KR101997120B1

KR101997120B1 - The production Method of high electricity Carbon-paper

Info

Publication number: KR101997120B1
Application number: KR1020160032431A
Authority: KR
Inventors: 권용범; 권성은
Original assignee: (주)시엔케이; 권성은
Priority date: 2016-03-18
Filing date: 2016-03-18
Publication date: 2019-07-05
Also published as: KR20170108474A; WO2017159917A1

Abstract

When a plastic material such as a polyimide film excellent in heat resistance, electrical insulation and chemical resistance is fired and processed through a specific process at an ultra-high temperature of 2000 ° C or higher, The characteristic of the material changes with 'Carbon-Paper' which is a carbon compound having super heat conduction characteristics.
The carbon paper has excellent thermal conductivity and electrical conductivity, but the electrical conductivity is significantly lower than that of copper (Cu) or aluminum (Al).
In the case of advanced electronic products, the power or grounding function may be required at the same time, while simultaneously extracting the heat to a desired place in a short period of time. In such a case, high conductivity and electrical conductivity are required at the same time.
Conventionally, this problem has been solved by attaching conductive material such as copper or aluminum sheet to carbon paper by physical or chemical method.
However, the present invention is not limited to the specific characteristics of 'carbon paper' by adding processes such as injection of an electrically conductive additive (Dopant), vacuum deposition or plating of a metal having high electrical conductivity, and electroconductive induction ion implantation in the process of manufacturing 'carbon paper' In addition, the object of the present invention is to enhance electrical conductivity.

Description

Method of making electrically conductive carbon paper. {The production Method of high electricity Carbon-paper}

When a plastic material such as a polyimide film (hereinafter referred to as "PI") film excellent in heat resistance, chemical resistance and electrical insulation is fired at an ultra-high temperature of 2000 ° C. or more through a specific process, (Carbon sheet such as PGS (Pyrolytic Graphite Sheet) or the like, hereinafter referred to as "carbon paper") having a super heat conductive property which is different from that of the carbon paper.

Such carbon paper is excellent in thermal conductivity and also has electrical conductivity. However, the electrical conductivity is significantly lower than that of a conductive metal such as copper (Cu) or aluminum (Al).

The present invention relates to a method for enhancing the electrical conductivity of a carbon paper to a conductive metal level by grafting an additive into a raw material (plastic such as a raw material or a PI) or a carbon paper as a finished material by a physical or chemical process Thereby increasing the electrical conductivity.

NASA in the United States commissioned DuPont, a privately held company, to develop plastics that could withstand extreme environments for use as spacecraft components. In 1964, polyimide was developed under the trade name Kapton.

These polyimides have been attracting attention as core materials for the future in the IT and aerospace industries due to their excellent electrical insulation, high thermal stability and excellent mechanical properties and have been used as advanced high-functional industrial materials. In particular, strength, flexibility and self-extinguishing properties in a wide range of temperatures from-269 ° C to 400 ° C have been known as the most outstanding materials of existing plastics.

However, if the PI film is fired at a super-high temperature of 2000 ° C or higher through a specific process, it will be changed into a carbon material having a property different from that of the original PI film, that is, carbon paper.

Unlike conventional PI films, 'carbon paper' has a high thermal conductivity (> 1000W) and heat dissipation characteristics. In contrast to the inherent properties of PI, which is excellent in electrical insulation, it has electrical conductivity. Conductive materials such as copper .

Carbon compounds exist in various forms such as graphite, graphene, diamond, carbon nanotube (CNT), and fullerene, and their physical and chemical properties have different characteristics. For example, diamonds have very good thermal conductivity properties while insulators and CNTs have good electrical conductivity.

The electrically conductive carbon paper pursued in the present invention has high heat conduction characteristics and excellent electrical conduction characteristics, thereby enhancing its applicability.

When "carbon paper" is applied to a high-tech industrial field, it is required to extract electric power to a desired place in a short period of time, if necessary, and at the same time, to have electric conductivity for use as a power source or a grounding function.

Conventionally, this problem has been solved by attaching electrically conductive materials such as copper or aluminum thin plate to carbon paper by physical or chemical methods. However, this method has many problems due to the increase in cost and complexity of the process due to addition of a separate material (copper, etc.) and a lapping process.

However, the present invention aims to provide a carbon paper which is fundamentally electrically conductive at a low cost.

(Carbon nanotube (CNT), conductive metal powder, graphene powder, etc.) having excellent electrical conduction properties in order to raise the electrical conductivity inherently possessed by carbon paper to a level similar to a general conductive metal, The carbon paper made from the film after the ultra-high temperature firing is made to have high electric conductivity by mixing with the PI chip which is the raw material of the paper, and the PI film is manufactured by various methods such as vacuum deposition method And to increase the electrical conductivity of the 'carbon paper' at low cost by depositing and coating a conductive material in a plating manner.

At this time, the mixing method of the conductive material uses a chemical or physical method.

The carbon paper having high electrical conductivity manufactured through the present invention has a great application field in industry by combining with inherent heat conduction characteristic and heat radiation characteristic.

Especially, as the industry becomes more sophisticated, the heat generated from the product itself is becoming one of the major causes of the critical impact on the product in the case of high-tech electronic products. Accordingly, the heat treatment is becoming a big problem. However, when the carbon paper according to the present invention is combined with the carbon paper, the problem can be solved easily, and a larger effect can be obtained by enlarging and applying the electrode, the ground, and the electromagnetic wave shielding function.

In addition, when the PI is formed in the shape of a wire by combining the present invention, a carbon wire having excellent electric conductivity and thermal conductivity can be manufactured. The carbon wire thus produced can replace the existing copper wire, and its merit can be remarkably exerted especially when it is attached to a transmission line.

Fig. 1 is a view showing a production process of a PI film and a PI roll using a PI material.
FIG. 2 is a process diagram for forming a chip by mixing a PI chip and an electrically conductive material (Dopant).
FIG. 3 is a process diagram of forming a film and a roll using a doped chip.
Figure 4 is an illustration of a vacuum deposition equipment.
5 is an example of a plating method.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.

Throughout the specification, when a component comprises a component, it is understood that it may include other components, not control of the other component, unless specifically stated otherwise.

Specific details for carrying out the present invention are as follows.

Carbon paper (carbon sheet such as PGS (Pyrolytic Graphite Sheet)) which is excellent in physical and chemical properties and superior in heat conduction characteristic more than 5 times of copper has electric conductivity of the same level as material having high electric conductivity such as copper or aluminum .

Polyimide (PI), a raw material of 'carbon paper', has been attracting attention as a core material of the future industry due to its excellent electrical insulation, high thermal stability and excellent mechanical properties.

When the PI film is fired at an ultra-high temperature of 2000 ° C or higher, it is converted into a carbon paper made of carbon having properties different from those of the original PI film.

The 'carbon paper' thus produced has an excellent thermal conductivity (over 1000 W) as opposed to the properties of conventional PI films, and also has electrical conductivity. The electrical conductivity of the carbon paper is considerably lower than that of conductive materials such as copper.

Accordingly, various methods have been attempted to increase the electric conductivity of the carbon paper and to increase the application field thereof.

However, the method to be realized in the present invention is different from the existing method and can be roughly classified into three types.

First, a method of inducing electrical conductivity by introducing an additive material (Dopant) which imparts electrical conductivity to a plastic material such as a PI film, which is a raw material of 'carbon paper', and a method of inducing electric conductivity by a method such as vacuum deposition or plating, 'A method of forming a conductive metal film on a surface, and a method of injecting an ion (ION) which enhances the conduction characteristic on the surface of a' carbon paper 'by using an ion-implantor.

i) A method of inducing electrical conductivity by injecting an additive material (Dopant) which gives electrical conductivity to a plastic material such as PI film, which is a raw material of 'carbon paper'.

Generally, in order to make a film type PI, a PI film made of a chip is passed through a film forming machine as shown in FIG.

However, in the method to be implemented in the present invention, Dopant (metal powder, CNT (carbon nano tube), and graphene powder) having excellent electric conduction characteristics is applied to a PI chip as a raw material (Dispersion, diffusion, etc.) to form a new chip.

The chip thus formed is passed through a film forming machine as shown in FIG. 3 to form a film,

When the formed film is baked through an ultra-high temperature process of 2000 ° C or higher, a carbon paper containing dopant and having high electrical conductivity is produced.

In the above-mentioned manner, the additive (Dopant) injected into the PI, which is a raw material, acts as a factor to induce the electric conductivity in the super-high temperature firing process in which the carbon paper is formed, thereby changing the carbon paper into a molecular structure having excellent electrical conductivity Or the dopant itself acts as a conduction enhancer.

However, unlike the method of the present invention, in the gas atmosphere dopant injection method used in the semiconductor process, the dopant to be introduced is first made into a gas form, and the electric conductivity is improved by burning 'carbon paper' in the produced gas . However, in this case, since the process of producing 'carbon paper' is an ultra-high temperature state of 2000 ° C. or more and the thermal energy of the carbon paper itself is too large, it is difficult to inject the dopant gas into the raw material. In other words, the energy of the dopant gas is small, and the injection of the dopant is practically difficult.

However, when the method of the present invention is used, the dopant is injected in the original process of manufacturing the PI chip, which is advantageous in that the dopant can be easily injected into the raw material.

2) A method of forming a conductive metal film on the surface of 'carbon paper' by vacuum deposition or plating.

First, the PI chip is passed through a film forming machine to produce a PI film as shown in FIG. The film thus formed is made of carbon paper through an ultra-high temperature process of over 2000 ° C.

A metal such as copper (Cu) or aluminum (Al), which has high electrical conductivity, is deposited on the surface of the carbon paper by vacuum deposition to form an electrically conductive film, as shown in FIG.

The carbon paper coated with the electroconductive metal has a high electrical conductivity due to the metal coated on the surface thereof, and also has excellent thermal conductivity according to the characteristics of the carbon paper itself.

At this time, various methods such as PVD (Physical Vapor Deposition) and CVD (Chemical Vapor Deposition) can be used for the vacuum deposition method.

Since the carbon paper has basic electrical conduction characteristics, it can be used to form an electrically conductive metal film on the surface of the carbon paper as shown in FIG. 5 by a metal plating method.

Further, by conducting the above-described vacuum deposition method and plating method in parallel, a more excellent electrically conductive film can be formed.

3) Ion-Implanter is used to inject ION, which improves conductivity on the surface of 'carbon paper'.

This method is a method commonly used in the semiconductor manufacturing process, in which specific ions capable of enhancing electrical conductivity are injected onto a surface of a target material, that is, a carbon paper, using an ion-implanting device Thereby enhancing the electrical conduction characteristics on the surface.

It is to be understood that the above description is intended to be illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may be implemented in a combined manner.

The scope of the present invention is defined by the appended claims rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the present invention.

1. PI Chip
2. PI Film
3. PI Roll
4. Conductive material powder
5. Dopant Chip with Conductive Material
6. Doped Film
7. Doped Roll

Claims

For the purpose of producing an electrode having both high electrical conductivity and super heat conduction characteristics, in the production of conductive carbon paper (PGS, Pyrolytic Graphite Sheet) having crystallization properties in the plane direction;
CNT (Carbon Nano Tube) and Graphene are mixed into a film form to induce or enhance electrical conductivity to the polyimide (PI) used as a raw material, and the film is baked at an ultra-high temperature Wherein a conductive metal film is further formed on the surface of the carbon paper having heat conduction characteristics and electric conduction characteristics through vacuum deposition or plating to further improve the electrical conduction characteristic.

The method according to claim 1,
Wherein the carbon paper is further injected with an ION using an ion implanter to further increase the electrical conductivity of the carbon paper.

3. The method according to claim 1 or 2,
And a conductive metal film is formed on the surface of the carbon paper through vacuum deposition or plating so as to increase the electrical conductivity of the carbon paper, and the ION is injected using an ion-implanting apparatus. Lt; / RTI >

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