KR101958336B1 - Quantification device and quantification method - Google Patents

Abstract

The quantification apparatus of the present invention includes an acquiring unit for acquiring a grain flow function for connecting line segments or curves having the same initial coordinate value using initial coordinate values of a plurality of joints calculated at the plurality of joints set for an object to be plastic-worked and stored; a first unit for calculating a grain flow density vector function corresponding to a gradient of the grain flow function; a second unit for calculating a grain flow overlapping quality matrix corresponding to a gradient of the grain flow density vector function; and a processing unit for quantifying the denseness and overlapping quality of the grain flow of the object using the grain flow density vector function and the grain flow overlapping quality matrix.

Description

{QUANTIFICATION DEVICE AND QUANTIFICATION METHOD}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a quantification apparatus and a method for quantifying short-circuited characteristics of an object.

Plastic processing is a method of making various shapes by applying plastic deformation to an object.

Plastic processing is based on the assumption that external energy such as heat or pressure is applied to an object so that the stress state of the object reaches the yielding standard adequately. In order to process an object with an initial design value through plastic working, it is necessary to select an appropriate mold and to determine the exact machining environment, such as the energy required for machining.

In order to derive such a machining environment, an empirical method in which various molds are provided and energy of various sizes is applied to an object in various directions can be used. However, according to the process design and development method depending on this method, frequent process design failures occur, and it is difficult to reuse inappropriate molds and plastic-processed objects, resulting in a problem of waste of resources. Further, it takes a long time until the appropriate machining environment is derived.

Even if a machining environment that can plasticize an object is derived according to a design value, it is difficult to grasp the flow state of a plastic-processed object including a shear line in the processing environment.

Korean Patent Registration No. 1386648 discloses a simulation apparatus and method for generating a flow state diagram of an object through simulation. However, there is no indication of the characteristics of the swept current using the generated flow state diagram.

Korean Patent Publication No. 2006-0066642

SUMMARY OF THE INVENTION The present invention is directed to a quantification apparatus and method for quantifying short-circuited characteristics of an object.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not intended to limit the invention to the precise forms disclosed. Other objects, which will be apparent to those skilled in the art, It will be possible.

The quantification apparatus of the present invention includes a grain flow function for connecting line segments or curves having the same initial coordinate values using the initial coordinate values of the joints calculated and stored at a plurality of joint points set for an object to be plastic- An acquiring unit for acquiring; A first unit for calculating a grain flow density vector function (vector function) corresponding to a gradient or a gradient of the short-circuit line function; A second unit for calculating a gradient of grain flow density vector matrix (matrix) corresponding to a gradient or a gradient of the shear line density vector function; And a processing unit for quantifying the denseness and overlapping quality of the swept line of the object using the swept line density vector function and the swept line overlapping quality matrix.

The quantification method of the present invention includes a grain flow function for connecting line segments or curves having the same initial coordinate value using the initial coordinate values of the joints calculated and stored at a plurality of joint points set in an object to be plastic- An acquiring step of acquiring A first calculating step of calculating a shear density vector function through a gradient or a gradient of the shear line function; A second calculation step of calculating a gradient or a gradient of the shear line density vector function; And a processing step of quantifying the short-circuited line characteristic of the object using the results of the first calculation step and the second calculation step.

The quantification apparatus and method of the present invention can quantify the short-circuited characteristics of the object subjected to the plastic working using the first unit, the second unit, and the processing unit.

The user visually observes the short-circuit line of the object visually and empirically to grasp the defective element. According to the present invention, the defective element of the object can be grasped quantitatively by the quantified short-circuit line characteristic.

Further, according to the present invention, there is an advantage that various post-treatment processes can be performed by using numerical characteristics of short-circuited lines.

For example, an automatic optimum design system can be implemented that identifies the problems of existing plastic fabrication design using quantified shear line characteristics, and automatically corrects the plastic fabrication design by improving the problems.

The shear line properties quantified by the quantification apparatus and method of the present invention can be used to formulate process design optimization problems that will become a hot topic in metal forming in the near future. And, the present invention can be easily applied to other processes including injection molding and casting.

1 is a block diagram showing a quantification apparatus of the present invention.
2 is a block diagram showing an acquisition unit;
3 is a schematic view showing a process structure in which an object is forged;
Figs. 4 and 5 are schematic views showing the result of simulating the plastic working of the object using the finite element analysis method. Fig.
Fig. 6 is a schematic view showing the definitions of the segregation zone and the sound material region together with the swept current line.
Fig. 7 is an image of an object showing the density of the swept line quantified using the shear line density (size) among the gradient results of the sweep line function.
8 is an image of an object in which the direction (the component of the shear line density vector) and the magnitude of the shear line density are displayed simultaneously with the shear line among the gradient results of the shear line function.
FIG. 9 is an image of an object displaying a gradation result of a short-circuited line function, that is, an overlapping defect quantified by using a short-line overlapping quality matrix obtained by grayscaleing a short-line density vector function.
10 is a schematic view showing nodes set by the simulation means;
11 is a schematic view showing a flow diagram generated by the simulation means;
12 is a schematic view showing information of a node set by the setting unit;
13 is a schematic view showing a first time point at which a joint initial coordinate is generated.
14 is a flow chart illustrating the quantification method of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The sizes and shapes of the components shown in the drawings may be exaggerated for clarity and convenience. In addition, terms defined in consideration of the configuration and operation of the present invention may be changed according to the intention or custom of the user, the operator. Definitions of these terms should be based on the content of this specification.

The quantification apparatus of the present invention is for quantifying various characteristics of a short-circuit line or a flow line formed by plastic working and molding of metal or non-metal object 210.

Forging has many advantages including high productivity as well as high product quality.

Partial traces formed on the object 210 due to plastic working such as forging, that is, particle traces on the etched cross section of the forging may have a large effect on product quality.

The object 210 to be forged is generally manufactured by hot rolling, drawing and extrusion, and each particle of the object 210 in the process can be stretched. The history of such plastic deformation can form a directional shear line that does not change much during marking, including post-processing, including forging or machining. This mark can be visualized by etching a polished cross section of a forgings called shear line or metal flow line.

Traditionally, the internal quality of the forged object 210 has been evaluated by visually inspecting the cross-section of an experimentally obtained shear line, the forged object 210. However, the judgment or verification of a swept line through the naked eye depends on the experience of the inspector, and there is no method for objectively evaluating the quality of the swept line.

There are a lot of studies on the effect of shorting line on product quality in the plastic working of metal.

A specific study showed that the life of tapered rollers with heavily inclined shear lines was nearly 1/6 of that of tapered rollers without shear shear.

According to another study, the effect of the shorting line on the rolling contact fatigue of the plastic-finished roller and ball was investigated and the fracture density around the pole area ending the shortening line was found to be much higher .

Also, the service life of the aircraft was found to be highly dependent on the direction of the swept line.

However, the existing research focuses on understanding the effect of the short cable on product quality, and there has been no attempt to quantify the quality of the short cable.

The shear line can be predicted by the plastic working simulation method. According to a general simulation method, a mesh defined in a plane section can be traced to display a shear line.

However, the traditional numerical approach applied to the general simulation method does not provide any solution for quantifying the quality of the current line.

Quantification of the swept line can be an essential element for realizing process design optimization with forging simulator.

In this specification, we introduce a new concept for the gradients of the shear density function and the shear line density, that is, the shear line overlapping quality matrix, in order to quantify the shear line.

The short-circuited line may be defined by a state variable, which is a vector function of the node coordinates virtually set in the object 210. Each component of the vector function at each node can be the initial coordinate that can be computed in the finite element analysis of the plastic working process. The gradient of the vector function (short-circuited function) and the gradient of the short-circuited density, which is defined by the short-circuited density, can be used to evaluate the quality of the short-circuited line.

Fig. 1 is a block diagram showing a quantification apparatus of the present invention, and Fig. 2 is a block diagram showing an acquisition unit 100. Fig.

The quantification apparatus shown in the figure may include an acquisition unit 100, a first unit 310, a second unit 320, and a processing unit 330.

Acquisition unit 100 may obtain a grain flow function.

The grain flow function is obtained by connecting line segments or curves having the same initial coordinate values using the initial coordinate values of the joints calculated and stored at a plurality of joint points set virtually in the object 210 to be plastic- It is possible to make short-circuit lines or flow lines. Here, connecting line segments or curves may mean drawing lines or curves.

Alternatively, the grain flow function may connect line segments or curves having the same initial coordinate values using the initial coordinate values of a plurality of nodes set in the object 210 to be plastic-worked. For example, if you want to create a shear line or a flow line at a target point (having the same initial coordinate value) other than the initial node, the interpolating method applies interpolation to the initial coordinates of the initial node, Can be connected.

It can be used not only for actual traversing lines but also for virtual traversing lines (e.g., the line initially parallel to the x-axis in FIG. 5) and is also applicable to problems where flow trajectory is important, such as casting and polymer processing. Therefore, a short-circuited line can be used to mean a virtual flow line.

The shear line function is a shape of a particle flow or a virtual line or a deformation of a surface appearing on the cut surface after plastic processing or molding of the object 210 including metal or nonmetal. Can be represented by an equivalent line of < RTI ID = 0.0 >

Acquisition unit 100 may obtain a short-circuit line function from external simulation means for plastic processing object 210. Optionally, the acquisition unit 100 may obtain a short-circuited line function from the cross-sectional photograph of the actual metal sample.

Alternatively, the acquisition unit 100 may obtain a short-circuit line function from its own simulation means. As an example, the acquisition unit 100 may include a setting unit 110, a tracking unit 130, and a transformation unit 150 to obtain a short-circuit line function.

The first unit 310 may calculate a grain flow density vector function corresponding to a gradient or gradient of the truncated line function.

The processing unit 330 can quantify the compactness of the swept line using the shear line density.

The second unit 320 may calculate an overlap index (a shear line overlapping quality matrix) corresponding to a gradient or a gradient result of the shear line density vector function. Specifically, the second unit can calculate the overlapping index from the matrix by obtaining the matrix by grading the short-circuit line density vector function corresponding to the gradient of the short-circuit line function received from the first unit.

The processing unit 330 can quantify the overlapping defects associated with the change in the direction in which the particles of the object 210 flow or the change in the normal direction of the sweep line using the sweep line quality quality matrix.

The second unit 320 receives the short-circuited line function directly from the acquiring unit 100 and can calculate the short-circuited line or the overlapped-index of the flowing line through the two gradients.

As another example, the second unit 320 may receive the gradient of the splitting function from the first unit 310 and may calculate the overlapping index by gradating the gradient of the splitting function received from the first unit 310 .

On the other hand, a tensor can be derived as a result of the gradient of the short-circuited line function corresponding to the vector function. Since the gradient of the tensor becomes a matrix, it may be difficult to obtain a numerical value representing the overlapping defect.

In order to quantify the overlap defects, the second unit 320 may partially modify the shear line density vector function corresponding to the gradient result of the shear line function. For example, the second unit 320 may normalize the sieve size maintaining the direction of the shear line density vector function to a set value. In other words, the second unit normalizes the short-circuited line function and the gradient result so that the short-circuit line density (vector size) corresponding to the result of the short-circuit line density vector function and the short- Or modified.

The second unit 320 may calculate the overlap index as shown in FIG. 9 from the gradient of the normalized or modified shear line density vector function, i.e., the matrix obtained by grading the particle flow direction. For example, a fair value or an effective value, which is calculated from the second invariance of the traversing line quality attribute, can be used as the overlap index.

The processing unit 330 may be used with the shear line on the image of the object 210 displayed on the display as shown in FIG. 8, or alternatively, with the shear line, as shown in FIG. 8, It can be displayed numerically regardless of the straight line. The user can easily grasp the defects of the object 210 by using the shear line density and the overlapping defect index expressed numerically on the image.

The magnitude of the shear line density corresponding to the gradient result of the shear line function may be a gradient value for the normal line S of the equivalent line. Therefore, the magnitude of the shear density can indicate the degree of compactness of the shear line or equivalent line.

The processing unit 330 can use the short-circuited density vector function output from the first unit 310 as a numerical value indicating the compactness of the short-circuited line, that is, the short-circuited line density. At this time, the density of the swept line can indicate that the distance between the equivalent lines represented by the line in Fig. 4 is narrowed or widened. The density of the swept line quantified by the processing unit 330 can be used to determine the quality of the object 210 as previously described.

The processing unit 330 can calculate the overlap index using the truncated line overlap quality matrix output from the second unit 320 and the calculated overlap index can be used as a value indicating the overlap defect as it is.

The overlap defect can be related to a change in the flow direction of the particles by overlapping the particles of the object 210 at the same position. For example, if the flow direction of the particles is abruptly changed, a lapping defect in which a plurality of particles are pushed to the same position may be generated. The overlap index or the shear line overlap quality matrix calculated from the second unit 320 can be calculated by partially changing the shear line density function to emphasize the flow direction of the particles or the rate of change of the shear line. The rate of change at this time can be directly connected to the overlapping bond.

If the scale of the overlap index and the scale of the overlap defect are different, the processing unit 330 may calibrate the scale of the overlap index to the scale of the overlap defect. The overlapping quality matrix quantified by the processing unit 330 may be used to determine the quality of the object 210. The function of the eigenvalues and eigenvectors and invariants of the matrix as well as each element of the matrix can be used as the overlap index.

3 is a schematic view showing a process structure in which the object 210 is forged.

For example, the object 210 having a rectangular cross-section can be plastically deformed between a die having a lower mold and a punch having an upper mold.

The flow stress in the process the structure is assumed to be 320.0 (1.0 + ε / 0.05) 0. 15. The coulomb friction coefficient is set to 0.05, and the punching speed is assumed to be 1.0 mm / s. Fig. 4 shows the finite element prediction results of the straight line obtained by applying the 8000 square finite element mesh system. The prediction result may be generated in a separate simulation unit and then transferred to the acquisition unit 100 or may be acquired through simulation of the acquisition unit 100 itself.

Figs. 4 and 5 are schematic views showing the result of simulating the plastic working of the object 210 by using the finite element analysis method. 6 is a schematic view of a sweep line divided into four regions. The area on the left of the four areas can be seen as a seismic zone and is structurally vulnerable, so it is a region where a high quality shear line is required.

Fig. 4 shows the equivalent line of the x-axis component of the short-circuited line function (the right direction of the horizontal line is defined as the x-axis). (X, y, z) when the x, y, and z axes orthogonal to each other are defined (the axis perpendicular to the drawing is defined as the z axis) And z-axis components (the z-axis component is fixed at 0) are connected by lines on the finite element mesh system with the same initial coordinates.

Fig. 5 shows the x-axis and y-axis component equivalent lines of the short-circuited line function on the x-y plane.

The initial node coordinates of the deformed object 210 through simulation can be calculated by a finite element analysis. In the absence of remeshing, the initial coordinates of the nodes in the simulated phase are the coordinates of the nodes at the initial stage of the simulation of the object 210 due to plastic deformation. In the case of re-meshing, the initial coordinates of the nodes of the remeshed object 210 may be calculated or mapped in the same manner as the speed of the nodes.

The nodal initial coordinates can be used to define the spline line function according to the finite element interpolation rule. The shear line function can be a vector function of coordinates. Thus, a shear line in a particular direction can be visualized by an equiva- lent line representing the corresponding component of the shear line function. For example, FIG. 4 shows the variation of the x-component equivalent line of the short-circuited line function with stroke. In the same way, various flow lines or shear lines can be visualized as shown in Fig. 5 by simultaneously showing the changes of the equivalent lines of the x-component and the y-component.

In addition, the microsegregation region of a round billet can be easily defined by the shear line function. In the two-dimensional problem, the x-component of the shear line function can be used to define a segregation zone, the central region defined by a 2.16 mm radius (1/4 of a radius). For example, in FIG. 6, a plurality of segregation zones are displayed in different colors.

FIG. 7 is an image of the object 210 showing the compactness of the swept line quantified by using the short-circuit line density (size) among the gradient results of the short-circuit line function, FIG. 8 is an image of the direction component Is the image of the object 210 displayed with the magnitude.

The gradient of the shear line function, referred to as the shear line density, can be used to evaluate the density or compactness of the equilibrium line, that is, the shear line, as shown in FIG.

For example, if the size of the shear line density for a selected node in the object 210 is small and the corresponding node is included in the segregation zone, then the product quality for that node may be considered bad. A weak region having a relatively small density can be clearly seen in Fig. 7 in the segregation zone. In FIG. 7, a weak region having poor product quality is shown in white, and a shear line density of the region is relatively low as compared with other regions such as 0.5.

Also, when the size of the shear line density is larger than the set value, for example, cracks may occur in the ⓐ area and the ⓑ area shown in Fig. 4 denoted by 11.0 and 9.0 in Fig.

Therefore, the node or peripheral region where the magnitude of the shear line density is smaller than the specific set value or larger than the other set value can be restricted so as not to deviate from the safe region in the process optimum designing stage.

As shown in Fig. 8, the direction of the shear density vector can provide a direction perpendicular to the shear line at one point. For the sake of convenience of explanation, Fig. 8 may be directed only to the x-component of the node and the remaining components to other shear lines or flow lines. Therefore, on the two-dimensional plane, the quality of the shear line or the flow line can be evaluated by processing the two components x, y of the initial coordinates of the nodal point. In the three-dimensional space, the quality of the swept line can be evaluated by processing the three components of the initial coordinates of the node, x, y, and z.

FIG. 9 is an image of an object 210 having an overlapping defect quantified by using a truncation line overlapping quality matrix, i.e., an invariance of the overlapping index, obtained by grayscaleing the gradient result of the spline line function.

The overlapping defect shown in FIG. 9 may be the overlapping index itself or the overlapping index may be calibrated.

It is known from experiments and experience that the overlapping of the particles forming the object 210 or the overlapping of the sweep lines deteriorates the rigidity of the object 210. [ Therefore, it is preferable that the overlapping defects in which the particles of the object 210 overlap or the splicing lines overlap are strictly excluded.

Overlap defects can occur almost exclusively in regions where the direction of the swirling current, that is, the direction of the shear line density vector function, changes very rapidly. In this region, the specific value of the gradient of the shear line density vector function corresponding to the second tensor, for example, the second constant of the second tensile amount, can vary greatly. Thus, the overlap index calculated from the gradient of the shear line density vector function can be used to check for overlap defects in metal and non-metal forming.

9 shows an overlap index indicating a change in the normal direction of the equivalent line corresponding to the short-circuit line in Fig.

The shear line density vector function can be normalized or partially modified to compute the gradient of the shear line density vector function corresponding to the second tensor. For example, the second unit 320 may perform normalization that ignores the magnitude of the shear line density vector function, and may calculate the overlap index using only the direction of the shear line density vector function. In FIG. 9, the same color may mean that the overlap indexes are equal to each other.

It can be seen that the possibility of overlapping defects in Figs. 4 and 6 is clearly reflected in the overlapping index shown in Fig.

The overlap index calculated from the gradient of the shear density vector function can also be easily extended to two-dimensional and three-dimensional like the shear line density vector function.

According to the present invention, a shorting line that affects the quality of the forged object 210 can be defined by the equivalent line of the shorting line function.

A shear line density vector function, defined by a gradient of a shear line function, can be used to evaluate the density (directionality) and direction of the shear line.

The overlap index calculated from the gradient of the shear line density can be used to monitor the overlap defects. The shear density, shear line denseness, shear line overlap defect matrix, overlap index and the like can all be quantified by the processing unit 330, and various quantified indexes can be used in the process design that will become a hot topic in the metal and non-metal forming fields in the near future Can be used to formulate optimization problems.

The acquisition unit 100 shown in FIG. 2 may simulate the plastic working of the object 210 using mathematical models (including process design and analysis factors). At this time, the short-circuit line function can be obtained through the simulation made by the acquiring unit 100.

The processing unit 330 may communicate the quantized overlap index to the acquisition unit 100 using quantified density (shear line density) or shear line function.

The acquiring unit 100 can modify the mathematical model or modify various factors applied to the simulation by using the density (shear line density) or the overlap index received from the processing unit 330. [

Acquisition unit 100 may acquire a new traversing line function through simulation that reflects the modified mathematical model or the modified factor and may pass it to first unit 310 and second unit 320.

The first unit 310 and the second unit 320 can calculate the short-circuit line density and the overlap index by using the newly transmitted short-circuit line function.

The processing unit 330 can quantify the denseness of the new straight line, new overlapping defects using the newly calculated shear line density and the overlap index. The processing unit 330 may deliver the newly quantified dense or overlapping defects back to the acquiring unit 100.

The above procedure can be repeated until the denseness and overlapping defects meet the set values.

The acquisition unit 100 may analyze and simulate a plurality of mathematical models applied to the simulation and then simulate the plastic forming of the object 210 again.

In one example, the processing unit may deliver first error information or first enhancement information having a denseness satisfying a first set value among a plurality of nodes to the acquiring unit. Or the processing unit may transmit the second error information or the second error information having the overlapping defect satisfying the second one of the plurality of nodes to the obtaining unit.

The acquiring unit analyzes the first error information, the first improvement information, the second error information, or the second improvement information to grasp the error expected position or the expected improvement position of the object,

The acquiring unit can re-simulate the plastic working of the object after correcting the mathematical model related to the error expected position and the expected improvement position among the plurality of mathematical models applied to the simulation.

Hereinafter, the acquisition process of the short-circuit line function will be described in detail.

10 is a schematic view showing nodes set by the simulation means;

The simulation means may be provided separately or integrally with the acquisition unit 100.

For example, the acquiring unit 100 may include a setting unit 110, a tracking unit 130, and a modification unit 150.

The setting unit 110 can set a virtual node in the object 210. [

Once a nodal point is set on the object 210, it is possible to discretize a continuous object 210 with a limited number of elements having a particular size connected to each nodal point.

When the plastic deformation of the object to be plastic-worked 210 is simulated through the deformation part 150 in the set processing environment, the tracking part 130 changes the position of each node until the deformation part 150 is driven It is possible to generate a flow state diagram by monitoring the initial position of each node at the point of time when it is continuously monitored and the drive is completed. At this time, the flow state diagram may correspond to the short-circuited line function.

Fig. 10 shows an initial desired network (hereinafter, interpreted demand network) for the purpose of analyzing the plastic working process. Setting unit 110 may be required to interpret node i that make up the desired including the initial coordinates (x _i, y _i, z _i) of the joint fixedly. If an equivalent line of the x, y, or z coordinates is drawn, an initial shear line or flow diagram (flow diagram) representing the equivalent line, that is, the initial shear line, as shown in FIG. 4, . At this time, the initial plastic flow diagram may correspond to a selection value or a selection condition.

Drawing a line with the same coordinate value results in a plastic flow line (virtual line) in the three-dimensional space, and when a plane having the same coordinate value is drawn, that is, when the plane of contour is drawn, it becomes a three-dimensional plastic flow plane (virtual plane). As shown in Fig. 9, a desired shear line or a flow line can also be created by creating an equivalent line at any cross-section. For reference, plastic flow diagrams can be drawn based on r coordinates, θ coordinates, z coordinates (x = rcosθ, y = rsinθ, z = z), and the number of equivalent lines can be changed freely.

In addition, the transformation process of a circle or a curve around a point set on an initial plane or a curved surface can be traced in the same way.

Equivalent lines can be used to include not only straight lines and curves connecting plane segments but also closed curves such as circles on a plane.

Equivalent lines can be used to include three-dimensional equivalent lines and back surfaces.

By applying each coordinate to the numerical analysis by treating it as the same state variable as the effective strain while maintaining the initial value of the initial coordinate of the node, it is possible to trace the short-circuited line or the flow line regardless of the element network reconstruction . Of course, since the initial coordinates of the nodes are constant, it is not necessary to change and calculate the initial coordinates of the nodes in the analysis step where no mesh reconstruction is performed.

11 is a schematic view showing a flow diagram generated by the simulation means; FIG. 12 is a schematic view showing information of a node set by the setting unit 110, and FIG. 13 is a schematic view showing a first time at which a node initial coordinate is generated.

In Fig. 11, eight nodes ①, ②, ③, ④, ⑤, ⑥, ⑦, ⑧ are set for convenience of explanation. However, there may be numerous nodes.

In FIG. 11, the setting unit 110 may include a joint initial coordinate at a first point of time t ₁ as a fixed value for each node as follows.

Node ①: the initial node coordinates of the nodes _{① (x 2, y 1,} z 1)

Node ②: the initial node coordinates of the node _{② (x 2, y 1,} z 2)

Nodal point ③: Nodal point of nodal point ③ Initial coordinate (x ₂ , y ₁ , z ₃ )

Nodal point ④: Nodal point of nodal point ④ Initial coordinates (x ₂ , y ₁ , z ₄ )

Nodal point ⑤: Nodal point of nodal point ⑤ Initial coordinate (x ₂ , y ₁ , z ₅ )

Nodal point ⑥: Nodal coordinates of the nodal point ⑥ (x ₁ , y ₁ , z ₅ )

Nodal point ⑦: Nodal point of nodal point ⑦ Initial coordinate (x ₃ , y ₁ , z ₅ )

Nodal point ⑧: Nodal coordinates of the nodal point ⑧ (x ₄ , y ₁ , z ₅ )

In each of the nodal points? To?, The characteristic information including the coordinate information? And the initial coordinates of the nodal point shown in FIG. 12 may be included. For example, the node (1) contains the coordinate information (x ₂ , y ₁ , z ₁ ) indicating the node ( ₁ ), and the node initial coordinates (x ₂ , y ₁ , z ₁ ) P ₁ , temperature T _1, and the like.

The initial node coordinates the initial node coordinates included in the coordinate information and attribute information ⓨ ⓩ because the coordinate information of each node, each node in the first time point t ₁ at a first point in time t ₁ can have the same value. The initial coordinates of the node can be a fixed value regardless of the viewpoint. For example, as shown in FIG. 12, even if the coordinate information 의 of the nodal point 변경 is changed to (x _a , y _b , z _c ) at the point of time t ₂ , the initial coordinates (x ₂ , y ₁ , z ₁ ) Value can be maintained.

The first point of time may be before or at the start of the deformation part 150. [ In some cases, the first point of time may be a point in the middle of driving the deforming unit 150.

On the other hand, a plurality of joint initial coordinates may be included in each joint. In this case, the first viewpoints of the initial coordinates of the respective nodes may be different from each other such as t _1a , t _1b , t _1c , t _1d , and t _1e shown in FIG. In the case of FIG. 13, since there are five first viewpoints in total, five initial coordinates of the node can be included in each node.

Since the flow state diagram generated by the tracking unit 130 at the second time point indicates how the first time object 210 before the second time point is transformed at the second time point, The flow state from t ₁ to the second point of view, the flow state from t _{1 b} to the second point of view, the flow state from t 1 _c to the second point of view, the flow state from t 1 _d to the second point of time, t The flow state diagram from _1e to the second time point, etc. can be obtained.

When a plurality of nodes are set for the object 210 in the setting unit 110 and the initial coordinates of the nodes are included as fixed values at the respective nodes, at the second time, A selection node including coordinates can be extracted. The tracking unit 130 may generate a flow state diagram or a shear line function connecting the extracted selected nodes.

The selection node may be a selection point among the plurality of nodes or a node including the initial coordinates of the node matching the selection criterion. The selection value or the selection criterion can be arbitrarily set. For the selected value of g (x _2, y _1,?) Is, the tracking section 130 will analyze all of the nodes included in the first time point t _1, the second object 210 at a time point t ₂ after a 11 can do. Tracking unit 130 having the joint initial coordinates and the selected value (x _2, y _1,?), The comparison, and the joint initial coordinates (x _2, y _1, z ₁₎ is matched with the selected values contained in the respective nodal points, node _{①, (x 2, y 1} , z 2) of having node _{②, (x 2, y 1} , z 3) for which node ③, the nodes having a _{(x 2, y 1, z} 4) ④, (x ₂ , y ₁ , z ₅ ) can be extracted as the selected node. The tracing unit 130 can generate a flow state diagram using the five selected nodes ①, ②, ③, ④, and ⑤ extracted as described above. For example, the tracking unit 130 may generate a flow state diagram k with a virtual line or a virtual plane connecting the selected nodes 1, 2, 3, 4, and 5 in the order of magnitude of coordinate z given degrees of freedom. At this time, the imaginary line or imaginary plane may be formed in the outline of the object 210.

As another example, if the selection value is (?, Y ₁ , z ₅ ), the tracking unit 130 compares the initial coordinates of the nodes included in each node with the selection values (?, Y ₁ , z ₅ ) node having a node initial coordinates _{(x 1, y 1, z} 5) is ⑥, the nodes having a _{(x 2, y 1, z} 5) the node _{⑤, (x 3, y 1} , z 5) having ⑦, ( x ₄ , y ₁ , z ₅ ) can be extracted as the selected node. Using the four selected nodes ⑥, ⑤, ⑦, and ⑧ extracted as described above, the tracking unit 130 can generate the flow state diagram g.

According to the above configuration, the tracking unit 130 does not need to track each node during the driving process of the deformation unit 150, that is, during the plastic deformation process. That is, the tracking unit 130 may be driven after the deformation of the object 210 is not performed and deformation of the object 210 is completed. In other respects, the tracking unit 130 may be considered to be driven at a second point in time after the first point in time. It is enough for the tracking unit 130 to analyze all the nodes included in the object 210 at the second time point and to extract an optional node matching the selection value or the selection condition. The tracking unit 130 may include a function of generating a virtual line or a virtual plane connecting the selected nodes as the case may be.

The configuration of the tracking unit 130 can be simplified and the load of the tracking unit 130 can be greatly reduced. In addition, accurate flow diagrams can be obtained.

Also, by analyzing the nodes of the deformed object 210 without having to re-drive the deformable part 150, it is possible to obtain various short-circuit line functions or flow state diagrams satisfying various selection values or selection conditions.

The obtained short-circuited line function may be provided to the first unit 310 or the second unit 320.

14 is a flow chart illustrating the quantification method of the present invention.

The quantification method of the present invention may include an acquisition step (S 510), a first calculation step (S 520), a second calculation step (S 530), a processing step (S 540), and a modification step (S 550).

The acquisition step S 510 may acquire a grain flow function that connects line segments or curves having the same initial coordinate values using the initial coordinate values of a plurality of nodes set in the plastic object 210 have. For example, the acquisition step (S 510) may acquire the short-circuited line function using the initial coordinate values stored at a plurality of nodes. In an operation performed by the acquiring unit 100, the short-circuited line function may be represented by an equal line on the image of the object 210. [

The first calculation step (S 520) may yield a gradient of the short-circuit line function. By the operation performed by the first unit 310, the short-circuit line density corresponding to the gradient of the short-circuit line function can be used to grasp the compactness of the short-circuit line.

The second calculation step (S 530) may yield a gradient of the gradient of the short-circuited line function. With the operation performed by the second unit 320, the second unit 320 can calculate the overlap index calculated from the gradient of the shear line density. The calculated overlap index can be used to identify the overlap defect.

If necessary, the second calculation step may normalize the gradient of the short-circuited line function and then re-gradient the normalized short-circuited line function gradient.

The processing step (S 540) may quantify the short-circuited characteristics of the object (210) using the results of the first calculation step or the results of the second calculation step. In a step performed by the processing unit 330, the processing unit 330 can calibrate the shear line density to quantify the compactness of the sheathed line. The processing unit 330 may calibrate the overlap index to quantify the overlap defects.

The processing unit 330 may display various characteristics of the quantified current lines through a display, or may transmit them to simulation means for optimum design. The characteristics of the short-circuited line transferred to the simulation means can be automatically reflected in the design of the plastic processing system.

The modification step S 550 may be an operation performed after the processing step. The correction step may be performed by a separate simulation means or acquisition unit 100.

The modification step S 550 may modify the mathematical model of the simulation means for simulating the plastic working of the object 210 using the short-cut line characteristics of the quantified object 210.

Then, the acquisition step (S 510) may acquire a newly modified short-circuited line function through re-simulation in which the mathematical model corrected in the modification step (S 550) is reflected. Thereafter, the first calculation step, the second calculation step, the processing step, and the correction step are repeatedly performed, and the repetitive operation can be performed until the short-circuited characteristic of the quantified object 210 satisfies the set value.

While the invention has been shown and described with reference to certain preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims. Accordingly, the true scope of the present invention should be determined by the following claims.

110 ... setting unit 130 ... tracking unit
150 ... deformation portion 210 ... object
100 ... Acquisition unit 310 ... First unit
320 ... second unit 330 ... processing unit

Claims (11)

delete An acquiring unit for acquiring a grain flow function for connecting line segments or curves having the same initial coordinate values using initial coordinate values of a plurality of nodes set in an object to be plastic-worked;
A first unit for calculating a grain flow density vector function corresponding to a gradient or a gradient of the short-circuit line function;
A processing unit for quantifying the compactness of the swept line of the object by using the shear line density vector function;
And a second unit for calculating an overlapping index corresponding to a gradient of the shear line density vector function or a gradient result,
Wherein the processing unit quantizes overlapping defects associated with a change in the direction of the particles of the object or a change in the normal direction of the sweep line using the overlap index.
3. The method of claim 2,
Wherein the second unit receives the gradient of the short-circuit line function from the first unit,
Wherein the second unit obtains a matrix by grading the short-circuit line density vector function corresponding to a gradient of the short-circuit line function received from the first unit, and calculates the overlap index from the matrix.
3. The method of claim 2,
Wherein the second unit has a gradient of the short-circuit line function to eliminate the short-circuit line density among the short-circuit line density (the magnitude of the vector) and the normal direction of the short- Normalizing or modifying the results,
Wherein said second unit calculates said overlap index from a matrix obtained by grading said shear line density vector function normalized or modified.
An acquiring unit for acquiring a grain flow function for connecting line segments or curves having the same initial coordinate values using initial coordinate values of a plurality of nodes set in an object to be plastic-worked;
A first unit for calculating a grain flow density vector function corresponding to a gradient or a gradient of the short-circuit line function;
A processing unit for quantifying the compactness of the swept line of the object by using the shear line density vector function; Lt; / RTI >
Wherein the processing unit displays the overlap index indicative of the quantified density or the intersecting line function quantitatively on the image of the object displayed on the display, either with or without regard to the swept line.
An acquiring unit for acquiring a grain flow function for connecting line segments or curves having the same initial coordinate values using initial coordinate values of a plurality of nodes set in an object to be plastic-worked;
A first unit for calculating a grain flow density vector function corresponding to a gradient or a gradient of the short-circuit line function;
A processing unit for quantifying the compactness of the swept line of the object by using the shear line density vector function; Lt; / RTI >
Wherein the obtaining unit simulates the plastic working of the object using a mathematical model,
The shear line function is obtained through the simulation,
Wherein the processing unit transfers the quantized overlap index to the acquisition unit using the quantified density or the shear line function,
Wherein the acquiring unit modifies the mathematical model using the denseness or the overlap index, or modifies a factor applied to the simulation.
The method according to claim 6,
Wherein the processing unit transfers first error or improvement information having a denseness satisfying a first set value among a plurality of nodes to the acquiring unit or a second error having an overlapping defect satisfying a second set value of the plurality of nodes Or improvement information to the acquiring unit,
The acquiring unit analyzes the first error or improvement information or analyzes the second error or improvement information to grasp an error expected position or an expected improvement position of the object to be corrected,
Wherein the acquiring unit modifies a mathematical model related to the error expected position or the expected improvement position among a plurality of mathematical models applied to the simulation, and then re-simulates the plastic working of the object.
delete An acquiring step of acquiring a grain flow function for connecting line segments or curves having the same initial coordinate values using initial coordinate values of a plurality of nodes set in an object to be plastic-worked;
A first calculation step of calculating a gradient of the short-circuit line function;
A processing step of quantifying the short-circuited line characteristic of the object using the result of the first calculation step; Lt; / RTI >
And a second calculation step of calculating a gradient of the gradient of the short-circuit line function,
Wherein the processing step quantifies the short-circuited characteristic of the object using the result of the second calculation step.
10. The method of claim 9,
Wherein the second calculation step normalizes or corrects the gradient of the short-circuited line function, and then performs the gradient calculation again.
An acquiring step of acquiring a grain flow function for connecting line segments or curves having the same initial coordinate values using initial coordinate values of a plurality of nodes set in an object to be plastic-worked;
A first calculation step of calculating a gradient of the short-circuit line function;
A processing step of quantifying the short-circuited line characteristic of the object using the result of the first calculation step; Lt; / RTI >
After the processing step,
And a correction step of correcting the mathematical model of the simulation means for simulating the plastic working of the object by using the quantified short-circuit line characteristic of the object,
Wherein the acquiring step acquires a newly modified short-circuited line function through a re-simulation in which the mathematical model corrected in the correcting step is reflected.

Images