KR102044072B1 - High functional Adhesive resin composition of Solvent-free type Thermal polymerization and Preparing thereof - Google Patents

Abstract

The present invention relates to a solvent-free thermal polymerization high-functional adhesive resin and a method for producing the same, more specifically, to an adhesive resin prepared by thermal polymerization using an acrylic monomer, by adding a polymerization retardant during thermal polymerization, Controlled, but the polymerization retardant is selected from 2,2,6,6-tetramethylpiperidine-1-oxyl, 2,4-diphenyl-4-methyl-1-pentene, thioglycolic acid, and β-terpinene. Provided is a solvent-free thermal polymerization high-functional adhesive resin, characterized in that at least one selected and a method for producing the same.

Description

High functional adhesive resin composition of Solvent-free type Thermal polymerization and Preparing}

The present invention relates to a solvent-free thermal polymerization high functional adhesive resin and a method for producing the same, and more particularly, to a high functional adhesive adhesive having a high adhesiveness as well as a shock absorber and a manufacturing method thereof.

 Acrylic adhesive is high permeability, easy to adjust adhesive force, and easy to process, so it is used in the IT industry such as smart phone, tablet phone, semiconductor wafer processing adhesive sheet as well as medical tape, and is used throughout the industry. One.

Here, the adhesive agent may be regarded as an intermediate form of the adhesive and the adhesive, and may be regarded as a state in which the user can intentionally detach from the adhesive state as an intermediate form having a higher adhesive strength than the conventional adhesive and lower adhesive strength than the adhesive.

Methods prepared by conventional techniques include emulsion polymerization, suspension polymerization, bulk polymerization, solution polymerization, etc., but have disadvantages in that it is difficult to remove the solvent and water used. In addition, there is a problem of explosion satellite or air pollution caused by the vapor when removing the solvent and water.

 In Korea, the use of solvent-free adhesives is required due to tightening environmental regulations and improving the working environment.

 In preparing such a solvent-free thermal polymerization high-functional adhesive resin, there is a method using thermal polymerization and photopolymerization using UV.

In the method using thermal polymerization, molecular weight can be easily controlled to prepare high molecular weight adhesive resins, and thus may exhibit high mechanical properties such as heat resistance and abrasion resistance, but there is a risk of explosion due to the difficulty in controlling temperature during polymerization due to high reaction heat. UV photopolymerization is a reaction using UV instead of heat, and the heat of reaction is relatively small, so it is easy to control heat generation and the reaction time is short. However, it is difficult to obtain an expensive device and to have a low yield and high molecular weight.

Accordingly, the development of an adhesive resin that can be produced by using the advantages of thermal polymerization and photopolymerization is required.

Patent Document 1: Korean Registered Patent No. 0877347 Patent Document 2: Korean Registered Patent No. 0817925 Patent Document 3: Korean Registered Patent No. 0727219

In order to solve the above problems, an object of the present invention is to provide a solvent-free thermal polymerization high-functional adhesive resin containing no solvent or water.

Another object of the present invention is to synthesize a point adhesive resin having a yield (solid content) of 50% or more in preparing a solvent-free thermal polymerization high functional adhesive resin.

Still another object of the present invention is to provide a solvent-free thermal polymerization high functional adhesive resin for IT industries such as adhesive sheets for smartphones or tablet phones, adhesive sheets for semiconductor wafer processing.

Still another object of the present invention is to provide a solvent-free thermal polymerization high functional adhesive resin that can be used for medical purposes.

In order to achieve the above object, the present invention is an adhesive resin produced by thermal polymerization using an acrylic monomer, by controlling the solid content of the resin by adding a polymerization retardant during thermal polymerization, the polymerization retardant 2,2,6 Solvent-free thermal polymerization high functionality, characterized in that at least one selected from, 6-tetramethylpiperidine-1-oxyl, 2,4-diphenyl-4-methyl-1-pentene, thioglycolic acid, and β-terpinene Provide adhesive resin.

According to the present invention, the thermal initiator is added during the thermal polymerization, wherein the thermal initiator is dibenzoyl peroxide, didecanoyl peroxide, dilauroyl peroxide, acetyl peroxide, butyl peroxy pivalate 2, Solvent thermal polymerization high, characterized in that at least one selected from 4-azobis 2,4 dimethylvaleronitrile, azobis isobutyronitrile, dibutylcyclohexyl peroxy dicarbonate, dimethoxybutyl peroxy dicarbonate Provide functional adhesive resin.

Further, according to the present invention, there is provided a solvent-free thermal polymerization high-functional adhesive resin, characterized in that the photopolymerization is carried out after the thermal polymerization.

According to the present invention, a photoinitiator is added during the photopolymerization, wherein the photoinitiator is benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin n-butyl ether, benzoin isobutyl ether, acetophenone , Dimethylanino acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 2-hydroxy-2-methyl-1-phenylpropane-1one, 1-hydroxycyclohexylphenyl ketone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-propan-1-one, 4- (2-hydroxyethoxy) phenyl-2- (Hydroxy-2-propyl) ketone, benzophenone, p-phenylbenzophenone, 4,4'-diethylaminobenzophenone, dichlorobenzophenone, 2-methylanthraquinone, 2-ethylanthraquinone, 2-t- Butyl anthraquinone, 2-aminoanthraquinone, 2-methyl thioxanthone, 2-ethyl thioxanthone, 2-chloro thioxanthone, 2,4-dimethyl thioxanthone, 2,4-diethyl thioxanthone, benzyldimethyl Ketal, aceto Phenone dimethylketal, p-dimethylamino benzoic acid ester, oligo [2-hydroxy-2-methyl-1- [4- (1-methylvinyl) phenyl] propanone] and 2,4,6-trimethylbenzoyl-diphenyl -Provides a solvent-free thermal polymerization high functional adhesive resin, characterized in that at least one of the phosphine oxide.

In addition, according to the present invention, by mixing the acrylic monomer and the thermal initiator is prepared by thermal polymerization, the reaction temperature during the thermal polymerization is 30 ~ 50 ℃, by adjusting the solid content of the resin by adding a polymerization delay, The polymerization retardant is selected from at least one of 2,2,6,6-tetramethylpiperidine-1-oxyl, 2,4-diphenyl-4-methyl-1-pentene, thioglycolic acid and β-terpinene. It provides a method for producing a solvent-free thermal polymerization high-functional adhesive resin, characterized in that.

In addition, according to the present invention, the reaction temperature in the thermal polymerization step provides a method for producing a solvent-free thermal polymerization high-functional adhesive resin, characterized in that 30 ~ 50 ℃.

In addition, according to the present invention, the polymerization retardant provides a method for producing a solvent-free thermal polymerization high-functional adhesive resin, characterized in that 0.01 to 0.3 parts by weight with respect to 100 parts by weight of the acrylic monomer.

In addition, according to the present invention, after the thermal polymerization is carried out a step of mixing the photoinitiator and photopolymerization, the photopolymerization is provided by a UV irradiation provides a method for producing a solvent-free thermal polymerization high-performance adhesive adhesive resin. .

Solvent thermal polymerization high functional adhesive resin production method according to the present invention is to be able to increase the high yield, which is easy to use in various applications such as functional tapes, high-functional solvent-free adhesive adhesive can be manufactured in slim type tape A small amount of bezeling, which is a recent trend in display products, is possible, and special purpose tapes can be manufactured, such as adhesive sheets for processing semiconductor wafers.

In addition, the solvent-free thermal polymerization high functional adhesive resin according to the present invention is easy to apply to medical adhesive tape products with excellent waterproofness and biocompatibility.

In addition, the present invention can be prepared using a solvent-free thermal polymerization high-functional adhesive resin that can obtain a high molecular weight and yield by using thermal polymerization and UV photopolymerization continuously.

Figure 1 shows a manufacturing process of a solvent-free thermal polymerization high functional adhesive resin according to an embodiment of the present invention.
Figure 2 shows an apparatus for manufacturing a solvent-free thermal polymerization high functional adhesive resin in accordance with an embodiment of the present invention.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. First, it should be noted that in the drawings, the same components or parts denote the same reference numerals as much as possible. In describing the present invention, detailed descriptions of related well-known functions or configurations are omitted in order not to obscure the subject matter of the present invention.

As used herein, the terms “about”, “substantially”, and the like, are used at, or in close proximity to, numerical values when manufacturing and material tolerances inherent in the meanings indicated are intended to aid the understanding of the invention. Accurate or absolute figures are used to assist in the prevention of unfair use by unscrupulous infringers.

Figure 1 shows a manufacturing process of a solvent-free thermal polymerization high functional adhesive resin according to an embodiment of the present invention. Figure 2 shows an apparatus for manufacturing a solvent-free thermal polymerization high functional adhesive resin in accordance with an embodiment of the present invention.

Solvent-free thermal polymerization high-functional adhesive resin of the present invention can be prepared through the material preparation, thermal polymerization step and further photopolymerization step.

To prepare a monomer and a thermal initiator for thermal polymerization, the monomer may be an acrylic monomer.

That is, the acrylic resin is prepared by copolymerizing the acrylic monomer with the thermal initiator.

The high functional adhesive is prepared to have an acrylic backbone structure containing a carboxyl group.

The solid content of the acrylic resin produced through thermal polymerization is preferably 20 to 80% by weight, more preferably 30 to 60% by weight based on the total weight of the acrylic resin.

If the solid content is less than 20% by weight, there is a limit in controlling the thickness of the adhesive and the solvent selection. If the solid content is more than 80% by weight, it is difficult to control the viscosity of the adhesive, which is not preferable because of poor workability such as coating. Therefore, in the production of the acrylic resin, the solid content of the acrylic resin is more preferably in the range of 20 to 80% by weight, preferably 30 to 60% by weight.

The acrylic resin has an acid value of 3 to 40, a weight average molecular weight of 200,000 to 1,500,000, a solid content of 30 to 60 parts by weight, and a glass transition temperature of -75 to 0 ° C. using an acrylic monomer that is generally used. Acrylic resin which has a phosphorus characteristic value can be synthesize | combined.

If the acid value of the acrylic resin (Acid value) is less than or equal to 3, there is a deterioration of overall coating properties due to lack of chemical bonds during the curing reaction, and if the acid value exceeds 40, water resistance may become weak. Therefore, the acid value is preferably in the range of 3 to 40.

If the weight average molecular weight of the acrylic resin is 200,000 or less, the molecular weight decreases, and the mechanical property of the adhesive coating and the waterproofness are weakened. If the weight average molecular weight exceeds 1,500,000, the workability is weak due to the limitation of proper viscosity control of the adhesive agent. . Therefore, the weight average molecular weight is preferably 200,000 to 1,500,000.

 If the glass transition temperature of the acrylic resin is less than 75 ° C it is difficult to maintain the cohesive force of the adhesive film and the monomer selection is not easy, the resin synthesis is difficult, and when the glass transition temperature exceeds 0 ° C it is difficult to exhibit the adhesive properties. Therefore, the glass transition temperature of the acrylic resin is preferably -75 ℃ to 0 ℃.

Acrylic monomers used in the acrylic resins are alkyl acrylates and butyl methacrylates such as ethyl acrylate, butyl acrylate, amyl acrylate, 2-ethylhexyl acrylate, octyl acrylate, cyclohexyl acrylate, benzyl acrylate, and the like. Methacrylic acid alkyl esters, such as 2-ethylhexyl methacrylate, cyclohexyl methacrylate, benzylhexyl methacrylate, cyclohexyl methacrylate, benzyl methacrylate, methyl acrylate, methyl methacrylate, vinyl acetate , Monomers containing carboxylic acid groups such as styrene, acrylonitrile, acrylic acid, methacrylic acid, maleic anhydride, itaconic acid, 2-hydroxyethyl (meth) acrylate, 4-hydroxy butyl acrylate, 2 Hydroxy groups such as hydroxypropyl (meth) acrylate It is preferable to use the monomer containing N, methyl- acrylamide, acrylamide, methacrylamide, glycidylamide, etc. individually or in mixture. In addition, lauryl acrylate, ethoxydiethylene glycol acrylate, methoxy triethylene glycol acrylate, phenoxyethyl acrylate, tetrahydrofuryl acrylate, isobornyl acrylate, 2-hydroxyethyl Single functional acrylates, such as acrylate, 2-hydroxypropyl acrylate, and 2-hydroxy-3- phenoxy acrylate, neopentyl glycol diacrylate, 1, 6- hexanediol diacrylate, and trimethylol propane tree Acrylic acid derivatives, such as polyfunctional acrylates, such as acrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol hexaacrylate, and trimethylol propane acrylate, 2-ethylhexyl methacrylate, n- Stearyl methacrylate, cyclohexyl methacrylate, tetrahydro Single-functional methacrylates such as furfuryl methacrylate, 2-hydroxyethyl methacrylate, 2-hydroxybutyl methacrylate, 1,6-hexanediol dimethacrylate, trimethylolpropane trimethacrylate, Monomers or oligomers such as methacrylic acid derivatives such as polyfunctional methacrylates such as glycerin dimethacrylate, urethane acrylates such as glycerin dimethacrylate hexamethylene diisocyanate and pentaerythritol triacrylate hexamethylene diisocyanate alone or It is also possible to mix and use.

Meanwhile, thermal initiators used in the thermal polymerization of the present invention include dibenzoyl peroxide, diedecanoyl peroxide, dilauroyl peroxide, acetyl peroxide and butyl peroxy pivalate 2,4-azobis 2,4 At least one selected from the group consisting of dimethylvaleronitrile, azobis isobutyronitrile, dibutylcyclohexyl peroxy dicarbonate, dimethoxybutyl peroxy dicarbonate, and the like.

The thermal initiator is preferably mixed with 0.1 to 0.5 parts by weight based on 100 parts by weight of the acrylic monomer.

The acrylic resin may be prepared by thermal polymerization by mixing an acrylic monomer and a thermal initiator, by minimizing the reaction heat generated when the reaction proceeds at a relatively low temperature and controlling the termination of the reaction, the yield and molecular weight may be increased. To be.

It is preferable that it is 25-90 degreeC, and, as for reaction temperature required for acrylic resin manufacture at the time of thermal polymerization, it is more preferable that it is 30-50 degreeC.

If the reaction temperature is lower than 25 ℃, it is too low to control the reaction at room temperature (25 ℃), and if it exceeds 90 ℃, there is a risk of explosion of unreacted monomers and explosion due to rapid vaporization during reaction. .

In addition, the present invention is characterized by further mixing the polymerization retardant in the finishing step of the thermal polymerization.

By adding the polymerization retardant, there is an effect of controlling the exotherm of the reactants and reducing the explosion risk.

In addition, by adding a polymerization retardant to control the solid content of the acrylic resin it can be produced as an adhesive resin, it is possible to control the molecular weight of the reactants and through this it is also possible to control the adhesive strength of the adhesive properties of the desired physical properties can be produced. Do.

In other words, it can be seen that the user can intentionally detach from the adhesive state as an intermediate form that is somewhat higher adhesive strength than the existing adhesive and lower adhesive strength than the adhesive.

The polymerization retardant may be selected from at least one of 2,2,6,6-tetramethylpiperidine-1-oxyl, 2,4-diphenyl-4-methyl-1-pentene, thiocholic acid, and β-terpinene. Can be.

The polymerization retardant is preferably mixed with 0.01 to 0.3 parts by weight based on 100 parts by weight of the acrylic monomer to be mixed.

When the polymerization retardant is less than 0.01 part by weight, reaction control becomes difficult and desired reaction termination is not achieved. In addition, when the polymerization retardant exceeds 0.3 parts by weight, a large amount of the polymerization retardant remaining in the adhesive resin hinders the reaction, or when UV photopolymerization, the UV photopolymerization prevents a smooth reaction.

By using the polymerization retardant, the reaction can be controlled, and the desired adhesive resin can be prepared by adjusting the solid content.

The method using the thermal polymerization can easily control the molecular weight to produce a high molecular weight adhesive resin can exhibit high mechanical properties such as heat resistance, wear resistance.

In addition, the present invention may further perform photopolymerization after the thermal polymerization. The photopolymerization is carried out by adding a photoinitiator when the temperature reaches about 30 ° C. or less after the thermal polymerization finishes with the polymerization retardant.

Photopolymerization can be carried out by irradiating UV. When the temperature is lowered to some extent after thermal polymerization, the photopolymerization is carried out by adding a photoinitiator, mixing by stirring and operating a UV lamp.

As the photoinitiator, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin n-butyl ether, benzoin isobutyl ether, acetophenone, dimethylanino acetophenone, 2,2-dimethoxy-2 -Phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 2-hydroxy-2-methyl-1-phenylpropane-1one, 1-hydroxycyclohexylphenylketone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-propan-1-one, 4- (2-hydroxyethoxy) phenyl-2- (hydroxy-2-propyl) ketone, benzophenone, p- Phenylbenzophenone, 4,4'-diethylaminobenzophenone, dichlorobenzophenone, 2-methylanthraquinone, 2-ethylanthraquinone, 2-t-butylanthraquinone, 2-aminoanthraquinone, 2-methylthioxanthone (thioxanthone), 2-ethylthioxanthone, 2-chlorothioxanthone, 2,4-dimethylthioxanthone, 2,4-diethylthioxanthone, benzyldimethyl ketal, acetophenone dimethyl ketal, p-dimethylamino benzoic acid ester, oligo [2 -Hydroxy-2-methyl-1- [4- (1-methylvinyl) phenyl] propanone] and 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide.

This photopolymerization is advantageous in that the heat of reaction is relatively small compared to the thermal polymerization, so that the exothermic control is easy and the reaction time is short.

By performing photopolymerization after thermal polymerization in this manner, a solvent-free thermal polymerization high-functional adhesive resin having high molecular weight and high yield can be produced.

Hereinafter, the Example and comparative example of this invention are demonstrated in detail.

Example  One

To prepare a resin using the apparatus of Figure 2, 75 parts by weight of 2-ethylhexyl acrylate, 15 parts by weight of normal butyl acrylate in a reactor consisting of a 1L five-necked flask equipped with a stirrer, a water bath, a thermometer, a condenser, 10 parts by weight of acrylic acid was added thereto, and the temperature was raised to 40 ° C. under nitrogen filling. When the temperature was raised, thermal polymerization was carried out by adding 0.1 parts by weight of 2,4-azobis 2,4dimethylvaleronitrile as a thermal initiator and stirring uniformly.

After the progress, 0.01 parts by weight of 2,2,6,6-tetramethylpiperidine-1-oxyl was added to the polymerization retardant, and the reaction was terminated by completing the adhesive polymerization resin.

Example 2

Same as Example 1,

The thermal polymerization reaction was carried out photopolymerization when the temperature inside the reactor is lowered to 25 ℃ or less, 0.2 parts by weight of 1-hydroxycyclohexylphenyl ketone as a photoinitiator was added and the UV lamp was irradiated for 1 minute.

Example 3

The same as in Example 2,

0.1 parts by weight of 2,2,6,6-tetramethylpiperidine-1-oxyl was added as a polymerization retardant to terminate the thermal polymerization reaction.

Example 4

The same as in Example 2,

0.3 parts by weight of 2,2,6,6-tetramethylpiperidine-1-oxyl was added as a polymerization retardant to terminate the thermal polymerization reaction.

Comparative Example 1

Into a reactor composed of a 1L five-necked flask equipped with a stirrer, a water bath, a thermometer, and a condenser, 75 parts by weight of 2-ethylhexyl acrylate, 15 parts by weight of normal butyl acrylate, and 10 parts by weight of acrylic acid were put in an acrylic monomer at 70 ° C. It heated up as. When the temperature was raised, 0.1 parts by weight of 2.2-azobisisobutyronitrile was added thereto, followed by thermal polymerization by uniformly stirring.

That is, a resin was prepared by terminating the reaction, but the resin was completed by thermal polymerization, but without adding a polymerization delay agent.

Comparative Example 2

75 parts by weight of 2-ethylhexyl acrylate, 15 parts by weight of normal acid, 10 parts by weight of acrylic acid, and 1-hydroxycyclohexylphenyl ketone as photoinitiator in a reactor composed of a 1 L five-necked flask equipped with a stirrer and a condenser. Part by weight was added and stirred sufficiently under nitrogen filling. Thereafter, the copolymer was polymerized by irradiating a UV lamp (Black light 18W) installed outside the flask. That is, the resin was prepared using only photopolymerization.

Property measurement method

1. Yield, solid content (unit:%)

 Using a 5ml pipette, take a sample of about 1ml, weigh it in a 10ml beaker, dry it for 30 minutes in an oven at 150 ° C, remove the unreacted monomer, and take out the weight of the remaining sample by weight.

Solid content% = (mass of dry sample / initial mass of sample) × 100

2. Viscosity (cps)

Measured by Brookfield Viscometer (model: DV-II + VISVOMETER) at 25 ℃

3. Molecular Weight

The adhesive was dried in the oven and dissolved in tetrahydrofuran and measured using Water Permanent Gas Permeation Chromatography (GPC).

Example 1 Example 2 Example 3 Example 4 Comparative Example 1 Comparative Example 2 Yield, Solids (%) 50 54 56 57 32 28 Viscosity (cps) 72,580 74,400 75,420 75,540 8,690 10,500 Molecular Weight
(g / mol) Number average molecular weight (Mn) 410,540 420,500 428,320 428,900 34,430 252,800 Weight average molecular weight (Mw) 830,252 852,281 857,250 860,530 520,200 380,100

It can be seen that the adhesive resins of Examples 1 to 4 have higher viscosity and molecular weight than Comparative Examples 1 and 2.

The present invention described above is not limited to the above-described embodiment and the accompanying drawings, and various substitutions, modifications, and changes are possible within the scope without departing from the technical spirit of the present invention. It will be evident to those who have the knowledge of.

Claims (8)

As an adhesive resin produced by thermal polymerization using an acrylic monomer,
During thermal polymerization, the solid content of the resin is controlled by adding a polymerization retardant,
The solid content is 30 to 60% by weight relative to the total weight of the resin,
The polymerization retardant is characterized in that at least one selected from 2,2,6,6-tetramethylpiperidine-1-oxyl, β-terpinene,
Add thermal initiator during the thermal polymerization,
The thermal initiators are dibenzoyl peroxide, didecanoyl peroxide, dilauroyl peroxide, acetyl peroxide, butyl peroxy pivalate 2,4-azobis 2,4dimethylvaleronitrile, azobis isobutyro At least one selected from nitrile, dibutylcyclohexyl peroxy dicarbonate, dimethoxybutyl peroxy dicarbonate,
After the thermal polymerization is characterized in that the photopolymerization to produce,
Add photoinitiator at the time of photopolymerization,
The photoinitiator is benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin n-butyl ether, benzoin isobutyl ether, acetophenone, dimethylanino acetophenone, 2,2-dimethoxy-2- Phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, 2-hydroxy-2-methyl-1-phenylpropane-1one, 1-hydroxycyclohexylphenylketone, 2-methyl-1- [ 4- (methylthio) phenyl] -2-morpholino-propan-1-one, 4- (2-hydroxyethoxy) phenyl-2- (hydroxy-2-propyl) ketone, benzophenone, p-phenyl Benzophenone, 4,4'-diethylaminobenzophenone, dichlorobenzophenone, 2-methylanthraquinone, 2-ethylanthraquinone, 2-t-butylanthraquinone, 2-aminoanthraquinone, 2-methylthioxanthone ( thioxanthone), 2-ethyl thioxanthone, 2-chloro thioxanthone, 2,4-dimethyl thioxanthone, 2,4-diethyl thioxanthone, benzyl dimethyl ketal, acetophenone dimethyl ketal, p-dimethylamino benzoic acid ester, oligo [ 2- Solvent-free characterized in that at least one selected from hydroxy-2-methyl-1- [4- (1-methylvinyl) phenyl] propanone] and 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide Polymeric high functional adhesive resin.
delete delete delete It is prepared by thermal polymerization by mixing an acrylic monomer and a thermal initiator,
In the thermal polymerization, the reaction temperature is 30 to 50 ° C., and the solid content of the resin is controlled by adding a polymerization delay agent,
The solid content is 30 to 60% by weight relative to the total weight of the resin,
The polymerization retardant is characterized in that at least one selected from 2,2,6,6-tetramethylpiperidine-1-oxyl, β-terpinene,
In the thermal polymerization step, the reaction temperature is characterized in that 30 ~ 50 ℃,
The polymerization retardant is characterized in that for mixing 0.01 to 0.3 parts by weight with respect to 100 parts by weight of the acrylic monomer,
After the thermal polymerization is carried out a step of photopolymerizing by mixing the photoinitiator,
The photopolymerization is a method for producing a solvent-free thermal polymerization high-performance adhesive resin, characterized in that carried out by irradiation with UV.
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