KR102074856B1 - Substrate and method of the same - Google Patents

Abstract

According to an embodiment, a method of manufacturing a substrate includes preparing a preliminary substrate; Cutting the preliminary substrate; And plasma etching the preliminary substrate.

Description

Glass Substrate and Manufacturing Method Thereof {SUBSTRATE AND METHOD OF THE SAME}

The present disclosure relates to a glass substrate and a method of manufacturing the same.

Chemically tempered glass, which is currently used as a substrate for display panels, has a problem in that damage and cracking occur frequently while being expensive. In addition, due to the micro cracks on the surface or the side of the product is applied to the chemically strengthened glass deviation occurs, which results in a decrease in the reliability of the product. In addition, as the thickness of the substrate decreases due to the recent thinning of the display panel, a situation in which chemically strengthened glass is required to maintain the thin thickness and to strengthen the strength.

In order to cover the micro cracks, the chemically strengthened glass is coated with a coating liquid. However, in general, coating liquids using silica sol have satisfactory properties at high temperatures of 300 ° C. or higher and at least 1 hour of curing. However, in the case of chemically tempered glass, the strengthening is released at high temperatures. There is. That is, chemically strengthened glass has a disadvantage that it is impossible to apply a coating solution that requires high temperature curing.

The embodiment provides a glass substrate having improved strength and a method of manufacturing the same.

According to an embodiment, a method of manufacturing a substrate includes preparing a preliminary substrate; Cutting the preliminary substrate; And plasma etching the preliminary substrate.

The substrate according to the embodiment includes a glass is subjected to plasma etching, through which, it is possible to improve the intensity of the chemically strengthened glass by improving the roughness of the chemically strengthened glass. In particular, in accordance with the trend of thinning, the strength can be maintained even if the chemically strengthened glass is thinned. Moreover, the compressive stress layer of chemically strengthened glass can be maintained as it is, and reliability can be improved.

In addition, improved strength can be maintained even for substrates in which the sodium content is between 3 wt% and 30 wt% with respect to the total weight of the substrate. In other words, strength can be ensured even for glass having various sodium weights. Thus, improved average strength can be maintained even for inexpensive glass.

Through this, when the substrate is used as a cover substrate of the display device, it is possible to reduce the cost while maintaining the strength without breaking or damage of the substrate.

On the other hand, the substrate is applicable to a variety of interior and exterior materials or automobile parts, as well as display devices such as mobile.

In addition, the substrate according to the embodiment is not applied to a separate coating layer can maintain the physical properties of the glass itself, such as pencil hardness, and also may occur during the coating process (Orange Peel), coating resilience (Sissing), oh There is no possibility of various coating film defects such as crushing and foreign material defects.

In addition, the coating substrate according to the embodiment can omit a separate coating layer can maintain transparency, can improve the transmittance is advantageous when applied to the substrate of the display panel. In addition, the manufacturing process for forming the coating layer can be omitted, thereby simplifying the process.

1 is a perspective view illustrating a substrate according to an embodiment.
2 is a process flowchart of a method of manufacturing a substrate according to the embodiment.
3 is a perspective view of an apparatus for manufacturing a substrate according to the embodiment.
4 shows an SEM image of the example.
5 shows an SEM image of a comparative example.
6 is a graph for comparing the strength of the Examples and Comparative Examples.

In the description of embodiments, each layer, region, pattern, or structure may be “on” or “under” the substrate, each layer, region, pad, or pattern. Substrate formed by ”includes all formed directly or through another layer. Criteria for the top / bottom or bottom / bottom of each layer are described with reference to the drawings.

In the drawings, the thickness or size of each layer (film), region, pattern, or structure may be modified for clarity and convenience of description, and thus does not necessarily reflect the actual size.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

First, the substrate according to the embodiment will be described in detail with reference to FIG. 1. 1 is a perspective view illustrating a substrate according to an embodiment.

Referring to FIG. 1, the substrate 100 according to the embodiment includes glass. Specifically, the substrate 100 may include chemically strengthened glass. For example, the chemically strengthened glass may be soda lime glass or aluminosilicate glass.

Preferably, the substrate 100 may be soda lime glass. In this case, the substrate 100 may include sodium, and the content of sodium may be 3 wt% to 30 wt% based on the total weight of the substrate 100.

The soda lime glass may be a glass produced by a float (float) method. The aluminosilicate glass may be produced by a fusion draw process.

However, the embodiment is not limited thereto, and the substrate 100 may include glass before chemically strengthening.

On the other hand, the substrate 100 includes a glass etched. Specifically, the substrate 100 includes glass subjected to dry etching. The substrate 100 includes glass subjected to plasma etching. This will be described in detail later.

The substrate 100 includes an upper surface and a lower surface opposing the upper surface, and includes a first side surface 110, a second side surface 120, a third side surface 130, and a fourth side surface 140.

The first side surface 110 is a side surface in contact with the upper and lower surfaces. The second side surface 120 is disposed to face the first side surface 110. The third side surface 130 is disposed in contact with the first side surface 110 and the second side surface 120. The fourth side 140 is disposed to face the third side 130.

Cracks or micro defects of at least one of the first side surface 110, the second side surface 120, the third side surface 130, and the fourth side surface 140. Is uniform. Specifically, the roughness Rp (maximum peak height) of at least one of the first side surface 110, the second side surface 120, the third side surface 130, and the fourth side surface 140 is 3.0. It is as follows. Rp is the height of the highest peak from the centerline within the reference length of either crack or micro defect.

Roughness Rq (root meen squred) of at least one of the first side surface 110, the second side surface 120, the third side surface 130, and the fourth side surface 140 is 0.4 or less. Rq is the average height of the peak or valley from the centerline of the crack or micro defect.

On the other hand, the average strength of the substrate 100 according to the embodiment may be 450 MPa or more. Specifically, the average strength of the substrate 100 according to the embodiment may be 500 MPa to 800 MPa. That is, in the embodiment, the strength of the substrate may be maintained through the roughness of the side surface of the substrate 100.

In addition, improved strength may be maintained even for a substrate having a sodium content of 3 wt% to 30 wt% based on the total weight of the substrate 100. In other words, strength can be ensured even for glass having various sodium weights. Thus, improved average strength can be maintained even for inexpensive glass.

Through this, when the substrate 100 is used as a cover substrate of the display device, the cost can be reduced while maintaining the strength without breaking or damaging the substrate 100.

On the other hand, the substrate 100 can be applied in various ways, such as interior and exterior materials or automobile parts, as well as display devices such as mobile.

In addition, the substrate 100 according to the embodiment may maintain its strength even if the substrate is thinned according to the trend of thinning.

In addition, since the substrate 100 according to the embodiment does not have a separate coating layer, the physical properties of the glass itself, such as pencil hardness, may be maintained, and the yuzu peel phenomenon and coating repulsion may occur during the coating process. ), There is no possibility of various coating film defects such as crate ring and foreign material defect.

In addition, the substrate 100 according to the embodiment may omit a separate coating layer, thereby maintaining transparency and improving transmittance, which is advantageous when applied to a substrate of a display panel. In addition, the manufacturing process for forming the coating layer can be omitted, thereby simplifying the process.

Hereinafter, a method of manufacturing a substrate according to an embodiment will be described with reference to FIGS. 2 and 3. For the sake of clarity and simplicity, detailed description of parts identical or similar to those described above will be omitted. 2 is a process flowchart of a method of manufacturing a substrate according to the embodiment. 3 is a perspective view of an apparatus for manufacturing a substrate according to the embodiment.

2, a method of manufacturing a substrate according to an embodiment includes preparing a preliminary substrate (ST100), cutting (ST200), and plasma etching (ST300).

In preparing the preliminary substrate (ST100), glass may be prepared. At this time, it is possible to prepare the soda lime glass described above.

Subsequently, in the cutting step ST200, the preliminary substrate may be cut. In this case, the preliminary substrate may be mechanically cut. Specifically, the cutting step (ST200) may be cut by a mechanical cutting process (NC). When the preliminary substrate is cut by a mechanical method, the preliminary substrate can be easily distinguished from the preliminary substrate cut by laser cutting. That is, the preliminary substrate cut by the mechanical method is very rough compared to the preliminary substrate cut by laser cutting.

Subsequently, in the plasma etching step (ST300), the preliminary substrate may be etched using plasma gas. The plasma gas may include any one selected from fluorine (F), carbon (C), hydrogen (H), and sulfur (S). For example, the plasma gas may include a gas represented by the chemical formula of CxFy. In this case, x and y may be represented by the following equation (1).

[Equation 1]

0 <x≤1, 1≤y≤4

In addition, the plasma gas may further include SF ₆ , H _2, and NF ₃ .

Through the plasma gas, cracks or microdefects disposed on the side surfaces of the preliminary substrate may be reduced, and illuminance may be improved.

Meanwhile, a doping gas may be further added in addition to the plasma gas. Ar, N ₂ , H ₂ or O ₂ may be used as the doping gas.

In the plasma etching step ST300, the manufacturing apparatus illustrated in FIG. 3 may be used. The manufacturing apparatus may include a support 10 and an etching machine 20.

The support part 10 may support the preliminary substrate 101. The preliminary substrate 101 may be disposed on the support 10, and one side 111 of the preliminary substrate 101 may be disposed upward. In this case, the support part 10 may further include a fixing part 12 capable of fixing the preliminary substrate 101.

The etchant 20 is disposed on the support 10. The etchant 20 may include a device capable of discharging the plasma using upper and lower electrodes. For example, such an etching machine 20 may be used inductively coupled plasma (ICP), reactive ion etching (RIE), dual frequency capacity coupled plasma (DCCP), capacitive coupled plasma (CCP), or the like.

The plasma etching step ST300 may take an etching time of 10 seconds to 180 minutes.

In the plasma etching step ST300, RF power, AC power, and DC power for forming a plasma may be used. At this time, the power may be 100W to 3 KW.

In the plasma etching step (ST300), the degree of etching may be controlled by controlling the density of the plasma formed by adjusting the etching time, the power intensity, the strength of the magnetic field, the pressure of the reactor in the manufacturing apparatus, and the ion bombardment energy.

Hereinafter, the Examples will be described in more detail with reference to Examples and Comparative Examples.

Example

Soda lime glass (soda lime glass) having a sodium content of about 23 wt% was cut and then chemically strengthened. After that, plasma etching was performed on the cut soda lime glass. At this time, the CF ₄ gas as a reaction gas, a CF ₄ gas as an etching gas, an Ar gas was used as a doping gas.

In the etching, the RF power was about 2 KW and the etching time was about 120 minutes.

Comparative example

The same soda-lime glass as in Example was prepared except that plasma etching was not performed.

4 and 5, an actual image of the example and the comparative example will be compared. 4 shows an SEM image of the example. 5 shows an SEM image of a comparative example.

4 and 5 are SEM images of the sides of the Examples and Comparative Examples, it can be seen that the side of the Example is smoother than the Comparative Example. That is, in the embodiment it can be seen that the roughness of the side is further improved through the plasma etching.

On the other hand, the results of measuring the intensity and roughness of the Examples and Comparative Examples are shown in Table 1 below.

Example Comparative example Strength (Mpa) 732 531 Roughness (Rp) 2.0 4.0 Roughness (Rq) 0.3 0.5

As shown in Table 1, it can be confirmed that the roughness Rp and Rq of the Example is lower than the comparative example. In addition, referring to Table 1 and Figure 6, it can be seen that the strength of the Example is about 200 MPa higher than that of the comparative example.

Features, structures, effects, and the like described in the above embodiments are included in at least one embodiment of the present invention, and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong. Therefore, it should be interpreted that the contents related to such a combination and modification are included in the scope of the present invention.

In addition, the above description has been made with reference to the embodiments, which are merely examples and are not intended to limit the present invention, and those skilled in the art to which the present invention pertains may be illustrated as above without departing from the essential characteristics of the present embodiment. It will be understood that various modifications and applications are not possible. For example, each component specifically shown in the embodiments may be modified. And differences relating to such modifications and applications will have to be construed as being included in the scope of the invention defined in the appended claims.

Claims (11)

A glass substrate comprising soda lime glass,
The glass substrate comprises more than 20 wt% to 30 wt% sodium based on the total weight of the glass substrate,
The glass substrate is
Upper surface;
A lower surface facing the upper surface; And
And a side surface connecting the upper surface and the lower surface,
The side is,
A first side surface in contact with the upper surface and the lower surface;
A second side facing the first side;
A third side surface in contact with the first side surface and the second side surface; And
A fourth side facing the third side;
The roughness Rp (Max. Peal height) of the first side, the second side, the third side and the fourth side is 3.0 or less,
The roughness Rq (root meen squred) of the first side, the second side, the third side and the fourth side is 0.4 or less,
Roughness Rp (Max. Peal height) of the first side, the second side, the third side, and the fourth side, and the first side, the second side, the third side, and the fourth side. The illuminance (Rq (root meen squred)) of the cover substrate for the uniform display device. delete delete The method of claim 1,
The strength of the glass substrate is 500 MPa to 800 MPa cover substrate for a display device. Preparing a preliminary substrate;
Cutting the preliminary substrate; And
Plasma etching the preliminary substrate;
In the plasma etching step, a reaction gas is added,
The reaction gas includes any one selected from fluorine (F), carbon (C), hydrogen (H) and sulfur (S),
The preliminary substrate comprises soda lime glass,
The cut preliminary substrate comprises more than 20 wt% to 30 wt% sodium based on the total weight of the cut preliminary substrate,
The cut preliminary substrate
Upper surface;
A lower surface facing the upper surface; And
And a side surface connecting the upper surface and the lower surface,
The side is,
A first side surface in contact with the upper surface and the lower surface;
A second side facing the first side;
A third side facing the first side and the second side; And
A fourth side facing the third side;
The roughness Rp (Max. Peal height) of the first side, the second side, the third side and the fourth side is 3.0 or less,
The roughness Rq (root meen squred) of the first side, the second side, the third side and the fourth side is 0.4 or less,
Roughness Rp (Max. Peal height) of the first side, the second side, the third side, and the fourth side, and the first side, the second side, the third side, and the fourth side. The roughness of (Rq (root meen squred)) is uniform
The manufacturing method of the cover substrate for display apparatuses. The method of claim 5,
The reaction gas includes CxFy,
The x and y is a manufacturing method of the cover substrate for a display device represented by the following equation.
0 <x≤1, 1≤y≤4 The method of claim 5,
And chemically strengthening the substrate before the plasma etching. The method of claim 5,
In the plasma etching step, RF power, AC power or DC power is used, the power is 100 W to 3 KW manufacturing method of the cover substrate for a display device. delete delete delete

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