KR101978307B1 - Soldering apparatus and soldering method for circuit board - Google Patents

Abstract

The present invention maintains the wettability of the solder in the mounting process of electronic components and prevent the coin-use of the coin to ensure the reliability of the electrical connection, and at the same time protect the worker from harmful gases generated in the soldering process to improve the working environment In addition, the present invention relates to a mounting substrate soldering device and a soldering method capable of increasing productivity by improving productivity. According to the present invention, the object loading step for loading the soldering member to the closed space; A pretreatment step of spraying an organic fatty acid polymer having a predetermined temperature on the soldering member loaded into the closed space; A soldering step of spraying molten solder on the pre-treated soldering member; A post-treatment step of spraying an organic fatty acid polymer to remove excess molten solder to the soldering target member that has undergone the soldering step; An object unloading step for unloading the post-processed soldering object member from a closed space; A smoke treatment step of discharging the smoke generated by the evaporation of the organic fatty acid polymer in the pretreatment step, the soldering step and the post-treatment step to the outside of the closed space; Provided is a mounting substrate soldering method comprising a; spray control step of circulating to recycle and recycle the organic fatty acid polymer and molten solder used in the pretreatment step, soldering step and post-treatment step.

Description

Mounting Board Soldering Equipment and Soldering Method {SOLDERING APPARATUS AND SOLDERING METHOD FOR CIRCUIT BOARD}

The present invention relates to a mounting substrate soldering device and a soldering method, and more particularly, to maintain the wettability of the solder in the mounting process of the electronic component and to prevent the generation of coin type, to ensure the reliability of the electrical connection, while soldering The present invention relates to a mounting board soldering device and a soldering method which can protect workers from harmful gases generated in a process, improve a working environment, and improve productivity by increasing productivity.

BACKGROUND ART In recent years, wiring densities and mounting densities of substrates such as printed boards, wafers, and flexible substrates (hereinafter, referred to as "mounting substrates") are further improved. The mounting board has a large number of coin electrodes for soldering electronic components. Solder bumps are provided on the coin electrodes, and the electronic components are soldered to the solder bumps and mounted on the mounting substrate.

The solder bumps are fine, have shapes, dimensions, and the like, and the solder bumps are required to be formed only in necessary portions. One conventional example of a method for forming solder bumps that satisfies these requirements is a screen plate having a passage for forming paste bumps from a paste, comprising a rigid first metal layer, a resin adhesive layer, and a second metal layer. On the other hand, a method for easily forming a dense and constant bump using a screen plate, wherein a passage between the adhesive layer and the second metal layer is reduced in diameter with respect to the passage of the first metal layer.

By the way, electronic components, such as a connector, QFP (Quad | Flat_Package), SOP (Small_Out_Line_Package), and BGA (Ball_Grid_Array), may have gaps in the dimensions of connection terminals such as lead terminals. In order to perform soldering in which solder | pewter is not bad in the electronic component of the dimension of a connection terminal irregular, it is necessary to make the influence of the dimension gap of an electronic component small by making the solder bump provided in the mounting board thick. When small electronic components such as CSP (Chip_Size_Package) are mixed in an electronic component for mounting on a mounting substrate, the size of the solder bumps for such small electronic components is very small and fine.

As a general method of forming solder bumps, a method of dipping (immersing) a mounting substrate provided with a coin electrode into molten solder is known. However, when solder contacts a coin electrode, copper and tin contained in the solder combine to form a CuSn intermetallic compound. Since the CuSn intermetallic compound is formed in a shape in which the coin electrode is eroded by tin in the solder, "copper food" or "copper food" (hereinafter referred to as "copper food") occurs. Such a utility type may lower the reliability of the coin electrode, which is an electrical connection portion, and may deteriorate the reliability of the mounting substrate. Therefore, it is necessary to shorten the dipping time of the mounting substrate in molten solder and to suppress the same type, and therefore, a method of forming a preliminary solder layer on the coin electrode of the mounting substrate and then dipping the mounting substrate into the molten solder ( Dipping method) is under consideration.

Among the above-described solder bump forming methods, the solder bump forming method using the screen plate is poor in productivity, and the solder bump forming method using the dipping method is used in the first dipping and the last dipping. There was a problem that the difference in the reliability of the coin electrode in each part of the same substrate caused a problem that the problem of the equation is still not solved.

(Document 1) Republic of Korea Utility Model Registration Publication No. 20-0450996 (registered 10 November 2010) (Document 2) Republic of Korea Patent Publication No. 10-1331394 (2013.12.13. Notification)

Accordingly, the present invention for solving the above-mentioned problems is to maintain the wettability of the solder in the mounting process of the electronic components and to prevent the generation of coin type, to ensure the reliability of the electrical connection at the same time, generated in the soldering process It is an object of the present invention to provide a mounting board soldering device and a soldering method that can protect workers from harmful gases, improve the working environment, and improve productivity by increasing productivity.

The problems of the present invention are not limited to those mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

According to a first aspect of the present invention for achieving the above objects and other features, a method for soldering an electrode, which is an electrical connection of a soldering member that requires a circuit configuration, comprising: loading the soldering member into a closed space An object loading step for; A pretreatment step of spraying a liquid organic fatty acid polymer having a predetermined temperature onto the soldering member loaded into the closed space; A soldering step of spraying molten solder on the pre-treated soldering member; A post-treatment step of spraying an organic fatty acid polymer to remove excess molten solder to the soldering target member that has undergone the soldering step; An object unloading step for unloading the post-processed soldering object member from a closed space; A smoke treatment step of discharging the smoke generated by the evaporation of the organic fatty acid polymer in the pretreatment step, the soldering step and the post-treatment step to the outside of the closed space; Provided is a mounting substrate soldering method comprising a; spray control step of circulating to recycle and recycle the organic fatty acid polymer and molten solder used in the pretreatment step, soldering step and post-treatment step.

In the first aspect of the present invention, the smoke treatment step includes inhaling, cooling, and incinerating the smoke, and the spraying control step includes spraying the organic fatty acid polymer and molten solder that are dropped by being sprayed onto the soldering target member. Collecting in the same storage container, it may include circulating each of the collected organic fatty acid polymer and molten solder to be recycled in the pretreatment step, soldering step and post-treatment step.

In the first aspect of the present invention, the spraying control step is to collect the organic fatty acid polymer and molten solder that is sprayed to the soldering target member in the same recycle storage container, and directly supplied from the recycle storage container, and the organic fatty acid polymer The supply from the dedicated reservoir and the molten solder reservoir can be controlled to be combined.

In the first aspect of the present invention, the soldering step is a squeegee member so that the molten solder sprayed on the soldering member after the injection of molten solder to the soldering member can be invaded to the fine pitch of the soldering member (Squeeagee member) or a roller member or a fine brush may further include causing the molten solder to be in contact with the injection target soldering member.

In a first aspect of the present invention, the soldering member may further include forced circulation of the airflow in the closed space to be treated.

According to a second aspect of the present invention, there is provided an apparatus for soldering a coin electrode, which is an electrical connection portion of a soldering member that requires a circuit configuration, comprising: a processing body forming a closed space and having an inlet and outlet on one side; Drive means configured to supply and discharge a soldering member through an inlet and outlet of the processing body; At least one substrate surface treatment solution spray nozzle member provided in a closed space in the processing body and spraying an organic fatty acid polymer having a predetermined temperature to a soldering member supplied by the driving means; At least one molten solder spray nozzle member provided on one side of the substrate surface treatment solution spray nozzle member and spraying molten solder on a soldering target member supplied by the driving means; Substrate surface treatment solution supply means for supplying an organic fatty acid polymer to the spray nozzle member for substrate surface treatment; Molten solder supply means for supplying molten solder to the molten solder spray nozzle member; Smoke treatment means for treating the evaporated smoke of the organic fatty acid polymer generated in the treatment body in communication with the treatment body; A storage tank configured under the processing body and integrating the organic fatty acid polymer and molten solder that are dropped by being sprayed from the substrate surface treatment solution injection nozzle member and the molten solder injection nozzle member to a soldering target member; Circulation means for circulating the organic fatty acid polymer and the molten solder collected in the reservoir; And a control panel for controlling the drive means, the substrate surface supply means, the molten solder supply means, the smoke treatment means, and the circulation means.

According to a fourth aspect of the present invention, there is provided an apparatus for soldering a coin electrode, which is an electrical connection portion of a soldering member that requires a circuit configuration, comprising: a processing body forming a closed space and having an inlet on one side and an outlet on the other side; Drive means configured to supply and discharge a soldering member through an inlet and an outlet of the processing body; At least one substrate surface treatment solution spray nozzle member provided in a closed space in the processing body and spraying an organic fatty acid polymer having a predetermined temperature to a soldering member supplied by the driving means; At least one molten solder spray nozzle member provided in a closed space of the processing body and spraying molten solder on a soldering target member supplied by the driving means; Substrate surface treatment solution supply means for supplying an organic fatty acid polymer to the spray nozzle member for substrate surface treatment; Molten solder supply means for supplying molten solder to the molten solder spray nozzle member; Smoke treatment means for treating the evaporated smoke of the organic fatty acid polymer generated in the treatment body in communication with the treatment body; A storage tank configured under the processing body and integrating the organic fatty acid polymer and molten solder that are dropped by being sprayed from the substrate surface treatment solution injection nozzle member and the molten solder injection nozzle member to a soldering target member; Circulation means for circulating the organic fatty acid polymer and the molten solder collected in the reservoir; And a control panel for controlling the driving means, substrate surface treatment supply means, molten solder supply means, smoke treatment means, and circulation means.

In the second and third aspects of the present invention, the processing body is partitioned into a plurality of spaces by a plurality of partition members having movable paths in which the soldering member is movable, and the partitioned spaces each have the substrate surface. The processing solution injection nozzle member and the molten solder injection nozzle member are configured to be provided separately, and in the space portion of the processing body in which the molten solder injection nozzle member is provided, the molten solder sprayed on the soldering target member is formed of the soldering target member. The method may further include a squeegee or roller or a fine brush-type molten solder invading member contacting the soldering target member to which the molten solder is injected to invade to a fine pitch.

In the second and third aspects of the present invention, the treatment body may further include an airflow circulation fan provided at one side of the closed space of the treatment body to forcely circulate the airflow in the internal space.

In the second and third aspects of the present invention, the injection nozzle member for the substrate surface treatment and the molten solder injection nozzle member each comprise a pair of opposing pairs for spraying the soldering member on the upper and lower surfaces, respectively. A heating member controlled by a control panel is provided, and the substrate surface treatment solution supply means is provided with an organic fatty acid polymer storage container and the storage container to maintain the organic fatty acid polymer at a constant temperature, thereby heating the organic fatty acid polymer. The heating member controlled by the control panel and the organic fatty acid polymer storage container and the substrate surface treatment solution injection nozzle member are connected to provide the organic fatty acid polymer from the organic fatty acid polymer storage container to the substrate surface treatment solution injection nozzle member. Solution solution line is provided with a heating member, the organic fatty acid polymer low A temperature for pumping the organic fatty acid polymer from the enteric container, the pumping means controlled by the control panel, and at one or more locations of the solution supply line to detect the temperature of the organic fatty acid polymer flowing along the solution supply line and deliver it to the control panel. A molten solder storage container for storing molten solder, a heating member for heating the molten solder storage container and controlled by the control panel, the molten solder storage container, and the molten solder spraying device. A nozzle member is connected to provide molten solder from the molten solder storage container to the molten solder injection nozzle member, and a molten solder supply line including a heating member, and a molten solder supply line from the molten solder storage container. Supplied to the molten solder spray nozzle member by means of the control panel. Pumping means that is air; a may include.

In the second and third aspects of the present invention, the reservoir includes a heating member for heating the reservoir or for heating the reservoir stored in the reservoir, wherein the circulation means is connected to an intermediate portion of the reservoir to connect the organic fatty acid. A first connecting line configured to provide an organic fatty acid polymer to the polymer storage container; A second connection line connected to a lower end of the reservoir to provide molten solder to the molten solder storage container; A level sensor provided at one side of the first connection line to detect a level of molten solder; An opening and closing means valve controlled by the control panel to open and close the inlet of the first connection means based on the detection signal of the water level sensor; A first direct supply line connected to an intermediate portion of the organic fatty acid polymer injection nozzle member and the reservoir or connected to the first connection line; A second direct supply line connected to a lower end of the molten solder spray nozzle member and the reservoir or connected to the second connection line; Pumping means for pumping an organic fatty acid polymer and molten solder from each of said direct supply lines; And a heating member provided in each of the direct supply lines, wherein the control panel is configured to directly supply from the reservoir and the organic fatty acid polymer storage container and the molten solder storage container based on a detection signal of the water level sensor of the reservoir. It can be configured to selectively control the supply.

According to the above-described mounting substrate soldering device and the soldering method according to the present invention, it is possible to ensure the reliability of the electrical connection (bump formation) by maintaining the wettability of the solder in the mounting process of the electronic components and prevent the generation of coin type It works.

In addition, according to the present invention, there is an effect that can protect the worker from harmful gases generated during the soldering process to improve the working environment, improve the productivity to increase the yield.

In addition, according to the present invention, it is possible to minimize the defect rate due to short, bubbles, or bridge oxidation generated in the soldering process, and it is possible to use a flexible and lead-free solder material without using expensive gold or silver, thereby reducing the manufacturing cost. It has an effect.

The effects of the present invention are not limited to those mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

1 is a flowchart showing a substrate soldering method according to the present invention.
2 is a view schematically showing the configuration of a mounting substrate soldering device according to a first embodiment of the present invention.
3 is a view schematically showing the configuration of a soldering apparatus for a mounting substrate according to a second embodiment of the present invention.
4 is a view showing the main components constituting a soldering apparatus for a mounting substrate according to a third embodiment of the present invention.
FIG. 5 is a view schematically showing a processing body constituting a soldering apparatus for a mounting substrate according to a third exemplary embodiment of the present invention.

Further objects, features and advantages of the present invention can be more clearly understood from the following detailed description and the accompanying drawings.

Prior to the detailed description of the present invention, the present invention may be variously modified and may have various embodiments, and the examples described below and illustrated in the drawings are intended to limit the present invention to specific embodiments. It is to be understood that the present invention includes all modifications, equivalents, and substitutes included in the spirit and technical scope of the present invention.

When a component is referred to as being "connected" or "connected" to another component, it may be directly connected to or connected to that other component, but it may be understood that other components may be present in between. Should be. On the other hand, when a component is said to be "directly connected" or "directly connected" to another component, it should be understood that there is no other component in between.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. As used herein, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described on the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, components, or a combination thereof.

In addition, the terms "... unit", "... unit", "... module", and the like described in the specification mean a unit for processing at least one function or operation, which means hardware or software or hardware and It can be implemented in a combination of software.

In addition, in the following description with reference to the accompanying drawings, the same components will be given the same reference numerals regardless of the reference numerals and redundant description thereof will be omitted. In the following description of the present invention, if it is determined that the detailed description of the related known technology may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

Hereinafter, a mounting board soldering apparatus and a soldering method according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings. The soldering members described below include substrates such as wafers and flexible substrates, connectors, quad-flat package (QFP), small-out line package (SOP), ball-grid array (BGA), semiconductor chips, chip resistors, chip capacitors, and jumpers. Electronic components, such as a wiring material, are named generically, and it means a well-known board | substrate and electronic components other than this.

First, the substrate soldering method according to the present invention will be described in detail with reference to FIG. 1. 1 is a flowchart showing a substrate soldering method according to the present invention.

The substrate soldering method according to the present invention is a method for soldering a coin electrode, which is an electrical connection of a soldering member that requires a circuit configuration, and as shown in FIG. 1, an object loading step for loading the soldering member into a closed space ( S100); A pretreatment step (S200) of injecting a liquid organic fatty acid polymer or organic fatty acid ester having a predetermined temperature to the soldering member loaded into the closed space; Soldering step (S300) for injecting molten solder to the pre-treated soldering member; A post-treatment step (S400) of spraying an organic fatty acid polymer to remove excess molten solder to the soldering target member which has passed the soldering step (S300); An object unloading step (S500) for unloading the post-processed soldering object member from a closed space; Smoke treatment step (S600) for discharging the smoke generated by the evaporation of the organic fatty acid polymer in the pre-treatment step (S200), soldering step (S300) and post-treatment step (S400) to the outside of the closed space (S600); And a spray control step (S700) for replenishing and recycling the organic fatty acid polymer and the molten solder used in the pretreatment step (S200), the soldering step (S300), and the post-treatment step (S400).

The object loading step (S100) and the object unloading step (S500) is a soldering target member such as a conveyor loading / unloading method using an endless belt or a robot arm loading / unloading method using a multi-stage and multi-axis robot arm automatically There is no particular limitation as long as it is a configuration or a method that can be loaded / unloaded. However, in the case of the conveyor loading / unloading method in order to have continuity with the post-process, it is preferable to be loaded / unloaded through a jig means capable of gripping at least two soldering members.

Here, it is preferable that the closed space where the soldering member is processed is formed as a closed space.

Next, in the pre-treatment step (S200) by spraying the organic fatty acid polymer heated to 70 ℃ ~ 250 ℃ to the soldering member using a spray nozzle, impurities such as oxides and flux components present on the surface of the soldering target member It is selectively absorbed to clean the surface of the coin electrode, which is an electrical connection.

The surface of the electrical connection portion (copper electrode) of the soldering target member pretreated with the organic fatty acid polymer is formed with a coating layer of organic fatty acid constituting the organic fatty acid polymer to clean the surface of the electrical connection portion, and to suppress oxidation of the surface to oxidize the surface. The film can be prevented from being produced.

In the pretreatment step S200, the closed space in which the soldering target member is processed is preferably maintained in a vacuum state, and may be configured to be filled with an inert gas such as nitrogen (N ₂ ) into the closed space.

Next, in the soldering step (S300) of injecting molten solder to the pre-treated soldering target member, the molten solder is sprayed onto the soldering target member on which a coating layer of organic fatty acid is formed using a spray nozzle.

The soldering step S300 may use molten solder based on a flexible and lead-free solder material. Preferably, the solder composition is made of a Sn-Ni-Ag-Cu-Ge alloy, and molten solder at a temperature of 240 ° C or more and 260 ° C or less may be used.

The molten solder sprayed in the soldering step (S300) as described above forms a CuNiSn intermetallic compound layer on the electrical connection portion formed of the copper material by combining nickel and tin contained in the molten solder with copper of an electrode of electrical connection. The CuNiSn intermetallic compound layer acts as an anti-melting layer of the electrical connection to prevent the loss or loss of the electrical connection.

Subsequently, since the post-processing step S400 is performed in the same manner as the pre-processing step S200, description thereof will be omitted.

Meanwhile, the soldering target member to be processed in the pretreatment step (S200), the soldering step (S300) and the post-treatment step (S400) is pretreated through a single organic fatty acid polymer injection means (for example, injection nozzle), After soldering through the molten solder spraying means, it is moved back to the single organic fatty acid polymer spraying means to be post-processed. In this case, the inlet and outlet through which the soldering member is introduced into and discharged into the closed space are the same, and the pretreatment and post-treatment of the soldering member are performed by a single organic fatty acid polymer injection means, so that the apparatus can be miniaturized. The manufacturing cost can be reduced.

In addition, the soldering target member to be processed in the pre-treatment step (S200), the soldering step (S300) and the post-treatment step (S400) is introduced through one side opening of the closed space and pretreated by the first organic fatty acid polymer injection means The soldering process may be performed through the molten solder spraying means, and then may be post-processed through the second organic fatty acid polymer spraying means to be discharged through the other outlet of the closed space. In this case, the soldering member is introduced into one side of the closed space and discharged to the other side, so that the process is performed very quickly, thereby improving productivity.

At this time, in the latter case, that is, when the input to one side of the closed space and discharged to the other side, the moving soldering target member may be moved through the moving means for moving horizontally, preferably moving to move inclined to one side The organic fatty acid polymer and the molten solder sprayed through the means are allowed to flow down from the soldering member to facilitate the pretreatment, the soldering and the post-treatment process, and the falling organic fatty acid polymer and the molten solder are stored in the storage container. Can be easily gathered.

Next, the smoke treatment step (S600) may be composed of aspirating the smoke of the organic fatty acid polymer generated in the closed space to discharge to the outside of the closed space, incineration of the discharged smoke. Here, the method may include cooling the smoke sucked before incineration of the smoke.

Subsequently, the spray control step S700 is not particularly limited as long as it is a control system capable of pumping the organic fatty acid polymer and the molten solder and supplying them alternately.

Preferably, in the present invention, the storage container for organic fatty acid polymers and the storage container for molten solder, and the organic fatty acid polymer and the molten solder are supplied in a spraying manner, thereby treating the soldering member and dropping the organic fatty acid polymer and the molten solder. Recycling storage containers are collected and can be maintained in a molten state having a constant temperature at all times, and the recycling storage containers are separately accommodated due to the difference in specific gravity of the organic fatty acid polymer and the molten solder, so that the middle portion and the organic fatty acid of the recycling storage container are separated. By connecting the storage container dedicated to the polymers through a recycling line for the treatment solution, and connecting the lower end of the recycle storage container and the dedicated storage container to the molten solder through a soldering recycling line, the organic fatty acid polymer and the molten solder accumulated in the recycle storage container are respectively organic. Storage container for fatty acid polymer To be supplied to the molten solder only storage container and is made such that an organic fatty acid polymer and the molten solder is supplied to pyeomping or its own weight from the organic fatty acid polymer-only storage container and only molten solder reservoir.

Here, in the spray control step (S700), the recycle storage container is provided with at least one level sensor capable of detecting the level of the organic fatty acid polymer and / or the molten solder, the organic fatty acid polymer injection means And a direct supply line directly connected to each of the molten solder injection means, the supply from the recycle storage container, the storage container dedicated to the organic fatty acid polymer, and the melting based on a detection signal detected from the water level sensor of the recycle storage container. It can be controlled so that the supply from the solder storage container can be combined.

For example, if the level sensor of the recycle storage container detects that the level of the organic fatty acid polymer is lowered or the level of the molten solder is lowered, the direct supply through the direct supply line from the recycle storage container is stopped, and the organic The organic fatty acid is controlled to be supplied from a storage container dedicated to a fatty acid polymer or a storage container dedicated to a molten solder, and when the level sensor of the recycle storage container detects that the level of the organic fatty acid polymer and the level of the molten solder are above a certain level, The supply from the polymerized storage container or the molten solder storage container is stopped and controlled so that the direct supply from the recycled storage container is made.

On the other hand, in the soldering step (S300) in the substrate soldering method according to the present invention, after the molten solder is injected to the soldering target member, the molten solder sprayed on the soldering target member is reliably up to the fine pitch of the soldering target member. Forming or plating bumps by squeezing or rolling the squeegee member, the roller member or the fine brush, etc., in contact with the molten solder-sprayed soldering member with an appropriate pressing force so as to be invasive. It may include.

In addition, the substrate soldering method according to the present invention further includes the forced space circulation in the closed space by using a fan or the like in each of the above steps so that the temperature in the closed space can be maintained evenly throughout. Can be.

Next, the mounting substrate soldering apparatus according to a preferred embodiment for implementing the mounting substrate soldering method according to the present invention as described above will be described in detail with reference to the accompanying drawings. In the following description of the mounting substrate soldering apparatus, descriptions overlapping with those described above will be omitted or briefly described for simplicity.

First, the mounting substrate soldering apparatus according to the first embodiment of the present invention will be described in detail with reference to FIG. 2. 2 is a view schematically showing the configuration of a mounting substrate soldering device according to a first embodiment of the present invention.

The mounting substrate soldering apparatus according to the first embodiment of the present invention is an apparatus for soldering a coin electrode, which is an electrical connection portion of a soldering member that requires a circuit configuration, as shown in FIG. A processing body 100 having an inlet and outlet having an openable and openable door; Drive means configured to supply and discharge the soldering member through the inlet and outlet of the processing body 100; At least one substrate surface treatment solution injection nozzle member (210) provided in a closed space in the processing body (100) and for injecting a liquid organic fatty acid polymer having a predetermined temperature to a soldering target member supplied by the driving means; At least one molten solder spray nozzle member 310 provided on one side of the substrate surface treatment solution spray nozzle member 210 for injecting molten solder to a soldering target member supplied by the driving means; Substrate surface treatment solution supply means for supplying an organic fatty acid polymer to the spray nozzle member 210 for substrate surface treatment; Molten solder supply means for supplying molten solder to the molten solder spray nozzle member 310; Smoke treatment means (not shown) in communication with the treatment body 100 for treating the evaporated smoke of the organic fatty acid polymer generated in the treatment body 100; The organic fatty acid polymer formed in the lower portion of the processing body 100 and sprayed from the substrate surface treatment solution injection nozzle member 210 and the molten solder injection nozzle member 310 to the soldering target member are integrated with the molten solder. A storage tank 400; Circulation means for circulating the organic fatty acid polymer and the molten solder collected in the reservoir 400; And a control panel (not shown) for controlling the above components (ie, driving means, substrate surface treatment supply means, molten solder supply means, smoke treatment means, and circulation means).

The processing body 100 has an inlet and outlet through which soldering member is introduced into and discharged from one side thereof, and the inner closed space of the processing body 100 is sealed and filled with an inert gas (for example, nitrogen gas). Is done. Therefore, when the inert gas is supplied, gas storage vessels, pipes and pumps for supplying the inert gas are included.

A well-known method may be employed for a method of enclosing the closed space of the treatment body 100, and the application of the method may be sufficiently understood by those skilled in the art, and thus, for clarity and simplification of the present disclosure, The description is omitted.

The drive means includes a drive pulley and a driven pulley at both ends, and includes a forward and reverse rotatable motor for driving the drive pulley by winding the conveyor belt, and configured to supply the soldering member by the conveyor belt supply method.

Here, the conveyor belt is a conveyor belt that is configured with a jig means that can be gripped on at least both sides so that the upper and lower surfaces of the soldering member is exposed to the outside.

The substrate surface treatment injection nozzle member 210 and the molten solder injection nozzle member 310 may be employed in any manner as long as they are capable of spraying and supplying an organic fatty acid polymer and molten solder. Here, the present invention may be configured in one fluid injection method in which only the injection nozzle member 210 and the molten solder injection nozzle member 310 for substrate surface treatment inject only the organic fatty acid polymer and the molten solder. In order to increase the treatment efficiency, it may be configured as a two-fluid injection method in which an inert gas is supplied together and diffused to be injected. In the latter case, an inert gas input path is further formed in the injection nozzle member 210, and the indirect gas input path may be configured to be connected to a line bypassed from the pipe for supplying the inert gas.

In addition, the substrate surface treatment nozzle member 210 and the molten solder spray nozzle member 310 are each formed in a pair facing each other so that the soldering member can be sprayed on the upper and lower surfaces thereof, and the supply direction of the soldering member Thus, the spray nozzle member 210 for substrate surface treatment, the melt solder spray nozzle member 310, and the spray nozzle member 210 for substrate surface treatment are arranged in this order.

In addition, the substrate surface treatment injection nozzle member 210 and the molten solder injection nozzle member 310 may be further provided with a heating member controlled by a control panel, respectively.

Subsequently, the substrate surface treatment solution supply means is provided in the storage container 220 to heat the organic fatty acid polymer storage container 220 and the organic fatty acid polymer at a constant temperature, and heats the organic fatty acid polymer. The organic fatty acid polymer from the organic fatty acid polymer storage container 220 is connected to a heating member 230 controlled by a control panel, the organic fatty acid polymer storage container 220 and the substrate surface treatment solution injection nozzle member 210. Pumping means 250 for pumping the organic fatty acid polymer from the solution supply line 240 and the organic fatty acid polymer storage container 220 for providing the to the substrate surface treatment solution injection nozzle member 210. ).

Here, the present invention further includes an auxiliary heating member 231 for heating the organic fatty acid polymer which is provided and supplied at one or more positions on the solution supply line 230. At this time, at least one location (position) of the solution supply line 230 is provided with a temperature sensor detects the temperature of the organic fatty acid polymer flowing along the solution supply line and transmits to the control panel, the control panel is the auxiliary heating member 231 It can be configured to control.

The heating member 230 is heated so that the organic fatty acid polymer stored and supplied in the organic fatty acid polymer storage container 220 has a temperature of 70 ℃ ~ 250 ℃, wherein the organic fatty acid polymer storage container 220 is a temperature sensor The detection signal of the temperature sensor may be transmitted to the control panel, and the control panel may be configured to control the heating member.

The organic fatty acid polymer supplied by the substrate surface treatment solution supply means is sprayed onto the soldering member to selectively absorb impurities such as an oxide or a flux component present on the surface of the soldering member, thereby providing an electrical connection (for example, an electrode). ) To clean the surface.

It is preferable that the said organic fatty acid polymer is a solution containing the organic fatty acid of 12 or more and 20 or less carbon atoms. When the carbon number is out of the range, the organic fatty acid is not preferable because of its high melting point, poor permeability, and difficulty in handling.

The surface of the electrical connection portion (copper electrode) of the soldering target member pretreated with the organic fatty acid polymer is formed with a coating layer of organic fatty acid constituting the organic fatty acid polymer to clean the surface of the electrical connection portion, and to suppress oxidation of the surface to oxidize the surface. The film can be prevented from being produced.

Next, the molten solder supply means heats the molten solder storage container 320 for storing molten solder and the molten solder storage container 320 to maintain the molten solder in the molten solder storage container 320. Molten solder from the molten solder storage container 320 by connecting a heating member 330 controlled by the control panel, the molten solder storage container 320 and the molten solder injection nozzle member 310 to each other. The molten solder supply line 340 for providing to the injection nozzle member 310 and the molten solder from the molten solder storage container 320 to the molten solder injection nozzle member 310 through the molten solder supply line 340. And pumping means (not shown) controlled by the control panel.

Here, the present invention further includes an auxiliary heating member 331 for heating the molten solder which is provided and supplied at one or more positions on the molten solder supply line 340. At this time, one or more locations (positions) of the molten solder supply line 340 is provided with a temperature sensor to detect the temperature of the molten solder so that the molten solder flowing along the molten solder supply line 340 maintains an appropriate molten state control panel The control panel may be configured to control the auxiliary heating member 331.

In addition, the molten solder storage container 320 is positioned above the processing body 100 so that the molten solder from the molten solder storage container 320 is provided to the molten solder spray nozzle member 310 by its own weight. Can be configured.

The molten solder may use molten solder based on a flexible and lead-free solder material. Preferably, the solder composition is made of a Sn-Ni-Ag-Cu-Ge alloy, and molten solder at a temperature of 240 ° C or more and 260 ° C or less may be used.

As such, the molten solder supplied through the molten solder supply means is injected through the substrate surface treatment solution supply means into the soldering target member in which the organic fatty acid polymer is injected to form a coating layer of the organic fatty acid.

The injected molten solder combines nickel and tin contained in the molten solder with copper of the copper electrode, which is an electrical connection portion, to form a CuNiSn intermetallic compound layer at an electrical connection portion formed of copper material, and the CuNiSn intermetallic compound layer is formed of an electrical connection portion. It acts as an anti-melting layer to prevent the loss or loss of electrical connections.

Subsequently, the smoke treatment means includes a hood for accumulating the smoke of the organic fatty acid polymer generated in the enclosed space, and an incinerator for incinerating the accumulated smoke, and can cool the smoke sucked before incineration of the smoke. Which may include a cooler.

The storage tank 400 configured at the lower side of the processing body 100 is a tank in which the organic fatty acid polymer and molten solder are dropped by being sprayed to the soldering member. The heating member 410 is provided on the inner and outer sides of the storage tank 400 to maintain the molten state of the organic fatty acid polymer and the molten solder collected.

Next, in the circulation means, the organic fatty acid polymer is collected at the upper side due to the difference in specific gravity of the organic fatty acid polymer and the molten solder in the storage tank 400, and the molten solder is collected at the lower side thereof. A first connection line 510 connected to an intermediate portion (eg, a design position above the full water level of the molten solder) and configured to provide the organic fatty acid polymer to the organic fatty acid polymer storage container 220, and The lower end of the reservoir 400 includes a second connection line 520 connected to provide molten solder to the molten solder storage container 320.

The reservoir 400 at one lower side of the first connection line 510 connected to the reservoir 400 is provided with a level sensor for detecting the level of the molten solder, and the level of the molten solder is detected from the level sensor. If so, further includes opening and closing means (for example, a valve) for opening and closing the inlet of the first connecting means, the opening and closing means is controlled by a control panel.

In addition, the circulation means is a first direct supply line (not shown) connected to the intermediate portion of the organic fatty acid polymer injection nozzle member 210 and the reservoir 400 or connected to the first connection line 510, the melting A second direct supply line (not shown) connected to the solder spray nozzle member 310 and the lower end of the reservoir 400 or connected to the second connection line 520, and the organic fatty acid polymer and the molten solder from each of the direct supply lines. Pumping means for pumping, and the heating member is provided in each of the direct supply line.

In this case, the control panel may selectively supply the direct supply from the reservoir 400 and the supply from the organic fatty acid polymer storage container and the molten solder storage container based on a detection signal detected from the water level sensor of the storage tank 400. Can be configured to control.

For example, when it is detected by the level sensor of the reservoir 400 that the level of the organic fatty acid polymer is lowered or the level of the molten solder is lowered, the control panel directly stops the supply from the reservoir 400, and the organic The fatty acid polymer storage container 220 or the molten solder storage container 320 is controlled to be supplied.

In addition, when the water level sensor of the storage tank 400 detects that the level of the organic fatty acid polymer and the level of the molten solder are above a certain level, the supply from the organic fatty acid polymer storage container or the molten solder storage container is stopped, and the It is controlled so that the feed is made directly from the reservoir.

In this way, the organic fatty acid polymer and the molten solder can be selectively supplied to each storage container so that the organic fatty acid polymer and the molten solder can be supplied directly from the reservoir without stopping the device. Work will be possible.

Next, the soldering apparatus of the mounting substrate according to the second embodiment of the present invention will be described in detail with reference to FIG. 3. 3 is a view schematically showing the configuration of a soldering apparatus for a mounting substrate according to a second embodiment of the present invention. For the contents overlapped with the first embodiment described above, the description thereof is omitted or simplified for clarity and simplification of the description, and the same reference numerals are assigned to the components having the same or identical functions.

The soldering apparatus for a mounting substrate according to the second embodiment of the present invention, as shown in FIG. 3, is an apparatus for soldering a coin electrode, which is an electrical connection portion of a soldering target member that requires a circuit configuration, to form a closed space, A processing body (100) having an inlet provided with an openable opening / closing door and an outlet opening with an openable opening / closing door at the other side thereof; Drive means configured to supply and discharge a soldering member through an inlet and an outlet of the processing body 100; At least one substrate surface treatment solution injection nozzle member (210) provided in a closed space in the processing body (100) and spraying an organic fatty acid polymer having a predetermined temperature to a soldering target member supplied by the driving means; One or more molten solder spray nozzle members (310) provided in a closed space in the processing body (100) and spraying molten solder on a soldering target member supplied by the driving means; Substrate surface treatment solution supply means for supplying an organic fatty acid polymer to the spray nozzle member 210 for substrate surface treatment; Molten solder supply means for supplying molten solder to the molten solder spray nozzle member 310; Smoke treatment means for treating the evaporated smoke of the organic fatty acid polymer generated in the treatment body 100 in communication with the treatment body 100; The organic fatty acid polymer formed in the lower portion of the processing body 100 and sprayed from the substrate surface treatment solution injection nozzle member 210 and the molten solder injection nozzle member 310 to the soldering target member are integrated with the molten solder. A storage tank 400; Circulation means for circulating the organic fatty acid polymer and the molten solder collected in the reservoir 400; And a control panel (not shown) for controlling the above components (ie, driving means, substrate surface treatment supply means, molten solder supply means, smoke treatment means, and circulation means).

The treatment body 100 has an inlet through which a soldering member is introduced into one side, and an outlet opening is formed on the other side of the inlet opposite to the inlet, and the interior closed space of the treatment body 100 is sealed and inert gas (for example, , Nitrogen gas). Therefore, when the inert gas is supplied, gas storage vessels, pipes and pumps for supplying the inert gas are included.

The drive means includes a drive pulley 101 and a driven pulley 102 at both ends, and includes a forward and reverse rotatable motor for driving the drive pulley by winding the conveyor belt. Configured to feed and discharge while passing through 100).

Here, the conveyor belt is a conveyor belt that is configured with a jig means that can be gripped on at least both sides so that the upper and lower surfaces of the soldering member is exposed to the outside.

The substrate surface treatment injection nozzle member 210 and the molten solder injection nozzle member 310 may be employed in any manner as long as they are capable of spraying and supplying an organic fatty acid polymer and molten solder. Here, the present invention may be configured in one fluid injection method in which only the injection nozzle member 210 and the molten solder injection nozzle member 310 for substrate surface treatment inject only the organic fatty acid polymer and the molten solder. In order to increase the treatment efficiency, it may be configured as a two-fluid injection method in which an inert gas is supplied together and diffused to be injected. In the latter case, an inert gas input path is further formed in the injection nozzle member 210, and the indirect gas input path may be configured to be connected to a line bypassed from the pipe for supplying the inert gas.

In addition, the substrate surface treatment nozzle member 210 and the molten solder spray nozzle member 310 are each formed in a pair to face each other so that the soldering member can be sprayed from the upper and lower sides, and the soldering member is supplied. The jet nozzle member 210 for the substrate surface treatment, the melt solder jet nozzle member 310, and the jet nozzle member 210 for the substrate surface treatment are arranged in the discharge direction.

In addition, the substrate surface treatment injection nozzle member 210 and the molten solder injection nozzle member 310 may be further provided with a heating member controlled by a control panel, respectively.

Subsequently, the substrate surface treatment solution supply means is provided in the storage container 220 to heat the organic fatty acid polymer storage container 220 and the organic fatty acid polymer at a constant temperature, and heats the organic fatty acid polymer. The organic fatty acid polymer from the organic fatty acid polymer storage container 220 is connected to a heating member 230 controlled by a control panel, the organic fatty acid polymer storage container 220 and the substrate surface treatment solution injection nozzle member 210. Pumping means 250 for pumping the organic fatty acid polymer from the solution supply line 240 and the organic fatty acid polymer storage container 220 for providing the to the substrate surface treatment solution injection nozzle member 210. ).

Here, the present invention further includes an auxiliary heating member 231 for heating the organic fatty acid polymer which is provided and supplied at one or more positions on the solution supply line 230. At this time, at least one location (position) of the solution supply line 230 is provided with a temperature sensor detects the temperature of the organic fatty acid polymer flowing along the solution supply line and transmits to the control panel, the control panel is the auxiliary heating member 231 It can be configured to control.

The heating member 230 is heated so that the organic fatty acid polymer stored and supplied in the organic fatty acid polymer storage container 220 has a temperature of 70 ℃ ~ 250 ℃, wherein the organic fatty acid polymer storage container 220 is a temperature sensor The detection signal of the temperature sensor may be transmitted to the control panel, and the control panel may be configured to control the heating member.

The organic fatty acid polymer supplied by the substrate surface treatment solution supply means is sprayed onto the soldering member to selectively absorb impurities such as an oxide or a flux component present on the surface of the soldering member, thereby providing an electrical connection (for example, an electrode). ) To clean the surface.

The surface of the electrical connection portion (copper electrode) of the member to be soldered pretreated with the organic fatty acid polymer as described above is formed with a coating layer of organic fatty acid constituting the organic fatty acid polymer to clean the surface of the electrical connection portion and to suppress oxidation of the surface. The formation of an oxide film can be prevented.

Next, the molten solder supply means heats the molten solder storage container 320 for storing molten solder and the molten solder storage container 320 to maintain the molten solder in the molten solder storage container 320. Molten solder from the molten solder storage container 320 by connecting a heating member 330 controlled by the control panel, the molten solder storage container 320 and the molten solder injection nozzle member 310 to each other. The molten solder supply line 340 for providing to the injection nozzle member 310 and the molten solder from the molten solder storage container 320 to the molten solder injection nozzle member 310 through the molten solder supply line 340. And pumping means 350 for supplying and controlled by the control panel.

Here, the present invention further includes an auxiliary heating member 331 for heating the molten solder which is provided and supplied at one or more positions on the molten solder supply line 340. At this time, one or more locations (positions) of the molten solder supply line 340 is provided with a temperature sensor to detect the temperature of the molten solder so that the molten solder flowing along the molten solder supply line 340 maintains an appropriate molten state control panel The control panel may be configured to control the auxiliary heating member 331.

In addition, the molten solder storage container 320 is positioned above the processing body 100 so that the molten solder from the molten solder storage container 320 is provided to the molten solder spray nozzle member 310 by its own weight. Can be configured.

Subsequently, the smoke processing means includes a hood 351 for accumulating the smoke of the organic fatty acid polymer generated in the closed space, and an incinerator 352 for incinerating the accumulated smoke, which is sucked before incineration of the smoke. It may include a cooler 353 that can cool the smoke.

The storage tank 400 configured at the lower side of the processing body 100 is a tank in which the organic fatty acid polymer and molten solder are dropped by being sprayed to the soldering member. The heating member 410 is provided on the inner and outer sides of the storage tank 400 to maintain the molten state of the organic fatty acid polymer and the molten solder collected.

Next, in the circulation means, the organic fatty acid polymer is collected at the upper side due to the difference in specific gravity of the organic fatty acid polymer and the molten solder in the storage tank 400, and the molten solder is collected at the lower side thereof. A first connection line 510 connected to an intermediate portion (eg, a design position above the full water level of the molten solder) and configured to provide the organic fatty acid polymer to the organic fatty acid polymer storage container 220, and The lower end of the reservoir 400 includes a second connection line 520 connected to provide molten solder to the molten solder storage container 320.

Heating members 230 and 330 may be further configured in the first and second connection lines 510 and 520, respectively.

The reservoir 400 at one lower side of the first connection line 510 connected to the reservoir 400 is provided with a water level sensor 420 capable of detecting the level of molten solder, from the water level sensor 420. When the level of the molten solder is detected, it further includes opening and closing means (for example, a valve) for opening and closing the inlet of the first connecting means, the opening and closing means is controlled by a control panel.

The circulation means may include a first direct supply line 530 connected to an intermediate portion of the organic fatty acid polymer injection nozzle member 210 and the reservoir 400 or a first connection line 510, and the molten solder. A second direct supply line 540 connected to the injection nozzle member 310 and the lower end of the reservoir 400 or connected to the second connection line 520, pumping the organic fatty acid polymer and molten solder from each of the direct supply lines It further comprises a pumping means (not shown), and a heating member (not shown) provided in each of the direct supply line.

In this case, the control panel may selectively supply the direct supply from the reservoir 400 and the supply from the organic fatty acid polymer storage container and the molten solder storage container based on a detection signal detected from the water level sensor of the storage tank 400. Can be configured to control.

For example, when it is detected by the level sensor of the reservoir 400 that the level of the organic fatty acid polymer is lowered or the level of the molten solder is lowered, the control panel directly stops the supply from the reservoir 400, and the organic The fatty acid polymer storage container 220 or the molten solder storage container 320 is controlled to be supplied.

In addition, when the water level sensor of the storage tank 400 detects that the level of the organic fatty acid polymer and the level of the molten solder are above a certain level, the supply from the organic fatty acid polymer storage container or the molten solder storage container is stopped, and the It is controlled so that the feed is made directly from the reservoir.

In this way, the organic fatty acid polymer and the molten solder can be selectively supplied to each storage container so that the organic fatty acid polymer and the molten solder can be supplied directly from the reservoir without stopping the device. Work will be possible.

Next, the soldering apparatus of the mounting substrate according to the third embodiment of the present invention will be described in detail with reference to FIGS. 4 and 5. 4 is a view showing the main components constituting the soldering apparatus of the mounting substrate according to a third embodiment of the present invention, Figure 5 is a processing body constituting the soldering apparatus of the mounting substrate according to a third embodiment of the present invention It is a figure which shows schematically. Descriptions overlapping with the above-described embodiments are omitted or simplified for clarity and simplicity of description, and the same reference numerals are assigned to components having the same or identical functions.

A soldering apparatus for a mounting substrate according to a third exemplary embodiment of the present invention is an apparatus for soldering a coin electrode, which is an electrical connection portion of a soldering target member that requires a circuit configuration, as shown in FIGS. 4 and 5, and forms a closed space. A treatment body 100 provided with an inlet and an outlet having opening and closing doors open and closed on opposite sides thereof; Drive means configured to supply and discharge a soldering member through an inlet and an outlet of the processing body 100; A first substrate surface treatment solution injection nozzle member 210 and a first substrate surface treatment solution spray nozzle member 210 provided in a closed space in the processing body 100 and spraying an organic fatty acid polymer having a predetermined temperature to a soldering target member supplied by the driving means. 2 substrate surface treatment solution spray nozzle member 210 '; One or more molten solder spray nozzle members (310) provided in a closed space in the processing body (100) and spraying molten solder on a soldering target member supplied by the driving means; Substrate surface treatment solution supply means for supplying an organic fatty acid polymer to the spray nozzle member 210 for substrate surface treatment; Molten solder supply means for supplying molten solder to the molten solder spray nozzle member 310; Smoke treatment means (not shown) in communication with the treatment body 100 for treating the evaporated smoke of the organic fatty acid polymer generated in the treatment body 100; The organic fatty acid polymer formed in the lower portion of the processing body 100 and sprayed from the substrate surface treatment solution injection nozzle member 210 and the molten solder injection nozzle member 310 to the soldering target member are integrated with the molten solder. Reservoir (not shown); Circulation means for circulating the organic fatty acid polymer and the molten solder collected in the reservoir; And a control panel (not shown) for controlling the above components (ie, driving means, substrate surface treatment supply means, molten solder supply means, smoke treatment means, and circulation means).

The processing body 100 is formed of the first space 121 and the first space 121 by a plurality of partition members 110 having a moving path 111 (see FIG. 7) to which a soldering target member supplied by the driving means is movable. The second space portion 122 and the third space portion 123 are divided into three, the first space portion 121 is provided with a first substrate surface treatment solution injection nozzle member 210, the second space portion A molten solder spray nozzle member 310 is provided at 122, and the third space portion 123 is provided with a second substrate surface treatment solution spray nozzle member 210 ′.

In addition, the processing body 110 in which the spaces 121 to 123 are located is formed with an observation window 130 for viewing the working process.

The closed space of the treatment body 100 is sealed and made to be filled with an inert gas (for example, nitrogen gas). Therefore, when the inert gas is supplied, gas storage vessels, pipes and pumps for supplying the inert gas are included.

The configuration of the processing body 100 may also be applied to the first to third embodiments described above.

The drive means is a conveyor belt 103 is wound around both ends of the processing body 110, the drive pulley 101 and the driven pulley 102 is provided, the drive pulley 101 and driven pulley 102 is processed It is fixed to the rotating shaft 104 rotatably extending through the body 110, the forward and reverse rotatable motor 105 is formed on the rotating shaft 104 of the drive pulley 101 side is formed outside the processing body 110 Connected and rotated thereby.

Here, the conveyor belt 103 is a conveyor belt is composed of a jig means 106 that can be gripped at least on both sides so that the upper and lower surfaces of the soldering member is exposed.

In the second space portion 122 of the processing body 110 of the substrate soldering apparatus of the third embodiment, the molten solder is injected to the soldering target member by the molten solder spray nozzle member 310 and then the soldering target member is applied to the soldering target member. The molten solder invasion member 160, such as a squeegee, a roller, or a fine brush, may be further included to spray the molten solder reliably even to the fine pitch of the soldering member.

In the drawing, the molten solder invading member 160 shows a case of a roller. For example, when the shape of the roller is used as the molten solder invasive member 160, the roller may be composed of a polygon as well as a circular having a concave-convex in the direction orthogonal to the rotational direction, preferably SUS, It is preferable to use what plated with tin, copper, chromium, silver, etc.

The molten solder invasion member 160 contacts the surface of the soldering target member to which the molten solder is injected with a predetermined contact force, so that the molten solder penetrates even the fine pitch of the soldering target member to enable reliable bump formation and plating. .

The molten solder invasive member 160 may also be configured in the first to third embodiments described above.

In addition, in the present invention, the supply of molten solder is supplied from the molten solder invasion member 160 together with the injection method by the molten solder injection nozzle member 310 or simultaneously with the injection method by the molten solder injection nozzle member 310. It can be configured to be executed by causing the molten solder to be discharged.

On the other hand, the substrate soldering apparatus according to the third embodiment of the present invention further includes an airflow circulation fan (not shown) provided on one side of the closed space of the processing body 100 to forcibly circulate the airflow in the internal space. It is desirable to force circulation of the internal heat so that the temperature in the enclosed space can be maintained evenly throughout.

The configuration of the air circulation fan can also be applied to the first to third embodiments described above.

In addition, in the third embodiment, the control panel selectively controls the soldering member to be unloaded by only half a turn in the course of being processed in the processing body 110 by the driving means, or to be unloaded by proceeding more than one wheel. Can be controlled to load. As a result, when the process is performed by only half a turn according to the soldering target member to be processed, the productivity can be improved, and the soldering can be performed by proceeding more than one turn.

Other components other than the components described above are the same as the components of the first to third embodiments described above, so a detailed description thereof will be omitted.

Meanwhile, in the above description of the soldering apparatus of the present invention, the soldering member is processed and processed horizontally in the processing body. However, the molten solder and the organic fatty acid sprayed by being inclined toward either side are processed. It is also possible to apply a method in which the polymer flows down to its own weight so that it can be easily collected in a reservoir.

According to the mounting substrate soldering device and the soldering method according to the present invention as described above, it is possible to ensure the reliability of the electrical connection by maintaining the wettability of the solder in the mounting process of the electronic components and to prevent the occurrence of coin type It can protect the workers from harmful gases generated in the process, improve the working environment, improve the productivity by improving the productivity, and minimize the defect rate caused by short, air bubbles or bridged oxidation, etc. Flexible and lead-free solder materials can be used without the need for expensive gold or silver, thereby reducing manufacturing costs.

The embodiments and the accompanying drawings described herein are merely illustrative of some of the technical ideas included in the present invention. Therefore, since the embodiments disclosed herein are not intended to limit the technical spirit of the present invention, but to explain, it is obvious that the scope of the technical spirit of the present invention is not limited by these embodiments. Modifications and specific embodiments that can be easily inferred by those skilled in the art within the scope of the technical idea included in the specification and drawings of the present invention should be construed as being included in the scope of the present invention.

100: treatment body
110: partition member
121 to 123: compartment space portion (first space portion, second space portion, third space portion)
210: substrate surface treatment solution injection nozzle member
220: organic fatty acid polymer storage container
230, 231, 330, 331, 410: heating member
240: solution supply line
250, 350: pumping means
310: molten solder spray nozzle member
320: molten solder storage container
340: molten solder supply line
351: hood
352: incinerator
353: cooler
360: storage container for self-weight supply
370: recovery line
400: reservoir
510: first connection line
520: second connection line
530: first direct supply line
540: second direct supply line
S100: object loading step
S200: pretreatment step
S300: Soldering Step
S400: Post Processing Step
S500: object unloading step
S600: Smoke Treatment Step
S700: Spray Control Step

Claims (13)

As a method for soldering a coin electrode, which is an electrical connection of a soldering member that requires a circuit configuration,
A moving path partitioned into a first space portion, a second space portion, and a third space portion by a plurality of partition members, wherein the first space portion, the second space portion, and the third space portion are provided in the plurality of partition members, respectively. An object loading step for loading the soldering object member into a closed space connected through it;
A pretreatment step of spraying an organic fatty acid polymer having a predetermined temperature onto the soldering target member loaded into the first space portion through at least one first substrate surface treatment solution spray nozzle member disposed in the first space portion;
A soldering step of spraying molten solder through at least one molten solder spray nozzle member disposed in the second space portion to a soldering target member pretreated in the first space portion and then transferred to the second space portion;
After the soldering step in the second space portion through the one or more second substrate surface treatment solution injection nozzle member disposed in the third space in order to remove excess molten solder to the soldering target member transferred to the third space portion Post-treatment step of spraying a liquid organic fatty acid polymer;
An object unloading step for unloading the post-processed soldering object member from a closed space;
A smoke treatment step of discharging the smoke generated by the evaporation of the organic fatty acid polymer in the pretreatment step, the soldering step and the post-treatment step to the outside of the closed space;
And a spray control step of recirculating the organic fatty acid polymer and the molten solder used in the pretreatment step, the soldering step and the post-treatment step, and circulating to recycle.
The soldering step may include a squeegee member, a roller member, or a fine particle so that the molten solder injected into the soldering member after the molten solder is injected to the soldering member may be invaded to a fine pitch of the soldering member. Using a brush to make the molten solder contact the injected soldering member,
In the spraying control step, the organic fatty acid polymer and the molten solder dropped by being sprayed to the soldering member are collected in the same storage container, and the collected organic fatty acid polymer and the molten solder are recycled in the pretreatment step, the soldering step, and the post-treatment step. Circulating, so that the organic fatty acid polymer and the molten solder are supplied directly from the storage container, or the organic fatty acid polymer storage container in which the organic fatty acid polymer is stored and the molten solder storage container in which the molten solder is stored.
Mounting Board Soldering Method.
The method of claim 1,
In the soldering step, a molten solder having a Sn-Ni-Ag-Cu-Ge alloy composition and having a temperature of 240 ° C. or more and 260 ° C. or less is used.
Mounting Board Soldering Method.
The method according to claim 1 or 2,
The smoke treatment step includes inhaling, cooling, and burning the smoke to discharge the smoke.
Mounting Board Soldering Method.
delete delete The method of claim 1,
Comprising the forced circulation of the air flow in the closed space to be treated the soldering member
Mounting Board Soldering Method.
An apparatus for soldering a coin pole, which is an electrical connection portion of a soldering member that requires a circuit configuration,
A closed space is formed, and an inlet and outlet is provided at one side, and the inside is partitioned into a first space portion, a second space portion, and a third space portion by a plurality of partition members, wherein the first space portion and the second space portion and A processing body having a third space part connected to each of the plurality of partition members through a moving path;
A conveyor belt disposed in a closed space of the processing body so as to pass through a moving path of the partition member, a driving pulley and a driven pulley rotatably disposed at both end sides of the processing body so that the conveyor belt is wound; Both sides of the motor to be connected to the driving pulley and the upper and lower surfaces of the soldering target member are exposed to move the soldering target member through the moving path along the first space, the second space, and the third space. Drive means including a plurality of jig means provided on the conveyor belt for holding at the conveyor belt and configured to supply and discharge the soldering member through the inlet and outlet of the processing body;
At least one first substrate surface treatment solution injection nozzle member disposed in the first space and injecting an organic fatty acid polymer having a predetermined temperature to the soldering member supplied by the driving means;
At least one molten solder spray nozzle member disposed in the second space and injecting molten solder to a soldering target member supplied by the driving means;
At least one second substrate surface treatment solution injection nozzle member disposed in the third space and injecting an organic fatty acid polymer having a predetermined temperature to a soldering member supplied by the driving means;
A substrate surface treatment solution supply means having an organic fatty acid polymer storage container for storing an organic fatty acid polymer for supplying the organic fatty acid polymer to the first and second substrate surface treatment solution injection nozzle members;
Molten solder supply means having a molten solder storage container for storing molten solder for supplying molten solder to the molten solder spray nozzle member;
Smoke treatment means for treating evaporated smoke of the organic fatty acid polymer produced in the treatment body in communication with the treatment body;
A storage tank configured under the processing body and integrating molten solder with an organic fatty acid polymer that is dropped by being sprayed from the first and second substrate surface treatment solution injection nozzle members and the molten solder injection nozzle member to a soldering target member;
Circulation means for circulating the organic fatty acid polymer and the molten solder collected in the reservoir;
The second squeegee, a roller, or a fine brush, and the molten solder is in contact with the soldered member to which the molten solder is sprayed so that the molten solder sprayed on the soldered member is infiltrated to the fine pitch of the soldered member; A molten solder invasive member disposed in the space portion; And
A control panel for controlling the drive means, substrate surface treatment solution supply means, molten solder supply means, smoke treatment means, and circulation means,
The circulation means,
A first connection line connected to an intermediate portion of the storage tank and configured to provide an organic fatty acid polymer to the organic fatty acid polymer storage container;
A second connection line connected to a lower end of the reservoir to provide molten solder to the molten solder storage container;
At least one level sensor detecting the level of the organic fatty acid polymer and the level of the molten solder in the reservoir;
A first direct supply line connected to an intermediate portion of the reservoir and configured to provide an organic fatty acid polymer to the first and second substrate surface treatment solution injection nozzle members;
A second direct supply line connected to a lower end of the reservoir and configured to provide molten solder to the molten solder spray nozzle member;
Pumping means for pumping an organic fatty acid polymer and molten solder from each of said direct supply lines;
And a heating member provided in each of the direct supply lines.
The control panel, based on the detection signal of the water level sensor, the first and second substrate surface treatment solution injection nozzle member and the molten solder injection nozzle from the reservoir through the first direct supply line and the second direct supply line. The organic fatty acid polymer and the molten solder are supplied directly to the member, or the organic fatty acid is supplied to the first and second substrate surface treatment solution injection nozzle members and the molten solder injection nozzle member from the organic fatty acid polymer storage container and the molten solder storage container. To control the supply of the polymer and the molten solder, respectively.
Mounting board soldering device.
An apparatus for soldering a coin pole, which is an electrical connection portion of a soldering member that requires a circuit configuration,
A closed space is formed, and an inlet is provided at one side and an outlet at the other side, and the interior is partitioned into a first space portion, a second space portion, and a third space portion by a plurality of partition members, wherein the first space portion and the second space portion are provided. A processing body to which a space part and a third space part are connected through a moving path provided in the plurality of partition members, respectively;
A conveyor belt disposed in a closed space of the processing body so as to pass through a moving path of the partition member, a driving pulley and a driven pulley rotatably disposed at both end sides of the processing body so that the conveyor belt is wound; Both sides of the motor to be connected to the driving pulley and the upper and lower surfaces of the soldering target member are exposed to move the soldering target member through the moving path along the first space, the second space, and the third space. A driving means having a plurality of jig means provided on the conveyor belt so as to be gripped by the conveyor belt, and configured to supply and discharge the soldering target member through the inlet and the outlet of the processing body;
At least one first substrate surface treatment solution injection nozzle member disposed in the first space and injecting an organic fatty acid polymer having a predetermined temperature to the soldering member supplied by the driving means;
At least one molten solder spray nozzle member disposed in the second space and injecting molten solder to a soldering target member supplied by the driving means;
At least one second substrate surface treatment solution injection nozzle member disposed in the third space and injecting an organic fatty acid polymer having a predetermined temperature to a soldering member supplied by the driving means;
Substrate surface treatment solution supply means having an organic fatty acid polymer storage container for storing an organic fatty acid polymer in order to supply a liquid organic fatty acid polymer to the first and second substrate surface treatment solution injection nozzle members;
Molten solder supply means having a molten solder storage container for storing molten solder for supplying molten solder to the molten solder spray nozzle member;
Smoke treatment means for treating the evaporated smoke of the organic fatty acid polymer generated in the treatment body in communication with the treatment body;
A storage tank configured under the processing body and integrating molten solder with an organic fatty acid polymer that is dropped by being sprayed from the first and second substrate surface treatment solution injection nozzle members and the molten solder injection nozzle member to a soldering target member;
Circulation means for circulating the organic fatty acid polymer and the molten solder collected in the reservoir;
The second squeegee, a roller, or a fine brush, and the molten solder is in contact with the soldered member to which the molten solder is sprayed so that the molten solder sprayed on the soldered member is infiltrated to the fine pitch of the soldered member; A molten solder invasive member disposed in the space portion; And
And a control panel for controlling the drive means, substrate surface treatment solution supply means, molten solder supply means, smoke treatment means, and circulation means.
The circulation means,
A first connection line connected to an intermediate portion of the storage tank and configured to provide an organic fatty acid polymer to the organic fatty acid polymer storage container;
A second connection line connected to a lower end of the reservoir to provide molten solder to the molten solder storage container;
At least one level sensor detecting the level of the organic fatty acid polymer and the level of molten solder in said reservoir;
A first direct supply line connected to an intermediate portion of the reservoir and configured to provide an organic fatty acid polymer to the first and second substrate surface treatment solution injection nozzle members;
A second direct supply line connected to a lower end of the reservoir and configured to provide molten solder to the molten solder spray nozzle member;
Pumping means for pumping an organic fatty acid polymer and molten solder from each of said direct supply lines;
And a heating member provided in each of the direct supply lines.
The control panel, based on the detection signal of the water level sensor of the reservoir, the first and second substrate surface treatment solution injection nozzle member and the molten solder from the reservoir through the first direct supply line and the second direct supply line. The organic fatty acid polymer and the molten solder are directly supplied to the injection nozzle member, or the first and second substrate surface treatment solution injection nozzle members and the molten solder injection nozzle member are respectively supplied from the organic fatty acid polymer storage container and the molten solder storage container. To control the supply of the organic fatty acid polymer and the molten solder, respectively.
Mounting board soldering device.
delete The method according to claim 7 or 8,
It is provided on one side of the closed space of the processing body further includes an air flow circulation fan for forced circulation of the air flow in the interior space
Soldering device for mounting board.
The method according to claim 7 or 8,
The molten solder has a Sn-Ni-Ag-Cu-Ge alloy composition and is made to have a temperature of 240 ℃ to 260 ℃
Soldering device for mounting board.
The method according to claim 7 or 8,
The first and second substrate surface treatment solution injection nozzle members and the molten solder injection nozzle members are formed in pairs facing each other so that the soldering target members can be sprayed on the upper and lower surfaces thereof.
The substrate surface treatment solution supply means includes a heating member which is provided in the organic fatty acid polymer storage container to heat the organic fatty acid polymer and controlled by the control panel to maintain the organic fatty acid polymer at a constant temperature, and the organic fatty acid polymer storage container. Connecting the substrate surface treatment solution injection nozzle member to provide the organic fatty acid polymer from the organic fatty acid polymer storage container to the first and second substrate surface treatment solution injection nozzle members, and a solution supply line having a heating member; Pumping the organic fatty acid polymer from the organic fatty acid polymer storage container, the pumping means controlled by the control panel, and at one or more locations of the solution supply line to detect the temperature of the organic fatty acid polymer flowing along the solution supply line Including temperature sensor to transmit to the control panel ,
The molten solder supply means heats the molten solder storage container and connects the heating member controlled by the control panel with the molten solder storage container and the molten solder spray nozzle member to connect the molten solder from the molten solder storage container. The molten solder spray nozzle member is provided as a molten solder spray nozzle member, and a molten solder supply line equipped with a heating member, and molten solder from the molten solder storage container are supplied to the molten solder spray nozzle member through a molten solder supply line and controlled by the control panel. Comprising pumping means;
Soldering device for mounting board. delete

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