KR102031401B1

KR102031401B1 - Method for producing and system for producing optical display device

Info

Publication number: KR102031401B1
Application number: KR1020157003602A
Authority: KR
Inventors: 미끼오 후지이; 히로미쯔 다나까
Original assignee: 스미또모 가가꾸 가부시키가이샤
Priority date: 2012-08-08
Filing date: 2013-08-06
Publication date: 2019-10-11
Also published as: WO2014024867A1; JPWO2014024867A1; CN104520916A; KR20150039773A; TWI582491B; JP5791018B2; CN104520916B; TW201407226A

Abstract

The production system of an optical display device includes the bonding apparatuses 12, 15, and 18 which bond the optical member sheet | seat FX to the optical display components P and PX, and make bonding bodies P11 and P12, and a laser beam irradiation apparatus ( The cutting devices 16 and 19 which have 30 are provided, The said cutting devices 16 and 19 form the optical member FS from the said optical member sheet | seat FX, and the said laser beam irradiation apparatus 30 The plurality of are contained in the optical layer S1 of the said laminated structure toward the cut-out part S between the said opposing part and the excess part Y of the said optical member sheet | seat FX in the said bonding bodies P11, P12. The laser beam L is irradiated with the focus U at the layer S7 closest to the optical display component among the layers of.

Description

Production system and production method of optical display device {METHOD FOR PRODUCING AND SYSTEM FOR PRODUCING OPTICAL DISPLAY DEVICE}

The present invention relates to a production system and a production method of optical display devices such as liquid crystal displays.

This application claims priority based on Japanese Patent Application No. 2012-175963 for which it applied on August 8, 2012, and Japanese Patent Application No. 2013-104402 for which it applied on May 16, 2013, The content here It is used for.

Conventionally, in production systems of optical display devices, such as a liquid crystal display, after optical members, such as a polarizing plate bonded to a liquid crystal panel (optical display component), are cut out from the elongate film by the sheet piece of the size according to the display area of a liquid crystal panel. It is bonded to the liquid crystal panel (for example, refer patent document 1).

[Patent Document 1] Japanese Unexamined Patent Publication No. 2003-255132

However, in the said conventional structure, the sheet piece which is slightly larger than a display area is cut out in consideration of each dimension deviation of a liquid crystal panel and a sheet piece, and the bonding deviation (position shift | offset | position) of the sheet piece with respect to a liquid crystal panel. Therefore, an extra area (liquid edge) is formed in the periphery of the display area, and there is a problem that miniaturization of the device is inhibited.

On the other hand, in patent document 1, the method of cutting out an optical member from an optical member sheet | seat is employ | adopted by the cutting process using a cutter. Moreover, as a method of cutting out an optical member from an optical member sheet | seat, the cutting process using a laser beam is also considered instead of the cutting process using a cutter. The cutting process using a laser beam has a smaller width (tolerance) of the cutting line than the cutting process using a cutlery such as a cutter, and can improve the cutting accuracy. In addition, in this specification, the cutting process using a laser beam may be called "laser cut."

Here, when an optical member sheet | seat contains the structure in which the some optical layer was laminated | stacked, the optical layer may contain the film layer with low average absorption of the laser beam in the oscillation wavelength range of the laser beam irradiated. Hereinafter, in this specification, "the film layer with low average absorption of the laser beam in the oscillation wavelength range of the laser beam irradiated" may be called "low absorption coefficient film layer."

When laser-cutting the optical member sheet | seat in which the several optical layer containing such a low water absorptivity film layer was laminated | stacked, an operator outputs the laser beam more than the laser cut of the optical member sheet | seat which does not contain the low water absorption film layer. It is necessary to cut | disconnect the low water absorption film layer by heat. Therefore, the optical member formed by laser cutting the optical member sheet | seat containing a low water absorption film layer has a problem that the cutting edge part is largely thermally deformed and the effective area of an optical member becomes narrow.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and it is possible to reduce the liquid lead portion around the display area to enlarge the display area and reduce the size of the device, and to suppress thermal deformation of the cut end of the optical member due to laser cut, thereby preventing the optical member. It provides a production system and a production method of an optical display device that can enlarge the effective area of the.

In order to achieve the above object, the present invention employs the following.

(1) The production system of the optical display device of one embodiment of the present invention is a production system of an optical display device formed by bonding an optical member to an optical display component, wherein the display region of the optical display component is formed on the optical display component. The cutting device provided with the bonding apparatus which joins the optical member sheet | seat which is larger and contains the optical layer of a laminated structure to make a bonded body, and the laser beam irradiation apparatus which irradiates the laser beam for cutting processing, The said cutting device is The opposing part of the said optical member sheet | seat and the surplus part of the outer side of the opposing part of the said bonding member are isolate | separated, and the said optical member of the magnitude | size corresponding to the said display area is formed from the said optical member sheet | seat, The said laser beam irradiation apparatus is the said opposing part of the said optical member sheet | seat in the said bonding body. Toward the cutting unit between the excess portion, of the plurality of layers included in the optical layers of the multilayer structure, with a focus on the closest layer to the optical display component, characterized in that the irradiation of the laser light.

According to the said structure, after attaching the optical member sheet larger than the said display area to an optical display component, the excess part of the optical member sheet | seat is isolate | separated, and the optical member of the size corresponding to a display area can be fixed on the surface of an optical display component with high precision. It can be formed, and the liquid margin part outside the display area can be narrowed, and the display area can be enlarged and the device can be miniaturized.

In addition, the cutting using a laser beam is more accurate than the cutting using a cutting blade, and compared with the case of using a cutting blade, the liquid margin part around a display area can be narrowed.

The optical member sheet can be efficiently cut by focusing on the layer closest to the optical display component (generally a low absorption rate film layer) of the optical member sheet, thereby irradiating a laser beam, so that the cut end of the optical member sheet Heat distortion can be suppressed, and the damage of the surface of an optical display component can also be suppressed, and further narrow solution softening of an optical display device can be aimed at.

In addition, "the opposing part with a display area" in the said structure is an area | region below the magnitude | size of the display area more than the magnitude | size of the external shape (contour shape when viewed from a plane) of an optical display component, and an electric component installation part etc. The area avoiding the functional part is shown. That is, the said structure includes the case where laser cuts an excess part along the outer periphery of an optical display component.

In addition, the "size corresponding to a display area" in the said structure is the magnitude | size below the size of the display area more than the magnitude | size of the external shape (contour shape in planar view) of an optical display component, and also in the optical display component It points to the size which avoided functional parts, such as an electrical component installation part.

In addition, the "laser light for a cutting process" in the said structure means that the laser beam irradiated is used for the cutting process of an optical member sheet | seat. In this sense, the cutting may be performed only by irradiation of laser light. In addition, cutting may be performed by irradiation of a laser beam and further another operation.

(2) In the aspect of (1), the laser beam irradiation apparatus may be configured to form a cutting line in which a layer closest to the optical display part is partially cut off and left behind in the cutting portion.

In this case, the damage of the surface of an optical display component can be suppressed effectively compared with the case where a laser cut is completely to the layer closest to an optical display component.

(3) In the aspect of the above (2), the cutting device further has a tearing device, and the tearing device uses the optical portion of the excess portion of the optical member sheet after the cutting device forms the cutting line. The structure which displaces the said optical member sheet | seat in a display component to the said optical display component side in the direction which intersects the bonding surface which bonds, and tears from the said opposing part may be sufficient.

With this configuration, the excess portion can be easily removed by tearing, and peeling of the optical member remaining on the optical display component and separation of the cut end portion can be suppressed.

(4) In any one of said (1)-(3), the said bonding body WHEREIN: The detection part which further detects the outer periphery of the bonding surface of the said optical member sheet | seat and the said optical display component, The said cutting part May be a configuration set along the outer circumference.

The "bonding surface of an optical member sheet | seat and an optical display component" in the said structure refers to the surface which opposes the optical member sheet | seat of an optical display component, and the "outer peripheral edge of a bonding surface" specifically, in an optical display component The outer periphery of the board | substrate of the side by which the optical member sheet was bonded is pointed.

(5) The method for producing an optical display device according to another embodiment of the present invention is a method for producing an optical display device obtained by bonding an optical member to an optical display component, wherein the display of the optical display component is performed on the optical display component. The bonding step of bonding an optical member sheet larger than an area | region and including an optical layer of a laminated structure to make a bonding body, and the outer side of the opposing part with the said display area of the said optical member sheet in the said bonding body, and the outer side of the opposing part The laser beam for cutting is irradiated, focusing on the layer closest to the optical display component among the plurality of layers included in the optical layer of the laminated structure toward the cutout portion between the excess portions, and the opposing portion and the excess portion To form the optical member having a size corresponding to the display area from the optical member sheet. It characterized in that it comprises a single step.

(6) In the aspect (5), the cutting step further includes a laser irradiation step, wherein the laser irradiation step irradiates a laser beam to the cut portion and partially covers a layer closest to the optical display component. The structure which forms the cutting line left by cutting | disconnecting by may be sufficient.

(7) In the aspect of (6), the cutting step further includes a tearing step, and the tearing step includes the excess portion of the optical member sheet after the cutting step forms the cutting line. The structure which displaces to the said optical display component side and tears from the said opposing part in the direction which cross | intersects the bonding surface which bonds the said optical member sheet | seat in an optical display component may be sufficient.

(8) In any one of said (5)-(7), the production system of the said optical display device is a said bonding body WHEREIN: The said bonding member WHEREIN: The said optical member sheet | seat and the said optical display component in the said bonding body. It may further have a detection process which detects the outer periphery of a joining surface, and the said cutting part may be set along the said outer periphery.

According to the present invention, it is possible to reduce the liquid lead portion around the display area to enlarge the display area and reduce the size of the device, and to suppress the thermal deformation of the cut end of the optical member due to the laser cut to increase the effective area of the optical member. Can be.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic block diagram of the film bonding system of the optical display device in embodiment of this invention.
2 is a perspective view around a second cutting device of the film bonding system.
FIG. 3 is a perspective view corresponding to FIG. 2 showing an internal configuration of the second cutting device. FIG.
4 is a perspective view around the second bonding device of the film bonding system.
It is sectional drawing of the 1st bonding sheet in the said film bonding system.
6 is a cross-sectional view of the second bonding sheet around the second cutting device in the film bonding system.
7 is a plan view of a third bonding sheet around the third cutting device in the film bonding system.
8 is a cross-sectional view taken along line AA of FIG. 7.
9 is a cross-sectional view of the double-sided bonding panel through the film bonding system.
10 is a cross-sectional view of a liquid crystal panel and a bonding sheet bonded thereto.
It is sectional drawing of the state which laser-cut the said bonding sheet | seat.
12A is a cross-sectional view of a state in which the bonding sheet is partially cut and left laser cut.
It is sectional drawing at the time of tearing the excess part of the said bonding sheet | seat.
It is a perspective view which shows the image at the time of tearing the excess part of an optical member sheet | seat from an optical display component.
It is a schematic diagram of a 1st detection part which detects the outer periphery of a bonding surface.
It is a schematic diagram which shows the modification of the 1st detection part which detects the outer periphery of the bonding surface.
It is a top view which shows the position which detects the outer periphery of a bonding surface.
It is a schematic diagram of a 2nd detection part which detects the outer periphery of a bonding surface.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described with reference to drawings. In this embodiment, the production method of the optical display device using the film bonding system and film bonding system which comprise a part of production system of an optical display device as a production system of an optical display device is demonstrated. In each figure, an XYZ rectangular coordinate system is set, X direction represents the width direction of an optical display component (liquid crystal panel), Y direction represents the conveyance direction of an optical display component, and Z direction represents the direction orthogonal to an X direction and a Y direction, respectively.

FIG. 1: shows schematic structure of the film bonding system (production system of an optical device) 1 of this embodiment. The film bonding system 1 bonds film-shaped optical members, such as a polarizing film, retardation film, and a brightness rising film, to panel-shaped optical display components, such as a liquid crystal panel and an organic electroluminescent panel, for example. The film bonding system 1 manufactures the optical member bonding body containing the said optical display component and the optical member. In the film bonding system 1, liquid crystal panel P is used as said optical display component. Each part of the film bonding system 1 is integratedly controlled by the control apparatus 20 as an electronic control apparatus.

The film bonding system 1 performs predetermined | prescribed process to liquid crystal panel P sequentially, conveying liquid crystal panel P from a start position to a termination position using the drive-type roller conveyor 5, for example. do. Liquid crystal panel P is conveyed on the roller conveyor 5 in the state which leveled the front and back.

In addition, in the figure, the left side is the conveyance direction upstream side (henceforth panel conveyance upstream side) of liquid crystal panel P, and the right side in the figure is the conveyance direction downstream side (henceforth panel conveyance downstream side) of liquid crystal panel P. Respectively).

7 to 9 together, the liquid crystal panel P has a rectangular shape in plan view, and has a display area P4 having an outer shape along the outer circumference inwardly by a predetermined width than the outer circumference. ). Liquid crystal panel P is conveyed in the direction which made the short side of display area P4 substantially follow a conveyance direction from the panel conveyance upstream rather than the 2nd alignment apparatus 14 mentioned later. In addition, the liquid crystal panel P is conveyed in the direction which made the long side of the display area P4 substantially follow the conveyance direction from the panel conveyance downstream rather than the 2nd alignment apparatus 14.

1st, 2nd and 3rd optical members F11, F12, which were cut out from the elongate 1st, 2nd, and 3rd optical member sheets F1, F2, F3 with respect to the front and back surface of this liquid crystal panel P, F13) is appropriately joined. In this embodiment, on both surfaces of the backlight side and the display surface side of liquid crystal panel P, 1st optical member (optical member, opposing part) F11 as a polarizing film, and 3rd optical member (optical member, opposing part) (F13) is respectively bonded, and the 2nd optical member (optical member, opposing part) F12 as a brightness improving film is further bonded by the 1st optical member F11 on the surface of the backlight side of liquid crystal panel P, respectively. do.

As shown in FIG. 1, the film bonding system 1 carries out alignment of liquid crystal panel P, conveying liquid crystal panel P on the panel conveyance upstream of the roller conveyor 5 from an upstream process. The first alignment apparatus 11, the first bonding apparatus (bonding apparatus) 12 provided in the panel conveyance downstream rather than the 1st alignment apparatus 11, and the agent provided in proximity to the 1st bonding apparatus 12 The 1st cutting device 13 and the 2nd alignment apparatus 14 provided in the panel conveyance downstream rather than the 1st bonding apparatus 12 and the 1st cutting device 13 are provided.

In addition, the film bonding system 1 is provided closer to the 2nd bonding apparatus (bonding apparatus) 15 provided in the panel conveyance downstream rather than the 2nd alignment apparatus 14, and the 2nd bonding apparatus 15. FIG. 2nd cutting device (cutting device) 16, 3rd alignment apparatus 17 provided in panel conveyance downstream rather than 2nd bonding apparatus 15 and 2nd cutting device 16, and 3rd alignment device ( The 3rd bonding apparatus (bonding apparatus) 18 provided in the panel conveyance downstream rather than 17, and the 3rd cutting apparatus (cutting apparatus) 19 provided in proximity to the 3rd bonding apparatus 18 are provided.

The 1st alignment apparatus 11 hold | maintains liquid crystal panel P, and conveys it freely in a vertical direction and a horizontal direction. In addition, the 1st alignment apparatus 11 has a camera (not shown) which image | photographs the edge part of the panel conveyance upstream and downstream of liquid crystal panel P, for example. The imaging data of this camera is sent to the control apparatus 20. The control apparatus 20 operates the 1st alignment apparatus 11 based on the said imaging data and the inspection data of the optical-axis direction previously memorize | stored. In addition, the 2nd and 3rd alignment apparatuses 14 and 17 mentioned later also have a camera, and use the imaging data of this camera for alignment.

The 1st alignment apparatus 11 is operationally controlled by the control apparatus 20, and performs alignment of liquid crystal panel P with respect to the 1st bonding apparatus 12. As shown in FIG. At this time, the liquid crystal panel P has a positioning in a horizontal direction (hereinafter referred to as a component width direction) orthogonal to the conveying direction, and a positioning in a rotational direction around the vertical axis (hereinafter, simply referred to as a rotation direction). Is done. In this state, the liquid crystal panel P is introduced at the bonding position of the first bonding apparatus 12.

The 1st bonding apparatus 12 has the upper surface (backlight side) of liquid crystal panel P conveyed below with respect to the lower surface of the elongate 1st optical member sheet | seat (optical member sheet) F1 introduce | transduced at the bonding position. Bond (see FIG. 5). The 1st bonding apparatus 12 winds up the 1st optical member sheet | seat F1, unwinding the 1st optical member sheet | seat F1 from the 1st disk roll R1 which wound the 1st optical member sheet | seat F1, The upper surface of liquid crystal panel P conveyed by the roller conveyor 5 is bonded by the conveying apparatus 12a conveyed along a longitudinal direction, and the lower surface of the 1st optical member sheet | seat F1 conveyed by the conveying apparatus 12a. A pinching roll 12b is provided.

The conveying apparatus 12a hold | maintains the 1st original roll R1 which wound the 1st optical member sheet | seat F1, and roll holding | maintenance which feeds out the 1st optical member sheet | seat F1 along the longitudinal direction. The protection film pf superposed on the support part 12c and the upper surface of the 1st optical member sheet | seat F1, and were extracted with the 1st optical member sheet | seat F1 in the panel conveyance downstream of the 1st bonding apparatus 12. It has a pf recovery part 12d to collect | recover.

The pinching roll 12b has a pair of bonding rollers arrange | positioned so that axial direction may mutually parallel. A predetermined gap is formed between the pair of bonding rollers. This gap inside becomes a joining position of the 1st bonding apparatus 12. FIG. Liquid crystal panel P and 1st optical member sheet | seat F1 overlap and are introduce | transduced in the said gap. These liquid crystal panel P and the 1st optical member sheet | seat F1 are sent out to a panel conveyance downstream while pinching between the said bonding rollers. By performing such an operation with respect to several liquid crystal panel P sequentially conveyed, the 1st bonding apparatus 12 is a long 1st optical member sheet | seat, with several liquid crystal panel P leaving a predetermined space | interval. The 1st bonding sheet | seat F21 continuously joined to the lower surface of (F1) is formed.

The 1st cutting device 13 is located in the panel conveyance downstream rather than the pf collection part 12d. The 1st cutting device 13 is sheet piece F1S larger than display area P4 (larger than liquid crystal panel P in this embodiment) from the 1st optical member sheet | seat F1 of the 1st bonding sheet | seat F21. ) (See FIG. 6), the predetermined location (between the liquid crystal panels P arranged in the conveyance direction) of the 1st optical member sheet | seat F1 is cut | disconnected over the full width of the said component width direction. Further, the first cutting device 13 may use a cutting blade or a laser cutter. The 1st single-sided bonding panel (optical display component, bonding body) by which the said 1st cutting device 13 bonded the said sheet piece F1S larger than the display area P4 to the upper surface of liquid crystal panel P by the said cutting | disconnection. (P11) is formed (see FIG. 6).

In addition, in the sheet piece F1S, the size (size of the excess part of the sheet piece F1S) protruded to the outer side of liquid crystal panel P is set suitably according to the size of liquid crystal panel P. FIG. . For example, when apply | coating sheet piece F1S to liquid crystal panel P of the medium size of 5 inches-10 inches, one side of the sheet piece F1S and liquid crystal panel in each side of the sheet piece F1S. The space | interval between 1 side of (P) is set to the length of the range of 2 mm-5 mm.

The 2nd alignment apparatus 14 changes direction so that 1st single side bonding panel P11 conveyed in substantially parallel with the short side of the display area P4 may be conveyed in parallel with the long side of the display area P4. do. In addition, the said direction change is made when the optical axis direction of the other optical member sheet | seat bonded to liquid crystal panel P is arrange | positioned at right angle with respect to the optical axis direction of the 1st optical member sheet | seat F1.

The second alignment device 14 performs alignment similar to that of the first alignment device 11. That is, the 2nd alignment apparatus 14 is based on the inspection data of the optical-axis direction memorize | stored in the control apparatus 20, and the imaging data of the said camera, The 1st single-sided bonding panel with respect to the 2nd bonding apparatus 15 ( Positioning in the component width direction of P11) and positioning in the rotation direction are performed. In this state, the 1st single-sided bonding panel P11 is introduce | transduced into the bonding position of the 2nd bonding apparatus 15. As shown in FIG.

The upper surface of the 1st single-sided bonding panel P11 conveyed below with respect to the lower surface of the long 2nd optical member sheet | seat (optical member sheet | seat) F2 introduce | transduced the 2nd bonding apparatus 15 in the bonding position. Backlight side of liquid crystal panel P]. The 2nd bonding apparatus 15 draws the 2nd optical member sheet | seat F2, unrolling the 2nd optical member sheet | seat F2 from the 2nd disk roll R2 which wound the 2nd optical member sheet | seat F2, and Of the 1st single-sided bonding panel P11 which the roller conveyor 5 conveys to the lower surface of the conveying apparatus 15a which conveys along a longitudinal direction, and the 2nd optical member sheet | seat F2 which the conveying apparatus 15a conveys, The pinching roll 15b which joins an upper surface is provided.

The conveying apparatus 15a holds the 2nd disk roll R2 which wound the 2nd optical member sheet | seat F2, and roll hold | maintenance which draws out 2nd optical member sheet | seat F2 along the longitudinal direction. 2nd collection part (tearing apparatus) which is located in the panel conveyance downstream rather than the support part 15c and the pinching roll 15b, and collect | recovers the excess part of the 2nd optical member sheet | seat F2 which passed through the 2nd cutting device 16. Has 15d.

The pinching roll 15b has a pair of bonding rollers arrange | positioned so that axial direction may mutually parallel. A predetermined gap is formed between the pair of bonding rollers. This gap inner side becomes a joining position of the 2nd bonding apparatus 15. FIG. In the gap, the first single-sided bonding panel P11 and the second optical member sheet F2 are overlapped and introduced. These 1st single-sided bonding panel P11 and 2nd optical member sheet | seat F2 are sent out to a panel conveyance downstream, pinching together between the said bonding rollers. By performing such an operation with respect to several 1st single-sided bonding panel P11 carried one by one, respectively, the 2nd bonding apparatus 15 is elongate while several 1st single-sided bonding panel P11 has predetermined space | interval. The 2nd bonding sheet | seat F22 continuously bonded to the lower surface of the 2nd optical member sheet | seat F2 of this is formed.

The 2nd cutting device 16 is located in the panel conveyance downstream rather than the pinching roll 15b. The 2nd cutting device 16 has the 1st optical member sheet | seat F1 which the 2nd optical member sheet | seat F2 and the 1st single-sided bonding panel P11 bonded to the lower surface of the 2nd optical member sheet | seat F2 have. Sheet piece F1S (refer FIG. 6) is cut | disconnected simultaneously. The second cutting device 16 is, for example, a CO ₂ laser cutter. The 2nd cutting device 16 moves the 2nd optical member sheet | seat F2 and the sheet piece F1S along the outer periphery of the display area P4 (in this embodiment, along the outer periphery of liquid crystal panel P). Cut into an endless shape.

The 2nd cutting device 16 cuts each optical member sheet | seat by bonding each optical member sheet | seat F1, F2 to a preferable state, after bonding each optical member sheet | seat F1, F2 to liquid crystal panel P, While the precision of the optical axis direction of F1, F2 becomes high, the shift | offset | difference of the optical axis direction between each optical member sheet | seat F1, F2 is eliminated, and the cutting | disconnection in the 1st cutting device 13 is simplified. The detail of the 2nd cutting device 16 is mentioned later.

The 2nd cutting device 16 cut | disconnects each optical member sheet | seat F1, F2 as mentioned above, and the 1st and 2nd optical member F11, F12 was bonded together on the upper surface of liquid crystal panel P, and was bonded. 2nd single-sided bonding panel (optical display component, bonding body) P12 is formed (refer FIG. 8). At this time, as shown in FIG. 4, in the 2nd bonding sheet | seat F22, the opposing part (each optical member F11, F12) of the 2nd single-sided bonding panel P12 and the display area P4 is cut out. And separated into surplus portions Y and Y 'of each of the optical member sheets F1 and F2 remaining in the frame shape. The surplus portion Y 'of the second optical member sheet F2 is connected in plural to form a ladder shape (see FIG. 4). This surplus part Y 'is wound by the 2nd collection part 15d with the surplus part Y of the 1st optical member sheet | seat F1.

Here, the said "opposing part with display area P4" is an area | region below the magnitude | size of the external shape of liquid crystal panel P more than the magnitude | size of the display area P4, and avoided functional parts, such as an electrical component installation part. Represents an area. In this embodiment, in three sides except the said functional part in rectangular liquid crystal panel P by planar view, the excess part is laser cut along the outer periphery of liquid crystal panel P, and it corresponds to the said functional part. In one side described above, the excess portion is laser cut at a position where the liquid crystal panel P is appropriately drawn from the outer periphery of the liquid crystal panel P to the display region P4 side.

In addition, in this Embodiment, although the structure which cut | disconnected the sheet piece F1S of the 2nd optical member sheet | seat F2 and the 1st optical member sheet | seat F1 simultaneously by the 2nd cutting device 16 was mentioned as the example, it is not limited to this. Instead, there may be a configuration in which only the sheet piece F1S of the first optical member sheet F1 or only the second optical member sheet F2 is cut.

Referring to FIG. 1, the third alignment device 17 inverts the second single-sided bonding panel P12 having the backlight side of the liquid crystal panel P as an upper surface and the display surface side of the liquid crystal panel P as the upper surface. In addition, alignment similar to that of the first and second alignment devices 11 and 14 is performed. That is, the 3rd alignment apparatus 17 is based on the inspection data of the optical axis direction memorize | stored in the control apparatus 20, and the imaging data of the said camera, The 2nd single-sided bonding panel with respect to the 3rd bonding apparatus 18 ( Positioning in the component width direction of P12) and positioning in the rotation direction are performed. In this state, the second single-sided bonding panel P12 is introduced at the bonding position of the third bonding apparatus 18.

The upper surface of the 2nd single-sided bonding panel P12 conveyed below with respect to the lower surface of the elongate 3rd optical member sheet | seat (optical member sheet | seat) F3 introduce | transduced the 3rd bonding apparatus 18 in the bonding position [ Display surface side of liquid crystal panel P]. The 3rd bonding apparatus 18 carries out 3rd optical member sheet | seat F3, unrolling the 3rd optical member sheet | seat F3 from the 3rd disk roll R3 which wound the 3rd optical member sheet | seat F3, and Of the 2nd single-sided bonding panel P12 which the roller conveyor 5 conveys to the lower surface of the conveying apparatus 18a which conveys along a longitudinal direction, and the 3rd optical member sheet | seat F3 which the conveying apparatus 18a conveys, The pinching roll 18b which joins an upper surface is provided.

The conveying apparatus 18a hold | maintains the 3rd disk roll R3 which wound the 3rd optical member sheet | seat F3, and roll holding | maintenance which draws out 3rd optical member sheet | seat F3 along the longitudinal direction. The 3rd recovery part 18d located in the panel conveyance downstream rather than the support part 18c and the pinching roll 18b, and collect | recovers the excess part of the 3rd optical member sheet | seat F3 which passed through the 3rd cutting device 19 Have

The pinching roll 18b has a pair of bonding rollers arrange | positioned so that axial direction may mutually parallel. A predetermined gap is formed between the pair of bonding rollers. This gap inner side becomes a joining position of the 3rd bonding apparatus 18. As shown in FIG. In the gap, the second single-sided bonding panel P12 and the third optical member sheet F3 are overlapped and introduced. These 2nd single-sided bonding panel P12 and 3rd optical member sheet | seat F3 are sent out to a panel conveyance downstream, being pinched between the said bonding rollers. By performing such an operation with respect to several 2nd single-sided bonding panel P12 carried one by one, respectively, the 3rd bonding apparatus 18 is elongate while several 2nd single-sided bonding panel P12 has predetermined space | interval. The 3rd bonding sheet | seat F23 continuously bonded to the lower surface of the 3rd optical member sheet | seat F3 of this is formed.

The 3rd cutting device 19 is located in the panel conveyance downstream rather than the pinching roll 18b, and cuts the 3rd optical member sheet | seat F3. The 3rd cutting device 19 is a laser processing machine similar to the 2nd cutting device 16, and moves the 3rd optical member sheet | seat F3 along the outer periphery of the display area P4 [for example, liquid crystal panel P] Along the outer periphery of

The 3rd cutting device 19 cuts the 3rd optical member sheet | seat F3 as mentioned above, and the double-sided bonding panel by which the 3rd optical member F13 was bonded by the upper surface of the 2nd single-sided bonding panel P12 ( An optical display device) P13 is formed (see Fig. 9). At this time, the third bonding sheet F23 has a third optical member sheet having a double-sided bonding panel P13 and an opposing portion (third optical member F13) between the display region P4 and cut out to remain in a frame shape. The excess portion (not shown) of F3). The excess part of the 3rd optical member sheet | seat F3 continues in multiple like the surplus part Y 'of the 2nd optical member sheet | seat F2, and forms a ladder shape. The surplus portion of the third optical member sheet F3 is wound around the third recovery portion 18d.

The double-sided bonding panel P13 is conveyed to a downstream process after the presence or absence of a defect (bonding defect etc.) is examined through the defect inspection apparatus which is not shown in figure, and another process is performed.

Hereinafter, liquid crystal panel P and each single side bonding panel P11, P12 which join each optical member sheet | seat F1, F2, F3 to the optical member sheet | seat FX, each optical member sheet | seat F1, F2, and F3. The optical display component PX and each of the optical members F11, F12, and F13 may be collectively referred to as an optical member FS.

The polarizer film which comprises the optical member sheet | seat FX is uniaxially stretched, for example, and forms the PVA film dyed with the dichroic dye. However, a polarizer film tends to produce a difference in the optical axis direction in the width direction inner side and the width direction outer side of the optical member sheet FX due to the thickness unevenness of the PVA film at the time of stretching or the uneven dyeing of the dichroic dye.

Therefore, in the film bonding system 1 of this embodiment, 1st alignment is based on the inspection data of the in-plane distribution of the optical axis in each part of the optical member sheet | seat FX memorize | stored in the control apparatus 20 previously. The apparatus 11, the 2nd alignment apparatus 14, and the 3rd alignment apparatus 17 perform the alignment of the optical display component PX bonded to the optical member sheet | seat FX. And the 1st bonding apparatus 12, the 2nd bonding apparatus 15, and the 3rd bonding apparatus 18 bond the optical display component PX to the optical member sheet | seat FX. The optical axis direction may be detected while unwinding the optical member sheet FX, and the optical display component PX may be aligned based on this detection data.

As shown in FIG. 5, the liquid crystal panel P is formed of, for example, a rectangular first substrate P1 formed of a TFT substrate and a similar rectangular agent disposed to face the first substrate P1. 2 substrate P2 and liquid crystal layer P3 enclosed between 1st board | substrate P1 and 2nd board | substrate P2. In addition, hatching of each layer is abbreviate | omitted for the convenience of illustration.

7, FIG. 8, the 1st board | substrate P1 makes three sides of the outer periphery follow the corresponding 3 sides of the 2nd board | substrate P2, and the other 1 side of the outer periphery is 2nd. It protrudes outward from the corresponding one side of the board | substrate P2. Thereby, the electrical component attachment part P5 which protrudes outward rather than the 2nd board | substrate P2 is provided in the said 1 side of 1st board | substrate P1.

6, 8, the 2nd cutting device 16 detects the outer periphery of the display area P4 by the detection part, such as the camera 16a, along the outer periphery of the display area P4, etc. The 1st and 2nd optical member sheets F1 and F2 are cut | disconnected. In addition, the 3rd optical member sheet | seat is along the outer periphery of display area P4, etc., while the 3rd cutting device 19 detects the outer periphery of display area P4 similarly by the detection part, such as camera 19a. (F3) is cut off. Outside the display area P4, a liquid margin portion G having a predetermined width for arranging a sealant or the like for joining the first and second substrates P1 and P2 is provided. Each cutting device 16 and 19 performs a laser cut within the width | variety of this liquid margin part G. As shown in FIG.

When laser-cutting the optical member sheet | seat FX made of resin independently, the cutting edge part of the optical member sheet | seat FX may swell or bend by heat deformation. For this reason, when bonding the optical member sheet | seat FX after a laser cut to the optical display component PX, the bonding defects, such as air mixing and a deformation | transformation, are likely to arise in the optical member sheet | seat FX.

On the other hand, in this embodiment which laser-cuts the optical member sheet | seat FX after bonding the optical member sheet | seat FX to liquid crystal panel P, the cut edge of the optical member sheet | seat FX is the glass surface of liquid crystal panel P. Is backed up. Therefore, in the optical member sheet | seat FX after laser cut, expansion | swelling, bending, etc. of the cutting edge part of the optical member sheet | seat FX hardly arise. Moreover, since it is after bonding to liquid crystal panel P, the said bonding defect is hard to produce.

The deviation width (tolerance) of the cutting line of a laser processing machine is smaller than the tolerance of cutting edges, such as a cutter. Therefore, in the film bonding system 1 of this embodiment, compared with the case where the optical member sheet | seat FX is cut | disconnected using a cutting blade, it is possible to narrow the width | variety of the said liquid margin part G. FIG. As a result, the liquid crystal panel P applied to the film bonding system 1 of this embodiment can be miniaturized and / or the display area P4 can be enlarged. This is effective for application to high-performance mobiles in which the enlargement of the display screen is required while the size of the housing is limited, such as a recent smartphone or tablet terminal.

In addition, when cutting the optical member sheet | seat FX into the sheet piece which matches the display area P4 of liquid crystal panel P, and bonding to liquid crystal panel P, each of the said sheet piece and liquid crystal panel P The dimensional tolerance overlaps with the dimensional tolerance of these relative joint positions. Therefore, it becomes difficult to narrow the width | variety of the liquid edge part G of liquid crystal panel P (it becomes difficult to enlarge a display area).

On the other hand, in the case where the optical member sheet FX is bonded to the liquid crystal panel P and then cut in accordance with the display region P4, only the deviation tolerance of the cutting line may be taken into account. Therefore, in the film bonding system 1 of this embodiment, the tolerance of the width | variety of the liquid edge part G can be made small (± 0.1 mm or less). Also in this point, the width | variety of the liquid edge part G of liquid crystal panel P can be narrowed (expansion of the display area becomes possible).

In addition, in the film bonding system 1 of this embodiment, the optical member sheet | seat FX is cut by the laser beam instead of the blade. Therefore, in the film bonding system 1, the force at the time of cutting | disconnection is not input to liquid crystal panel P, and it becomes difficult to produce a crack and a defect in the edge (edge) of the board | substrate of liquid crystal panel P, and a heat cycle Durability to the back is improved. Similarly, in the film bonding system 1, since it is non-contact with liquid crystal panel P at the time of cutting the optical member sheet | seat FX, there is also little damage to the electrical component attachment part P5. Suppression of damage to liquid crystal panel P by laser cut is mentioned later.

As shown in FIG. 7, when laser-cutting the optical member sheet | seat FX (3rd optical member sheet | seat F3 in FIG. 7), the 3rd cutting device 19 is the display area P4, for example. The time point pt1 of the laser cut is set on the extension of one long side of, and the cutting of the one long side is started first from this time point pt1. Further, the third cutting device 19 sets the end point pt2 of the laser cut at a position where the laser light circumscribes the display area P4 and reaches the extension of the short side on the view side of the display area P4. The starting point pt1 and the end point pt2 are set to withstand the tension at the time of winding the optical member sheet FX, leaving a predetermined connection portion in the excess portion of the optical member sheet FX.

FIG. 2: is a perspective view which shows an example of the laser beam irradiation apparatus 30 used as a cut part of the optical member sheet | seat FX of each single side bonding panel P11, P12. In addition, although application to the 2nd cutting device 16 is shown as an example in FIG. 2, the same structure is also applicable to the 3rd cutting device 19. As shown in FIG.

As shown in FIG. 2, the laser beam irradiation device 30 includes a table 31, a scanner as the second cutting device 16, a moving device 32, and a control device 33.

The laser beam irradiation apparatus 30 operates each part based on the control of the control apparatus 33 as an electronic control apparatus, and the optical member sheet | seat FX of the 1st single-sided bonding panel P11 (refer FIG. 6) [made 2 optical member sheet | seat F2 and sheet piece F1S], and irradiates a laser beam L, and cut | disconnects the optical member sheet | seat FX with the optical member FS of a predetermined size.

The table 31 has the holding surface 31a holding the 1st single-sided bonding panel P11 (irradiation object).

In order to cut | disconnect the optical member sheet | seat FX of the 1st single-sided bonding panel P11 hold | maintained by the table 31, the 2nd cutting device 16 (scanner) has a laser beam (FIG. L) is injected.

The 2nd cutting device 16 can biaxially scan the laser beam L in the plane (in XY plane) parallel to the holding surface 31a of the table 31. In other words, the second cutting device 16 is relatively movable relative to the table 31 in the X direction and the Y direction. Thereby, the 2nd cutting device 16 is moved to arbitrary positions on the table 31, and the laser beam L is precisely fixed to arbitrary positions of the optical member sheet | seat FX hold | maintained by the table 31. As shown in FIG. It is possible to investigate.

The moving device 32 makes the second cutting device 16 relatively movable with respect to the table 31. The moving device 32 makes the second cutting device 16 with respect to the table 31 parallel to the holding surface 31a and the first direction V1 (X direction) parallel to the holding surface 31a. Moreover, it moves relative to 2nd direction V2 (Y direction) orthogonal to 1st direction V1, and 3rd direction V3 (Z direction) which is the normal line direction of the holding surface 31a. The moving device 32 operates the linear motor of the slider mechanism provided in the 2nd cutting device 16 (all are not shown), and moves the 2nd cutting device 16 to each direction of XYZ.

Although the said structure moves the 2nd cutting device 16 by the moving device 32, the structure which moves the table 31 by the same moving device may be sufficient, and also the table 31 and the 2nd cutting The structure which moves both sides of the apparatus 16 may be sufficient.

FIG. 3: is a perspective view which shows the internal structure of the 2nd cutting device 16 (scanner) in the laser beam irradiation apparatus 30. As shown in FIG. In addition, illustration of the mobile device 32 and the control device 33 is abbreviate | omitted in FIG.

As shown in FIG. 3, the second cutting device 16 includes a laser beam oscillator 160, a first irradiation position adjusting device 161, a second irradiation position adjusting device 162, and a condenser lens 163. do.

The laser beam oscillator 160 is a device for pulse oscillating the laser beam L. In this embodiment, a CO ₂ laser beam oscillator (carbon dioxide laser beam oscillator) is used. The laser beam oscillator 160 may include, but is not particularly limited to, a UV laser beam oscillator, a semiconductor laser beam oscillator, a YAG laser beam oscillator, an excimer laser beam oscillator, and the like. The CO ₂ laser beam oscillator is more preferable because it can oscillate a laser beam at a high output suitable for cutting processing of a polarizing film, for example.

The 1st and 2nd irradiation position adjusting apparatus 161, 162 carries out the scanning element which can carry out biaxial scanning in the plane parallel to the holding surface 31a, and the laser beam L oscillated from the laser beam oscillator 160 is carried out. Configure.

As the 1st and 2nd irradiation position adjusting devices 161 and 162, a galvano scanner, a gimbal, etc. are used, for example. The first and second irradiation position adjusting devices 161 and 162 are arranged on the optical path of the laser beam L between the laser beam oscillator 160 and the condenser lens 163 from the laser beam oscillator 160 side. It arrange | positions in order of the 1st irradiation position adjusting apparatus 161 and the 2nd irradiation position adjusting apparatus 162. FIG.

The 1st irradiation position adjustment apparatus 161 is equipped with the mirror 161a and the actuator 161b which adjusts the installation angle of the mirror 161a. The actuator 161b has the rotating shaft 161c parallel to a Z direction, and connects the mirror 161a to this rotating shaft 161c.

The 2nd irradiation position adjustment apparatus 162 is equipped with the mirror 162a and the actuator 162b which adjusts the installation angle of the mirror 162a. The actuator 162b has the rotating shaft 162c parallel to a Y direction, and connects the mirror 162a to this rotating shaft 162c.

The laser beam L oscillated from the laser beam oscillator 160 passes through these in the order of the mirror 161a, the mirror 162a, and the condenser lens 163, and the optical member sheet held on the table 31 ( FX) is investigated. The 1st and 2nd irradiation position adjusting devices 161, 162 drive each actuator 161b, 162b based on the control of the control apparatus 33, and adjust the installation angle of each mirror 161a, 162a. And the 1st and 2nd irradiation position adjusting apparatus 161, 162 makes biaxial scanning the irradiation position of the laser beam L irradiated toward the optical member sheet | seat FX on the table 31. As shown in FIG.

When the optical path of the laser beam L is positioned in the state shown by the solid line in the figure, the laser beam L oscillated from the laser beam oscillator 160 is directed to the condensing point Qa on the optical member sheet FX. Condensed Similarly, when the optical path of the laser beam L is located in the state shown by the dashed-dotted line in the figure, the laser beam L is condensed at the condensing point Qb. When the optical path of the laser beam L is positioned in the state shown by the dashed-dotted line in the figure, the laser beam L is focused at the condensing point Qc.

In this embodiment, the condenser lens 163 is disposed between the second irradiation position adjusting device 162 and the optical member sheet FX. The condenser lens 163 condenses the laser beam L whose optical path is adjusted by the 1st and 2nd irradiation position adjusting devices 161 and 162 at the predetermined position of the optical member sheet | seat FX. The condenser lens 163 is, for example, an fθ lens. The condensing lens 163 can condense the laser beam L shown by each line in the figure input parallel to the condensing lens 163 from the mirror 162a in parallel with the optical member sheet | seat FX.

The control device 33 moves the laser light L, which has passed through the condenser lens 163, to move to show a desired trajectory on the optical member sheet FX held by the table 31. Operation control of the 1st and 2nd irradiation position adjusting devices 161 and 162 is carried out.

In the present embodiment, the optical member sheet FX is relatively moved with respect to the laser beam oscillator 160 by the nozzle method using the moving device 32 to enable a wide range of laser cuts. Then, the laser beam L is biaxially scanned by the scanner system using the first and second irradiation position adjusting devices 161 and 162 to enable high-precision laser cut in detail.

Here, in the above description, the "nozzle method" refers to moving the second cutting device 16 relative to the table 31.

In addition, in the said description, a "scanner system" means the laser beam L irradiated toward the optical member sheet | seat FX on the table 31 using the 1st and 2nd irradiation position adjusting devices 161,162. It means to perform biaxial scanning of the irradiation position of.

FIG. 10: is sectional drawing of the state which isolate | separated the protection film pf (separator) from the 1st optical member sheet | seat F1, and bonded it to liquid crystal panel P. FIG. Hereinafter, although description is given using the first optical member sheet F1 as an example, the second and third optical member sheets F2 and F3 have the same configuration.

The first optical member sheet F1 is formed through a film-shaped optical layer S1, an adhesive layer S2 formed on one surface (lower surface in the drawing) of the optical layer S1, and an adhesive layer S2. A protective film pf (separator, not shown in FIG. 10) that is separably stacked on one surface of the optical layer S1, and the other surface (upper surface in the drawing) of the optical layer S1. It has surface protection film S4.

Optical layer S1 is a sheet-shaped polarizer S6 and the 1st film (most layer closest to the said optical display component) bonded to the surface of one side (liquid crystal panel P side) of polarizer S6 (S7) ) And 2nd film S8 bonded by the other surface of polarizer S6. 1st film S7 and 2nd film S8 are protective films which protect polarizer S6, for example.

Optical layer S1 functions as a polarizing plate, and is bonded over the whole region of display area P4 of liquid crystal panel P. FIG. In addition, hatching of each layer is abbreviate | omitted for the convenience of illustration.

Bonding surface T1 of liquid crystal panel P (backlit in this embodiment), in the state which isolate | separated the protection film pf leaving 1st optical member sheet | seat F1 on one surface, leaving adhesion layer S2. Side) through the adhesion layer (S2). In the film bonding system 1 of this embodiment, the adhesion layer (the 1st optical member sheet | seat F1 [optical member sheet | seat FX]) is bonded by liquid crystal panel P (optical display component PX) at the bonding position ( S2) is conveyed to face downward. Thereby, the film bonding system 1 suppresses adhesion | attachment of a foreign material to adhesion layer S2, and suppresses generation | occurrence | production of a bonding defect. Hereinafter, the sheet | seat body remove | excluding the protection film pf and the adhesion layer S2 from 1st optical member sheet | seat F1 (optical member sheet | seat FX) is called bonding sheet S5.

In the first optical member sheet F1, the polarizer S6 is a polyvinyl alcohol (PVA) film layer. The first film S7 is a cycloolefin polymer (COP) film layer. The second film S8 is a triacetyl cellulose (TAC) film layer. The surface protection film S4 (and the protection film pf) is a polyethylene terephthalate (PET) film layer.

As shown in FIG. 11, the 2nd cutting device mentioned above in the state which the bonding sheet | seat S5 which has the optical layer S1 of the said laminated structure is bonded by the bonding surface T1 of liquid crystal panel P. As shown in FIG. Laser cut by 16. The 2nd cutting device 16 is opposed to the display area P4 of the liquid crystal panel P in the bonding sheet | seat S5 bonded by liquid crystal panel P, and [1st optical member F11]. To cutout part S between surplus parts Y, to layer [first film S7, low water absorption film layer] just in the vicinity of liquid crystal panel P of optical layer S1 of bonding sheet S5. The laser beam L is irradiated with the focal point U adjusted.

Now, let's perform laser cut of this 1st optical member sheet | seat F1 in the state in which only 1st optical member sheet | seat F1 was bonded by one surface of liquid crystal panel P. FIG. In this case, the distance (focal length L1) from the surface T2 on the side of the 2nd cutting device 16 in the bonding sheet S5 to the focal point U of the laser beam L is a liquid crystal panel. In order to cut | disconnect the sheet | seat S5 for bonding efficiently, restraining the damage to (P), it sets as follows.

That is, the said focal length L1 is the surface of the 2nd cutting device 16 side of the 1st film S7 from the surface T2 of the 2nd cutting device 16 side in the bonding sheet S5. It is thickness more than (T3) and is surface T4 of the liquid crystal panel P side of 1st film S7 from surface T2 of the 2nd cutting device 16 side in the sheet S5 for bonding. It is set so that it may be below thickness. The focal length L1 is adjusted by irradiation conditions such as the output of the laser light L, the moving speed, the spot diameter, and the like.

In addition, when performing these laser cuts in the state where the 2nd optical member sheet | seat F2 was superimposed on the 1st optical member sheet | seat F1, these laser cuts are judged by looking at the integral bonding sheet, and the focal length L1 is set. Just do it. Moreover, the same focusing is performed also with the laser cut of 3rd optical member sheet | seat F3.

Film layer (high absorption film layer, PET layer, PVA layer, and TAC in the bonding sheet S5 with a high average absorption of the laser beam L in the oscillation wavelength range of the laser beam L to be irradiated). Layer) is cut off even if the output of the laser light L is suppressed.

On the other hand, the film layer (low absorption coefficient film layer, COP layer in this embodiment) with the low average absorption of the laser beam L in the oscillation wavelength range of the laser beam L irradiated in the bonding sheet S5, It is necessary to enlarge the output of the laser beam L, and to cut | disconnect by heat.

Then, excessive heat is applied to the high water absorption film layer, and the cut end of the bonding sheet S5 is greatly melted and deformed, which hinders the narrowing of the liquid solution around the display region P4. Moreover, damage, such as a micro crack, is easy to generate | occur | produce also on the surface of liquid crystal panel P, and affects durability.

On the other hand, in the film bonding system 1 of this embodiment, the low water absorption rate which is a layer closest to an optical display component (liquid crystal panel P) among the several layers contained in the optical layer S1 of the bonding sheet S5. The laser light L is irradiated by focusing (focusing on energy) the film layer. Thereby, the high water absorption film layer on the side of the laser beam irradiation apparatus 30 in the bonding sheet S5 can be cut at intervals corresponding to the spot diameter of the laser beam L. In addition, the low water absorption film layer on the liquid crystal panel P side in the bonding sheet S5 can be cut at intervals less than the spot diameter of the laser beam L. FIG. Thereby, after suppressing the damage to liquid crystal panel P by the laser beam L, the bonding sheet | seat S5 can be cut efficiently.

Thus, the process of irradiating a laser beam L to cut | disconnect an optical member sheet (sheet | seat for bonding S5), and forming an optical member corresponds to the cutting process of this invention.

Although it is preferable to cut | disconnect a low water absorption film layer completely at intervals, in order to suppress the damage to liquid crystal panel P further, as shown to FIG. 12A, the 1st film S7 of the optical layer S1 ( A part of the low water absorption film layer) may be cut and left in a thin or interrupted shape to such an extent that it can tear. In this case, the cutting line formed in the 1st film S7 is shown with the code | symbol SL in a figure.

In this way, the step of irradiating the laser beam L to cut a portion of the first film S7 into a thin or interrupted shape to the extent of tearing and forming a cutting line corresponds to the laser light irradiation step of the present invention.

After formation of the cutting line SL, as shown in FIG. 12B, the surplus portion Y is teared from the optical member FS joined to the display region P4. At that time, the surplus portion Y is teared by being displaced toward the liquid crystal panel P side in the direction intersecting with the bonding surface T1 of the liquid crystal panel P (direction perpendicular to the bonding surface T1 in the drawing). . The said displacement is made by the winding of the 2nd collection part 15d, for example (refer FIG. 4). By this displacement, the optical member FS and the surplus portion Y are teared so as to shear the edges of the edges of the liquid crystal panel P.

In this way, the step of displacing the surplus portion Y in the liquid crystal panel P side in the direction crossing the bonding surface T1 of the liquid crystal panel P corresponds to the tearing process of the present invention.

The force which arises in the optical member FS by the said tear acts on the side which presses the optical member FS to the bonding surface T1. Thereby, joining defects, such as peeling of the cutting edge part of optical member FS, are suppressed.

The displacement direction of the surplus portion Y is an angle close to the direction orthogonal to the bonding surface T1 in order to suppress the disturbance of the cut end portion of the optical member FS due to the cut-off pieces and the like remaining at the cutting line SL portion. Is preferably.

In this manner, the laser beam L is irradiated to form a cutting line on the optical member sheet (sheet S5 for bonding), and the optical member sheet is cut by tearing the excess portion Y to form an optical member. The process corresponds to the cutting process of the present invention.

As explained above, according to the production system of the optical display device which has the film bonding system 1 in the said embodiment, the optical member sheet | seat FX larger than the display area P4 of liquid crystal panel P was used for the liquid crystal panel. After bonding to (P), by separating the excess part of this optical member sheet | seat FX, the optical member FS of the size corresponding to display area P4 can be formed on the surface of liquid crystal panel P with high precision. Can be. Thereby, liquid crystal panel P applied to the film bonding system 1 can narrow the liquid edge part G of the display area P4 outer side, and can aim at expansion of a display area, and size reduction of an apparatus.

In addition, the cutting using the laser beam L is more accurate than the cutting using the cutting blade. Therefore, compared with the case where a cutting blade is used, the liquid margin part G around the display area P4 can be narrowed.

Then, the laser beam L is irradiated while focusing the focus U on a layer (low absorption coefficient film layer) immediately near the liquid crystal panel P of the optical layer S1 of the laminated structure in the optical member sheet FX. The optical member sheet | seat FX can be cut efficiently. Therefore, the thermal deformation of the cutting edge part of the optical member sheet | seat FX is suppressed, the damage of the surface of liquid crystal panel P can also be suppressed, and further narrowing softening of an optical display device can be aimed at.

Moreover, according to the production system of the optical display device which has the said film bonding system 1, the laser beam irradiation apparatus 30 which cut | disconnects the optical member sheet | seat FX is cut to the cut part S of the optical member sheet | seat FX. By forming a cutting line SL that partially cut and left the layer immediately adjacent to the liquid crystal panel P of the optical layer S1, the liquid crystal panel ( Damage to the surface of P) can be effectively suppressed.

Moreover, the surplus part of the optical member sheet | seat FX after the said cutting line SL formation is displaced to the liquid crystal panel P side in the direction which intersects the bonding surface T1 of liquid crystal panel P, and the optical member FS By having a tearing device (second recovery part 15d) which tears away from it, the excess part can be easily removed by tearing, and the said phosphorus of the optical member FS which stuck to liquid crystal panel P and remained The peeling by heat and the disturbance of a cut edge can be suppressed.

In the above embodiment, the separation between the optical member FS of the optical display component PX and the surplus portion Y of the optical member sheet FX includes the surplus portion Y as a second or third recovery portion ( 15d, 18d), but the present invention is not limited thereto, and the separation may be performed using various apparatuses or processes. At this time, as shown in FIG. 13, by tearing the excess part Y from the corner part of the optical display component PX as a starting point, the edge of the edge of the edge part of liquid crystal panel P is effective from a tear start, and the excess part ( Y) can be separated smoothly.

In addition, this invention is not limited to the said embodiment and a modification, For example, the laminated polarizing plate used as the cutting object of this embodiment is not limited to a COP polarizing plate, Polyethylene terephthalate (PET) film, polyvinyl High absorption film layers such as alcohol (PVA) films and triacetyl cellulose (TAC) films, and low absorption films such as cycloolefin polymer (COP) films, polypropylene (PP) films, and polymethyl methacrylate (PMMA) films. Various things, including a layer, are mentioned.

In this embodiment, although the structure which cuts an optical member sheet | seat into frame shape was mentioned as an example as a structure which irradiates a irradiation object with a laser beam, and performs a predetermined process, it is not limited to this. For example, the structure which divides an optical member sheet | seat into at least two, forms the perforation line which penetrates an optical member sheet | seat, or forms the groove | channel (cutting part) of predetermined depth in an optical member sheet | seat may be sufficient. Specifically, there exist cutting | disconnection (cutting) of the edge part of an optical member sheet | seat, half cut, marking processing, etc., for example.

The optical member bonded to a liquid crystal panel may be a retardation film, a brightness enhancement film, etc., not a polarizing film as long as it has an optical layer of a laminated structure. Also in this case, what is necessary is just to irradiate a laser beam, focusing on the layer immediately adjacent to the liquid crystal panel of the optical layer of each film.

In addition, in the said embodiment, the 2nd cutting device 16 detects the outer periphery of the display area P4 by a detection part, such as camera 16a, and is along the outer periphery of the display area P4, etc. And the second optical member sheets F1 and F2. In addition, the third cutting device 19 detects the outer periphery of the display area P4 by a detection unit such as the camera 19a, while the third optical member sheet F3 is located along the outer periphery of the display area P4. It was supposed to cut. However, the structure of the detection part in the 2nd cutting device 16 and the 3rd cutting device 19 is not limited to this.

Specifically, the film bonding system 1 detects the outer periphery of the bonding surface of the 1st and 2nd optical member sheets F1 and F2 and liquid crystal panel P in 2nd bonding sheet | seat F22. The cutting section SX may be cut along the outer periphery of the bonding surface. Moreover, the film bonding system 1 has a detection part which detects the outer periphery of the bonding surface of 3rd optical member sheet | seat F3 and liquid crystal panel P in 3rd bonding sheet | seat F23, and a bonding surface The cutting section SX set along the outer circumferential edge may be cut.

Thus, the process of detecting the outer periphery of the bonding surface of 3rd optical member sheet | seat F3 and liquid crystal panel P corresponds to the detection process of this invention.

In addition, you may call a cutting part the cutting line.

Such cutting by the outer periphery detection and cutting device of the joint surface is performed as follows in detail. Hereinafter, the modification of the film bonding system 1 is demonstrated using FIGS. 14-17.

FIG. 14: is a schematic diagram of the 1st detection part 61 which detects the outer periphery of a bonding surface. The 1st detection part 61 with which the film bonding system 1 of this embodiment is equipped is the bonding surface of liquid crystal panel P and sheet piece F1S in 2nd bonding sheet | seat F22 [hereinafter, May be referred to as first bonding surface SA1], an imaging device 63 for imaging an image of the outer peripheral edge ED, an illumination light source 64 for illuminating the outer peripheral edge ED, and an imaging device 63. Has a control part 65 which performs the operation for detecting the outer periphery ED based on the memory | storage of the image picked up by the image, and an image.

Such a 1st detection part 61 is a panel conveyance upstream of the 2nd cutting device 16 in FIG. 1, and is provided between the pinching roll 15b and the 2nd cutting device 16. As shown in FIG.

The imaging device 63 is arranged to be fixed to the inside of the first bonding surface SA1 rather than the outer circumferential edge ED, and the normal of the first bonding surface SA1 and the imaging surface 63a of the imaging device 63 are positioned. The normal line is inclined so as to form an angle θ (hereinafter referred to as an inclination angle θ of the imaging device 63). The imaging device 63 picks up the image of the outer peripheral edge ED from the side by which the sheet piece F1S was joined in the 2nd bonding sheet | seat F22 toward the outer peripheral edge ED of the imaging surface 63a.

It is preferable to set the inclination angle (theta) of the imaging device 63 so that the outer periphery of the 1st board | substrate P1 which forms 1st bonding surface SA1 can be imaged reliably. For example, when liquid crystal panel P is formed with what is called a multifaceted odor which divides a mother panel into a several liquid crystal panel, the 1st board | substrate P1 and 2nd board | substrate which comprise liquid crystal panel P ( A shift | deviation arises in the outer periphery with P2), and the end surface of 2nd board | substrate P2 may shift outward rather than the end surface of 1st board | substrate P1. In such a case, it is preferable that the inclination angle θ of the imaging device 63 is set so that the outer periphery of the second substrate P2 does not enter the imaging visual field of the imaging device 63.

In such a case, the inclination angle θ of the imaging device 63 is the distance H between the first bonding surface SA1 and the center of the imaging surface 63a of the imaging device 63 (hereinafter, the imaging device 63). Referred to as the height (H) of?). For example, when the height H of the imaging device 63 is 50 mm or more and 100 mm or less, it is preferable that the inclination angle θ of the imaging device 63 is set to an angle in the range of 5 ° or more and 20 ° or less. desirable. However, when the shift amount is known empirically, the height H of the imaging device 63 and the inclination angle θ of the imaging device 63 can be obtained based on the shift amount. In this embodiment, the height H of the imaging device 63 is set to 78 mm, and the inclination angle (theta) of the imaging device 63 is set to 10 degrees.

0 degree may be sufficient as the inclination-angle (theta) of the imaging device 63. FIG. FIG. 15: is a schematic diagram which shows the modification of the 1st detection part 61, and is an example when the inclination-angle (theta) of the imaging device 63 is 0 degrees. In this case, each of the imaging device 63 and the illumination light source 64 may be arrange | positioned in the position which overlaps with the outer periphery ED along the normal line direction of 1st bonding surface SA1.

The distance H1 (hereinafter referred to as height H1 of the imaging device 63) between the first bonding surface SA1 and the center of the imaging surface 63a of the imaging device 63 is the first bonding surface SA1. It is preferable to set at the position which is easy to detect the outer periphery ED of (). For example, it is preferable that the height H1 of the imaging device 63 is set to the range of 50 mm or more and 150 mm or less.

The illumination light source 64 is fixedly arrange | positioned on the opposite side to the side to which the sheet piece F1S in the 2nd bonding sheet | seat F22 was bonded. The illumination light source 64 is arrange | positioned outside the 1st bonding surface SA1 rather than the outer periphery ED. In this embodiment, the optical axis of the illumination light source 64 and the normal line of the imaging surface 63a of the imaging device 63 are parallel.

In addition, the illumination light source 64 may be arrange | positioned at the side (that is, the same side as the imaging device 63) to which the sheet piece F1S in the 2nd bonding sheet | seat F22 was bonded.

Moreover, when the outer periphery ED which the imaging device 63 image | photographs is illuminated by the illumination light emitted from the illumination light source 64, the optical axis of the illumination light source 64 and the imaging surface 63a of the imaging device 63 are carried out. The normals may intersect.

It is a top view which shows the position which detects the outer periphery of a bonding surface. The inspection area CA is set on the conveyance path | route of the 2nd bonding sheet | seat F22 shown in a figure. The test | inspection area | region CA is set in the position corresponding to the outer periphery ED of 1st bonding surface SA1 in liquid crystal panel P conveyed. In the drawing, the inspection area CA is set at four positions corresponding to four corner portions of the rectangular first bonding surface SA1 in plan view, and the outer edge ED of the corner portion of the first bonding surface SA1 is ED. ) Is configured to detect. In the figure, the hook-shaped part corresponding to a corner part among the outer periphery of 1st bonding surface SA1 is shown as outer periphery ED.

The 1st detection part 61 of FIG. 14 detects the outer periphery ED in four test | inspection area | regions CA. Specifically, the imaging device 63 and the illumination light source 64 are arrange | positioned in each test | inspection area | region CA, respectively. The 1st detection part 61 image | photographs the corner part of 1st bonding surface SA1 for every liquid crystal panel P conveyed, and detects the outer periphery ED based on imaging data. Data of the detected outer peripheral edge ED is stored in the control part 65 shown in FIG.

In addition, if the outer periphery of 1st bonding surface SA1 can be detected, the setting position of test | inspection area | region CA is not limited to this. For example, each test | inspection area | region CA may be arrange | positioned in the position corresponding to a part (for example, center part of each side) of each side of 1st bonding surface SA1. In this case, it becomes a structure which detects each edge | side (four sides) of 1st bonding surface SA1 as an outer periphery.

In addition, the imaging device 63 and the illumination light source 64 are not limited to the structure arrange | positioned at each test | inspection area | region CA, The movement path set so that the outer periphery ED of 1st bonding surface SA1 may be followed. The configuration may be moved. In this case, when the imaging device 63 and the illumination light source 64 are located in each inspection area CA, it is set as the structure which detects the outer periphery ED, and the imaging device 63 and the illumination light source 64 are each, respectively. When provided one by one, detection of the outer peripheral edge ED becomes possible.

The cut part (cut line) with respect to the sheet piece F1S and the 2nd optical member sheet | seat F2 by the 2nd cutting device 16 is based on the detection result of the outer periphery ED of 1st bonding surface SA1. Is set. As for the control part 65 shown in FIG. 11, based on the data of the outer periphery ED of the 1st bonding surface SA1 stored, the 1st optical member F11 is the outer side of the liquid crystal panel P [1st The cut position of the sheet piece F1m and the 2nd optical member sheet | seat F2 is determined so that it may become a magnitude | size which does not push out [outside of bonding surface SA1]. The 2nd cutting device 16 cuts the sheet piece F1S and the 2nd optical member sheet | seat F2 in the cut position determined by the control part 65. FIG.

In FIG. 1, the 2nd cutting device 16 is provided in the panel conveyance downstream rather than the 1st detection part 61. FIG. The 2nd cutting device 16 of the sheet piece F1S and 2nd optical member sheet | seat F2 bonded by liquid crystal panel P and the opposing part of display area P4 (refer FIG. 6), and an opposing part The surplus portion on the outside is separated along the cut portion (cut line) set on the basis of the detected outer periphery ED, and the first optical member F11 and the second optical member having a size corresponding to the display area P4 ( F12) (refer FIG. 9) is cut out. Thereby, 2nd single-sided bonding panel P12 by which the 1st and 2nd optical member F11, F12 overlapped and bonded to the upper surface of liquid crystal panel P is formed.

In this embodiment, in three sides except the functional part in the rectangular liquid crystal panel P by planar view, the excess part is laser cut along the outer periphery of liquid crystal panel P, and 1 corresponds to a functional part. In the side, the structure which laser-cuts an excess part in the position which was suitably drawn in from the outer periphery of liquid crystal panel P to the display area P4 side can be employ | adopted. For example, when the 1st board | substrate P1 is a TFT board | substrate, it cuts in the position which shifted a predetermined amount toward the display area P4 side from the outer periphery of liquid crystal panel P so that a functional part may be excluded in one side corresponded to a functional part. A configuration can be adopted.

FIG. 17: is a schematic diagram of the 2nd detection part 62 which detects the outer periphery of a bonding surface. The 2nd detection part 62 with which the film bonding system 1 of this embodiment is equipped is the bonding surface of liquid crystal panel P and 3rd optical member sheet | seat F3 in 3rd bonding sheet | seat F23 [ Hereinafter, the imaging device 63 which picks up the image of the outer periphery ED of the second bonding surface SA2], the illumination light source 64 which illuminates the outer periphery ED, and the imaging device The control unit 65 stores an image picked up by 63 and performs a calculation for detecting the outer edge ED based on the image. The 2nd detection part 62 has the structure similar to the 1st detection part 61 mentioned above.

Such a 2nd detection part 62 is a panel conveyance upstream of the 3rd cutting device 19 in FIG. 1, and is provided between the pinching roll 18b and the 3rd cutting device 19. As shown in FIG. The 2nd detection part 62 makes the outer periphery ED of 2nd bonding surface SA2 similarly to the 1st detection part 61 mentioned above in the test | inspection area set on the conveyance path | route of the 3rd bonding sheet | seat F23. Detect.

The cut part (cut line) with respect to the 3rd optical member sheet | seat F3 by the 3rd cutting device 19 is set based on the detection result of the outer periphery ED of 2nd bonding surface SA2.

For example, the control part 65 of the 2nd detection part 62 makes the 3rd optical member F13 the liquid crystal panel P based on the data of the outer periphery ED of the 2nd bonding surface SA2 memorize | stored. It can be set as the structure which sets the cut part (cut line) of the 3rd optical member sheet | seat F3 so that it may become a magnitude | size which does not push out to the outer side (outside of 2nd bonding surface SA2) of (). In addition, setting of a cutting | disconnection part (cutting line) does not necessarily need to be performed by the control part 65 of the 2nd detection part 62, but uses the data of the outer peripheral edge ED detected by the 2nd detection part 62, It is good also as setting a cut part (cut line) along the outer periphery of a joining surface using a separate calculation part.

The 3rd cutting device 19 cut | disconnects 3rd optical member sheet | seat F3 in the cut part (cut line) set along the outer periphery ED of the bonding surface.

The 3rd cutting device 19 makes the opposing part with the display area P4 (refer FIG. 8) of the 3rd optical member sheet | seat F3 bonded by liquid crystal panel P, and the excess part of the outer side of the opposing part, The 3rd optical member F13 (refer FIG. 9) of the magnitude | size corresponding to display area P4 is cut | disconnected along the cut part (cut line) set based on the detected outer periphery ED. Thereby, the double-sided bonding panel P13 by which the 3rd optical member F13 was bonded by the upper surface of the 2nd single-sided bonding panel P12 is formed.

Also in the film bonding system which concerns on the above modifications, adhesion of a fume to the product surface can be suppressed effectively, without affecting the product processing precision, and it can contribute to narrowing softening.

In addition, in the said embodiment, although the whole of the 2nd cutting device 16 containing the laser beam oscillator 160 was demonstrated as moving relative to the table 31, it is not limited to this structure. For example, when the laser beam oscillator 160 is large and unsuitable for movement, the laser beam oscillator 160 is fixed, and the scanning elements (the first irradiation position adjusting device 161 and the second irradiation position adjusting device ( 162) relative to the table 31 can be adopted. In this case, the condensing lens 163 may also be moved following the scanning element.

In the film bonding system of the said embodiment, the sheet piece which detected the outer periphery of the bonding surface for every some liquid crystal panel P using the detection part, and bonded each individual liquid crystal panel P based on the detected outer periphery. Cutting position of (F1S), 2nd optical member sheet | seat F2, and 3rd optical member sheet | seat 3 is set. Thereby, the optical member of a desired size can be isolate | separated regardless of the individual difference of the magnitude | size of liquid crystal panel P and the sheet piece F1S. Therefore, the quality fluctuation by the individual difference of the magnitude | size of liquid crystal panel P and the sheet piece F1S can be eliminated, the liquid margin part around a display area can be reduced, and a display area can be enlarged and a device can be miniaturized.

In addition, the structure in the said embodiment and a modification is an example of this invention, and various changes are possible in the range which does not deviate from the summary of the said invention.

1: film bonding system (production system of optical device)
12: first bonding device (bonding device)
15: second bonding device (bonding device)
15d: second recovery part (tearing device)
18: 3rd bonding apparatus (bonding apparatus)
16: second cutting device (cutting device)
19: 3rd cutting device (cutting device)
30: laser light irradiation device
61: first detector (detector)
62: second detector (detector)
P: liquid crystal panel (optical display component)
P4: Display Area
F1: first optical member sheet (optical member sheet)
F2: 2nd optical member sheet (optical member sheet)
F3: Third optical member sheet (optical member sheet)
F11: 1st optical member (optical member, opposing part)
F12: 2nd optical member (optical member, opposing part)
F13: 3rd optical member (optical member, opposing part)
P11: 1st single side | surface bonding panel (optical display component, bonding body)
P12: 2nd single sided bonding panel (optical display component, bonded body)
P13: double-sided bonding panel (optical display device)
PX: Optical Display Parts
FS: Optical member
FX: Optical Member Sheet
Y, Y ': surplus part
S: cutout
SL: Cutting Line
S7: first film (layer closest to the optical display part)
U: Focus
L: laser light
T1: joint surface
S1: optical layer
ED: Outer lead
SA1: first bonding surface (bonding surface)
SA2: second bonding surface (bonding surface)

Claims

In the production system of an optical display device formed by bonding an optical member to an optical display component,
A bonding apparatus in which the optical member sheet is bonded to the optical display component larger than the display region of the optical display component and includes an optical layer having a laminated structure to form a bonded body;
Cutting device which has a laser beam irradiation apparatus which irradiates a laser beam for cutting processing
And
The said cutting device isolate | separates the opposing part of the said optical member sheet from the said optical member sheet with the display area, and the excess part of the outer side of the said opposing part, and the said optical part of the magnitude | size corresponding to the said display area from the said optical member sheet | seat. Form a member,
The said laser beam irradiation apparatus is the closest to the said optical display component among the some layer contained in the optical layer of the said laminated structure toward the cut part between the said opposing part and the excess part of the said optical member sheet | seat in the said bonding body. Focusing on the layer, irradiating the laser light,
The said bonding body further has a detection part which detects the outer periphery of the bonding surface of the said optical member sheet | seat and the said optical display component,
The said cutting part is set along the said outer periphery, The production system of the optical display device characterized by the above-mentioned.

The method of claim 1,
The laser beam irradiation apparatus forms a cutting line in which the layer closest to the optical display component is cut partially and is left in the cutting portion.

The method of claim 2,
The cutting device further has a tearing device,
The said tearing device is a said direction in which the excess part of the said optical member sheet | seat after the said laser beam irradiation apparatus forms the said cutting line cross | intersects the bonding surface which bonds the said optical member sheet | seat in the said optical display component, A system for producing an optical display device, characterized in that it is displaced toward the optical display component side and is teared from the opposite portion.

In the manufacturing method of the optical display device formed by bonding an optical member to an optical display component,
A bonding step in which the optical member sheet is bonded to the optical display component larger than the display region of the optical display component and includes an optical layer having a laminated structure to form a bonded body;
The optical display of the plurality of layers contained in the optical layer of the said laminated structure toward the cut part between the opposing part of the said optical member sheet | seat in the said bonding body with the said display area | region, and the excess part of the outer side of the said opposing part. Focusing on a layer close to the component, irradiating a laser beam for cutting, separating the opposing portion and the excess portion to form the optical member having a size corresponding to the display area from the optical member sheet. Including,
Prior to the said cutting process, the said bonding body WHEREIN: It further has a detection process which detects the outer periphery of the bonding surface of the said optical member sheet | seat and the said optical display component,
The said cutting part is set along the said outer periphery, The manufacturing method of the optical display device characterized by the above-mentioned.

The method of claim 4, wherein
The cutting step further includes a laser irradiation step,
The said laser irradiation process irradiates a laser beam to the said cutting part, and forms the cutting line which partially cut and left the layer closest to the said optical display component, The manufacturing method of the optical display device characterized by the above-mentioned.

The method of claim 5,
The cutting process further includes a tearing process,
The said tear process is the said optical in a direction which crosses the surplus part of the said optical member sheet | seat after the said laser irradiation process forms the said cutting line with the bonding surface which bonds the said optical member sheet | seat in the said optical display component. It displaces to the display component side, and it tears from the said opposing part, The manufacturing method of the optical display device characterized by the above-mentioned.

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