KR101930977B1 - A plug-type optical connector comprising optical chip module and optical alignment combination structure and an assembly including the same and a manufacturing method thereof. - Google Patents

Abstract

The present invention relates to an optical connector plug and an optical connector plug assembly having a photo alignment structure capable of passive optical alignment, An optical device module including a first substrate as a double-sided substrate having a first alignment groove portion and a second alignment groove portion having a function of coupling with a photo alignment block and having a first electrode pad portion on which a photo- An optical transmission module module including optical transmission members corresponding to the number of optical signal channels, a first alignment protrusion portion corresponding to the first alignment groove portion and the second alignment groove portion for coupling with the optical module, An optical alignment block in which an optical transmission member guide hole serving as a guide is formed in the optical transmission member for receiving the optical transmission member, And a second substrate on which a second electrode pad portion for electrically connecting the first electrode pad portion and the control element is formed, and the second substrate includes a second substrate, A via hole connected to the first electrode pad portion is formed on the first substrate, and a through hole is formed on the back surface side of the first substrate to form a via hole And the contact member connected to the penetrating electrode is electrically connected to the second electrode pad portion.

Description

An optical connector plug having an optical device module and a photo-aligned interconnection structure, and an optical connector plug assembly including the same and a method of manufacturing the same. ≪ / RTI > A plug-type optical connector comprising an optical chip module and an optical alignment combination structure and an assembly including the same and a manufacturing method thereof.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical connector plug and a method of manufacturing the same, and more particularly to an optical connector plug and a method of manufacturing the same, The present invention relates to an optical connector plug and an optical connector plug assembly, and a method of manufacturing the same.

Recently, high-speed, high-speed data transmission technology such as high image quality and 3D image contents is emerging in the device or between devices, and signal attenuation, noise, EMI / EMC, impedance matching, cross talk, skew,

Generally, in data transmission between devices or between devices, that is, electrical leads based on copper wiring are used in the device, and cables using the same are used between devices. However, copper wiring does not satisfy high-capacity data high-speed transmission needs , And the various technical issues mentioned above are not resolved.

Recently, optical connection technology has been researched and developed to solve this problem. The optical module replaces several tens of channels of parallel electrical signal lines with serial optical signal lines, enabling high-speed data transmission at high speeds and eliminating technical problems such as noise, EMI / EMC, impedance matching, cross talk, skew, .

Many kinds of optical connectors and optical modules are being developed to apply optical transmission and optical connection devices using optical materials to various use environments. They basically provide a connecting function for connecting two or more separated light pathways and also form and change optical signal transmission paths by using optical phenomena such as refraction, reflection, interference and diffraction, A function of amplifying or merging an optical signal, and the like. The optical element having such a configuration functions to connect two different regions-optical region and electric region, or to connect the optical region and the optical region, and at the same time, to design an optimal transmission efficiency to provide. The problems are inherent in the components included in the optical connector system and the like. For example, in a device (a die bonder, etc.) for mounting an optical element on a substrate, errors are inherently inevitably, and the final mounting position of the optical element is indefinite. Even in the case of an optical transmission member, Error occurs.

In order to solve the above-mentioned problem, a process of active optical alignment has emerged. Active optical alignment refers to a series of processes for locating or detecting a point or state that optimally arranges or arranges components for optical signal transmission, such as an optical element, to provide optimal light transmission efficiency, and fixes such point or state Process. However, since the active optical alignment is time-consuming and is not suitable for mass production, it has recently been proposed to design and arrange structural elements inside the connector, or to position optical elements directly on the optical path The method of optical alignment is spreading.

In addition, as the size of electronic devices is reduced, there is a problem of miniaturization and low reduction in the optical devices such as the optical connectors used therein. Therefore, it is necessary to optimize the existing layout for the elements inside the device to meet these requirements, It is becoming important to devise.

The optical module of FIG. 1 (hereinafter referred to as "prior art 1") comprises a transmitter 10a, a receiver 10b, and an optical transmission line 2 as a connection wiring between a transmitter and a receiver. The transmitting section is composed of a VCSEL chip 3a on the substrate 6a, an electrode pad 5a, a bonding wire 7a, a liquid resin 8a and a height supporting member 4a. An electrode pad 5b, a bonding wire 7b, a liquid resin 8b and a height supporting member 4b.

1, an electrical signal from a board connected to a transmitter is controlled by a driver IC (not shown) through an electrode pad 5a on a substrate 6a, and the VCSEL chip 3a receives an optical signal And is reflected on a 45-degree mirror surface formed at the end of the optical path 2 to change its path, and then is transmitted to the receiving part through the optical path 2. [

The light is reflected by the 45 ° mirror surface formed at the end of the optical path 2 and is then incident on the PD chip 3b on the substrate 6b, Is converted into an electric signal in the PD chip 3b through the control of [not shown] and input to the board connected to the receiving unit.

The photoelectric hybrid type connectors shown in Figures 2 and 3 are disclosed in Japanese Laid-Open Patent Application No. 2010-266729 (entitled " photoelectric hybrid type connector ") (hereinafter referred to as" prior art 2 " Then, 3 is a plug 20 that is fastened to a connector 30 called a receptacle mounted on an in-device board. The plug 20 includes a housing 21, A ground plate 24 mounted on the inner bottom surface of the housing 21 and an electric terminal 22 and a ground terminal 23 mounted on both sides of the ground plate 21, The bonding wires 28 of the connection wiring function between the VCSEL chip 26, the Driver IC 27, the electric terminal 22 and the ground terminal 23 on the VCSEL chip 26 and the Driver IC 27 on the VCSEL chip 26, And an optical fiber 29 inserted into the housing 21.

JP 2010-266729 A

The conventional art 1 requires not only an additional machining process for cutting the end surface of the light transmitting member so that the end surface of the light transmitting member forms 45 degrees with respect to the axial direction but also the die bonder die used for mounting the optical device on the circuit board active optical alignment processes must be included to compensate for equipment errors inherently present in the bonder. In the optical alignment process in the prior art 1, after the driving circuit of the optical device is activated, transmission efficiency is measured by using a measuring device such as an optical spectrum analyzer for an optical signal generated, And sequentially fixing the optical element and the optical transmission member 91 to the position in the state. However, although the above-mentioned active optical alignment ensures a light transmission efficiency of a certain level or higher, there is a problem that it is relatively time-consuming and costly because it is basically based on a trial and error technique.

On the other hand, in the prior art 2, the driver IC 27 on the ground plate 24 and the electrical terminal 22 on the side of the housing 21 must be electrically connected by a wire bonding process. It is difficult to realize the bonding wire 28 on the wire 20 and particularly the wire bonding process becomes difficult when the number of pins of the electric terminal 22 increases. There is a problem that it is difficult to miniaturize the plug because the driver IC 27 having a relatively high process degree and a relatively large size is located on the plug side because all elements and components must be mounted inside the housing 21. [

In the prior art 2, the VCSEL chip 26 is mounted on the submount 25 made of a wafer and mounted on the ground plate 24, the optical fiber 29 is placed on the ground plate 24 to form the VCSEL chip 26, And the VCSEL chip 26 and the optical fiber 29 are not fixed relative to each other, so that the optical alignment can not be properly performed. In addition, there is a problem that the plug 20 is difficult to operate because there is no part that can be held by hand by fastening (plugging) the plug 20 to the receptacle 30 or detaching (removing) the plug 20 from the receptacle 30.

Accordingly, the present invention has been made to solve the above-mentioned problems and to meet the above-mentioned needs.

A first alignment trench 57 and a second alignment trench 58 having a function of coupling with the optical alignment block 60 are formed in the number of optical signal channels, An optical device module 50 including a first substrate 51 as a double-sided substrate having a first electrode pad portion 52 mounted on one surface thereof, and an optical transmission member 91 as many as the number of optical signal channels A first alignment protrusion 61 formed corresponding to the first alignment groove 57 and the second alignment groove 58 for coupling with the optical element module 50 and the optical element module 50, A light alignment block 60 having an alignment projection 62 and an optical transmission member guide hole 65 serving as a guide for the introduction of the optical transmission member 91, A second substrate 81 on which a control element 83 for controlling the element 53 and a second electrode pad portion 84 for electrical connection between the first electrode pad portion 52 and the control element 83 are formed, And the second substrate 81 includes a module mounting portion 82 for mounting the optical device module 50 and the optical alignment block 60 on the side surface A via hole connected to the first electrode pad portion 52 is formed on the first substrate 51. The first substrate 51 is fitted on the backside of the first substrate 51, And the contact member 70 connected to the second electrode pad portion 84 is electrically connected to the second electrode pad portion 84. [

The optical transmission member module 90 of the optical connector plug 100 has a function of branching the optical transmission members 91 as many as the number of optical signal channels for each channel in order to mount the optical transmission member 91 in the optical transmission member guide hole 65 And a branching block for branching.

The optical connector plug assembly (110) further includes an interface unit (99) having a function of electrically connecting to a third substrate or a device external port as an external separate substrate.

Further, a method of manufacturing such an optical connector plug is provided.

As a main effect, the present invention has a third effect that the first effect of lowering the luminance, the second effect of shortening the optical alignment time, and the process rationalization by using the modular principle.

Regarding the first effect, the optical device module 50 is arranged on the side surface of the substrate by adopting a configuration in which the advancing direction of the optical signal and the optical device attaching face are close to and perpendicular to each other, Thereby making it possible to achieve downsizing and downsizing.

In the second effect, the conventional optical modules change the relative positions and arrangements among the components in a trial and error manner, and a process of finding a point at which the optimum transmission efficiency is generated, that is, a process of obtaining an optical optical alignment The present invention applies a passive optical alignment that allows a given light transmission efficiency to be obtained immediately upon coupling of components without the need for such a separate active light alignment process.

In the third effect, the optical element 53 is formed as a separate module, and is manufactured in a separate process from the main manufacturing process. Thus, the overall manufacturing process is simplified and simplified, and the entire process time is reduced and the workability is increased Lt; / RTI >

Fig. 1 is an explanatory diagram relating to Prior Art 1. Fig.
2 is a perspective view showing a plug and a receptacle of the conventional art 2;
3 is a perspective view showing a detailed structure of a plug of the conventional art 2;
4 is a perspective view showing a front structure of an optical device module 50 in an embodiment of the present invention.
5 is a perspective view showing the rear surface configuration of the optical element module 50 in one embodiment of the present invention.
6 is a perspective view showing a photo alignment block 60 in an embodiment of the present invention.
7 is a perspective view showing the contact member 70 in an embodiment of the present invention.
FIG. 8 is a perspective view showing a state in which the optical alignment block 60 and the optical module 50 are combined in an embodiment of the present invention.
9 is a perspective view showing the shape of a module mounting portion formed on a substrate of a control element module 80 in an embodiment of the present invention.
10 is a plan view showing a control element 83 and a second electrode pad portion 84 mounted on the control element module 80 of the present invention.
11 is a plan view and an enlarged view showing a state in which the second electrode pad portion 84 of the present invention and the contact member 70 are electrically connected.
12 is a perspective view showing a shape of a branching block in an embodiment of the present invention.
13 is a plan view showing a state in which an optical transmission member 91 is mounted on a branching block in an embodiment of the present invention.
14 is a perspective view showing an embodiment of the optical connector plug 100 of the present invention.
15 is a perspective view showing an embodiment of an optical connector plug assembly 110 to which an external interface unit 99 of the present invention is attached.
16 is a perspective view showing an embodiment of the optical connector plug 100 to which the casing 111 of the present invention is attached.
17 is a perspective view showing an embodiment of assembling the optical alignment block and the optical device module of the present invention.
18 is a perspective view showing an embodiment of assembling the optical alignment block, the optical device module assembly, and the control device module of the present invention.
19 is a perspective view showing one embodiment of assembling the optical alignment block, the optical device module, the control device module assembly, and the optical transmission member module of the present invention.

The present invention discloses the following technology for three issues of optical connectors, optical connectors, low rejection, modularization and optical alignment assurance.

First, regarding the low-emission, the final height of the optical connector can be reduced by mounting the module on which the optical device 53 is mounted on the 'side' of the substrate. That is, when the module is mounted on the 'upper surface' of the substrate, the length corresponding to the sum of the height of the module and the thickness of the substrate is the final height of the optical connector. In the present invention, Is included in the thickness of the side surface of the substrate, it is more advantageous in lowering the thickness. However, in the case of mounting on the side surface of the substrate, since the total contact area is small, an additional coupling structure may be required for a strong coupling between the optical element mounting module and the substrate.

Secondly, with respect to modularization, the present invention is characterized in that the manufacturing process of the optical device module 50, the optical transmission member module 90, and the control device module 80, which mount the optical device 53 on the first substrate 51, , The modules thus manufactured are put into a corresponding portion of the main process in the future to shorten the entire manufacturing process time and the quality of the final product can be improved through quality inspection for each module.

Third, in relation to the optical alignment assurance, the present invention is implemented by adopting a so-called butt coupling system in which the optical input / output slope of the optical device and the optical signal transmitted by the optical transmission member are perpendicular to each other. When the optical element and the optical transmission member are connected in this manner, the optical signal transmitted / received from the optical transmission member and the optical element can be mutually interchanged immediately. However, since the top surface of the horizontal substrate and the entrance and exit slopes of the optical element are relatively perpendicular A separate lead frame or a separate substrate for mounting an optical device is required. In the latter case, the latter uses a technique of mounting an optical device on a separate substrate. Furthermore, it is possible to maintain the distance between the entrance / exit surface of the optical device and the entrance / exit surface of the optical signal of the optical transmission member close to each other, as well as a method of contacting the optical device entrance / exit surface and the optical signal entrance / exit surface of the optical transmission member. It is ideal to make direct contact with each other, but it is effective to compromise the two elements closer to each other in consideration of the inevitable manufacturing errors that arise in the case of using an automated process, and to provide an element capable of correcting these errors separately would.

In the case of butt coupling, ideal ideal optical alignment conditions are such that the optical input / output points of the optical elements match the center of the exposed core section of the optical transmission member as precisely as possible, while minimizing the distance between them And the like. However, it is impossible to perform the above-described full optical alignment in consideration of the positional error between the respective components constituting the optical connector and the manufacturing errors inherent in the respective components. Therefore, for the practical level of optical alignment, the following two optical alignment methods can be considered.

First, a first optical alignment is performed to search for a point where the optical transmission efficiency becomes maximum while continuously changing the relative position of the optical transmission member and the optical device, and to fix the relative position of the optical transmission member and the optical device at the position at the time when the optical transmission efficiency becomes maximum. And a second platform part which is a member serving as a platform on which the optical transmission member is mounted, wherein the optical device includes a first platform part serving as a platform on which the optical device is mounted and a second platform part serving as a platform on which the optical transmission member is mounted, The second condition that the optical transmission member is mounted at a fixed position, the optical transmission member is mounted at a fixed position with respect to the reference position of the second platform unit, and a third condition that the optical transmission member is aligned with the second platform unit It is possible to consider a second optical alignment method for achieving the optical alignment by satisfying the first condition. The first optical alignment method is so-called active optical alignment, and the second optical alignment method is called passive optical alignment. Since the first optical alignment method utilizes the optical transmission efficiency measured using the optical measuring equipment, the optical alignment is highly reliable, but the mounting positions of the components of the optical transmission system are sequentially aligned and fixed over several steps, The process becomes complicated and the whole process time becomes long. The second optical alignment method is characterized by a first condition capable of ensuring optical alignment at a level within a predetermined tolerance, together with the establishment of the second and third conditions, the first condition being a position of the first platform part and the second platform part The condition for aligning the fastening structure. When the alignment is completed using such a fastening structure, a separate active optical alignment operation is not required, thereby reducing the overall process speed and manufacturing cost. When all of these first, second and third conditions are satisfied, it is possible to implement logically complete optical alignment, but optical alignment does not fail because some of the conditions are selectively satisfied among them. However, as the parts become smaller, the weight of parts and equipment becomes larger. In spite of this error, the necessity of satisfying all of the above three conditions is increased in order to achieve optical alignment There is a number.

Hereinafter, the constituent elements of the present invention will be described in detail.

The optical connector plug 100 according to the present invention includes an optical element, a first alignment trench 57 and a second alignment trench 58. The first electrode pad 52, on which the optical element 53 is mounted, An optical transmission module module 90 including an optical transmission member, a first alignment protrusion 61 and a second alignment protrusion 62. The optical module module 50 includes a first substrate 51 on which a first substrate 51 is formed, A light alignment block 60 and a light control element 83 in which an optical transmission member guide hole 65 functioning as a guide of the optical transmission member 91 are formed are mounted and the first electrode pad portion 52, And a second substrate 81 on which a second electrode pad portion 84 for conducting between the control element 83 is formed.

A laser diode or a VCSEL () may be adopted as the optical element 53. In the case where the optical connector plug 100 of the present invention is used in the transmitter, The electric signal received from the optical element 83 drives the optical element to emit an optical signal and the optical signal enters the core of the optical transmission member 91 mounted on the optical alignment block 60. In addition, when used in a receiving unit, a PD (Photo Diode) can be adopted as a light receiving element. An optical signal transmitted through the optical transmission member 91 is incident on an incident surface of an optical device, converted into an electric signal, The signal is controlled by the element 83.

The first substrate 51 includes a first alignment trench 57 and a second alignment trench 58 for optical alignment, in which the optical device 53 is mounted and transmits electrical signals related to the optical device 53 And is a main component of the optical device module 50 having the function to be provided. A PCB substrate is suitable for the PCB substrate and a first electrode pad portion 52 is formed on a surface of the first electrode pad portion 52. The first electrode pad portion 52 is a well- . The first alignment trench 57 and the second alignment trench 58 are formed in the shape of a through hole and can be processed through a drilling process, an NC milling process, a CNC process, or the like. This will be described later.

In particular, the first substrate 51 must be a double-sided substrate because the optical alignment block 60 described later and the optical element 53 mounted on the first substrate 51 are coupled to each other, It is necessary to use the rear surface of the first substrate 51 to input / output a signal related to the signal. In addition, a via hole structure for bringing an electric signal through the first electrode pad portion 52 to the rear surface of the first substrate 51 is also required. In the embodiment shown in FIGS. 4 and 5, a via hole having a conductive penetrating electrode connected to the first electrode pad portion 52 is formed on the first substrate 51 by a known method. The via hole 54 is a structure in which a conductive material is plated or filled on the inner wall surface of the through hole formed in the substrate to enable conduction between the front surface and the back surface of the substrate. In the present invention, between the front surface and the back surface of the first substrate 51 Enables conduction. In the embodiment of the first electrode pad portion shown in FIG. 4, two sets of electrode pads are formed for each optical signal channel because the optical element 53 having two terminals is to be applied. The optical alignment block 60 has a structure for optical alignment, that is, a first aligning protruding portion 61 and a second aligning protruding portion 62. The number of the optical communication member guide holes 65 corresponding to the number of optical signal channels And guides the inserted optical transmission member 91 to the vicinity of the optical element 53 to enable butt coupling. The optical alignment block 60 is preferably made of a synthetic resin material in terms of moldability, light weight, and cost, and is preferably manufactured through injection molding. In forming the optical transmission member guide hole 65, the inner diameter value should be determined in relation to the thickness of the strand of the optical transmission member 91. Generally, one optical transmission member 91 has a diameter of several hundred micrometers to several millimeters However, if the inner diameter of the optical transmission member guide hole 65 is too small, it may be difficult to enter the optical transmission member guide hole 65. Therefore, the inner diameter of the optical transmission member guide hole 65 should be determined in consideration of this. The optical alignment block 60 is coupled to the optical device module 50 and then mounted on the module coupling portion formed on the second substrate 81 so that the shape of the optical alignment block 60 can be changed in the shape of the module coupling portion on the second substrate 81 .

It is also possible to consider forming the light transmission portion at the end of the optical transmission member guide hole 65 on the side of the optical device 53. The optical transmission member 91 inserted along the optical transmission member guide hole 65, The optical signal can be condensed even when the cores of the core and the input / output slopes of the optical elements are aligned with a certain error, so that the effect of correction in alignment can be enjoyed. That is, although the optical transmission member guide hole may completely penetrate the optical alignment block, the light transmission portion may be formed at the corresponding portion without passing through the optical device side end portion side, and as a result, It is molded. Particularly, in order to cope with multi-channels, the number of light transmission parts must be equal to the number of channels, so that a so-called light transmission part array is formed. The shape of the light transmitting portion for performing the correction function in the optical alignment, such as collecting the optical signal at the set point, can have a convex lens shape in particular, It is possible to condense the incoming and outgoing optical signal into the focus region of the lens formed on the optical axis and use it corresponding to both the light receiving element and the light emitting element. Generally, when the radius of curvature of the convex lens is increased, the focal length becomes longer. Therefore, the specification such as the radius of curvature of the lens should be determined.

When the light transmitting portion is formed as described above, the light transmitting portion is formed integrally with the body of the light aligning block 60 so that the optical signal passes through a certain distance inside the light aligning block 60, Should be molded using a transparent member. It is preferable that the optical signal transmission apparatus is made of a material having a light transmittance in a wavelength band of 70 to 100% with respect to an optical signal having a specific wavelength band transmitted from the optical transmission member or an optical signal having a specific wavelength band received from the optical transmission member. In this case, the wavelength band of the optical signal may be 650 nm, 850 nm, 980 nm, 1310 nm, 1550 nm, etc. In view of this, it is preferable to use silicon, epoxy, ABS resin may be used. Particularly, a silicone resin has a molecular structure of silicon in the form of a siloxane bond in which silicon and oxygen alternate with each other, and a thermoplastic or thermosetting resin to which a methyl group, a phenyl group, Which is excellent in electrical insulation, durability and heat resistance.

The control element 83 serves as a Driver IC to drive the optical element 53 and to be electrically connected to an external driving circuit. The second substrate 81 has a structure in which a control element 83 is mounted on one surface of the second substrate 81 and the optical device module 50 can be mounted on a side surface thereof. It is preferable to use a material that is thicker than a commonly used PCB in order to allow the optical device module 50 to be stably mounted on the side surface. The module coupling portion is a structure formed on the second substrate 81 so as to mount the optical device module 50. In this embodiment, the side surface of the second substrate 81 is used without any additional processing. It is necessary to increase the thickness of the side surface of the second substrate 81 in order to stably fix the optical device module 50, Additional processes may be required, such as attaching using an adhesive for fixation. Therefore, a notch portion is formed by removing a predetermined portion of the edge of the second substrate 81 in order to keep the side surface thickness of the second substrate 81 to a minimum and not to perform an additional process, (50) and the optical alignment block (60) are placed on the surface of the optical component module (50). In this case, since the predetermined portions formed on both sides of the above-described optical alignment block 60 and the one surface of the second substrate 81 come into wide contact with each other, the mounting stability can be further improved. This embodiment is shown in Figures 9-11.

In the present invention, a second electrode pad portion (not shown) formed on the second substrate 81 by a known processing method in connecting the through electrode of the via hole 54 formed in the first substrate 51 to the control element 83, (84) is provided to mediate the electrical connection, as an embodiment. As a method of electrically connecting the penetrating electrode of the via hole 54 and the second electrode pad portion 84, a direct wire bonding method or the like may be used. However, not only the two are electrically coupled but also a certain mechanical bonding strength A method of using a separate contact member 70 may be employed. In the embodiment shown in Fig. 8, the contact member 70, which is fitted on the back surface side of the first substrate 51 and connected to the penetrating electrode of the via hole 54, is electrically connected to the second electrode pad. At this time, in order to improve the contact stability between the penetrating electrode of the via hole 54 and the contact member 70, considering the application of the tolerance of the interference fit between the two elements, Can be prevented. A third electrode pad portion 55 connected to the penetrating electrode of the via hole 54 around the entrance of the via hole 54 on the rear surface of the first substrate 51 to further secure the contact area of the contact member 70, And the shape of the contact member 70 can be determined so as to be electrically connected to the third electrode pad portion 55. An embodiment of the shape of the contact member 70 is shown in Figure 7 .

Further, in order to further secure the contact stability, the contact member 70 and the through electrode of the via hole 54 are electrically connected to each other by a process of soldering, SMT (Surface Mount Technology) or reflow, A bump or a solder ball may be formed to further strengthen the mechanical bonding and the electrical bonding therebetween.

Electrical contact between the contact member 70 and the second electrode pad portion 84 can be selected from SMT (Surface Mount Technology), reflow, or wire-bonding. However, in terms of strength and stability of bonding, it is more preferable to select the SMT and the reflow process rather than the wire bonding process.

Next, the configuration for the optical alignment coupling will be described. Now, in order to satisfy the above-mentioned first condition and to secure the optical alignment, a structure is required in which the reference point at the time of setting the optical element mounting position and the reference point in positioning the optical transmission member guide hole 65 are aligned with each other, The reference point is the first alignment recess 61 and the second alignment recess 62 and the latter reference point is the first alignment recess 57 and the second alignment recess 58, And is realized by fitting the protrusion 61, the first alignment groove 57, the second alignment protrusion 62, and the second alignment groove 58. The mounting position of the optical element and the position of the end of the optical transmission member guide hole 65 formed in the optical alignment block 60 are set such that the first alignment protrusion 61, the second alignment protrusion 62, It is preferable to set them on the connecting line segments connecting the centers of the respective sections of the groove portion 57 and the second alignment groove portion 58 and further on the "equally divided points" thereof. Actually, Only the distance between the first aligning protrusion 61 and the second aligning protrusion 62 (the first distance) and the distance between the first aligning groove 57 and the second aligning groove 58 (the second distance) are meaningful.

The problem is that a manufacturing error is involved in the first and second intervals. That is, the first alignment groove 57 and the second alignment groove 58 are formed on the first substrate 51 Equipment errors are inevitable when a drilling machine, a CNC / NC milling machine, etc. are used. In the injection molding of the optical alignment block 60, manufacturing errors arise in designing injection molds. Although the first interval and the second interval are set to the same value, in the present invention, the first interval and the second interval are different from each other, so that the alignment is incomplete. Due to the existence of these errors, The first aligning recessed portion 57 and the first aligning recessed portion 61 are engaged but the second aligning recessed portion 58 and the second aligning recessed portion 62 are not engaged with each other, There is a great possibility that In general, in order for the first condition to be established, first, the difference between the errors occurring in the first interval and the second interval should be managed. If this is difficult, a structure capable of absorbing at least such difference should be proposed Second condition that the first aligning protrusion 61 and the first aligning recess 57 and the fitting clearance between the second aligning protrusion 62 and the second aligning recess 58 should be managed -2 condition).

First, in the present invention, the first alignment protrusion 61, the second alignment protrusion 62, and the first alignment groove 57 have a circular cross-section, and the second alignment groove 58, Groove grooves formed in the connection line direction of the horizontal cross-sectional centers of the first alignment grooves 57 and the second alignment grooves 58, respectively. Such an elongated groove portion should be formed to have a predetermined length with respect to both the inner side in the direction of the first alignment groove portion 57 and the outward direction opposite to the reference position, which is the center point of the elongated groove portion. The inwardly elongated portion corresponds to a case where the first interval is shorter than the second interval, and the outwardly elongated portion corresponds to the case where the first interval is longer than the second interval. The predetermined length is to be determined in consideration of a typical manufacturing error of hole processing and projection processing using the above-mentioned equipment. In designing the shape of the long groove portion, it should be formed long only in the direction of the connection line, and the length of the second alignment protrusion 62 should be the same as the length of the second alignment protrusion 62 in the direction perpendicular to the connection line. Otherwise, it is impossible to establish the second condition and the third condition of the optical alignment described above.

Next, the first alignment trench 57, the first alignment trench 61, the second alignment trench 58, and the second alignment trough 62 have a proper tolerance with respect to the first-second condition, , Then each pair of these should be considered to have aligned their center axes. This tolerance should be determined in consideration of the usual manufacturing errors of the hole processing and the projection processing using the above-mentioned equipment. When the diameter of the projecting section is larger than the hole, that is, when the fastening occurs, the reliability of the optical alignment is increased On the other hand, when the diameter of the hole section is larger than the diameter of the protruding portion, that is, when a clearance is generated, the coupling is facilitated. However, it should be taken into consideration that the reliability of the optical alignment may deteriorate do. In the case of the present invention, it is desirable to apply a tolerance that allows intermediate fitting, rather than tolerance corresponding to forced fit or loose fit, in view of the material characteristics of the substrate and the block forming the joined structure.

Since the tolerance of the loose fitting is avoided in order to satisfy the condition 1-2, it is not easy to combine the optical alignment block and the first substrate using the above coupling structure, and furthermore, If an assembling machine is used, the operating error of such a machine is also added, so that smooth assembly may be more difficult. Therefore, when the corners of the first aligning protrusion 61 and the second aligning protrusion 62 are chamfered, the cross-sectional size of the end portions of the first aligning protrusion 61 and the second aligning protrusion 62 becomes smaller than the original cross- It is possible to easily place a seat in the groove part, and once the stone part is seated in the groove part entrance, the subsequent mounting process can be easily performed. The angle of the chamfer may be any angle between 20 and 60 degrees. However, if the end section size is too small than the original section size, collision may occur in the side section during the insertion process, There is no need to chamfer, so it is preferable to select 45 degrees as the slope of the chamfer.

In addition, it is possible to consider forming a tapered tab at the entrance of the first alignment groove portion and the second alignment groove portion. This has the effect of widening the entrance of the groove, and can facilitate the coupling in the initial stage of fastening with the protrusion. As described above, it is preferable that the tapered tab portion has an inclination of 45 degrees.

Of course, in the above-mentioned 1-1 and 1-2 conditions, the above-mentioned scale of error and tolerance through the use of precise equipment or process can be neglected with respect to the actual dimensions of the product (order The first aligning recessed portion 61, the second aligned recessed portion 58, and the second aligned recessed portion 58, and the second aligned recessed portion 58, All of the second alignment protrusions 62 may be circular in cross section. Particularly, when the first substrate 51 is a PCB, it is not necessary to strictly satisfy the above-mentioned 1-1 and 1-2 conditions due to the characteristics of the substrate material having a relatively low strength, Is greater than the diameter of the alignment groove, or there is an error between the first distance and the second distance, the inner wall of the hole of the PCB substrate is partly abraded during the bonding process so that the bonding can be forcibly performed. Therefore, in the embodiment in which the first substrate 51 is a PCB, the fitting tolerance in the 1-2 condition can be made a low level of the interference fit tolerance, and even in the 1-1 condition, It is sufficient that the groove portion 58 is not formed as the elongated groove portion but has a simple circular cross section.

The configuration for establishing the second condition in the present invention is such that the mounting position of the optical element 53 on the first electrode pad portion 52 is set to the first alignment groove portion 57 and the second alignment groove portion 58 to a predetermined relative position with respect to a connecting line connecting the respective centers of the first and second connecting portions. For example, it is possible to mount four optical elements at a point 3 millimeters above and above the fifth division point on the assumption that the fifth division point (four points) of the connecting line segment is assumed. The line segment connecting the mounting positions of the optical devices 53 on the first electrode pad portion 52 is connected to each of the first alignment groove portion 57 and the second alignment groove portion 58 It is parallel to the line connecting the center of the horizontal section. However, for convenience of design and processing, it is preferable to set the optical element mounting position at a position on the connecting line segment rather than a point deviating from the connecting line segment. The line segment connecting the mounting positions of the optical devices 53 on the first electrode pad portion 52 is formed by connecting the first alignment groove 57 and the second alignment groove 58, And the line segments connecting the horizontal cross-sectional centers. And furthermore, it is more preferably set on an equal part of the connecting line segment. Here, the predetermined relative position should be made coincident with the 'predetermined relative position' referred to in the construction for establishing the third condition described later, which will be described later.

Next, the configuration for establishing the third condition is such that the center of the entrance of the optical element guide hole 65 on the side of the optical element 53 is defined as the center of each cross section of the first alignment projecting portion 61 and the second alignment projecting portion 62 And to set a predetermined relative position with respect to the connecting line segment. For example, it is possible to assume the fifth equally divided points (four) of the connecting line segments and to position the entrance of the four optical transmission member guide holes 65 at a position 3 mm vertically above the fifth equilibrium point. The line segment connecting the center of the entrance of the optical element 53 of the optical transmission member guide hole 65 is connected to the center of the first alignment protrusion 61 and the second alignment protrusion 62 It is parallel to the line connecting the center of the horizontal section. However, for convenience of design and processing, it is preferable to set the position on the connecting line segment rather than the point deviating from the connecting line segment. The line segment connecting the center of the entrance of the optical element 53 of the optical transmission member guide hole 65 is connected to the center of the first alignment protrusion 61 and the second alignment protrusion 62 It is consistent with the line connecting the horizontal section center. Furthermore, it is more preferable to set the connection line segment to the " equal distribution point " as in the above example. At this time, the 'predetermined relative position' must exactly coincide with the 'predetermined relative position' with respect to the mounting of the above-mentioned optical element, so that when the above-mentioned first condition is satisfied, to be. Next, how the error between the design and the implementation for satisfying the second condition and the third condition is absorbed will be described.

When the mounting position of the optical element 53 is determined, the first electrode pad portion 52 is actually formed at the corresponding position, and the optical element is mounted thereon. In general, the operation error of the apparatus for die- Because it is a micrometer, it should be considered that this error occurs. This implies that, in mounting an optical device, an optical device in an actual product is accompanied by an error of several tens to several hundreds of micrometers from the set position.

In addition, when the end position of the optical transmission member guide hole 65 is determined, the optical alignment block 60 must be formed accordingly. The optical alignment block 60 is made of a resin material and is preferably formed by injection molding or the like. Since the manufacturing error of an injection mold is usually within a range of several tens to several hundreds of micrometers, Means that the optical-transmission-member guide hole 65 of the light-emitting element is located at a distance of several tens to several hundreds of micrometers from the set position. The actual error is the sum of the mounting error of the optical device and the spacing error of the optical transmission member guide hole 65. Such an error is inevitable, And the diameter of the core portion of the optical transmission member 91 should be appropriately set to a large value, and the influence thereof must be nullified. In other words, if the size of the optical element 53 or the diameter of the core portion of the optical transmission member is appropriately set large, the second condition and the third condition-related error are no longer affected. Therefore, Can be said to be satisfied.

In the case of the optical transmission member module 90, the optical transmission member bundle 91a having a plurality of strands is used for processing the multi-channel optical signal. The optical alignment should be performed for each channel, In order to be mounted in the guide hole, the ends of the bundle should be used separately for each channel. However, since the thickness of the optical transmission member is only a few hundred micrometers to several millimeters, when the optical transmission member is exposed to a single strand rather than a bundle, problems such as cutting may occur when external tension is applied. Therefore, in order to prevent such a problem and to facilitate entry of the optical alignment block 60 into the optical-communication-member guide hole 65, a branching block can be introduced. A branching block 93 having an inlet portion 94 for inserting the optical transmission member bundle 91a and a branching portion 95 for branching the optical transmission member bundle 91a into individual optical transmission members for each channel, 96 and 96 are shown in Figs. 12 and 13. Fig.

In addition, when the second substrate 81 is provided with a separate interface, that is, a lead frame or an electrical terminal, the present invention has an optical connection function in the device, which has the same configuration as the embodiment shown in FIG. 14 . When an electrical connector corresponding to a port of the external board is provided, the optical connector functions as an optical connection between the devices. In this case, the electrical connector to be used may be selected from various types such as a B2B connector, an FPC connector, a PCB to Wire connector, an MMI connector, an HDMI connector, and a USB connector. May be referred to as a plug assembly 110. This embodiment is shown in Fig.

It is also possible to consider mounting the optical connector plug assembly 110 in a separate casing 111, thereby increasing the durability of the optical connector plug assembly 110 of the present invention, Respectively.

Hereinafter, each step of the method of manufacturing the optical connector plug of the present invention will be described in detail.

First, the optical device module 50, the optical transmission member module 90, the control device module 80, and the optical alignment block 60 are manufactured. The relative order of fabrication between these elements does not need to be linear on a single time series, and each of them may be fabricated in a separate process, then the fabricated modules may then be put into the main process, 100). This modularity can shorten the overall manufacturing process time and enhance the quality of the final product through quality inspection of each module. That is, the order of manufacturing the optical device module 50, the optical transmission member module 90, and the control device module 80 is not determined, but only when the module is put in a proper period in the main process.

The detailed process of manufacturing the optical device module 50 is to process the first alignment trench 57 and the second alignment trench 58 in the first substrate 51 and align the first alignment trench 57 and the second alignment trench 58, The first electrode pad portion 52 and the via hole 54 are formed at a predetermined relative position with respect to a connection line connecting the centers of the two alignment trenches 58, And mounting the optical element 53 in this order.

The first alignment groove portion 57 and the second alignment groove portion 58 on the first substrate 51 can be processed by a mechanical drilling process, a laser for a PCB, or a CNC / NC milling process. , The position on the first substrate 51 on which the groove portion is to be formed is selected, the groove portion is machined, and processing is performed in the order of measuring and managing the illuminance of the inner wall surface of the groove portion. In the case of a mechanical drilling process, it is necessary to place a small spot in the pre-selected position before performing the groove machining by applying a drilling force perpendicular to the substrate, whereby the drill tip is moved laterally Precise machining can be done by avoiding pushing. In the case of machining a groove portion by using a mechanical drilling process, it is more difficult to set the position of the groove portion than to use a CNC process or a laser process to be described later and to precisely process the groove portion at a set position. An additional step such as grinding of the inner wall surface may be required to manage the roughness of the inner wall surface of the groove portion related to the negative fitting tolerance. In the case of using the CNC process, the shape and positional information of the groove portion are inputted to the computer in advance, and the cutting is performed based on the information, so that the machining time can be shortened. The laser machining process is based on non-contact work, suitable for automated line configuration, precise control, and high-speed scan speed enables short process times. Examples of the laser used include a UV laser, a carbon dioxide gas laser, and the like, and can be selected from a percussion method, a trepanning method, a helical method or the like according to a puncturing method. The specific operation is performed by controlling the energy of one shot, the number of shots, the total energy sum, etc. according to the thickness of the first substrate 51.

At this time, the second alignment trench 58 is formed by the manufacturing error of the interval between the first alignment trench 57 and the second alignment trench 58 and the manufacturing error of the first alignment trench 61 and / Shaped grooves formed in the direction of the connecting line connecting the first aligned trench 57 and the second aligned trench 58 to function to absorb the manufacturing error of the interval between the second aligned troughs 62 Can be considered. Optionally, the alignment grooves may be formed with tabs for facilitating engagement with the aligning protrusions, and preferably the tabs may be tapered tabs. An embodiment reflecting such matters is shown in Fig.

After the first alignment trench 57 and the second alignment trench 58 are formed, the first alignment trench 57 and the second alignment trench 58 are formed as the positions where the first electrode pad portions 52 are formed. And determines a predetermined relative position to a line segment connecting each horizontal section center. This position is substantially related to the mounting position of the optical element 53 and is intended to ensure optical alignment with the position of the optical transmission member guide hole 65 formed in the optical alignment block 60 to be described later, . The first electrode pad portion 52 is formed using a known electrode pad forming method. When the pattern shape of the first electrode pad portion 52 is determined, the first electrode pad portion 52 and the first electrode pad portion 52 are electrically connected to each other through the through- The position of the via hole 54 in which the via hole 54 is formed is determined. The via hole 54 is a through hole on the substrate having a through electrode for electrically connecting the front and back surfaces of the substrate to each other. The through hole is formed by plating a conductive metal or polymer such as copper To form a penetrating electrode. However, in the present invention, the thickness of the plated film constituting the penetrating electrode should be determined in consideration of the fact that the contact member 70 is inserted into the via hole 54 as described later. The through holes are processed through a mechanical drilling process, a laser for PCB, or a CNC / NC milling process, as in the case of the first alignment trench 57 and the second alignment trench 58 described above . A separate electrode pad portion (third electrode pad portion 55) is selectively formed around the via hole 54 on the back surface of the first substrate 51 on which the first electrode pad portion 52 is formed, As shown in FIG.

As a method of mounting the optical element 53 on the first electrode pad portion 52, any one of wire bonding, flip chip bonding, SMT (surface mounting technology), and reflow method can be selected. The wire bonding is performed by electrically connecting the optical element 53 to the substrate, and a thermocompression bonding process and an ultrasonic bonding method can be considered. In the thermo-compression process, heat and pressure are applied to form a joint, and an end portion of a wire having a diameter of 10-20 μm is melted using an electric discharge or a torch, and pressure is applied to form a ball bond. A capillary tip is used as a bonding condition, and a pressure is applied to a wire at a second bonding position to form a bonding portion, which is called a wedge bond. The bonding speed is approximately 6 bpm (bond per minute). In the ultrasonic bonding process, the wire is bonded to the pad at room temperature by applying the vertical pressure and the ultrasonic vibration of about 60 KHz in the horizontal direction. The oxide film breaks due to pressure and vibration, and metal contact occurs, and it works at room temperature, forming a cold weld. The joints at both ends of the pad are in the form of a ball-wedge or a wedge-wedge bond, and in the case of a wedge-wedge bond, a capillary tip and other types of tools Tool) can be used. As the wire material, Au or Cu is used and the bonding speed is about 240 bpm (bond per minute). Flip chip bonding is a method of attaching an optical element to the back surface of a substrate by bonding an optical element and a substrate using gold or a solder bump. Further, when a conductive paste is applied to the back surface of the device and hot air is applied using a reflow equipment, the paste is melted to form a solder ball. This is called SMT (Surface Mount Technology) Which is advantageous for low-volume and miniaturization.

The manufacturing of the optical transmission member module 90 including the branching block 93 provided with the branching unit 95 for branching the optical transmission member by the optical signal channel can be carried out by forming a part The optical transmission member bundle is inserted into the inlet portion 94 and the optical transmission member 96 is covered with the fixing cover 96 so that the optical transmission member is fixed . The branching block and fixing lid 96 may be formed of a general thermosetting or thermoplastic plastic material and a separate member sealing the bundle of optical transmission members inserted into the inlet 94 and the inlet 94 may be used .

The detailed process of manufacturing the control element module 80 is performed in the order of preparing the second substrate 81 on which the module mounting portion 82 is formed and mounting the control element 83 on the second substrate 81 . The module mounting portion 82 formed on the second substrate 81 is a portion on which a combination of the optical alignment block 60 and the optical module 50 to be mounted is mounted, And then removing the portion. In one embodiment, a notch shape having a rectangular cross section may be formed on one side edge portion of the second substrate 81. The shape of the notch shape should be determined such that the optical alignment block 60 to be coupled thereto can be coupled without a large error. The member removing process for forming the module mounting portion 82 can be performed through a laser cutting process or a cutting press process. Depending on the precision and the output of the equipment, the area around the innermost corner of the module mounting portion 82 is removed There is a possibility that the work may not be completed completely. Accordingly, the first substrate 51 constituting the optical device module 50 may have a shape such as a cylinder including the innermost corner so that one surface of the first substrate 51 may completely contact the inner surface of the module coupling portion of the second substrate 81 There is a further step to remove more parts.

In mounting the control device 83 on the second substrate 81, any one of wire bonding, flip chip bonding, surface mounting technology (SMT), and reflow may be selected.

The manufacturing of the optical alignment block 60 is performed only when the optical transmission member guide hole 65 formed in the optical alignment block 60 and the first coupling projection and the second coupling projection satisfy the requirement to be precisely formed, It may be manufactured by a process such as an automated CNC process or a milling process, but it is preferable that the process is performed through an injection molding process excellent in process speed and final quality. One embodiment of an injection molding process is as follows. After mixing the resin powder, the mixture is heated to a specific temperature to be melted, stirred using an agitator, injected into the injection port of the mold, and then the mold is separated when solidified. The mold for injection molding of the optical alignment block 60 should be designed not only in the shape of the body but also in the shape of two coupling protrusions for coupling with the optical transmission member guide hole 65 and the optical module 50 .

The formation of the optical transmission member mounting part is performed by a first method in which the optical alignment member 60 is injection-molded integrally with the optical alignment block 60 by reflecting the shape of the optical alignment block 60, or in the injection process, , A laser cutting, an NC, a milling, or the like. However, the first method is more preferable when considering the process speed and process precision. When the optical transmission member mounting portion is formed into a hole having a predetermined width and depth, the width and depth of the optical transmission member mounting portion should be determined in consideration of the fitting tolerance with the optical transmission member.

The shapes of the first aligning protrusion 61 and the second aligning protrusion 62 of the optical alignment block 60 are naturally different from those of the first aligning recess 57 and the second aligning recess 58, and preferably the shape of the horizontal cross section is a circle. The edges of the first aligning protrusion 61 and the second aligning protrusion 62 can be chamfered so that the first aligning recess 57 and the second aligning recess 58 can be coupled with each other. It can be made easier.

Secondly, the optical element module 50 and the optical element module 50 are assembled by fitting the first alignment protrusion 61, the first alignment recess 57, the second alignment protrusion 62 and the second alignment protrusion 62, Thereby joining the alignment block 60. One embodiment of such a coupling is shown in Fig.

The fitting tolerance at this time has an important meaning in relation to the optical alignment, and should be determined in consideration of the usual manufacturing errors of the groove process and the projection process using the above-mentioned equipment and process. In the case where the diameter of the projecting end face is larger than that of the groove portion, that is, when the fastening is generated, the reliability of the optical alignment is increased. However, there is a fear that the coupling becomes impossible. Conversely, It should be taken into consideration that the coupling becomes easy, but the reliability of the optical alignment may be deteriorated. In the case of the present invention, it is preferable to apply a tolerance capable of intermediate fitting, rather than a tolerance corresponding to forced fit or loose fit, in view of the material characteristics of the substrate and the optical alignment block forming the coupled structure.

In addition, when the second engaging groove portion is formed as the elongated groove portion as described above, since the engaging may be failed if the engaging is attempted from the side of the second engaging groove portion, the engaging operation proceeds through a more specific procedure. In other words, if the central axis of the first alignment groove portion 57 and the central axis of the first alignment projection portion 61 are not located on a straight line but spaced apart from each other, The second aligning protrusion 62 is first joined to the second aligning recess 58. As a result, the overall engraving will eventually fail, especially if the assembly is performed by a machine in an automated assembly process will be. First, the first alignment protrusion 61 is inserted into the first alignment groove 57 by a predetermined depth. If the depth is too large in this determination of the predetermined depth, the central axis of the second alignment projection part 62 and the central alignment axis of the second alignment groove part 58 (long axis) are deviated so much that coupling becomes impossible, The first alignment protrusion 61 partially inserted into the first alignment groove 57 is formed in a slight movement when the second alignment groove 58 and the second alignment protrusion 62 are moved to the joining step, ) Can easily fall off and try to insert it again. Thereafter, while the first alignment projecting portion 61 is being inserted into the first alignment groove portion 57, the second substrate 51 is placed in parallel with the second alignment groove portion 57, And the alignment protrusion 62 is inserted into the second alignment groove 58. The central axis of the first alignment protrusion 61 and the center axis of the first alignment groove 57 are arranged so that the center axis of the first alignment protrusion 61 and the center axis of the second alignment protrusion 62 overlap with each other, The insertion of the first alignment protrusion 61 is performed until the point where the first substrate 51 is positioned parallel to the optical alignment block 60 Lt; / RTI > Finally, the relative position of the optical alignment block 60 with respect to the first substrate 51 is inserted parallel to the end of the movable range to complete the coupling.

If the process of applying the adhesive to the contact surfaces of the optical device module 50 and the optical alignment block 60 is further performed in order to prevent the optical device module 50 and the optical alignment block 60 from being detached after being joined, It is possible to ensure the surface contact between them after the coupling is completed by using the coupling structure. Thus, it is possible to prevent the partial alignment of the coupling portion from moving in the release direction by the external force, and thus the optical alignment is prevented from being skipped. However, care must be taken to prevent adhesive from flowing on the path of the optical signal during the adhesive application process.

Third, the optical device module and the optical alignment block assembly and the control device module are electrically connected and coupled. In the detailed procedure, first, the contact member 70 is inserted into the via hole 54. Since the first electrode pad portion 52 is electrically connected to the penetrating electrode of the via hole 54 so that the contact member 70 is electrically connected to the via hole 54, And is electrically connected to the optical element 53 when it is connected to the penetrating electrode. The shape of the contact member 70 is largely a portion for electrical connection between a portion to be inserted into the via hole 54 and a second electrode pad portion 84 to be described later. The portion to be inserted into the via hole 54 is a via hole 54, And the fitting tolerance in relation to the diameter. If the size of the portion of the contact member 70 where the via hole 54 is inserted is larger than the diameter of the via hole 54, the interference fit is achieved. If the contact member 70 is small, the fitting is loose. In the case of electrons, , And the latter may cause non-contact in an emergency and short-circuit of the electric signal may occur. Therefore, it is preferable that the size of the portion of the contact member 70 where the via hole 54 is inserted is controlled by the tolerance of the intermediate fitting in relation to the diameter of the via hole 54. At this time, after the contact member 70 and the via hole 54 are fitted to each other, a method of a soldering or reflow process is performed in order to further electrically connect the fitting portion to further secure the electrical connection between the contact member 70 and the via hole 54 A bump or a solder ball may be formed around the bonding site. However, since it is difficult to form the bumps directly on the substrate, in order to form the bumps, the above-described third electrode pad portion 55 should be formed around the back surface of the first substrate 51 and the via hole 54 .

Next, a combined assembly of the optical device module 50 and the optical alignment block 60 combined in the second step preceding the module mounting portion 82 formed on the second substrate 81 is mounted. An example of such a mounting is shown in Figure 18. The contact member 70 is then electrically connected to the second electrode pad portion 84 by wire bonding, surface mounting technology (SMT) And a method of reflow may be selected.

Fourth, the optical transmission member module is assembled with the assembly in the preceding step. One embodiment of such an assembly is shown in Fig. This method is carried out by inserting an optical transmission member that is branched to the transmission member guide hole 65 and drawing it to the end of the movable range. At this time, the optical transmission member guide hole 65 and the optical transmission member can be fixed using an adhesive resin to prevent the optical transmission member from being detached in the direction opposite to the insertion direction after the optical transmission member is mounted. As the adhesive resin, Can be used.

The interface unit 99 and the control element 83 are electrically connected through the electrode pad portion formed separately on the second substrate 81 between the pin or terminal of the control element 83 and the terminal of the interface portion 99 .

Furthermore, a casing portion including the built-in assembly can be mounted. The shape may be such that only a part of the bundle of bundles of optical transmission members and the interface unit 99 is exposed to the outside as in the embodiment shown in FIG. 16, but the present invention is not limited thereto.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it should be understood that various changes and modifications will be apparent to those skilled in the art. It is to be understood that the present invention is not limited to the above-described embodiments. Accordingly, the scope of protection of the present invention should be construed according to the following claims, and all technical ideas which fall within the scope of equivalence by alteration, substitution, substitution, Range. In addition, it should be clarified that some configurations of the drawings are intended to explain the configuration more clearly and are provided in an exaggerated or reduced size than the actual configuration.

50: optical device module
51: first substrate
52: first electrode pad portion
53: Optical element
54:
55: third electrode pad portion
57: first alignment groove
58: second alignment groove portion (elongated shape)
59: tapered tab portion
60: block for optical alignment
61: first alignment projection
62: second alignment projection
65: optical transmission member guide hole
70: contact member
80: Control device module
81: second substrate
82: Module mounting part
83: Control element
84: second electrode pad portion
90: optical transmission member module
91a: bundle of optical transmission member
91b: optical transmission member
93: Branching block
94:
95:
96: Fixing cover
99:
100: Optical connector plug
110: Optical connector plug assembly
111: casing

Claims (15)

In the optical connector plug 100 having the optical element 53 as a separate module,
A first alignment trench 57 and a second alignment trench 58 having a function of coupling with the optical alignment block 60 are formed as many as the number of optical signal channels and the optical device 53 An optical device module 50 including a first substrate 51 as a double-sided substrate having a first electrode pad portion 52 mounted on one surface thereof;
An optical transmission member module 90 including optical transmission members 91 as many as the number of optical signal channels;
A first aligning protrusion 61 and a second aligning protrusion 62 formed to correspond to the first alignment trench 57 and the second alignment trench 58 for coupling with the optical device module 50, An optical alignment block 60 having an optical transmission member guide hole 65 serving as a guide for receiving the optical transmission member 91;
A control device 83 for controlling the optical device 53 and a control device module 80 including a second substrate 81 on which the control device 83 is mounted and electrically connected to the optical device module, );
, ≪ / RTI >
The second substrate 81 includes a module mounting portion 82 for mounting the optical device module 50 and the optical alignment block 60,
A via hole 54 connected to the first electrode pad portion 52 is formed on the first substrate 51 and a second electrode pad portion 84 is formed on the second substrate 51, A contact member 70 fitted in the via hole 54 on the rear side of the first substrate 51 and connected to the penetrating electrode is electrically connected to the second electrode pad portion 84, 50 and the control element module 80 are electrically connected,
A third electrode pad portion 55 for connecting the penetrating electrode of the via hole 54 around the entrance of the via hole 54 on the back surface of the first substrate 51 and for increasing the contact area with the contact member 70, ) Is further formed,
A conductive bump or a solder ball is further formed on the connection portion of the contact member 70 and the penetrating electrode of the via hole 54 to enhance the mechanical and electrical bonding between the contact member 70 and the via hole 54 (100). delete delete The method according to claim 1,
Wherein the module mounting part (82) is formed by removing a corner of the second substrate (81) in a predetermined shape so that the optical device module (50) and the combination of the optical alignment block can be seated. Connector plug (100). The method according to claim 1,
Each of the first alignment protrusions 61, the second alignment protrusions 62 and the first alignment recesses 57 has a circular cross section and the second alignment recesses 58 define the first alignment recesses 57, And a second aligning protrusion (62) and a second aligning protrusion (62), and a second aligning protrusion (62) It is possible to absorb the positional error between the alignment trench 57 and the second alignment trench 58 and to prevent the positional error between the first alignment trench 57 and the first alignment protrusion 61 and the second alignment trench 58 Wherein the second alignment protrusion (62) is fit-engaged with a predetermined tolerance to ensure optical alignment. The method according to claim 1,
The first alignment grooves 57, the second alignment grooves 58, the first alignment protrusions 61 and the second alignment protrusions 62 are formed to have a circular cross section, 57) and the first alignment protrusions (61) and the second alignment recesses (58) and the second alignment protrusions (62) are fit-engaged with a predetermined tolerance to ensure optical alignment. Connector plug (100). The method according to claim 5 or 6,
The edges of the first aligning protrusion 61 and the second aligning protrusion 62 are chamfered and the tapered tab 59 is formed in the first aligning recess 57 and the second aligning recess 58, wherein the tapered tab is formed to facilitate coupling of the optical device module (50) and the optical alignment block (60). The method according to claim 1,
The line segments connecting the mounting positions of the optical devices 53 on the first electrode pad portion 52 are connected to the first alignment groove 57 and the second alignment groove 58, And are parallel to or coincident with the line segments. The method according to claim 1,
The line segment connecting the center of the optical device guide hole 65 on the side of the optical device 53 is connected to the center of each horizontal section of the first alignment protrusion 61 and the second alignment protrusion 62 And are parallel to or coincident with the line segments. The method according to claim 1,
The optical alignment block 60 is made of a material that transmits a wavelength band of an optical signal and is used for condensing the optical signal transmitted through the optical transmission member 91 to the optical device 53 And the transmission portion is provided at the entrance of the optical element guide hole (65) on the side of the optical element (53). The method of claim 10,
And the light transmitting portion is formed in the shape of a convex lens. The method according to claim 1,
The optical transmission member module 90 includes a branching block 93 which functions to branch the optical signal transmission channels 91 by optical signal channels to mount the optical transmission members 91 in the optical transmission member guide holes 65, (100). ≪ / RTI > An optical connector plug (100) according to claim 1; And
An interface unit 99 having a function of electrically connecting to a third substrate or a device external port as an external separate substrate;
(110). ≪ RTI ID = 0.0 > 11. < / RTI > 14. The method of claim 13,
Wherein the optical connector plug assembly 110 further includes a casing 111 including the optical connector plug 100 and the interface unit 99 therein. ). The method of manufacturing the optical connector plug (100) according to claim 1,
(i) fabricating the optical device module 50, the optical transmission member module 90, the control device module 80, and the optical alignment block 60, respectively;
(ii) combining the optical device module 50 and the optical alignment block 60;
(iii) electrically connecting and coupling the coupling member in the step (ii) and the control element module 80;
(iv) assembling the optical transmission member module 90 and the assembly in the step (iii);
, ≪ / RTI >
The coupling in the step (ii) may include a first alignment trench 57 and a second alignment trench 58 formed in the optical device module, a first alignment protrusion 61 formed in the optical alignment block 60, And the second alignment protrusion (62) are fitted to each other.

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