a need to develop a structural adhesive excellent in flame retardancy, mechanical strength and impact resistance.

본 발명에 관련된 배경기술로는 대한민국 공개특허공보 제10-2017-0127472호(2017.11.21. 공개)가 있으며, 상기 문헌에는 이액형 구조용 접착제가 기재되어 있다.Background art related to the present invention includes Republic of Korea Patent Publication No. 10-2017-0127472 (published on November 21, 2017), the document discloses a two-part structural adhesive.

본 발명의 목적은 난연성이 우수한 구조용 접착제를 제공하는 것이다.An object of the present invention is to provide a structural adhesive having excellent flame retardancy.

상기 하나의 목적을 달성하기 위한 본 발명에 따른 구조용 접착제는 비스페놀계 에폭시 수지 100중량부에 대하여, 에폭시기를 포함하는 반응성 희석제 1~20중량부, 산무수물계 화합물 20~40중량부, 이미다졸계 유도체를 포함하는 경화 촉진제 1~15중량부, 제1실란으로 표면처리 된 실리카 입자 10~20중량부, 제2실란으로 표면처리 된 할로이사이트 나노튜브(HNT, Halloysite NanoTube) 1~20중량부, 및 실리콘계 소포제와 실리콘계 레벨링제 중 1종 이상을 포함하는 첨가제 0.1~2중량부를 포함하는 것을 특징으로 한다.Structural adhesive according to the present invention for achieving the above one object is 1 to 20 parts by weight of a reactive diluent containing an epoxy group, 20 to 40 parts by weight of an acid anhydride-based compound, imidazole-based with respect to 100 parts by weight of bisphenol-based epoxy resin 1 to 15 parts by weight of a curing accelerator containing a derivative, 10 to 20 parts by weight of silica particles surface-treated with a first silane, 1 to 20 parts by weight of Halloysite NanoTube (HNT), surface-treated with a second silane, And 0.1 to 2 parts by weight of an additive containing at least one of a silicone-based antifoaming agent and a silicone-based leveling agent.

상기 산무수물계 화합물은 HHPA(Hexahydro phthalic anhydride), MeHHPA(Methyl hexahydro phthalic anhydride), THPA(Tetra hydro phthalic anhydride) 및 MeTHPA(Methyl tetrahydro phthalic anhydride) 중 1종 이상을 포함할 수 있다.The acid anhydride-based compound may include one or more of Hexahydro phthalic anhydride (HHPA), Methyl hexahydro phthalic anhydride (MeHHPA), Tetra hydro phthalic anhydride (THPA) and Methyl tetrahydro phthalic anhydride (MeTHPA).

상기 제1실란으로 표면처리 된 실리카 입자는 직경이 1~20㎛일 수 있다.The silica particles surface-treated with the first silane may have a diameter of 1 to 20 μm.

상기 제1실란 및 상기 제2실란 각각은 3-글리시독시프로필트리메톡시실란, 3-글리시독시프로필메틸디메톡시실란, 3-메타크릴옥시프로필트리메톡시실란, 3-클로로프로필메틸디메톡시실란 및 3-클로로프로필트리메톡시실란 중 1종 이상을 포함할 수 있다.Each of the first silane and the second silane is 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-chloropropylmethyldime It may include at least one of methoxysilane and 3-chloropropyl trimethoxysilane.

상기 구조용 접착제는 촉매 0.1~1중량부를 더 포함할 수 있다.The structural adhesive may further include 0.1 to 1 part by weight of a catalyst.

본 발명에 따른 구조용 접착제는 에폭시 수지에 강도를 부여하는 실리카 입자와 난연성을 부여하는 HNT를 포함함으로써, 우수한 난연성과 기계적 강도를 나타낼 수 있다.The structural adhesive according to the present invention can exhibit excellent flame retardancy and mechanical strength by including silica particles that give strength to the epoxy resin and HNT that gives flame retardancy.

본 발명의 이점 및 특징, 그리고 그것들을 달성하는 방법은 첨부되는 도면과 함께 상세하게 후술되어 있는 실시예들을 참조하면 명확해질 것이다. 그러나 본 발명은 이하에서 개시되는 실시예들에 한정되는 것이 아니라 서로 다른 다양한 형태로 구현될 것이며, 단지 본 실시예들은 본 발명의 개시가 완전하도록 하며, 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자에게 발명의 범주를 완전하게 알려주기 위해 제공되는 것이며, 본 발명은 청구항의 범주에 의해 정의될 뿐이다. 명세서 전체에 걸쳐 동일 참조 부호는 동일 구성요소를 지칭한다.Advantages and features of the present invention, and methods for achieving them will be clarified with reference to embodiments described below in detail together with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various different forms, and only the present embodiments allow the disclosure of the present invention to be complete, and the ordinary knowledge in the technical field to which the present invention pertains. It is provided to fully inform the holder of the scope of the invention, and the invention is only defined by the scope of the claims. The same reference numerals refer to the same components throughout the specification.

이하 첨부된 도면을 참조하여 본 발명의 바람직한 실시예에 따른 난연성이 우수한 구조용 접착제에 관하여 상세히 설명하면 다음과 같다.Hereinafter, a structural adhesive having excellent flame retardancy according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

본 발명에 따른 구조용 접착제는 목재, 복합재 또는 금속과 같은 다른 고강도 재료들을 접착시키는데 사용되는 재료이다.Structural adhesives according to the present invention are materials used to bond other high strength materials such as wood, composites or metals.

본 발명에 따른 구조용 접착제는 비스페놀계 에폭시 수지 100중량부에 대하여, 에폭시기를 포함하는 반응성 희석제 1~20중량부, 산무수물계 화합물 20~40중량부, 이미다졸계 유도체를 포함하는 경화 촉진제 1~15중량부, 제1실란으로 표면처리 된 실리카 입자 10~20중량부, 제2실란으로 표면처리 된 할로이사이트 나노튜브(HNT, Halloysite NanoTube) 1~20중량부, 및 실리콘계 소포제와 실리콘계 레벨링제 중 1종 이상을 포함하는 첨가제 0.1~2중량부를 포함한다.Structural adhesive according to the present invention is 1 to 20 parts by weight of a reactive diluent containing an epoxy group, 20 to 40 parts by weight of an acid anhydride-based compound, curing accelerator containing an imidazole derivative, based on 100 parts by weight of a bisphenol-based epoxy resin Among 15 parts by weight, 10 to 20 parts by weight of silica particles surface-treated with the first silane, 1 to 20 parts by weight of Halloysite NanoTube (HNT) surface-treated with the second silane, and silicon-based antifoaming agent and silicon-based leveling agent It contains 0.1 to 2 parts by weight of additives containing one or more.

상기 비스페놀계 에폭시 수지는 상온에서 액상으로 존재하고, 내수성, 접착성 등이 우수하다. 그 예로 비스페놀 A형 에폭시 수지 또는 비스페놀 F형 에폭시 수지 등이 있다. 상기 비스페놀계 에폭시 수지의 당량은 170~180g/eq일 수 있으나, 이에 제한되는 것은 아니다.The bisphenol-based epoxy resin exists as a liquid at room temperature, and has excellent water resistance, adhesion, and the like. Examples include bisphenol A-type epoxy resins or bisphenol F-type epoxy resins. The equivalent of the bisphenol-based epoxy resin may be 170 to 180 g / eq, but is not limited thereto.

상기 반응성 희석제는 에폭시 수지의 우수한 물성을 유지하면서도 구조용 접착제의 점도를 낮추는 물질을 총칭하는 것으로, 지방성 글라이시딜 에테르 형태의 2관능성 에폭시기 등을 포함하는 것이 바람직하다. The reactive diluent collectively refers to a substance that lowers the viscosity of the structural adhesive while maintaining excellent properties of the epoxy resin, and preferably includes a bifunctional epoxy group in the form of a fatty glycidyl ether.

구조용 접착제는 에폭시기를 포함하는 반응성 희석제 1~20중량부를 포함하는 것이 바람직하다. 함량이 1중량부 미만인 경우, 접착제의 점도와 유리전이 온도가 증가될 수 있다. 반대로, 함량이 20중량부를 초과하는 경우, 접착제의 점도와 유리전이 온도가 감소될 수 있다.It is preferable that the structural adhesive contains 1 to 20 parts by weight of a reactive diluent containing an epoxy group. When the content is less than 1 part by weight, the viscosity of the adhesive and the glass transition temperature may be increased. Conversely, when the content exceeds 20 parts by weight, the viscosity of the adhesive and the glass transition temperature may be reduced.

상기 산무수물계 화합물은 지환족 산무수물(Cyclo Aliphatic)이며, 경화제로 작용한다. 예를 들어, HHPA(Hexahydro phthalic anhydride), MeHHPA(Methyl hexahydro phthalic anhydride), THPA(Tetra hydro phthalic anhydride) 및 MeTHPA(Methyl tetrahydro phthalic anhydride) 중 1종 이상을 포함할 수 있다.The acid anhydride-based compound is an alicyclic acid anhydride (Cyclo Aliphatic), and acts as a curing agent. For example, it may include one or more of Hexahydro phthalic anhydride (HHPA), Methyl hexahydro phthalic anhydride (MeHHPA), Tetra hydro phthalic anhydride (THPA) and Methyl tetrahydro phthalic anhydride (MeTHPA).

HHPA는 상온에서 고체로, 무색투명성을 띄며, 내후성인 특징이 있다. MeHHPA는 상온에서 액체로 내후성을 가지고 있으며, 저점도이다. THPA는 상온에서 고체이며, 작업성이 우수한 특징이 있다. MeTHPA는 상온에서 액체이며, 함침 및 적층하는 용도로 쓰인다.HHPA is a solid at room temperature, has colorless transparency, and has weather-resistant characteristics. MeHHPA is a liquid at room temperature and has weather resistance and low viscosity. THPA is a solid at room temperature and has excellent workability. MeTHPA is liquid at room temperature and is used for impregnation and lamination.

구조용 접착제는 산무수물계 화합물 20~40중량부를 포함하는 것이 바람직하다. 20중량부 미만이거나, 40중량부를 초과하는 경우, 구조용 접착제의 점도 조절이 어려울 수 있다. It is preferable that the structural adhesive contains 20 to 40 parts by weight of an acid anhydride-based compound. If it is less than 20 parts by weight, or more than 40 parts by weight, viscosity control of the structural adhesive may be difficult.

상기 이미다졸계 유도체를 포함하는 경화 촉진제는 경화 반응성과 상온±20℃에서의 저장안정성을 유지시키기 위한 것이다. 구조용 접착제는 상기 경화 촉진제 1~15중량부를 포함하는 것이 바람직하다. 함량이 1중량부 미만인 경우, 경화 촉진제의 효과가 불충분할 수 있고, 15중량부를 초과하는 경우, 효과 없이 제조 비용만 상승하는 문제점이 있다. The curing accelerator comprising the imidazole derivative is intended to maintain curing reactivity and storage stability at room temperature ± 20 ° C. It is preferable that the structural adhesive contains 1 to 15 parts by weight of the curing accelerator. If the content is less than 1 part by weight, the effect of the curing accelerator may be insufficient, and when it exceeds 15 parts by weight, there is a problem that only the manufacturing cost increases without effect.

상기 이미다졸계 유도체를 포함하는 경화 촉진제는 이미다졸, 이소이미다졸, 2-메틸 이미다졸, 2-에틸-4-메틸이미다졸 등에서 1종 이상을 포함할 수 있다.The curing accelerator comprising the imidazole derivative may include one or more of imidazole, isoimidazole, 2-methyl imidazole, 2-ethyl-4-methylimidazole, and the like.

상기 제1실란으로 표면처리 된 실리카 입자는 구조용 접착제의 물리적 강도를 향상시킬 수 있다. 여기서, 제1실란은 3-글리시독시프로필트리메톡시실란, 3-글리시독시프로필메틸디메톡시실란, 3-메타크릴옥시프로필트리메톡시실란, 3-클로로프로필메틸디메톡시실란 및 3-클로로프로필트리메톡시실란 중 1종 이상을 포함할 수 있다.The silica particles surface-treated with the first silane can improve the physical strength of the structural adhesive. Here, the first silane is 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-chloropropylmethyldimethoxysilane and 3- Chloropropyl trimethoxysilane.

또한, 상기 제1실란으로 표면처리 된 실리카 입자는 직경이 1~20㎛일 수 있다. 실리카 입자의 직경이 1㎛ 미만인 경우, 입자들이 뭉치는 현상이 발생하고, 20㎛를 초과하는 경우, 직경이 너무 커져서 접착제의 표면 거칠기와 작업성이 저하될 수 있다.In addition, the silica particles surface-treated with the first silane may have a diameter of 1 to 20 μm. When the diameter of the silica particles is less than 1 μm, the phenomenon that the particles agglomerate occurs, and when it exceeds 20 μm, the diameter may become too large, thereby deteriorating the surface roughness and workability of the adhesive.

구조용 접착제는 제1실란으로 표면처리 된 실리카 입자 10~20중량부를 포함하는 것이 바람직하다. 이 범위를 벗어나는 경우, 기계적 물성이 저하될 수 있다.It is preferable that the structural adhesive contains 10 to 20 parts by weight of silica particles surface-treated with the first silane. If it is outside this range, mechanical properties may deteriorate.

상기 할로이사이트 나노튜브는 알루미늄과 실리콘의 비가 1:1로 구성된 규산알루미늄 점토광물로서, 튜브 형태의 나노입자로 형성된다. 할로이사이트 나노튜브는 접착제 내에서 분산성이 우수하고, 난연성을 부여한다.The halosite nanotube is an aluminum silicate clay mineral composed of a 1: 1 ratio of aluminum and silicon, and is formed of nanoparticles in a tube shape. The halosite nanotube has excellent dispersibility in the adhesive and imparts flame retardancy.

상기 할로이사이트 나노튜브는 제2실란으로 표면 처리되어 접착제 내에서 상용성 및 계면 접착성을 더욱 더 향상시킬 수 있다. The halosite nanotubes may be surface treated with a second silane to further improve compatibility and interfacial adhesion in the adhesive.

상기 할로이사이트 나노튜브의 길이는 50~1000㎛일 수 있으나, 이에 제한되는 것은 아니다.The length of the halosite nanotube may be 50 to 1000 μm, but is not limited thereto.

상기 제2실란은 제1실란에서 전술한 바와 같다.The second silane is as described above in the first silane.

상기 제2실란으로 표면처리 된 할로이사이트 나노튜브의 제조 방법은 다음과 같다.The manufacturing method of the halosite nanotubes surface-treated with the second silane is as follows.

먼저, 상온±10℃에서 할로이사이트 나노튜브와 유기용매를 혼합한다.First, the halosite nanotube and the organic solvent are mixed at room temperature ± 10 ° C.

상기 유기용매는 히드록시기가 포함된 용매이며, 그 예로는 아세톤, 메탄올 또는 에탄올 등이 있다. 유기용매의 히드록시기는 실란(SinH2n+2)계 커플링제와 반응하여 수분에 의한 가수분해로 실라놀(silanol, (H2SiOH))을 형성한다. 상기 실라놀은 부분적으로 탈수 축합하게 되며, 이에 따라, 할로이사이트 나노튜브 표면에 실란(SiH4)이 흡착하게 된다.The organic solvent is a solvent containing a hydroxy group, and examples thereof include acetone, methanol or ethanol. The hydroxy group of the organic solvent reacts with a silane (Si n H 2n + 2 ) coupling agent to form silanol (H 2 SiOH) by hydrolysis with moisture. The silanol is partially dehydrated and condensed, and accordingly, silane (SiH 4 ) is adsorbed on the surface of the halosite nanotube.

상기 할로이사이트 나노튜브와 유기용매는 1:1 ~ 1:3의 중량비로 혼합될 수 있다. 이 범위를 벗어나는 경우, 나노튜브의 표면처리가 충분히 수행되기 어려울 수 있다. The halosite nanotubes and the organic solvent may be mixed in a weight ratio of 1: 1 to 1: 3. If it is outside this range, it may be difficult to sufficiently perform the surface treatment of the nanotube.

다음으로, 마련된 결과물에 실란계 커플링제를 첨가하여 교반한다. 이때, 교반은 나노튜브, 용매 및 실란계 커플링제가 적절히 혼합될 수 있도록 대략 10~14시간 동안 수행될 수 있으며, 이때 유기용매가 일부 제거될 수 있다.Next, a silane coupling agent is added to the prepared result and stirred. At this time, the stirring may be performed for approximately 10 to 14 hours so that the nanotube, the solvent, and the silane-based coupling agent can be appropriately mixed, and the organic solvent may be partially removed.

실란계 커플링제는 크롬계 등의 다른 커플링제보다 흡유량을 감소시키는 효과가 크다. 이에 따라, 실란계 커플링제로 표면처리하는 경우, 접착제 내 성분들끼리의 계면 접착성 및 분산성이 높아져 접착제의 물성이 향상된다.Silane-based coupling agents have a greater effect of reducing oil absorption than other coupling agents such as chromium-based. Accordingly, in the case of surface treatment with a silane-based coupling agent, the interfacial adhesion and dispersibility between components in the adhesive is increased, thereby improving the physical properties of the adhesive.

상기 실란계 커플링제는 할로이사이트 나노튜브 100중량부에 대하여, 0.1~5중량부로 첨가될 수 있다. 교반 후에는 대략 90~100℃에서 3~5시간 동안 건조하여 남아 있는 유기용매를 완전히 제거할 수 있다. The silane coupling agent may be added in an amount of 0.1 to 5 parts by weight based on 100 parts by weight of the halosite nanotube. After stirring, it can be dried at approximately 90 to 100 ° C. for 3 to 5 hours to completely remove the remaining organic solvent.

상기 제1실란으로 표면처리 된 실리카 입자도 마찬가지로 할로이사이트 나노튜브 대신 실리카 입자를 이용하여 제조될 수 있다.The silica particles surface-treated with the first silane may likewise be produced using silica particles instead of halosite nanotubes.

구조용 접착제는 제2실란으로 표면처리 된 할로이사이트 나노튜브 1~20중량부를 포함하는 것이 바람직하다. 이 범위를 벗어나는 경우, 접착제의 난연성 효과를 기대하기 어렵다.It is preferable that the structural adhesive contains 1 to 20 parts by weight of the halosite nanotubes surface-treated with the second silane. If it is outside this range, it is difficult to expect the flame retardant effect of the adhesive.

첨가제는 실리콘계 소포제와 실리콘계 레벨링제 중 1종 이상을 포함하는 것으로, 0.1~2중량부를 포함할 수 있다. 첨가제의 함량이 0.1중량부 미만이거나, 2중량부를 초과하는 경우, 접착제의 요구되는 물성을 보다 향상시키기 어려울 수 있다.The additive contains at least one of a silicone-based antifoaming agent and a silicone-based leveling agent, and may include 0.1 to 2 parts by weight. If the content of the additive is less than 0.1 parts by weight, or more than 2 parts by weight, it may be difficult to further improve the required physical properties of the adhesive.

상기 구조용 접착제는 접착제 내에서 성분들끼리의 반응을 촉진시키기 위해 촉매 0.1~1중량부를 더 포함할 수 있다. The structural adhesive may further include 0.1 to 1 part by weight of a catalyst to promote the reaction between components in the adhesive.

촉매는 지방족 우레아 화합물을 사용할 수 있다. 예를 들어, p-클로로-N,N-다이메틸(모누론(Monuron)), 3-페닐-1,1-다이메틸우레아(페누론(Phenuron)), 3,4-다이클로로페닐-Ν,Ν-다이메틸(다이유론(Diuron)), N-(3-클로로-4-메틸페닐)-As the catalyst, an aliphatic urea compound can be used. For example, p-chloro-N, N-dimethyl (Monuron), 3-phenyl-1,1-dimethylurea (Phenuron), 3,4-dichlorophenyl-Ν , Ν-dimethyl (Diuron), N- (3-chloro-4-methylphenyl)-

N',N'-다이메틸우레아(클로르톨루론(Chlortoluron)), 3급-아크릴- 또는 알킬렌 아민 예컨대 벤질다이메틸아민, 2,4,6-트리스(다이메틸아미노메틸)페놀, 피페리딘 또는 이들의 유도체 중에서 선택될 수 있다.N ', N'-dimethylurea (Chlortoluron), tert-acrylic- or alkylene amines such as benzyldimethylamine, 2,4,6-tris (dimethylaminomethyl) phenol, pipery Dean or derivatives thereof.

또한, 본 발명의 구조용 접착제는 테트라부틸포스포늄 테트라플루오로보레이트(tetrabutylphosphonium tetrafluoroborate) 0.1~3중량부를 더 포함할 수 있다. 상기 테트라부틸포스포늄 테트라플루오로보레이트를 더 포함하는 경우, 점도 조절이 용이하며, 우수한 기계적 특성을 나타낼 수 있다.In addition, the structural adhesive of the present invention may further include 0.1 to 3 parts by weight of tetrabutylphosphonium tetrafluoroborate. When the tetrabutylphosphonium tetrafluoroborate is further included, viscosity control is easy, and excellent mechanical properties may be exhibited.

이처럼, 본 발명에 따른 구조용 접착제는 비스페놀계 에폭시 수지에 제1실란으로 표면처리된 실리카 입자, 제2실란으로 표면처리된 HNT를 첨가하여 강도와 난연성을 부여할 수 있다. As described above, the structural adhesive according to the present invention may impart strength and flame retardancy by adding silica particles surface-treated with a first silane and HNT surface-treated with a second silane to a bisphenol-based epoxy resin.

또한, 본 발명에 따른 구조용 접착제는 산무수물계 화합물인 경화제를 포함하는 1액형으로, 별도의 경화제를 교반할 필요가 없다.In addition, the structural adhesive according to the present invention is a one-component type containing a curing agent that is an acid anhydride-based compound, and there is no need to stir a separate curing agent.

이와 같이 난연성이 우수한 구조용 접착제에 대하여 그 구체적인 실시예를 살펴보면 다음과 같다.Looking at the specific embodiment of the structural adhesive having excellent flame retardancy as follows.

1. 난연성이 우수한 구조용 접착제의 제조1. Preparation of structural adhesives with excellent flame retardancy

실시예 1 내지 실시예 3, 및 비교예 1 내지 비교예 5Examples 1 to 3, and Comparative Examples 1 to 5

비스페놀 A형 에폭시 수지(Huntsman사), 반응성 희석제인 지방성 글라이시딜 에테르 형태의 2관능성 에폭시기(Shin-Nihon Rika K. K.), THPA(Sigma Aldrich), 3-클로로프로필트리메톡시실란으로 표면처리된 실리카(평균 직경 10㎛, Sigma Aldrich), 실리콘 소포제, 실리콘 레벨링제(LG화학), 경화촉진제인 2-메틸 이미다졸(Sigma Aldrich), 3-클로로프로필트리메톡시실란으로 표면처리된 HNT를 표 1의 조성으로 혼합하여 구조용 접착제를 제조하였다. Bisphenol A-type epoxy resin (Huntsman), a reactive diluent, a fatty glycidyl ether type bifunctional epoxy group (Shin-Nihon Rika KK), THPA (Sigma Aldrich), 3-chloropropyl trimethoxysilane HNT surface treated with silica (average diameter 10㎛, Sigma Aldrich), silicone antifoaming agent, silicone leveling agent (LG Chemical), curing accelerator 2-methyl imidazole (Sigma Aldrich), 3-chloropropyl trimethoxysilane A structural adhesive was prepared by mixing with the composition of 1.

표 1 및 표 2의 조성은 비스페놀 A형 에폭시 수지 100중량부에 대한 중량부를 기재한 것이다.The composition of Table 1 and Table 2 describes parts by weight based on 100 parts by weight of bisphenol A-type epoxy resin.

실시예 4 및 실시예 5Example 4 and Example 5

3-페닐-1,1-다이메틸우레아 촉매를 더 포함하는 것을 제외하고는 실시예 2와 동일한 조건으로 구조용 접착제를 제조하였다.A structural adhesive was prepared under the same conditions as in Example 2, except that the 3-phenyl-1,1-dimethylurea catalyst was further included.

실시예 6Example 6

테트라부틸포스포늄 테트라플루오로보레이트 1중량부를 더 포함하는 것을 제외하고는 실시예 4와 동일한 조건으로 구조용 접착제를 제조하였다. A structural adhesive was prepared under the same conditions as in Example 4, except that it further contained 1 part by weight of tetrabutylphosphonium tetrafluoroborate.

[표 1][Table 1]

Figure 112018033791590-pat00001
Figure 112018033791590-pat00001

[표 2][Table 2]

Figure 112018033791590-pat00002
Figure 112018033791590-pat00002

2. 물성 평가 방법 및 그 결과2. Method for evaluating physical properties and results

상기 실시예 1 내지 6, 및 비교예 1 내지 5에서 제조된 구조용 접착제를 이용하여 아래 항목에 대한 평가를 하였으며, 그 측정 결과를 다음 [표 3]에 나타내었다.The following items were evaluated using the structural adhesives prepared in Examples 1 to 6 and Comparative Examples 1 to 5, and the measurement results are shown in the following [Table 3].

(1) 굴곡강도(N/mm2) : KSM 3015에 의거하여 측정하였다.(1) Flexural strength (N / mm 2 ): Measured according to KSM 3015.

(2) 인장강도(N/mm2) : ASTM D790에 의거하여 측정하였다.(2) Tensile strength (N / mm 2 ): Measured according to ASTM D790.

(3) 상호 겹 접착력(kgf/25mm) : asida-DZC-5에 의거하여 측정하였다.(3) Mutual layer adhesion (kgf / 25mm): measured according to asida-DZC-5.

(4) 난연성 : UL-94 방법에 의거하여 측정하였다.(4) Flame retardance: measured according to the UL-94 method.

[표 3][Table 3]

Figure 112018033791590-pat00003
Figure 112018033791590-pat00003

표 1 내지 표 3을 참조하면, 본 발명의 구조용 접착제 조성을 만족하는 실시예 1~5는 굴곡강도, 인장강도, 접착력, 난연성 항목에서 전체적으로 높은 결과값을 보여주었다.Referring to Tables 1 to 3, Examples 1 to 5 satisfying the structural adhesive composition of the present invention showed high overall results in flexural strength, tensile strength, adhesive strength, and flame retardancy.

특히, 실시예 6은 테트라부틸포스포늄 테트라플루오로보레이트 1중량부를 더 포함함으로써, 실시예 1~5에 비하여 굴곡강도, 인장강도가 더 높은 결과를 나타낸다.In particular, Example 6 further comprises 1 part by weight of tetrabutylphosphonium tetrafluoroborate. By including, it shows a result of higher flexural strength and tensile strength compared to Examples 1 to 5.

그러나, 비교예 1 내지 5에서는 결과값이 낮거나, 물성이 측정되지 않았다.However, in Comparative Examples 1 to 5, the result was low, or physical properties were not measured.

따라서, 본 발명에 따른 구조용 접착제는 표면처리된 실리카 입자와 HNT를 포함함으로써, 굴곡강도 35~50N/mm2, 인장강도 60~70N/mm2, 접착력 25~35kgf/25mm 및 우수한 난연성을 나타낼 수 있다.Therefore, the structural adhesive according to the present invention can exhibit a flexural strength of 35 to 50 N / mm 2 , a tensile strength of 60 to 70 N / mm 2 , an adhesive strength of 25 to 35 kgf / 25 mm, and excellent flame retardancy by including surface treated silica particles and HNT. have.

이상 첨부된 도면을 참조하여 본 발명의 실시예들을 설명하였으나, 본 발명은 상기 실시예들에 한정되는 것이 아니라 서로 다른 다양한 형태로 제조될 수 있으며, 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자는 본 발명의 기술적 사상이나 필수적인 특징을 변경하지 않고서 다른 구체적인 형태로 실시될 수 있다는 것을 이해할 수 있을 것이다. 그러므로 이상에서 기술한 실시예들은 모든 면에서 예시적인 것이며 한정적이 아닌 것으로 이해해야만 한다.The embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and may be manufactured in various different forms, and having ordinary knowledge in the art It will be understood that a person can be implemented in other specific forms without changing the technical spirit or essential features of the present invention. Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive.

Claims (5)

비스페놀계 에폭시 수지 100중량부에 대하여, 에폭시기를 포함하는 반응성 희석제 1~20중량부, 산무수물계 화합물 20~40중량부, 이미다졸계 유도체를 포함하는 경화 촉진제 1~15중량부, 제1실란으로 표면처리 된 실리카 입자 10~20중량부, 제2실란으로 표면처리 된 할로이사이트 나노튜브(HNT, Halloysite NanoTube) 1~20중량부, 및 실리콘계 소포제와 실리콘계 레벨링제를 포함하는 첨가제 0.1~2중량부를 포함하고,
지방족 우레아 화합물을 포함하는 촉매 0.1~1중량부를 더 포함하는 것을 특징으로 하는 구조용 접착제.
With respect to 100 parts by weight of the bisphenol-based epoxy resin, 1 to 20 parts by weight of a reactive diluent containing an epoxy group, 20 to 40 parts by weight of an acid anhydride-based compound, 1 to 15 parts by weight of a curing accelerator containing an imidazole derivative, first silane 10-20 parts by weight of the silica particles surface-treated, 1-20 parts by weight of Halloysite NanoTube (HNT) surface-treated with a second silane, and 0.1-2 parts by weight of an additive containing a silicone antifoaming agent and a silicone leveling agent Including wealth,
Structural adhesive, characterized in that it further comprises 0.1 to 1 part by weight of a catalyst comprising an aliphatic urea compound.
제1항에 있어서,
상기 산무수물계 화합물은 HHPA(Hexahydro phthalic anhydride), MeHHPA(Methyl hexahydro phthalic anhydride), THPA(Tetra hydro phthalic anhydride) 및 MeTHPA(Methyl tetrahydro phthalic anhydride) 중 1종 이상을 포함하는 것을 특징으로 하는 구조용 접착제.
According to claim 1,
The acid anhydride-based compound is a structural adhesive, characterized in that it comprises at least one of HHPA (Hexahydro phthalic anhydride), MeHHPA (Methyl hexahydro phthalic anhydride), THPA (Tetra hydro phthalic anhydride) and MeTHPA (Methyl tetrahydro phthalic anhydride).
제1항에 있어서,
상기 제1실란으로 표면처리 된 실리카 입자는 직경이 1~20㎛인 것을 특징으로 하는 구조용 접착제.
According to claim 1,
Structural adhesive characterized in that the silica particles surface-treated with the first silane have a diameter of 1 to 20 μm.
제1항에 있어서,
상기 제1실란 및 상기 제2실란 각각은 3-글리시독시프로필트리메톡시실란, 3-글리시독시프로필메틸디메톡시실란, 3-메타크릴옥시프로필트리메톡시실란, 3-클로로프로필메틸디메톡시실란 및 3-클로로프로필트리메톡시실란 중 1종 이상을 포함하는 것을 특징으로 하는 구조용 접착제.


According to claim 1,
Each of the first silane and the second silane is 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-chloropropylmethyldime Structural adhesive comprising at least one of methoxysilane and 3-chloropropyltrimethoxysilane.


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