KR101937903B1 - Thermoelectric device module - Google Patents

Abstract

One embodiment of the present invention relates to a thermoelectric element module, and the technical objective to be solved is to provide a thermoelectric element module which can perform thermoelectric cooling, thermoelectric heating and thermoelectric generation in a high efficiency. To this end, the present invention comprises: a first ceramic substrate; a first adhesive which is coated on the first ceramic substrate; a first electrode which adheres to the first adhesive; first and second thermoelectric elements of which one ends are serially connected to the first electrode; a third thermoelectric element which is placed in a side part of the second thermoelectric element; a second electrode which is serially connected to the other end of the second and third thermoelectric elements; a second adhesive which adheres to the second electrode; and a second ceramic substrate which adheres to the second adhesive. Transverse cross sections of the first and second ceramic substrates are arc-shaped, and centers of curvature of the first and second ceramic substrates are the same. A radius of curvature of the first ceramic substrate is larger than that of the second ceramic substrate.

Description

[0001] Thermoelectric device module [0002]

An embodiment of the present invention relates to a thermoelectric module.

In recent years, interest in the development and conservation of alternative energy has been increasing, and studies on efficient energy conversion materials have been actively conducted. In particular, researches on thermoelectric materials as heat-electric energy conversion materials are being accelerated.

When there is a temperature difference between both ends of a solid state material, there is a difference in density at both ends of the carrier (electron or hole) having a heat dependence, which is caused by an electric phenomenon, that is, a thermoelectric phenomenon. Thus, thermoelectric conversion means reversible and direct energy conversion between the temperature difference and the electric voltage. Such a thermoelectric phenomenon can be classified into a thermoelectric power generating electric energy and a thermoelectric cooling / heating inducing a temperature difference at both ends by electric power supply, and the thermoelectric material is a thermoelectric material.

Thermoelectric materials have many advantages because they have no environmental pollutants during power generation and cooling and are environmentally friendly and sustainable. Particularly, there is a high interest in renewable energy related fields that can generate electricity directly from natural heat such as incineration furnace and various industrial facilities, and natural heat such as solar heat, geothermal heat and river water heat, and can do energy harvesting.

The efficiency of the thermoelectric material (heat generation, endothermic) is evaluated by the thermoelectric figure of merit (ZT _m ). The whiteness factor is α [V / K], the resistivity is ρ [Ω · m] Is defined as [W / m · K].

ZT _m = 留² T _m / ρ · λ [1 / K]

Therefore, it is preferable to increase the value of the Seebeck coefficient (α) or electric conductivity (σ), increase the temperature of the hotter end, or lower the resistivity (ρ) or thermal conductivity (λ) as basic conditions for excellent thermoelectric properties .

The thermoelectric element is composed of a device made of p-type thermoelectric material that moves holes and moves heat energy and a pair of pn thermoelectric devices made of n-type thermoelectric material that moves heat and moves electrons. Are combined into a module.

On the other hand, such a conventional thermoelectric module is formed in a substantially flat plate shape, so that the thermoelectric efficiency and application fields are limited. For example, there is a problem that the number of thermoelectric elements that can be positioned in the same space is limited because the thermoelectric module is limited to a flat plate shape, and the thermoelectric module can be attached to only a device having a substantially flat shape.

The above-described information disclosed in the background of the present invention is only for improving the understanding of the background of the present invention, and thus may include information not constituting the prior art.

The present invention provides a thermoelectric module capable of performing thermoelectric cooling, thermoelectric heating and thermoelectric generation with high efficiency.

A thermoelectric module according to an embodiment of the present invention includes a first ceramic substrate; A first adhesive coated on the first ceramic substrate; A first electrode bonded to the first adhesive; A first thermoelectric element having one end connected in series to the first electrode; A third thermoelectric element disposed on a side of the second thermoelectric element; A second electrode connected in series to the other end of the second and third thermoelectric elements; A second adhesive bonded to the second electrode; And a second ceramic substrate adhered to the second adhesive, wherein a cross-section of the first and second ceramic substrates is an arc shape, and a center of curvature of the first and second ceramic substrates is And the radius of curvature of the first ceramic substrate may be greater than the radius of curvature of the second ceramic substrate.

The cross-sectional surfaces of the first and second adhesives are in the form of an arc, the centers of curvature of the first and second adhesives are the same, and the radius of curvature of the first adhesive may be larger than the radius of curvature of the second adhesive.

The curvature center of the first and second electrodes may be the same, and the radius of curvature of the first electrode may be greater than the radius of curvature of the second electrode.

The outer and inner surfaces of the first, second and third thermoelectric elements are in the form of an arc, and the centers of curvature of the outer and inner surfaces of the first, second and third thermoelectric elements are the same, , The radius of curvature of the outer surface of the three thermoelectric elements may be larger than the radius of curvature of the inner surfaces of the first, second and third thermoelectric elements.

Wherein the first ceramic substrate further comprises first projections formed on both side portions in the longitudinal direction to contact the first and second thermoelectric elements, respectively, wherein the second ceramic substrate has, on both sides in the longitudinal direction, And a second projection formed so as to be in contact with the element, respectively.

Wherein the first ceramic substrate, the first adhesive, the first electrode, the first, second and third thermoelectric elements, the second electrode, the second adhesive, and the second ceramic substrate constitute a unit, Two to sixty-four radial radials along the center of curvature may be combined to form a longitudinal tube.

A partition wall may be arranged longitudinally between the units.

One to ten thousand tubes may be combined in the longitudinal direction.

The first and second adhesives may be used in combination with one or more additives selected from the group consisting of aluminum, magnesium, copper, nickel, silver, boron nitride, aluminum nitride, aluminum oxide, aluminum carbon, beryllium oxide, diamond, carbon fiber, graphite, Metal-coated polymer beads, ceramic-coated carbon beads, or the like.

The first and second adhesives may be an inorganic heat-dissipating coating material fused with a super-heat-resistant inorganic binder manufactured by a sol-gel method and a superconducting graphene material.

In the embodiment of the present invention, the thermoelectric elements are arranged in the radial and longitudinal directions along the same center of curvature, thereby providing the maximum number of thermoelectric elements in the minimum space and having a tube shape having a length, Provided is a thermoelectric module capable of performing heating and thermoelectric generation with high efficiency.

1A and 1B are a perspective view and a front view showing a thermoelectric module according to an embodiment of the present invention.
2A and 2B are perspective views illustrating a half structure of a thermoelectric module according to an embodiment of the present invention.
3A and 3B are perspective views illustrating a 1/8 structure of a thermoelectric module according to an embodiment of the present invention.
4A and 4B are perspective views illustrating several units of the 1/8 structure of the thermoelectric module according to the embodiment of the present invention.
5A to 5C are perspective views illustrating one unit of a 1/8 structure of a thermoelectric module according to an embodiment of the present invention.
FIG. 6 is a cross-sectional view illustrating one unit of a 1/8 structure of a thermoelectric module according to an embodiment of the present invention.
FIGS. 7A and 7B are graphs showing the thermoelectric performance of the N-type and P-type thermoelectric materials developed to date according to the temperature.
8 is a perspective view illustrating a thermoelectric module according to another embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The embodiments of the present invention are described in order to more fully explain the present invention to those skilled in the art, and the following embodiments may be modified into various other forms, It is not limited to the embodiment. Rather, these embodiments are provided so that this disclosure will be more faithful and complete, and will fully convey the scope of the invention to those skilled in the art.

In the following drawings, thickness and size of each layer are exaggerated for convenience and clarity of description, and the same reference numerals denote the same elements in the drawings. As used herein, the term "and / or" includes any and all combinations of one or more of the listed items. In the present specification, the term " connected "means not only the case where the A member and the B member are directly connected but also the case where the C member is interposed between the A member and the B member and the A member and the B member are indirectly connected do.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a," "an," and "the" include singular forms unless the context clearly dictates otherwise. Also, " comprise, " and / or "comprising, " when used in this specification, are intended to be interchangeable with the said forms, numbers, steps, operations, elements, elements and / And does not preclude the presence or addition of one or more other features, integers, operations, elements, elements, and / or groups.

Although the terms first, second, etc. are used herein to describe various elements, components, regions, layers and / or portions, these members, components, regions, layers and / It is obvious that no. These terms are only used to distinguish one member, component, region, layer or section from another region, layer or section. Thus, a first member, component, region, layer or section described below may refer to a second member, component, region, layer or section without departing from the teachings of the present invention.

It is to be understood that the terms related to space such as "beneath," "below," "lower," "above, But may be utilized for an easy understanding of other elements or features. Terms related to such a space are for easy understanding of the present invention depending on various process states or use conditions of the present invention, and are not intended to limit the present invention. For example, if an element or feature of the drawing is inverted, the element or feature described as "lower" or "below" will be "upper" or "above." Thus, "below" is a concept covering "upper" or "lower ".

1A and 1B are a perspective view and a front view showing a thermoelectric module 100 according to an embodiment of the present invention.

1A and 1B, a thermoelectric module 100 according to an embodiment of the present invention includes a plurality of units 101 in a substantially transverse direction, a radial direction, and / or a radial direction along a center of curvature, May be disposed to form the tube 102, and such tube 102 may also have a predetermined length, which is also approximately continuous and / or longitudinally coupled / arranged in a generally longitudinal direction.

Here, the unit 101 can form a longitudinal tube 102 radially in the transverse / radial direction along the center of curvature, for example, but not limited to, two to sixty-four continuous connections. In the figure, it is seen that eight units 101 are disposed radially in the transverse direction along the center of curvature to form the tube 102.

In addition, the tube 102 may have a length in the longitudinal direction, for example, but not limited to, one to ten thousand continuously joined to form a longitudinal direction. In the drawing, it is seen that twenty-four tubes 102 are arranged in the longitudinal direction along the center of curvature.

In addition, unnecessary electrical connection is not generated between the units 101 by arranging the insulating partition walls 199 in the longitudinal direction between the units 101. [ In addition, the partition wall 199 has a shape radially arranged at the center of curvature.

The insulating partition wall 199 is capable of shrinking and expanding to absorb thermal expansion and thermal contraction phenomenon of the thermoelectric module 100 so that the thermoelectric module 100 of a cylindrical shape is not damaged in the radial direction and / . The insulating partition wall 199 may be formed of a material such as glass, reinforced glass, quartz glass, quartz, epoxy, alumina (Al2O3), zirconia (ZrO2), zinc oxide (ZnO) Aluminum, Copper, Tungsten, Stainless steel, PC, Polyethylene terephthalate, Polyamide, Polymethyl methacrylate, Polybutylene terephthalate (PBT), PU Polyurethane, PVA (polyvinyl alcohol) or PVB (polyvinyl butyral).

As described above, the thermoelectric module 100 according to the embodiment of the present invention is in the form of a substantially circular pipe having a hollow space 103 (hollow space) at the center of its curvature, The thermoelectric elements can be arranged. Further, since the thermoelectric module 100 has a pipe shape, it can be applied to thermoelectric cooling, thermoelectric heating, and thermoelectric power generation in the form of a pipe.

2A and 2B are perspective views illustrating a half structure of a thermoelectric module 100 according to an embodiment of the present invention.

As shown in FIGS. 2A and 2B, the thermoelectric module 100 according to the embodiment of the present invention may have a half structure. Of course, when two such half structures are provided and coupled to each other, the thermoelectric element module 100 shown in FIGS. 1A and 1B is provided.

3A and 3B are perspective views showing a 1/8 structure of the thermoelectric module 100 according to the embodiment of the present invention.

As shown in FIGS. 3A and 3B, the thermoelectric module 100 according to the embodiment of the present invention may have a 1/8 structure. Of course, when eight such 1/8 structures are provided and are coupled to each other in the arc direction, the thermoelectric module 100 shown in FIGS. 1A and 1B is provided.

4A and 4B are perspective views illustrating several units 101 of 1/8 structure of the thermoelectric module 100 according to the embodiment of the present invention.

As shown in FIGS. 4A and 4B, the thermoelectric module 100 according to the embodiment of the present invention may have three thermally coupled units 101 in a 1/8 structure. Of course, when these thermoelectric elements are repeatedly repeated in the transverse direction and the longitudinal direction, the thermoelectric element module 100 shown in FIGS. 1A and 1B is provided.

5A to 5C are perspective views showing one unit 101 of the 1/8 structure of the thermoelectric module 100 according to the embodiment of the present invention. 6 is a cross-sectional view showing one unit 101 of the 1/8 structure of the thermoelectric module 100 according to the embodiment of the present invention.

5A to 5C and 6, a thermoelectric module 100 according to an embodiment of the present invention includes a first ceramic substrate 110, a first adhesive 120, a first electrode 130, First and second thermoelectric elements 151, 152 and 153, a second electrode 170, a second adhesive 180 and a second ceramic substrate 190.

The first and second ceramic substrates 110 and 190 may be formed in a substantially arc shape having a predetermined length (circumference), and the first and second ceramic substrates 110 and 190 may have a center of curvature, Can be mutually the same. However, the radius of curvature of the first ceramic substrate 110 is larger than the radius of curvature of the second ceramic substrate 190. In other words, the arc length of the first ceramic substrate 110 is larger than the arc length of the second ceramic substrate 190. In other words, the first ceramic substrate 110 is positioned / disposed outside and the second ceramic substrate 190 is positioned / placed inside. Accordingly, the hollow 103 may be formed by connecting / connecting a plurality of the second ceramic substrates 190.

The first ceramic substrate 110 further includes first protrusions 111 formed on both sides of the first ceramic substrate 110 in the longitudinal direction to contact the first and second thermoelectric elements 151 and 152, The second protrusions 191 may be formed on both sides in the longitudinal direction so as to be in contact with the second and third thermoelectric elements 152 and 153, respectively. Accordingly, the first and second thermoelectric elements 151 and 152 are stably fixed / constrained by the first protrusion 111 of the first ceramic substrate 110, and the second and third thermoelectric elements 152 and 153 are fixed / And is stably fixed / constrained by the second projection 191 of the projection 190.

The first and second ceramic substrates 110 and 190 are made of a material selected from the group consisting of alpha -Al2O3, alumina (Al2O3), yttria (Y2O3), YAG (Y3Al5O12), rare earths Of titanium oxide (TiO2), an organic material, an organic-inorganic composite material, and the like, and a mixture of two or more selected from the group consisting of oxide, bioglass, silica (SiO2), hydroxyapatite, However, the present invention is not limited to these materials.

More specifically, the first and second ceramic substrates 110 and 190 may be formed of a material selected from the group consisting of alpha alumina, alumina, hydroxyapatite, calcium phosphate, bioglass, Pb (Zr, Ti) O3 (PZT), titanium dioxide, zirconia (Y2O3), Yttria stabilized zirconia, DysO2, Gd2O3, CeO2, GDC, Gadolinia doped Ceria, Magnesia MgO), barium titanate (BaTiO3), nickel manganate (NiMn2O4), potassium sodium niobate (KNaNbO3), bismuth potassium titanate (BiKTiO3), bismuth sodium titanate (BiNaTiO3), CoFe2O4, NiFe2O4, BaFe2O4, NiZnFe2O4, ZnFe2O4, Zr-O based garnet (Mn), Mn x Co 3-x O 4 where x is a positive real number of 3 or less, bismuth ferrite (BiFeO 3), bismuth zinc titanate (Bi 1.5 Zn 1 Nb 1.5 O 7), lithium aluminum titanium glass ceramic, Oxide, a Li-La-Ti-O-based perovskite oxide, a La-Ni-O-based oxide, lithium iron phosphate, Oxide, a lithium-manganese oxide, a lanthanum-strontium-iron-cobalt oxide, a silicate-based oxide such as Li-Mn-O based spinel oxide (lithium manganese oxide), lithium aluminum gallium oxide, tungsten oxide, tin oxide, lanthanum nickel oxide Phosphors, SiAlON phosphors, aluminum nitride, silicon nitride, titanium nitride, AlON, silicon carbide, titanium carbide, tungsten carbide, magnesium magnesium boride, titanium boride, a mixture of metal oxides and metal nitrides, a mixture of metal oxides and metal carbides, A mixture of ceramics and metals, a mixture of one or two selected from the group consisting of nickel, copper, silica and their equivalents may be used.

In addition, the first and second ceramic substrates 110 and 190 may be formed by, for example, but not limited to, a metal molding method, a rubber press method, an injection molding method, an extrusion molding method, an injection molding method, or a spraying method.

The first adhesive 120 may be adhered to the inside of the first ceramic substrate 110 and the second adhesive 180 may be adhered to the outside of the second ceramic substrate 190. Similar to the above, the cross-sections of the first and second adhesives 120 and 180 are in the form of an arc, and the center of curvature of the first and second adhesives 120 and 180 may be the same. However, the radius of curvature of the first adhesive 120 is larger than the radius of curvature of the second adhesive 180. In other words, the arc length of the first adhesive 120 is larger than the arc length of the second adhesive 180. Stated another way, the first adhesive 120 is located on the outside and is located inside the second adhesive 180.

The first and second adhesives 120 and 180 may be formed of a material selected from the group consisting of Al, Mg, Cu, Ni, Ag, Au, (AlN), aluminum oxide (Al2O3), aluminum carbon (AlC), beryllium oxide (BeO), diamond, carbon fiber, graphite, carbon nanotubes, graphene, metal beads, And at least one of the coated carbon beads may be added.

In particular, the first and second adhesives 120 and 180 may be inorganic heat-dissipating coating materials fused with a super-heat-resistant inorganic binder manufactured by a sol-gel method and a superconducting graphene material. Such an inorganic heat-radiating coating material has high heat resistance (maximum 2,000 DEG C) and corrosion resistance (oxidation prevention). In addition, the graphene heat dissipation coating material, which is an oxidative chemical separation method that separates the graphene film and the oxide film, is easy to coat by a spray method. Existing heat-radiating coating materials can not be used for devices that generate high heat due to organic or inorganic / inorganic composite heat-resistant coating materials of 95% or more. However, super heat conductive coating materials can be used at ambient temperatures up to 2,000 ℃.

For example, it exhibits a thermal conductivity of about 200 W / mk to 400 W / mk and a high electric conductivity of 3.55 X 10 ^-1 S / m or higher at a spray of about 10 μm to 50 μm, It is easy to produce with material. In addition, it has high stability to acids and alkalis and has heat resistance up to 2,000 캜 as mentioned above.

These first and second adhesives 120 and 180 may be formed by any suitable technique known in the art such as, but not limited to, spray coating, paint brushing, doctor blade, dipping-impression, casting, slot die coating, curtain coating, Or may be formed on the surfaces of the first and second ceramic substrates 110 and 190 by inkjet printing or the like.

The first electrode 130 may be bonded to the first adhesive 120 and the second electrode 170 may be bonded to the second adhesive 180. Similarly to the above, the first and second electrodes 130 and 170 may have a circular cross section, and the center of curvature of the first and second electrodes 130 and 170 may be the same. However, the radius of curvature of the first electrode 130 is larger than the radius of curvature of the second electrode 170. In other words, the arc length of the first electrode 130 is greater than the arc length of the second electrode 170. In other words, the first electrode 130 is located on the outer side and the second electrode 170 is located on the inner side.

The first and second electrodes 130 and 170 may be formed of at least one of copper, aluminum, nickel, gold, silver, palladium, and SUS.

The first and second electrodes 130 and 170 may be formed by an electroless plating method, an electrolytic plating method, an RF sputtering method, a physical vapor deposition method, a plasma enhanced physical vapor deposition method, a low pressure chemical vapor deposition method, an atmospheric pressure chemical vapor deposition method, As shown in FIG. In addition, the first and second electrodes 130 and 170 may be formed by the above-described method and then bonded to the first adhesive 120 and 180, respectively. In some cases, the first and second electrodes 130 and 170 may be formed directly on the first and second ceramic substrates 110 and 190 without passing through the first adhesive 120 and 180. The first and second electrodes 130 and 170 may be attached to the first, second and third thermoelectric elements 151, 152 and 153 through the first and second solders 140 and 160, 180, 180).

One end of each of the first and second thermoelectric elements 151 and 152 may be connected to the first electrode 130 in series and the other end of the second and third thermoelectric elements 152 and 153 may be connected to the second electrode 170 in series. have. One end of each of the first and second thermoelectric elements 151 and 152 may be connected to the first electrode 130 through the first solder 140 and the other end of the second and third thermoelectric elements 152 and 153 may be connected to the And may be connected to the second electrode 170 through the solder 160.

The outer and inner surfaces of the first, second and third thermoelectric elements 151, 152 and 153 are in an arc shape and the centers of curvature of the outer and inner surfaces of the first, second and third thermoelectric elements 151, 152 and 153 may be the same . The radius of curvature of the outer surface of the first, second and third thermoelectric elements 151, 152 and 153 is larger than the radius of curvature of the inner surfaces of the first, second and third thermoelectric elements 151, 152 and 153. In other words, the arc length of the first, second and third thermoelectric elements 151, 152 and 153 with respect to the outer surface is larger than the arc length of the first, second and third thermoelectric elements 151, 152 and 153 with respect to the inner surface. In other words, the outer surfaces of the first, second and third thermoelectric elements 151, 152 and 153 are located on the outer side and the inner surfaces of the first, second and third thermoelectric elements 151, 152 and 153 are located on the inner side. Therefore, both side surfaces (two side surfaces) of the first, second and third thermoelectric elements 151, 152 and 153 gradually become closer to each other as they move from the outer diameter surface to the inner diameter surface. Conversely, both side surfaces (two side surfaces) of the first, second and third thermoelectric elements 151, 152 and 153 are gradually distant from each other as they move from the inner surface to the outer surface. Of course, the above-described insulating partition 199 is closely attached to both sides of the first, second and third thermoelectric elements 151, 152 and 153.

On the other hand, the first and third thermoelectric elements 151 and 153 may be an N type semiconductor thermoelectric material, and the second thermoelectric element 152 may be a P type semiconductor thermoelectric material. Therefore, the first and second thermoelectric elements 151 and 152, that is, the N-type semiconductor thermoelectric material and the P-type semiconductor thermoelectric material are connected in series through the first electrode 130 and the second and third thermoelectric elements 151 and 152 are connected in series through the second electrode 170, 3 thermoelectric elements 152 and 153, that is, a P-type semiconductor thermoelectric material and an N-type semiconductor thermoelectric material may be connected in series. Of course, the first and second electrodes 130 and 170 are also substantially connected in series.

The first, second and third thermoelectric elements 151, 152 and 153 may be made of at least two elements selected from among Bi, Tell, And a bismuth-tellurium (Bi-Te) thermoelectric material having a main component thereof.

For example, the first and third thermoelectric elements 151 and 153 may be composed of a thermoelectric material including bismuth (Bi), tellurium (Te) and selenium (Se), and the second thermoelectric element 152 may be composed of bismuth Bi), tellurium (Te), and antimony (Sb).

In particular, a bismuth-tellurium (Bi-Te) thermoelectric material is suitable in a temperature environment in which the temperature of the high-temperature side heat exchanger reaches a maximum of 250 ° C to 280 ° C.

The first and second solders 140 and 160 may have a composition represented by PbxSn (1-x) (x? 0.85) with lead (Pb) and tin (Sn) as main components. It is possible to provide the thermoelectric module 100 that can withstand use at high temperatures by using the first and second solders 140 and 160 having such a composition and the tin (Sn) content is small, 130,170) and tin are inhibited, so that peeling of each layer can be prevented. Further, the content ratio of tin may be infinitely close to 0 (x < 1). When the first and second solders 140 and 160 contain more than 85% of lead, the melting points of the first and second solders 140 and 160 are higher than about 260 ° C., so that the first and second solders 140 and 160, The first and second thermoelectric elements 151 and 152 and the first electrode 130 and the second and third thermoelectric elements 152 and 153 and the second electrode 170 can be satisfactorily bonded. When the content of lead is 90% or more, the melting point of the first and second solders 140 and 160 becomes 275 ° C or more. When the content of lead is 95% or more, the melting point of the solder becomes 305 ° C or more. %, The melting point of the first and second solders 140 and 160 becomes 317 ° C or higher.

The first and second solders 140 and 160 may further include particles incorporated therein. As the particles, for example, copper balls can be used. By using copper as the material of the particles, the particles are not melted and lost even at a high temperature of about 260 ° C to 317 ° C, and the electric resistance is low, so that the first and second thermoelectric elements 151 and 152, the first electrode 130, The current can be efficiently passed between the second and third thermoelectric elements 152 and 153 and the second electrode 170. [ The surface of the copper ball may be coated with gold. The first and second thermoelectric elements 151 and 152 and the first electrode 130 and the second and third thermoelectric elements 152 and 153 and the second electrode 170 are bonded to the first and second solders 140 and 160, The first and second thermoelectric elements 151 and 152 and the first electrode 130 and the second and third thermoelectric elements 152 and 153 and the second electrode 170 are bonded together at one time because the copper ball functions as a gap- The height of the thermoelectric element module 100 is uniform and sufficient bonding strength can be ensured. Also, in the bonding of the first and second solders 140 and 160 under pressure and the use of the first and second solders 140 and 160 in a high temperature environment, the thickness of the first and second solders 140 and 160 is maintained by the copper ball, And it is possible to prevent breakage or the like caused by the reaction between the protruded first and second solders 140 and 160 and the first, second and third thermoelectric elements 151, 152 and 153.

Subsequently, the first ceramic substrate 110, the first adhesive 120, the first electrode 130, the first and second thermoelectric elements 151, 152 and 153, the second electrode 170, the second adhesive 180 And the second ceramic substrate 190 constitute one unit 101. In this case, Also, two to sixty (eight in the present invention) radial pairs of such units 101 along the center of curvature may be combined to form a longitudinal tube 102. Furthermore, the arrangement of the insulating barrier ribs 199 in the longitudinal direction between the above-described units 101 has been described above.

Furthermore, since the tube 102 has a length of 1 to 10,000 (24 in the present invention) coupled thereto, the thermoelectric module 100 in the form of the tube 102 having a predetermined length is provided. have.

FIGS. 7A and 7B are graphs showing the thermoelectric performance of the N-type and P-type thermoelectric materials developed to date according to the temperature.

7A and 7B, the figure of merit (ZT) of the semiconductor thermoelectric material changes according to the temperature of the heat source. In particular, it has a high value at a specific temperature, and the thermoelectric performance decreases when the temperature is exceeded Able to know. Therefore, a semiconductor thermoelectric material suitable for a temperature band to be used is synthesized, or a commercially available raw material powder or ingot is purchased to manufacture a P-type thermoelectric semiconductor material and an N-type thermoelectric semiconductor material.

8 is a perspective view illustrating a thermoelectric module 200 according to another embodiment of the present invention.

8, in the thermoelectric module 200 according to another embodiment of the present invention, the first and second ceramic substrates 210 and 290 may be formed in a cylindrical shape. That is, a first adhesive 120, a first electrode 130, and a first solder 140 (having the above-described structure) are formed between the cylindrical first ceramic substrate 210 and the cylindrical second ceramic substrate 290 Second and third thermoelectric elements 151, 152 and 153, a second solder 160, a second electrode 170 and a second adhesive 180 are formed.

In this manner, the thermoelectric module 200 according to the embodiment of the present invention is formed in a smooth shape without interruption in each of the first and second ceramic substrates 210 and 290, so that the heat transfer medium can flow easily without swirling .

It is to be understood that the present invention is not limited to the above-described embodiment, but may be modified and changed without departing from the spirit and scope of the present invention as defined in the appended claims. It will be understood by those of ordinary skill in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention.

100; Thermoelectric module
101; Unit 102; tube
103; Hollow 110; The first ceramic substrate
111; A projection 120; The first adhesive
130; A first electrode 140; The first solder
151, 152, 153; First, second and third thermoelectric elements
160; Second solder 170; The second electrode
180; A second adhesive 190; The second ceramic substrate
191; A projection 199; septum

Claims (10)

A first ceramic substrate;
A first adhesive coated on the first ceramic substrate;
A first electrode bonded to the first adhesive;
A first thermoelectric element having one end connected in series to the first electrode;
A third thermoelectric element disposed on a side of the second thermoelectric element;
A second electrode connected in series to the other end of the second and third thermoelectric elements;
A second adhesive bonded to the second electrode; And
And a second ceramic substrate adhered to the second adhesive,
Wherein a cross-sectional surface of each of the first and second ceramic substrates is an arc shape, and a center of curvature of each of the first and second ceramic substrates is the same, and a radius of curvature of the first ceramic substrate of curvature is greater than a radius of curvature of the second ceramic substrate,
The first and second adhesives are inorganic heat-dissipating coating materials fused with a super-heat-resistant inorganic binder manufactured by a sol-gel method and a superconducting graphene material, and the first and second adhesives have a thickness of 10 μm to 50 μm Having a thermal conductivity of 200 W / mk to 400 W / mk, an electrical conductivity of 3.55 X 10 ^-1 S / m, and a heat resistance of 2,000 캜. The method according to claim 1,
Characterized in that the first and second adhesive cross-sections are in the form of an arc, the centers of curvature of the first and second adhesives are the same, and the radius of curvature of the first adhesive is greater than the radius of curvature of the second adhesive Thermoelectric module. The method according to claim 1,
Wherein a cross-section of the first and second electrodes is an arcuate shape, a center of curvature of the first and second electrodes is the same, and a radius of curvature of the first electrode is greater than a radius of curvature of the second electrode. . The method according to claim 1,
The outer and inner surfaces of the first, second and third thermoelectric elements are in the form of an arc, and the centers of curvature of the outer and inner surfaces of the first, second and third thermoelectric elements are the same, And the radius of curvature of the outer surface of the three thermoelectric elements is larger than the radius of curvature of the inner surfaces of the first, second and third thermoelectric elements. The method according to claim 1,
Wherein the first ceramic substrate further includes first projections formed on both side portions in the longitudinal direction to contact the first and second thermoelectric elements,
Wherein the second ceramic substrate further comprises a second protrusion formed on both sides of the second ceramic substrate in a longitudinal direction so as to be in contact with the second and third thermoelectric elements. The method according to claim 1,
Wherein the first ceramic substrate, the first adhesive, the first electrode, the first, second and third thermoelectric elements, the second electrode, the second adhesive, and the second ceramic substrate form a unit,
Wherein two to sixty of said units are radially transverse to said center of curvature to form a longitudinal tube shape. The method according to claim 6,
And a partition wall is arranged in the longitudinal direction between the units. 8. The method of claim 7,
Wherein one to ten thousand of the tubes are coupled in the longitudinal direction. delete delete

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