KR102069181B1 - Multi layer board and signal control method of thereof - Google Patents

Abstract

According to the present invention, there is provided a multilayer substrate and a signal control method of the multilayer substrate. Specifically, the multilayer substrate according to the present invention is provided with a braking control device and a control method thereof. Specifically, the multi-layer substrate according to the present invention, in the radar apparatus, the first substrate including the first printed circuit board and the second substrate and the first substrate comprising a second printed circuit board located on the first substrate And a bonding layer that fixes the second substrate to each other, and transmits and receives a high frequency signal through wireless communication between the first printed circuit board and the second printed circuit board.

Description

MULTI LAYER BOARD AND SIGNAL CONTROL METHOD OF THEREOF}

      The present invention relates to a multi-layer substrate and a signal control method of a multi-layer substrate, and more particularly, to a multi-layer substrate and a signal control method of a multi-layer substrate for easy high frequency signal transmission.

Today, with the development of millimeter wave wireless communication technology, the demand for vehicle radar technology is increasing rapidly. The vehicle radar device is mounted outside the vehicle and can detect or track the distance, speed, and angle of the target device through radio wave transmission and reception. Recently, the FMCW (Frequency modulated continuous wave) radar, which has a relatively simple circuit configuration and low radio wave output in the 24Ghz or 77Ghz band, has been adopted as a vehicle radar device to detect front, rear and rear detection (including blind spot detection), Vehicles with automatic cruise control have been developed.

On the other hand, the vehicle radar device includes an internal electronic component such as an antenna for transmitting and receiving radio waves and millimeter wave RFIC (Radio Frequency Integrated Circuit) and a radome (Radome) for protecting it. The radome mechanically protects the internal electronic components of the vehicle radar device from the external environment and functions to minimize the loss of radio waves transmitted to or received from the outside.

In particular, the internal electronic components covered by the radome of the radar device are largely composed of a high frequency circuit section and a general board. However, as the mounting of radar increases today, efforts are being made to produce two circuits in a single configuration to simplify the manufacturing process.

For example, to simplify the manufacturing process, a printed circuit board (hereinafter referred to as 'PCB') is intended to be composed of a single PCB, and to prevent the inflow of noise and noise between the high-frequency circuit unit and the general board. Development is continuing.

Embodiment according to the present invention is to simplify the manufacturing process of the radar device by minimizing the thickness of the multi-layer substrate included in the radar device.

In addition, to reduce the noise generated in the signal transmission between the high-frequency circuit portion and the general board, and to minimize the interference caused by the radome installed to minimize the loss of radio waves, to improve the detection performance of the radar.

According to an embodiment of the present invention, a radar apparatus includes: a first substrate including a first printed circuit board; and a second substrate including a second printed circuit board positioned on the first substrate; A bonding layer fixing the first substrate and the second substrate to each other; It may include, and may provide a multi-layer substrate for transmitting and receiving a high frequency signal by wireless communication between the first printed circuit board and the second printed circuit board.

In addition, a cavity may be formed on a surface of the second substrate facing the first substrate, and the second printed circuit board may be positioned in the cavity.

The first printed circuit board may include a first integrated circuit chip for outputting a high frequency, an RF integrated circuit chip for receiving a radio signal from an antenna; A local line receiving the output frequency signal; It may include.

In addition, the second printed circuit board may further include a radio frequency (RF) transmission line.

The cavity may be formed facing the RF integrated circuit chip.

In addition, the high frequency signal output from the first integrated circuit may be wirelessly propagated to the RF integrated circuit or the local line after being wirelessly propagated to the RF transmission line.

In addition, the RF transmission line may be provided as a waveguide or a strip line.

In addition, the bonding layer may include a plurality of soldering balls.

According to another embodiment of the present invention, a first substrate including a first printed circuit board, a second substrate including a second printed circuit board positioned on the first substrate, and the first substrate and the A radar apparatus comprising a multi-layer substrate composed of a bonding layer for fixing a second substrate to each other, comprising: transmitting and receiving a high frequency signal based on wireless communication between the first printed circuit board and the second printed circuit board; A signal control method of a multilayer substrate may be provided.

The method may further include transmitting and receiving a high frequency signal between the first printed circuit board and the second printed circuit board based on wireless communication. The high frequency signal output from the first printed circuit board may be wirelessly transmitted to the second printed circuit board. Propagating; And wirelessly propagating a signal propagated to the second printed circuit board to the first printed circuit board.

Embodiments according to the present invention can simplify the manufacturing process of the radar device by minimizing the thickness of the multi-layered substrate included in the radar device.

In addition, it is possible to reduce noise generated in the signal transmission between the high frequency circuit portion and the general board.

In addition, by minimizing the interference caused by the radome installed to minimize the loss of radio waves, it is possible to improve the detection performance of the radar.

1 is a cross-sectional view of a lower circuit board in a multilayer circuit board included in a conventional radar device.
2 is a plan view of a lower circuit board in a multilayer circuit board included in a conventional radar device.
3 is a perspective view of a multilayer circuit board according to an embodiment.
4 is a schematic diagram illustrating a rear surface of an upper circuit board in a multilayer circuit board according to an exemplary embodiment.
5 is a side view of a multilayer circuit board according to an embodiment.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The following embodiments are presented to sufficiently convey the spirit of the present invention to those skilled in the art. The present invention is not limited to the embodiments presented herein but may be embodied in other forms. The drawings may omit illustrations of parts not related to the description in order to clarify the present invention, and may be exaggerated to some extent in order to facilitate understanding.

The vehicle radar device is mounted on the outside of the vehicle, and in general, beam formation is possible through the transmission and reception of a radio frequency (RF) signal by beam steering and directivity. Such an embodiment may be applied to, for example, an automobile radar, a camera system, and the like, but is not limited thereto.

For example, a radar device in a camera system can be used to determine the focus and exposure settings by determining the distance to the object being photographed, using a radar system with a bandwidth of approximately 2 GHz to 8 GHz. To detect objects with high accuracy and accuracy.

First, a vehicle radar device 1 including a multilayer board according to the present invention includes a case (not shown), a connector (not shown), and a printed circuit board, a bracket, a printed circuit board, a shield, And radome.

The case may accommodate a connector, an auxiliary printed circuit board, a bracket, a printed circuit board, and a shield, and the connector may transmit and receive signals between the vehicle radar device 1 and an external device. For example, the connector may perform CAN (Controller area network) communication, but is not limited thereto. The auxiliary printed circuit board may include a circuit for power and signal processing, but is not limited thereto. The bracket may block noise generated during the signal processing of the auxiliary printed circuit board.

The printed circuit board may include a plurality of antenna arrays and integrated chips (ICs) connected to the plurality of antenna arrays. The plurality of antenna arrays may include a plurality of wide-angle antennas arranged in a line, but is not limited thereto. In addition, the IC chip may be an RF IC (Radio Frequency IC), but is not limited thereto.

Specifically, FIG. 1 is a first printed circuit board 21 included in a lower circuit board in the multilayer circuit board included in the radar apparatus 1. Specifically, the first printed circuit board 21 has a circuit unit in which the transmitter 141 and the receiver 142 are mounted.

That is, the electromagnetic wave output from the transmitter 141 is radiated through a first antenna (not shown), and the electromagnetic wave reflected from the detection object is received by the receiver 142 through a second antenna (not shown).

At this time, the receiving elements of the transmitting unit 141 for controlling the transmission of electromagnetic waves and the receiving elements and the receiving unit 142 for controlling the reception of electromagnetic waves have the same height in the horizontal direction on the front side of the first printed circuit board 21. It can be mounted to have.

Accordingly, the first printed circuit board 140 may have a function of estimating a distance, a direction, a speed, and the like of an object by calculating reception information of electromagnetic waves.

In addition, FIG. 2 is a schematic diagram illustrating the signal transmission of the transmitter 141 and the receiver 142 in the first printed circuit board 140 in the conventional radar apparatus 1.

For example, (a) of FIG. 2 is an IC chip for controlling an output signal from the transmitter 141, and (b) is an IC chip included in the receiver 142 to acquire a transmission signal from a transmitter to a local line. The chip (c) is composed of an RF (Radio Frequency) chip for receiving the electromagnetic wave reflected from the detection object through the second antenna.

In particular, as shown in FIG. 2, in the related art, a wired circuit for transmitting a high frequency signal transmitted from the IC chip (a) included in the transmitter 141 to (b) and (c) of the receiver 142 ( L1 and L2).

However, when the high frequency signal is supplied to the receiver 142 through the wired circuits L1 and L2, noise is added to the signal through the wired circuits L1 and L2.

Accordingly, according to an embodiment of the present invention, as shown in FIGS. 3 to 5, the first substrate 2 included in the radar apparatus 1 included in the lower substrate and the radar apparatus 1 included in the upper substrate Noise may be reduced by transmitting and receiving a high frequency signal to the air layer from the second substrate 3 included in the N-type substrate 3.

Specifically, FIG. 3 is a perspective view of a multilayer circuit board according to an embodiment, FIG. 4 is a schematic view showing a rear surface of an upper circuit board in a multilayer circuit board according to an embodiment, and FIG. 5 is according to an embodiment. Side view of a multilayer circuit board.

First, as shown in FIG. 3, in the multilayer circuit board, the lower first substrate 2 has a first integrated circuit chip a for outputting high frequency and a local line for receiving the output high frequency signal. (Local Line) A first printed circuit board 21 including a chip (b) and a radio frequency integrated circuit chip (c) for receiving a radio signal from a receiving antenna (not shown).

In addition, as shown in FIG. 4, in the multilayer circuit board, the upper second substrate 3 includes at least one cavity, each cavity having a first integrated circuit of the first substrate 2. The chip (a), the local line chip (b) and the RF integrated circuit chip (c) facing each other.

For example, the first cavity (a ') is shown facing the first integrated circuit chip (a), the second cavity (b') is shown facing the local line chip (b) is shown The third cavity c 'is shown facing the RF integrated circuit chip c.

At this time, the cross section of the first cavity (a ') to the third cavity (c') is composed of a second printed circuit board (100 in FIG. 5), the first integrated circuit chip (a), the local line chip (b) And a high frequency signal with the RF integrated circuit chip (c).

In addition, the second printed circuit board 100 includes an RF (Radio Frequency) transmission line therein. At this time, the RF transmission line may include a waveguide structure or a strip line to facilitate the transmission of the RF signal. However, the RF transmission line is not necessarily limited to the conduit structure or the strip line, and various methods of easily transmitting the RF signal may be possible.

As shown in FIG. 4, by including the cavity, the distance (gap) between the first substrate 2 and the second substrate 3 can be reduced, thereby minimizing the thickness of the multilayer substrate required for the radar device 1. There are advantages to it.

That is, as the first integrated circuit chip a to the RF integrated circuit chip c are positioned in engagement with each other, including the first cavity a ′ to the third cavity c ′, the coupling layer (4 in FIG. 5). ) Can be thinner.

Therefore, in the radar apparatus 1 including a multilayer board | substrate like this invention, in the system which requires wide FOV (Filed OF View) by reducing the distance between a multilayer board | substrate and a radome (not shown), a radar apparatus There is an advantage that the interference from the radome of (1) can be minimized.

Next, FIG. 5 is a side view of a multilayer circuit board according to an embodiment.

The bonding layer 4 between the first substrate 2 and the second substrate 3 may support the second substrate 3 with a plurality of shoulder balls 40 on the first substrate 2.

At this time, the shoulder ball 40 may be composed of a lead (Pb) ball, but is not necessarily limited thereto.

The first substrate 2 includes a first printed circuit board 21, and the first printed circuit board 21 includes a plurality of chips 100. In this case, the first integrated circuit chip (a), the local line chip (b) and the RF integrated circuit chip (c) shown in FIG. 3 may be included.

A second printed circuit board 100 is formed on the second substrate 3 to transmit and receive radio signals with the plurality of chips a to c included in the first printed circuit board 21.

For example, a high frequency signal may be transmitted from the first integrated circuit chip (a) included in the first printed circuit board 21 to the second printed circuit board 100 through wireless communication through the RF integrated circuit chip (c). Can be.

In addition, the high frequency signal obtained by the second printed circuit board 100 is transmitted to the RF integrated circuit chip c included in the first printed circuit board 21 again through wireless communication, and further, wireless communication is performed. The signal may be transmitted to the local line chip b through wireless communication.

Therefore, as the wireless communication is performed, noise generated when the high frequency signal is transmitted from the first integrated circuit chip a to the local line chip c may be reduced.

Although one embodiment of the disclosed invention has been illustrated and described above, the disclosed invention is not limited to the specific embodiments described above, and those skilled in the art without departing from the spirit of the claims. Of course, various modifications are possible by the above, and such modifications are not individually understood from the disclosed invention.

1: radar device 2: first substrate
3: second substrate 21: first printed circuit board
100: second printed circuit board 11: a plurality of chips
4: bonding layer 40: shoulder ball

Claims (10)

In the radar device,
A first substrate comprising a first printed circuit board;
A second substrate including a second printed circuit board positioned on the first substrate;
A bonding layer fixing the first substrate and the second substrate to each other; Including,
Transmitting and receiving high frequency signals by wireless communication between the first printed circuit board and the second printed circuit board,
The second substrate has a cavity formed on a surface facing the first substrate, and the second printed circuit board is located in the cavity.
delete The method of claim 1,
The first printed circuit board is
A first integrated circuit chip for outputting high frequency;
An RF integrated circuit chip for receiving a radio signal from an antenna; And
A local line receiving the output frequency signal; Multilayer substrate comprising a. The method of claim 3, wherein
The second printed circuit board further comprises a radio frequency (RF) transmission line. The method of claim 4, wherein
And the cavity is formed facing the RF integrated circuit chip. The method of claim 5, wherein
And a high frequency signal output from the first integrated circuit is wirelessly propagated to the RF integrated circuit or the local line after being wirelessly propagated to the RF transmission line. The method of claim 4, wherein
The RF transmission line is provided with a waveguide or a strip line (Strip Line). The method according to any one of claims 1 and 3 to 7,
The bonding layer includes a plurality of soldering balls. A first substrate including a first printed circuit board, a second substrate including a second printed circuit board positioned on a cavity formed on a surface facing the first substrate on the first substrate, and the A radar apparatus comprising a multi-layer substrate composed of a bonding layer for fixing a first substrate and a second substrate to each other,
And transmitting and receiving a high frequency signal based on wireless communication between the first printed circuit board and the second printed circuit board. The method of claim 9,
Transmitting and receiving a high frequency signal based on wireless communication between the first printed circuit board and the second printed circuit board;
Radio wave propagating from the first printed circuit board to the second printed circuit board; And
And wirelessly propagating a signal propagated to the second printed circuit board to the first printed circuit board.

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