KR102060652B1 - Display Panel and Display Apparatus - Google Patents

Abstract

The present invention relates to a display panel and a display device including the same.
The display apparatus according to the present invention includes a display panel and a flexible substrate attached to a side of the display panel, wherein the display panel includes an electrode line and a switching element. First Substrate disposed, Second Substrate disposed opposite the first substrate, Seal Part bonding the first substrate and the second substrate, Vertical Direction A side surface including a pad electrode disposed at a position overlapping with the seal portion, a pad electrode electrically connected to the electrode line, and connected to one end surface of the pad electrode, and positioned at a side surface of the seal portion; Including an electrode (Side Electrode), the flexible substrate may be electrically connected to the side electrode.

Description

Display panel and display device including the same {Display Panel and Display Apparatus}

The present invention relates to a display panel and a display device including the same.

As the information society develops, the demand for display devices is increasing in various forms, and in recent years, liquid crystal display devices (LCDs), plasma display panels (PDPs), electro luminescent displays (ELDs), and vacuum fluorescents (VFDs) have been developed. Various display devices such as displays have been researched and used. Among them, the liquid crystal panel of the LCD includes a TFT substrate and a color filter substrate facing each other with the liquid crystal layer and the liquid crystal layer interposed therebetween, and can display an image using light provided from the backlight unit.

It is an object of the present invention to provide a display panel having a reduced size of a bezel area and a display device including the same.

The display apparatus according to the present invention includes a display panel and a flexible substrate attached to a side of the display panel, wherein the display panel includes an electrode line and a switching element. First Substrate Arranged, Second Substrate Arranged Against The First Substrate, Seal Part Bonding The First Substrate And The Second Substrate, Vertical Direction A side surface including a pad electrode disposed at a position overlapping with the seal portion, a pad electrode electrically connected to the electrode line, and connected to one end surface of the pad electrode, and positioned at a side surface of the seal portion; Including an electrode (Side Electrode), the flexible substrate may be electrically connected to the side electrode.

The flexible substrate may include a base layer having a ductility, an electrode disposed on the base layer, and a cover layer including a portion covering the electrode, wherein the base layer and the cover layer At least one may include a black material, and the electrode may include a portion electrically connected to the side electrode.

In addition, the width of the flexible substrate in a horizontal direction may be greater than the distance between adjacent flexible substrates.

In addition, the flexible substrate may include at least one of a portion attached to the side of the first substrate, a portion attached to the side of the seal portion, and a portion attached to the side of the second substrate.

In addition, the flexible substrate may include a portion extending from the front surface of the second substrate.

The substrate may further include a resin layer covering at least a portion of the flexible substrate and a portion of the second substrate and extending in a horizontal direction.

In addition, the resin layer may include a first portion positioned on the side of the display panel and a second portion positioned in front of the display panel.

The display device may further include a film type filter attached to the front surface of the second substrate, and the second part may contact the film type filter.

The electrode line may include a gate line and a data line that cross each other, and the pad electrode is electrically connected to the gate pad electrode and the data line, which are electrically connected to the gate line. A data pad electrode, wherein the side electrode includes a gate side electrode connected to one end surface of the gate pad electrode and a data side electrode connected to one end surface of the data pad electrode, and the flexible substrate includes the gate. The gate flexible substrate may be electrically connected to the side electrodes, and the data flexible substrate may be electrically connected to the data side electrodes.

The gate pad electrode, the gate side electrode, and the gate flexible substrate may be disposed on a short side of the first substrate, and the data pad electrode, the data side electrode, and the data flexible substrate may be disposed on the first substrate. It may be located on the long side.

The display panel and the display apparatus including the display panel according to the present invention have an effect of reducing the size of the bezel area by exposing side surfaces of the pad electrodes and forming side electrodes on the side surfaces of the pad electrodes. .

1 is a view for schematically explaining a configuration of a display panel according to the present invention;
2 to 32 are views for explaining the manufacturing method and structure of the display panel;
33 to 62 are views for explaining a configuration in which a flexible substrate is connected to a side of a display panel;
63 to 74 are views for explaining another configuration of the display device; And
75 is a view for explaining an example of an electronic apparatus to which the display device according to the present invention is applied.

Hereinafter, a display panel and a display apparatus including the same according to the present invention will be described in detail with reference to the accompanying drawings.

As the invention allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the written description. It is not intended to limit the invention to the specific embodiments, it can be understood to include all changes, equivalents, and substitutes included in the spirit and scope of the present invention.

In describing the present invention, terms such as first and second may be used to describe various components, but the components may not be limited by the terms. The terms may be used only for the purpose of distinguishing one component from another component. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

The term and / or may include a combination of a plurality of related items or any item of a plurality of related items.

When a component is referred to as being "connected" or "connected" to another component, it may be directly connected or connected to that other component, but other components may be present in between. Can be understood. On the other hand, when a component is said to be "directly connected" or "directly connected" to another component, it may be understood that there is no other component in between.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions may include plural expressions unless the context clearly indicates otherwise.

In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described in the specification, and one or more other features. It may be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or a combination thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, may have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries may be interpreted to have meanings consistent with the meanings in the context of the related art, and shall be interpreted in ideal or excessively formal meanings unless expressly defined in the present application. It may not be.

In addition, the following embodiments are provided to more fully describe those skilled in the art, and the shape and size of elements in the drawings may be exaggerated for clarity.

1 is a diagram schematically illustrating a configuration of a display panel according to the present invention. Although the liquid crystal display panel is described as an example of the display panel in FIG. 1, the display panel may be an organic light emitting panel (OLED panel) in the present invention.

Referring to FIG. 1, the display panel 10 according to the present invention may include a first substrate 100 and a second substrate 110 disposed to face each other. In addition, although not shown, a liquid crystal layer may be disposed between the first substrate 100 and the second substrate 110.

Electrode lines EL may be disposed on the first substrate 100. Here, the electrode line EL may include a gate line GL and a data line DL that cross each other.

The electrode line EL may be referred to as electrode wiring.

The gate line GL may extend in a second direction DR2, and the data line DL may extend in a third direction DR3 crossing the second direction DR2.

A switching element T may be disposed in a portion where the gate line GL and the data line DL cross each other in the first substrate 100. In addition, a pixel electrode P electrically connected to the switching element T may be disposed on the first substrate 100.

The switching element T may be implemented in the form of a thin film transistor TFT.

In addition, the switching device T in the first substrate 100 may be arranged in a matrix form.

The gate line GL and the data line DL may be electrically connected to the switching element T, respectively.

Such a first substrate 100 may be referred to as an array substrate.

A color filter 111 may be disposed on the second substrate 110. The color filter 111 may include at least R (Red), G (Green), and B (Blue) regions.

Although not illustrated, a black matrix layer may be formed on the second substrate 110 to separate pixel regions.

Although not illustrated, another electrode, for example, a common electrode may be disposed on the second substrate 110.

Such a second substrate 110 can be referred to as a color filter substrate.

2 to 32 are views for explaining a manufacturing method and a structure of a display panel. Hereinafter, the description of the above-described parts may be omitted.

Referring to FIG. 2A, the first substrate 100 and the second substrate 110 on which the electrode line EL and the switching element T are formed may be bonded using a seal part 120. .

The seal part 120 may be formed at an edge of at least one of the first substrate 100 and the second substrate 110.

Thereafter, as in the case of FIG. 2B, the liquid crystal layer 130 may be injected into a region between the first substrate 100 and the second substrate 110 bonded by the seal part 120.

Thereafter, as shown in FIG. 3A, the edge of the display panel may be cut along the cutting line CL.

In this cutting process, a part of the first substrate 100, the second substrate 110, and the seal part 120 may be cut.

Accordingly, after the cutting process, the ends of the first substrate 100, the second substrate 110, and the seal part 120 may be aligned in a straight line as in the case of FIG. 3B.

As such, when the edge of the display panel is cut and removed, the size of the bezel area may be reduced.

It is possible to change the cut portion according to the structure of the electrode line EL disposed on the first substrate 100 in the display panel.

For example, as in the case of FIG. 4A, the first long side of the first substrate 100 and the second substrate 110 in a state where the first substrate 100 and the second substrate 110 are bonded together. The first long side (LS1) area is cut along the second cutting line CL2, and the second short side (SS2) areas of the first substrate 100 and the second substrate 110 are first cut. It is possible to cut along the line CL1.

In this case, although not shown, a pad electrode may be disposed in the first long side LS1 and the second short side SS2 of the first substrate 100 and the second substrate 110.

Alternatively, as in the case of FIG. 4B, the first long side LS1 of the first substrate 100 and the second substrate 110 in a state where the first substrate 100 and the second substrate 110 are bonded together. ) Is cut along the second cutting line CL2, and the second long side (LS2) areas of the first substrate 100 and the second substrate 110 are cut along the fourth cutting line CL4. After cutting, the first short side (SS1) regions of the first substrate 100 and the second substrate 110 are cut along the third cutting line CL3, and the first substrate 100 and the second substrate are cut. It is possible to cut the second short side SS2 region of the substrate 110 along the first cutting line CL1.

In this case, although not shown, the first long side LS1, the second long side LS2, the first short side SS1, and the second short side SS2 of the first substrate 100 and the second substrate 110 are provided. Pad electrodes may be disposed on the pad electrodes.

After cutting the edge of the display panel, as shown in FIG. 5A, the side surface of the cut display panel may be ground using a grinder 200.

Then, as in the case of FIG. 5B, the side surface of the display panel may be smoothly processed. Accordingly, structural stability of at least one of the first substrate 100 and the second substrate 110 may be improved.

Referring to FIG. 6, a pad electrode ELP may be disposed at an edge of the first substrate 100. In addition, the pad electrode ELP may be electrically connected to the electrode line EL.

For example, the data pad electrode DLP electrically connected to the data line DL is disposed in the second long side LS2 of the first substrate 100, and the second short side ( A gate pad electrode GLP electrically connected to the gate line GL may be disposed in the SS2 region.

The pad electrode ELP may be located at at least one end of the electrode line EL.

The pad electrode ELP may be integrated with the electrode line EL. Alternatively, after the pad electrode ELP is formed separately from the electrode line EL, it may be possible to electrically connect the pad electrode ELP and the electrode line EL.

The seal unit 120 may be formed at a position overlapping the pad electrode ELP, that is, the gate pad electrode GLP and the data pad electrode DLP. In other words, the gate pad electrode GLP and the data pad electrode DLP overlap each other with the seal 120 in a vertical direction crossing the second direction DR2 and the third direction DR3. Can be arranged.

In the following, the vertical direction may be referred to as a first direction DR1. In addition, the second direction DR2 and the third direction DR3 may be collectively referred to as a horizontal direction.

In addition, an area in which the seal part 120 is formed may be referred to as a dummy area (DA). The area surrounded by the dummy area DA can be referred to as an active area AA. The effective area AA may be referred to as an area where an image is displayed.

The width of the pad electrode ELP may be larger than the width of the electrode line EL.

For example, as in the case of FIGS. 7A and 7B, the width W1 of the gate pad electrode GLP is greater than the width W2 of the gate line GL and the data pad electrode DLP. The width W3 may be larger than the width W4 of the data line DL.

In this case, it is possible to easily electrically connect the gate pad electrode GLP and the data pad electrode DLP to a flexible substrate (not shown).

Hereinafter, a description will be given on the assumption that the width of the pad electrode ELP is larger than the width of the electrode line EL. However, the width of the pad electrode ELP and the width of the electrode line EL may be substantially the same. .

Meanwhile, an insulating layer for insulating the electrode line EL may be further disposed on the first substrate 100.

For example, as in the case of FIG. 8A, the data line DL and the data pad electrode DLP are formed on the first substrate 100, and then, as in the case of FIG. 8B. The first insulating layer 140A may be formed on the first substrate 100 to cover the data line DL and the data pad electrode DLP.

Thereafter, as in the case of FIG. 9A, a gate line GL and a gate pad electrode GLP may be formed on the first substrate 100 on which the first insulating layer 140A is formed. For example, the gate line GL may be formed on the first insulating layer 140A, and the gate pad electrode GLP may be formed on the first substrate 100.

Thereafter, as in the case of FIG. 9B, the second insulating layer 140B covers the first insulating layer 140A, the gate line GL, and the gate pad electrode GLP on the first substrate 100. Can be formed.

In this case, an insulating layer, that is, the second insulating layer 140B may be positioned between the gate line GL and the data line DL. Accordingly, the gate line GL and the data line DL may be electrically insulated.

When the gate line GL and the gate pad electrode GLP are formed in the same manner as in FIG. 9, at least a part of the gate line GL is positioned on a different layer from the gate pad electrode GLP, or the gate pad electrode GLP. At least a portion of) may be located on a layer different from the gate line GL.

Although not shown, a step of forming the switching element T between the step of forming the data line DL (FIG. 8A) and the step of forming the gate line GL (FIG. 9A). Can be added.

Hereinafter, the first insulating layer 140A and the second insulating layer 140B will be referred to collectively as the insulating layer 140. In the present invention, the structure of the insulating layer 140 may not be limited thereto. For example, the insulating layer 140 may be formed in a three-layer structure or a four-layer structure.

A portion of the gate pad electrode GLP and the data pad electrode DLP is exposed to the first substrate 100 and the second substrate 110 to be exposed to side surfaces of the gate pad electrode GLP and the data pad electrode DLP in the cutting process. And it is possible to cut together with the seal portion 120.

As described above with reference to FIG. 6, the data pad electrode DLP is disposed on the second long side LS2 of the first substrate 100, and the gate pad electrode is disposed on the second short side SS2 of the first substrate 100. Suppose that GLP is deployed.

Under this assumption, as in the case of FIG. 10A, when the second long side LS2 of the display panel 10 is cut, the side of the data pad electrode DLP is cut as in the case of FIG. 10B. The first substrate 100 may be exposed between the insulating layer 140. In other words, one end surface of the data pad electrode DLP may be exposed between the first substrate 100 and the insulating layer 140.

In addition, as in the case of FIG. 11A, when the second short side SS2 of the display panel 10 is cut, the side of the gate pad electrode GLP is formed as in the case of FIG. 11B. 1 may be exposed between the substrate 100 and the insulating layer 140. In other words, one end surface of the gate pad electrode GLP may be exposed between the first substrate 100 and the insulating layer 140.

9 to 10, one end of the pad electrode ELP may be positioned in line with the end of the seal part 120. In other words, one end of the pad electrode ELP may coincide with the end of the seal part 120.

Thereafter, as shown in FIG. 12, a side electrode 150 may be formed on the side of the cut display panel 10. In the following drawings, for convenience of description, the electrode line EL and the pad electrode ELP are described as being formed on the same layer, but the electrode line EL and the pad electrode ELP are formed on different layers. It is also possible. This has been described above with reference to FIG. 9.

The side electrode 150 may be connected to the exposed side surface (end surface) of the pad electrode ELP in the cutting process.

The side electrode 150 may include not only a portion connected to the pad electrode ELP but also a portion positioned on the side of the seal portion 120. In this case, it is possible to increase the area of the side electrode 150 to facilitate the electrical connection between the flexible substrate and the side electrode 150 (not shown).

In addition, the side electrode 150 may include a portion located on the side of the first substrate 100.

The side electrode 150 is longer than the first substrate 100, the second substrate 110, and the seal portion 120 by a predetermined length D1 in the horizontal direction (second direction DR2 or third direction DR3). It may include an extended portion. In other words, the side electrode 150 is larger than the first substrate 100, the second substrate 110 and the seal 120 in the horizontal direction (the second direction DR2 and / or the third direction DR3). It may include extending.

The side electrode 150 may be preferably sufficiently high in electrical conductivity to more effectively supply a driving signal supplied through a flexible substrate (not shown) to the pad electrode ELP and the electrode line EL.

In addition, since the side electrode 150 is formed to be connected to at least one end surface of the pad electrode ELP after the electrode line EL and the pad electrode ELP are formed, the side electrode 150 and the pad electrode ELP. There is a possibility that the electrical resistance increases at the interface between

In order to compensate for the loss due to the electrical resistance at the interface between the side electrode 150 and the pad electrode ELP, the electrical conductivity of the side electrode 150 is greater than the electrical conductivity of the pad electrode ELP and the electrode line EL. Higher ones may be desirable.

In other words, the side electrode 150 may include a material having an electrical conductivity greater than that of the electrode line EL and the pad electrode ELP.

For example, assuming that the electrode line EL and the pad electrode ELP are formed of copper (Cu) material, the side electrode 150 may be formed of aluminum (Al), silver (Ag), gold (Au), or the like. It is possible to be formed of a material.

As such, the material of the electrode line EL and the pad electrode ELP may be different from that of the side electrode 150.

When the electrical resistance at the interface between the side electrode 150 and the pad electrode ELP is negligibly low, the electrical conductivity of the side electrode 150 may be approximately equal to that of the pad electrode ELP. In this case, the material of the electrode line EL and the pad electrode ELP may be the same as that of the side electrode 150.

The side electrode 150 may be manufactured in various ways. A method of manufacturing the side electrode 150 will be described in detail below.

As illustrated in FIG. 13, an electrode material layer 300 may be formed on the side of the display panel 10. This electrode material layer 300 may comprise a photosensitive material.

Thereafter, as in the case of FIG. 14A, a photo mask 310 in which a predetermined pattern is formed is disposed on the electrode material layer 300, and light such as ultraviolet rays is applied to the photo mast 310. The electrode material layer 300 may be irradiated through the formed pattern.

Then, a portion of the electrode material layer 300 exposed to light by the photosensitive material may be cured.

Subsequently, through a process such as etching or sand blast, a hardened portion of the electrode material layer 300 remains, and a portion that is not hardened is removed, as in the case of FIG. 14B. Side electrodes 150 may be formed on side surfaces of the display panel 10.

The process described above can be regarded as an example of the photo process. The side electrode 150 manufactured through the photo process may have a shape as shown in FIG. 15.

It is also possible to manufacture the side electrode 150 using an offset method different from the photo process. This is described below. The offset method is an example of a direct patterning printing method.

Referring to FIG. 16A, an electrode material 410 in a paste state or a slurry state may be applied to a surface of a mold 400.

Thereafter, as shown in FIG. 16B, the blanket 420 may be moved on the surface of the mold 400 to which the electrode material 410 is applied. The electrode material 410 may then be buried on the surface of the blanket 420.

The blanket 420 may be preferably in the form of a roller in order to more effectively bury the electrode material 410. As such, when the blanket 420 is in the form of a roller, the electrode material 410 may be buried while the blanket 420 is rotated on the surface of the mold 400.

Thereafter, as shown in FIG. 16C, the electrode material 410 buried on the surface of the blanket 420 is moved while moving the blanket 420 embedded with the electrode material 410 from the side of the cut display panel 10. May be printed on the side of the display panel 10.

Subsequently, when the firing or drying process is performed, the side electrode 150 may be formed on the side of the display panel 10.

An example of the side electrode 150 manufactured in this manner is shown in FIG. 17.

It is also possible to manufacture the side electrode 150 using a plating process different from the photo process and the offset process. The plating method may include an electrolytic plating method and an electroless plating method. Looking at the method of forming the side electrode 150 by the electroplating method of the plating method as follows.

As shown in FIG. 18A, the display panel 10 having the edge cut to expose the pad electrode ELP may be deepened in the electrolyte solution 510. In addition, the metal electrode 520 may be deepened in the electrolyte solution 510.

In this state, when a predetermined voltage is applied to the electrode line EL or the pad electrode ELP and the metal electrode 520, the metal contained in the electrolytic solution 510, as shown in FIG. As the component 530 is deposited on the exposed side of the pad electrode ELP, the side electrode 150 may be formed.

For example, when + voltage is applied to the metal electrode 520 and − voltage is applied to the pad electrode ELP or the electrode line EL, the metal component 530 included in the electrolyte solution 510 is padded. It may be collected on the side of the electrode ELP and precipitated.

An example of the side electrode 150 formed according to this method is disclosed in FIGS. 19A and 19B.

Here, the metal component 530 may include a material having excellent electrical conductivity, for example, silver (Ag) material. In this case, the side electrode 150 may also be formed of silver (Ag) material.

In addition, the particle size of the metal component 530 may be approximately several nanometers for effective precipitation. In addition, the electrolyte solution 510 may be a silver-acet (Ag-Aceate) aqueous solution. In addition, the concentration of the electrolyte solution 510 may be about 0.1 wt% or more.

Alternatively, the electrolytic solution 510 may be contained in a predetermined container 500, and a voltage may be applied to the container 500. In such a case, it is possible not to use the metal electrode 520.

Looking at the method of forming the side electrode 150 by the electroless plating method of the plating method as follows.

As shown in FIG. 20A, the edge of the display panel 10 whose edges are cut to expose the pad electrode ELP may be deepened in the H 2 SO 4 aqueous solution. Then, the oxide film formed on the exposed surface of the pad electrode ELP can be removed.

If the pad electrode ELP is made of a material that is not easily oxidized, the step of FIG. 20A may be omitted.

If the pad electrode ELP is formed of a material such as copper (Cu) having a relatively high probability of oxidizing, the copper (Cu) material is oxidized on the exposed side of the pad electrode ELP to form a copper oxide film. Relatively likely. Therefore, as shown in FIG. 20A, it may be desirable to perform the step of removing the oxide film from the exposed side of the pad electrode ELP.

Afterwards, as shown in FIG. 20B, the pad electrode ELP is deeping in the palladium (Pd) aqueous solution for forming a seed in the state in which the oxide film is removed from the side of the pad electrode ELP. can do.

In this case, the palladium (Pd) material contained in the palladium (Pd) aqueous solution may be attached to the side of the pad electrode ELP to form the seed 540 as shown in FIG. In this case, the seed 540 may be made of palladium (Pd) material.

Here, although only the case of forming the seed 540 using palladium (Pd) is described, it may be possible to form the seed 540 using another metallic material.

Thereafter, as shown in FIG. 21A, in the state where the seed 540 is formed on the side surface of the pad electrode ELP, the side surface of the pad electrode ELP may be deepened in the electrolyte solution 550. Here, the electrolyte solution 550 may include a metal material for forming the side electrode 150. For example, the electrolytic solution 550 may be a silver-acetic (Ag-Aceate) aqueous solution.

As such, when the side of the pad electrode ELP is deepened in the electrolyte solution 550 while the seed 540 is formed on the side of the pad electrode ELP, the metal material included in the electrolyte solution 550 is the seed 540. ) And the pad electrode ELP may grow to the side electrode 150 as shown in FIG. 21B.

Here, the seed 540 may reduce the time required for the manufacturing process of the side electrode 150 by improving the electrode growth rate.

Referring to FIG. 21B, the seed 540 may be located between the side surface of the pad electrode ELP and the side electrode 150.

For example, the seed 540 may be made of palladium (Pd) material, the side electrode 150 may be made of silver (Ag), and the pad electrode ELP may be made of copper (Cu). Can be. In this case, a seed 540 including a material different from that of the side electrode 150 and / or the pad electrode ELP may be formed between the side electrode 150 and the pad electrode ELP.

The structure and shape of the side electrode 150 formed according to this method may be similar to those of FIGS. 19A and 19B.

Referring to FIG. 22, a protection electrode 150C may be formed on a surface of the pad electrode ELP. In detail, the side electrode 150 may include a base electrode 150B and a protective electrode 150C coated on a surface of the base electrode 150B.

Here, the base electrode 150B may be located at one end of the pad electrode ELP. That is, the base electrode 150B may be connected to one end surface of the pad electrode ELP.

In the horizontal direction (second direction DR2 or third direction DR3), the thickness D3 of the protection electrode 150C may be smaller than the thickness D2 of the base electrode 150B.

The protection electrode 150C may include a material in which oxidation is relatively less than that of the pad electrode ELP and / or the base electrode 150B. That is, the protective electrode 150C can prevent the base electrode 150B from oxidizing. For example, the protective electrode 150C may include a nickel (Ni) or gold (Au) material.

Such a protection electrode 150C can also be formed by a plating method.

For example, after the base electrode 150B is formed on the side surface of the pad electrode ELP in the same manner as in FIGS. 20 to 21, the protective electrode 150C is formed on the surface of the base electrode 150B. It is possible to form in the same manner as in FIG.

In this case, as shown in FIG. 23, another seed 560 may be formed between the base electrode 150B and the protection electrode 150C. The material of another seed 560 formed between the base electrode 150B and the protection electrode 150C is the same as that of the seed 540 formed between the pad electrode ELP and the base electrode 150B. It is possible.

On the other hand, in order to effectively electrically connect the flexible substrate (not shown) and the side electrode 150, it may be desirable to widen the area of the side electrode 150 sufficiently.

Preferably, as in the case of FIG. 24, the side electrode 150 may include a portion positioned on the side of the first substrate 100 and a portion positioned on the side of the second substrate 110.

In this case, the width D4 of the side electrode 150 in the vertical direction (first direction DR1) is in the horizontal direction (second direction DR2 or third direction DR3) of the pad electrode ELP. It may be greater than the width (D10) of. Alternatively, the width D4 of the side electrode 150 in the vertical direction (first direction DR1) is in the horizontal direction (second direction DR2 or third direction DR3) of the side electrode 150. It may be larger than the width D5.

In addition, the width D4 of the side electrode 150 in the vertical direction (first direction DR1) may be greater than the distance D6 between adjacent side electrodes 150.

In addition, the distance D8 between the side electrode 150 and the end of the first substrate 100 in the vertical direction DR1 may be smaller than the distance D6 between the adjacent side electrodes 150. Alternatively, the distance D7 between the side electrode 150 and the end of the second substrate 110 in the vertical direction DR1 may be smaller than the distance D6 between the adjacent side electrodes 150.

When the pad electrode ELP is formed on the first substrate 100, the distance D8 between the side electrode 150 and the end of the first substrate 100 in the vertical direction DR1 is formed on the side surface in the vertical direction DR1. It may be smaller than the distance D7 between the electrode 150 and the end of the second substrate 110.

On the other hand, in order to sufficiently lower the electrical resistance in the boundary area between the pad electrode ELP and the side electrode 150, it may be desirable to sufficiently widen the area of the cross section of the pad electrode ELP. For example, as in the case of FIG. 25, the width D10 of the pad electrode ELP in the horizontal direction (the second direction DR2 or the third direction DR3) is equal to the distance between the adjacent pad electrodes ELP. It is possible to be larger than D11).

The side electrode 150 may include a gate side electrode 150G connected to one end surface of the gate pad electrode GLP and a data side electrode 150D connected to one end surface of the data pad electrode DLP. Can be.

For example, as shown in FIGS. 26A and 26B, in the second long side LS2 region of the display panel 10, the data side electrode of the side electrode 150 is disposed on the side of the display panel 10. 150D may be disposed. The data side electrode 150D may be connected to the data pad electrode DLP.

Here, since the data pad electrode DLP is formed on the first substrate 100, the distance D13 between the data side electrode 150D and the end of the first substrate 100 is vertical in the vertical direction DR1. DR1 may be smaller than the distance D12 between the data side electrode 150D and the end of the second substrate 110.

Alternatively, according to the manufacturing method, the distance D13 between the data side electrode 150D and the end of the first substrate 100 in the vertical direction DR1 is the data side electrode 150D and the second substrate in the vertical direction DR1. It may also be possible to be approximately equal to the spacing D12 between the ends of 110.

As shown in FIGS. 27A and 27B, in the second short side SS2 of the display panel 10, a gate side electrode 150G of the side electrodes 150 is formed on the side surface of the display panel 10. Can be arranged. The gate side electrode 150G may be connected to the gate pad electrode GLP.

Here, since the gate pad electrode GLP is formed on the first substrate 100, the distance D15 between the gate side electrode 150G and the end of the first substrate 100 is vertical in the vertical direction DR1. DR1 may be smaller than the distance D14 between the gate side electrode 150G and the end of the second substrate 110.

Alternatively, according to the manufacturing method, the distance D15 between the gate side electrode 150G and the end of the first substrate 100 in the vertical direction DR1 is equal to the gate side electrode 150G and the second substrate in the vertical direction DR1. It may also be possible to be approximately equal to the spacing D14 between the ends of 110.

Referring to FIG. 28, the width H2 of the side electrode 150 in the vertical direction DR1 is increased in the horizontal direction DR2 or DR3 in order to increase the contact area between the side electrode 150 and the flexible substrate (not shown). It may be desirable to be larger than the width H1 of 150.

Referring to FIG. 29, the data side electrode 150D is disposed on the second long side LS2 of the display panel 10, and the first side of the gate side electrode 150G is disposed on the first short side SS1 of the display panel 10. The gate side electrode 150G1 may be disposed, and the second gate side electrode 150G2 of the gate side electrode 150G may be disposed on the second short side SS2 of the display panel 10.

In this case, the gate pad electrode GLP may be formed on the first short side SS1 and the second short side SS2 of the first substrate 100, respectively. For example, as in the case of FIG. 30, an odd-numbered gate pad electrode GLP of the plurality of gate pad electrodes GLP, for example, a first gate pad electrode, may be formed on the second short side SS2 of the first substrate 100. GLP1)... The n-th gate pad electrode GLPn-1 may be positioned. In addition, an even-numbered gate pad electrode GLP of the plurality of gate pad electrodes GLP, for example, a second gate pad electrode GLP2, is formed on the first short side SS1 of the first substrate 100. The n gate pad electrode GLPn may be positioned. Here, n may mean an even number among natural numbers.

In addition, in order to expose one end surface of the gate pad electrode GLP at the first short side SS1 and the second short side SS2 of the display panel 10, the first short side SS1 of the first substrate 100 may be exposed. ) May be cut along the eleventh cutting line CL11, and the second short side SS2 of the first substrate 100 may be cut along the tenth cutting line CL10.

As described above, when the gate pad electrode GLP is disposed on the first short side SS1 and the second short side SS2 of the first substrate 100, it is preferable to widen the cross-sectional area of the gate pad electrode GLP sufficiently. It is possible.

Referring to FIG. 31, the first data side electrode 150D1 of the data side electrode 150D is disposed on the first long side LS1 of the display panel 10, and the second long side LS2 of the display panel 10 is disposed on the first long side LS1 of the display panel 10. The second data side electrode 150D2 of the data side electrode 150D is disposed, and the first gate side electrode 150G1 of the gate side electrode 150G is disposed on the first short side SS1 of the display panel 10. The second gate side electrode 150G2 of the gate side electrode 150G may be disposed on the second short side SS2 of the display panel 10.

In this case, the gate pad electrode GLP is formed at each of the first short side SS1 and the second short side SS2 of the first substrate 100, and the first long side LS1 of the first substrate 100 is formed. It is possible to form the data pad electrodes DLP on the second long side LS2, respectively. For example, as in the case of FIG. 32, an odd-numbered data pad electrode DLP of the plurality of data pad electrodes DLP, for example, a first data pad electrode, may be formed on the first long side LS1 of the first substrate 100. GLP1)... The n-th data pad electrode DLPn-1 may be positioned. In addition, the second long side LS2 of the first substrate 100 has an even-numbered data pad electrode DLP among the plurality of data pad electrodes DLP, for example, a second data pad electrode DLP2. The n data pad electrode DLPn may be located.

In addition, in order to expose one end surface of the data pad electrode DLP at the first long side LS1 and the second long side LS2 of the display panel 10, the first long side LS1 of the first substrate 100 may be exposed. ) May be cut along the twelfth cutting line CL11, and the second long side LS2 of the first substrate 100 may be cut along the thirteenth cutting line CL13.

As described above, when the data pad electrode DLP is disposed on the first long side LS1 and the second long side LS2 of the first substrate 100, it is preferable to widen the cross-sectional area of the data pad electrode DLP sufficiently. It is possible.

33 to 62 are views for explaining a configuration in which the flexible substrate is connected to the side of the display panel. In the following description of the parts described in detail above may be omitted.

Referring to FIG. 33, the display apparatus 2000 according to the present invention may include a display panel 10 and a flexible substrate 600 attached to a side surface of the display panel 10. The structure of the display panel 10 has been described in detail above. The flexible substrate 600 may include a tape carrier package (TCP), a flexible printed circuit (FPC), a chip on film (COF), or the like.

Although not illustrated, the flexible substrate 600 may electrically connect the driver and the pad electrode ELP to supply a driving signal. To this end, the flexible substrate 600 may be electrically connected to the side electrode 150 formed on the side of the display panel 10. To this end, the flexible substrate 600 may include a connection electrode 620.

As in the case of FIG. 34A, the flexible substrate 600 includes a first connection area CA1 corresponding to the side electrode 150, a second connection area CA2 corresponding to a driving unit (not shown), and a first substrate. Located between the first connection area CA1 and the second connection area CA2 may be bent into an intermediate area MA in which the transmission line 650 is formed.

The connection electrode 620 for electrical connection with the side electrode 150 may be disposed in the first connection area CA1.

An electrode 640 may be disposed in the second connection area CA2 for electrical connection with a driver (not shown).

IC which performs a predetermined switching operation in the middle area MA or supplies a predetermined driving signal to the display panel 10 in response to a predetermined control signal supplied from a driver (not shown). The unit 650 may be disposed. Here, the IC unit 630 may be omitted.

The transmission line 650 formed in the intermediate area MA may electrically connect the connection electrode 620 formed in the first connection area CA1 and the electrode 640 formed in the second connection area CA2. .

In the flexible substrate 600, the electrode 640 formed in the connection electrode 620, the transmission line 650, and the second connection area CA2 may be collectively referred to as an electrode.

Referring to the cross-section of the flexible substrate 600, as in the case of FIG. 34B, the flexible substrate 600 is a flexible base layer 610 and an electrode 620 disposed on the base layer 610. The cover layer 660 may include a portion covering the electrodes 640, 650, and the electrodes 620, 640, 650 and may be flexible. Here, the electrodes 620, 640, and 650 may include a portion connected to the side electrode 150, that is, a connection electrode 620. The base layer 610 and the cover layer 660 may each include a resin material that is flexible so that the flexible substrate 600 may be bent.

Here, the case where the electrodes 620, 640, and 650 have a single layer structure in the flexible substrate 600 will be described as an example, but the present invention may not be limited thereto. For example, in the flexible substrate 600, the electrodes 620, 640, and 650 may have a multi-layer structure.

At least one of the base layer 610 and the cover layer 660 of the flexible substrate 600 may include a black material. In this case, the flexible substrate 600 may appear black. Therefore, even if the flexible substrate 600 is exposed, the visual field of the seer may be prevented from being disturbed by the flexible substrate 600.

The flexible substrate 600 and the side electrode 150 may be connected in various ways. This is described below.

Referring to FIG. 35, a metal layer 700 may be disposed between the side electrode 150 and the connection electrode 620 of the flexible substrate 600. The metal layer 700 may electrically connect the side electrode 150 and the connection electrode 620 of the flexible substrate 600.

The metal layer 700 may be made of an organometallic complex.

The manufacturing method of the metal layer 700 is demonstrated below.

After forming the side electrode 150 on the side of the display panel 10 after the cutting process as shown in FIG. 36, the organic metal layer 701 is coated by applying an organic material including a metal material on the side electrode 150. Can be formed. Alternatively, the organic metal layer 701 may be formed by laminating a sheet of an organic material including a metal material on the side surface of the display panel 10.

Here, the organic metal layer 701 may be formed of an organometallic complex.

The organometallic compound is a material including a chemical bond between metal and carbon, and may be formed by substantially dispersing a nanomaterial metal material in an organic material.

Here, the metal that can be applied to the organometallic compound may be a material having high electrical conductivity, such as silver (Ag), gold (Au), palladium (Pd), and the like.

In addition, the organometallic compound may include a material such as an organic solvent and a binder in addition to the metal material.

Examples of organometallic compounds applicable to the present invention include metal compounds including metal alkoxides, metal acetates and metal acid compounds, ethylene glycol, propanediol and derivatives thereof, butanediol and derivatives thereof, pentanediol and its Diols containing derivatives and hexanol are mixed or reacted in a constant molar ratio, and solid and liquid organic metals prepared by using trimethyl phosphate (TMP), triethyl phosphate (TEP) and triphenyl phosphate (TPP) as additives Compound.

The organometallic layer 701 as shown in FIG. 36 may be formed using the above organometallic compound. The organic metal layer 701 may cover the side electrode 150 at the side of the display panel 10.

Thereafter, the flexible substrate 600 may be disposed on the organic metal layer 701, and pressure may be applied to the flexible substrate 600 at a predetermined temperature.

Here, when the ambient temperature rises above the critical temperature, the chemical bond between the metal material and the carbon is broken in the organic metal compound forming the organic metal layer 701, and the metal material is connected between the side electrode 150 and the flexible substrate 600. The metal layer 700 may be formed between the electrodes 620.

In the present invention, after forming the organic metal layer 701 including the metal material 702 on the side of the display panel 10 as shown in Figure 37 (A), approximately 5 seconds ~ at a temperature of approximately 120 ℃ ~ 300 ℃ It may be desirable to apply pressure to the flexible substrate 600 disposed above the organic metal layer 701 for about 2 minutes. More preferably, it may be desirable to apply pressure to the flexible substrate 600 disposed on the upper portion of the organic metal layer 701 at a temperature of about 180 ° C. for about 5 seconds to about 30 seconds. In this case, the organic solvent included in the organic metal layer 701 is evaporated, and nano-sized metal materials are sufficiently gathered between the connecting electrode 620 and the side electrode 150 of the flexible substrate 600 to form the metal layer 700. Can be formed.

A material such as epoxy, acryl, or the like remains around the metal layer 700, and the organic layer 703 can be formed as shown in FIG. 37B. That is, the organic layer 703 may include an acrylic material and / or an epoxy material. Since the organic layer 703 has adhesiveness, the flexible substrate 600 may be firmly attached to the side of the display panel 10. In addition, the organic layer 703 may include a portion of the metal material 702 included in the organic metal layer 701 that is not included in the metal layer 700.

As described above, when an organic metal compound is used to electrically connect the side electrode 150 and the connection electrode 620 of the flexible substrate 600, the connection electrode of the side electrode 150 and the flexible substrate 600 ( The metal layer 700 may be formed between the 620 to effectively connect the connection electrode 620 and the side electrode 150 of the flexible substrate 600 to each other, as well as the organic layer around the metal layer 700. By forming the 703, the flexible substrate 600 may be firmly attached to the side of the display panel 10.

Referring to FIG. 38, the side electrode 150 may be in direct contact with the connection electrode 620 of the flexible substrate 600. For example, at a junction surface of the connecting electrode 620 of the flexible substrate 600 and the side electrode 150 of the display panel 10, at least one of the connecting electrode 620 and the side electrode 150 is melted to connect the connecting electrode. 620 and the side electrode 150 may be bonded.

As such, it may be possible to use ultrasonic waves to connect the side electrodes 150 and the connection electrodes 620 of the flexible substrate 600 to be in direct contact.

Referring to FIG. 39, the flexible substrate 600 including the connection electrode 620 may be positioned on the side of the display panel 10 on which the side electrodes 150 are formed. In addition, the ultrasonic wave head 800 may radiate ultrasonic waves to the connection portions of the connection electrode 620 and the side electrode 150.

Then, the side electrode 150 and / or the connection electrode 620 are melted by the frictional force between the side electrode 150 and the connection electrode 620, so that the side electrode 150 and the connection electrode are formed as shown in FIG. 38. 620 may be electrically connected.

As such, when using the ultrasonic bonding method of bonding the connection electrode 620 and the side electrode 150 by ultrasonic waves, the side electrode 150 and / or the connection electrode 620 are melted and directly connected. As a result, the bonding force between the side electrode 150 and the connection electrode 620 may be improved.

In addition, it may be desirable to perform an ultrasonic bonding process at a relatively high temperature in order to facilitate bonding of the side electrode 150 and the connection electrode 620. Preferably, the bonding electrode 620 and the side electrode 150 may be ultrasonically bonded at a temperature of about 130 ° C to 150 ° C.

Referring to FIG. 40, an adhesive layer 900 including a plurality of conductive particles 901 is disposed between the connecting electrode 620 and the side electrode 150 of the flexible substrate 600, whereby the conductive particles 901 are formed. The connection electrode 620 and the side electrode 150 of the flexible substrate 600 may be electrically connected to each other.

The adhesive layer 900 may be an anisotropic conductive adhesive or an anisotropic conductive adhesive sheet.

In this case, the adhesive layer 900 including the conductive particles 901 is disposed between the connecting electrode 620 and the side electrode 150 of the flexible substrate 600, and is disposed for about 8 to 15 seconds at a temperature of at least 180 ° C. A pressure of approximately 2-4 Pa may be applied to the flexible substrate 600 to electrically connect the connection electrode 620 and the side electrode 150 of the flexible substrate 600.

The pad electrode ELP and the connection electrode 620 of the flexible substrate 600 may correspond one-to-one. For example, as shown in FIG. 41, the first connection electrode 620a of the connection electrode 620 formed on the flexible substrate 600 is the first electrode line EL1 and the first pad electrode of the display panel 10. The second connection electrode 620b may correspond to the second electrode line EL2 and the second pad electrode ELP2 of the display panel 10.

In this case, the driving signal supplied to the first electrode line EL1 is supplied through the first connection electrode 620a, and the driving signal supplied to the second electrode line EL2 is supplied through the second connection electrode 620b. Can be supplied.

In addition, each flexible substrate 620 may correspond to the plurality of electrode lines EL.

For example, as shown in FIG. 42, the first flexible substrate 600-1 corresponds to the first data line group DLG1 including the plurality of data lines DL, and the second flexible substrate 600-. 2) may correspond to a second data line group DLG2 including a plurality of data lines DL. Here, although the data line DL is demonstrated as an example among the electrode lines EL, the following content is also applicable to the gate line GL.

In FIG. 42, the first data line group DLG1 may correspond to the first data pad electrode group DLPG1, and the second data line group DLG2 may correspond to the second data pad electrode group DLPG2.

In order to connect the data line group DLG to the flexible substrate 600, a traveling direction of at least one data line DL included in the data line group DLG may be changed in the dummy area DA. For example, it is possible to change the advancing direction of the data line DL such that the distance between adjacent data lines DL in the first data line group DLG1 becomes smaller.

The region where the traveling direction of the electrode line EL is changed can be referred to as a dummy region DA or a bezel region.

Referring to FIG. 43, a plurality of flexible substrates 600-1 to 600-4 may be attached to side surfaces of the display panel 10.

Here, the width S1 of the flexible substrate 600 in the horizontal direction DR2 or DR3 may be larger than the distance S2 between the adjacent flexible substrates 620.

As such, when the distance S2 between the flexible substrates 620 adjacent to each other in the horizontal direction DR2 or DR3 is made relatively small, the size of the region where the traveling direction of the electrode line EL is changed can be reduced. Therefore, the size of the bezel area can be further reduced.

Referring to FIG. 44, the width of the data line group DLG in a direction crossing (vertical) the data line EL may be larger than the width of the corresponding data pad electrode group DLPG. For example, the width S3 of the first data line group DLG1 in a direction crossing (vertical) to the data line EL is greater than the width S4 of the first data pad electrode group DLPG1 corresponding thereto. Can be large.

In addition, the width of the data pad electrode group DLPG may be larger than the interval S5 between the adjacent data pad electrode groups DLPG. For example, the width S4 of the first data pad electrode group DLPG1 in the direction crossing (vertical) with the data line DL is equal to the first data pad electrode group DLPG1 and the second data pad electrode group DLPG2. It is possible to be larger than the interval S5 between). Here, the interval S5 between the first data pad electrode group DLPG1 and the second data pad electrode group DLPG2 is the second data pad electrode group among the data pad electrodes DLP of the first data pad electrode group DLPG1. The a + 1 data pad that is closest to the first data pad electrode group DLPG1 among the a data pad electrode DLPa that is closest to the DLPG2 and the data pad electrode DLP of the second data pad electrode group DLPG2. It can be seen as the interval between the electrodes DLPa + 1.

On the other hand, the width S6 of the portion where the advancing direction of the data line DL is changed in the direction parallel to the data line DL, for example, the width of the dummy region, is greater than the distance S5 between adjacent data pad electrode groups DLPG. Small is possible. In this case, the size of the bezel area can be further reduced.

Referring to FIG. 45, it is possible to position the electrode line EL and the pad electrode ELP in a straight line without changing the traveling direction of the electrode line EL. In this case, it is possible to further reduce the size of the bezel area.

The flexible substrate 600 may include a gate flexible substrate 600G electrically connected to the gate side electrode 150G and a data flexible substrate 600D electrically connected to the data side electrode 150D.

For example, as shown in FIG. 46, the gate side electrode 150G may be disposed on the second short side SS2 of the display panel 10, and the gate flexible substrate 600G may be connected to the gate side electrode 150G. have. In addition, the data side electrode 150D may be disposed on the second long side LS2 of the display panel 10, and the data flexible substrate 600D may be connected to the data side electrode 150D.

As shown in FIG. 47, the data side electrode 150D is disposed on the second long side LS2 of the display panel 10, and one of the gate side electrodes 150G is disposed on the first short side SS1 of the display panel 10. Assume that the first gate side electrode 150G1 is disposed and the second gate side electrode 150G2 of the gate side electrode 150G is disposed on the second short side SS2 of the display panel 10.

In this case, the first gate flexible substrate 600G1 may be connected to the first gate side electrode 150G1, and the second gate flexible substrate 600G2 may be connected to the second gate side electrode 150G2.

As shown in FIG. 48, the first data side electrode 150D1 of the data side electrodes 150D is disposed on the first long side LS1 of the display panel 10, and the second long side LS2 of the display panel 10 is disposed. The second data side electrode 150D2 of the data side electrode 150D is disposed, and the first gate side electrode 150G1 of the gate side electrode 150G is disposed on the first short side SS1 of the display panel 10. Suppose that the second gate side electrode 150G2 of the gate side electrode 150G is disposed on the second short side SS2 of the display panel 10.

In this case, the first data flexible substrate 600D1 may be connected to the first data side electrode 150D1, and the second data flexible substrate 600D2 may be connected to the second data side electrode 150D2.

Meanwhile, each flexible substrate 600 may be connected to the plurality of side electrodes 150. Accordingly, the flexible substrate 600 may be attached to the side surface of the display panel 10 in an area between the adjacent side electrodes 150.

For example, as shown in FIG. 49, when the flexible substrate 600 is connected to the side electrode 150, the cross section A1-A2 of the portion passing through the side electrode 150 in the vertical direction DR1 is shown. As shown in FIG. 50, the side electrode 150 may be connected to the connection electrode 620 of the flexible substrate 600.

In this case, the first adhesive layer 1000 may be disposed between the first substrate 100 and the flexible substrate 600 in order to improve adhesion between the flexible substrate 600 and the display panel 10.

Alternatively, as shown in FIG. 51, in order to improve adhesion between the flexible substrate 600 and the display panel 10, a second adhesive layer 1010 is added between the second substrate 110 and the flexible substrate 600. It is possible to place more as.

Alternatively, in FIG. 49, when the flexible substrate 600 is connected to the side electrode 150, the cross section B1-B2 of the portion passing through the region between the adjacent side electrodes 150 in the vertical direction DR1 is illustrated. As shown in FIG. 52, the flexible substrate 600 may be attached to at least one of the first substrate 100, the second substrate 110, the seal 120, and the pad electrode ELP of the display panel 10. have. To this end, the third adhesive layer 1020 may be disposed between the side of the display panel 10 and the flexible substrate 600. The third adhesive layer 1020 may include a portion positioned on the side of the first substrate 100, the second substrate 110, the seal portion 120, and / or the pad electrode ELP.

As such, it is possible to further use an adhesive layer or an adhesive sheet to attach the flexible substrate 600 to the side of the display panel 10.

For example, as shown in FIG. 53, in the state in which the side electrode 150 is formed on the side of the display panel 10, the adhesive sheet 1100 having the holes 1110 to expose the side electrode 150 is formed. May be attached to the side of the display panel 10.

The adhesive sheet 1100 may include first, second, and third adhesive layers 100, 1010, and 1020.

Unlike the case of FIGS. 36 to 37, when the flexible substrate 600 is connected to the side electrode 150 using an organometallic compound, an organic layer 703 having adhesiveness is additionally formed. It is possible not to use the adhesive sheet 1100.

In addition, as in the case of FIG. 40, even when the adhesive layer 900 including the conductive particles 901 is used, the adhesive sheet 1100 may not be used.

On the other hand, in order to lower the electrical resistance between the connecting electrode 620 and the side electrode 150 of the flexible substrate 600, it may be desirable to make the area of the connecting electrode as wide as possible.

For example, as in the case of FIG. 54B, the width S9 of the connection electrode 620 in the vertical direction DR1 is a predetermined length greater than the width S10 of the seal portion 120 in the vertical direction DR1. It may be as large as (S11).

In this case, the contact area between the side electrode 150 and the connection electrode 620 may be increased.

Referring to FIG. 55, the flexible substrate 600 in the vertical direction DR1 may include a portion extending further by a predetermined length R1 than the front surface of the second substrate 110. In this case, it is possible to lengthen the length of the flexible substrate 600 sufficiently.

Meanwhile, in order to more firmly connect the flexible substrate 600 to the display panel 10, it is possible to form a resin layer on the side of the display panel 10.

For example, as shown in FIG. 56, the resin layer 1200 covering at least a portion of the flexible substrate 600 may be formed at the edge of the display panel 10 to extend in the horizontal direction DR2 or DR3.

The resin layer 1200 may cover a part of the second substrate 110 and / or a part of the seal part 120.

The resin layer 1200 may include a photosensitive material.

In addition, the resin layer 1200 may include a black dye so that the flexible substrate 600 is not visible.

Referring to FIGS. 57 and 58, the resin layer 1200 may include a portion located on the front surface FS of the second substrate 110. In other words, the resin layer 1200 may include a first portion 1210 positioned at the side of the display panel 10 and a second portion 1220 positioned at the front of the display panel 10.

Here, the first portion 1210 of the resin layer 1200 may cover at least a portion of the flexible substrate 600.

As such, when the resin layer 1200 includes the second portion 1220 positioned in front of the display panel 10, the flexible substrate 600 includes a portion extending further than the front surface of the display panel 10. In this case, the resin layer 1200 may cover the ends of the flexible substrate 600, thereby improving structural stability.

Referring to FIG. 59, a film type filter 1300 may be attached to the front surface of the second substrate 110 of the display panel 10.

The film type filter 1300 may be a polarization filter or a stereoscopic (3D) filter.

The second portion 1220 of the resin layer 1200 may contact the film type filter 1300.

The resin layer 1200 may be formed to surround the edge of the display panel 10.

As shown in FIG. 60, it is assumed that the gate side electrode 150G is formed in the second short side SS2 region of the display panel 10 and the gate flexible substrate 600G is connected to the gate side electrode 150G. Let's see.

In this case, at the second short side SS2 of the display panel 10, the first resin layer 1200A covers at least a portion of the gate flexible substrate 600G, and at the first short side SS1 of the display panel 10. The second resin layer 1200B may be formed to cover a portion of the second substrate 110.

Referring to FIG. 61, the film type filter 1300 attached to the front surface of the second substrate 110 may extend to the side of the display panel 10. In this case, the film type filter 1300 may cover a part of the flexible substrate 600.

As such, when the film type filter 1300 extends to the side surface of the display panel 10, the resin layer 1200 may be formed to cover the ends of the film type filter 1300 and a part of the flexible substrate 600. have.

63 to 74 are diagrams for describing still another configuration of the display apparatus. In the following, the description of the above-described parts may be omitted. Hereinafter, a description will be given of a liquid crystal display apparatus including a liquid crystal display panel as an example, but the present invention may not be limited thereto. For example, the backlight unit 11 may be omitted in the following configuration.

Referring to FIG. 63, the display apparatus 2000 includes a back light unit 11 and a cover including a display panel 10, an optical layer 11A, and a light source part 11B. , 12).

The display panel 10 displaying an image has been described in detail above.

The optical layer 11A may be disposed between the display panel 10 and the cover 12.

The optical layer 11A may be composed of a plurality of sheets. For example, although not illustrated, the optical layer 11A may include at least one of a prism sheet and a diffusion sheet.

In addition, the light source unit 11B of the backlight unit 11 may be disposed behind the optical layer 11A. In addition, the backlight unit may include a light guide plate (not shown).

Various types of light sources may be applied to the light source 11B. For example, the light source may be one of a light emitting diode (LED) chip or a light emitting diode package having at least one light emitting diode chip. In this case, the light source may be a colored LED or a white LED emitting at least one of colors such as red, blue, green, and the like.

The backlight unit 11 may be a direct type backlight unit or an edge type backlight unit.

It may be possible that the cover 12 is disposed behind the backlight unit 11.

The cover 12 may at least protect the backlight unit 11 from impact and pressure applied from the outside.

Referring to FIG. 64, a bracket 1500 may be disposed on the rear surface of the first substrate 100 of the display panel 10.

The bracket 1500 may be attached to the first substrate 100 by an adhesive layer 1510.

The backlight unit 11 including the optical layer 11A and the light source unit 11B may be disposed on the bracket 1500.

The frame 1520 may be disposed behind the backlight unit 11.

The driving unit 1530 may be disposed in the frame 1520. The driving unit 1530 may be referred to as a driving board.

The flexible substrate 600 may electrically connect the side electrode 150 formed on the side of the display panel 10 and the driver 1530.

Referring to FIG. 65, the cover 12 may include a rear portion 12A positioned at the rear of the display panel and a side portion 12B positioned at the side of the display panel 10. That is, the cover 12 may cover the rear and side surfaces of the display panel 10.

Here, the rear portion 12A and the side portion 12B may be integrally formed.

As such, at least one edge of the front surface FS of the display panel 10 may be exposed while the cover 12 is disposed behind the display panel 10.

Here, at least one edge of the front surface FS of the display panel 10 is exposed to the viewer when the viewer looks at the display panel 10 from the front of the display apparatus 2000 (for example, the first point P1). It may mean that the edge of the front surface FS of the display panel 10 can be observed.

In this case, a visual effect of a larger screen of the display device may be obtained.

Referring to FIG. 66, the cover 12 may be physically divided into the side portion 12B and the rear portion 12A.

In this case, the rear portion 12A and the side portion 12B of the cover 12 may be fastened by fastening means S100 such as a screw.

The cover 12 may be connected to the frame 1520. For example, as shown in FIG. 67, the rear portion 12A of the cover 12 and the frame 1520 may be fastened by a predetermined fastening means S200.

Referring to FIG. 68, the flexible substrate 600 may be exposed in an area between the side portion 12B of the cover 12 and the display panel 10. For example, when the viewer looks at the area between the side portion 12B of the cover 12 and the display panel 10 in front of the display device 2000, the viewer may observe the flexible substrate 600.

As described above, when the base layer and / or the cover layer of the flexible substrate 600 includes a black material, the flexible substrate (in the region between the side portion 12B of the cover 12 and the display panel 10) Even if 600) is exposed, it may not interfere with the observer's field of view.

As in the case of FIG. 69, when the resin layer 1200 is formed at the edge of the display panel 10, the resin layer 1200 may have the side surface portion 12B of the cover 12 and the side surface of the display panel 10. It may include a portion located between.

The area between the side portion 12B of the cover 12 and the side surface of the display panel 10 may be covered by the resin layer 1200. In this case, the resin layer 1200 may further include a black material as a dye.

Alternatively, as shown in FIG. 70, a buffer layer 1600 having elasticity may be disposed between the side portion 12B of the cover 12 and the side surface of the display panel 10.

The buffer layer 1600 may be made of a material having elasticity such as a sponge.

The buffer layer 1600 may prevent the side of the display panel 10 from colliding with the side portion 12B of the cover 12, and the side portion 12B of the side of the display panel 10 and the cover 12. It is possible to prevent foreign substances such as dust from flowing in between them.

The buffer layer 1600 may also have a substantially black color.

The buffer layer 1600 may be attached to the side portion 12B of the cover 12. To this end, an adhesive layer 1610 may be disposed between the side portion 12B of the cover 120 and the buffer layer 1600.

Referring to FIG. 71, the side surface portion 12B of the cover 12 is higher by a predetermined height X1 than the front surface FS of the display panel 10, that is, the front surface of the second substrate 110 in the vertical direction DR1. It may include a protruding portion. In this case, the side portion 12B of the cover 12 may effectively protect the side surface of the display panel 10.

72 to 73, the display apparatus 2000 according to the present invention may further include a bottom cover 13. The lower cover 13 may be connected to the cover 12.

Referring to FIG. 73, the side portion 12B of the cover 12 corresponds to the first long side LS1, the first short side SS1, and the second short side SS2 of the display panel 10, and the lower cover 13. ) May be disposed on the second long side LS2 corresponding to the first long side LS1 of the display panel 10.

Accordingly, the side portion 12B of the cover 12 faces the side of the display panel 10 in the first long side LS1, the first short side SS1, and the second short side SS2 of the display panel 10. The lower cover 13 may cover the side surface of the display panel 10 in the second long side LS2 area of the display panel 10.

In addition, front edges of the first long side LS1, the second long side LS2, the first short side SS1, and the second short side SS2 of the display panel 10 may be exposed.

As such, the front edges of the first long side LS1, the second long side LS2, the first short side SS1, and the second short side SS2 of the display panel 10 may be exposed, respectively. This is because the flexible substrate 600 is attached to the side of the display panel 10.

For example, as in FIG. 74, the data side electrode 150D is disposed on the second long side LS2 of the display panel 10, and the gate side electrode is disposed on the first short side SS1 of the display panel 10. Assume that the first gate side electrode 150G1 is disposed in 150G and the second gate side electrode 150G2 is disposed in the second short side SS2 of the display panel 10. lets do it.

In this case, the first gate flexible substrate 600G1 may be connected to the first gate side electrode 150G1, and the second gate flexible substrate 600G2 may be connected to the second gate side electrode 150G2.

In addition, the data flexible substrate 600 may be disposed between the side surface of the display panel 10 and the lower cover 13 in the second long side LS2 area of the display panel 10.

In addition, the first gate flexible substrate 600G1 may be disposed between the side surface of the display panel 10 and the side portion 12B of the cover 12 in the first short side SS1 of the display panel 10. .

In addition, the second gate flexible substrate 600G2 may be disposed between the side surface of the display panel 10 and the side portion 12B of the cover 12 in the second short side SS2 area of the display panel 10. .

In this case, at least a first long side LS1, a first short side SS1, and a second short side SS2 of the display panel 10 may be cut. Accordingly, edges of the front surface of the display panel 10 may be exposed at the first long side LS1, the second long side LS2, the first short side SS1, and the second short side SS2 of the display panel 10, respectively. It can be.

75 is a view for explaining an example of an electronic apparatus to which the display device according to the present invention is applied. In the following, description of the parts described above in detail will be omitted. In addition, hereinafter, a case of a broadcasting signal receiver as an electronic device to which the display device according to the present invention is applied will be described. The display device according to the present invention can be applied to other electronic devices such as a mobile phone.

In addition, hereinafter, the display unit 10 may correspond to the display panel and the display apparatus described above with reference to FIGS. 1 to 74.

Referring to FIG. 75, the broadcast signal receiver 100Q according to the present invention includes a broadcast receiver 105Q, an external device interface unit 135Q, a storage unit 140Q, a user input interface unit 150Q, a controller 170Q, The display unit 10 may include an audio output unit 185Q, a power supply unit 190Q, and a photographing unit (not shown). The broadcast receiver 105Q may include a tuner 110Q, a demodulator 120Q, and a network interface unit 130Q.

If necessary, the tuner 110Q and the demodulator 120Q may be provided and the network interface 130Q may not be included. On the contrary, the tuner 110Q and the demodulator are provided while the network interface 130Q is provided. It is also possible to design not to include 120Q.

The tuner 110Q selects an RF broadcast signal corresponding to a channel selected by a user or all pre-stored channels among RF radio broadcast signals received through an antenna. In addition, the selected RF broadcast signal is converted into an intermediate frequency signal or a baseband video or audio signal.

The demodulator 120Q receives the digital IF signal DIF converted by the tuner 110Q and performs a demodulation operation.

The stream signal output from the demodulator 120Q may be input to the controller 170Q. After performing demultiplexing, image / audio signal processing, and the like, the controller 170Q outputs an image to the display unit 10 and outputs audio to the audio output unit 185Q.

The external device interface unit 135Q may connect the external device to the broadcast signal receiver 100Q. To this end, the external device interface unit 135Q may include an A / V input / output unit (not shown) or a wireless communication unit (not shown).

The network interface unit 130Q provides an interface for connecting the broadcast signal receiver 100Q to a wired / wireless network including an internet network.

The network interface unit 130Q may correspond to the wireless communication unit described above in detail.

The storage unit 140Q may store a program for processing and controlling each signal in the controller 170Q, or may store a signal-processed video, audio, or data signal.

The user input interface unit 150Q transmits a signal input by the user to the controller 170Q, or transmits a signal from the controller 170Q to the user.

For example, the user input interface unit 150Q may be configured to power on / off, select a channel, or display a screen from the remote controller 200Q according to various communication methods such as a radio frequency (RF) communication method and an infrared (IR) communication method. A control signal such as a setting may be received and processed, or a control signal from the controller 170Q may be transmitted to the remote controller 200Q.

In addition, for example, the user input interface unit 150Q may transmit a control signal input from a local key (not shown) such as a power key, a channel key, a volume key, and a set value to the controller 170Q.

The controller 170Q demultiplexes the input stream or processes the demultiplexed signals through the tuner 110Q, the demodulator 120Q, or the external device interface 135Q, and outputs a video or audio signal. You can create and output.

The image signal processed by the controller 170Q may be input to the display unit 10 and displayed as an image corresponding to the image signal. In addition, the image signal processed by the controller 170Q may be input to the external output device through the external device interface unit 135.

The audio signal processed by the controller 170Q may be audio output to the audio output unit 185Q. In addition, the voice signal processed by the controller 170Q may be input to the external output device through the external device interface unit 135Q.

In addition, the controller 170Q may control overall operations of the broadcast signal receiver 100Q. For example, the controller 170Q may control the tuner 110Q to control selecting of an RF broadcast corresponding to a channel selected by a user or a previously stored channel.

In addition, the controller 170Q may control the broadcast signal receiver 100Q by a user command or an internal program input through the user input interface unit 150Q.

The display unit 10 converts an image signal, a data signal, an OSD signal processed by the controller 170Q, or an image signal, data signal, etc. received from the external device interface unit 135Q into R, G, and B signals, respectively. Generate a drive signal.

The audio output unit 185Q receives a signal processed by the controller 170Q, for example, a stereo signal, a 3.1 channel signal, or a 5.1 channel signal, and outputs a voice signal.

The power supply unit 190Q supplies the corresponding power throughout the broadcast signal receiver 100Q.

The remote control apparatus 200Q transmits a user input to the user input interface unit 150Q. To this end, the remote control device 200 may use Bluetooth, RF (Radio Frequency) communication, infrared (IR) communication, UWB (Ultra Wideband), ZigBee (ZigBee) method and the like.

In addition, the remote control apparatus 200Q may receive an image, an audio or a data signal output from the user input interface unit 150Q, display it on the remote control apparatus 200Q, or output audio or vibration.

Meanwhile, the broadcast signal receiver 100Q may not include the tuner 110Q and the demodulator 120Q, and may receive and reproduce image content through the network interface 130Q or the external device interface 135Q. have.

As such, the technical configuration of the present invention described above can be understood by those skilled in the art that the present invention can be implemented in other specific forms without changing the technical spirit or essential features of the present invention.

Therefore, the exemplary embodiments described above are to be understood as illustrative and not restrictive in all respects, and the scope of the present invention is indicated by the appended claims rather than the foregoing detailed description, and the meaning and scope of the claims are as follows. And all changes or modifications derived from the equivalent concept should be interpreted as being included in the scope of the present invention.

Claims (10)

Display Panel; And
Flexible substrate attached to the side of the display panel (Flexible Substrate);
Including,
The display panel
A first substrate on which an electrode line and a switching element are disposed;
A second substrate disposed opposite the first substrate;
A seal part bonding the first substrate and the second substrate to each other;
A pad electrode disposed at a position overlapping with the seal part in a vertical direction and electrically connected to the electrode line; And
A side electrode connected to one end surface of the pad electrode, the side electrode including a portion positioned on a side of the seal part;
Including,
The flexible substrate is electrically connected to the side electrode, and the flexible substrate is
A flexible base layer;
An electrode disposed on the base layer;
A cover layer including a portion covering the electrode;
Including,
At least one of the base layer and the cover layer includes a black material,
The electrode includes a portion electrically connected to the side electrode.
delete The method of claim 1,
And a width of the flexible substrate in a horizontal direction is greater than a distance between adjacent flexible substrates. The method of claim 1,
The flexible substrate includes at least one of a portion attached to the side of the first substrate, a portion attached to the side of the seal portion, and a portion attached to the side of the second substrate. The method of claim 1,
The flexible substrate may include a portion extending from a front surface of the second substrate. The method of claim 1,
And a resin layer covering at least a portion of the flexible substrate and a portion of the second substrate and extending in a horizontal direction. The method of claim 6,
The resin layer is
A first portion positioned at a side of the display panel; And
A second portion positioned in front of the display panel;
Display device comprising a. The method of claim 7, wherein
Further comprising a film type filter (Film Type Filter) attached to the front of the second substrate,
The second portion is in contact with the film type filter (Contact). The method of claim 1,
The electrode line includes a gate line and a data line that cross each other.
The pad electrode is
A gate pad electrode electrically connected to the gate line; And
A data pad electrode electrically connected to the data line;
Including,
The side electrode is
A gate side electrode connected to one end surface of the gate pad electrode; And
A data side electrode connected to one end surface of the data pad electrode;
Including,
The flexible substrate is
A gate flexible substrate electrically connected to the gate side electrodes; And
A data flexible substrate electrically connected to the data side electrodes;
Display device comprising a. The method of claim 9,
The gate pad electrode, the gate side electrode, and the gate flexible substrate are located at a short side of the first substrate.
The data pad electrode, the data side electrode, and the data flexible substrate are positioned on a long side of the first substrate.

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