KR101974306B1 - Method of manufacturing a plane heating element structure - Google Patents

Abstract

The present invention relates to a method for manufacturing a planar heating element structure, wherein a water-soluble sacrificial pattern is formed on the flexible insulating substrate; an alloy thin film is formed on the flexible insulating substrate so as to cover the sacrificial pattern; and a single metal thin film is formed on the alloy thin film. Then, a lift-off process using the water-soluble sacrificial pattern is performed to form an alloy thin film pattern a single metal thin film pattern from the alloy thin film and the single metal thin film on the flexible insulating substrate, respectively. Then, a radiation layer is formed on the single metal thin film pattern.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method of manufacturing a planar heating element structure,

The present invention relates to a method of manufacturing an area heating element structure. More particularly, the present invention relates to a method of manufacturing a planar heating element structure using radiant heat generated by electric current application.

The planar heating element corresponds to a heating element that generates heat in a plane. The planar heating element has an advantage of being excellent in heat generation efficiency compared with the conventional linear heating element, capable of controlling the temperature rise quickly, and having a thin structure of the heating part, so that it can be applied to various products.

The planar heating element is applied to a portable heating device, a portable heating device, a medical device, and a heating device of an airlable heating device which are required to have high flexibility and light weight characteristics, such as a transparent / flexible heater used in automobile glass, The application field is expanding.

Generally, the planar heating element structure includes sequentially formed conductive heating elements, a metal electrode, and an insulating layer.

When a rated voltage is applied to the metal electrode, the conductive heating element generates heat. In order to form such a surface heating element, metal spheres or needle powders such as silver (Ag), copper (Cu) and the like and metal pastes in which a binder is mixed are used. As the nonmetal powder, silicon carbide (SiC) (Graphite) and the like are used as a binder and a mixed paste,

The metal heating element may be an alloy metal such as nickel-chromium (Ni-Cr), iron chrome (Fe-Cr), iron chromium aluminum (Fe-Cr-Al), molybdenum, tungsten, platium, And the like are used.

The surface heating element using the mixed paste according to the related art has a problem that the paste is broken due to the deterioration (degradation) of the paste binder due to the continuous heat generation and the bonding force between the metal or the non-metal powder is lowered and the heating efficiency is decreased, and cracks are generated in the heating element , There is a high risk of fire due to damage to the surface heating element structure,

In order to solve such a problem, a planar heating element using conductive fibers has been proposed as an alternative. However, a conductive fiber based planar heating element uses materials such as Ag, Cu, and CNT to secure electrical conductivity and chemical safety. The material has low flexibility and is vulnerable to moisture, requiring a separate chemical treatment, which has the disadvantage of rising price and reliability.

It is an object of the present invention to provide a method of manufacturing a planar heating element structure capable of securing improved flexibility, chemical stability and reliability.

In order to accomplish one object of the present invention, there is provided a method of manufacturing a planar heating element structure, comprising: forming a water-soluble sacrificial pattern on a flexible insulating substrate; And a single metal thin film is formed on the alloy thin film. Next, a lift-off process using the water-soluble sacrificial pattern is performed to form an alloy thin film pattern and a single metal thin film pattern from the alloy thin film and the single metal thin film on the flexible insulating substrate, respectively. Next, a spinning layer is formed on the single metal thin film pattern.

In one embodiment of the present invention, the alloy thin film and the single metal thin film may be formed through a sputtering process. Here, the step of forming the alloy thin film and the single metal thin film may be formed by in-situ. Also, the sputtering process may be performed in a roll-to-roll manner with respect to a flexible insulating substrate in which the water-soluble sacrificial pattern is formed in a vacuum chamber. Further, in the sputtering process, the alloy thin film and the single metal thin film may be formed on both sides of the flexible insulating substrate on which the water-soluble sacrificial pattern is formed.

In one embodiment of the present invention, the lift-off process using the water-soluble sacrificial pattern may include an ultrasonic washing process using ultra-pure water with a resistivity range of 10 to 14 OMEGA.

In an embodiment of the present invention, a first electromagnetic wave shielding layer may be additionally formed on the radiation layer. Here, the first electromagnetic wave shielding layer may be formed on the single metal thin film through a sputtering process. The first electromagnetic wave shielding layer may have a thickness ranging from 100 to 1,000 angstroms.

In one embodiment of the present invention, the alloy thin film pattern is a heating pattern, and the single metal thin film pattern may function as an exothermic electrode.

According to the embodiments of the present invention, since the alloy thin film and the single metal thin film are formed through the sputtering process, the problem of the low life of the planar heating element due to deterioration of the binder contained in the conventional paste can be solved at the source. Further, by patterning the alloy thin film and the single metal thin film through the lift-off process to form the alloy thin film pattern and the single metal thin film pattern, the patterning process of the alloy thin film and the single metal thin film can be easily performed.

Further, since the surface heating element made of the alloy thin film pattern and the single metal thin film pattern is easily formed, it has a high flexibility property that can be folded or bent, and there is no risk of occurrence of overcurrent due to rapid resistance increase due to defects such as cracks at the folded portion The heat generation efficiency of the surface heating element can be improved without the risk of fire occurrence.

In addition, a radiation layer capable of emitting negative ions or far-infrared rays is additionally formed, so that a functional plane heating element capable of projecting a hot line for a human body can be constructed.

Meanwhile, since the electromagnetic wave shielding layer made of the magnetic metal thin film capable of shielding electromagnetic waves harmful to the human body is additionally provided, electromagnetic waves emitted from the heating body can be effectively blocked.

1 is a flowchart illustrating a method of manufacturing a planar heating element structure according to an embodiment of the present invention.
2 to 7 are sectional views for explaining a method of manufacturing the planar heating element structure according to an embodiment of the present invention.
8 is a schematic view for explaining the sputtering process for forming the alloy thin film and the pure metal thin film of FIG.

BRIEF DESCRIPTION OF THE DRAWINGS The invention will be described in more detail below with reference to the accompanying drawings showing embodiments of the invention. However, the present invention should not be construed as limited to the embodiments described below, but may be embodied in various other forms. The following examples are provided so that those skilled in the art can fully understand the scope of the present invention, rather than being provided so as to enable the present invention to be fully completed.

When an element is described as being placed on or connected to another element or layer, the element may be directly disposed or connected to the other element, and other elements or layers may be placed therebetween It is possible. Alternatively, if one element is described as being placed directly on or connected to another element, there can be no other element between them. The terms first, second, third, etc. may be used to describe various items such as various elements, compositions, regions, layers and / or portions, but the items are not limited by these terms .

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Furthermore, all terms including technical and scientific terms have the same meaning as will be understood by those skilled in the art having ordinary skill in the art, unless otherwise specified. These terms, such as those defined in conventional dictionaries, shall be construed to have meanings consistent with their meanings in the context of the related art and the description of the present invention, and are to be interpreted as being ideally or externally grossly intuitive It will not be interpreted.

Embodiments of the present invention are described with reference to cross-sectional illustrations that are schematic illustrations of ideal embodiments of the present invention. Accordingly, changes from the shapes of the illustrations, such as changes in manufacturing methods and / or tolerances, are those that can be expected. Accordingly, the embodiments of the present invention are not to be construed as being limited to the specific shapes of the areas described by way of illustration, but rather to include deviations in the shapes, the areas described in the drawings being entirely schematic and their shapes Are not intended to illustrate the exact shape of the regions and are not intended to limit the scope of the invention.

1 is a flowchart illustrating a method of manufacturing a planar heating element structure according to an embodiment of the present invention. FIG. 2 and FIG. 3 are cross-sectional views illustrating a method of manufacturing a planar heating element structure according to an embodiment of the present invention.

Referring to FIGS. 1 and 2, in the method for manufacturing a planar heating element structure according to an embodiment of the present invention, a water-soluble sacrificial pattern 200 is formed on a flexible insulating substrate 100. The flexible insulating substrate 100 may be formed using a polymer resin such as polyimide (PI), polyester (PET), polyamide (PA), or polyurethane (PU). Particularly, polyimide substrates are widely used because they have excellent flexibility.

The flexible insulating substrate 100 may have a thickness of 25 to 100 탆. For example, the flexible insulating substrate 100 may have a thickness of at least one of 25, 35, 50, 75, and 100 占 퐉 thickness.

A water-soluble sacrificial pattern (200) is formed on the flexible insulating substrate (100). The water-soluble sacrificial pattern 200 may be made of a water-soluble material that can be easily removed by a subsequent lift-off process.

In the case of the photolithography process for forming the existing heating element pattern, wastewater containing chloride, ferric chloride and the like is generated in the exposure / development / etching process to cause environmental pollution, while the water-soluble sacrificial pattern 200 is water- It can be easily removed in a lift-off process using subsequent pure water.

Examples of the water-soluble substance include natural polymers such as starch and the like, or polyethylene oxide, polyvinyl alcohol, polyacrylamide and the like.

In order to form the water-soluble sacrifice pattern 200, a Krabi printing process, a roll-to-roll printing process with a comma coater, or the like may be performed. The water-soluble sacrificial pattern 200 may be formed to a thickness of 3 to 6 占 퐉. As a result,

Referring to FIGS. 1 and 3, an alloy thin film 110 is formed on the flexible insulating substrate 100 so as to cover the water-soluble sacrificial pattern 200.

The alloy thin film 110 is patterned through a subsequent lift-off process, so that it can be converted into a heating element pattern.

The material of the alloy thin film 110 is one selected from the group consisting of Ni-Cr alloy, Cu-Cr alloy, Ni-Ag alloy and Ni-Cu- Or more.

The alloy ratio of the nickel-chromium (Ni-Cr) alloy may be 10 to 30% of chromium (Cr) alloy based on nickel (Ni). On the other hand, in the case of the copper-chromium (Cu-Cr) alloy, the content of chromium may be 5 to 10% based on copper. In case of nickel (Ni-Ag) alloy, the content of silver (Ag) on the basis of nickel (Ni) may be 10 to 25%. Further, in the case of nickel-copper-chromium (Ni-Cu-Cr) alloy, the content of copper-chromium (Cu-Cr) alloy on the basis of nickel (Ni) can be 30 to 40%.

The alloy thin film 110 may have a thickness ranging from 200 to 500 ANGSTROM.

The alloy thin film 110 may be formed through a sputtering process. When the paste is formed through the conventional paste process, it is difficult to control the thickness thereof, and the reliability of the binder contained in the paste is deteriorated. On the other hand, the alloy thin film 110 is formed through the sputtering process , Thickness control is easy, and excellent reliability can be ensured.

Then, a single metal thin film 120 is formed on the alloy thin film 110. The single metal foil 110 is patterned through a subsequent lift-off process to convert into a single metal foil pattern. Thereby, the single metal pattern 110 can function as an electrode.

The single metal film 120 is formed using copper, for example. The single metal thin film 120 may be formed through a sputtering process.

In one embodiment of the present invention, the alloy thin film 110 and the single metal thin film 120 may be formed in situ during the sputtering process.

Referring to FIG. 8, the sputtering process may be performed through a roll-to-roll process.

That is, in the state that the supply roll and the winding roll are provided in the vacuum chamber, the roll-to-roll sputtering process is performed using the alloy target for forming an alloy thin film and the electrode target for forming a single thin film. At this time, while the flexible insulating substrate 100 on which the water-soluble sacrificial pattern 200 is formed is rolled while being rotated from the supply roll to the take-up roll, the material discharged from the alloy target and the electrode target is Is deposited on the flexible insulating substrate (100). Thus, the roll-to-roll sputtering process can be performed. As a result, the alloy thin film 110 and the single metal thin film 120 can be easily formed through the sputtering process.

During the roll-to-roll sputtering process, the alloy thin film 110 and the single metal thin film 120 may be formed on both sides of the flexible insulating substrate 100 on which the water-soluble sacrificial pattern 200 is formed.

Referring to FIGS. 1 and 4, a lift-off process using the water-soluble sacrificial pattern 200 is performed. As a result, when the water-soluble sacrificial pattern 200 is removed from the flexible insulating substrate 100, a portion of the single metal thin film 120 and the portion of the alloy thin film 110 corresponding to the portion provided with the water- Can be removed from the flexible insulating substrate 100 together. As a result, the single metal thin film 120 and the portion of the alloy thin film 110 not provided with the water-soluble sacrificial pattern 200 remain on the flexible insulating substrate 100, so that the single metal thin film 120 and the alloy The thin film 110 is patterned. As a result, the alloy thin film pattern and the single metal thin film pattern may be sequentially formed on the flexible insulating substrate 100. Thereby, an area heating element including the alloy thin film pattern and the single metal thin film pattern is formed.

Accordingly, the patterning process is simplified as compared with the conventional photoresist thin film formation / exposure / development / etching process for patterning the single metal thin film 120 and the alloy thin film 110, Environmental pollution can be suppressed.

The lift-off process may include, for example, an ultrasonic washing process using ultrapure water having a resistance range of 10 to 14 [Omega]. Thus, the process of patterning the single metal thin film 120 and the alloy thin film 110 can be easily performed.

Referring to FIGS. 1, 5 and 6, a spinneret 130, 140 is formed to cover the single metal thin film pattern and the alloy thin film pattern. The radiation layers 130 and 140 may emit negative ions or far infrared rays. The radiation layers 130 and 140 may have a multi-layer structure.

The radiation layers 130 and 140 may be a polymer resin such as a polyurethane or acrylic resin and an anion or a far infrared material such as loess, carbon powder, germanium, or tourmaline powder dispersed in the polymer resin. Alternatively, the polymer resin may be made of a polyimide thermosetting resin when high temperature heating is required.

The radiation layer 130, 140 may have a thickness ranging from 8 to 25 μm. Further, the radiation layers 130 and 140 may have an insulation strength of 10 ^-6 ?.

The radiation layers 130 and 140 may be manufactured by a gravure, a comma, or a screen printing method.

Referring to FIGS. 1 and 7, in one embodiment of the present invention, a process of forming a first electromagnetic wave shielding layer 150 on the radiation layer may be further performed.

The first electromagnetic wave shielding layer 150 may be formed of a magnetic alloy material having magnetism and having oxidation resistance against moisture.

Examples of the magnetic alloy material may include at least one of nickel-chromium (Ni-Cr) alloy, nickel-chromium-iron alloy and nickel-chromium-cobalt alloy.

In the case of the nickel (Ni) - chromium (Cr) alloy, an alloy thin film of 5 to 25% based on the content of nickel (N) i is included. In the case of a nickel-chromium-iron (Ni-Cr-Fe) alloy, the content of chromium iron (Cr-Fe) may be 10 to 25% by weight based on nickel (Ni). The Cr-Fe alloy alloy may have a Fe alloy content of 3 to 5% based on chromium (Cr). The first electromagnetic wave shielding layer 170 may have a thickness ranging from 100 to 1,000 ANGSTROM.

In addition, the first electromagnetic wave shielding layer 150 may be formed through a vacuum sputtering metallization process.

In one embodiment of the present invention, the second electromagnetic wave shielding layer 170 and the insulating layer 190 may be additionally formed on the lower surface of the organic insulating substrate 100. The second electromagnetic wave shielding layer 170 and 180 may be made of the same material as the first electromagnetic wave shielding layer. The heat insulating layer 190 can block the heat generated from the alloy thin film pattern from the bottom to suppress the heat loss.

The heat-retaining layer 190 may be a polymer foam such as a polyurethane foam, a polyethylene foam, etc., or a water-repellent or water-repellent coated fiber fabric, and a fiber fabric or a polymer foam film.

100: Flexible insulating substrate 110: Alloy thin film
120: single metal film 130, 140: radiation layer
150: first electromagnetic wave shielding layer 160: passivation layer
170, 180: second electromagnetic wave shielding layer 190: insulating layer

Claims (10)

Forming a water-soluble sacrificial pattern on the flexible insulating substrate;
Forming an alloy thin film on the flexible insulating substrate to cover the water-soluble sacrificial pattern;
Forming a single metal thin film on the alloy thin film;
Performing a lift-off process using the water-soluble sacrificial pattern to form an alloy thin film pattern and a single metal thin film pattern from the alloy thin film and the single metal thin film on the flexible insulating substrate, respectively; And
And forming a radiation layer on the single metal thin film pattern. The method according to claim 1, wherein the alloy thin film and the single metal thin film are formed through a sputtering process. 3. The method according to claim 2, wherein the step of forming the alloy thin film and the single metal thin film is performed by an in-situ process. 3. The method according to claim 2, wherein the sputtering process is performed in a roll-to-roll manner with respect to a flexible insulating substrate having the water-soluble sacrificial pattern formed therein. 5. The method according to claim 4, wherein the sputtering step forms the alloy thin film and the single metal thin film on each of both sides of the flexible insulating substrate on which the water-soluble sacrificial pattern is formed. The method according to claim 1, wherein the lift-off process using the water-soluble sacrificial pattern includes an ultrasonic washing process using ultra-pure water having a resistance range of 10 to 14 Ω. The method of manufacturing a planar heating element structure according to claim 1, further comprising forming a first electromagnetic wave shielding layer on the radiation layer. 8. The method according to claim 7, wherein the first electromagnetic wave shielding layer is formed on the single metal thin film through a sputtering process. 8. The method according to claim 7, wherein the first electromagnetic wave shielding layer has a thickness ranging from 100 to 1,000 angstroms. The method according to claim 1, wherein the alloy thin film pattern is a heating pattern, and the single metal thin film pattern functions as a heating electrode.

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