KR102052872B1 - Liquid crystal display device for removing easily static electrocity - Google Patents

Liquid crystal display device for removing easily static electrocity Download PDF

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Publication number
KR102052872B1
KR102052872B1 KR1020130112784A KR20130112784A KR102052872B1 KR 102052872 B1 KR102052872 B1 KR 102052872B1 KR 1020130112784 A KR1020130112784 A KR 1020130112784A KR 20130112784 A KR20130112784 A KR 20130112784A KR 102052872 B1 KR102052872 B1 KR 102052872B1
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substrate
conductive layer
liquid crystal
crystal display
display device
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KR1020130112784A
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Korean (ko)
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KR20150033158A (en
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하종무
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엘지디스플레이 주식회사
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133512—Light shielding layers, e.g. black matrix
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509—Filters, e.g. light shielding masks
    • G02F1/133514—Colour filters
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/22—Antistatic materials or arrangements

Abstract

The present invention relates to a liquid crystal display device capable of removing static electricity introduced through a black matrix, comprising: a first substrate including a dummy region and an image display region and including a pixel defined by a plurality of gate lines and data lines; A second substrate facing the first substrate and having a color filter layer formed thereon; A thin film transistor formed on each pixel of the first substrate; A conductive layer formed on the second substrate to discharge static electricity to the outside; A black matrix formed over the conductive layer in the outer region of the second substrate and the image display region to block light leakage; A liquid crystal layer formed between the first substrate and the second substrate; And a connection wiring connecting the conductive layer with an external ground to remove static electricity through the ground.

Description

Liquid crystal display device for easy elimination of static electricity {LIQUID CRYSTAL DISPLAY DEVICE FOR REMOVING EASILY STATIC ELECTROCITY}

The present invention relates to a liquid crystal display device, and more particularly to a liquid crystal display device that can easily remove the static electricity generated in the black matrix.

Since the introduction of flat panel display devices, liquid crystal display devices have been used as representative flat panel display devices due to mass production technology, ease of driving means, and high quality.

Such a display element is a device for displaying information on a screen by using the refractive anisotropy of the liquid crystal. As shown in FIG. 1, the liquid crystal display device 1 includes a liquid crystal layer 40 formed between the first substrate 20 and the second substrate 30 and between the first substrate 20 and the second substrate 30. ) The first substrate 20 is a drive element array substrate. Although not shown, a plurality of pixels are formed on the first substrate 20, and a driving element such as a thin film transistor is formed in each pixel. The second substrate 30 is a color filter substrate, and a color filter layer 32 and a black matrix 34 are formed to realize actual colors. In addition, a pixel electrode and a common electrode are formed on the first substrate 20, and an alignment layer for aligning liquid crystal molecules of the liquid crystal layer 40 is coated on the first substrate 20 and the second substrate 30. have.

The first substrate 20 and the second substrate 30 are bonded by a sealing material 44, and a liquid crystal layer 40 is formed therebetween to drive the first substrate 20. The liquid crystal molecules are driven by the device to emit light from the backlight unit (not shown), thereby controlling the amount of light transmitted to the liquid crystal layer 40 to display the information.

However, the following problems occur in the liquid crystal display device having the above structure.

As illustrated in FIG. 1, a black matrix 34 is formed in the outer region of the second substrate 30 and inside the display device, and a color filter layer 32 is formed between the black matrix 34. The black matrix 34 is to prevent light from leaking into a region where an image is not displayed when light is transmitted from the backlight to the liquid crystal layer. As shown in the drawing, the outer region and the display of the display element are shown. It is formed between the color filter layers in the area to prevent light from leaking into the area and generating bright lines on the screen.

In the outer region of the display device, the black matrix 34 extends to the end region of the second substrate 30. The black matrix 34 may be formed only from the end of the second substrate 30 to the inside of the predetermined region. In this case, light leaks from the edge region of the liquid crystal display device 1, thereby degrading image quality. In particular, in the case of a small liquid crystal display device applied to a mobile communication device such as a mobile phone or a tablet PC, since the area of the dummy area outside the image display area on which an image is displayed is minimized, the black matrix 34 is a second substrate ( In the case where only the inside of the predetermined area is formed from the end of 30), light leakage affects the screen display area, resulting in a noticeable degradation in image quality.

In order to prevent such deterioration in image quality, the black matrix 34 is formed up to the end region of the second substrate 30 so that the outer dummy region of the display element is blocked by the black matrix 34. In this case, as shown in FIG. 1, the side end of the black matrix 34 is aligned with the side end of the second substrate 30 so that the side end of the black matrix 34 is exposed to the outside.

Therefore, when an operator during the liquid crystal display device process or the user touches the side of the liquid crystal display device by hand, static electricity generated in the human hand is introduced into the liquid crystal display device through the black matrix 34. The inflow of static electricity into the liquid crystal display device causes whitening and is a cause of failure of the liquid crystal display device.

SUMMARY OF THE INVENTION The present invention has been made in view of the above, and provides a liquid crystal display device capable of removing static electricity introduced through a black matrix by forming a conductive layer for discharging static electricity on a second substrate and connecting it to ground. The purpose.

In order to achieve the above object, a liquid crystal display device according to the present invention includes a first substrate including a dummy region and an image display region and including a pixel defined by a plurality of gate lines and data lines; A second substrate facing the first substrate and having a color filter layer formed thereon; A thin film transistor formed on each pixel of the first substrate; A conductive layer formed on the second substrate to discharge static electricity to the outside; A black matrix formed over the conductive layer in the outer region of the second substrate and the image display region to block light leakage; A liquid crystal layer formed between the first substrate and the second substrate; And a connection wiring connecting the conductive layer with an external ground to remove static electricity through the ground.

The black matrix has a side end portion extending to the side end portion of the second substrate, and the conductive layer is formed over the entire second substrate or at least a portion of the black matrix in the outer region of the second substrate and at least a portion of the black matrix in the image display area. It is formed at the bottom.

The conductive layer may be formed of a transparent conductive material, such as indium tin oxide (ITO) and indium zinc oxide (IZO), or may be formed of a metal. When the conductive layer is formed of a transparent conductive material, the conductive layer may be annealed at a temperature of 190 degrees or more.

The connection wiring may include a metal wiring formed in the dummy region of the first substrate; And a silver dot disposed on the metal wire and in contact with the conductive layer of the second substrate.

In the present invention, after the conductive layer is formed on the second substrate, the conductive layer is electrically connected to the metal wiring of the dummy region of the first substrate through the connection wiring, thereby preventing static electricity introduced into the liquid crystal display device through the black matrix. Efficiently discharge through ground. Therefore, it is possible to effectively prevent whitening from occurring in the liquid crystal display device due to static electricity.

1 is a view conceptually showing the structure of a conventional liquid crystal display device;
2 is a plan view showing the structure of a liquid crystal display device according to the present invention;
3 is a cross-sectional view showing the structure of a liquid crystal display device according to the present invention.
4A-4C show the structure of a conductive layer according to the invention, respectively.

Hereinafter, with reference to the accompanying drawings will be described in detail the present invention.

2 is a plan view showing the structure of a liquid crystal display device according to the present invention. As shown in FIG. 2, the liquid crystal display device 101 includes an image display unit 117 in which a plurality of pixels are arranged in a matrix form, a gate pad unit 118 connected to a gate line of the image display unit 117, and The data pad unit 119 is connected to the data line. In this case, the gate pad part 118 and the data pad part 119 are formed in an edge region of the first substrate 120 which does not overlap the second substrate 130, and the gate pad part 118 is a gate driver integrated circuit. The scan signal supplied from the first to the gate line of the image display unit 117 is supplied, and the data pad unit 119 supplies the image information supplied from the data driver integrated circuit to the data line of the image display unit 117.

In the thin film transistor array substrate of the image display unit 117, that is, the first substrate 120, a plurality of data lines to which image information is applied and a plurality of gate lines to which a scan signal is applied are vertically intersected with each other, and the intersections thereof. A thin film transistor for switching pixels, a pixel electrode connected to the thin film transistor to drive the pixel, and a protective film formed on the front surface of the pixel electrode and the thin film transistor to protect the pixel electrode and the thin film transistor.

The color filter substrate of the image display unit 117, that is, the second substrate 130, is separated and applied to each pixel region to implement color, and is formed on the image display unit 117 to partition the color filter layer and the gate pad. And a black matrix 144 formed in the unit 118 and the data pad unit 119. In the drawing, for convenience of description, only the configuration in which the black matrix 144 is formed in the gate pad portion 118 and the data pad portion 119 is disclosed, but the black matrix 144 is formed in the image display portion 117. It is also formed in the image non-display area.

A conductive layer 146 is formed on the second substrate 130. In this case, the conductive layer 146 is formed under the black matrix 144 and is electrically connected to an external ground to discharge static electricity introduced into the liquid crystal display device through the black matrix 144 to the outside.

Although the conductive layer 146 is formed over the entire second substrate 130 in the drawing, the formation region of the conductive layer 146 is not limited to a specific position. Since the role of the transparent conductive layer 146 is to discharge and remove the static electricity introduced into the liquid crystal display device, the conductive layer 146 may be formed in any form as long as it can perform this function smoothly. Various shapes of the conductive layer 146 will be described later in more detail.

The first substrate 120 and the second substrate 130 configured as described above maintain a constant cell gap by a spacer, and the seal line 144 formed on the outer side of the image display unit 17. Bonded to each other, a liquid crystal layer is formed between the first substrate 120 and the second substrate 130 to form a liquid crystal panel.

The silver dot 152 is formed near the edge region of the second substrate 130 of the gate pad part 118 of the first substrate 120. The silver dot 152 electrically contacts the conductive layer 146 formed on the second substrate 130 to electrically connect the conductive layer 146 to an external ground. In the drawing, the silver dot 152 is formed on the gate pad portion 118 near the two edges of the second substrate 130, but the silver dot 152 is formed near the edge of the second substrate 130. 118 and the data pad part 119 may be formed. In addition, the silver dot 152 may be formed on any one of the gate pad part 118 and the data pad part 119. Since the silver dot 152 serves as a connection wiring for electrically connecting the conductive layer 146 and the external ground, any shape or number may be possible as long as the conductive layer 146 can be connected to the external ground.

As described above, in the present invention, when the side end portion of the black matrix 134 is aligned with the side end portion of the second substrate 130 to complete the liquid crystal display, the side end portion of the black matrix 134 is exposed to the outside. In this case, by forming the conductive layer 146 for removing static electricity on the second substrate 130, the static electricity introduced into the liquid crystal display device through the exposed region of the black matrix 134 may be removed.

A liquid crystal display device having the above structure will be described in more detail with reference to FIG. 3.

3 is a cross-sectional view showing the structure of a liquid crystal display device 101 according to the present invention. As shown in FIG. 3, the liquid crystal display device 101 of the present invention includes an image display area in which an actual image is implemented, and a dummy area including a gate pad part and a data pad part. Although the image display area of the liquid crystal display element 101 is actually composed of many pixels, for convenience of explanation, only one pixel is shown in the drawings and the invention will be described.

In the image display area of the liquid crystal display device 101, the image display area includes a first substrate 120, which is a thin film transistor array substrate on which a thin film transistor is formed, and a second substrate 130, which is a color filter substrate on which a color filter layer is formed. And a thin film transistor formed on the first substrate 120, a protective layer 124 formed on the first substrate 120 on which the thin film transistor is formed, and a protective layer 124 disposed on the protective layer 124 in parallel with each other. As the signal is input, at least one pair of common electrode 126 and the pixel electrode 127 forming a lateral field (In Plnae Switching Field) and the second substrate 130 are formed in the liquid crystal display device 101. The conductive layer 146 which discharges the static electricity flowing to the outside, the dummy region of the second substrate 130 on which the conductive layer 146 is formed, and the image non-display portion in the image display region are formed to leak light into the region. To prevent the black matrix 134, A color filter layer 132 formed of R (Red), G (Green), and B (Blue) color filters formed on the second substrate 130 to realize actual colors, and the first substrate 120 and the second substrate. The gap between the first substrate 120 and the second substrate 130 is formed on the liquid crystal layer 140 formed between the substrate 130 and the first substrate 120 or the second substrate 130. It is composed of a spacer 148 to maintain a constant cell gap (cell gap).

The silver dot 152 is formed in the outer region of the liquid crystal display device 101. do. The silver dot 152 is connected to the conductive layer 146 formed on the second substrate 130 to be discharged into the liquid crystal display device 101 to discharge static electricity flowing through the conductive layer 146 to the outside. It functions as a passage. As such, the silver dot 152 serves as a connection wiring for connecting the conductive layer 146 to the outside. In the drawings, the connection wiring is specifically described with the silver dot 152. However, the connection wiring of the present invention is not limited to the silver dot, but various forms or shapes may be provided as long as the conductive layer 146 can be electrically connected to the outside. It will be possible.

Meanwhile, a metal wiring 129 made of a material having good conductivity is formed in the dummy region of the first substrate 120 so that the silver dot 152 is electrically connected to the metal wiring 129. The metal wire 129 removes static electricity discharged by being connected to a ground such as an external metal case and an external PCB.

The thin film transistor formed in the image display area is formed in each of the plurality of pixel areas formed on the first substrate 120 to switch the image signal applied to the pixel electrode 127. The gate formed on the first substrate 120 A semiconductor layer 112 formed of an electrode 111, a gate insulating layer 122 formed on the gate electrode 111, and a semiconductor material such as amorphous silicon (a-Si) formed on the gate insulating layer 122; And a source electrode 113 and a drain electrode 114 formed on the semiconductor layer 112.

The gate electrode 111 is formed by stacking a metal such as Mo, Al, Al alloy, etc. on the first substrate 101 by sputtering and then etching, and the gate insulating layer 122 is formed of SiO 2 or SiN. Inorganic materials such as 2 are formed by laminating by Plasma Enhanced Chemical Vapor Deposition (PECVD).

The semiconductor layer 112 is formed by laminating and etching amorphous silicon (a-Si) by PECVD. The source electrode 114 and the drain electrode are formed by sputtering a metal such as Cr or Cr alloy by sputtering. Is formed.

The protective layer is formed by laminating an inorganic material such as SiO 2 or SiN 2 by PECVD or by applying an organic material such as photo acryl.

The common electrode 126 and the pixel electrode 127 may be formed by stacking and etching a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO), and may be formed of Mo, Cr, Cu, Al, and Al alloys. It may be formed by laminating and etching metals such as the like. In addition, although the common electrode 126 and the pixel electrode 127 are both formed on the passivation layer 124 in the drawing, the formation positions of the common electrode 126 and the pixel electrode 127 are formed only on the passivation layer 124. It is not limited. For example, both the common electrode 126 and the pixel electrode 127 may be formed on the first substrate 120 and may be formed on the gate insulating layer 122, and the common electrode 126 and the pixel electrode 127 may be formed on the first substrate 120. One electrode may be formed on the first substrate 120, and the other electrode may be formed on the gate insulating layer 122. When the common electrode 126 is formed on the first substrate 120, the common electrode 126 is preferably formed of the same metal as the gate electrode 111 of the thin film transistor, and the pixel electrode 127 is gated. When formed on the insulating layer 122, it is preferable to simultaneously form the same metal as the source electrode 113 of the thin film transistor.

In addition, a plurality of data lines 104 are formed on the gate insulation layer 122 in one direction of the substrate. Although not shown in the drawing, the data lines 104 are vertically arranged on the first substrate 120 to be perpendicular to the data lines 104. A plurality of gate lines defining regions are formed.

The black matrix 134 is formed of a metal oxide or black resin such as CrO or CrO 2 . The black matrix 134 has a side end portion extending to the side end portion of the second substrate 130 so that the side end portion is exposed to the outside. Even when a predetermined amount of static electricity is introduced into the liquid crystal display device. In particular, the present inventors have found that even when the black matrix 134 is formed of a black resin, a certain amount of static electricity flows into the liquid crystal display device 101 through the black matrix 134.

The conductive layer 146 is formed of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO). In general, ITO and IZO are known to have lower conductivity than metals. Although ITO or IZO has a low conductivity, the conductivity of the black matrix 134 is better than that of Cr, CrO 2 , and black resin, so that the black matrix 134 is formed even if the ITO or IZO is formed of the conductive layer 146. Through this, the static electricity introduced into the liquid crystal display device 101 can be efficiently discharged to the outside.

On the other hand, in the present invention, in order to improve the discharge efficiency of static electricity, the conductivity of the conductive layer 146 is improved by annealing the ITO or IZO. Since metal oxides such as ITO and IZO have an amorphous phase unlike metals, electron mobility is lowered than metals, and thus conductivity is lowered than metals.

In the present invention, the conductivity of the conductive layer 146 is improved by annealing metal oxides such as ITO or IZO to reduce the amorphous phase and increase the crystal phase. To this end, in the present invention, the conductivity is improved by annealing the conductive layer 146 made of a metal oxide such as ITO or IZO at a temperature of 190 ° C. or higher, preferably 210-230 ° C. for about 1000 seconds.

Table 1 is a table showing the sheet resistance of the conductive layer 146 when the conductive layer 146 made of a metal oxide such as ITO or IZO is heated at a set temperature and then annealed for about 1000 seconds.

No annealing 150 degrees 170 degrees 190 degrees 210 degrees 230 degrees Sheet resistance (Ω / cm2) 41 40 40 38 17 24 Reduction ratio (0% 0 2.5 2.5 7 59 41

As shown in Table 1, when annealing is not performed, the sheet resistance of the conductive layer 146 is about 41 (Ω / cm 2). When the conductive layer 146 is heated to about 150 degrees and 170 degrees, and then cooled for 1000 seconds to anneal the conductive layer 146, the sheet resistance becomes about 40 (Ω / cm2), which is about 2.5% reduction in sheet resistance is achieved.

When the conductive layer 146 is heated to a temperature of 190 degrees and annealed for 1000 seconds, the sheet resistance becomes about 38 (Ω / cm 2), and thus, a sheet resistance reduction effect of about 7% can be obtained as compared with the case where the annealing is not performed.

In addition, when the conductive layer 146 is heated to a temperature of 210 degrees and annealed for 1000 seconds, the sheet resistance becomes about 59 (Ω / cm 2), thereby obtaining a sheet resistance reduction effect of about 59% compared to the case where the sheet is not annealed. When the layer 146 is heated to a temperature of 230 degrees and annealed for 1000 seconds, the sheet resistance becomes about 41 (Ω / cm 2), thereby obtaining a sheet resistance reduction effect of about 41% compared with the case where the layer 146 is not annealed.

Thus, in the present invention, the sheet resistance effect can be obtained by annealing the conductive layer 146 at a temperature of about 150-230 degrees, while a slight effect is obtained at a temperature of 150-180 degrees, while the sheet resistance is particularly pronounced at a temperature of 190 degrees or more. You will get the effect. In particular, when the annealing of 210 to 230 degrees proceeds, a remarkable effect can be obtained.

The conductive layer 146 is deposited by ITO or IZO by sputtering or the like, and then heated the conductive layer 146 to raise a specific temperature (for example, 190 degrees or more), and then, for a specific time at room temperature. Annealed by standing for 1000 seconds.

The column spacer 117 is made of an organic material, a photosensitive organic material, or the like to always maintain a constant gap between the first substrate 120 and the second substrate 130. In this case, the column spacer 117 is formed on the second substrate 130 as shown in the drawing, but may be formed on the first substrate 120. In addition, the column spacer 117 may be disposed above the data line 104 or above the gate line, rather than the area where the actual image is implemented, to prevent the aperture ratio from being lowered. In addition, the column spacer 117 may be disposed at the intersection of the gate line and the data line 104 perpendicular to each other.

The seal line 144 is formed between the first substrate 120 and the second substrate 130 along the circumference of the first substrate 120 and the second substrate 130 to form the first substrate 120 and the first substrate 120. The second substrate 130 is bonded together and the first substrate 120 and the second substrate 130 are sealed together.

In this case, the seal line 144 is formed of a thermosetting sealant or an ultraviolet curing sealant, and the thermosetting sealant or ultraviolet curing sealant is formed by dropping the outer surface of the first substrate 120 by dropping the sealant, and then The first substrate 120 and the second substrate 130 are bonded by applying heat or ultraviolet rays and pressing the substrate 120 and the second substrate 130 to compress them.

The metal wiring 129 formed in the dummy region of the first substrate 120 is made of a metal having good conductivity, so that the static electricity discharged through the silver dot 152 can be smoothly transmitted to the external ground.

The metal wire 129 is preferably made of a metal having good conductivity, and may be formed simultaneously with the formation of the gate electrode 111 after laminating Mo, Al, Al alloy, etc. on the first substrate 120. . Of course, the metal wiring 129 may be formed of a different metal from the gate electrode 111 in a different process, but for the efficiency of the process, the metal wiring 129 may be formed of the same metal as the gate electrode 111 by the same process. will be.

The silver dot 152 has a metal wire 129 disposed on the metal wire 129 to electrically connect the conductive layer 146 and the metal wire 129 formed on the second substrate 130. The silver dot is formed by forming a thin film transistor, a metal wiring 129 and a seal line 144 on the first substrate 120 and then placing the silver dot on the metal wiring 129 before bonding to the second substrate 130. Is formed. That is, after arranging the silver dots, the first substrate 120 and the second substrate 130 are bonded to each other so that the silver dots 152 are in contact with the side end surface of the conductive layer 146 to be electrically connected.

As described above, in the present invention, after the conductive layer 146 is formed on the second substrate 130, the conductive layer 146 is formed on the second substrate 130 by a connection wiring such as the silver dot 152. By electrically connecting to the metal wire 129, the static electricity introduced into the liquid crystal display device through the black matrix 134 can be efficiently discharged through the ground.

In the drawing, the conductive layer 146 is formed on the entire surface of the second substrate 130, but the conductive layer 146 may be formed only in a predetermined region of the second substrate 130. As such, when the conductive layer 146 is formed only in a partial region of the second substrate 130, the conductive layer 146 is formed under the black matrix 134. In addition, the conductive layer 146 may not be formed of a transparent metal oxide such as ITO or IZO but may be formed of an opaque metal having good conductivity such as Mo, Al, and Al alloy.

4A to 4C are views showing the shape of the conductive layer 246 when formed only in a partial region of the second substrate.

As shown in FIG. 4A, the conductive layer 246 includes a first conductive layer 246a formed in an outer region of the liquid crystal display device, a second conductive layer 246b formed along a gate line of the liquid crystal display device, The third conductive layer 246c is formed along the data line of the liquid crystal display device.

The black matrix formed on the second substrate is formed in a region corresponding to the regions in order to prevent light from leaking into the dummy region of the first substrate, the gate line forming region of the image display region, and the data line forming region. Since the conductive layer 246 having the structure shown in FIG. 4A is formed below all black matrices formed on the second substrate, the conductive layer 246 is formed in the same shape as the black matrix of the conductive layer 246. Therefore, the second conductive layer 246b and the third conductive layer 246c have a matrix like the pixels of the liquid crystal display device.

In this case, the second conductive layer 246b and the third conductive layer 246c are not formed along all the gate lines and the data lines, but may be formed along the even-numbered gate lines and the data lines or the odd-numbered gate lines and the data lines. It may be. In addition, the second conductive layer 246b and the third conductive layer 246c may be formed along the n-th (where n is a natural number) gate line and data line, such as a multiple of 3 or a multiple of 4, or the like. .

The static electricity flowing into the black matrix from the conductive layer 246 having such a structure is gathered into the second conductive layer 246b and the third conductive layer 246c, and the second conductive layer 246b and the third conductive layer arranged vertically and horizontally. After flowing to the first conductive layer 246a of the outer region through 246c, the conductive layer 246c is discharged to ground through a connection wiring such as silver dot and removed.

As shown in FIG. 4B, the conductive layer 346 may include a first conductive layer 346a formed in the outer region and a second conductive layer 346b formed along the gate line of the liquid crystal display device. . In this case, the second conductive layer 346b may not be formed along all the gate lines, but may be formed along the even or odd gate lines. In addition, the second conductive layer 346b may be formed along the n-th (where n is a natural number) gate line, such as a multiple of 3 or a multiple of 4, or the like.

As shown in FIG. 4C, the conductive layer 446 may include a first conductive layer 446a formed in an outer region and a second conductive layer 446b formed along a data line of the liquid crystal display. . In this case, the second conductive layer 446b may not be formed along every data line, but may be formed along an even data line or an odd data line. In addition, the second conductive layer 446b may be formed along the n-th data line, where n is a natural number, such as a multiple of 3, a multiple of 4, or the like.

As described above, in the present invention, the conductive layer for removing static electricity can be formed in various shapes. The shape and area of the conductive layer are determined according to the conductivity of the conductive layer, the area of the liquid crystal display element, and the like.

As described above, in the present invention, after the conductive layer is formed on the second substrate, the conductive layer is electrically connected to the metal wiring of the dummy region of the first substrate through the connection wiring, thereby to form the inside of the liquid crystal display device through the black matrix. The static electricity introduced into the can be efficiently discharged through the ground. Therefore, it is possible to effectively prevent whitening from occurring in the liquid crystal display device due to static electricity.

In the above description, the liquid crystal display device of the present invention is formed in a specific structure, but the present invention is not limited to this structure. The present invention is to remove the static electricity introduced into the liquid crystal display device through the black matrix when the black matrix extends to the side end of the second substrate, the black matrix extends to the side end of the second substrate and the lower side of the black matrix. It can be applied to the liquid crystal display device of any structure in which the conductive layer is formed over a certain area.

Accordingly, the scope of the present invention is not limited thereto, but various modifications and improvements of those skilled in the art using the basic concept of the present invention as defined in the following claims are also within the scope of the present invention.

120,130: substrate 132: color filter layer
134: black matrix 140: liquid crystal layer
144: seal line 146: conductive layer
152: Silver Dot

Claims (10)

A first substrate including a dummy region and an image display region and including a pixel defined by a plurality of gate lines and data lines;
A second substrate facing the first substrate and having a color filter layer formed thereon;
A thin film transistor formed on each pixel of the first substrate;
A conductive layer formed on the second substrate to discharge static electricity to the outside;
A black matrix formed to cover the conductive layer in the outer region and the image display region of the second substrate to block leakage of light and to form a black resin;
A liquid crystal layer formed between the first substrate and the second substrate; And
And a connection wiring connecting the side of the conductive layer exposed from the outer region of the second substrate and the external ground to remove static electricity through the ground. The liquid crystal display of claim 1, wherein the side end portion of the black matrix extends to the side end portion of the second substrate. The liquid crystal display device of claim 1, wherein the conductive layer is formed over the entire second substrate. The liquid crystal display of claim 1, wherein the conductive layer is formed under the black matrix of the second substrate outer region and at least a portion of the black matrix of the image display region. The liquid crystal display device according to claim 3 or 4, wherein the conductive layer is made of a transparent conductive material. The liquid crystal display device of claim 5, wherein the conductive layer comprises indium tin oxide (ITO) and indium zinc oxide (IZO). 6. The liquid crystal display device according to claim 5, wherein the conductive layer is annealed at a temperature of 190 degrees or more. The liquid crystal display device according to claim 4, wherein the conductive layer is made of metal. The method of claim 1, wherein the connection wiring,
A metal wiring formed in the dummy region of the first substrate; And
And a silver dot disposed on the metal line and in contact with a side surface of the conductive layer exposed in the outer region of the second substrate. 10. The liquid crystal display device according to claim 9, wherein at least one silver dot is formed in a dummy area near a corner area of the second substrate.
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KR102546984B1 (en) * 2016-12-28 2023-06-27 엘지디스플레이 주식회사 Liquid crystal display device
CN106647014A (en) * 2017-03-23 2017-05-10 京东方科技集团股份有限公司 Color film substrate, preparation method thereof and display panel
CN107065288B (en) * 2017-05-25 2020-06-05 昆山龙腾光电股份有限公司 Color film substrate, manufacturing method thereof and liquid crystal display panel
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