KR101942723B1 - Multilayer ceramic electronic part and print circuit board having embedded multilayer ceramic electronic part - Google Patents

Abstract

The present invention provides a ceramic body comprising a ceramic body having first and second main faces facing each other, a first side facing each other, a second side and first and second end faces facing each other, Wherein the first internal electrode and the second internal electrode are formed on the first and second main surfaces of the ceramic body, the first internal electrode and the second internal electrode, and first and second external electrodes disposed outside the ceramic body, The second internal electrode is connected to the second external electrode by one or more second vias extended by at least one of the first and second major faces of the ceramic body, A length from the ends of the first and second external electrodes formed on the first and second main surfaces of the ceramic body to the first and second external electrodes corresponding to the first and second vias, G, The lengths of the first and second outer electrodes formed on the first and second main surfaces of the ceramic body to the end faces of the ceramic body are denoted by BW, 1 ≤ B ≤ BW-M, where M is the length from the first external electrode to the second external electrode.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer ceramic electronic component and a multilayer ceramic electronic component embedded printed circuit board. 2. Description of the Related Art Multilayer ceramic electronic components and multilayer ceramic electronic components include a printed circuit board (MULTILAYER CERAMIC ELECTRONIC PART and PRINT CIRCUIT BOARD HAVING EMBEDDED MULTILAYER CERAMIC ELECTRONIC PART)

The present invention relates to a multilayer ceramic electronic component and a multilayer ceramic electronic component embedded printed circuit board.

As electronic circuits become denser and highly integrated, passive devices mounted on a printed circuit board have insufficient mounting space. To solve this problem, an attempt has been made to implement a component embedded in a substrate, that is, an embedded device . Particularly, various methods of embedding a multilayer ceramic electronic part used as a capacitive part in a substrate have been proposed.

As a method of embedding a multilayer ceramic electronic component in a substrate, there is a method in which a substrate material itself is used as a dielectric material for multilayer ceramic electronic components and a copper wiring or the like is used as an electrode for multilayer ceramic electronic components. As another method for implementing the multilayer ceramic electronic component, there is a method of forming a multilayer ceramic electronic component by forming a dielectric sheet having a high dielectric constant or a dielectric of a thin film in a substrate, and a method of embedding a multilayer ceramic electronic component in a substrate .

Generally, a multilayer ceramic electronic device includes a plurality of dielectric layers made of a ceramic material and internal electrodes inserted between the plurality of dielectric layers. By placing such a multilayer ceramic electronic component in a substrate, a multilayer ceramic electronic component having a high capacitance can be realized.

 In order to manufacture a printed circuit board having a multilayer ceramic electronic component, a multilayer ceramic electronic component is inserted into a core substrate, and then a laser is used to connect the substrate wiring and the external electrodes of the multilayer ceramic electronic component. A via hole must be drilled through the through hole. This laser processing is a factor that significantly increases the manufacturing cost of the printed circuit board.

On the other hand, since the multilayer ceramic electronic component must be embedded in the core portion of the substrate, a nickel / tin (Ni / Sn) plating layer is not required on the external electrode, unlike a conventional multilayer ceramic electronic component mounted on the surface of the substrate.

That is, since the external electrodes of the multilayer ceramic electronic device are electrically connected to the circuits in the substrate through vias made of copper, a copper (Cu) layer instead of the nickel / tin (Ni / Sn) It becomes necessary on the electrode.

Normally, the outer electrode also contains copper (Cu) as a main component. However, since the glass contains the glass, a component included in the glass absorbs the laser during laser processing used for forming a via in the substrate , There is a problem that the processing depth of vias can not be controlled.

For this reason, a copper (Cu) plating layer is separately formed on the external electrode of the multilayer ceramic electronic component.

However, due to the formation of a separate copper (Cu) plating layer, there is still a problem of increased cost and lowering of reliability due to penetration of the plating solution, and thus there is still a demand for solving such problems.

On the other hand, the multilayer ceramic electronic component is incorporated in a printed circuit board used for a memory card, a PC main board, and various RF modules, whereby the size of the product can be drastically reduced as compared with the mounting multilayer ceramic electronic component.

In addition, since the input terminal of the active element such as the MPU can be disposed at a very close distance, the interconnect inductance due to the conductor length can be reduced.

The inductance reduction effect in such multilayer ceramic electronic components is merely an effect due to the reduction of interconnection inductance obtained by the inherent arrangement relationship of the built-in type, and the improvement of the ESL characteristics of the multilayer ceramic electronic component itself has not been achieved yet.

Generally, in a multilayer ceramic electronic component, in order to lower the ESL, it is necessary to shorten the current path inside the multilayer ceramic electronic component.

However, when a copper (Cu) plating layer is separately formed on the external electrode of the multilayer ceramic electronic component, there is a problem that the plating liquid infiltrates into the external electrode, and it is not easy to shorten the internal current path.

Korean Patent Publication No. 2006-0073274

The present invention relates to a multilayer ceramic electronic component and a multilayer ceramic electronic component embedded printed circuit board.

An embodiment of the present invention includes a ceramic body having first and second main faces facing each other, a first side facing each other, a second side and first and second end faces facing each other, A first internal electrode and a second internal electrode, and first and second external electrodes disposed outside the ceramic body, wherein the first internal electrode is connected to the first and second main surfaces of the ceramic body, Wherein the second internal electrode is connected to one or more second vias extending from at least one of the first and second major surfaces of the ceramic body, The first and second external electrodes being formed on the first and second major surfaces of the ceramic body, the first and second external electrodes being electrically connected to the first and second external electrodes, To the length of G is a length of the first and second outer electrodes formed on the first and second major surfaces of the ceramic body to a cross section of the ceramic body is BW, And the length to the first and second external electrodes corresponding to the via is M, the multilayer ceramic electronic component satisfies the relationship of 30 占 퐉 G <BW-M.

(G) from the ends of the first and second external electrodes formed on the first and second main surfaces of the ceramic body to the first and second external electrodes corresponding to the first and second vias, (BW) of the first and second external electrodes formed on the first and second main surfaces of the ceramic body to the end surface of the ceramic body and the lengths of the first and second external electrodes 2 &gt; M &lt; BW-G can be satisfied.

The average thickness of the first and second external electrodes formed on the first and second main surfaces of the ceramic body may be 5 탆 or more.

A metal layer made of copper (Cu) may be further formed on the first and second external electrodes.

Another embodiment of the present invention is a semiconductor device comprising: an insulating substrate; And a multilayer ceramic electronic component embedded in the insulating substrate.

(G) from the ends of the first and second external electrodes formed on the first and second main surfaces of the ceramic body to the first and second external electrodes corresponding to the first and second vias, (BW) of the first and second external electrodes formed on the first and second main surfaces of the ceramic body to the end surface of the ceramic body and the lengths of the first and second external electrodes 2 &gt; M &lt; BW-G can be satisfied.

The average thickness of the first and second external electrodes formed on the first and second main surfaces of the ceramic body may be 5 탆 or more.

A metal layer made of copper (Cu) may be further formed on the first and second external electrodes.

According to the present invention, it is possible to reduce the equivalent series inductance (ESL) by shortening the current path by forming vias in the multilayer ceramic electronic component and connecting the internal electrodes and the external electrodes through the vias.

Further, by controlling the thickness of the external electrode in contact with the via, it is possible to prevent the reliability from lowering due to penetration of the plating liquid.

1 is a perspective view showing a multilayer ceramic electronic component according to an embodiment of the present invention.
2 is a sectional view taken along the line XX 'in Fig.
3 is a cross-sectional view showing a multilayer ceramic electronic component built-in printed circuit board according to another embodiment of the present invention.

The embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to more fully explain the present invention to those skilled in the art. Accordingly, the shapes and sizes of the elements in the drawings may be exaggerated for clarity of description, and the elements denoted by the same reference numerals in the drawings are the same elements.

Throughout the specification, when an element is referred to as " comprising ", it means that it can include other elements as well, without excluding other elements unless specifically stated otherwise.

In order to clearly illustrate the present invention in the drawings, thicknesses are enlarged in order to clearly illustrate various layers and regions, and parts not related to the description are omitted, and similar parts are denoted by similar reference numerals throughout the specification .

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings.

1 is a perspective view showing a multilayer ceramic electronic component according to an embodiment of the present invention.

2 is a sectional view taken along the line XX 'in Fig.

1 and 2, a multilayer ceramic electronic device according to an embodiment of the present invention includes a dielectric layer 11, and includes first and second major surfaces facing each other, a first side facing each other, And a ceramic body (10) having first and second cross sections facing each other; A first internal electrode 21 and a second internal electrode 22 which are alternately exposed through both end faces of the ceramic body 10 with the dielectric layer 11 therebetween; And first and second external electrodes 31 and 32 extending from the first and second end faces of the ceramic body 10 to first and second major faces, first and second sides.

Hereinafter, a multilayer ceramic electronic device according to an embodiment of the present invention will be described, but a laminated ceramic capacitor will be described, but the present invention is not limited thereto.

In the multilayer ceramic capacitor according to one embodiment of the present invention, the 'longitudinal direction' is defined as 'L' direction, 'width direction' as 'W' direction, and 'thickness direction' as T direction do. Here, the 'thickness direction' can be used in the same sense as the direction in which the dielectric layers are stacked, that is, the 'lamination direction'.

In one embodiment of the present invention, the ceramic body 10 is not particularly limited in shape, but may be in the form of a hexahedron as shown.

In one embodiment of the present invention, the ceramic body 10 may have first and second main faces facing each other, a first side facing each other, a second side, and first and second end faces facing each other, The first and second main surfaces may be represented by the upper surface and the lower surface of the ceramic body 10.

According to one embodiment of the present invention, the raw material for forming the dielectric layer 11 is not particularly limited as long as sufficient electrostatic capacity can be obtained, for example, it may be a barium titanate (BaTiO ₃ ) powder.

A variety of ceramic additives, organic solvents, plasticizers, binders, dispersants and the like may be added to the powder of the barium titanate (BaTiO ₃ ) to form the dielectric layer 11 according to the purpose of the present invention.

The average particle diameter of the ceramic powder used for forming the dielectric layer 11 is not particularly limited and may be adjusted to achieve the object of the present invention, but may be adjusted to, for example, 400 nm or less.

The material for forming the first and second internal electrodes 21 and 22 is not particularly limited and may be selected from a noble metal material such as palladium (Pd), a palladium-silver (Pd-Ag) alloy, , Copper (Cu), or the like.

The first and second internal electrodes 21 and 22 may be alternately exposed through both end faces of the ceramic body 10 with the dielectric layer 11 interposed therebetween.

According to an embodiment of the present invention, the first and second external electrodes 31 and 32 extend from the first and second end faces of the ceramic body 10 to the first and second main faces, May be formed.

The first and second external electrodes 31 and 32 may include a conductive metal and a glass.

The first and second external electrodes 31 and 32 are formed to extend from the first and second end faces of the ceramic body 10 to the first and second major faces, And may be electrically connected to the first and second internal electrodes 21 and 22.

The first and second external electrodes 31 and 32 may be formed of a conductive material having the same material as that of the first and second internal electrodes 21 and 22, Cu), silver (Ag), nickel (Ni), and alloys thereof.

The first and second external electrodes 31 and 32 may be formed by applying a conductive paste prepared by adding glass frit to the conductive metal powder and then firing the paste.

According to an embodiment of the present invention, a metal layer of copper (Cu) may be further formed on the first external electrode 31 and the second external electrode 32.

Generally, since the multilayer ceramic capacitor is mounted on a printed circuit board, a nickel / tin plating layer is usually formed on the external electrode.

However, the multilayer ceramic capacitor according to the embodiment of the present invention is not mounted on the substrate, and the first external electrode 31 and the second external electrode 32 of the multilayer ceramic capacitor and the circuit of the substrate are made of copper Cu) via a via.

Therefore, according to one embodiment of the present invention, copper (Cu) having good electrical connection with copper (Cu), which is a material of vias in the substrate, is formed on the first external electrode 31 and the second external electrode 32 A metal layer may be further formed.

The first external electrode 31 and the second external electrode 32 are made of copper (Cu) as a main component. However, since the first external electrode 31 and the second external electrode 32 include glass, There is a problem in that the processing depth of the vias can not be controlled by absorbing the laser contained in the glass during the processing.

Therefore, according to one embodiment of the present invention, the above problem can be solved by forming a metal layer made of copper (Cu) on the first external electrode 31 and the second external electrode 32.

The method of forming the metal layer made of copper (Cu) is not particularly limited and may be formed by plating, for example.

Alternatively, a conductive paste containing copper (Cu) but not including glass frit may be applied on the first external electrode 31 and the second external electrode 32, and is particularly limited It is not.

According to the coating method, the metal layer after firing may be made of only copper (Cu).

2, the first internal electrode 21 is electrically connected to the first external electrode (not shown) by one or more first vias 21a extending from at least one of the first and second main surfaces of the ceramic body 10, And the second internal electrode 22 is connected to the second external electrode 22 by one or more second vias 22a extending from at least one of the first and second major surfaces of the ceramic body 10, 32, respectively.

In general, in the case of a multilayer ceramic electronic component, a copper (Cu) plating layer is separately formed on the external electrode, so that damage to the internal electrode due to penetration of the plating liquid may occur.

Accordingly, in the case of the multilayer ceramic electronic component, the thickness of the upper and lower cover layers is increased to prevent damage to the internal electrode due to penetration of the plating liquid.

However, when the thickness of the upper and lower cover layers is increased as described above, there is a problem that the current path in the multilayer ceramic electronic component becomes long, and it is not easy to reduce the equivalent series inductance (ESL).

However, according to one embodiment of the present invention, the first internal electrode 21 is formed by at least one first via 21a extending from at least one of the first and second main surfaces of the ceramic body 10, And the second internal electrode 22 is connected to one external electrode 31 by one or more second vias 22a extending from at least one of the first and second major surfaces of the ceramic body 10, 2 external electrode 32, the equivalent series inductance (ESL) can be reduced.

Specifically, the equivalent series inductance (ESL) can be reduced by shortening the current path inside the multilayer ceramic electronic component.

In the case of a general laminated ceramic electronic device, the current path is such that a current is transferred to the first internal electrode through the first end face of the ceramic body by the voltage applied to the first external electrode, And the second external electrode.

However, the first internal electrode 21 may be formed by one or more first vias 21a extended from at least one of the first and second main surfaces of the ceramic body 10, as in the embodiment of the present invention, The second internal electrode 22 is connected to one external electrode 31 and the one or more second vias 22a extended from at least one of the first and second main surfaces of the ceramic body 10, 2 external electrode 32, the current path can be shortened.

That is, the current path can be shortened when the current flows through the first or second main surface of the ceramic body according to the embodiment of the present invention, as compared with the path of the current flowing through both ends of the ceramic body.

As described above, since the current path is shortened, the equivalent series inductance (ESL) of the multilayer ceramic electronic component can be reduced.

Although the first and second vias 21a and 22a are shown in FIG. 2, the present invention is not limited thereto. It is needless to say that various changes can be made in the number and shape of vias according to the object of the present invention .

On the other hand, at the ends of the first and second external electrodes 31 and 32 formed on the first and second major surfaces of the ceramic body 10, first and second via holes 21a and 22a corresponding to the first and second vias 21a and 22a, And the length of the first external electrode 31 and the second external electrode 31 to the second external electrode 31 is 32. The length of the ceramic body And a length from the end face of the ceramic body 10 to the first and second external electrodes 31 and 32 corresponding to the first and second vias 21a and 22a is set to be BW M, it is possible to satisfy 30 mu m &lt; G &lt; BW-M.

The first and second external electrodes 31 and 32 formed on the first and second main surfaces of the ceramic body 10 are respectively formed with first and second vias 21a and 22a corresponding to the first and second vias 21a and 22a. 2 By controlling the length G up to the external electrodes 31 and 32 to satisfy 30 mu m &lt; G &lt; BW-M, it is possible to prevent reliability deterioration due to penetration of the plating liquid.

The first and second external electrodes 31 and 32 formed on the first and second main surfaces of the ceramic body 10 are respectively formed with first and second vias 21a and 22a corresponding to the first and second vias 21a and 22a. 2 When the length G to the external electrodes 31 and 32 is less than 30 mu m, reliability may be lowered due to penetration of the plating liquid.

The first and second external electrodes 31 and 32 formed on the first and second main surfaces of the ceramic body 10 are respectively formed with first and second vias 21a and 22a corresponding to the first and second vias 21a and 22a. The ceramic body 10 of the first and second outer electrodes 31 and 32 formed on the first and second major surfaces of the ceramic body 10 has a length G from the outer electrode 31 to the outer electrode 31, The length M from the end face of the ceramic body 10 to the first and second external electrodes 31 and 32 corresponding to the first and second vias 21a and 22a in the length BW to the end face of the ceramic body 10, The via can not be formed and the internal electrode and the external electrode can not be connected to the upper and lower surfaces of the ceramic body 10.

A multilayer ceramic electronic device according to an embodiment of the present invention includes first and second outer electrodes 31 and 32 formed on first and second main surfaces of the ceramic body 10, The length G to the first and second external electrodes 31 and 32 corresponding to the vias 21a and 22a and the length G to the first and second external surfaces 31 and 32 formed on the first and second main surfaces of the ceramic body 10, The length BW of the electrodes 31 and 32 to the end face of the ceramic body 10 and the lengths of the first and second vias 21a and 22a corresponding to the first and second vias 21a and 22a, 2 The length M to the external electrodes 31 and 32 can satisfy 50 mu m &lt; M &lt; BW-G.

The length M from the end face of the ceramic body 10 to the first and second external electrodes 31 and 32 corresponding to the first and second vias 21a and 22a is 50 μm ≤ M < It is possible to prevent delamination defects and realize a multilayer ceramic electronic part having excellent reliability.

When the length M from the end face of the ceramic body 10 to the first and second external electrodes 31 and 32 corresponding to the first and second vias 21a and 22a is less than 50 占 퐉, There is a problem that reliability is lowered.

When the length M from the end face of the ceramic body 10 to the first and second external electrodes 31 and 32 corresponding to the first and second vias 21a and 22a coincides with BW-G The via can not be formed and the internal electrode and the external electrode can not be connected to the upper and lower surfaces of the ceramic body 10. [

According to an embodiment of the present invention, the average thickness te of the first and second external electrodes 31 and 32 formed on the first and second main surfaces of the ceramic body 10 may be 5 탆 or more .

The average thickness te of the first and second external electrodes 31 and 32 formed on the first and second side surfaces of the ceramic body 10 is controlled to be 5 占 퐉 or more to prevent reliability deterioration due to penetration of the plating liquid .

If the average thickness te of the first and second external electrodes 31 and 32 formed on the first and second side surfaces of the ceramic body 10 is less than 5 탆, the reliability may deteriorate due to penetration of the plating liquid. have.

The average thickness te of the first and second external electrodes 31 and 32 formed on the first and second main surfaces of the ceramic body 10 is determined by the average thickness te formed on the first and second main surfaces of the ceramic body 10, The length G from the ends of the first and second external electrodes 31 and 32 to the first and second external electrodes 31 and 32 corresponding to the first and second vias 21a and 22a, The length BW of the first and second outer electrodes 31 and 32 to the end surface of the ceramic body 10 formed on the first and second main surfaces of the ceramic body 10, The length M from the end face of the ceramic body 10 to the first and second external electrodes 31 and 32 corresponding to the first and second vias 21a and 22a is the length- Directional cross section can be measured by scanning an image with a scanning electron microscope (SEM).

For example, as shown in FIG. 2, the length and length direction LT cut at the central portion in the width W direction of the ceramic body 10 are scanned by a scanning electron microscope (SEM) 1 and the second external electrodes 31 and 32, respectively.

In the method for manufacturing a multilayer ceramic electronic device according to an embodiment of the present invention, a slurry containing a powder such as barium titanate (BaTiO ₃ ) is coated on a carrier film and dried to form a plurality of ceramic green sheets Whereby a dielectric layer can be formed.

The ceramic green sheet may be prepared by mixing a ceramic powder, a binder and a solvent to prepare a slurry, and the slurry may be formed into a sheet having a thickness of several micrometers by a doctor blade method.

Next, an internal electrode conductive paste containing nickel powder having an average nickel particle size of 0.1 to 0.2 μm and 40 to 50 parts by weight can be provided.

The internal electrode conductive paste was applied on the green sheet by a screen printing method to form internal electrodes, and then 200-300 layers were laminated to form a ceramic body.

Next, a first external electrode and a second external electrode including a conductive metal and glass may be formed on the upper and lower surfaces of the ceramic body.

The conductive metal is not particularly limited, but may be at least one selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni), and alloys thereof.

The glass is not particularly limited, and a material having the same composition as glass used for manufacturing an external electrode of a general multilayer ceramic capacitor may be used.

The first and second external electrodes may be electrically connected to the first and second internal electrodes by being formed on upper and lower surfaces of the ceramic body.

Next, a metal layer made of copper (Cu) may be formed on the first external electrode and the second external electrode.

Other parts of the multilayer ceramic electronic component according to the embodiment of the present invention that are the same as those of the multilayer ceramic electronic component according to the embodiment of the present invention will be omitted here.

3 is a cross-sectional view showing a multilayer ceramic electronic component-embedded printed circuit board 100 according to another embodiment of the present invention.

Referring to FIG. 3, a multilayer ceramic electronic component-embedded printed circuit board 100 according to another embodiment of the present invention includes an insulating substrate 110; And a multilayer ceramic electronic component according to an embodiment of the present invention.

3, the insulating substrate 110 includes the insulating layer 120 and the conductive pattern 130 and the conductive via hole 140, which form various interlayer circuits as illustrated in FIG. 3, . The insulating substrate 110 may be a printed circuit board 100 including a multilayer ceramic electronic component.

The multilayer ceramic electronic component is inserted into the printed circuit board 100 and then experiences various harsh environments during a post-process such as heat treatment of the printed circuit board 100. [

In particular, in the heat treatment process, the shrinkage and expansion of the printed circuit board 100 are directly transmitted to the multilayer ceramic electronic component inserted into the printed circuit board 100, so that stress on the bonding surface of the multilayer ceramic electronic component and the printed circuit board 100 .

If the stress applied to the bonding surface of the multilayer ceramic electronic component and the printed circuit board 100 is higher than the bonding strength, the bonding surface is liable to be dropped.

The bonding strength between the multilayer ceramic electronic component and the printed circuit board 100 is proportional to the electrochemical bonding force between the multilayer ceramic electronic component and the printed circuit board 100 and the effective surface area of the bonding surface. The multilayer ceramic electronic component and the printed circuit board 100, the surface roughness of the multilayer ceramic electronic component can be controlled in order to improve the effective surface area of the multilayer ceramic electronic component and the printed circuit board 100, thereby improving the lifting between the multilayer ceramic electronic component and the printed circuit board 100.

Hereinafter, the present invention will be described in more detail by way of examples, but the present invention is not limited thereto.

Example

The embodiment is characterized in that the average thickness (te) of the first and second external electrodes formed on the first and second main surfaces of the ceramic body of the multilayer ceramic electronic part and the average thickness (te) of the first and second external electrodes And the length (M) from the cross-section of the ceramic body to the first and second external electrodes corresponding to the first and second vias, So as to satisfy the numerical range of the invention.

Comparative Example

The comparative example is characterized in that in the multilayer ceramic electronic component, the average thickness te of the first and second external electrodes formed on the first and second main surfaces of the ceramic body, (G) between the first and second external electrodes corresponding to the first via and the second via and the length (M) from the cross section of the ceramic body to the first and second external electrodes corresponding to the first and second vias Were prepared under the same conditions as those of the above examples, except that they were outside the scope of the present invention.

Table 1 below shows an average thickness (te) of the first and second external electrodes formed on the first and second main surfaces of the ceramic body of the multilayer ceramic electronic component according to the embodiment of the present invention, (G) between the first and second external electrodes corresponding to the first and second vias.

Specifically, the reliability evaluation was carried out by applying a rated voltage for 1 hour at a humidity condition of 8585 (85 캜, 85% humidity). When the defect rate was less than 0.01% A case where the defective rate is 0.01% to 1.00% is represented by o, a case where the defective rate is 1.00% to 50% is indicated by?, And a case where the defective rate is 50% or more is indicated by x.

Sample The average thickness (te)
(μm) G
(μm) Reliability evaluation *One 1.00 10 × *2 1.00 20 × * 3 1.00 30 × *4 1.00 40 × * 5 1.00 50 × * 6 3.00 10 △ * 7 3.00 20 △ *8 3.00 30 △ * 9 3.00 40 △ * 10 3.00 50 △ * 11 5.00 10 △ * 12 5.00 20 △ 13 5.00 30 ○ 14 5.00 40 ◎ 15 5.00 50 ◎ * 16 7.00 10 △ * 17 7.00 20 △ 18 7.00 30 ○ 19 7.00 40 ◎ 20 7.00 50 ◎

*: Comparative Example

Referring to Table 1, in the case of Samples 1 to 12, which are comparative examples, the average thickness te of the first and second external electrodes formed on the first and second main surfaces of the ceramic body deviates from the numerical range of the present invention, It can be seen that there is a problem in reliability due to a decrease in the accelerated lifetime due to penetration of the plating solution.

In the samples 16 and 17 of the comparative examples, the lengths G from the ends of the first and second external electrodes to the first and second external electrodes corresponding to the first and second vias were out of the numerical range of the present invention , There is a problem in reliability.

On the other hand, the samples 13 to 15 and 18 to 20, which are the examples, satisfy the numerical range of the present invention, and the reliability is excellent.

Table 2 below shows reliability in accordance with the value of the length M from the cross section of the ceramic body of the multilayer ceramic electronic component to the first and second external electrodes corresponding to the first and second vias according to the embodiment of the present invention .

Specifically, the reliability evaluation was made as to whether or not delamination occurred. Specifically, it was judged whether or not delamination was caused by a mold inspection of the cutting face of the ceramic body. The degree of defect was less than 0.01%, the defect ratio was 0.01 to 1.00% , The case where the defective ratio is 1.00% to 50% is indicated by DELTA, and the case where the defective ratio is 50% or more is indicated by x.

Sample M
(μm) Reliability evaluation * 21 20 × * 22 25 × * 23 30 × * 24 35 △ * 25 40 △ * 26 45 △ 27 50 ○ 28 55 ○ 29 65 ○ 30 70 ◎ 31 75 ◎ 32 80 ◎

*: Comparative Example

Referring to Table 2, in the case of Samples 21 to 26 as comparative examples, the length M from the cross section of the ceramic body to the first and second external electrodes corresponding to the first and second vias is within the numerical range And it can be seen that there is a problem in reliability due to the delamination failure.

On the other hand, in the case of Samples 27 to 32 which are Examples, the numerical range of the present invention is satisfied, and it is understood that the reliability is excellent.

The present invention is not limited by the above-described embodiments and the accompanying drawings, but is intended to be limited only by the appended claims. It will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. something to do.

10: Ceramic body
11: dielectric layer
21, 22: first and second inner electrodes
21a, 22a: first and second vias
31, 32: first and second outer electrodes
100: printed circuit board
110: insulated substrate
120: insulating layer
130: conductive pattern
140: conductive via hole
te: average thickness of the first and second external electrodes formed on the first and second main surfaces of the ceramic body

Claims (12)

A ceramic body including a dielectric layer and having first and second main faces facing each other, a first side facing each other, a second side and first and second end faces facing each other;
A first internal electrode and a second internal electrode stacked with the dielectric layer interposed therebetween; And
And first and second external electrodes disposed outside the ceramic body,
Wherein the first inner electrode is connected to the first outer electrode by one or more first vias extending from at least one of the first and second major surfaces of the ceramic body, And at least one second via connected to the second external electrode by one or more second vias extending from at least one of the first and second main surfaces of the first and second main electrodes, A length from the first and second external electrodes corresponding to the first and second vias is G, and a length of the cross section of the ceramic body of the first and second external electrodes formed on the first and second main surfaces of the ceramic body And a length from the first external electrode to the second external electrode corresponding to the first and second vias in the cross section of the ceramic body is M, The first and second Wherein an average thickness of the first and second external electrodes formed on the main surface is 5 占 퐉 or more.
The method according to claim 1,
(G) from the ends of the first and second external electrodes formed on the first and second main surfaces of the ceramic body to the first and second external electrodes corresponding to the first and second vias, (BW) of the first and second external electrodes formed on the first and second main surfaces of the ceramic body to the end surface of the ceramic body and the lengths of the first and second external electrodes 2 The length (M) to the external electrode satisfies 50 mu m &lt; M &lt; BW-G.
delete The method according to claim 1,
And a metal layer made of copper (Cu) is further formed on the first and second external electrodes.
An insulating substrate; And
The multilayer ceramic electronic component-embedded printed circuit board according to claim 1, wherein the multilayer ceramic electronic component is embedded in the insulating substrate.
6. The method of claim 5,
(G) from the ends of the first and second external electrodes formed on the first and second main surfaces of the ceramic body to the first and second external electrodes corresponding to the first and second vias, (BW) of the first and second external electrodes formed on the first and second main surfaces of the ceramic body to the end surface of the ceramic body and the lengths of the first and second external electrodes 2 The length (M) to the external electrode satisfies 50 mu m &lt; M &lt; BW-G.
delete 6. The method of claim 5,
And a metal layer made of copper (Cu) is further formed on the first and second external electrodes.


















A ceramic body including a dielectric layer;
A first internal electrode and a second internal electrode stacked with the dielectric layer interposed therebetween; And
And first and second external electrodes disposed outside the ceramic body,
Wherein the first internal electrode is connected to the first external electrode by one or more first vias extending in at least one of the upper and lower sides of the ceramic body in the thickness direction and the second internal electrode is connected to one of the upper and lower surfaces of the ceramic body in the thickness direction Of the first and second external electrodes formed on the upper and lower surfaces of the ceramic body in the thickness direction of the ceramic body, wherein the first and second external electrodes are connected to the second external electrode by at least one second via A length to the first and second external electrodes is G and a length from the first and second external electrodes formed on the upper and lower sides of the ceramic body in the thickness direction to a longitudinal side surface side of the ceramic body is BW, Wherein a length from the longitudinal side of the body to the first and second external electrodes corresponding to the first and second vias is M, and satisfies 30 mu m &lt; G &lt; BW-M, The first and second laminated above the average thickness of the external electrode is 5 μm ceramic electronic component formed in the thickness direction of the upper and lower surfaces of the ceramic body group.
10. The method of claim 9,
(G) from the end of the first and second external electrodes formed on the upper and lower surfaces of the ceramic body in the thickness direction to the first and second external electrodes corresponding to the first and second vias, (BW) of the first and second external electrodes formed on the upper and lower surfaces of the ceramic body to the longitudinal side surface of the ceramic body and the lengths of the first and second external electrodes corresponding to the first and second vias Wherein a length (M) to an electrode satisfies 50 mu m &lt; M &lt; BW-G.
delete 10. The method of claim 9,
And a metal layer made of copper (Cu) is further formed on the first and second external electrodes.

Images