KR101961034B1 - Bright enhancing film and preparing method of the same - Google Patents

Bright enhancing film and preparing method of the same Download PDF

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KR101961034B1
KR101961034B1 KR1020170150075A KR20170150075A KR101961034B1 KR 101961034 B1 KR101961034 B1 KR 101961034B1 KR 1020170150075 A KR1020170150075 A KR 1020170150075A KR 20170150075 A KR20170150075 A KR 20170150075A KR 101961034 B1 KR101961034 B1 KR 101961034B1
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phosphor
base
yag
film
luag
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KR20180056554A (en
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은종혁
김병남
류민영
안호진
강신비
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효성화학 주식회사
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Abstract

본 발명은 휘도 향상 필름과 그 제조방법에 관한 것으로, 기재필름층과, 상기 기재필름층 내에 분산되는 YAG계 형광체와, 상기 기재필름층 내에 분산되는 LuAG계 형광체 및 상기 기재필름층의 일면 또는 양면에 코팅되는 염료층을 포함하는 휘도 향상 필름과, (a) 용융 수지에 YAG계 형광체와 LuAG계 형광체를 균일하게 분산시킨 후 캐스팅 공정을 통해 기재필름을 제조하는 단계 및 (b) 상기 기재필름의 일면 또는 양면에 염료를 코팅하여 건조시키는 단계를 포함하는 휘도 향상 필름의 제조방법을 제공하여 휘도 향상 필름의 휘도, 색재현율 및 물리적 특성을 향상시킬 수 있다.The present invention relates to a brightness enhancement film and a method of manufacturing the same, and is characterized by comprising a base film layer, a YAG base phosphor dispersed in the base film layer, a LuAG base phosphor dispersed in the base film layer, (A) a step of uniformly dispersing a YAG-base phosphor and a LuAG-base phosphor in a molten resin, followed by casting to produce a base film; and (b) Coating the dyes on one or both sides of the substrate, and drying the coating, thereby improving the brightness, color reproducibility, and physical properties of the brightness enhancement film.

Description

휘도 향상 필름과 그 제조방법{Bright enhancing film and preparing method of the same}Brightening Enhancing Film and Preparation Method Thereof

본 발명은 휘도 향상 필름과 그 제조방법에 관한 것으로, 더욱 상세하게는 휘도와, 색재현율 및 물리적 특성이 개선될 수 있도록 한 휘도 향상 필름과 그 제조방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a brightness enhancement film and a method of manufacturing the brightness enhancement film, and more particularly, to a brightness enhancement film and a method of manufacturing the same that can improve brightness, color reproducibility and physical properties.

최근 디스플레이 시장은 대면적, 고해상도 경쟁에서 색감 경쟁으로 진화하고 있으며, 이로 인해 우수한 색감을 구현할 수 있는 디스플레이의 제조에 대한 관심이 높아지고 있다. Recently, the display market is evolving from a large-size and high-resolution competition to a color competition, and attention is focused on manufacturing a display capable of realizing excellent color.

차세대 디스플레이로 각광받고 있는 OLED(Organic Light-emitting Diode, 유기발광다이오드)는 색재현율을 NTSC 기준 100%까지 달성할 수 있지만 현재 사용되고 있는 LCD의 경우에는 70% 수준의 색재현율을 나타내고 있어 개선이 필요한 상황이다.OLED (Organic Light-Emitting Diode), which is widely regarded as the next generation display, can achieve the color recall rate up to 100% of NTSC. However, currently used LCD shows 70% color reproduction rate It is a situation.

이에, LCD의 색재현율을 향상시키기 위해 양자점(Quantum Dot)을 이용한 방법이 적용되고 있지만 수분과 산소에 취약한 양자점의 고유 특성으로 인해 배리어 필름을 통한 밀봉 과정이 반드시 수반되어야 하는 문제점이 있다.Accordingly, although a method using a quantum dot is applied to improve the color gamut of an LCD, there is a problem that a sealing process through a barrier film must be accompanied by inherent characteristics of quantum dots susceptible to moisture and oxygen.

한편, LCD에서는 콘트라스트(contrast)를 증가시키기 위해 휘도 향상 필름을 적용하고 있다. 휘도 향상 필름은 차광 테이프를 이용하여 BLU(Back Light Unit)에 부착될 수 있다. 이러한 휘도 향상 필름으로는 반사형 편광 필름이 사용되는데, 반사형 편광 필름은 고굴절률층과 저굴절률층이 교대로 반복 적층된 필름으로 상업적으로는 3M사의 DBEF(Dual Brightness Enhancement Film, 이중 휘도 향상 필름) 등이 사용되고 있다.On the other hand, in the LCD, a luminance enhancement film is applied in order to increase the contrast. The brightness enhancement film can be attached to a back light unit (BLU) using a light shielding tape. The reflection type polarizing film is a film in which a high refractive index layer and a low refractive index layer are alternately repeatedly laminated, and commercially available is a dual brightness enhancement film (DBEF) ) Are used.

그러나 DBEF를 사용하기 위해서는 로열티를 지불해야 하기 때문에 국내 관련 업체들은 DBEF를 대체할 수 있는 휘도 향상 필름의 국산화에 연구, 개발을 집중하고 있는 상황이다.However, since royalty is required to use DBEF, Korean affiliates are concentrating their research and development on localization of luminance enhancement film that can replace DBEF.

따라서 DBEF를 사용하지 않고도 LCD의 휘도를 향상시킬 수 있는 필름을 개발한다면 국내 디스플레이 시장의 활성화에 기여할 수 있을 것으로 기대된다.Therefore, if a film that can improve the luminance of LCD without using DBEF is developed, it is expected to contribute to the activation of the domestic display market.

본 발명은 전술한 종래기술의 문제점을 해결하기 위해 안출된 것으로, DBEF를 대체하기 위해 휘도와 색재현율 및 물리적 특성을 향상시킬 수 있도록 한 휘도 향상 필름을 제공하는 데 목적이 있다.SUMMARY OF THE INVENTION It is an object of the present invention to provide a brightness enhancement film capable of improving luminance, color reproduction rate, and physical characteristics to replace DBEF.

전술한 기술적 과제를 해결하기 위한 수단으로서,As means for solving the above-mentioned technical problem,

본 발명은 기재필름층과; 상기 기재필름층 내에 분산되는 YAG계 형광체와; 상기 기재필름층 내에 분산되는 LuAG계 형광체; 및 상기 기재필름층의 일면 또는 양면에 코팅되는 염료층;을 포함하는 휘도 향상 필름을 제공한다.The present invention relates to an optical film comprising a base film layer; A YAG-base phosphor dispersed in the base film layer; A LuAG-based phosphor dispersed in the base film layer; And a dye layer coated on one side or both sides of the base film layer.

이 경우, 상기 YAG계 형광체는 Y3Al5012:Ce3+(YAG:Ce), Tb3Al5012:Ce3+(TAG:Ce), Ca3(Sc,Mg)2Si3O12:Ce3+, Y3Mg2AlSi2O12:Ce3+ 중에서 선택되는 1종 이상을 포함할 수 있다.In this case, the YAG-base phosphor is Y 3 Al 5 0 12: Ce 3+ (YAG: Ce), Tb 3 Al 5 0 12: Ce 3+ (TAG: Ce), Ca 3 (Sc, Mg) 2 Si 3 O 12 : Ce 3+ , Y 3 Mg 2 AlSi 2 O 12 : Ce 3+ , and the like.

이 경우, 상기 LuAG계 형광체는 Lu3Al5O12:Ce3+, Tb3Al5O12:Ce3+, Lu2CaMg2Si3O12:Ce3+ 중에서 선택되는 1종 이상을 포함할 수 있다.In this case, the LuAG-based fluorescent material includes at least one selected from Lu 3 Al 5 O 12 : Ce 3+ , Tb 3 Al 5 O 12 : Ce 3+ , Lu 2 CaMg 2 Si 3 O 12 : Ce 3+ can do.

이 경우, 상기 YAG계 형광체는 상기 기재필름층 조성물 100wt%에 대해 10~40wt% 첨가될 수 있다.In this case, the YAG-base phosphor may be added in an amount of 10 to 40 wt% based on 100 wt% of the base film layer composition.

이 경우, 상기 LuAG계 형광체는 상기 기재필름층 조성물 100wt%에 대해 1~20wt% 첨가될 수 있다.In this case, the LuAG-based phosphor may be added in an amount of 1 to 20 wt% based on 100 wt% of the base film layer composition.

이 경우, 상기 염료층은 380~430nm, 480~510nm, 560~600nm 중 적어도 어느 하나의 파장대역의 광을 흡수하는 것일 수 있다.In this case, the dye layer may absorb light having a wavelength band of at least one of 380 to 430 nm, 480 to 510 nm, and 560 to 600 nm.

이 경우, 상기 염료층은 히드록시 벤조트리아졸(hydroxy -benzotriazole)계, 로다민(rhodamine, RH)계, 스쿠아린(squarine, SQ)계 및 시안(cyanine, CY)계 염료 중에서 선택되는 어느 하나 이상을 포함할 수 있다.In this case, the dye layer may be any one selected from the group consisting of hydroxy-benzotriazole, rhodamine (RH), squarine (SQ), and cyanine (CY) Or more.

이 경우, 상기 염료층에 염료가 0.01~5wt% 포함될 수 있다.In this case, the dye layer may contain 0.01 to 5 wt% of dye.

이 경우, 상기 염료층의 두께는 0.1~15㎛일 수 있다.In this case, the thickness of the dye layer may be 0.1 to 15 mu m.

또한, 본 발명은 (a) 용융 수지에 YAG계 형광체와 LuAG계 형광체를 균일하게 분산시킨 후 캐스팅 공정을 통해 기재필름을 제조하는 단계; 및 (b) 상기 기재필름의 일면 또는 양면에 염료를 코팅하여 건조시키는 단계;를 포함하는 휘도 향상 필름의 제조방법을 제공한다.The present invention also provides a method of manufacturing a light emitting device, comprising the steps of: (a) uniformly dispersing a YAG-base phosphor and a LuAG-base phosphor in a molten resin, And (b) coating a dye on one side or both sides of the base film and drying the base film.

본 발명에 따르면, 기재필름층 내에 YAG계 형광체와 LuAG계 형광체를 소정의 비율로 균일하게 분산시킴으로써 LCD에 적용시 휘도와 색재현율을 향상시켜 우수한 색감을 구현할 수 있을 뿐 아니라 연필경도, 부착력, Curl, 내굴곡성 등과 같은 물리적 특성도 확보할 수 있다.According to the present invention, by uniformly dispersing the YAG-base phosphor and the LuAG-base phosphor in the base film layer at a predetermined ratio, it is possible to improve the brightness and color reproduction ratio when applied to an LCD to realize excellent color, , Bending resistance, and the like.

또한, 기재필름층의 일면 또는 양면에 염료를 추가적으로 코팅함으로써 색재현율을 보다 향상시킬 수 있다.Further, the color reproduction ratio can be further improved by additionally coating a dye on one side or both sides of the base film layer.

뿐만 아니라, YAG계 형광체와 LuAG계 형광체가 기재필름 자체에 포함되기 때문에 별도의 코팅 공정이 불필요하고, 이로 인해 생산성을 향상시킬 수 있다.In addition, since the YAG-base phosphor and the LuAG-base phosphor are included in the base film itself, a separate coating process is unnecessary, thereby improving the productivity.

도 1은 본 발명에 따른 휘도 향상 필름의 적층 구조도,
도 2는 도 1에 도시된 휘도 향상 필름의 변형예를 나타낸 적층 구조도.
1 is a laminated structure of a brightness enhancement film according to the present invention,
Fig. 2 is a laminated structure showing a modified example of the brightness enhancement film shown in Fig. 1. Fig.

이하에서는 첨부한 도면을 참조하여 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자가 용이하게 실시할 수 있도록 본 발명을 상세히 설명한다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention.

도 1은 본 발명에 따른 휘도 향상 필름의 적층 구조도이고, 도 2는 도 1에 도시된 휘도 향상 필름의 변형예를 나타낸 적층 구조도이다.FIG. 1 is a laminated structure of a brightness enhancement film according to the present invention, and FIG. 2 is a laminated structure showing a modified example of the brightness enhancement film shown in FIG.

도 1 및 도 2에 도시된 바와 같이 본 발명에 따른 휘도 향상 필름(100)은 기재필름층(110)과, YAG계 형광체(120)와, LuAG계 형광체(121) 및 염료층(130)을 포함한다.1 and 2, the brightness enhancement film 100 according to the present invention includes a base film layer 110, a YAG-base phosphor 120, a LuAG-base phosphor 121, and a dye layer 130, .

기재필름층(110)은 PET, TAC, PC, Polyimide, Acryl 등과 같이 필름의 소재로 사용되는 통상의 수지로 이루어진다.The base film layer 110 is made of a conventional resin used as a film material such as PET, TAC, PC, polyimide, and acryl.

YAG계 형광체(120)와 LuAG계 형광체(121)는 휘도와 색재현율 및 물리적 특성을 향상시키기 위한 것으로 기재필름층(110) 내에 소정의 비율로 균일하게 분산된다.The YAG-base phosphor 120 and the LuAG-base phosphor 121 are uniformly dispersed in the base film layer 110 at a predetermined ratio for the purpose of improving brightness, color reproducibility and physical properties.

이 경우, YAG계 형광체(120)는 Y3Al5012:Ce3+(YAG:Ce), Tb3Al5012:Ce3+(TAG:Ce), Ca3(Sc,Mg)2Si3O12:Ce3+, Y3Mg2AlSi2O12:Ce3+ 중에서 선택되는 1종 이상을 포함할 수 있으며, 기재필름층(110) 조성물 100wt%에 대해 10~40wt%의 비율로 첨가된다. YAG계 형광체(120)의 함량이 10wt% 미만이면 요구되는 휘도 향상 효과를 나타낼 수 없고, 40wt% 초과이면 코팅이 어려울 뿐 아니라 색재현율이 저하되기 때문이다.In this case, YAG-based fluorescent material 120 is Y 3 Al 5 0 12: Ce 3+ (YAG: Ce), Tb 3 Al 5 0 12: Ce 3+ (TAG: Ce), Ca 3 (Sc, Mg) 2 Si 3 O 12 : Ce 3+ , and Y 3 Mg 2 AlSi 2 O 12 : Ce 3+ , and may include at least one selected from the group consisting of 10 to 40 wt% of 100 wt% of the base film layer 110 composition Lt; / RTI > When the content of the YAG-base phosphor 120 is less than 10 wt%, the desired brightness enhancement effect can not be exhibited. If the content is more than 40 wt%, the coating is difficult and the color reproduction rate is lowered.

또한, LuAG계 형광체(121)는 Lu3Al5O12:Ce3+, Tb3Al5O12:Ce3+, Lu2CaMg2Si3O12:Ce3+ 중에서 선택되는 1종 이상을 포함할 수 있으며, 기재필름층(110) 조성물 100wt%에 대해 1~20wt%의 비율로 첨가된다. LuAG계 형광체(121) 의 함량이 1wt% 미만이면 요구되는 휘도 향상 효과를 나타낼 수 없고, 20wt% 초과이면 코팅이 어려울 뿐 아니라 색재현율이 저하되기 때문이다.The LuAG-based phosphor 121 may include at least one selected from Lu 3 Al 5 O 12 : Ce 3+ , Tb 3 Al 5 O 12 : Ce 3+ , Lu 2 CaMg 2 Si 3 O 12 : Ce 3+ , And is added in a proportion of 1 to 20 wt% based on 100 wt% of the base film layer 110 composition. If the content of the LuAG-based phosphor 121 is less than 1 wt%, the desired brightness enhancement effect can not be exhibited. If the content of the LuAG-based phosphor 121 is more than 20 wt%, coating is difficult and the color reproduction rate is lowered.

염료층(130)은 보다 선명한 색재현성을 얻기 위한 것으로 기재필름층(110)의 일면 또는 양면에 코팅된다.The dye layer 130 is coated on one or both surfaces of the base film layer 110 to obtain a clearer color reproducibility.

염료층(130)으로는 휘도 향상 필름(100)의 LCD 적용시 광원, 예컨대, 청색 LED로부터 방출되는 380~430nm, 480~510nm, 560~600nm 중 적어도 어느 하나의 파장대역의 광을 흡수하여 빛을 차단함으로써 색재현율을 향상시킬 수 있는 염료를 사용한다.The dye layer 130 absorbs light in a wavelength band of at least one of 380 to 430 nm, 480 to 510 nm, and 560 to 600 nm emitted from a light source such as a blue LED when applying the LCD of the brightness enhancement film 100, A dye capable of improving the color reproduction rate is used.

구체적으로, 염료층(130)은 4-Hydroxy-1H-benzotriazole, 2-(2-Hydroxy-5-methylphenyl)benzotriazole와 같은 히드록시 벤조트리아졸(hydroxy -benzotriazole)계, Rhodamine B, Rhodamine 6G와 같은 로다민(rhodamine, RH)계, 2,4-Bis[4-(N,N-dibenzylamino)-2,6-dihydroxyphenyl]squaraine와 같은 스쿠아린(squarine, SQ)계, Phthalocyanine와 같은 시안(cyanine, CY)계 염료 중 선택된 1 종 이상의 물질을 포함할 수 있다.Specifically, the dye layer 130 may include a hydroxy-benzotriazole type such as 4-Hydroxy-1H-benzotriazole and 2- (2-hydroxy-5-methylphenyl) benzotriazole, Rhodamine B, Rhodamine 6G Rhodamine (RH), squarine (SQ) such as 2,4-bis [4- (N, N-dibenzylamino) -2,6-dihydroxyphenyl] squaraine, cyanine such as phthalocyanine, CY) based dyes.

이러한 염료층(130) 내 염료는 염료층(130) 전체 고형분 대비 0.01~5wt%로 첨가된다. 염료의 함량이 0.01wt% 미만이면 색재현율 상승 효과가 없고, 5wt%를 초과하면 휘도 저하 문제가 발생한다.The dye in the dye layer 130 is added in an amount of 0.01 to 5 wt% based on the total solid content of the dye layer 130. When the content of the dye is less than 0.01 wt%, the color reproducibility is not increased, whereas when the content exceeds 5 wt%, the luminance decreases.

또한, 염료층(130)의 두께는 0.1~15㎛인 것이 바람직하다. 왜냐하면, 염료층(130)의 두께가 0.1㎛ 미만이면 코팅시 색재현율이 미흡하고, 15㎛ 초과이면 휘도 저하가 발생하기 때문이다.The thickness of the dye layer 130 is preferably 0.1 to 15 占 퐉. This is because if the thickness of the dye layer 130 is less than 0.1 탆, the color reproduction rate is insufficient when coated, and if the thickness exceeds 15 탆, the luminance decreases.

이상으로 본 발명에 따른 휘도 향상 필름에 대해 설명하였다. 이하에서는 본 발명에 따른 휘도 향상 필름의 제조방법에 대해 설명한다.The brightness enhancement film according to the present invention has been described above. Hereinafter, a method for manufacturing a brightness enhancement film according to the present invention will be described.

먼저, PET, TAC, PC, Polyimide, Acryl 등의 용융 수지에 YAG계 형광체(120)와 LuAG계 형광체(121)를 각각 10~40wt%, 1~20wt% 비율로 균일하게 분산시킨 후 캐스팅(Casting) 공정을 통해 기재필름(110)을 제조하고, 기재필름(110)의 일면 또는 양면에 염료층(130)을 코팅하면 휘도 향상 필름(100)이 완성된다.First, the YAG-base phosphor 120 and the LuAG-base phosphor 121 are uniformly dispersed in a molten resin such as PET, TAC, PC, Polyimide, Acryl or the like at a ratio of 10 to 40 wt% and 1 to 20 wt% And the dye layer 130 is coated on one or both sides of the base film 110. The brightness enhancement film 100 is completed.

이 경우, 캐스팅 공정은 중합공정을 통해 제조된 열가소성 칩(Chip)을 용융하여 일정 폭의 다이(Die)에 토출시켜 시트(Sheet) 형태로 제조한 후 2축 연신공정을 통해 연신 필름을 제조하는 공정으로, 건조된 열가소성 수지 칩을 공급받아 가열, 용융 후 T-Die에 정량 압출하는 Extruder 공정, 용융된 칩을 시트상으로 형성되도록 Slit Gap을 통해 Melt Resin을 토출하는 T-Die 공정, T-Die에서 토출되는 Melt Resin을 급랭, 고화시켜 Casting Sheet형태로 생산하는 Casting Roll 공정, Casting Sheet에 열을 가한 후 Roll주속차를 이용하여 종연신시키는 MDO 공정, 시트 양변부를 칩에 물고 고속주행하면서 필름을 횡연신 및 열고정시키는 TDO 공정, 필름의 양단부를 절단하고 제품 원단을 감는 T/U & Winder 공정, 권취 공정, 포장 공정 등을 포함한다.In this case, in the casting step, a thermoplastic chip produced through a polymerization process is melted and discharged into a die having a predetermined width to produce a sheet, followed by biaxial stretching to produce a stretched film An extruder process in which a dried thermoplastic resin chip is supplied and heated and melted and then extruded in a T-die, a T-die process in which molten resin is discharged through a slit gap to form a molten chip, Casting roll process to produce Melt Resin discharged from die by solidification and solidification to produce casting sheet form, MDO process to longitudinally stretch using casting sheet after heat is applied to roll, A TDO process for transversely stretching and thermally fixing the film, a T / U & Winder process for cutting both ends of the film and winding the product fabric, a winding process, and a packaging process.

이상으로 본 발명에 따른 휘도 향상 필름의 제조방법에 대해 설명하였다. 이하에서는 본 발명의 실시예에 대해 설명한다. 본 발명은 아래의 실시예에 의해 보다 명확하게 이해될 수 있으나, 이는 본 발명의 예시를 위한 것에 불과하고 본 발명의 범위를 제한하고자 하는 것은 아니다.The method for manufacturing the brightness enhancement film according to the present invention has been described above. Hereinafter, embodiments of the present invention will be described. The present invention can be understood more clearly by the following examples, which are merely illustrative of the present invention and are not intended to limit the scope of the present invention.

제1제조예First Production Example

형광체층의 제조Fabrication of phosphor layer

중합공정을 통해 제조된 Mw=40,000g/mol의 PET Chip 900Kg을 용융하고, 융융된 PET Chip에 YAG 형광체 100Kg(Resin대비 10wt%)을 정밀하게 분산한 후 1000mm 폭의 Die에 토출시켜 Sheet형태로 제조한 다음 2축 연신공정을 통해 PET 필름 100M을 제조하였다. 구체적인 제막 공정은 다음과 같다.900 Kg of PET Chip of Mw = 40,000 g / mol prepared by the polymerization process was melted, 100 Kg of YAG fluorescent material (10 wt% relative to Resin) was precisely dispersed in the melted PET chip, And then the PET film 100M was produced through the biaxial stretching process. The specific film-forming process is as follows.

중합공정을 통해 제조된 PET Chip 900Kg을 Feeding 받아 용융하고, YAG 형광체 100Kg을 고온 믹서기를 통해 정밀하게 분산한 후 T-Die에 정량 압출하고, 형광체가 정밀하게 분산된 용융 PET Chip을 Sheet상으로 형성하도록 slit Gap(300㎛)을 통해 Melt PET Resin을 토출하여 Casting Roll에서 Melt Resin을 급랭, 고화시켜 Casting Sheet형태로 제조하였다. 이후, Casting Sheet에 120 ℃로 열을 가하고, Roll 주속차(10M/min속도)를 이용하여 종연신시킨 후 Sheet 양변부를 Clip에 물고 110% 연신하고, 10M/min의 속도로 주행하면서 250㎛ 두께의 PET 필름을 100M 권취하였다.900 Kg of PET Chip produced through the polymerization process was fed and melted. 100 Kg of YAG phosphor was precisely dispersed through a high-temperature mixer and then extruded to a T-die to quantitatively extrude a molten PET chip in which a phosphor was precisely dispersed. , Melt PET Resin was discharged through a slit gap (300 μm), and Melt Resin was rapidly quenched and hardened in a casting roll to produce a casting sheet. Thereafter, heat was applied to the casting sheet at 120 ° C, and longitudinal stretching was performed using a roll primary speed (10M / min speed). The both sides of the sheet were stretched by 110% stretched with a clip and driven at a speed of 10M / Of PET film was wound up at 100M.

염료층의 제조Preparation of dye layer

고분자 매트릭스에 히드록시 벤조트리아졸(hydroxy -benzotriazole)계 염료인 4-Hydroxy-1H-benzotriazole을 0.1wt% 혼합하여 60분 동안 교반한다. 이 경우, 고분자 매트릭스(Matrix)로는 단관능 우레탄아크릴레이트 올리고머, 단관능 모노머를 사용하였다. 이후, 염료와 매트릭스 혼합물에 광개시제를 첨가한다. 광개시제로는 IG184, IG907, TPO, CP4 중에서 선택하여 1~5wt% 첨가할 수 있으나, 여기서는 IG 184와 TPO를 5:5의 비율로 5wt% 첨가하였다. 마지막으로, 제조된 코팅액을 Mayer Bar로 PET 필름의 일면 또는 양면에 도포한 후 무전극 램프를 이용하여 약 5초간 조사하여 휘도 향상 필름을 제조하였다. 이때 조사된 광량은 500mj 이하가 바람직하다.Hydroxybenzotriazole dyestuff 4-Hydroxy-1H-benzotriazole (0.1 wt%) was added to the polymer matrix and stirred for 60 minutes. In this case, a monofunctional urethane acrylate oligomer and a monofunctional monomer were used as the polymer matrix. A photoinitiator is then added to the dye and matrix mixture. As the photoinitiator, IG184, IG907, TPO, and CP4 may be added in an amount of 1 to 5 wt%. In this case, 5 wt% of IG 184 and TPO are added at a ratio of 5: 5. Finally, the prepared coating solution was applied to one side or both sides of the PET film with a Mayer Bar and irradiated for about 5 seconds using a non-electrode lamp to prepare a luminance improving film. At this time, the irradiated light amount is preferably 500 mj or less.

제2제조예Example 2

중합공정을 통해 제조된 Mw=40,000g/mol의 PET Chip 890Kg을 용융하고, 융융된 PET Chip에 YAG 형광체 100Kg(Resin대비 10wt%)과 LuAG 형광체 10Kg(Resin대비 1wt%)을 정밀하게 분산한 후 1000mm 폭의 Die에 토출시켜 Sheet형태로 제조한 다음 2축 연신공정을 통해 PET 필름 100M을 제조하였다. 구체적인 제막 공정은 다음과 같다.890 Kg of a PET chip of Mw = 40,000 g / mol produced by a polymerization process was melted and 100 Kg of YAG fluorescent material (10 wt% of Resin) and 10 Kg of LuAG fluorescent material (1 wt% of Resin) were finely dispersed in the melted PET chip The PET film 100M was produced through a biaxially stretching process. The specific film-forming process is as follows.

중합공정을 통해 제조된 PET Chip 890Kg을 Feeding 받아 용융하고, YAG 형광체 100Kg과 LuAG 형광체 10Kg을 고온 믹서기를 통해 정밀하게 분산한 후 T-Die에 정량 압출하고, 형광체가 정밀하게 분산된 용융 PET Chip을 Sheet상으로 형성하도록 slit Gap(300㎛)을 통해 Melt PET Resin을 토출하여 Casting Roll에서 Melt Resin을 급랭, 고화시켜 Casting Sheet형태로 제조하였다. 이후, Casting Sheet에 120 ℃로 열을 가하고, Roll 주속차(10M/min속도)를 이용하여 종연신시킨 후 Sheet 양변부를 Clip에 물고 110% 연신하고, 10M/min의 속도로 주행하면서 250㎛ 두께의 PET 필름을 100M 권취하였다. 이 경우, 염료층은 제1제조예와 동일하게 제조하였다.890 Kg of PET Chip produced by the polymerization process was fed and melted. 100 Kg of YAG phosphor and 10 Kg of LuAG phosphor were precisely dispersed through a high-temperature mixer and then extruded in a T-die to obtain a molten PET chip in which the phosphor was precisely dispersed Melt PET Resin was discharged through a slit gap (300 μm) to form a sheet, and Melt Resin was rapidly quenched and hardened in a casting roll to produce a casting sheet. Thereafter, heat was applied to the casting sheet at 120 ° C, and longitudinal stretching was performed using a roll primary speed (10M / min speed). The both sides of the sheet were stretched by 110% stretched with a clip and driven at a speed of 10M / Of PET film was wound up at 100M. In this case, the dye layer was prepared in the same manner as in the first production example.

제3제조예Third Manufacturing Example

850Kg의 PET Chip을 사용하고, LuAG 형광체의 함량을 50 Kg(Resin 대비 5wt%)으로 조절한 것을 제외하고는 제2제조예와 동일한 방법으로 PET 필름을 제조하였다.A PET film was prepared in the same manner as in the second production example except that 850 kg of PET chip was used and the content of LuAG phosphor was adjusted to 50 Kg (5 wt% based on Resin).

제4제조예Fourth Production Example

800Kg의 PET Chip을 사용하고, LuAG 형광체의 함량을 100 Kg(Resin 대비 10wt%)으로 조절한 것을 제외하고는 제2제조예와 동일한 방법으로 PET 필름을 제조하였다.A PET film was prepared in the same manner as in the second production example except that 800 Kg PET Chip was used and the content of LuAG phosphor was adjusted to 100 Kg (10 wt% relative to Resin).

제5제조예Fifth Manufacturing Example

800Kg의 PET Chip을 사용하고, YAG 형광체의 함량을 200 Kg(Resin 대비 20wt%)으로 조절한 것을 제외하고는 제1제조예와 동일한 방법으로 PET 필름을 제조하였다.A PET film was prepared in the same manner as in the first production example except that 800 Kg PET Chip was used and the content of YAG phosphor was adjusted to 200 Kg (20 wt% based on Resin).

제6제조예Example 6

790Kg의 PET Chip을 사용하고, YAG 형광체의 함량은 200 Kg(Resin 대비 20wt%)으로 조절한 것을 제외하고는 제2제조예와 동일한 방법으로 PET 필름을 제조하였다.A PET film was prepared in the same manner as in the second production example except that 790 Kg PET Chip was used and the content of the YAG fluorescent material was adjusted to 200 Kg (20 wt% relative to Resin).

제7제조예Seventh Manufacturing Example

750Kg의 PET Chip을 사용하고, YAG 형광체의 함량은 200 Kg(Resin 대비 20wt%)으로, LuAG 형광체의 함량은 50 Kg(Resin 대비 5wt%)으로 조절한 것을 제외하고는 제2제조예와 동일한 방법으로 PET 필름을 제조하였다.750 Kg PET Chip was used and the content of the YAG fluorescent substance was adjusted to 200 Kg (20 wt% relative to Resin) and the content of the LuAG fluorescent substance was adjusted to 50 Kg (5 wt% relative to Resin) To prepare a PET film.

제8제조예Example 8

600Kg의 PET Chip을 사용하고, YAG 형광체의 함량은 200 Kg(Resin 대비 20wt%)으로, LuAG 형광체의 함량은 200 Kg(Resin 대비 20wt%)으로 조절한 것을 제외하고는 제2제조예와 동일한 방법으로 PET 필름을 제조하였다.600 Kg PET Chip was used and the content of the YAG fluorescent substance was adjusted to 200 Kg (20 wt% relative to Resin) and the content of the LuAG fluorescent substance was adjusted to 200 Kg (20 wt% relative to Resin) To prepare a PET film.

제9제조예Ninth Production Example

600Kg의 PET Chip을 사용하고, YAG 형광체의 함량을 400 Kg(Resin 대비 40wt%)으로 조절한 것을 제외하고는 제1제조예와 동일한 방법으로 PET 필름을 제조하였다.A PET film was prepared in the same manner as in the first production example except that a 600 Kg PET Chip was used and the content of the YAG fluorescent material was adjusted to 400 Kg (40 wt% relative to Resin).

제10제조예Example 10

590Kg의 PET Chip을 사용하고, YAG 형광체의 함량은 400 Kg(Resin 대비 40wt%)으로 조절한 것을 제외하고는 제2제조예와 동일한 방법으로 PET 필름을 제조하였다.A PET film was prepared in the same manner as in the second production example except that 590 kg of PET chip was used and the content of the YAG fluorescent material was adjusted to 400 Kg (40 wt% with respect to Resin).

제11제조예Example 11

550Kg의 PET Chip을 사용하고, YAG 형광체의 함량은 400 Kg(Resin 대비 40wt%)으로, LuAG 형광체의 함량은 50 Kg(Resin 대비 5wt%)으로 조절한 것을 제외하고는 제2제조예와 동일한 방법으로 PET 필름을 제조하였다.550 Kg PET Chip was used and the content of the YAG fluorescent material was adjusted to 400 Kg (40 wt% with respect to Resin) and the content of the LuAG fluorescent material was adjusted to 50 Kg (5 wt% with respect to Resin) To prepare a PET film.

제12제조예Example 12

500Kg의 PET Chip을 사용하고, YAG 형광체의 함량은 400 Kg(Resin 대비 40wt%)으로, LuAG 형광체의 함량은 100 Kg(Resin 대비 10wt%)으로 조절한 것을 제외하고는 제2제조예와 동일한 방법으로 PET 필름을 제조하였다.500 Kg PET Chip was used and the content of the YAG fluorescent substance was adjusted to 400 Kg (40 wt% with respect to Resin) and the content of the LuAG fluorescent substance was adjusted to 100 Kg (10 wt% with respect to Resin) To prepare a PET film.

제13제조예Example 13

950Kg의 PET Chip을 사용하고, YAG 형광체의 함량을 50 Kg(Resin 대비 5wt%)으로 조절한 것을 제외하고는 제1제조예와 동일한 방법으로 PET 필름을 제조하였다.A PET film was produced in the same manner as in the first production example except that 950 kg of PET chip was used and the content of the YAG fluorescent material was adjusted to 50 Kg (5 wt% based on Resin).

제14제조예Example 14

940Kg의 PET Chip을 사용하고, YAG 형광체의 함량은 50 Kg(Resin 대비 5wt%)으로 조절한 것을 제외하고는 제2제조예와 동일한 방법으로 PET 필름을 제조하였다.A PET film was prepared in the same manner as in the second production example except that 940 Kg PET Chip was used and the content of YAG phosphor was adjusted to 50 Kg (5 wt% based on Resin).

제15제조예Example 15

900Kg의 PET Chip을 사용하고, YAG 형광체의 함량은 50 Kg(Resin 대비 5wt%)으로, LuAG 형광체의 함량은 50 Kg(Resin 대비 5wt%)으로 조절한 것을 제외하고는 제2제조예와 동일한 방법으로 PET 필름을 제조하였다.Except that a 900 Kg PET Chip was used and the content of the YAG fluorescent material was adjusted to 50 Kg (5 wt% relative to Resin) and the content of the LuAG fluorescent material was adjusted to 50 Kg (5 wt% relative to Resin) To prepare a PET film.

제16제조예Example 16

850Kg의 PET Chip을 사용하고, YAG 형광체의 함량은 50 Kg(Resin 대비 5wt%)으로, LuAG 형광체의 함량은 100 Kg(Resin 대비 10wt%)으로 조절한 것을 제외하고는 제2제조예와 동일한 방법으로 PET 필름을 제조하였다.Except that the PET chip of 850 Kg was used and the content of the YAG fluorescent material was adjusted to 50 Kg (5 wt% based on Resin) and the content of the LuAG fluorescent material was adjusted to 100 Kg (10 wt% based on Resin) To prepare a PET film.

제17제조예Example 17

500Kg의 PET Chip을 사용하고, YAG 형광체의 함량을 500Kg(Resin 대비 50wt%)으로 조절한 것을 제외하고는 제1제조예와 동일한 방법으로 PET 필름을 제조하였다.A PET film was prepared in the same manner as in the first production example except that 500 Kg PET Chip was used and the content of the YAG fluorescent material was adjusted to 500 Kg (50 wt% relative to Resin).

제18제조예Example 18

490Kg의 PET Chip을 사용하고, YAG 형광체의 함량은 500 Kg(Resin 대비 50wt%)으로 조절한 것을 제외하고는 제2제조예와 동일한 방법으로 PET 필름을 제조하였다.A PET film was prepared in the same manner as in the second production example except that 490 Kg PET Chip was used and the content of YAG phosphor was adjusted to 500 Kg (50 wt% relative to Resin).

제19제조예Article 19 Manufacturing Example

450Kg의 PET Chip을 사용하고, YAG 형광체의 함량은 500Kg(Resin 대비 50wt%)으로, LuAG 형광체의 함량은 50 Kg(Resin 대비 5wt%)으로 조절한 것을 제외하고는 제2제조예와 동일한 방법으로 PET 필름을 제조하였다.450 Kg PET Chip was used and the content of the YAG phosphor was adjusted to 500 Kg (50 wt% relative to Resin) and the content of the LuAG phosphor was adjusted to 50 Kg (5 wt% relative to Resin). PET film was prepared.

제20제조예Example 20

400Kg의 PET Chip을 사용하고, YAG 형광체의 함량은 500Kg(Resin 대비 50wt%)으로, LuAG 형광체의 함량은 100Kg(Resin 대비 10wt%)으로 조절한 것을 제외하고는 제2제조예와 동일한 방법으로 PET 필름을 제조하였다.400 Kg PET Chip was used and the content of the YAG phosphor was adjusted to 500 Kg (50 wt% relative to Resin) and the content of the LuAG phosphor was adjusted to 100 Kg (10 wt% relative to Resin). PET A film was prepared.

제21제조예Example 21

895Kg의 PET Chip을 사용하고, YAG 형광체의 함량은 100Kg(Resin 대비 10wt%)으로, LuAG 형광체의 함량은 5Kg(Resin 대비 0.5wt%)으로 조절한 것을 제외하고는 제2제조예와 동일한 방법으로 PET 필름을 제조하였다.Except that a PET chip of 895 kg was used and the content of the YAG fluorescent substance was adjusted to 100 kg (10 wt% relative to Resin) and the content of the LuAG fluorescent substance was adjusted to 5 kg (0.5 wt% relative to Resin) PET film was prepared.

제22제조예Article 22 Manufacturing Example

750Kg의 PET Chip을 사용하고, YAG 형광체의 함량은 100Kg(Resin 대비 10wt%)으로, LuAG 형광체의 함량은 150Kg(Resin 대비 15wt%)으로 조절한 것을 제외하고는 제2제조예와 동일한 방법으로 PET 필름을 제조하였다.750 Kg PET Chip was used and the content of the YAG fluorescent material was adjusted to 100 Kg (10 wt% relative to Resin) and the content of the LuAG fluorescent material was adjusted to 150 Kg (15 wt% relative to Resin). PET A film was prepared.

하기의 [표 1]에는 제1제조예 내지 제22제조예의 성분과 조성을 정리하여 나타내었다.The following Table 1 summarizes the components and compositions of the first to twenty-second production examples.

제조예Manufacturing example 1One 22 33 44 55 66 77 88 99 1010 1111 1212 PET ChipPET Chip 900900 890890 850850 800800 800800 790790 750750 600600 600600 590590 550550 500500 YAG 형광체YAG phosphor 100100 100100 100100 100100 200200 200200 200200 200200 400400 400400 400400 400400 LuAG 형광체LuAG phosphor 1010 5050 100100 1010 5050 200200 1010 5050 100100 Total
(kg)
Total
(kg)
10001000 10001000 10001000 10001000 10001000 10001000 10001000 10001000 10001000 10001000 10001000 10001000
제조예Manufacturing example 1313 1414 1515 1616 1717 1818 1919 2020 2121 2222 PET ChipPET Chip 950950 940940 900900 850850 500500 490490 450450 400400 895895 750750 YAG 형광체YAG phosphor 5050 5050 5050 5050 500500 500500 500500 500500 100100 100100 LuAG 형광체LuAG phosphor 1010 5050 100100 1010 5050 100100 55 150150 Total
(kg)
Total
(kg)
10001000 10001000 10001000 10001000 10001000 10001000 10001000 10001000 10001000 10001000

제1실시예First Embodiment

제1제조예 내지 제12제조예에 따라 제조된 휘도 향상 필름을 A4 사이즈로 재단하고, 이를 이용하여 LCD를 제작한 후 휘도와 색재현율을 측정하였으며, 그 결과를 하기의 [표 2]에 나타내었다. 이 경우, LCD는 광원(Blue LED), POP(Prism on Prism) 필름, 액정패널 순서로 구성하였으며, 휘도 향상 필름은 광원과 POP 필름 사이에 배치하였다. 또한, 휘도는 일본 Topcon사의 BM-7 FAST 색채 휘도계를 이용하여 측정하였다.The brightness enhancement films prepared according to the first to twelfth production examples were cut into A4 size, and LCDs were manufactured using the same. Then, the brightness and color gamut were measured. The results are shown in Table 2 below. . In this case, the LCD is composed of a light source (Blue LED), a POP (Prism on Prism) film, and a liquid crystal panel, and a luminance enhancement film is disposed between the light source and the POP film. Also, the luminance was measured using a BM-7 FAST color luminance meter manufactured by Topcon Co., Ltd. of Japan.

제조예Manufacturing example 1One 22 33 44 55 66 77 88 99 1010 1111 1212 YAG:LuAG
[wt%]
YAG: LuAG
[wt%]
10:010: 0 10:110: 1 10:510: 5 10:1010:10 20:020: 0 20:120: 1 20:520: 5 20:2020:20 40:040: 0 40:140: 1 40:540: 5 40:1040:10
휘도
[nit]
Luminance
[nit]
430430 450450 500500 550550 480480 520520 560560 600600 540540 550550 580580 620620
색재현성
[%]
Color Reproducibility
[%]
81.381.3 81.881.8 82.482.4 82.682.6 82.682.6 82.382.3 82.482.4 82.682.6 81.381.3 81.281.2 81.481.4 81.681.6
- Ref. DBEF(LED TV): 430nit(휘도), 81.6%(색재현성)
- Ref. DBEF(QD TV): 450nit(휘도), 100%(색재현성)
- Ref. DBEF (LED TV): 430 nit (luminance), 81.6% (color reproducibility)
- Ref. DBEF (QD TV): 450nit (luminance), 100% (color reproducibility)

비교예Comparative Example

제13제조예 내지 제22제조예에 따라 제조된 휘도 향상 필름에 대해 실시예와 동일한 방법으로 휘도와 색재현율을 측정하였으며, 그 결과를 하기의 [표 3]에 나타내었다.The brightness and color reproduction ratio of the brightness enhancement films prepared in Examples 13 to 22 were measured in the same manner as in Examples, and the results are shown in Table 3 below.

제조예Manufacturing example 1313 1414 1515 1616 1717 1818 1919 2020 2121 2222 YAG:LuAG
[wt%]
YAG: LuAG
[wt%]
5:05: 0 5:15: 1 5:55: 5 5:105:10 50:050: 0 50:150: 1 50:550: 5 50:1050:10 10:0.510: 0.5 10:1510:15
휘도
[nit]
Luminance
[nit]
230230 280280 290290 330330 500500 510510 530530 540540 400400 560560
색재현성
[%]
Color Reproducibility
[%]
79.879.8 79.379.3 79.379.3 78.378.3 75.075.0 72.372.3 71.371.3 71.371.3 81.081.0 75.075.0
- Ref. DBEF(LED TV): 430nit(휘도), 81.6%(색재현성)
- Ref. DBEF(QD TV): 450nit(휘도), 100%(색재현성)
- Ref. DBEF (LED TV): 430 nit (luminance), 81.6% (color reproducibility)
- Ref. DBEF (QD TV): 450nit (luminance), 100% (color reproducibility)

제2실시예Second Embodiment

제2제조예에 따라 제조된 휘도 향상 필름의 염료 종류, 함량, 두께를 변경하면서 제1실시예와 동일한 방식으로 휘도와 색재현율을 측정하였으며, 그 결과를 하기의 [표 4] 내지 [표 9]에 각각 나타내었다. 이 경우, YAG 형광체와 LuAG 형광체는 20:2의 비율로 첨가하였고, 휘도 향상 필름의 두께는 50㎛로 하였다. 또한, 염료의 종류, 함량에 따른 휘도 및 색재현율 측정시에는 염료층의 두께를 0.1㎛로 고정하였고, 염료층 두께에 따른 휘도 및 색재현율 측정시에는 염료의 함량을 0.1wt%로 고정하였다. 한편, [표 4] 내지 [표 9]의 휘도 데이터는 QD Ref.(450nit)를 기준으로 %로 환산한 값이다.The brightness and color reproduction rate were measured in the same manner as in Example 1 while changing the kind, content and thickness of the brightness enhancement film prepared according to the second production example. The results are shown in Tables 4 to 9 Respectively. In this case, the YAG fluorescent material and the LuAG fluorescent material were added in a ratio of 20: 2, and the thickness of the luminance improving film was set to 50 탆. The thickness of the dye layer was fixed to 0.1 탆 for measuring the luminance and color reproducibility according to the kinds and contents of the dyes, and the dye content was fixed to 0.1 wt% when the luminance and color reproduction rate were measured according to the dye layer thickness. On the other hand, the luminance data in [Table 4] to [Table 9] are values converted into% based on QD Ref. (450 nit).

Figure 112017112004695-pat00001
Figure 112017112004695-pat00001

Figure 112017112004695-pat00002
Figure 112017112004695-pat00002

Figure 112017112004695-pat00003
Figure 112017112004695-pat00003

Figure 112017112004695-pat00004
Figure 112017112004695-pat00004

Figure 112017112004695-pat00005
Figure 112017112004695-pat00005

Figure 112017112004695-pat00006
Figure 112017112004695-pat00006

100 : 휘도 향상 필름 110 : 기재필름
120 : YAG계 형광체층 121 : LuAG계 형광체
130 : 염료층
100: brightness enhancement film 110: substrate film
120: YAG-base phosphor layer 121: LuAG-base phosphor
130: dye layer

Claims (10)

기재필름층과;
상기 기재필름층 내에 분산되는 YAG계 형광체와;
상기 기재필름층 내에 분산되는 LuAG계 형광체; 및
상기 기재필름층의 일면 또는 양면에 코팅되는 염료층;
을 포함하되,
상기 YAG계 형광체는 Tb3Al5012:Ce3+(TAG:Ce), Ca3(Sc,Mg)2Si3O12:Ce3+, Y3Mg2AlSi2O12:Ce3+ 중에서 선택되는 1종 이상이 10~40wt% 포함되고, 상기 LuAG계 형광체는 Lu3Al5O12:Ce3+, Tb3Al5O12:Ce3+, Lu2CaMg2Si3O12:Ce3+ 중에서 선택되는 1종 이상이 1~20wt% 포함되는 것을 특징으로 하는 휘도 향상 필름.
A base film layer;
A YAG-base phosphor dispersed in the base film layer;
A LuAG-based phosphor dispersed in the base film layer; And
A dye layer coated on one side or both sides of the base film layer;
≪ / RTI >
Wherein the YAG-base phosphor is at least one selected from the group consisting of Tb 3 Al 5 0 12 : Ce 3+ (TAG: Ce), Ca 3 (Sc, Mg) 2 Si 3 O 12 : Ce 3+ , Y 3 Mg 2 AlSi 2 O 12 : Ce 3+ Wherein the LuAG-based phosphor is at least one selected from the group consisting of Lu 3 Al 5 O 12 : Ce 3+ , Tb 3 Al 5 O 12 : Ce 3+ , Lu 2 CaMg 2 Si 3 O 12 : Ce 3+ is contained in an amount of 1 to 20 wt%.
삭제delete 삭제delete 삭제delete 삭제delete 제 1 항에 있어서,
상기 염료층은 380~430nm, 480~510nm, 560~600nm 중 적어도 어느 하나의 파장대역의 광을 흡수하는 것을 특징으로 하는 휘도 향상 필름.
The method according to claim 1,
Wherein the dye layer absorbs light having a wavelength band of at least one of 380 to 430 nm, 480 to 510 nm, and 560 to 600 nm.
제 1 항에 있어서,
상기 염료층은 히드록시 벤조트리아졸(hydroxy -benzotriazole)계, 로다민(rhodamine, RH)계, 스쿠아린(squarine, SQ)계 및 시안(cyanine, CY)계 염료 중에서 선택되는 어느 하나 이상을 포함하는 것을 특징으로 하는 휘도 향상 필름.
The method according to claim 1,
The dye layer may include at least one selected from the group consisting of hydroxybenzotriazole, rhodamine, squarine (SQ), and cyanine (CY) dyes. Wherein the brightness enhancement film is made of a metal.
제 1 항에 있어서,
상기 염료층에 염료가 0.01~5wt% 포함되는 것을 특징으로 하는 휘도 향상 필름.
The method according to claim 1,
Wherein the dye layer contains 0.01 to 5 wt% of a dye.
제 1 항에 있어서,
상기 염료층의 두께는 0.1~15㎛인 것을 특징으로 하는 휘도 향상 필름.
The method according to claim 1,
Wherein the thickness of the dye layer is 0.1 to 15 占 퐉.
(a) 용융 수지에 YAG계 형광체와 LuAG계 형광체를 균일하게 분산시킨 후 캐스팅 공정을 통해 기재필름을 제조하는 단계; 및
(b) 상기 기재필름의 일면 또는 양면에 염료를 코팅하여 건조시키는 단계;
를 포함하되,
상기 YAG계 형광체는 Tb3Al5012:Ce3+(TAG:Ce), Ca3(Sc,Mg)2Si3O12:Ce3+, Y3Mg2AlSi2O12:Ce3+ 중에서 선택되는 1종 이상이 10~40wt% 포함되고, 상기 LuAG계 형광체는 Lu3Al5O12:Ce3+, Tb3Al5O12:Ce3+, Lu2CaMg2Si3O12:Ce3+ 중에서 선택되는 1종 이상이 1~20wt% 포함되는 것을 특징으로 하는 휘도 향상 필름의 제조방법.
(a) uniformly dispersing a YAG-base phosphor and a LuAG-base phosphor in a molten resin, and then producing a base film through a casting process; And
(b) coating a dye on one side or both sides of the base film and drying;
, ≪ / RTI &
Wherein the YAG-base phosphor is at least one selected from the group consisting of Tb 3 Al 5 0 12 : Ce 3+ (TAG: Ce), Ca 3 (Sc, Mg) 2 Si 3 O 12 : Ce 3+ , Y 3 Mg 2 AlSi 2 O 12 : Ce 3+ Wherein the LuAG-based phosphor is at least one selected from the group consisting of Lu 3 Al 5 O 12 : Ce 3+ , Tb 3 Al 5 O 12 : Ce 3+ , Lu 2 CaMg 2 Si 3 O 12 : Ce 3+ is contained in an amount of 1 to 20 wt%.
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