KR101924298B1 - Non woven for LED illumination device, Circuit board for LED illumination device containing the same and LED illumination device using the same - Google Patents

Abstract

The present invention relates to a non-woven fabric, which dissipates heat generated from an LED by being applied to a circuit board of the LED illumination device, and by absorbing water in a gas phase which can exist in the LED illumination device to remove and/or minimize the water, secures long-term life stability of the LED illumination device, to a circuit board for the LED illumination device containing the same and to the LED illumination device containing the same.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a nonwoven fabric for an LED lighting device, a circuit board for the LED lighting device including the same, and an LED lighting device including the LED lighting device,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a nonwoven fabric for an LED lighting device which can be applied to a circuit board of an LED lighting device or as a circuit board, a circuit board for an LED lighting device including the same, and an LED lighting device using the same.

BACKGROUND ART In general, a light emitting diode (LED) emits excess energy into light when recombined with injected electrons and holes, and can emit white light, red light, green light, and blue light, , It is widely used as a display device (display device), a small numeric character display device, and a light source for a light-coupling device, taking advantage of low power.

A commonly used automobile bulb is a bulb that injects incombustible gas into a glass bulb in a vacuum state and emits light by emitting light from a wire such as tungsten. So as to emit light by electrical resistance.

In recent years, indoor lighting devices of vehicles have been replaced with LEDs. In recent years, LEDs have been replaced with LEDs. However, in general, a vehicle interior lighting device is relatively short in use time compared to an external lighting device, and is used without a replacement until it becomes a car accident or a scrap vehicle. However, one of the main factors that shorten the life of the vehicle interior LED is the heat generated by the LED lighting device itself, and also the humidity inside the vehicle that may or may not exist due to the nature of the vehicle. Therefore, it is necessary to provide a technology for reducing the moisture in the gaseous state existing in the LED lighting device as well as emitting the heat generated in the LED in the vehicle easily to the outside of the lighting device.

Japanese Patent Application Laid-Open No. 2006-272671 (published on October 12, 2006) Korean Patent Registration No. 10-1228558 (Notification Date 2013.01.28)

BACKGROUND ART [0002] Conventionally, there has been provided a laminate in which a surface layer of a nonwoven fabric substrate (base material) containing a resin composition is laminated and integrated on a surface of a nonwoven fabric layer containing a resin composition. Such a laminated board is processed by a printed wiring board for mounting electric and electronic parts by forming a conductor pattern on the surface thereof and has been processed into a circuit board by forming an electric circuit using the conductor pattern. SUMMARY OF THE INVENTION The present invention has been made in order to solve the above problems, and it is an object of the present invention to provide a nonwoven fabric for an LED lighting device, a circuit board using the LED lighting device, and an LED lighting device.

In order to solve the above-described problems, the nonwoven fabric for an LED lighting apparatus of the present invention is a multi-layered nonwoven fabric laminated in the order of a heat dissipating nonwoven fabric layer and a moisture absorptive nonwoven fabric layer, wherein the heat insulating nonwoven fabric layer comprises thermally conductive fibers, And the moisture absorbing nonwoven fabric layer may include side-by-side type conjugated fiber, C type hollow fiber, and a moisture absorbent.

It is also an object of the present invention to provide a circuit board for an LED lighting device, which comprises the nonwoven fabric.

Another object of the present invention is to provide an LED lighting device in which an LED (light emitting diode) is mounted on one surface of the circuit board.

The nonwoven fabric for the LED lighting device of the present invention is flexible and has excellent thermal conductivity as well as excellent water absorption rate and can remove and minimize moisture in the LED lighting device and is applied to the circuit board material of the LED lighting device Thus, the long-term stability of the LED lighting apparatus can be enhanced.

The terms " about ", " substantially ", etc. used to the extent that they are used herein are intended to be taken to mean an approximation of, or approximation to, the numerical values of manufacturing and material tolerances inherent in the meanings mentioned, Accurate or absolute numbers are used to help prevent unauthorized exploitation by unauthorized intruders of the referenced disclosure.

Hereinafter, the present invention will be described in more detail.

The nonwoven fabric (hereinafter referred to as "nonwoven fabric") of the LED lighting apparatus of the present invention is a multi-layered nonwoven fabric laminated in the order of the heat radiation nonwoven fabric layer and the moisture absorption nonwoven fabric layer.

When the nonwoven fabric of the present invention is applied to a part of the circuit board of the LED lighting device or to the circuit board itself, the LED is mounted in the direction of the heat-radiating nonwoven fabric layer in the nonwoven fabric.

[Heat-radiating nonwoven fabric layer]

The heat-dissipating nonwoven fabric layer includes thermally conductive fibers, stainless fibers and a thermally conductive inorganic filler. Preferably, 10 to 20 parts by weight of the stainless fibers and about 1 to 20 parts by weight of the thermally conductive inorganic filler are added to 100 parts by weight of the thermally- More preferably 10 to 15 parts by weight of the stainless steel fiber and about 5 to 12 parts by weight of the thermally conductive inorganic filler per 100 parts by weight of the thermally conductive fiber. If the amount of the stainless steel fibers is less than 10 parts by weight, the effect of introducing the stainless fibers may not be increased. If the amount of the stainless fibers is more than 20 parts by weight, the manufacturing cost may increase and the weight of the nonwoven fabric may be excessively increased. If the amount of the thermally conductive inorganic filler used is less than 1 part by weight, the heat radiation effect against heat generated from the LED may be deteriorated. If the amount exceeds 20 parts by weight, a large amount of thermally conductive inorganic filler is detached from the nonwoven fabric, There is not a large increase in the effect, it is preferable to use within the above range.

The thermally conductive fiber may include about 80 to 95% by weight of a homopolypropylene resin and about 5 to 20% by weight of a polyolefin resin, and preferably about 85 to 90% by weight of a homopolypropylene resin % Of the polyolefin resin and about 10 to 15% by weight of the polyolefin resin. The use of the homopolypropylene resin and the polyolefin resin within the above ranges facilitates the production of the heat-dissipating nonwoven fabric and is advantageous in terms of the mechanical strength of the heat-dissipating nonwoven fabric.

The homopolypropylene resin preferably has a melt index of 5 to 50 g / 10 min at 160 캜 and an isotacticity index of 90% or more, preferably a melt index of 15 to 30 g / 10 min at 160 캜, It is preferable to use an isotactic index of 92% or more. If the melt index of the homopolypropylene resin is less than 5 g / 10 min, the viscosity is too low and the processability is poor. If the melt index exceeds 50 g / 10 min, the stiffness of the fiber decreases and the radioactivity drops. The term "isotactic" as used herein refers to the weight of the remaining isotactic component obtained by boiling normal heptane to dissolve the atactic component and expressed in terms of weight%.

The polyolefin resin may include a polyethylene resin, a polypropylene resin or a polyethylene propylene copolymer resin. Preferably, the polyolefin resin is a polyethylene resin containing about 5 to 20% by weight of calcium carbonate having an average particle diameter of 0.05 to 1 탆 for improving thermal conductivity Propylene copolymer resin may include a polyethylene propylene copolymer resin containing about 10 to 15% by weight of calcium carbonate.

The thermally conductive fiber can be produced by a conventional method in the art. For example, the mixed resin obtained by mixing the homopolypropylene resin and the polyolefin resin is melted by applying heat at 210 to 250 ° C, Spinning at a spinning speed of about 90 to 110 m / min to produce an undrawn yarn, and then the unstretched yarn is stretched at a temperature of 50 to 100 DEG C to 1.2 to 3 times with a stretching roll. Next, the drawn yarn is crimped in a crimper, treated with an emulsion and opened and fixed at about 100 to 120 DEG C for 5 to 15 minutes, and then cut into an appropriate size to obtain an average fineness of 2 to 10 denier, an average fiber length of 20 to 50 mm. < / RTI >

Next, the stainless fibers improve the endothermic and heat-releasing properties of the heat-dissipating nonwoven fabric layer and additionally provide an electromagnetic wave absorbing function incidentally. The stainless steel fibers are produced by melt drawing through a nozzle in a fiber state can do. Such stainless steel fibers are minimized in corrosion and rusting due to the characteristics of stainless steel, and are produced in the form of fibers, so that they are free from bending. That is, the processability is excellent. The stainless fibers preferably have an average fineness of 4 to 20 denier, preferably 6 to 15 denier, and more preferably 6 to 12 denier. At this time, if the average fineness of the stainless steel fibers is less than 4 denier, the production is difficult. If the average fiber fineness is more than 20 denier, the workability of the thermoconductive fibers and the nonwoven fabric may be decreased. The weight per unit area of the stainless steel fiber may be 50 to 100 g / m ² , preferably 50 to 65 g / m ² .

Next, the thermally conductive inorganic filler may include at least one selected from the group consisting of carbon black, acetylene black, fine carbon, and nano-metal particles, preferably selected from carbon black, acetylene black, and fine carbon And may include one or more species.

The heat-dissipating nonwoven fabric is prepared by carding the thermally conductive fibers and the stainless fibers at a speed of 80 to 150 mpm using a card reader, preparing a nonwoven web by mixing a thermally conductive inorganic filler, and then passing the web through two hot rolls Bonded nonwoven fabric having a basis weight of 50 to 100 gsm.

Alternatively, the thermally conductive fiber and the thermally conductive inorganic filler may be uniformly dispersed in a collecting plate or a conveyor to be placed thereon, and the stainless fibers may be dispersed in the upper part of the collecting plate or the conveyor. . This is to ensure that the stainless fibers are positioned between the fibers. The nonwoven fabric having a basis weight of 50 to 100 gsm may be prepared by allowing the web to pass between the two hot rolls so that the thermoconductive fibers and the stainless fibers are well bonded.

The heat-dissipating nonwoven fabric may also be produced by a general dry method, a span bond method, a meltblown method, a stitch bond method or the like in the related art.

[Moisture absorbing nonwoven fabric layer]

Wherein the moisture absorbing nonwoven fabric layer comprises 10 to 30 parts by weight of the C-type hollow fiber and 40 to 80 parts by weight of a moisture absorbent, based on 100 parts by weight of the conjugated fiber, preferably the side-by-side type conjugated fiber, the C- More preferably, 15 to 20 parts by weight of the C-type hollow fiber and 50 to 70 parts by weight of the moisture absorbent may be contained relative to 100 parts by weight of the conjugated fiber. If the amount of the C-type hollow fiber is less than 10 parts by weight, the amount of the moisture absorber in the nonwoven fabric may be reduced. If the amount exceeds 30 parts by weight, the basis weight of the nonwoven fabric may decrease. If the amount of the moisture absorbent is less than 40 parts by weight, the moisture absorption amount of the nonwoven fabric may be insufficient. When the amount of the moisture absorbing agent is more than 80 parts by weight, The nonwoven fabric may be deteriorated because it is retained without releasing it. Therefore, the nonwoven fabric may be used within the above range.

Wherein the first component is a high-melting-point polymer resin having a melt index of 45 to 60 g / 10 min at 230 DEG C, preferably a high-melting-point polymer resin having a melt index of 45 to 55 g / 10 min . ≪ / RTI > The second component may include a low melting point polymer resin having a melt index of 35 to 45 g / 10 min at 190 캜, preferably a low melting point polymer resin having a melt index of 35 to 40 g / 10 min at 190 캜. Here, the high melting point and the low melting point are relative terms, meaning that the melting point of the low melting point polymer resin is 5 ° C or more, preferably 7 ° C or more lower than that of the high melting point polymer resin. By forming the composite fiber with the resin having the above melting point and melt index range, the bonding force between the fibers can be increased and the shape stability of the nonwoven fabric can be maintained from the moisture absorbed. The volume ratio of the first component and the second component in the composite fiber is 1: 0.3 to 0.8, preferably 1: 0.5 to 0.8, which is advantageous in terms of maintaining the proper shape. In addition, the method for producing the composite fiber may be manufactured by a general composite spinning method used in the manufacture of side-by-side composite fibers in the art.

The high melting point polymer resin is preferably a polypropylene resin. The low melting point resin may include at least one selected from a polypropylene resin, a high density polyethylene resin, a low density polyethylene resin and a linear low density polyethylene resin, preferably a high density polyethylene resin having a density of 0.940 to 0.960, Density polyethylene resin having a density of 0.950 to 0.960.

The composite fibers may have an average fineness of 4 to 15 denier and an average fiber length of 20 to 50 mm, and preferably an average fineness of 6 to 10 denier and an average fiber length of 30 to 40 mm.

Next, the C-type hollow fiber forms a proper space in the nonwoven fabric to prevent the nonwoven fabric itself from expanding due to the volume expansion due to moisture absorption, and to prevent the moisture absorbent from being fixed and bonded in the moisture- (For example, a moisture absorbent enters the C-shaped hollow fiber or a C-shaped moisture absorbent is caught and fixed).

The C-type hollow fiber preferably includes a polypropylene resin in view of an increase in bonding strength with the first component of the conjugate fiber and a bonding strength between the heat-dissipating nonwoven fabric layer and the thermally conductive fiber, and preferably, the polypropylene resin and the random copolymer resin Preferably 65 to 75% by weight of a polypropylene resin, and a remaining amount of a random copolymer resin, more preferably 65 to 70% by weight of a homopolypropylene resin, and a remaining amount of a random copolymer resin The hollow fiber of the present invention can be produced by using a mixed resin which is generally used in the art.

At this time, the polypropylene resin may be the same as or similar to the first component of the side-by-side type conjugate fiber, specifically, a polypropylene resin having a melt index of 45 to 60 g / 10 min at 230 DEG C, And a polypropylene resin having a melt index of 45 to 55 g / 10 min at 230 캜 can be used.

The random copolymer resin may include an ethylene / propylene random copolymer, an ethylene / 1-butene random copolymer or a propylene / 1-butene random copolymer, preferably a propylene / 1-butene random copolymer Is advantageous in terms of morphological stability of the C-type hollow fiber.

The C-type hollow fibers may have an average fineness of 10 to 25 denier and an average fiber length of 30 to 70 mm, preferably an average fineness of 15 to 20 denier and an average fiber length of 35 to 50 mm.

Next, the moisture absorbent may be a general moisture absorbent used in the art, preferably aluminum hydroxide particles, zeolite particles and calcium chloride particles, more preferably gibbsite-type aluminum hydroxide particles and Calcium chloride particles at a weight ratio of 1: 0.1 to 0.3. The average particle diameter of the moisture absorbent is preferably within a range of from ± 10% to ± 15% of the average fineness of the C-type hollow fiber, and preferably from 0% to -15% of the average fineness of the C-type hollow fiber.

The moisture-absorbing nonwoven fabric may be produced by a dry method, a spunbond method, a meltblown method, a stitch bond method, or the like, which are general methods in the art, using the side-by-side type conjugated fiber, the C type hollow fiber and the moisture absorbent.

The moisture-absorbing nonwoven fabric may have a basis weight of 40 to 80 gsm, and preferably 50 to 75 gsm.

The moisture-absorbing nonwoven fabric layer of the present invention may have a single-layer structure or may have a multi-layer structure of 2 to 5 layers. When the moisture absorptive nonwoven fabric layer has a multilayer structure, it is preferable to form a multilayer structure such that the moisture absorptive matter content in the moisture absorptive nonwoven fabric layer decreases as the heat absorbing nonwoven fabric layer gets closer to the heat radiation nonwoven fabric layer. For example, in the case of a three-layer structure, the moisture absorptive amount in the first layer of the moisture-absorbing nonwoven fabric directly contacting the heat-dissipating nonwoven fabric layer is 40 parts by weight, the second layer is 60 parts by weight, The moisture absorbing nonwoven fabric layer may be multilayered by varying the amount of the moisture absorbent. By varying the amount of the moisture absorber, it is possible to more effectively absorb moisture on the gas passing through the heat-dissipating nonwoven fabric layer.

The thickness of the heat dissipating nonwoven fabric layer and the moisture absorbing nonwoven fabric layer may be 1: 2 to 10, preferably 1: 4 to 8, more preferably 1: 4.5 ~ 6. The heat-dissipating nonwoven fabric and the moisture-absorbing nonwoven fabric may be integrated by using an adhesive, but it is preferable that the heat-dissipating nonwoven fabric and the moisture-absorbing nonwoven fabric are integrally formed by heat fusion or needle punching.

The nonwoven fabric for the LED lighting apparatus of the present invention is laminated with the heat dissipating nonwoven fabric layer and the moisture absorbing nonwoven fabric layer, and a microporous film may be further laminated on the moisture absorbing nonwoven fabric layer.

The circuit board of the present invention may include a laminate including the non-woven fabric for the LED lighting device between the copper foils having a thickness of 0.01 to 0.05 mm (a laminate layered in the order of a copper foil, a nonwoven fabric and a copper foil).

In addition, the circuit board of the present invention can be manufactured in the form of a copper foil clad laminate by interposing the above laminate between one metal film (or metal sheet) or two metal films and then molding by heat (metal film-copper foil- Lamination in the order of copper foil or lamination in the order of metal film, copper foil, nonwoven fabric, copper foil and metal foil).

At this time, a conductor pattern may be provided on at least one surface of the metal film of the laminate, and a circuit may be provided.

In the LED lighting device of the present invention, a single or multiple LEDs may be mounted on one surface of the circuit board, and a power feeder for emitting the LED may be provided.

The LED lighting device may be a direct-type LED lighting device or an edge-type LED lighting device.

Hereinafter, the present invention will be described in more detail with reference to examples. However, the scope of the present invention should not be construed to limit the scope of the present invention by the following examples, but the following examples are given to aid understanding of the present invention.

[ Example ]

Example  1: Manufacture of nonwoven fabric for LED lighting equipment

(1) Production of heat-radiating nonwoven fabric

A homopolypropylene resin having a melting index of 25 to 26 g / 10 min at 160 DEG C, an isotacticity index of 92% or more, and a polyethylene propylene copolymer resin containing 13 wt% of calcium carbonate having an average particle diameter of about 0.3 to 0.4 mu m Respectively.

Next, a mixed resin obtained by mixing 88.5% by weight of the homopolypropylene resin and 11.5% by weight of the polyethylene propylene copolymer resin was melted by applying heat at about 230 DEG C, and then the melted resin was melted at a spinning speed of about 100 m / To prepare an undrawn yarn, and then the undrawn yarn was stretched at a temperature of about 85 DEG C to about 2 times with a stretching roll.

Next, the drawn yarn was crimped in a crimper, treated with an emulsion, opened and fixed at about 110 DEG C for 10 minutes, and then cut to obtain an average fineness of about 6 deniers and an average fiber length of about 35 mm to prepare thermoconductive fibers Respectively.

The nonwoven web was prepared by carding the thermally conductive fiber, the stainless fiber (average fineness: 9 to 10 denier, weight per unit area: 58 g / m ² ) at a rate of 120 mpm, and incorporating carbon black as the thermally conductive inorganic filler. A calender-bonded nonwoven fabric (heat-dissipating nonwoven fabric) having a basis weight of about 88 to 90 gsm was produced by passing through two hot rolls.

The heat-dissipating nonwoven fabric thus produced contained 12 parts by weight of stainless fibers and 8 parts by weight of a thermally conductive inorganic filler, based on 100 parts by weight of the thermally conductive fibers.

(2) Absorption  Production of nonwoven fabric

Side-by-side type composite fibers (average fineness of 10 denier, average fiber length of 30 mm) having a volume ratio of the first component and the second component of 1: 0.65 to 0.70 were prepared. The first component includes a polypropylene resin having a melt index of 47 to 48 g / 10 min at 230 캜 measured according to ASTM D 1238, and the second component has a melt index at 190 캜 measured at ASTM D 1238 Density polyethylene resin having a density of 0.9515 to 0.9535, which is 39 to 40 g / 10 min.

A mixed resin containing 68 wt% of a polypropylene resin having a melt index of 47 to 48 g / 10 min at 230 캜 and 32 wt% of a propylene / 1-butene random copolymer resin was measured by ASTM D 1238 One type C hollow fiber was prepared (average fineness of about 18 deniers, average fiber length of 40 mm).

Further, a hygroscopic agent in which gibbsite-type aluminum hydroxide particles and calcium chloride particles were mixed at a weight ratio of 1: 0.25 was prepared. At this time, the average particle size of the moisture absorber was set to be 0% to -10% smaller than the average fineness of the C-type hollow fibers.

The composite fiber and the C-type hollow fiber were carded at a speed of 120 mpm, and a nonwoven web was produced by mixing the absorbent agent. Then, the web was passed between two hot rolls to obtain a calender bonding nonwoven fabric (moisture absorbing nonwoven fabric) having a basis weight of about 60 gsm .

The produced moisture-absorbing nonwoven fabric contains about 17 parts by weight of the C-type hollow fiber and about 63 parts by weight of the moisture absorbent relative to 100 parts by weight of the conjugated fiber.

(3) Manufacture of nonwoven fabrics for LED lighting equipment

The heat-dissipating nonwoven fabric and the moisture-absorbing nonwoven fabric were needle-punched and integrated to produce a nonwoven fabric for a LED lighting device having a two-layer structure. At this time, the thickness ratio of the heat dissipation nonwoven fabric layer and the moisture absorption nonwoven fabric layer was about 1: 5.7 to 5.8.

Example  2

A moisture absorptive nonwoven fabric was prepared in the same manner as in Example 1, except that a moisture absorptive nonwoven fabric having a moisture absorptive amount of 42 parts by weight was separately prepared. However, the thickness was made to be 1/2 of the thickness of the moisture-absorbing non-woven fabric of Example 1 (first layer of the moisture-absorbing non-woven fabric).

The moisture-absorbing non-woven fabric (moisture-absorbing agent content: 63 wt. Parts) of Example 1 was prepared in the same manner, but the thickness was 2/3 of the thickness of the non-woven fabric of Example 1 (second layer of moisture-absorbing nonwoven fabric).

The heat-dissipating nonwoven fabric, the first moisture-absorbing nonwoven fabric layer and the second moisture-absorbing nonwoven fabric layer of Example 1 were laminated in order, and then needle punched to produce a nonwoven fabric for an LED lighting device.

Example  2 to 8 and Comparative Example  1 to 6

A nonwoven fabric for an LED lighting device was prepared in the same manner as in Example 1, except that a heat-dissipating nonwoven fabric and / or a moisture-absorbing nonwoven fabric were prepared so as to have compositions as shown in Tables 1 and 2, Were prepared and Examples 2 to 8 and Comparative Examples 1 to 6 were carried out.

Comparative Example  7

Side nonwoven fabrics were produced in the same manner as in Example 1 except that side-by-side composite fibers having a volume ratio of the first component and the second component of 1: 0.65 to 0.70 were used as the side- (Average fineness of 10 denier, average fiber length of 30 mm) instead of the fibers (average fineness of 10 denier, average fiber length of 30 mm) was 1: 0.92 to 0.95 in terms of the volume ratio of the first component and the second component. Were used. The first component includes a polypropylene resin having a melt index of 47 to 48 g / 10 min at 230 캜 measured according to ASTM D 1238, and the second component has a melt index at 190 캜 measured at ASTM D 1238 Density polyethylene resin having a density of 0.9515 to 0.9535, which is 39 to 40 g / 10 min.

division Example One 2 3 4 5 6 7 8 radiation
Non-woven Thermoconductive fibers 100 100 100 100 100 100 100 100 Stainless fiber 12 12 15 13 12 12 12 12 Thermally conductive inorganic filler 8 8 5.3 12 8 8 8 8 Absorption
Non-woven shape First floor Second floor First floor Side by side composite fiber 100 100 100 100 100 100 100 100 C type hollow fiber 17 17 17 17 25 10 17 17 Absorbent 63 42 63 63 63 63 42 76

division Comparative Example One 2 3 4 5 6 7 radiation
Non-woven Thermoconductive fibers 100 100 100 100 100 100 100 Stainless fiber 5 22 12 12 12 12 12 Thermally conductive inorganic filler 5.3 12 8 8 8 8 8 Absorption
Non-woven Side by side composite fiber 100 100 100 100 100 100 100 C type hollow fiber 17 17 7 35 17 17 17 Absorbent 63 63 63 63 30 85 63

Manufacturing example  One

A nonwoven fabric for the LED lighting apparatus of Example 1 was mounted between two copper foils having a thickness of 0.02 mm to produce a laminate. Next, this laminate was sandwiched between two metal plates, and the temperature was 180 DEG C and the pressure was 0.3 kPa (30 kgf / m²) To obtain a copper clad clad laminate having a thickness of 1.5 mm.

Manufacturing example  2

A copper foil clad laminate was produced in the same manner as in Production Example 1 except that the nonwoven fabric for the LED lighting apparatus of Example 2 was used in place of the nonwoven fabric of Example 1.

Manufacturing example  3 to 8 and Comparative Manufacturing Example  1 to 7

A copper-clad clad laminate was produced in the same manner as in Production Example 1 except that the non-woven fabrics for LED lighting devices manufactured in Examples 3 to 8 and Comparative Examples 1 to 7 were used in place of the non-woven fabric of Example 1, , Production Examples 3 to 8 and Comparative Production Examples 1 to 7 were carried out.

Experimental Example  : Measurement of physical properties of nonwoven fabric

Thermal conductivity, heat resistance and gas phase water absorption of the copper-clad clad laminates of Production Examples 1 to 8 and Comparative Production Examples 1 to 7 were measured, and the results are shown in Table 3 below.

(1) Thermal conductivity

The density of the resultant copper clad clad laminate was measured by an in-water substitution method, the specific heat was measured by DSC (differential scanning calorimetry), and the thermal diffusivity was measured by a laser flash method.

Then, the thermal conductivity was calculated by the following formula (1).

[Formula 1]

Thermal conductivity (W / m 占 =) = density (kg / m ³ ) 占 Specific heat (kJ / kg? K) 占 thermal diffusivity (m ² / S) 占 1000

(2) Heat resistance

When the copper clad clad laminate was treated for 1 hour in a thermostatic chamber equipped with an air circulating device with a test piece set at 200 to 240 ° C, the temperature at which the copper foil and the laminate were inflated and peeled was measured. The evaluation of the oven heat resistance test is preferably at least 220 캜 for use as a substrate for mounting an LED, and less than 220 캜 may cause insufficient heat resistance.

(3) Gas phase  Moisture hygroscopicity

The copper clad laminates were allowed to stand in a closed space at 23 to 25 ° C and 90% relative humidity for 2 hours, and then the weight change of the copper clad clad laminates was measured to measure moisture adsorption on the gas phase. Production Examples 2 to 8 and Comparative Production Examples 1 to 7 were expressed as percentages based on Production Example 1 and shown in Table 3 below.

division Thermal conductivity
(W / mK) Heat resistance
(° C) Moisture hygroscopicity
(%) Production Example 1 5.2 233 100% Production Example 2 5.0 230 112.4% Production Example 3 4.7 225 98.1% Production Example 4 5.5 238 99.6% Production Example 5 5.1 232 104.3% Production Example 6 5.2 234 97.8% Production Example 7 5.2 233 96.5% Production Example 8 5.2 232 115.2% Comparative Preparation Example 1 3.3 209 100.3% Comparative Production Example 2 5.5 239 100.5% Comparative Production Example 3 5.2 235 101.1% Comparative Production Example 4 5.1 231 81.3% Comparative Preparation Example 5 5.2 233 69.5% Comparative Preparation Example 6 5.2 232 128.1% Comparative Preparation Example 7 5.2 233 98.9%

The results of measurement of the physical properties of Preparation Examples 1 to 8 are as follows: Production Examples 1 to 8 had a thermal conductivity of 4.0 W / m · K or more, excellent heat resistance, and adequate moisture hygroscopicity As shown in Fig. Particularly, in the case of Production Example 2 in which the moisture-absorbing nonwoven fabric having a two-layer structure was applied, it was confirmed that the moisture hygroscopicity greatly increased as compared with Production Example 1.

On the other hand, in Comparative Production Example 1 in which a heat-dissipating nonwoven fabric having less than 10 parts by weight of stainless fibers was applied, there was a problem that the thermal conductivity and heat resistance were significantly lowered as compared with Production Example 3. Further, in Comparative Production Example 2 in which a heat-dissipating nonwoven fabric having more than 20 parts by weight of stainless fibers was applied, there was no significant change in thermal conductivity and heat resistance in comparison with Production Example 4. [

In Comparative Production Example 3, in which a moisture absorbing nonwoven fabric having more than 30 parts by weight of C-type hollow fiber was applied, the effect of increasing the water hygroscopicity was insufficient as compared with Production Example 5. In Comparative Production Example 4, in which a moisture absorptive nonwoven fabric in which C type hollow fibers were used in an amount of less than 10 parts by weight, the water hygroscopic properties were drastically decreased as compared with Production Example 1 and Production Example 6, And it was judged that the moisture migration path space in the moisture absorptive nonwoven fabric was affected by the shortage of the moisture transport path space as compared with the production examples 1 and 6 due to the increase of the density of the moisture absorption nonwoven fabric itself.

Further, in Comparative Production Example 5 in which a moisture absorptive nonwoven fabric having a moisture absorptive amount of less than 40 parts by weight was used, there was a problem in that the moisture absorption performance dropped sharply as compared with Production Example 1 and Production Example 7, In the case of Comparative Production Example 6 in which the moisture absorption nonwoven fabric is applied, the water absorption rate is very good, but the moisture in the nonwoven fabric is excessively moist, and when applied to LED lighting devices such as automobiles, there may be a problem of nonwoven fabric deterioration due to mold or the like. In the production of the copper clad clad laminate of Comparative Production Example 6, there was a problem that the amount of the desiccant to be removed was large and the processability was poor.

In Comparative Production Example 7 to which the moisture-absorbing nonwoven fabric of Comparative Example 7 was applied, there was a problem that the shape of the nonwoven fabric was deformed at the time of measuring the moisture absorbency.

It can be seen from the above Examples and Experimental Examples that the nonwoven fabric for the LED lighting device of the present invention has excellent heat radiation properties (thermal conductivity), heat resistance and water absorbing property, and through this, Circuit board or the like, it is confirmed that the LED lighting device can prevent or minimize the lifetime of the LED due to heat and moisture.

Claims (10)

A heat-dissipating nonwoven fabric layer and a moisture-absorbing nonwoven fabric layer,
Wherein the heat dissipation nonwoven fabric layer comprises thermally conductive fibers, stainless fibers and a thermally conductive inorganic filler,
Wherein the moisture-absorbing nonwoven fabric layer comprises side-by-side type conjugated fiber, type C hollow fiber and a moisture absorbent.
The nonwoven fabric for an LED lighting device according to claim 1, wherein the heat-dissipating nonwoven fabric layer comprises 10 to 20 parts by weight of stainless fibers and 1 to 20 parts by weight of a thermally conductive inorganic filler per 100 parts by weight of the thermally conductive fibers.
The LED lighting device according to claim 1, wherein the moisture-absorbing nonwoven fabric layer comprises 10 to 30 parts by weight of the C-type hollow fiber and 40 to 80 parts by weight of a moisture absorbent, based on 100 parts by weight of the side- Non-woven.
The thermally conductive fiber according to claim 1, wherein the thermally conductive fiber of the heat-radiating nonwoven fabric layer comprises 80 to 95% by weight of a homopolypropylene resin having a melt index of 5 to 50 g / 10 minutes at 160 DEG C and 5 to 20% by weight of a polyolefin resin A nonwoven fabric for an LED lighting device.
The nonwoven fabric according to claim 1, wherein the side-by-side composite fiber first component of the moisture-absorbing nonwoven fabric layer comprises a high melting point polymer resin having a melt index of 45 to 60 g / 10 min at 230 DEG C, Is 35 to 45 g / 10 min. ≪ / RTI >
The LED lighting device according to claim 1, wherein the C-type hollow fiber comprises a mixed resin of a homopolypropylene resin and an? -Olefin random copolymer resin having a melt index of 5 to 50 g / 10 min at 160 ° C. Nonwoven for apparatus.
The nonwoven fabric for an LED lighting apparatus according to claim 1, wherein the moisture-absorbing nonwoven fabric layer has a multilayer structure of two to five layers, and the moisture absorbent content in the moisture-absorbing nonwoven fabric layer is reduced as the layer is closer to the heat-dissipating nonwoven fabric layer.
A circuit board for an LED lighting device comprising a nonwoven fabric for an LED lighting device according to any one of claims 1 to 7.
An LED lighting device according to claim 8, wherein an LED is mounted on one surface of the circuit board.
10. The LED lighting device according to claim 9, wherein the LED lighting device is an outdoor or indoor lighting device of an automobile.