KR102059086B1 - Chip stacking apparatus and manufacturing system for flooring - Google Patents

Abstract

The present invention provides a chip stacking device and a flooring manufacturing system having the same.
The chip stacking device is provided with a hopper member having a storage space for storing chips stacked on a surface of a plate-shaped base portion, and provided under the hopper member to receive the chips falling from the hopper member. The plate-shaped guide plate member and the chip placed adjacent to the guide plate member to receive the chip, rotate in one direction, have a hollow cylindrical shape, and have the chip supplied from the guide plate member to have a predetermined pattern. And a screen roll member laminated on the substrate portion, wherein the screen roll member sucks the chip supplied from the guide plate member, attaches the chip to a region of a predetermined pattern, and the chip is adjacent to the substrate portion. The suction of the chip is released, and the chip is laminated on the base portion.

Description

Chip stacking device and flooring manufacturing system having same {CHIP STACKING APPARATUS AND MANUFACTURING SYSTEM FOR FLOORING}

The present invention relates to a chip laminating apparatus and a flooring manufacturing system having the same, and more particularly, to a chip laminating apparatus and a flooring manufacturing system having the same by implementing a preset pattern on the flooring as it is to enhance the decorative design of the flooring.

In general, the flooring used in the living space is manufactured to have a pattern using a chip to minimize deformation even if the surface of the product is worn.

In particular, flooring materials, which are widely used in places of transportation such as railroads, ships, vehicles, etc., and where there are many walks, such as medical facilities and amusement facilities, are more likely to be decorated with scattered colored decorative chips or slipped by particles of inorganic materials. Is preventing.

When a pattern is formed on the flooring material to give decorativeness, the flooring material is manufactured by using chips scattered on the surface of the flooring material to manufacture the flooring material that matches the desired design.

However, according to the conventional chip spreading method, the chip is not uniformly distributed on the flooring material, and a problem occurs in some areas, such as chipping or chip overlap, which makes it difficult to implement a design that matches the designed pattern shape. have.

Therefore, there is a need for an apparatus capable of accurately stacking chips in the shape of a desired pattern.

The present invention has been made to solve the above-described problems, and since the preset pattern can be implemented as it is in the flooring, an object of the present invention is to provide a chip stacking device and a flooring manufacturing system having the same to increase the decorative design of the flooring.

In order to achieve the above object, the chip stacking apparatus according to the present invention is provided with a hopper member having a storage space for storing chips stacked on a surface of a plate-shaped base portion, and a lower portion of the hopper member. A plate-shaped guide plate member receiving the chip falling from the member, and positioned adjacent to the guide plate member to receive the chip, rotated in one direction, formed in a hollow cylindrical shape, and supplied from the guide plate member. And a screen roll member for laminating the received chip to the base part to have a pattern, wherein the screen roll member sucks the chip supplied from the guide plate member, attaches the chip to a patterned area, and the chip. Adjacent to this base portion releases suction of the chip and causes the chip to fall on the base portion.

In addition, the flooring manufacturing system according to the present invention includes a guide portion for guiding the plate-shaped substrate portion to proceed in one direction, and a chip stacking device installed on the substrate portion to laminate chips. The chip stacking apparatus includes a hopper member having a storage space for storing chips stacked on a surface of a plate-shaped base portion, and a lower portion of the hopper member to receive the chips falling from the hopper member. The plate-shaped guide plate member and the chip is placed adjacent to the guide plate member is supplied, rotated in one direction, formed in a hollow cylindrical shape, the chip supplied from the guide plate member to have a pattern And a screen roll member laminated on the portion, wherein the screen roll member sucks a chip supplied from the guide plate member, attaches the chip to a patterned area, and If the chip is adjacent to the base portion, the suction of the chip is released, and the chip falls to the base portion.

By using the chip stacking apparatus and the flooring manufacturing system having the same according to the present invention, the pattern preset by the screen roll member can be implemented in the flooring as it is, thereby improving the decorative design of the flooring.

1 is a perspective view showing a flooring manufacturing system and chip stacking apparatus according to an embodiment of the present invention.
2 is a partially enlarged perspective view illustrating an enlarged screen roll member of FIG. 1;
Figure 3 is a cross-sectional view showing a flooring manufacturing system and chip stacking apparatus according to an embodiment of the present invention.
Figure 4 is a perspective view showing an example of a chip supply control panel applied to the present invention.
5 is a partially enlarged cross-sectional view of the screen roll member according to the present invention.
6 is a cross-sectional view of a flooring material in which a colored chip and a non-slip chip are stacked with a pattern according to the present invention;
Figure 7 is a cross-sectional view of the flooring stacked colored chips having a pattern according to the present invention.
8 is a cross-sectional view of a flooring material in which a non-slip chip is stacked with a pattern according to the present invention.
9 is a cross-sectional view of a flooring material in which colored chips and a non-slip chip are stacked amorphously, and then colored chips are stacked with a pattern according to the present invention.

Hereinafter, preferred embodiments of the present invention according to the accompanying drawings will be described in detail.

First, the embodiments described below are embodiments suitable for understanding the technical features of the present invention, the chip stacking device and the flooring manufacturing system having the same. However, the technical features of the present invention are not limited by the embodiments described or applied to the embodiments described below, and various modifications are possible within the technical scope of the present invention.

1 and 3, the chip stacking apparatus 100 according to an embodiment of the present invention includes a hopper member 200, a guide plate member 300, and a screen roll member 400.

The hopper member 200 is provided with a storage space for storing the chips C stacked on the surface of the plate-shaped base portion 20 therein. Here, the hopper member 200 may be formed of a metal plate, but is not limited thereto. Here, the base material part 20 can comprise the flooring material 20, and it demonstrates with the same code | symbol for convenience of description.

The guide plate member 300 is provided under the hopper member 200, is supplied with the chip C falling from the hopper member 200, and is formed in a plate shape.

In detail, the guide plate member 300 may serve to transfer and supply the chip C flowing down from the hopper member 200 to the screen roll member 400. The guide plate member 300 may include a dam at a widthwise edge of the guide plate member 300 so as to maintain an appropriate width of the chip C to be supplied.

Here, the guide plate member 300 may be provided to be inclined downward at a predetermined angle from one end adjacent to the hopper member 200 toward the other end adjacent to the screen roll member 400. That is, the guide plate member 300 is inclined downward in the direction of the screen roll member 400 so that the chip C supplied from the hopper member 200 flows smoothly in the direction of the screen roll member 400. About 1 degree or more and 10 degrees or less).

In addition, the chip stacking apparatus 100 according to the present invention may further include a chip supply control panel 600. Chip supply control panel 600 is attached to the hopper member 200 to adjust the amount of the chip (C) stored in the storage space supplied to the guide plate member 300, the hopper member 200 and the guide plate member 300 ) May be provided at a position to be connected.

Here, the chip supply control panel 600, as shown in the embodiment shown in Figure 4 is divided into a plurality in the width direction of the guide plate member 300, can be coupled to the hopper member 200 by the coupling member 610. have. At this time, each chip supply control panel 600 may have a different height coupled to the hopper member. That is, the chip ball supply control panel 600 or the hopper member 200 may be provided with a slot formed long in the vertical direction, the height is different depending on the position where the coupling member is coupled to the slot. Accordingly, the amount of chips supplied from the hopper member 200 to the guide plate member 300 may be adjusted differently for each divided section of the width direction of the guide plate member.

In addition, the chip stacking apparatus 100 according to the present invention may further include a vibration member 500. The vibrating member 500 may vibrate the hopper member 200 and the guide plate member 300 to move the chip C.

Specifically, the vibrating member 500 may vibrate the hopper member 200 to cause the chip C to flow from the hopper member 200 to the lower guide plate member 300. The vibrating member 500 may vibrate the guide plate member 300 so that the chip C of the guide plate member 300 flows down to the screen roll member 400. Here, the vibration member 500 is not limited in kind and frequency, and various embodiments may be applied if the chip is moved by applying vibration to the hopper member 200 and the guide plate member 300.

The screen roll member 400 is positioned adjacent to the guide plate member 300 to receive the chip C, rotate in one direction (see B direction in FIG. 1), and have a hollow cylindrical shape. The chip C supplied from the 300 is laminated on the substrate portion 20 to have a predetermined pattern.

Here, the screen roll member 400 sucks the chip C supplied from the guide plate member 300 (see D direction in FIG. 5), attaches the chip C to a region of a predetermined pattern, and the chip. If (C) is adjacent to the substrate portion 20, suction can be released and the chip C can be stacked on the substrate portion 20 (see E direction in FIG. 5).

Specifically, the screen roll member 400 is attached to the chip (C) of the guide plate member 300 by the suction force on the surface, so as to display a predetermined pattern and the chip (C) is attached only to the region of the displayed pattern. (See FIG. 2). In addition, the suction force may be maintained when the screen roll member 400 rotates.

Thereafter, the screen roll member 400 may release the suction when the attached chip C is adjacent to the base portion 20 so that the chip C falls to the base portion 20 by its own weight. (See E direction in FIG. 5). In this case, the screen roll member 400 may release the suction force in the state in which the chip C is located closest to the base portion 20, and release the suction force and at the same time, the chip C may fall. Therefore, when the chip C falls from the screen roll member 400, the predetermined pattern is set by other factors than gravity (for example, the centrifugal force of the screen roll member 400 or the collision of the chip C). Changes can be minimized.

As such, when the chip stacking apparatus 100 according to the present invention is used, the pattern preset by the screen roll member 400 may be embodied in the flooring 20 as it is, and thus the decorativeness of the flooring 20 may be improved. .

More specifically, the screen roll member 400 may include a main body 410, a pattern portion 420, and a masking portion 430. In addition, the sound pressure unit 440 and the normal pressure unit 450 may be further included.

The main body 410 includes a mesh network 411 through which a mesh hole G is formed, and may have a cylindrical shape. Specifically, the body 410 is a frame constituting the screen roll member 400, it may be made of a mesh network structure. The mesh hole 411 is formed in the mesh network 411 of the main body 410, and air inside and outside the main body 410 may communicate with the mesh hole G.

For example, the thickness of the body 410 may be about 0.2 to 2 mm, and the density of the mesh holes G in the mesh network 411 may be about 4 to 40 mesh. In addition, the size of the mesh hole G may be smaller than the size of the chip C applied. However, the thickness of the main body 410 and the density of the mesh network 411 are not limited to the above, and various modifications are possible.

In addition, the screen roll member 400 is not limited to the case in which the main body 410 has a mesh network structure, and may be modified in various forms as long as the chip may not penetrate while communicating the inside and the outside of the hollow. For example, the main body 410 may be formed by forming a cylindrical plate in which holes (not shown) are perforated.

The pattern unit 420 may be provided in the main body 410 in a region of a predetermined pattern, and may be provided through the air. Specifically, the pattern portion 420 may be formed by displaying a predesigned pattern on the surface of the main body 410 and allowing air to pass through without masking. That is, in the pattern unit 420, the inside and the outside of the main body 410 may communicate with each other through the mesh hole G.

The masking unit 430 may be provided in the main body 410 in an area excluding the pattern part 420, and may be provided by masking a surface of the main body 410 so that air does not pass through.

In detail, the masking unit 430 may mask the mesh network 411 of the main body so that the mesh hole G is blocked in an area of the main body 410 except for the pattern part 420. That is, the masking part 430 may not communicate with the outside of the body 410 and the air. For example, the masking unit 430 may coat and harden the mesh network 411 constituting the main body 410 with a plastic resin such as an epoxy resin and harden, or may mask with a metallic material. However, the masking method of the masking unit 430 is not limited to the above description, and various modifications may be made if the masking unit 430 may not allow the air inside and outside the main body 410 to pass through.

On the other hand, the screen roll member 400 may be provided with a negative pressure unit 440 which is an area in which a negative pressure state is formed, and a normal pressure unit 450 in which the negative pressure state is released.

The negative pressure unit 440 may be provided in a predetermined region inside the main body 410, and may form a negative pressure state to direct the flow of air in the pattern unit 420 from the outside to the inside.

Here, the negative pressure unit 440 may form a negative pressure state, so that the flow of air may be directed from the outside to the inside, and various embodiments may be applied. For example, an air suction device (not shown) may be installed on the screen roll member 400 so as to be connected to an internal region of the main body, and the negative pressure may be formed inside the main body 410 by extracting the internal air through the air suction device. Can be. The air suction device may include an air pump for discharging air to the outside, and may include an air amount regulator for adjusting the amount of air discharged to prevent deformation of the screen roll member during air discharge. However, the method of forming the sound pressure of the sound pressure unit is not limited to the above description, and various embodiments may be applied if the pressure of the air inside the body 410 may be lower than that of the outside.

The atmospheric pressure unit 450 may be provided in an area of the main body 410 except for the negative pressure unit 440. In addition, the atmospheric pressure part 450 may be provided in an area including the lowermost part of the main body 410 so as to face the substrate part 20.

For example, the atmospheric pressure unit 450 has a position in which the vertical virtual line V, which is an imaginary line extending vertically downward of the rotation axis of the screen roll member 400, is rotated 45 degrees clockwise, and counterclockwise. It may be provided in the region θ1 between the positions rotated 45 degrees. That is, the atmospheric pressure unit 450 may be positioned in the above-described region, and may be disposed toward the lower side where the base unit 20 is disposed. Accordingly, the chip C attached to the screen roll member 400, when the screen roll member 400 rotates and is positioned in the upper pressure portion 450, the sound pressure is released and at the same time vertically falls downward to the base portion ( 20) can be placed in a predetermined position on the.

However, the position at which the atmospheric pressure unit 450 is installed is not limited to the above bar, and if the chip C can be dropped to a predetermined position on the base unit 20, it may be modified.

On the other hand, the mesh network 411, the mesh hole (G) may be formed in a smaller size than the chip (C).

 Accordingly, it is possible to prevent the sucked chip C from being inserted into the main body 410 (see FIGS. 2 and 5).

That is, if the size of the mesh hole (G) is larger than or similar to the size of the chip (C), when the chip (C) is sucked by the negative pressure, the chip (C) passes through the mesh network 411 to the screen roll member ( The suction pump or the fan provided inside the 400 may be damaged, or the chip C may be caught in the mesh hole G to cause an error in pattern formation and chip stacking. According to the present invention, the chip C may be sucked by the suction force of the negative pressure unit 440, and then attached to the surface of the mesh network 411. Here, when the chip (C) is attached to the surface of the main body 410, the chip (C) is attached in a single layer without overlapping by the mesh network 411, minimizing the case where the chip (C) overlaps or is missing Can be. Accordingly, the pattern implemented on the flooring 20 may have a clear and uniform boundary as designed by the manufacturer.

On the other hand, the substrate portion 20 proceeds in one direction (see A direction in FIG. 1), and the screen roll member 400 may rotate at the same linear speed as the speed of the substrate portion 20 traveling.

Accordingly, the present invention, the shape of the pattern portion 420 displayed on the screen roll member 400 can be implemented in the flooring 20 as it is.

Meanwhile, the contact point P of the guide plate member 300 and the screen roll member 400 may be provided to be lower than the horizontal virtual line H which extends the rotation axis of the screen roll member 400 parallel to the ground. have.

For example, the contact point P of the guide plate member 300 and the screen roll member 400 has the above-described vertical virtual line V in a direction of 1 degree to 30 degrees in the direction toward the guide plate member 300. It may be located in the region θ2 between the rotated positions.

As a result, since the pattern portion 420 of the screen roll member 400 is disposed above the contact point P, the chip C of the guide plate member 300 is directed upward toward the pattern portion 420. (See D direction in FIG. 5) and may be attached. Therefore, according to the position of the contact point P, the chip C may be attached only to the pattern portion 420, and the appropriate amount of the chip C may be attached.

On the other hand, the chip (C) may be provided with at least one of the non-slip chip 32 of the colored chip 31 and the slippery material provided with a colored (see Figs. 6 to 9).

At this time, the stacked form of the colored chip 31 and the non-slip chip 32 may be applied in various ways. For example, as shown in FIG. 6, both the colored chip 31 and the non-slip chip 32 are stacked with a pattern, or as shown in FIG. 7, only the colored chip 31 is stacked with a pattern or as shown in FIG. 8. Only 32 can be stacked with a pattern. Alternatively, as shown in FIG. 9, the colored chips 31a and the non-slip chips 32 may be stacked without a pattern, and then the colored chips 31b may be stacked with patterns.

Here, the colored chip 31 may be pulverized by sheeting in a PVC material by a rolling process or an extrusion method. For example, the colored chip 31 may include 15 to 30 parts by weight of a primary plasticizer selected from dioctyl terephthalate (DOTP), diisononyl phthalate (DINP), and barium-zinc compound based on 100 parts by weight of PVC straight resin. 0.5-5 parts by weight of a stabilizer selected from a potassium-barium-zinc compound, an organic tin compound, and the like, 0.5-5 parts by weight of a pigment imparting color, and 0-30 parts by weight of a filler, followed by rolling and processing with a calendar to form a sheet. And it may be applied to make a general pallet-type particles in the form of pulverized, or cut out by a cutter of the desired size when the compound is extruded through the extruder by the combination. In addition, it can be configured by various combinations of shapes, sizes, colors and the like according to the intended design. Herein, the material is not limited to a PVC material, and a plastic material having adhesion with PVC can be modified to various materials.

On the other hand, the non-slip chip 32 may be distributed simultaneously with the colored chip 31, or the colored chip 31 may be placed in conformity with the design, and then the non-slip chip 32 of the inorganic material may be dispersed to prevent slippage or wear. It may be.

Here, the non-slip chip 32 can be used by crushing one or more selected from quartz, SiO 2, Al 2 O 3, glass beads, SiC, and the like to have a particle size of about 1.50 to 0.3 mm. In addition, the non-slip chip 32 may be formed of a material having excellent wear resistance and heat resistance hardness, and may be provided as silicon carbide (SIC), for example. However, the composition and material of the non-slip chip 32 are not limited to the above, and various modifications are possible as long as the non-slip chip can be provided.

Meanwhile, the flooring manufacturing system 10 according to another aspect of the present invention includes a guide part 11 and a chip stacking device 100.

The guide part 11 can guide so that the plate-shaped base material part 20 may advance to one direction (A direction of FIG. 1). For example, the guide part 11 may be provided in the form of a guide roll, and one or a plurality of guide parts may be spaced apart from the lower part of the base part 20 to allow the base part to move in one direction. Here, the type and size of the guide portion 11 is not limited, and various modifications are possible as long as the base portion can be advanced while supporting the base portion 20 so as not to fall.

The chip stacking apparatus 100 may be provided on the base portion 20 to stack the chips C on the base portion 20. The chip stacking apparatus 100 may be provided in the same manner as described above.

Meanwhile, the flooring 20 according to another aspect of the present invention may include a lower layer 21, a base layer 22, a surface layer 23, and a chip layer 30.

The lower layer 21 may be provided in various materials, for example, non-woven nonwoven fabric, woven fiber or glass fiber, etc., in the form of semi-finished products and calenders processed in a general woven or nonwoven form, or calendered or extruded It is possible to laminate the semi-finished product in the form of a sheet of the thermoplastic material, which is not limited thereto.

The base layer 22 may be provided by coating a PVC paste sol on a fiberglass mat with a knife coat or a comma coat. It can also be bonded to the lower layer 21 to cure.

At this time, the PVC composition impregnated into the glass fiber mat constituting the base layer 22, for example, 50 to 100 parts by weight of a general plasticizer such as dioctyl terephthalate, based on 100 parts by weight of vinyl chloride resin having a polymerization degree of 1000 to 3000, 1 to 10 parts by weight of a stabilizer selected from paraffin-based compounds 3 to 15 parts by weight of a secondary plasticizer, barium-zinc compounds, heat-resistant stabilizers, potassium-barium-zinc compounds and organic tin compounds, and titanium oxide as a pigment 0.5 to 5 By weight, 50 to 170 parts by weight of the filler calcium carbonate may be mixed in a sol state. In addition, the viscosity may be 2000 ~ 10,000 cps. After knife coating to a thickness of 0.3 ~ 1.5mm on this glass fiber mat, the non-woven fabric or sheet may be laminated while the lower layer 21 is laminated and cured at a temperature of 150 to 180 degrees with a gelling drum having a circumference of 3 to 6 m. However, the present invention is not limited thereto.

The surface layer 23 may be colored on the base layer 22 which is an impregnation layer including a glass fiber mat.

At this time, the composition of the surface layer 23 is 40 to 70 parts by weight of a primary plasticizer selected from dioctyl terephthalate (DOTP), diisononyl phthalate (DINP) and the like with respect to 100 parts by weight of vinyl chloride resin having a polymerization degree of 1000 to 3000, for example. 2 to 15 parts by weight of a paraffinic compound, a secondary plasticizer, 0.5 to 5 parts by weight of a stabilizer selected from a barium-zinc compound, a potassium-barium-zinc compound and an organic tin compound, and a pigment to impart color 1 to 5 parts by weight. Part, may be made of a sol state by mixing 0 to 50 parts by weight of the filler. In addition, the surface layer 23 may be coated with a knife coater or comma coater to be provided with a thickness of 0.3 ~ 1.0mm on the glass fiber mat layer.

The chip C may be stacked on the surface layer 23.

As such, when the chip stacking device and the flooring manufacturing system having the same according to the present invention are used, the pattern preset by the screen roll member can be implemented as it is on the flooring, thereby improving the decorative design of the flooring.

Although specific embodiments of the present invention have been described above, the spirit and scope of the present invention are not limited to these specific embodiments, and are described in the claims by those skilled in the art. Various modifications and variations are possible without departing from the spirit of the invention.

10: Flooring Manufacturing System
11: guide part 20: flooring material, base part
21: lower layer 22: substrate layer
23: surface layer 30: chip layer
31: colored chip 32: non-slip chip
100: chip stacking device 200: hopper member
300: guide plate member 400: screen roll member
410: main body 411: mesh network
420: pattern portion 430: masking portion
440: sound pressure unit 450: normal pressure unit
500: vibration member 600: chip supply control panel
A: advancing direction of flooring material B: rotating direction of screen roll member
C: Chip D: Chip Suction Direction
E: Chip fall direction G: Mesh hole
H: horizontal virtual line V: vertical virtual line

Claims (13)

A hopper member having a storage space for storing chips stacked on a surface of a plate-shaped base portion;
A plate-shaped guide plate member provided under the hopper member to receive the chip falling from the hopper member;
A screen roll member disposed adjacent to the guide plate member to receive chips, rotate in one direction, be formed in a hollow cylindrical shape, and stack the chips supplied from the guide plate member on the substrate to have a pattern; And,
And a chip supply control panel attached to the hopper member to adjust the amount of chips stored in the storage space to the guide plate member, and provided at a position where the hopper member and the guide plate member are connected.
The screen roll member sucks the chip supplied from the guide plate member, attaches the chip to a region where a pattern is formed, and releases the chip when the chip is adjacent to the substrate, thereby releasing the chip. Drop in wealth,
The screen roll member therein,
An atmospheric pressure portion provided in a region including a lowermost portion of the screen roll member toward the substrate portion, and an area in which sound pressure is released so that the chip falls to the substrate portion by its own weight; And
A negative pressure state is formed so that the flow of air in the region where the pattern is formed is provided from the outside toward the inside, the region between the point where the chip is attached from the guide plate member from the point where the chip falls by the normal pressure portion Including a sound pressure unit which is an area that includes,
The chip supply control panel is provided in plurality in the width direction of the guide plate member, and each of the plurality of chip supply control panel is a chip stacking device that can be combined by different heights coupled to the hopper member. The method of claim 1,
The screen roll member,
A cylindrical body having a mesh network in which mesh holes are formed;
A pattern portion provided in an area where a pattern of the main body is formed and provided with air; And,
A chip stacking apparatus, comprising a masking portion provided in an area of the main body except for the pattern portion, and provided by masking the main body so that air does not pass. The method of claim 2,
The mesh stacking device, the mesh hole is formed in a smaller size than the chip so that the sucked chip is not inserted into the main body. delete The method of claim 1,
The atmospheric pressure portion is provided in an area between a position where the vertical virtual line, which is a virtual line extending vertically downward through the rotation axis of the screen roll member, is rotated 45 degrees clockwise and rotated 45 degrees counterclockwise. Lamination device. The method of claim 1,
The base portion proceeds in one direction,
And the screen roll member rotates at the same linear speed as the advancing speed of the substrate portion. The method of claim 1,
The contact plate between the guide plate member and the screen roll member is provided so as to be positioned lower than the horizontal virtual line extending the axis of rotation of the screen roll member in parallel to the ground. The method of claim 1,
The guide plate member, the chip stacking device is provided to be inclined downward at a predetermined angle from one end adjacent to the hopper member toward the other end adjacent to the screen roll member. The method of claim 1,
And a vibration member which vibrates the hopper member and the guide plate member to move the chip. delete The method of claim 1,
The chip is provided with at least one of a non-slip chip of a colored chip and a material for preventing slip, provided with a colored, chip stacking device. The method of claim 1,
The chip is provided with at least one of non-slip chips of a colored chip and non-slip material provided with a color, at least one of the colored chip and the non-slip chip is amorphous and stacked on the substrate, the colored chip A chip stacking device having a pattern and laminated on the substrate portion. A guide part for guiding the plate-shaped base part to proceed in one direction; And,
A chip stacking device, which is provided on an upper portion of the substrate portion and stacks chips on the substrate portion,
The chip stacking device,
A hopper member having a storage space for storing chips stacked on a surface of a plate-shaped base portion;
A plate-shaped guide plate member provided under the hopper member to receive the chip falling from the hopper member;
A screen roll member positioned adjacent to the guide plate member to receive a chip, rotate in one direction, formed in a hollow cylindrical shape, and stack the chip supplied from the guide plate member on the substrate to have a pattern; And,
And a chip supply control panel attached to the hopper member to adjust the amount of chips stored in the storage space to the guide plate member, and provided at a position where the hopper member and the guide plate member are connected.
The screen roll member sucks the chip supplied from the guide plate member, attaches the chip to a region where a pattern is formed, and releases the chip when the chip is adjacent to the substrate, thereby releasing the chip. Drop in wealth,
The screen roll member therein,
An atmospheric pressure portion provided in a region including a lowermost portion of the screen roll member toward the substrate portion, and an area in which sound pressure is released so that the chip falls to the substrate portion by its own weight; And
A negative pressure state is formed so that the flow of air in the region where the pattern is formed is provided from the outside toward the inside, the region between the point where the chip is attached from the guide plate member from the point where the chip falls by the normal pressure portion Including a sound pressure unit which is an area that includes,
The chip supply control panel is provided in plurality along the width direction of the guide plate member, and each of the plurality of chip supply control panel is a flooring manufacturing system capable of combining the different height coupled to the hopper member.

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