KR102088133B1 - Touch screen panel controller board device and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a touch screen panel controller board device and a control method thereof, the device capable of preventing static discharge applied to a touch controller chip embedded in a circuit board by covering the circuit board with power failure prevention tape having an electromagnetism shield function, and preventing static discharge applied to a wiring layer of a flexible board by installing a diode part and a mesh ground layer in the upper part of the wiring layer. The touch screen panel controller board device comprises: a flexible board having a first end part connected to a touch screen panel (TSP); a reinforcement plate attached and fixed to the lower surface of a second end part of the flexible board; a first adhesive layer formed on the lower surface of the reinforcement plate; a first release paper attached to the first adhesive layer and removed when used; a circuit board attached and fixed to the upper surface of the second end part of the flexible board on a position corresponding to the reinforcement plate; a touch controller chip embedded in the upper part of the circuit board and connected to a host processor; power failure prevention tape covering a part of the upper surface of the circuit board including the touch controller chip, and having an electromagnetism shield function and a capacitive element; a lower reinforcement film attached and fixed to the lower surface of the first end part of the flexible board; an upper reinforcement film attached and fixed to the upper surface of the first end part of the flexible board on a position corresponding to the lower reinforcement film; a second adhesive layer formed on the upper surface of the upper reinforcement film; and a second release paper attached to the second adhesive layer and removed when used.

Description

Touch screen panel controller board device and manufacturing method thereof

The present invention relates to a touch screen panel controller board device and a method of manufacturing the same, and more specifically, to a touch controller chip by covering a capacitive element and an electrostatic shielding tape having an electromagnetic shielding function on a circuit board on which the touch controller chip is mounted. The present invention relates to a touch screen panel controller board device and a method of manufacturing the same, capable of blocking an electrostatic discharge applied thereto and blocking an electrostatic discharge applied to the wiring layer by providing a mesh ground layer and a diode part on the wiring layer of the flexible substrate.

Touch Screen Panel (TSP) is a liquid crystal display (LCD), organic light emitting diodes (Organic Light Emitting Diodes), plasma display panel (PDP), electroluminescent device (Electro Luminescence Device, It is provided on a display surface of an image display device such as an ELD and the like so that when the user touches the touch screen panel while looking at the image display device, the position information of the point touched by the user is input.

The touch screen panel (TSP) is connected to the touch screen panel controller, the touch screen panel controller is made of a structure connected to the host processor, the touch screen panel (TSP) and the touch screen panel controller is a flexible printing A structure connected by a flexible printed circuit (FPC) is common.

The touch screen panel controller is mounted on a flexible printed circuit board (FPC) is called a touch screen panel controller board device.

For reference, a technology of a structure in which a touch panel flexible printed circuit board (FPC) is attached to one side of the touch panel and the touch screen panel controller is attached to the touch panel flexible printed circuit board (FPC) is disclosed in Korea. Patent Publication No. 10-1359658 (February 06, 2014) of the "flexible circuit board connecting the touch panel integrated display device and the touch panel controller" has been disclosed.

However, the conventional touch screen panel controller board device including the registration No. 10-1359658 has a problem that is vulnerable to electrostatic discharge from the outside.

Registered Patent Publication No. 10-1359658

SUMMARY OF THE INVENTION An object of the present invention is to solve the conventional problems as described above, connecting a circuit board on which a touch controller chip is mounted to a flexible board, but covering the circuit board with a capacitive element and an electrostatic shielding tape having an electromagnetic shielding function. The present invention provides a touch screen panel controller board device and a method of manufacturing the same, which can block an electrostatic discharge applied to a touch controller chip.

Another object of the present invention is to provide a touch screen panel controller board apparatus and a method of manufacturing the same, which can block an electrostatic discharge applied to a wiring layer by providing a mesh ground layer and a diode part on the wiring layer of the flexible substrate.

As a means for achieving the above object, the configuration of the present invention is a flexible substrate having a first end connected to the touch screen panel (TSP) side, and a reinforcement plate attached and fixed to the lower surface of the second end of the flexible substrate. And a first adhesive layer formed on the lower surface of the reinforcement plate, a first release paper attached to the first adhesive layer and removed in use, and a flexible substrate at a position corresponding to the reinforcement plate. A circuit board fixed to the upper end of the second end, a touch controller chip mounted on the circuit board and connected to a host processor, and the touch controller chip to cover a part of the upper surface of the circuit board. An electrostatic shielding tape having a capacitive element and an electromagnetic shielding function, and attached to and fixed to a lower surface of the first end of the flexible substrate. An auxiliary reinforcement film, an upper reinforcement film attached to and fixed to an upper surface of the first end of the flexible substrate at a position corresponding to the lower reinforcement film, a second adhesive layer formed on the upper surface of the upper reinforcement film, and It is preferable to include a second release paper attached to one second adhesive layer and removed at the time of use.

The structure of the present invention includes a wiring layer for transmitting data between the touch controller chip and the touch screen panel side, a mesh ground layer formed on the upper surface of the wiring layer, and a mesh ground layer for grounding, and the mesh described above. And an insulating film layer formed on the upper surface of the ground layer, and a diode portion connected to the wiring layer, wherein the mesh ground layer and the diode portion block a static discharge from the outside applied to the wiring layer. Paper is preferred.

The structure of the present invention is preferred that the mesh ground layer is formed of a mesh pattern having a line width of 3 to 8 μm and a line interval of 200 to 600 μm as a gold material.

According to the configuration of the present invention, the diode unit includes a first resistor connected between the reception electrostatic radiation signal line RX_ESD and the reception ground signal line RX_GR of the wiring layer, and the reception electrostatic radiation signal line RX_ESD and the first resistor. Between the second resistor connected to the contact, the reception ground signal line RX_GR and the first TVS diode connected to the contact of the first resistor, the transmission electrostatic radiation signal line TX_ESD and the transmission ground signal line TX_GR of the wiring layer. A second resistor connected to the third resistor; a fourth resistor connected to the transmission electrostatic radiation signal line TX_ESD and a contact of the third resistor; and a second TVS connected to a contact of the transmission ground signal line TX_GR and the third resistor. It is preferable to include a diode.

The structure of this invention is that the said electrostatic shielding tape is a binder layer, the electromagnetic shielding polymer layer formed in the lower surface of the said binder layer, the 1st silicone layer formed in the upper surface of the said binder layer, A multi-layer dielectric layer formed on the upper surface of the first silicon layer, and a second silicon layer formed on the upper surface of the multi-layer dielectric layer, wherein the first silicon layer and the multi-layer dielectric layer It is preferable to have a structure in which the capacitance element is formed by the second silicon layer.

The construction of the method of the present invention as a means for achieving the above object comprises the steps of attaching a reinforcement plate to the bottom surface of the second end of the flexible substrate having a mesh ground layer and a diode portion formed on top of the wiring layer; Forming a first adhesive layer on the plate, attaching the first release paper to the first adhesive layer, mounting a circuit component including a touch controller chip on the circuit board, and a second end of the flexible substrate Connecting the circuit board to the upper surface, and covering the capacitive element and the electrostatic shielding tape having an electromagnetic shielding function on the circuit board, and forming the capacitive element formed on the electrostatic shielding tape on the mesh ground of the flexible substrate. Connecting the layer, attaching the lower reinforcement film to the lower surface of the first end of the flexible substrate, and Attaching an upper reinforcement film to an upper surface of the first end of the upper surface; forming a second adhesive layer on an upper surface of the upper reinforcement film; and attaching a second release paper to the second adhesive layer. It is preferable to include.

In the configuration of the method of the present invention, the antistatic tape includes the steps of forming a binder layer, forming a first silicon layer on an upper surface of the binder layer, and an upper surface of the first silicon layer. Forming a multi-layer dielectric layer on the substrate, forming a second silicon layer on the upper surface of the multi-layer dielectric layer, collecting and drying the polymer filament yarn, and preparing an aggregate yarn, 1000 parts by weight of distilled water 0.1 to 10 parts by weight of an activator, 5 to 20 parts by weight of a metal salt reducing agent, and 50 to 200 parts by weight of an acid are sequentially added and stirred to prepare a surface activator, 5 to 50 parts by weight of a metal salt and 1 to 20 complexing agents. Part by weight, 0.001 to 40 parts by weight of stabilizer, 5 to 100 parts by weight of reducing agent are sequentially prepared and stirred to prepare an electroless metal coating solution, 40 to 150 parts by weight of electrolyte, 10 to 40 parts by weight of electrode corrosion inhibitor, stress relieving agent 1 to 5 parts by weight, surfactant 0.1 to 0.5 parts by weight, conduction aid 10 to 50 parts by weight of sequentially administering and stirring to prepare an electrolyte solution, activating the surface while impregnating the aggregated yarn with a surface activator, and the surface-activated aggregate yarn Impregnating the metal-coated solution with an electroless metal coating solution, and depositing the metal-coated aggregated yarn in an electrolyte solution as a cathode, and using a carbon sheet, graphite, carbon-compressed film as an anode, Decomposing to form a carbon layer, 3,000 to 6000 parts by weight of alcohol, 4 to 100 parts by weight of silane, and then stirring, impregnating the aggregated yarn with the carbon layer, and heating and silane surface treatment, and silane surface Cutting the treated aggregate yarn to prepare a yarn, 1000 parts by weight of a polymer resin or a polymer elastomer, 100 to 500 parts by weight of yarn, and 0.1 to 20 parts by weight of an auxiliary shielding agent. 1.0 to 5.0 parts by weight of antioxidants, 1.0 to 10 parts by weight of pigments are sequentially added and melt mixed and kneaded, 20 to 100 parts by weight of polymer resin or polymer elastomer, 10 to 100 parts by weight of ferrite powder, 0.1 to about processing aid 5 parts by weight, flame retardant 1 ~ 300 parts by weight is added sequentially and melt-mixed to prepare a polymer composite, and the step of applying the polymer composite to the lower surface of the binder layer to form a polymer layer is preferred. .

This invention prevents electrostatic discharge applied to the touch controller chip by covering a capacitive element and an electrostatic shielding tape having an electromagnetic shielding function on a circuit board on which the touch controller chip is mounted, and a mesh ground on the wiring layer of the flexible substrate. By providing a layer and a diode part, it is possible to block the electrostatic discharge applied to the wiring layer.

1 is a perspective view of a touch screen panel controller board device according to an embodiment of the present invention.
2 is a cross-sectional view taken along the line AA of FIG.
3 is a cross-sectional view of the flexible substrate of the touch screen panel controller board device according to an embodiment of the present invention.
4 is a circuit diagram of a diode unit of a touch screen panel controller board device according to an embodiment of the present invention.
5 is a cross-sectional view of an antistatic tape of a touch screen panel controller board device according to an embodiment of the present invention.
6 is a flowchart illustrating a method of manufacturing a touch screen panel controller board device according to an embodiment of the present invention.
7 is a flowchart illustrating a manufacturing process of an anti-static tape of the method for manufacturing a touch screen panel controller board device according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily implement the present invention. Other objects, features, and operational advantages, including the object, operation, and effect of the present invention will become more apparent from the description of the preferred embodiment.

For reference, the embodiments disclosed herein are only presented by selecting the most preferred embodiment in order to help those skilled in the art from the various possible examples, the technical spirit of the present invention is not limited or limited only by the embodiments presented In addition, various changes, additions, and modifications including equivalents and substitutes may be made without departing from the spirit of the present invention.

In addition, the terms or words used in the specification and claims herein are defined on the basis of the principle that the inventor can appropriately define the concept of terms in order to best explain his invention in the best way. However, the present invention should not be construed as being limited to the ordinary or dictionary meaning, but should be interpreted as meanings and concepts consistent with the technical spirit of the present invention. As an example, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The expression "includes" not only a direct connection or connection but also a connection or connection through another component in the middle. In addition, the expression "unit" includes a unit realized using hardware, a unit realized using software, a unit realized using both hardware or software, and one unit includes one or more pieces of hardware or software. May be realized using two or more units may be realized using one hardware or software.

1 is a perspective view of a touch screen panel controller board device according to an embodiment of the present invention, Figure 2 is a cross-sectional view taken along the line A-A of FIG.

As shown in FIG. 1 and FIG. 2, the configuration of the touch screen panel controller board apparatus according to an embodiment of the present invention includes a flexible substrate having a first end 1a connected to a touch screen panel (TSP) side. 1), a reinforcing plate 2 attached to and fixed to the lower surface of the second end 1b of the flexible substrate 1, and a first adhesive layer formed on the lower surface of the reinforcing plate 2 ( 3), the first release paper 4 attached to the first adhesive layer 3 described above and removed at the time of use, and the second end of the flexible substrate 1 at a position corresponding to the reinforcement plate 2 described above. (1b) a circuit board 5 attached and fixed to an upper surface, a touch controller chip 6 mounted on the circuit board 5 and connected to a host processor side, and the touch controller chip 5 described above. Covering a portion of the upper surface of the circuit board 5 including a capacitive element and the electromagnetic difference Corresponding to the electrostatic shielding tape 7 having a function, the lower reinforcement film 8 attached and fixed to the lower surface of the first end 1a of the flexible substrate 1, and the lower reinforcement film 8 described above. An upper reinforcement film 9 attached to and fixed to an upper surface of the first end portion 1a of the flexible substrate 1 at a position, a second adhesive layer 10 formed on the upper surface of the upper reinforcement film 9 described above; , The second release paper 11 attached to the second adhesive layer 10 and removed in use.

3 is a cross-sectional view of the flexible substrate 1 of the touch screen panel controller board apparatus according to the embodiment of the present invention.

As shown in FIG. 3, the flexible substrate 1 of the touch screen panel controller board apparatus according to an embodiment of the present invention transmits data between the touch controller chip 5 and the touch screen panel (TSP) side. Is formed on the wiring layer 111 and the upper surface of the wiring layer 111 with a mesh pattern, and is formed on the mesh ground layer 112 for grounding and the upper surface of the mesh ground layer 112. An insulating film layer 113 and a diode portion (not shown) connected to the wiring layer 111, and the outside of which the mesh ground layer 112 and the diode portion are applied to the wiring layer 111. It is made of a structure to block the electrostatic discharge from.

The mesh ground layer 112 is a gold material and is formed of a mesh pattern having a line width of 3 to 8 μm and a line interval of 200 to 600 μm. If it is less than or exceeds this limited value, it turns out that the fixed-capacitance discharge blocking effect falls.

4 is a circuit diagram of a diode unit of a touch screen panel controller board device according to an embodiment of the present invention.

As shown in FIG. 4, the diode unit of the touch screen panel controller board apparatus according to the exemplary embodiment of the present invention is connected between the receiving electrostatic radiation signal line RX_ESD and the receiving ground signal line RX_GR of the wiring layer 111. The first resistor R5, the second resistor R7 connected to the contact of the reception electrostatic radiation signal line RX_ESD and the first resistor R5, the reception ground signal line RX_GR and the first resistor R5. A first TVS diode (TVS1) connected to a contact of the third resistor, a third resistor (R6) connected between the transmission electrostatic discharge signal line (TX_ESD) and the transmission ground signal line (TX_GR) of the wiring layer 111, and transmission power failure The fourth resistor R8 connected to the contact point of the radiation signal line TX_ESD and the third resistor R6, and the second TVS diode connected to the contact point of the transmission ground signal line TX_GR and the third resistor R6. TVS2).

The above-mentioned TVS (Transient Voltage Suppressor) diode is a diode with sub-nanosecond response time and high surge absorption capability. When instantaneous high energy shock is applied at both ends, the impedance value between both ends is very high from low impedance to low impedance. The device has the ability to absorb high currents and clamp voltages through them.

5 is a cross-sectional view of an antistatic tape of a touch screen panel controller board device according to an embodiment of the present invention.

As shown in FIG. 5, the electrostatic blocking tape 7 of the touch screen panel controller board apparatus according to the exemplary embodiment of the present invention is formed on the binder layer 71 and the lower surface of the binder layer 71. The electromagnetic shielding polymer layer 72, the first silicon layer 73 formed on the upper surface of the binder layer 71, and the upper surface of the first silicon layer 73 described above. And a second silicon layer 75 formed on the upper surface of the multilayer dielectric layer 74, wherein the first silicon layer 73 and the multilayer dielectric layer ( 74 and the second silicon layer 75 are formed to have a structure in which a capacitance element is formed.

6 is a flowchart illustrating a method of manufacturing a touch screen panel controller board device according to an embodiment of the present invention.

As illustrated in FIG. 6, the method for manufacturing a touch screen panel controller board device according to an embodiment of the present invention includes a reinforcement plate on a lower surface of a second end of a flexible substrate having a mesh ground layer and a diode portion formed on an upper portion of a wiring layer. Attaching (S10), forming a first adhesive layer on the reinforcing plate (S20), attaching a first release paper on the first adhesive layer (S30), and touching the circuit board Mounting a circuit component including a controller chip (S40); connecting the circuit board to the upper surface of the second end of the flexible substrate (S50); and capacitive element and electromagnetic shielding function to the circuit board. Connecting the capacitive element formed on the electrostatic shielding tape with the mesh ground layer of the flexible substrate while covering the electrostatic shielding tape (S60), and the first substrate of the flexible substrate. Attaching the lower reinforcement film to the lower end surface (S70), attaching the upper reinforcement film to the upper end surface of the first end of the flexible substrate (S80), and a second adhesive layer on the upper surface of the upper reinforcement film Forming a step (S90), and attaching a second release paper to the second adhesive layer (S100).

Referring to the manufacturing method of the touch screen panel controller board device according to an embodiment of the present invention by the above configuration in detail as follows.

First, the reinforcing plate 2 is attached to the lower surface of the second end 1b of the flexible substrate 1 (S10).

Next, the first adhesive layer 3 is formed on the reinforcing plate 2 (S20), and the first release paper 4 is attached to the first adhesive layer 3 (S30).

Subsequently, after mounting the circuit component including the touch controller chip 6 on the circuit board 5 (S40), the circuit board 5 is mounted on the upper surface of the second end 1b of the flexible substrate 1 described above. While connecting the wiring layer 111 and the circuit component of the flexible substrate 1 (S50).

Next, the capacitive element formed on the capacitive shielding tape 7 is covered with the capacitive element and the capacitive shielding tape 7 having the electromagnetic shielding function on the circuit board 5. By connecting to the mesh ground layer 112, the electrostatic discharge applied to the touch controller chip 6 from the outside is blocked (S60).

Subsequently, the lower reinforcement film 8 is attached to the lower surface of the first end 1a of the flexible substrate 1 (S70).

Next, the upper reinforcing film 9 is attached to the upper surface of the first end 1a of the flexible substrate 1 (S80).

Subsequently, the second adhesive layer 10 is formed on the upper surface of the upper reinforcement film 9 (S90), and the second release paper 11 is attached to the second adhesive layer 10 (S100). .

7 is a flowchart illustrating a manufacturing process of an anti-static tape of the method for manufacturing a touch screen panel controller board device according to an embodiment of the present invention.

As shown in FIG. 7, the manufacturing process of the antistatic tape of the method for manufacturing a touch screen panel controller board device according to an embodiment of the present invention includes forming a binder layer (S110) and an upper portion of the binder layer. Forming a first silicon layer on a surface (S120), forming a multilayer dielectric layer on an upper surface of the first silicon layer (S130), and forming a second silicon layer on an upper surface of the multilayer dielectric layer Forming step (S140), and gathering and drying the polymer filament yarn to an aggregate pitch of 5 ~ 300mm to produce a bundle (S150), 1000 parts by weight of distilled water, 0.1 to 10 parts by weight of activator, metal salt Step 5 to 20 parts by weight of reducing agent, 50 to 200 parts by weight of acid in order to prepare a surface activator by stirring (S160), metal salt 5 to 50 parts by weight, complexing agent 1 to 20 parts by weight, stabilizer 0.001 to 40 Parts by weight, 5-100 parts by weight of a reducing agent are sequentially administered Step of preparing an electroless metal coating liquid by high stirring (S170), 40 to 150 parts by weight of electrolyte, 10 to 40 parts by weight of electrode corrosion inhibitor, 1 to 5 parts by weight of stress relief agent, 0.1 to 0.5 parts by weight of surfactant, conductive aid 10-50 parts by weight is sequentially administered and stirred to prepare an electrolytic solution (S180), the step of activating the surface by impregnating the aggregate yarn with a surface activator (S190), and the surface-activated aggregate yarn The metal coating step while impregnating the seacoated metal coating solution (S200), and the metal-coated aggregated yarn is immersed in the electrolytic solution as a cathode, using a carbon sheet, graphite, carbon-compression film, etc. as an anode using a direct current Step of electrolysis to form a carbon layer (S210), 3,000 ~ 6000 parts by weight of alcohol, 4 ~ 100 parts by weight of silane is added and stirred, then impregnated the aggregated yarn with the carbon layer formed, heated to the silane surface Step (S220), and cutting the silane surface-treated aggregate yarn to prepare a yarn (S230), 1000 parts by weight of a polymer resin or polymer elastomer, 100 to 500 parts by weight of yarn, 0.1 to 20 parts by weight of an auxiliary shielding agent, 1.0 to 5.0 parts by weight of antioxidant, 1.0 to 10 parts by weight of pigments are sequentially added and melt mixed and kneaded (S240), 20 to 100 parts by weight of polymer resin or polymer elastomer, 10 to 100 parts by weight of ferrite powder, processing aid 0.1 to 5 parts by weight, flame retardant 1 to 300 parts by weight in sequence and melt mixing to produce a polymer composite (S250), and applying the polymer composite to the lower surface of the binder layer to form a polymer layer 72 Step S260 is performed.

According to the above configuration, the manufacturing process of the electrostatic shielding tape of the touch screen panel controller board device manufacturing method according to an embodiment of the present invention will be described in detail.

First, the binder layer 71 is formed (S110), and the first silicon layer 73 is formed on the upper surface of the binder layer 71 (S120).

Next, after the multilayer dielectric layer 74 is formed on the upper surface of the first silicon layer 73 (S130), the second silicon layer 75 is disposed on the upper surface of the multilayer dielectric layer 74. It forms (S140).

Subsequently, polymer filament yarns such as polyester yarns, nylon yarns and aramid yarns having a filament diameter of 1 to 50 µm and a filament number of 50 to 4000 g are assembled at a gathering pitch of 5 to 300 mm, and heated to a hot air drying oven at 80 to 120 ° C. Drying while passing continuously to produce a collective yarn (S150).

Next, 1000 parts by weight of distilled water, 0.1 to 10 parts by weight of an activating agent such as rhodium trichloride, diamine palladium hydroxide, platinum chloride, palladium chloride, metal salt reducing agents such as zinc chloride, cadmium chloride, tin chloride, and 5 to 20 weight parts 50-200 parts by weight of acid, such as parts, hydrochloric acid and sulfuric acid are sequentially added, and stirred for 5 to 60 minutes at a speed of 50 to 1000 rpm to prepare a surface activator (S160). When the activator is less than 0.1 part by weight, the surface adhesion of the metal is lowered, and when it is 10 parts by weight or more, the economy is inferior. When the metal salt reducing agent is less than 5 parts by weight, the surface adhesion of the metal is lowered, and when it is 20 parts by weight or more, the economy is inferior.

Subsequently, 5 to 50 parts by weight of metal salts such as kappa sulfate, kappa acetate, kappa carbonate, nickel sulfate, nickel chloride, gold cyanide, gold chloride, silver nitrate, citric acid, sodium citrate, succidic acid, Propionic acid, glycoyl acid, sodium acetate, ethyleneamine tetraacetate, disodium ethylenediamine tetraacetate, pyridine-3-sulfonyl chloride, potassium tartrate, sodium phosphate, potassium citrate, sodium borate, ammonia, methyl 1 to 20 parts by weight of complexing agents such as amines and ammonium chloride, 0.001 to 40 parts by weight of stabilizers such as lead acetate, sodium cyanide, thiourea, triethanolamine, thiodiglycoyl acid, acetylacetone, urea, sodium Hypophosphite, sodium borohydride, formate, formaldehyde , Diethylamine borane, dimethylamine borane, hydrazine, hydrazine sulfate, potassium borohydride, potassium cyanoborohydride and other reducing agents in 5 to 100 parts by weight sequentially administered and stirred for 5 to 60 minutes at a speed of 50 ~ 1000rpm An electroless metal coating solution is prepared (S170). If the complexing agent is less than 1 part by weight, the metal coating property is inferior, and if it is 20 parts by weight or more, the by-product generation is increased. When the stabilizer is less than 0.001 part by weight, the long-term stability of the metal coating liquid is lowered, and when it is 40 parts by weight or more, the coating property is inferior. The reducing agent serves to reduce the metal of the metal salt. If it is less than 5 parts by weight, the coating property of the metal coating liquid is inferior, and if it is more than 100 parts by weight, the by-products by side reactions increase.

Next, 40 to 150 parts by weight of an electrolyte such as peres sulfate, nickel sulfate, aluminum sulfate, kappa sulfate, 10 to 40 parts by weight of electrode corrosion inhibitor such as lithium hydroxide, boric acid, 1,4-butanediol, saccharin, 1 to 5 parts by weight of stress relieving agents such as allyl sulfonyl salt, formaldehyde, thiourea, sodium dodecyl sulfate, N-laurie-beta-aminopropionic acid, sorbitan mono-oleate 0.1 ~ 0.5 parts by weight, 10 to 50 parts by weight of conduction aids such as sodium chloride, ammonium chloride, potassium chloride, calcium chloride were sequentially administered, and stirred for 30 to 120 minutes at a speed of 50-100 rpm to prepare an electrolyte solution (S180). When the electrolyte is less than 40 parts by weight, the coating thickness becomes thin when the carbon layer is formed, and when it is 150 parts by weight or more, the amount of carbon that is deposited without coating is increased. When the above-mentioned electrode corrosive agent is 10 parts by weight, the metal coating layer is corroded, and when it is 40 parts by weight or more, the economy is inferior. The stress relieving agent serves to reduce the surface tension of the electrolyte, and if less than 1 part by weight, the carbon coating layer is thinner, and if by more than 5 parts by weight, by-products increase. When the surfactant is less than 1 part by weight, the carbon coating layer becomes thin, and when it is 5 parts by weight or more, the by-product increases. When the conductive aid is less than 10 parts by weight, the carbon coating layer becomes thinner and by-products increase when the weight is greater than 50 parts by weight.

Subsequently, while impregnating the aggregate yarn prepared in S150 at a speed of 0.1-100 m / min into the surface activator prepared in S160, the surface is activated so that the metal can be easily attached to the surface (S190).

Next, the metal coating is performed while the surface-activated aggregate yarn is impregnated in the electroless metal coating liquid prepared in step S170 at a speed of 0.1-100 m / min (S200).

Subsequently, the metal-coated aggregated yarn was deposited on the electrolyte prepared in step S180 to form a negative electrode, and the carbon sheet, graphite, carbon-compressed film, etc., as the positive electrode was used for 1 to 6 hours using a DC current of 1 to 50V. Electrolysis forms a carbon layer (S210).

Next, 3,000 to 6000 parts by weight of alcohol such as methanol, ethanol, propanol, and 4 to 100 parts by weight of silane are added thereto, and the mixture is stirred at a speed of 100 to 1000 rpm for 30 to 120 minutes, and then the aggregated yarn having the carbon layer formed is 0.1 to 100 m. Impregnated at a rate of / min, and heated to a temperature of 40 ~ 100 ℃ silane surface treatment (S220). When the silane is less than 4 parts by weight, the surface adhesion between the yarn and the polymer is inferior, and when it is 100 parts by weight or more, the economy is inferior.

Subsequently, the silane surface-treated aggregate yarn is cut to prepare yarns (S230).

Next, 1000 parts by weight of polymer resin or polymer elastomer, 100 to 500 parts by weight of yarn, carbon black, carbon nanotube, 0.1 to 20 parts by weight of auxiliary shielding agent such as graphite, graphene, antioxidant 1 to 5 parts by weight, pigment 1 ~ 10 parts by weight is sequentially added to melt and kneaded for 10 to 60 minutes at a temperature of 160 ~ 300 ℃ (S240). The auxiliary shielding agent serves to reinforce the electromagnetic shielding property of the polymer composite. When the auxiliary shielding agent is less than 0.1 part by weight, the electromagnetic shielding reinforcing effect is inferior. When the antioxidant is less than 1 part by weight, the polymer is oxidized at the time of kneading, and when it is 5 parts by weight or more, the economy is inferior. When the pigment is less than 1 part by weight, the polymer is oxidized, and when it is 10 parts by weight or more, the dispersibility is poor.

Subsequently, 20 to 100 parts by weight of the polymer resin or the polymer elastomer, 10 to 100 parts by weight of the ferrite powder, 0.1 to 5 parts by weight of the processing aid, and 1 to 300 parts by weight of the flame retardant were sequentially added, and then 10 to 60 minutes at a temperature of 160 to 300 ° C. Melt mixing during the preparation of the polymer composite (S250). In the case where the ferrite powder is less than 10 parts by weight, the magnetic shielding property is lowered, and in the case of 100 parts by weight or more, the economy is inferior. When the processing aid is less than 0.1 part by weight, the dispersibility of the polymer composite is inferior, and when it is 5 parts by weight or more, the surface is migrated to the surface of the polymer composite. If the flame retardant is less than 1 part by weight, the flame retardancy of the polymer composite is lowered, and if it is 100 parts by weight or more, the kneading property is lowered.

Next, the polymer composite is applied to the lower surface of the binder layer 71 and then dried at a temperature of 60 to 120 ° C. to form the polymer layer 72 (S260).

The electrostatic shielding tape 7 manufactured as described above was improved in dispersibility of the filler, and as a result of the experiment, it was confirmed that the tensile strength was 10 to 15 MPa and the electromagnetic shielding efficiency was 90%.

1 Flexible board 2 Reinforcement plate
3: first adhesive layer 4: first release paper
5: circuit board 6: touch controller chip
7: electrostatic shielding tape 8: lower reinforcing film
9: upper reinforcement film 10: second adhesive layer
11: second release paper

Claims (7)

A flexible substrate having a first end connected to a touch screen panel (TSP) side;
A reinforcing plate attached and fixed to a lower surface of the second end of the flexible substrate;
A first adhesive layer formed on the lower surface of the reinforcing plate;
A first release paper attached to the first adhesive layer and removed in use;
A circuit board attached and fixed to an upper surface of the second end of the flexible substrate at a position corresponding to the reinforcing plate;
A touch controller chip mounted on the circuit board and connected to the host processor;
An electrostatic shielding tape covering a part of the upper surface of the circuit board including the touch controller chip and having a capacitive element and an electromagnetic shielding function;
A lower reinforcement film attached to and fixed to a lower surface of the first end of the flexible substrate;
An upper reinforcement film attached to and fixed to an upper surface of the first end of the flexible substrate at a position corresponding to the lower reinforcement film;
A second adhesive layer formed on the upper surface of the upper reinforcement film,
A second release paper attached to said second adhesive layer and removed in use,
The antistatic tape includes a binder layer, an electromagnetic shielding polymer layer formed on the lower surface of the binder layer, a first silicon layer formed on the upper surface of the binder layer, and the first silicon. And a second silicon layer formed on the upper surface of the multilayer dielectric layer, wherein the first silicon layer, the multilayer dielectric layer, and the second silicon layer are formed on the upper surface of the multilayer dielectric layer. Capacitive element is formed by the structure,
The flexible substrate includes a wiring layer for transmitting data between the touch controller chip and the touch screen panel side, a mesh ground layer formed on the upper surface of the wiring layer, and a mesh ground layer for grounding, and the mesh. And an insulating film layer formed on an upper surface of the ground layer, and a diode portion connected to the wiring layer, wherein the mesh ground layer and the diode portion block a static discharge from the outside applied to the wiring layer. Touch screen panel controller board device, characterized in that. delete The method of claim 1,
The mesh ground layer is a gold material and is formed of a mesh pattern having a line width of 3 to 8 μm and a line interval of 200 to 600 μm as a gold material. The method of claim 1,
The diode unit,
A first resistor connected between the reception electrostatic radiation signal line RX_ESD and the reception ground signal line RX_GR of the wiring layer;
A second resistor connected to the contact of the receiving electrostatic radiation signal line RX_ESD and the first resistor,
A first TVS diode connected to the reception ground signal line RX_GR and a contact of the first resistor;
A third resistor connected between the transmission electrostatic radiation signal line TX_ESD and the transmission ground signal line TX_GR of the wiring layer;
A fourth resistor connected to the contact of the transmission electrostatic radiation signal line TX_ESD and the third resistor;
And a second TVS diode connected to the transmission ground signal line (TX_GR) and the contact of the third resistor. delete Attaching a reinforcing plate to the lower surface of the second end of the flexible substrate having the mesh ground layer and the diode portion formed on the wiring layer;
Forming a first adhesive layer on the reinforcing plate;
Attaching the first release paper to the first adhesive layer;
Mounting a circuit component including a touch controller chip on the circuit board;
Connecting the circuit board to the upper surface of the second end of the flexible substrate;
Connecting the capacitive element formed on the capacitive tape with the mesh ground layer of the flexible substrate while covering the circuit board with the capacitive element and the capacitive tape having an electromagnetic shielding function;
Attaching a lower reinforcement film to a lower surface of the first end of the flexible substrate;
Attaching an upper reinforcement film to an upper surface of the first end of the flexible substrate;
Forming a second adhesive layer on an upper surface of the upper reinforcing film;
Attaching a second release paper to the second adhesive layer;
The above blackout tape,
Forming a binder layer,
Forming a first silicon layer on an upper surface of the binder layer;
Forming a multilayer dielectric layer on an upper surface of the first silicon layer;
Forming a second silicon layer on an upper surface of the multilayer dielectric layer;
Collecting the polymer filament yarn and drying the yarn to produce aggregate yarn,
Preparing a surface activator by sequentially adding and stirring 1000 parts by weight of distilled water, 0.1 to 10 parts by weight of activator, 5 to 20 parts by weight of a metal salt reducing agent, and 50 to 200 parts by weight of acid;
5 to 50 parts by weight of metal salt, 1 to 20 parts by weight of complexing agent, 0.001 to 40 parts by weight of stabilizer, and 5 to 100 parts by weight of reducing agent are sequentially administered and stirred to prepare an electroless metal coating solution,
40 to 150 parts by weight of electrolyte, 10 to 40 parts by weight of electrode corrosion inhibitor, 1 to 5 parts by weight of stress relieving agent, 0.1 to 0.5 parts by weight of surfactant, and 10 to 50 parts by weight of conduction aid are sequentially administered and stirred to prepare an electrolyte solution. Wow,
Activating a surface while impregnating the aggregated yarn with a surface activator,
Performing a metal coating while impregnating the surface-activated aggregate yarn in an electroless metal coating solution;
Depositing the metal-coated aggregated yarn in an electrolytic solution to form a cathode, and forming a carbon layer by electrolysis using a direct current using a carbon sheet, graphite, a carbon yarn crimp film, etc .;
Adding and stirring 3000 to 6000 parts by weight of alcohol and 4 to 100 parts by weight of silane, and then impregnating the aggregated yarn having the carbon layer formed thereon, and heating the silane surface;
Cutting the silane surface-treated aggregate yarn to prepare yarn;
1000 parts by weight of polymer resin or polymer elastomer, 100 to 500 parts by weight of yarn, 0.1 to 20 parts by weight of auxiliary shielding agent, 1.0 to 5.0 parts by weight of antioxidant, 1.0 to 10 parts by weight of pigment, sequentially mixing and melting and kneading,
20 to 100 parts by weight of a polymer resin or a polymer elastomer, 10 to 100 parts by weight of ferrite powder, 0.1 to 5 parts by weight of a processing aid, and 1 to 300 parts by weight of a flame retardant are sequentially added and melt mixed to prepare a polymer composite,
And applying the polymer composite to the lower surface of the binder layer to form a polymer layer.




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