KR101926715B1 - Micro light emitting diode module and its manufacturing method - Google Patents

Abstract

The present invention relates to a micro LED module and a method of manufacturing a micro LED module that enable a display device or a lighting device to be implemented using a micro LED, comprising: a first substrate preparation step of preparing a first substrate; A first electrode layer base material forming step of forming a first electrode layer base material on the first substrate; A first conductive bonding layer base material forming step of forming a first conductive bonding layer base material on the first electrode layer base material; Forming a first electrode layer and a first conductive bonding layer by collectively forming a pattern on the first electrode layer base material and the first conductive bonding layer base material; And a chip mounting step of mounting the first surface of the micro LED chip on the first conductive bonding layer.

Description

Technical Field [0001] The present invention relates to a micro-LED module,

The present invention relates to a micro LED module and a method of manufacturing a micro LED module. More particularly, the present invention relates to a micro LED module and a method of manufacturing a micro LED module that enable a display device or a lighting device to be implemented using a micro LED.

Since the commercialization of nitride semiconductor light-emitting diodes (hereinafter referred to as GaN-LEDs), GaN-LED has achieved remarkable improvement in performance and reliability owing to the continuous development of semiconductor thin film technology, process technology and device technology. Demand for light emitting diodes (LEDs) has been explosively rising due to rapid growth and continuous introduction of high brightness and high power applications.

In addition, unlike conventional incandescent lamps and fluorescent lamps, GaN-LEDs have many advantages such as small size, low power consumption, high efficiency, and environmental friendliness. Recently, they have been applied to mid- And is expanding its scope not only to automotive lighting but also to general lighting market.

However, GaN-LEDs developed to date require further improvement in terms of luminous efficiency, light output and cost, and in particular, in order to expand applications of GaN-LEDs as general illumination, It is considered a top priority.

That is, the light generated inside the GaN-LED generates total internal reflection due to the difference in refractive index between the semiconductor and air, thereby increasing the light extraction efficiency. As a result, the problem is that the GaN- Has come.

In order to obtain a high light extraction efficiency, a method of manufacturing a high-brightness micro-array light-emitting diode device that minimizes photons that are trapped in the device or converted into heat by damaging total reflection geometrically is required.

Particularly, in the manufacturing process of the high-brightness microarray light-emitting diode device, the alignment process or the planarization process of the microarray pattern for depositing the transparent electrode on the upper surface of the microarray pattern requires highly precise and high-level work.

However, depending on the result of the alignment process or the planarization process for the placement of the micro LED chips on the substrate, the production cost may be greatly increased or the structure of the surface on which the transparent electrode is deposited may become complicated or uneven, There is a problem that the productivity of the product, the reproducibility of the process, and the reliability are inferior because it can be connected to a problem causing disconnection or short-circuit in the multilayer wiring process.

The idea of the present invention is to solve these problems by improving the productivity by shortening the process time by forming a pattern in the electrode layer and the conductive bonding layer and facilitating the electrical or mechanical coupling between the components by using the conductive bonding layer. The chip surface can be quickly aligned and planarized by using the hydrophilic first side and the hydrophobic second side coated on the micro LED chip to improve the reliability of the product and reduce the production time and cost of the product, And to provide a method of manufacturing a micro LED module and a micro LED module. However, these problems are illustrative, and thus the scope of the present invention is not limited thereto.

According to an aspect of the present invention, there is provided a method of manufacturing a micro LED module, comprising: preparing a first substrate; A first electrode layer base material forming step of forming a first electrode layer base material on the first substrate; A first conductive bonding layer base material forming step of forming a first conductive bonding layer base material on the first electrode layer base material; Forming a first electrode layer and a first conductive bonding layer by collectively forming a pattern on the first electrode layer base material and the first conductive bonding layer base material; And a chip mounting step of mounting the first surface of the micro LED chip on the first conductive bonding layer.

According to another aspect of the present invention, there is provided a method of manufacturing a semiconductor device, the method comprising: forming an etch protection layer on a first conductive bonding layer base material; A batch etching step of collectively etching the first conductive bonding layer base material on which the etch protection layer is not formed and the first electrode layer base material on the bottom surface thereof to form the first electrode layer and the first conductive bonding layer; And removing the etch protection layer from the first conductive bonding layer.

In addition, the method of manufacturing a micro LED module according to the present invention may further include a conductive bonding layer curing step of curing the first conductive bonding layer by heating or irradiating light after the chip mounting step.

According to another aspect of the present invention, there is provided a method of manufacturing a micro LED module, comprising: preparing a second substrate; Forming a second electrode layer base material on the second substrate; A second conductive bonding layer base material forming step of forming a second conductive bonding layer base material on the second electrode layer base material; Forming a second electrode layer and a second conductive bonding layer by collectively forming a pattern on the second electrode layer base material and the second conductive bonding layer base material; An inversion step of inverting the second substrate; And a second substrate mounting step of mounting the second conductive bonding layer of the inverted second substrate on the second surface of the micro LED chip.

In the method of manufacturing a micro LED module according to the present invention, after the first substrate preparation step, a first partition wall layer having a first through hole exposing at least a part of the first electrode layer is formed on the first substrate A first barrier rib layer forming step of forming a first barrier rib layer.

According to the present invention, the chip mounting step may include: forming a hydrophilic surface or a hydrophobic surface on the first surface or the second surface of the wafer for micro LEDs or a plurality of the micro LED chips; Placing a plurality of the micro LED chips in a water tank so that the hydrophilic surface floats in the water direction or the hydrophobic surface floats so as to be natural aligned in the water surface direction; A chip adsorption step of adsorbing at least one micro LED chip naturally aligned using a vacuum hole formed on a vacuum adsorption plate with vacuum pressure; And releasing the vacuum pressure to place the micro LED chip adsorbed on the first conductive bonding layer.

According to an aspect of the present invention, there is provided a micro LED module including: a first substrate; A first electrode layer formed on the first substrate; A first conductive bonding layer formed on the first electrode layer; A micro LED chip on which a first surface is mounted on the first conductive bonding layer; A second conductive bonding layer formed on a second side of the micro LED chip; A second electrode layer formed on the second conductive bonding layer; And a second substrate formed on the second electrode layer, wherein the first conductive bonding layer may be an etchable material that can be etched to etch the first conductive bonding layer base material.

Also, according to the present invention, the first conductive bonding layer and the second conductive bonding layer may be thermosetting or UV curable materials.

Also, according to the present invention, the first conductive bonding layer may be hydrophilic and the second conductive bonding layer may be hydrophobic.

According to some embodiments of the present invention as described above, a batch pattern is formed on the electrode layer and the conductive bonding layer to shorten the process time to improve the productivity, and the electrical bonding or mechanical coupling between the components using the conductive bonding layer And the hydrophilic first side and the hydrophobic second side coated on the micro LED chip enable rapid chip alignment and planarization to improve the reliability of the product and reduce the production time and cost of the product, And it has an effect of producing a high-quality product. Of course, the scope of the present invention is not limited by these effects.

1 is a cross-sectional view illustrating a micro LED module according to some embodiments of the present invention.
FIGS. 2 to 11 are cross-sectional views showing steps of manufacturing the micro-LED module of FIG.
12 is a flow chart illustrating a method of fabricating a micro LED module in accordance with some embodiments of the present invention.
13 is a flowchart showing the batch pattern forming step of FIG. 12 in more detail.
Figure 14 is a flow chart illustrating a method of manufacturing a micro LED module in accordance with some alternative embodiments of the present invention.
Figure 15 is a flow diagram illustrating a method of fabricating a micro LED module in accordance with some further embodiments of the present invention.
16 is a flowchart showing the chip mounting step of Fig. 12 in more detail.

Hereinafter, various embodiments of the present invention will be described in detail with reference to the accompanying drawings.

The embodiments of the present invention are described in order to more fully explain the present invention to those skilled in the art, and the following embodiments may be modified into various other forms, It is not limited to the embodiment. Rather, these embodiments are provided so that this disclosure will be more thorough and complete, and will fully convey the concept of the invention to those skilled in the art. In the drawings, the thickness and size of each layer are exaggerated for convenience and clarity of explanation.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms "a," "an," and "the" include singular forms unless the context clearly dictates otherwise. Also, " comprise "and / or" comprising "when used herein should be interpreted as specifying the presence of stated shapes, numbers, steps, operations, elements, elements, and / And does not preclude the presence or addition of one or more other features, integers, operations, elements, elements, and / or groups.

Hereinafter, embodiments of the present invention will be described with reference to the drawings schematically showing ideal embodiments of the present invention. In the figures, for example, variations in the shape shown may be expected, depending on manufacturing techniques and / or tolerances. Accordingly, the embodiments of the present invention should not be construed as limited to the particular shapes of the regions shown herein, but should include, for example, changes in shape resulting from manufacturing.

Hereinafter, a micro LED module and a micro LED module manufacturing method according to various embodiments of the present invention will be described in detail with reference to the drawings.

1 is a cross-sectional view illustrating a micro LED module 100 in accordance with some embodiments of the present invention.

1, a micro LED module 100 according to some embodiments of the present invention includes a first substrate 10, a first electrode layer 11, a first conductive bonding layer 12, a micro LED chip C, a second conductive bonding layer 22, a second electrode layer 21, and a second substrate 20.

For example, as shown in FIG. 1, the first substrate 10 includes a first electrode layer 11, a first conductive bonding layer 12, a micro LED chip C, Various types of substrates having sufficient strength and durability to support the conductive bonding layer 22, the second electrode layer 21, and the second substrate 20 can be applied.

More specifically, various synthetic resin materials such as polyethylene terephthalate (PET), which is a soft material, may be applied to the first substrate 10 so as to implement a flexible display device using a micro LED.

However, the first substrate 10 is not necessarily limited to this, and may be a variety of substrate materials such as various printed circuit boards, metal substrates, ceramic substrates, glass substrates, synthetic resin substrates, and composite substrates All of which can be applied.

1, the first electrode layer 11 may include a high-conductivity copper component, an aluminum component, a gold component, a silver component, a platinum component, and the like. However, the present invention is not limited to this, and various conductive transparent electrode materials such as ITO (Indium Tin Oxide) can be applied. More specifically, the first electrode layer 11 may be patterned on the first substrate 10 using an etching process.

1, the first conductive bonding layer 12 is a kind of conductive bonding medium formed on the first electrode layer 11, and may be a paste containing graphene or a CNT component Alternatively, an epoxy solder paste mixed with an epoxy-based resin may be applied to the solder powder. However, the present invention is not limited thereto, and a wide variety of conductive pastes such as silver paste can be applied.

The first conductive bonding layer 12 may function to firmly bond the first electrode layer 11 and the micro LED chip to be described later electrically and mechanically to each other. For example, the first conductive bonding layer 12 may include a graphene component, A conductive powder containing a solder component, a silver component, a tin component, a copper component, or the like may be used as a polymer mixture, a film type that may include a thermosetting or UV curable medium such as ceramic or silicon or a volatile medium Lt; / RTI > That is, the first conductive bonding layer 12 and the second conductive bonding layer 22 may be thermosetting or UV curable materials.

Here, the mixing ratio of the conductive powder and the curable resin medium may be determined according to the specifications of the first electrode layer 11, the processing environment, and the like. More specifically, for example, the first conductive bonding layer 12 may be a film containing a graphene or CNT component, or an epoxy solder film in which an epoxy-based resin is mixed with a solder powder. However, the present invention is not limited thereto, and a wide variety of conductive films such as an epoxy silver film can be applied.

In addition, for example, the first conductive bonding layer 12 may be an etchable material that is etchable by etching the first conductive bonding layer base material 120.

1, the micro LED chip C has a first surface (C-1) mounted on the first conductive bonding layer 12, The term, "micro" element, "micro" pn diode or "micro" LED structure may refer to a descriptive size of certain elements or structures in accordance with embodiments of the present invention. As used herein, the term "micro" element or structure is intended to refer to a scale of 1 to 100 μm. However, it should be appreciated that embodiments of the present invention are not necessarily so limited, and that certain embodiments of the embodiments may be applicable with larger and possibly smaller size scales.

For example, an embodiment of the present invention can describe a method of treating a bulk LED substrate with an array of micro-LED structures with preparation for transport to a pick-up and receiving substrate. In this way, it is possible to integrate and assemble the micro-LED structure in a heterogeneous integrated system. The micro LED structures can be picked up and transported individually, in groups, or as an entire array. Thus, a micro-LED structure in an array of micro-LED structures can be used as a receiving substrate, such as a display substrate of any size, from pick-up and micro-display to large-area display. More specifically, for example, the array of micro-LED structures can be described as having a pitch of 10 μm × 10 μm, or a pitch of 5 μm × 5 μm. At this density, a 15.2 cm (6 inch) substrate can be fabricated using, for example, approximately 165 million micro LED structures with a 10 μm × 10 μm pitch, or approximately 600 million with a 5 μm × 5 μm pitch It can accommodate 60 million micro LED structures. However, the micro LED module and micro LED module manufacturing method described herein are not limited to micro LED structures, and can also be used in the manufacture of other micro devices.

1, the second conductive bonding layer 22 is formed on the second surface C-2 of the micro LED chip C, and the second electrode layer 21 is formed on the second surface C- And the second substrate 20 may be formed on the second conductive layer 22 and the second conductive layer 22, respectively.

The second conductive bonding layer 22 may have the same structure and function as the first conductive bonding layer 12 described above and the second electrode layer 21 may be formed on the first electrode layer 11, And the second substrate 20 may have the same configuration and function as the first substrate 10.

However, the second conductive bonding layer 22 and the second electrode layer 21 may be formed of indium tin oxide (ITO) or the like in order to increase transparency in order that light generated from the micro LED chips C may be emitted upward. The first conductive layer 12, the first electrode layer 11, and the first substrate 10 may be made of a reflective material such as an epoxy solder film or a transparent or semi-transparent material. However, the present invention is not limited thereto, and various types of materials can be applied.

For example, the micro-LED chip C may be hydrophilic and the second surface C-2 may be hydrophobic, using the coating process or the self-nature.

It is also possible that the hydrophilic property of the first conductive bonding layer 12 and the second conductive bonding layer 22 is higher than that of the second conductive bonding layer 22, The first conductive bonding layer 12 may be hydrophilic and the second conductive bonding layer 22 may be hydrophobic in order to further strengthen the mechanical bonding to prevent short circuiting and improve the reliability of the product.

More specifically, for example, the first surface (C-1) of the micro LED chip may be coated with a hydrophilic material to form a hydrophilic surface, and the second surface (C-2) The first conductive bonding layer 12 may contain or be coated with a hydrophilic material and the second conductive bonding layer 22 may contain a hydrophobic material to form a hydrophobic surface, Or coated.

1, a micro LED module 100 according to some embodiments of the present invention is formed between the first substrate 10 and the second substrate 20, A first barrier rib layer W1 formed between the first barrier rib layer W1 and the second substrate 20 and a second barrier rib layer W2 formed between the first barrier rib layer W1 and the second substrate 20, W2). The first barrier rib layer W1 and the second barrier rib layer W2 may be made of various synthetic resin materials such as polyethylene (PE), for example.

The first barrier rib layer W1 and the second barrier rib layer W2 may serve as a kind of spacer between the first substrate 10 and the second substrate 20. [

Therefore, productivity is improved by shortening the processing time by collectively etching the electrode layers 11 and 21 and the conductive bonding layers 12 and 22, and by using the conductive bonding layers 12 and 22 described above, (C-1) coated on the micro LED chip (C-1) and the second hydrophobic surface (C-2) to facilitate chip alignment and planarization The reliability of the product can be improved, the production time and cost of the product can be reduced, the productivity can be greatly increased, and a high quality product can be produced.

FIGS. 2 to 11 are cross-sectional views illustrating steps of manufacturing the micro-LED module 100 of FIG.

As shown in FIGS. 2 to 11, the manufacturing process of the micro LED module 100 of FIG. 1 will be described step by step. First, as shown in FIG. 2, the first substrate 10 can be prepared .

Next, as shown in FIG. 3, a first electrode layer preform 110 may be formed on the first substrate 10. At this time, the first electrode layer base material 110 may be formed in a state where the pattern is not yet formed so as to be formed on the upper surface of the first substrate 10 as a whole. For example, the first electrode layer base material 110 may be a metal plating process or a metal film bonding process.

Then, as shown in FIG. 4, the first conductive bonding layer base material 120 may be formed on the first electrode layer base material 110. At this time, the first conductive bonding layer base material 120 may be formed in a state where the pattern is not yet formed so as to be formed on the upper surface of the first electrode layer base material 110 as a whole. For example, the first conductive bonding layer base material 120 may be bonded or coated.

5, a pattern is formed on the first electrode layer base material 110 and the first conductive bonding layer base material 120 to form a first electrode layer 11 and a first conductive bonding layer The etching protection layer PR may be partially formed on the first conductive bonding layer base material 120 so as to form the etching protection layer PR. At this time, for example, a photoresist may be applied to the etch protection layer PR.

6, the first conductive bonding layer base material 120, on which the etch protecting layer PR is not formed, and the first electrode layer base material 120 on the bottom surface thereof, which are not formed using the dry etching process or the wet etching process, The first electrode layer 11 and the first conductive bonding layer 12 can be collectively formed.

Next, as shown in FIG. 7, the etch protecting layer PR may be removed from the first conductive bonding layer 12.

8, in order to mount the first surface C-1 of the micro LED chip C on the first conductive bonding layer 12, first, a wafer for a micro LED or a plurality of A hydrophilic surface or a hydrophobic surface is formed on the first surface (C-1) or the second surface (C-2) of the micro LED chips (C), and a plurality of micro LED chips (C) The hydrophilic surface can be floated so that it is naturally aligned in the water direction or the hydrophobic surface is naturally aligned in the water surface direction.

9, at least one micro LED chip C, which is naturally aligned as shown in FIG. 4, may be vacuum-suctioned by using a vacuum hole H3 formed in the vacuum adsorption plate 30 .

At this time, hydrophobic or hydrophilic coating may be applied to the surface of the vacuum adsorption plate 30 or the inside of the vacuum hole H3 while using the vacuum pressure, thereby facilitating the transfer of the micro LED chips C.

10, the internal vacuum pressure of the vacuum hole H3 of the vacuum adsorption plate 30 is released or a positive pressure is applied to the micro-LED chip C so that the micro- (12). At this time, a first barrier layer W1 having a first through hole H1 exposing at least a part of the first electrode layer 11 may be formed on the first substrate 10. [

11, a second substrate 20 is prepared, a second electrode layer base material is formed on the second substrate 20, and on the second electrode layer base material, a second conductive bonding material base material A second electrode layer 21 and a second conductive bonding layer 22 are formed by collectively forming a pattern on the second electrode layer base material and the second conductive bonding layer base material, The second conductive bonding layer 22 of the second substrate 20 may be mounted on the second surface C-2 of the micro LED chip C. The second substrate 20, the second electrode layer 21, and the second conductive bonding layer 22 may be formed in the same manner as the first substrate 10 illustrated in FIGS. 2 to 10, May be the same as the formation process of the first electrode layer 11 and the first conductive bonding layer 12.

Next, although not shown, the first conductive bonding layer 12 and the second conductive bonding layer 22 are heated or irradiated with light such as UV light to form the first conductive bonding layer 12 and the second conductive bonding layer 22, The conductive bonding layer 22 can be cured.

12 is a flow chart illustrating a method of fabricating a micro LED module in accordance with some embodiments of the present invention.

1 to 12, a method of manufacturing a micro LED module according to some embodiments of the present invention includes a first substrate preparing step S1 of preparing the first substrate 10 of FIG. 2, A first electrode layer base material forming step S2 of forming a first electrode layer base material 110 of FIG. 3 on the first substrate 10, a second electrode layer base material forming step S2 of forming a first electrode layer base material 110 of FIG. 4 on the first electrode layer base material 110, A first conductive bonding layer base material forming step S3 of forming a layer base material 120 and a first conductive bonding layer base material forming a pattern on the first electrode layer base material 110 and the first conductive bonding layer base material 120, A batch pattern formation step S4 of forming an electrode layer 11 and a first conductive bonding layer 12 and a micro LED chip (not shown) on the first conductive bonding layer 12, as shown in FIGS. (S5) for mounting the first surface (C-1) of the first substrate (C).

13 is a flowchart showing the batch pattern forming step S4 of FIG. 12 in more detail.

As shown in FIGS. 5 to 13, in the batch pattern formation step S4, the etching protection layer PR is partially formed on the first conductive bonding layer base material 120, as shown in FIG. 6, the first conductive bonding layer base material 120 on which the etch protecting layer PR is not formed and the first electrode layer base material 120 on the bottom surface of the first conductive bonding layer base material 120, (S42) of forming the first electrode layer 11 and the first conductive bonding layer 12 by collectively etching the first conductive bonding layer 110 and the first conductive bonding layer 12 as shown in FIG. 7, (S43) for removing the etching protection layer (PR) from the etching stop layer (12).

Figure 14 is a flow chart illustrating a method of manufacturing a micro LED module in accordance with some alternative embodiments of the present invention.

1 to 14, a method of manufacturing a micro LED module according to some embodiments of the present invention includes a second substrate preparing step (S6) of preparing a second substrate (20), a second substrate preparing step A second electrode layer base material forming step (S7) for forming a second electrode layer base material on the substrate (20), a second conductive bonding layer base material forming step (S8) for forming a second conductive bonding layer base material on the second electrode layer base material (S9) for forming a second electrode layer (21) and a second conductive bonding layer (22) by collectively forming a pattern on the base material of the second electrode layer and the base material of the second conductive bonding layer And the second conductive bonding layer 22 of the inverted second substrate 20 is electrically connected to the second surface 20 of the micro LED chip C through the inversion step S10 of inverting the second substrate 20, After the second substrate mounting step (S11) and the chip mounting step (S5), which are mounted on the first substrate (C-2) And a conductive bonding layer curing step (S12) for curing the first conductive bonding layer (12) by irradiating the conductive bonding layer (12).

Figure 15 is a flow diagram illustrating a method of fabricating a micro LED module in accordance with some further embodiments of the present invention.

15, a method of fabricating a micro LED module according to still another embodiment of the present invention includes the steps of: providing a first substrate 10 having a first electrode layer 11, at least a first electrode layer 11, The first barrier rib layer forming step S13 and the second substrate preparing step S6 forming the first partition wall layer W1 having the through holes H1 are formed on the second substrate 20, (S14) forming a second partition wall layer (W2) having a second through hole (H2) exposing at least a part of the two-electrode layer (21).

Fig. 16 is a flowchart showing the chip mounting step S5 of Fig. 12 in more detail.

As shown in FIGS. 8 to 16, the chip mounting step S5 includes a step of mounting a micro LED chip or a plurality of micro LED chips C on a first surface C-1 or a second surface C- A hydrophilic surface forming step S51 for forming a hydrophilic surface or a hydrophobic surface on the hydrophilic surface 2 in the water tank 1 and a plurality of micro LED chips C are put into the water tank 1 as shown in FIG. And a vacuum hole H3 formed in the vacuum adsorption plate 30 as shown in FIG. 9, and a step of aligning the hydrophobic surface so that the hydrophobic surface is naturally aligned in the water surface direction, As shown in FIG. 10, the micro-LED chip C is attracted to the first conductive bonding layer 12 (see FIG. 10) (S54). ≪ / RTI >

Therefore, it is possible to improve the productivity by shortening the process time by collectively etching the electrode layers 11 and 21 and the conductive bonding layers 12 and 22, thereby producing high-quality products.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the invention. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

10: first substrate
11: First electrode layer
110: first electrode layer base material
12: first conductive bonding layer
120: first conductive bonding layer base material
C: Micro LED chip
C-1: First side
C-2: Second side
PR: etch protection layer
W1: first partition wall layer
W2: second partition wall layer
H1: First through hole
H2: Second through hole
30: Vacuum suction plate
H3: Vacuum hole
100: Micro LED module

Claims (9)

A first substrate preparation step of preparing a first substrate;
A first electrode layer base material forming step of forming a first electrode layer base material on the first substrate;
A first conductive bonding layer base material forming step of forming a first conductive bonding layer base material on the first electrode layer base material;
Forming a first electrode layer and a first conductive bonding layer by collectively forming a pattern on the first electrode layer base material and the first conductive bonding layer base material; And
And a chip mounting step of mounting the first surface of the micro LED chip on the first conductive bonding layer,
Wherein the chip mounting step includes:
Forming a hydrophilic surface or a hydrophobic surface on the first surface or the second surface of the wafer for micro LEDs or a plurality of the micro LED chips;
Placing a plurality of the micro LED chips in a water tank so that the hydrophilic surface floats in the water direction or the hydrophobic surface floats so as to be natural aligned in the water surface direction;
A chip adsorption step of adsorbing at least one micro LED chip naturally aligned using a vacuum hole formed on a vacuum adsorption plate with vacuum pressure; And
Releasing vacuum pressure to place the micro-LED chip adsorbed on the first conductive bonding layer;
≪ / RTI > The method according to claim 1,
Wherein the batch pattern forming step comprises:
Forming an etch protecting layer partially on the first conductive bonding layer base material;
A batch etching step of collectively etching the first conductive bonding layer base material on which the etch protection layer is not formed and the first electrode layer base material on the bottom surface thereof to form the first electrode layer and the first conductive bonding layer; And
Removing the etch protection layer from the first conductive bonding layer;
≪ / RTI > The method according to claim 1,
After the chip mounting step,
A conductive bonding layer curing step of curing the first conductive bonding layer by heating or irradiating light;
≪ / RTI > The method according to claim 1,
A second substrate preparation step of preparing a second substrate;
Forming a second electrode layer base material on the second substrate;
A second conductive bonding layer base material forming step of forming a second conductive bonding layer base material on the second electrode layer base material;
Forming a second electrode layer and a second conductive bonding layer by collectively forming a pattern on the second electrode layer base material and the second conductive bonding layer base material;
An inversion step of inverting the second substrate; And
A second substrate mounting step of mounting the second conductive bonding layer of the inverted second substrate on a second surface of the micro LED chip;
≪ / RTI > The method according to claim 1,
After the first substrate preparation step,
A first barrier rib layer forming step of forming a first barrier rib layer having a first through hole exposing at least a part of the first electrode layer on the first substrate;
≪ / RTI > delete delete delete delete

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