KR102036303B1 - Multiple backup device for semiconductor manufacturing system - Google Patents

Abstract

The present invention provides a multiple backup device for a semiconductor manufacturing apparatus, which comprises: a RAID engine processing data input/output operations with respect to at least one connected storage means; a storage unit including a plurality of storage means; a switching unit selectively connecting a specific storage means to the RAID engine; and an MCU engine capable of combining a first storage means and a second storage means in a RAID manner or controlling the first storage means to back up to a third storage means. The semiconductor manufacturing apparatus and the multiple backup device may be wired by an extension cable.

Description

MULTIPLE BACKUP DEVICE FOR SEMICONDUCTOR MANUFACTURING SYSTEM}

The present invention relates to a multiple backup device for backing up data stored in any storage means to a plurality of different storage means.

A device for manufacturing a semiconductor requires various data such as temperature, time, pressure, heat, etc. in order to uniformize the quality of the semiconductor, and such data obtained in real time is always fed back in real time to manufacture a semiconductor of constant quality. It is utilized in manufacturing process.

In addition, the semiconductor manufacturing apparatus may be stopped for maintenance, or may be stopped due to a sudden power failure. In such a case, if data is not stored safely, the semiconductor manufacturing apparatus may be uniformly maintained under the same conditions as before. Quality semiconductors cannot be manufactured. Therefore, the semiconductor manufacturing apparatus is provided with a storage device (for example, hard disk, SSD, etc.) for securely storing data generated during the process at any time. However, because the storage device frequently stores or outputs data, the storage device itself is likely to fail. If the storage device fails, the data stored therein cannot be used, which causes a lot of difficulties in maintaining the semiconductor manufacturing process.

In order to solve such a disadvantage, the conventional semiconductor manufacturing apparatus combines a plurality of independent storage devices in a RAID (Redundant Array of Independant Disks) method, and stores the data distributed or mirrored thereto.

This storage method is as shown in Figure 1 (a), through the RAID controller (1) to connect two storage devices (3), and to the two storage devices, one continuous power (4) have. Therefore, the process data entered through the input / output port 3 is stored in the same (or distributed) to the two storage devices through the RAID controller.

However, even if you use a RAID controller to store data on two storage devices, that is, a main storage device and a secondary storage device at the same time, there is no hardware or software defect in the semiconductor manufacturing device. If this occurs, the H / W or S / W defects may occur in the storage device, and the semiconductor manufacturing device may eventually stop.

In order to overcome this problem, in Korean Patent Laid-Open No. 10-2016-0003393, as shown in FIG. 1 (b), input / output for receiving data from or outputting data to a semiconductor manufacturing apparatus is shown. An output port 10, a plurality of storage devices 20 including a main storage device and a backup storage device, and between the input / output port 10 and the plurality of storage devices 20; RAID 30 for controlling a storage device, a power line 40 for supplying power to the plurality of storage devices 20, and a clock controller 50 for controlling the operation of a storage device selected from the plurality of storage devices. A semiconductor process data storage device is disclosed.

In particular, the semiconductor process data storage device is configured such that the power line 40 is directly connected to a main storage device among a plurality of storage devices 20, and power is connected to a remaining backup storage device through a clock controller. have.

In this configuration, power is usually connected and operated to the main storage and only one backup storage, and the remaining backup storage is not powered. Every time, or whenever the backup selection switch 50 is pressed, any one of the backup storage devices is activated to back up the process data.

However, the semiconductor process data storage device also has the difference that the number of storage devices connected in a RAID manner can be increased and selectively activated, which is not different from the RAID storage method using the two disks.

That is, since the operating system of the semiconductor manufacturing apparatus may not be booted or booted using the backup storage device which is backed up by the RAID method, the main storage device may not be coped with.

Therefore, there is a need for an improved backup system that can safely protect data in the main storage device and also allow the semiconductor manufacturing device to immediately operate normally even if the main storage device is damaged.

The present invention is directed to providing an improved backup apparatus in accordance with the above-described needs. To this end, it is intended to provide a multiple backup device capable of driving a semiconductor manufacturing apparatus by replacing the main storage device by simultaneously backing up the main storage device while simultaneously storing data of the main storage device in a RAID manner.

According to an aspect of the present invention, there is provided a multiple backup device including: a RAID engine processing data input / output operations for at least one connected storage means; First storage means for storing data used to operate the semiconductor manufacturing apparatus, second storage means coupled to the first storage means in a RAID manner, and the first storage means are sector-sector by sector. a storage unit including a third storage means backed up in a sector) manner; A switching unit for selectively connecting the second storage means or the third storage means to the RAID engine; In the case where the first storage means and the second storage means are to be combined in a RAID manner, the switching unit is controlled to connect the second storage means to the RAID engine and RAID data of the first storage means is stored. Instruct the RAID engine to store in the second storage means in a controlled manner; If the first storage means is to be backed up to the third storage means, the switching unit is controlled to connect the third storage means to the RAID engine, and the first storage means is sector-sector-based. 3 instruct the RAID engine to back up to a storage means; And when the backup is completed, controlling the switching unit to disconnect the third storage means from the RAID engine and to connect the second storage means to the RAID engine, and to convert the data of the first storage means into a RAID scheme. And an MCU engine for instructing the RAID engine to store in the second storage means.

The apparatus may further include a power supply unit receiving power from the semiconductor manufacturing apparatus and supplying power to each of the multiple backup devices. The MCU engine may control the power supply unit to stop supplying power applied to the third storage means when disconnecting the third storage means from the RAID engine.

In addition, when executing the backup, the MCU engine controls the switching unit to allow the third storage unit and the RAID engine to connect, and then controls the power supply unit to power the third storage unit. Can be supplied.

The power supply unit may include a plurality of power devices connected to a 5V power terminal of the semiconductor manufacturing apparatus and output a constant voltage or a constant current, wherein the first storage means receives power from one power device, and The second and third storage means can be coupled to one other power element in parallel and selectively powered.

In addition, the multiple backup device according to another embodiment of the present invention, the first memory for storing the first software for controlling the operation of the RAID engine; And a second memory in which second software for controlling the operation of the MCU engine is stored, wherein the MCU engine executes the backup at a specific period set in the second software.

Further, the second storage means is used for the purpose of backing up the first storage means in a sector-sector manner, and the MCU engine is configured to backup the second storage means and the third storage means in different periods. The first storage means can be backed up.

In addition, it may further include a manual operation switch for executing the backup immediately.

Further, the second storage means is used for the purpose of backing up the first storage means in a sector-sector manner, and the MCU engine automatically backs up the first storage means to the second storage means every specific period. And, when the manual operation switch is operated, it is possible to immediately back up the first storage means to the third storage means.

In addition, the RAID engine, upon the backup, the entire format of the third storage means, and backs up the first storage means to the third storage means in a sector-sector manner, and examines the bad sector of the third storage means. Parity can be checked against the data being backed up.

In addition, a multi-backup device according to another embodiment of the present invention, the case of the type that can be inserted into the component mounting tray provided in the semiconductor manufacturing apparatus-when the case is inserted into the tray, provided in the tray A first up terminal and a second up terminal, which may be coupled to a data terminal and a power terminal, respectively; a down connector that may be coupled to an external connection of the RAID engine; and the external connection is a data input / output terminal connected to a RAID engine. And a power receiving terminal connected to a power supply unit, wherein the down connector includes a first down terminal connected to the data input / output terminal and a second down terminal connected to the power receiving terminal-and the first up terminal. A wireline extending to connect to the first downward terminal and to connect the second upward terminal to the second downward terminal The extended interface provided with a table may be further included.

According to the multiple backup device for a semiconductor manufacturing apparatus according to the present invention having the configuration as described above, the function of storing the data of the first storage device in a RAID method, and the first storage by backing up the first storage device exactly the same It is possible to provide the function of maintaining a storage device which can completely replace the device.

Therefore, it is possible to safely store data of the first storage device in the second and third storage devices in general, and if the first storage device is damaged, the first storage device can be replaced by the third storage device. The device can operate normally using the third storage device.

In addition, the multiple backup device according to the present invention can provide a variety of backup scheme, it is possible to utilize the data backup function according to the site situation.

Further various functions and effects may be implemented as disclosed in the detailed description below.

1 (a) and 1 (b) show a data storage device according to the prior art.
2 is a diagram illustrating a schematic configuration of a multiple backup device according to an embodiment of the present invention.
3 is a diagram for describing various operation modes that may be implemented in multiple backup devices according to an embodiment of the present invention.
4 is a diagram illustrating in detail the configuration of a power supply unit of a multiple backup device according to an exemplary embodiment of the present invention.
5 is a diagram illustrating an interface configuration for connecting the multiple backup device of the present invention to a semiconductor manufacturing apparatus.

Hereinafter, exemplary embodiments of a multiple backup device according to the present invention will be described with reference to the accompanying drawings. For reference, terms referring to each component of the present invention are named by way of example in consideration of their functions, and thus, the technical contents of the present invention should not be predicted and limited by the term itself.

First, a schematic configuration of a multiple backup device according to an embodiment of the present invention will be described with reference to FIG. 2.

The semiconductor manufacturing apparatus 100 may include various sub-devices for manufacturing a semiconductor and a computer system for driving and controlling the sub-devices. The semiconductor manufacturing apparatus 100 may be booted and initialized using operating system driving data stored in a specific storage means (for example, the first storage means of the present invention), and may be connected using software and data stored therein. A plurality of sub-devices are operated to perform a semiconductor manufacturing process. In addition, various data provided from a plurality of subordinate devices may be stored.

On the other hand, in the drawings, the multiple backup device 300 according to an embodiment of the present invention that can be connected to the semiconductor manufacturing apparatus 100 is a RAID engine 310, MCU engine 320, switching unit 330, storage The unit 340 and the power supply unit 360 are included.

First, the multiple backup device 300 of the present invention may include a storage unit 340 having at least three storage means (first to third storage means). Each storage means is preferably a high-capacity, high-speed storage means such as a hard disk or SSD, and may include all other storage means.

The first storage means 341 may include data necessary to operate the semiconductor manufacturing apparatus 100 (for example, data for operating an operating system), software for operating a plurality of sub-devices of the semiconductor manufacturing apparatus, a semiconductor manufacturing apparatus, and Data requested by the lower device may be stored. That is, the first storage unit 341 may store an operating system and all important software for booting and initializing the semiconductor manufacturing apparatus 100 and operating respective subordinate devices.

The second storage means 342 may be combined with the first storage means 341 in an arbitrary RAID manner to store data together with the first storage means 341.

The third storage means 343 may be used to back up the first storage means and / or the second storage means in a sector-sector manner.

Meanwhile, the second storage means 342 may also be used for the purpose of backing up the first storage means 341 as in the third storage means 343. In this case, the second storage means 342 and the third storage means 343 may be set such that the backup is executed at different times or the backup is executed according to different commands.

In the description of the present invention, "backing up" means copying all the data of one storage means to another storage means in a sector-sector manner, so that one storage means and the other It means making the storage means exactly the same. When one storage means is completely backed up to the other storage means, the computer operating by booting with the operating system data stored in one storage means is booted in the same manner using the other storage means. It can work.

In the present invention, if a software error is found during backup, the error can be recovered by a recovery algorithm provided to back up the good data in real time, and when the backup is completed, since the storage means is automatically disconnected from the power source, a virus from outside Intrusion of the back is blocked.

On the other hand, the " RAID method " refers to a method of distributing and storing data in each of a plurality of storage means, a RAID 0 method called striping, and a method of storing data in a plurality of storage means exactly the same, and mirroring. It can refer to any of the RAID 1 schemes, also called mirroring. In addition, the RAID method may include other storage methods such as RAID 2/3/4/5/6.

However, the RAID method, particularly the RAID 1 method, mirroring is merely for maintaining the identity of the data. When a software file error such as a virus infection occurs, the data including the file error is mirrored as it is. As a result, even the data of the mirrored storage device is damaged. Therefore, you cannot boot your computer using the mirrored storage device instead of the original storage device, and you cannot use the software stored there.

The RAID engine 310 may process data input / output operations for one or a plurality of storage means communicatively connected. The RAID engine 310 checks the type of the storage means connected, stores the data transmitted according to the data input / output command from the semiconductor manufacturing apparatus 100 in the specific storage means or searches for the requested data from the specific storage means. Read.

In addition, the RAID engine 310 may back up the entirety of a specific storage means to another storage means according to a backup command from the MCU engine 320. In this case, the storage means used for the backup may be determined as a storage means capable of recording data except for a storage means (ie, a first storage means) in which data for operating an operating system is stored among the currently connected storage means, or the MCU engine 320 It may be a storage means specified in).

In particular, when performing a backup operation, the RAID engine 310 stores the data while checking the integrity of the data by formatting the entire backup storage means, checking the bad sectors, checking the parity of the original data and the stored data, and the like. Can be. In addition, if a software error is found, the RAID engine 310 may recover the error by a built-in recovery algorithm and back up the recovered data.

Selectively connecting any storage means to the RAID engine 310 may be made by the switching unit 330. That is, the switching unit 330 may be a multiplexer, and may be connected to the second storage means 342 or the third storage means 343 by the control of the MCU engine 320 or by the request of the RAID engine 310. Allow or release the connection with the RAID engine 310. The switching unit 330 may connect only one of the second storage means 342 and the third storage means 343 to the RAID engine 310 or both to the RAID engine 310 at the same time. That is, the switching unit 330 does not necessarily need to be configured in the form shown in FIG. 2, and may combine two or more switching elements in various ways.

The MCU engine 320 connects or disconnects the third storage means 343 to the RAID engine 310 or connects or disconnects the second storage means 342 to the RAID engine 310. The operation of the switching unit 330 may be controlled.

In addition, the MCU engine 320 may control the RAID engine 310 to store and back up data to any storage means in various modes. For example, the second storage means 342 may be coupled to the first storage means 341 in a RAID manner at all times or when necessary. Also, the second storage means 342 and / or the third storage means 343 may be connected to or disconnected from the first storage means 341 at all times or as necessary for a backup operation. In addition, the MCU engine 320 may control the power supply to the second storage means 342 and / or the third storage means 343, and even to control the power supply to the first storage means 341. You may.

In addition, the MCU engine 320 may execute the backup operation at a cycle set in the dedicated software. In addition, the MCU engine 320 may immediately execute a backup operation in response to a request (for example, a manual operation switch) inputted at an unexpected time.

The MCU engine 320 may support the following modes. This may be referred to FIG. 3.

(1) first mode

In the first mode, the first storage means 341 functions as primary storage means, in which operating system driving data is stored so that the semiconductor manufacturing apparatus 100 can boot to process a semiconductor manufacturing process. The second storage means 342 is combined with the first storage means in any RAID manner (especially, a mirroring manner) to store the data of the first storage means together. The third storage means 343 is used for backup of the first storage means. Naturally, backup here means that all the data is stored in a sector-sector manner to constitute exactly the same storage means. The backup operation to the third storage means 343 may be executed in a cycle set in dedicated software of the MCU engine 320 or may be executed when the manual operation switch 324 is operated.

(2) second mode

In the second mode, the first storage means 341 still function as the main storage means. The third storage means 343 is still used for backup as well. However, in this mode, the second storage means 342 can also be used for backup. To this end, the second storage means is not connected to the first storage means in a RAID manner.

The second storage means 342 and the third storage means 343 may be used for the backup operation in the same period or at different periods. For example, the second storage means 342 may be backed up at a predetermined time period, and the third storage means 343 may be set to back up at a predetermined one period.

(3) third mode

In the third mode, the first storage means 341 still function as the main storage means. Second storage means 342 and third storage means 343 can still be used for backup. Here, the second storage means 342 may be set to execute the backup operation at a predetermined cycle. However, the third storage means 343 may be set to be used for a backup operation that is executed at an unexpected time according to the manual operation switch 324. To this end, the third storage means 343 may not be used for periodic backups.

On the other hand, the MCU engine 320, by controlling the operation of the power supply unit 360, can selectively allow or block the power supply to the first to third storage means (341, 342, 343). For example, among the storage means used for the backup, the power supply may be cut off by the storage means for which the backup operation is not currently performed. As a result, the backup storage means is turned off and is turned off, so that it is completely blocked from external communication and protected from attacks such as hacking and viruses, and also from overvoltage / overcurrent that may be input from the outside. It can be blocked completely, so that physical damage can be completely prevented.

That is, the MCU engine 320 may supply power only to the storage means that needs to be backed up in each operation mode described above, and cut off the power to the storage device in which the backup is completed.

The power supply unit 360 receives power from the semiconductor manufacturing apparatus 100 and supplies appropriate voltage / current to each of the parts constituting the multiple backup device 300 of the present invention. The configuration of the power supply unit 360 as an example will be described in detail with reference to FIG. 4.

The power supply unit 360 may be configured to independently supply or cut off power to the first to third storage means under the control of the MCU engine 320. In addition, the power supply unit 360 may implement functions such as low ripple, noise cancellation, over temperation protection, short circuit protection, short circuit protection, inrush current and transient current removal, constant current supply, and balanced distribution. The circuit module 362 may be configured.

The power supply unit 360 is connected to a 5V power supply terminal of the semiconductor manufacturing apparatus 100 to supply operating power to each of the storage means, and further outputs a 5V voltage to the multiple backup devices 300. Operate the elements. Such elements are, for example, cooling fans, LED / LCD displays, speakers, and the like.

In addition, the power supply unit 360 may be connected to the 12V power supply terminal of the semiconductor manufacturing apparatus 100, and may convert the supplied 12V power into various voltages and supply them to various parts. For example, the 12V voltage may be converted into 4.5V, 3.3V, 1.3V, 1.2V, and the like, and supplied to the above-described elements or required portions of the RAID engine 310 and the MCU engine 320.

Meanwhile, the power supply unit 360 may include power devices Q1 and Q2 having one or two 5V output units. Each power element is operated by a power control signal (for example, provided by a MCU engine) applied to the control inputs (ⓓ, ⓔ) to provide a constant voltage and / or a constant current at each output (ⓐ, ⓑ, ⓒ). You can output

As an example, the first storage means 341 may be coupled to one output unit of the power device Q1 alone. Thus, stable voltage / current can be supplied to the first storage means 341 through the power device Q1 at all times. The power device Q2 may include two output units, and the second storage unit 342 and the third storage unit 343 may be connected to each output unit. As a result, the second storage means 342 and the third storage means 343 may be turned on or off as needed independently of the first storage means 341 under the control of the MCU engine 320. This power control scheme may be applied to the second mode and the third mode. In addition, a switch may be installed in at least one of the outputs of the power device Q2 to separately control the power supply to the second storage means 342 and the third storage means 343.

As another example, the first storage means 341 and the second storage means 342 are simultaneously connected to each of the two output portions of the power element Q2, and the third storage portion is stored at one output portion of the power element Q1. The means 343 may be connected alone. In this connection scheme, power may be continuously supplied to the first storage means 341 and the second storage means 342, and power supply may be individually controlled to the third storage means 343. The power control scheme may be applied to a first mode in which the first storage means 341 and the second storage means 342 operate in a RAID manner and use the third storage means 343 for backup.

In another example, the power supply unit may include three or more power elements, and connect one storage means to each output unit. And by individually controlling the operation of each power device, one storage means can be operated independently.

Alternatively, an arbitrary switch may be added between the output of the power supply unit and each storage means to control the power supply.

Meanwhile, as shown in FIG. 4, the circuit module 362 integrating the same two power devices Q1 and Q2 into one package includes two silicon P-channel MOSFETs, thereby providing power switching and DC-DC converters. It has a small on-resistance, can be used for high power, enables fast switching, and can operate at low drive voltages. In addition, it is possible to eliminate inrush current that may occur when powering the storage means or during operation of the storage means, to respond quickly to transient response, to provide a stable current, and to provide a balanced voltage / current distribution Done.

In another embodiment, the power supply 360 may use a circuit module in which two DC-DC converters are integrated. These circuit modules feature low output ripple and noise, can operate over a wide temperature range, can output a constant voltage over a wide range of input voltages, overcurrent protection, overtemperature protection, undervoltage lockout (LVLO), and short circuits. It is desirable to provide a protective function and a remote on / off function.

The multiple backup device 300 according to the present invention may be connected to the semiconductor manufacturing apparatus 100 through an expansion interface 200 having a wired cable (see FIG. 5). The expansion interface 200 may include a downward connector 230 and may be coupled to an external connection 390 of the multiple backup device, and may be connected to the data terminal of the semiconductor manufacturing apparatus through the first and second upward terminals 211 and 212. 101 and power terminal 102. The first and second upward terminals 211 and 212 may be disposed in a case 210 having a shape conforming to a 2.5 inch or 3.5 inch standard, and the case 210 is provided by the semiconductor manufacturing apparatus 100. When inserted into the tray 110 of an inch or 3.5 inch size, the first and second upward terminals 211 and 212 may be configured to be coupled to the data terminal 101 and the power terminal 102.

By using the expansion interface 200 having a wired cable as described above, even when the semiconductor manufacturing apparatus 100 has only one tray, the multiple backup device 300 according to the present invention uses at least two or more storage means. ) Can be connected and utilized. In addition, regardless of the size of the tray 110, it is possible to implement a multi-backup device 300 in a variety of sizes.

The multiple backup device according to an exemplary embodiment of the present invention having the above-described configuration includes a function of storing data of a first storage device, which is a main storage device, in a RAID manner, and storing the first storage device as a second storage device and / or a second storage device. A sector-sector backup to the third storage device may be provided to completely replace the first storage device. As a result, the data of the first storage device can be safely stored in the second storage device and / or the third storage device normally, and if the first storage device is damaged, the data is transferred to the second storage device and / or the third storage device. 1, the storage device can be completely replaced, and in particular, the semiconductor manufacturing device can operate normally while using all the data that has been created and maintained so far using the third storage device in a backup state.

In addition, the multiple backup device according to the present invention can implement a variety of backup modes, it is possible to provide an optimal data backup function in accordance with a variety of field situations to which the semiconductor manufacturing apparatus is applied.

On the other hand, the multiple backup device according to the present invention can be protected from external influences by supplying power to the storage means on which the backup is to be executed, i.e., the backup storage means is completely cut off while the backup is not executed.

In particular, when executing the backup operation, the MCU engine may control the switching unit to control the power supply unit to supply power after communicatively connecting the designated storage means to the RAID engine. For example, you can power up three seconds after establishing a connection with a RAID engine. By such a time difference, data loss can be prevented and stability can be increased.

In addition, the RAID engine may be provided with a dedicated memory (first memory) 312 in which dedicated software (first software) designed to operate the RAID engine is stored. The first software implements a function of storing data in the first storage means and / or the second storage means and reading the stored data according to a data input / output command provided by the semiconductor manufacturing apparatus. In addition, the first software implements a function of combining the first storage means and the second storage means in a specific RAID manner, and allowing data to be properly distributed or mirrored to the first storage means and / or the second storage means. do. The first software may also perform a sector-sector backup of the first storage means and / or the second storage means to the second storage means and / or the third storage means according to the backup execution command provided by the MCU engine. Implement

In particular, when executing a backup operation, the first software functions to format the entire backup storage means, check the bad sectors, and check and store the integrity of the data by checking the parity of the original data and the stored data. Can be implemented. If necessary, recovery of bad sectors or data may be performed.

In addition, the MCU engine may also be provided with a dedicated memory (second memory) 322 in which dedicated software (second software) designed to operate the MCU engine is stored. The second software, in a predetermined time period, controls the switching unit to connect a predetermined storage means for backup to the RAID engine, and controls the power supply unit to supply power to the storage means, and the RAID engine backs up to the storage means. Instruct the action to run. In addition, when the second software detects that the manual operation switch is operated, the second software controls the switching unit, the RAID engine, and the power supply unit to perform the backup operation as described above.

As such, since the first memory 312 dedicated to the RAID engine and the second memory 322 dedicated to the MCU engine are provided, the stability of the multiple backup device is improved, and the operator can customize the multiple backup device by variously customizing the software. You can use it.

Next, with reference to FIG. 5, the external configuration of the expansion interface for connecting the multiple backup device of the present invention to the semiconductor manufacturing apparatus will be described.

The semiconductor manufacturing apparatus basically includes a component mounting tray 110 into which a storage means (for example, a conventional 2.5 inch or 3.5 inch hard disk or SSD, etc.) can be inserted or mounted. A data terminal 101 for data communication with the storage means and a power terminal 102 for supplying power to the mounted storage means may be arranged.

In addition, the expansion interface 200 of the present invention is for connecting the multiple backup device to the semiconductor manufacturing apparatus, the case 210 of the type that can be mounted on the tray 110 of the semiconductor manufacturing apparatus, and the data of the semiconductor manufacturing apparatus. A first upward terminal 211 coupled to the terminal 101, a second upward terminal 212 coupled to a power terminal 102 of the semiconductor manufacturing apparatus, and a wired cable extending from the first and second upward terminals ( 220 and a downward connector 230 formed at the opposite end of the wired cable and capable of being coupled to an external connection 390 of the multiple backup device.

The down connector 230 may include a first down terminal coupled to the data input / output terminal 391 of the external connection unit 390, and a second down terminal coupled to the power receiving terminal 392.

Meanwhile, at least the data terminal 101 and the first uplink terminal 211 may have a form that conforms to SATA, IDE, and SCSI standards. Also, at least the power terminal 102 and the second uplink terminal may be configured in a form capable of providing voltage and current required by the SATA, IDE, and SCSI standards.

The external connector 390 and the down connector 230 may be in the form of conforming to the above SATA, IDE, SCSI standards or any other form.

If each line included in the wired cable 220 can be directly connected to the target point of the multiple backup device 300 (soldering connection, etc.), the external connection 390 and the down connector 230 of the multiple backup device will be omitted. It may be.

On the other hand, the inside of the case 210, the additional circuit for the purpose of increasing, lowering or stabilizing the voltage / current input from the second upward terminal 212, the purpose of reducing the ripple, noise removal, over-temperature protection, short circuit ( 262 may be disposed. This additional circuit 262 may include, for example, some or all of the components constituting the power supply unit 360 or the circuit module 362.

Indeed, in the spherical semiconductor manufacturing apparatus, the voltage and current supplied from the power terminal 102 may be unstable or short of specifications. In addition, when the voltage / current of the power terminal 102 is supplied to the lower device through the wire cable 220 having a relatively long length, the voltage / current may be lowered due to the internal resistance of the wire cable 220. have. Therefore, in order to stably supply voltage / current to the subordinate device, an additional circuit 262 needs to be provided.

In FIG. 5, the multiple backup device 300 is illustrated and described as being connected to the outside of the semiconductor manufacturing apparatus 100 through the expansion interface 200 in the semiconductor manufacturing apparatus 100. However, the appearance of the multiple backup device 300 is configured to be inserted in accordance with the 2.5-inch or 3.5-inch tray 100 of the semiconductor manufacturing apparatus 100, the external connection 390 of the multiple backup device 300 is a semiconductor manufacturing The extension interface 200 may be unnecessary if it can be coupled to the data terminal 101 and the power terminal 102 of the device 100 as it is.

The embodiments of the present invention described above are merely illustrative of the technical idea of the present invention, and the protection scope of the present invention should be interpreted by the following claims. In addition, various modifications and variations will be possible to those skilled in the art without departing from the essential characteristics of the present invention. All technical ideas within the scope equivalent to the present invention are the present invention. It should be construed as being included in the scope of rights.

Claims (10)

A RAID engine to process data input / output operations to at least one connected storage means;
First storage means for storing data used to operate the semiconductor manufacturing apparatus, second storage means coupled to the first storage means in a RAID manner, and the first storage means are sector-sector by sector. a storage unit including a third storage means backed up in a sector) manner;
A switching unit for selectively connecting the second storage means or the third storage means to the RAID engine;
In the case where the first storage means and the second storage means are to be combined in a RAID manner, the switching unit is controlled to connect the second storage means to the RAID engine and RAID data of the first storage means is stored. Instruct the RAID engine to store in the second storage means in a controlled manner; If the first storage means is to be backed up to the third storage means, the switching unit is controlled to connect the third storage means to the RAID engine, and the first storage means is sector-sector-based. 3 instruct the RAID engine to back up to a storage means; And when the backup is completed, controlling the switching unit to disconnect the third storage means from the RAID engine and to connect the second storage means to the RAID engine, and to convert the data of the first storage means into a RAID scheme. And an MCU engine instructing the RAID engine to store in the second storage means. The method of claim 1,
A power supply unit receiving power from the semiconductor manufacturing apparatus and supplying power to each of the multiple backup devices;
And the MCU engine controls the power supply to stop supplying power to the third storage means when disconnecting the third storage means from the RAID engine. The method of claim 2,
The MCU engine,
In the case of executing the backup, after controlling the switching unit to allow the third storage unit and the RAID engine to be connected, the power supply unit is controlled to supply power to the third storage unit. , Multiple backup devices. The method of claim 2,
The power supply unit,
Is provided with a plurality of power devices connected to the 5V power terminal of the semiconductor manufacturing device for outputting a constant voltage or a constant current,
The first storage means receives power from one power element, and
And said second and third storage means are coupled to one other power element in parallel and can be selectively powered. The method of claim 1,
A first memory in which first software for controlling an operation of the RAID engine is stored;
A second memory in which second software for controlling an operation of the MCU engine is stored;
And the MCU engine executes the backup at a specific period set in the second software. The method of claim 1,
The second storage means is used for the purpose of backing up the first storage means in a sector-sector manner,
The MCU engine, characterized in that to back up the first storage means by connecting the second storage means and the third storage means to the RAID engine in different periods. The method of claim 1,
And a manually operated switch for immediately executing the backup. The method of claim 7, wherein
The second storage means is used for the purpose of backing up the first storage means in a sector-sector manner,
The MCU engine,
Automatically backup the first storage means to the second storage means at a specific period, and
And when said manual control switch is operated, backing up said first storage means immediately to said third storage means. The method of claim 1,
The RAID engine,
During the backup, the third storage means is totally formatted, and the first storage means is backed up to the third storage means in a sector-sector manner. And multiple backup devices. The method of claim 2,
A case that may be inserted into a component mounting tray provided by the semiconductor manufacturing apparatus, wherein the case may include a first upward terminal that may be coupled to a data terminal and a power terminal provided in the tray, respectively, when inserted into the tray; And a second up terminal;
Downward connector that can be coupled to the external connection of the RAID engine-The external connection includes a data input and output terminal connected to the RAID engine and a power receiving terminal connected to the power supply, the down connector is a first downlink connected to the data input and output terminal A terminal and a second downward terminal connected to the power receiving terminal; and
And an extension interface having a wired cable extending to connect the first up terminal to the first down terminal and to connect the second up terminal to the second down terminal. device.

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