KR101912836B1 - Apparatus for rotating semiconductor wafer carrier - Google Patents

Apparatus for rotating semiconductor wafer carrier Download PDF

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KR101912836B1
KR101912836B1 KR1020160173873A KR20160173873A KR101912836B1 KR 101912836 B1 KR101912836 B1 KR 101912836B1 KR 1020160173873 A KR1020160173873 A KR 1020160173873A KR 20160173873 A KR20160173873 A KR 20160173873A KR 101912836 B1 KR101912836 B1 KR 101912836B1
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wafer carrier
lift block
holder
rotating
moving
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KR1020160173873A
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Korean (ko)
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KR20180071082A (en
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윤통섭
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비전세미콘(주)
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H01L21/67787—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks with angular orientation of the workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

본 발명은 반도체 웨이퍼가 보관된 웨이퍼 캐리어를 자동으로 회전시킬 수 있는 반도체 웨이퍼 캐리어 회전장치에 관한 것이다.
본 발명은 웨이퍼 캐리어(C)가 안착되는 안착부재(110)와, 상기 안착부재의 좌우 양측에 각각 위치하는 승강부재(120)와, 상기 승강부재에 설치되어 안착부재에 안착된 웨이퍼 캐리어를 홀딩하는 홀더(130)와, 상기 홀더를 회전시키는 회전부재(140)와, 상기 승강부재를 안착부재측으로 접근시키는 수평이동부재(150)를 포함하며;
상기 승강부재가 수직지지대(121)와, 상기 수직지지대에 설치된 수직이동유닛(122)과, 상기 수직이동유닛을 따라 승강하는 제1승강블록(123)을 구비하고;
상기 회전부재가 상기 제1승강블록에 일측이 고정된 상태로 상기 제1승강블록을 따라 승강하는 제2승강블록(141)과, 회전축이 웨이퍼 캐리어의 측면을 향하도록 상기 제2승강블록에 설치된 모터(142)를 구비하며;
상기 홀더가 모터의 회전축에 결합된 반도체 웨이퍼 캐리어 회전장치를 제공한다.The present invention relates to a semiconductor wafer carrier rotating apparatus capable of automatically rotating a wafer carrier in which a semiconductor wafer is stored.
The present invention relates to an apparatus and a method for holding a wafer carrier (C) on which a wafer carrier (C) is mounted, a lift member (120) A rotary member 140 for rotating the holder, and a horizontal moving member 150 for moving the elevating member toward the seating member side;
The elevating member includes a vertical support 121, a vertical movement unit 122 installed on the vertical support, and a first lift block 123 moving along the vertical movement unit;
A second lift block (141) for raising and lowering the rotary member along the first lift block with one side fixed to the first lift block, and a second lift block (141) installed on the second lift block A motor 142;
And the holder is coupled to the rotation shaft of the motor.

Description

반도체 웨이퍼 캐리어 회전장치{Apparatus for rotating semiconductor wafer carrier}[0001] The present invention relates to a semiconductor wafer carrier rotating apparatus,

본 발명은 반도체 웨이퍼가 보관된 웨이퍼 캐리어를 자동으로 회전시킬 수 있는 반도체 웨이퍼 캐리어 회전장치에 관한 것이다.The present invention relates to a semiconductor wafer carrier rotating apparatus capable of automatically rotating a wafer carrier in which a semiconductor wafer is stored.

일반적으로, 반도체 소자 제조 공정은 웨이퍼를 대상으로 사진, 식각, 확산, 증착 및 금속 공정 등의 다양하게 이루어지는 단위 공정을 반복적으로 수행하여 이루어진다. 각 단위 공정에서는 웨이퍼를 다수 적재된 웨이퍼 캐리어를 이용하여 웨이퍼를 이동하거나 상기 웨이퍼 캐리어 상태로 각 공정에 투입한다.2. Description of the Related Art In general, a semiconductor device manufacturing process is performed by repeatedly performing a variety of unit processes such as photolithography, etching, diffusion, deposition, and metal processing on a wafer. In each unit process, the wafer is moved using the wafer carrier loaded with a plurality of wafers, or the wafers are put into each process in the wafer carrier state.

상기 웨이퍼 캐리어는 전면 개방 운반 용기(FOSB, Front Opening Shipping Box)와 전면 개방 일체식 포드(FOUP, Front Open Unified Pod)가 제조되어 사용되고 있다.The wafer carrier is manufactured using a front opening shipping box (FOSB) and a front open unified pod (FOUP).

상기 FOUP은 주로 직접 생산 프로세스에 투입되는 데에 사용된다. 상기 FOUP에는 다수의 웨이퍼가 수평하게 적재되며, 상기 웨이퍼는 상기 FOUP의 도어를 통하여 출입한다.The FOUP is mainly used for direct input into the production process. In the FOUP, a plurality of wafers are loaded horizontally, and the wafers are transferred through the door of the FOUP.

상기 FOSB는 주로 웨이퍼를 보관하거나 이동시키는 쉬핑(Shipping) 용도로 이용된다. 상기 FOSB는 상기 FOUP과 유사한 구조를 가지며, 도어를 통해 상기 웨이퍼가 출입한다.The FOSB is mainly used for shipping to store or move wafers. The FOSB has a structure similar to that of the FOUP, and the wafer enters and exits through a door.

이와 같이 웨이퍼는 각 단위 공정으로 투입되기 전 FOSB 및 FOUP와 같은 웨이퍼 캐리어 내에서 안전하게 보관된 상태로 대기하게 되며 로봇 또는 AGV(Automatic Guide Vehicle)나 LGV(Laser Guide Vehicle)와 같은 무인운반차를 통해 각 단위 공정으로 투입된다.In this way, the wafers are stored safely in the wafer carriers such as FOSB and FOUP before they are put into each unit process, and they are stored in the unmanned transportation vehicles such as robot or AGV (Automatic Guide Vehicle) or LGV It is injected into each unit process.

이때, 웨이퍼 캐리어 내에 보관 중인 웨이퍼는 미세 먼지를 비롯한 작업장 내의 각종 파티클(particle)이 웨이퍼 면에 내려앉는 것을 방지하도록 수직으로 세워진 상태로 보관되는 반면 각 단위 공정에서는 웨이퍼가 수평상태로 놓여진 상태에서 대부분의 작업이 수행되기 때문에, 상기 웨이퍼 캐리어는 로봇 또는 무인운반차를 통해 각 단위 공정으로 이송된 후 로딩되기 전에 내부에 보관된 웨이퍼가 수평상태가 되도록 90°로 회전되어야 한다.At this time, the wafers stored in the wafer carrier are vertically erected so as to prevent various particles in the workplace including fine dust from sinking on the wafer surface. In each unit process, most of the wafers The wafer carrier must be rotated through 90 ° so that the wafer stored in the wafer carrier is transferred to each unit process through the robot or the automated guided vehicle before being loaded.

그러나, 상기와 같이 웨이퍼 캐리어를 회전시키는 작업은 작업자를 통해 수동으로 수행되고 있다.However, as described above, the operation of rotating the wafer carrier is manually performed through the operator.

따라서, 작업성이 매우 불량함은 물론 작업속도와 생산성이 크게 떨어지고 웨이퍼 캐리어를 회전시키는 과정에서 작업자의 실수로 웨이퍼를 바닥으로 쏟거나 웨이퍼 캐리어를 바닥에 떨어뜨리는 사고가 종종 발생하는 문제가 있다.Therefore, there is a problem that the workability is very poor, work speed and productivity are greatly reduced, and an accident occurs in which the operator accidentally pours the wafer to the floor or drops the wafer carrier to the floor in the process of rotating the wafer carrier.

본 발명은 상기한 문제점들을 해결하기 위해 안출된 것으로서, 웨이퍼 캐리어를 회전시키는 작업이 자동으로 수행되는 반도체 웨이퍼 캐리어 회전장치를 제공하는데 그 목적이 있다.It is an object of the present invention to provide a semiconductor wafer carrier rotating apparatus in which the operation of rotating the wafer carrier is automatically performed.

상기 목적을 달성하기 위해, 본 발명의 반도체 웨이퍼 캐리어 회전장치는 웨이퍼 캐리어가 안착되는 안착부재와, 상기 안착부재의 좌우 양측에 각각 위치하는 승강부재와, 상기 승강부재에 설치되어 안착부재에 안착된 웨이퍼 캐리어를 홀딩하는 홀더와, 상기 홀더를 회전시키는 회전부재와, 상기 승강부재를 안착부재측으로 접근시키는 수평이동부재를 포함하며; 상기 승강부재가 수직지지대와, 상기 수직지지대에 설치된 수직이동유닛과, 상기 수직이동유닛을 따라 승강하는 제1승강블록을 구비하고; 상기 회전부재가 상기 제1승강블록에 일측이 고정된 상태로 상기 제1승강블록을 따라 승강하는 제2승강블록과, 회전축이 웨이퍼 캐리어의 측면을 향하도록 상기 제2승강블록에 설치된 모터를 구비하며; 상기 홀더가 모터의 회전축에 결합된 것을 특징으로 한다.In order to achieve the above object, a semiconductor wafer carrier rotating apparatus of the present invention comprises: a seating member on which a wafer carrier is seated; an elevating member disposed on both left and right sides of the seating member; A holder for holding the wafer carrier; a rotating member for rotating the holder; and a horizontal moving member for moving the elevating member toward the seating member side; Wherein the elevating member includes a vertical support unit, a vertical movement unit installed on the vertical support unit, and a first lift block moving up and down along the vertical movement unit; A second lift block for moving the rotary member along the first lift block with one side fixed to the first lift block and a motor provided on the second lift block such that the rotary shaft faces the side of the wafer carrier ; And the holder is coupled to the rotation shaft of the motor.

삭제delete

한편, 상기 홀더는 모터의 회전축과 결합되는 본체와, 상기 안착부재에 안착된 웨이퍼 캐리어의 측면에 밀착되도록 상기 본체로부터 돌출된 복수의 밀착단으로 구성되는 것이 바람직하다.The holder may include a main body coupled to a rotation shaft of the motor, and a plurality of closely contacting ends protruding from the main body so as to be in close contact with a side surface of the wafer carrier mounted on the mounting member.

상기와 같이 구성된 본 발명은 웨이퍼 캐리어가 안착되는 안착부재의 좌우 양측에 각각 승강 및 접근 그리고 회전이 가능한 홀더가 구비되어 있기 때문에 상기 웨이퍼 캐리어의 회전이 홀더를 통해 견고하게 홀딩된 상태에서 매우 안정적으로 이루어지게 되므로, 종래와 같이 작업자가 수작업을 통해 웨이퍼 캐리어를 회전시키지 않아도 작업성과 작업속도 그리고 생산성이 크게 향상됨은 물론 웨이퍼가 바닥으로 쏟아지거나 웨이퍼 캐리어가 바닥에 떨어지는 사고가 전혀 발생되지 않는 효과가 있다.In the present invention constructed as described above, since the holders capable of lifting, approaching and rotating can be respectively provided on the left and right sides of the seating member on which the wafer carrier is seated, the rotation of the wafer carrier can be stably held The work efficiency, the work speed, and the productivity are greatly improved, and the wafer carrier is not poured to the floor and the wafer carrier is not accidentally dropped on the floor even if the worker does not rotate the wafer carrier manually as in the conventional art .

도 1은 본 발명에 따른 반도체 웨이퍼 캐리어 회전장치의 사시도.
도 2는 도 1의 정면도.
도 3은 도 2의 Ⅲ-Ⅲ선 단면도.
도 4 내지 도 9는 각각 본 발명의 사용상태를 순서대로 나타내는 도면.1 is a perspective view of a semiconductor wafer carrier rotating apparatus according to the present invention;
Figure 2 is a front view of Figure 1;
3 is a sectional view taken along the line III-III in Fig.
Figs. 4 to 9 are views showing the use states of the present invention in order; Fig.

본 발명의 특징 및 이점들은 첨부도면에 의거한 다음의 바람직한 실시예에 대한 상세한 설명으로 더욱 명백해질 것이다. 이에 앞서, 본 명세서 및 청구범위에 사용된 용어나 단어는 발명자가 그 자신의 발명을 가장 최선의 방법으로 설명하기 위해 용어의 개념을 적절하게 정의할 수 있다는 원칙에 입각하여 본 발명의 기술적 사상에 부합하는 의미와 개념으로 해석되어야만 한다.The features and advantages of the present invention will become more apparent from the following detailed description of preferred embodiments with reference to the accompanying drawings. Prior to this, terms and words used in the present specification and claims are to be interpreted in accordance with the technical idea of the present invention based on the principle that the inventor can properly define the concept of the term in order to explain his invention in the best way. It must be interpreted in terms of meaning and concept.

이하, 본 발명의 일 실시예를 도면을 참조하여 상세히 설명함에 있어, 동일한 구성에 대해서는 동일한 부호를 사용하며, 명료성을 위하여 가능한 중복되지 않게 상이한 부분만을 주로 설명한다.Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings. The same reference numerals are used for the same components, and only the different portions are described for the sake of clarity.

도 1 내지 도 3에 도시된 바와 같이, 본 발명은 웨이퍼 캐리어(C)가 안착되는 안착부재(110)와, 상기 안착부재(110)의 좌우 양측에 각각 위치하는 승강부재(120)와, 상기 승강부재(120)에 설치되어 안착부재(110)에 안착된 웨이퍼 캐리어(C)를 홀딩하는 홀더(130)와, 상기 홀더(130)를 회전시키는 회전부재(140)와, 상기 승강부재(120)를 안착부재(110)측으로 접근시키는 수평이동부재(150)로 구성된다.1 to 3, the present invention includes a seating member 110 on which a wafer carrier C is seated, a lifting member 120 positioned on both left and right sides of the seating member 110, A holder 130 installed on the elevating member 120 to hold the wafer carrier C mounted on the seating member 110, a rotary member 140 rotating the holder 130, To the seat member 110 side.

상기 안착부재(110)는 수평베이스(B)의 중앙에 형성된다. 상기 안착부재(110) 웨이퍼 캐리어(C)가 수평상태로 놓여지는 수평면으로서, 웨이퍼 캐리어(C)가 안착된 상태를 안정적으로 유지할 수 있도록 웨이퍼 캐리어(C)의 저면과 후면(회전된 웨이퍼 캐리어(C)의 저면)을 지지하는 복수의 걸림돌기(111)들이 형성되어 있다. 이 경우, 도시하지는 않았으나 웨이퍼 캐리어(C)의 저면과 후면에는 각각 상기 걸림돌기(111)들에 대응되는 걸림홈들이 형성될 수 있다.The seating member 110 is formed at the center of the horizontal base B. A horizontal plane on which the wafer carrier C is placed in a horizontal state so that the position of the wafer carrier C can be stably maintained. C) are formed on the bottom surface of the base plate 111. [ In this case, although not shown, latch grooves corresponding to the latch protrusions 111 may be formed on the bottom surface and the rear surface of the wafer carrier C, respectively.

한편, 상기 걸림돌기(111)는 웨이퍼의 직경에 따라 각기 다른 크기로 제작되는 FOSB 및 FOUP들을 포함하는 다양한 종류의 웨이퍼 캐리어(C)들에 대한 걸림이 이루어지도록 적절한 위치와 개수로 형성되는 것이 바람직하다.It is preferable that the locking protrusions 111 are formed at appropriate positions and numbers so as to be engaged with various kinds of wafer carriers C including FOSBs and FOUPs manufactured to have different sizes according to the diameter of the wafers Do.

상기 안착부재(110)의 좌우 양측에는 승강부재(120)가 위치한다. 상기 승강부재(120)는 수평베이스(B) 상에 설치된 수직지지대(121)와, 상기 수직지지대(121)에 수직으로 설치된 수직이동유닛(122)과, 상기 수직이동유닛(122)을 따라 승강하는 제1승강블록(123)으로 구성된다.The lift member 120 is positioned on both left and right sides of the seating member 110. The elevation member 120 includes a vertical support 121 installed on a horizontal base B, a vertical movement unit 122 vertically installed on the vertical support 121, And a first elevating block 123 for controlling the elevation.

상기 승강부재(120)는 제1승강블록(123)의 보다 안정적인 승강을 위하여 수직지지대(121)에 설치되는 수직안내레일(124)을 더 구비할 수 있다. 이 경우, 상기 제1승강블록(123)은 수직안내레일(124)을 따라 이동가능하게 연결된다.The elevating member 120 may further include a vertical guide rail 124 installed on the vertical support 121 for more stable elevation of the first elevating block 123. In this case, the first lift block 123 is movably connected along the vertical guide rail 124.

아울러, 상기 승강부재(120)는 제1승강블록(123)의 보다 안정적인 승강을 위하여 수직지지대(121)에 설치되는 적어도 수직안내봉(125)을 더 구비할 수도 있다. 이 경우, 상기 제1승강블록(123)은 수직안내봉(125)을 따라 이동가능하게 연결된다.In addition, the elevating member 120 may further include at least a vertical guide bar 125 installed on the vertical support 121 for more stable elevation of the first elevating block 123. In this case, the first lift block 123 is movably connected along the vertical guide bar 125.

본 실시예에서는 상기 수직이동유닛(122)이 볼스크류인 것을 예를 들어 도시하였으나 반드시 이에 국한될 필요 없고 엘엠가이드나 실린더부재 등도 가능하다.Although the vertical movement unit 122 is a ball screw in the present embodiment, the vertical movement unit 122 is not limited to this, and may be an electromagnet guide or a cylinder member.

한편, 상기 승강부재(120)에는 안착부재(110)에 안착된 웨이퍼 캐리어(C)를 홀딩하는 홀더(130)와, 상기 홀더(130)를 회전시키는 회전부재(140)가 설치된다.The lifting member 120 is provided with a holder 130 for holding the wafer carrier C mounted on the seating member 110 and a rotating member 140 for rotating the holder 130.

상기 회전부재(140)는 제1승강블록(123)에 일측이 고정되어 상기 제1승강블록(123)을 따라 승강하는 제2승강블록(141)과, 회전축이 웨이퍼 캐리어(C)의 측면을 향하도록 상기 제2승강블록(141)에 설치된 모터(142)로 구성된다.The rotary member 140 includes a second lift block 141 having one side fixed to the first lift block 123 and moving up and down along the first lift block 123, And a motor 142 installed in the second lift block 141 to face the first lift block 141.

그리고 상기 홀더(130)는 모터(142)의 회전축과 결합되는 본체(131)와, 상기 안착부재(110)에 안착된 웨이퍼 캐리어(C)의 측면에 밀착되도록 상기 본체(131)로부터 돌출된 복수의 밀착단(132)을 가진다. 상기 밀착단(132)에는 슬립방지 및 충격완충용 패드가 부착되는 것이 바람직하다.The holder 130 includes a main body 131 coupled to the rotation shaft of the motor 142 and a plurality of projections 132 projecting from the main body 131 so as to be in close contact with the side surface of the wafer carrier C mounted on the seating member 110. [ (Not shown). Preferably, a pad for slip prevention and impact buffering is attached to the close end 132.

한편, 수평베이스(B)에는 상기 승강부재(120)를 안착부재(110)측으로 접근시키는 수평이동부재(150)가 설치된다. 본 실시예에서는 상기 수평이동부재(150)가 볼스크류인 것을 예를 들어 도시하였으나 반드시 이에 국한될 필요 없고 엘엠가이드나 실린더부재 등도 가능하다.On the other hand, the horizontal base B is provided with a horizontal moving member 150 for moving the elevating member 120 toward the seating member 110 side. Although the horizontally moving member 150 is a ball screw in the present embodiment, the horizontal moving member 150 is not limited thereto, and may be an electromagnet guide or a cylinder member.

상기 수평이동부재(150)는 전후방향으로 나란하게 수평베이스(B)의 좌우방향으로 설치된 한 쌍의 이송레일(151)을 구비하는 것이 바람직하다. 이 경우, 상기 승강부재(120)의 수직지지대(121)는 안착부재(110)측으로의 접근이 안정적으로 이루어지도록 이송레일(151)에 결합된다.The horizontal moving member 150 preferably includes a pair of conveying rails 151 arranged in the left-right direction of the horizontal base B in the front-rear direction. In this case, the vertical support 121 of the elevating member 120 is coupled to the conveying rail 151 so that the approach to the seating member 110 can be stably performed.

이와 같이 구성된 본 발명의 반도체 웨이퍼 캐리어 회전장치는 다음과 같이 동작된다.The semiconductor wafer carrier rotating apparatus of the present invention constructed as above operates as follows.

도 4에 도시된 바와 같이 웨이퍼 캐리어(C)가 로봇(미도시) 또는 AGV(Automatic Guide Vehicle)나 LGV(Laser Guide Vehicle)와 같은 무인운반차(미도시)를 통해 안착부재(110)의 상면에 안착된다.4, the wafer carrier C is mounted on the upper surface of the seating member 110 through a robot (not shown) or an unmanned conveyance vehicle (not shown) such as an AGV (Automatic Guide Vehicle) or an LGV (Laser Guide Vehicle) Respectively.

안착부재(110)의 상면에 안착된 웨이퍼 캐리어(C)는 안착부재(110)의 상면에 돌출된 걸림돌기(111)에 의해 지지되면서 안착상태가 안정적으로 유지된다. 이때, 웨이퍼 캐리어(C) 내부의 웨이퍼는 수직상태로 보관된 상태이다.The wafer carrier C mounted on the upper surface of the seating member 110 is supported by the locking protrusions 111 protruding from the upper surface of the seating member 110 and the seating state is stably maintained. At this time, the wafer inside the wafer carrier C is kept in a vertical state.

안착부재(110)의 상면에 웨이퍼 캐리어(C)의 안착이 완료되면, 수평이동부재(150)가 동작하면서 안착부재(110)의 양측에 위치된 수직지지대(121)들이 안착부재(110)측으로 접근한다. 수직지지대(121)들은 동일한 수평이동부재(150)를 통해 구동되므로 안착부재(110)측을 향해 동시에 동일거리를 이동하게 된다. 이때, 상기 수평이동부재(150)는 안착된 웨이퍼 캐리어(C)의 정보를 미리 전달받아 웨이퍼 캐리어(C)의 종류별로 미리 입력된 거리만큼만 수직지지대(121)를 이동시킨다.When the wafer carrier C is placed on the upper surface of the seating member 110, the horizontal moving member 150 is operated and vertical supports 121 positioned on both sides of the seating member 110 are moved toward the seating member 110 Approach. Since the vertical supports 121 are driven through the same horizontal moving member 150, they move at the same distance toward the seating member 110 side at the same time. At this time, the horizontal moving member 150 receives information of the wafer carrier C placed in advance, and moves the vertical support 121 only by a distance previously inputted for each type of the wafer carrier C.

수직지지대(121)가 안착부재(110)측으로 접근함에 따라 수직지지대(121)에 설치된 홀더(130) 역시 웨이퍼 캐리어(C)의 측면으로 접근하게 되며, 수평이동부재(150)의 동작이 정지되면 홀더(130)의 밀착단(132)들이 웨이퍼 캐리어(C)의 측면에 밀착된 상태가 된다.The holder 130 provided on the vertical support 121 also approaches the side of the wafer carrier C as the vertical support 121 approaches the seating member 110. When the operation of the horizontal moving member 150 is stopped The fastening ends 132 of the holder 130 are brought into close contact with the side surface of the wafer carrier C. [

도 5에 도시된 바와 같이, 홀더(130)의 밀착단(132)들이 웨이퍼 캐리어(C)의 측면에 밀착되면, 웨이퍼 캐리어(C)는 상기 홀더(130)에 의하여 양측면이 견고하게 홀딩된 상태가 되며, 승강부재(120)의 수직이동유닛(122)이 동작한다.5, when the close ends 132 of the holder 130 are brought into close contact with the side surface of the wafer carrier C, the wafer carrier C is held by the holder 130 in a state where both sides are firmly held by the holder 130 And the vertical movement unit 122 of the lifting member 120 operates.

수직이동유닛(122)이 동작함에 따라 제1승강블록(123)은 상승하기 시작한다. 제1승강블록(123)이 상승하면 제1승강블록(123)에 결합된 홀더(130)가 제1승강블록(123)을 따라 동반상승하게 된다. 이때, 상기 수직이동유닛(122)은 안착부재(110)에 안착된 웨이퍼 캐리어(C)의 정보를 미리 전달받아 웨이퍼 캐리어(C)의 종류별로 미리 입력된 거리만큼만 제1승강블록(123)을 상승시킨다. 따라서, 웨이퍼 캐리어(C)는 제1승강블록(123)이 상승한 만큼 안착부재(110)로부터 이격된다.As the vertical movement unit 122 operates, the first lift block 123 starts to rise. When the first elevating block 123 is elevated, the holder 130 coupled to the first elevating block 123 ascends along the first elevating block 123. At this time, the vertical movement unit 122 receives the information of the wafer carrier C that is seated on the seating member 110 in advance, and transmits the information of the wafer carrier C to the first lift block 123 . Therefore, the wafer carrier C is spaced apart from the seating member 110 as the first lift block 123 rises.

도 6에 도시된 바와 같이, 웨이퍼 캐리어(C)가 일정거리 안착부재(110)로부터 이격되면 수직이동유닛(122)의 동작이 정지되고 회전부재(140)가 작동을 개시한다. 상기 모터(142)는 웨이퍼 캐리어(C)의 전면이 상부를 향하도록 상기 홀더(130)를 90°만큼 회전시킨다. 이때, 웨이퍼 캐리어(C)는 안착부재(110)로부터 소정거리 이격된 상태이므로 안착부재(110)와 간섭되지 않고 원활하게 회전된다. 상기 웨이퍼 캐리어(C)는 홀더(130)를 통해 견고하게 홀딩된 상태에서 매우 안정적이고 정확하게 회전된다.As shown in FIG. 6, when the wafer carrier C is separated from the fixed distance seating member 110, the operation of the vertical movement unit 122 is stopped and the rotary member 140 starts operating. The motor 142 rotates the holder 130 by 90 degrees such that the front surface of the wafer carrier C faces upward. At this time, since the wafer carrier C is spaced from the seating member 110 by a predetermined distance, the wafer carrier C smoothly rotates without interference with the seating member 110. The wafer carrier C rotates very steadily and accurately in a firmly held state through the holder 130. [

도 7에 도시된 바와 같이, 웨이퍼 캐리어(C)의 회전이 완료되면, 웨이퍼 캐리어(C)의 내부에 보관된 웨이퍼(W)들은 수평상태가 되며, 승강부재(120)가 동작되면서 제1승강블록(123)이 하강하게 된다. 이때, 회전된 웨이퍼 캐리어(C)는 회전 전에 비하여 안착부재(110)와의 이격거리가 달라지므로 상기 수직이동유닛(122)에는 웨이퍼 캐리어(C)의 종류별로 하강거리가 미리 입력되어 있다. 상기 수직이동유닛(122)은 미리 입력된 거리만큼 제1승강블록(123)을 하강시킨다.7, when the rotation of the wafer carrier C is completed, the wafers W stored in the wafer carrier C are in a horizontal state, and when the elevation member 120 is operated, The block 123 is lowered. At this time, since the distance of the rotated wafer carrier C is different from that of the seat member 110 before rotation, the falling distance of each type of the wafer carrier C is previously input to the vertical movement unit 122. The vertical movement unit 122 moves down the first lift block 123 by a previously inputted distance.

도 8에 도시된 바와 같이, 제1승강블록(123)의 하강이 완료되면, 웨이퍼 캐리어(C)가 안착부재(110)의 상면에 안착됨과 함께 안착부재(110)의 상면에 형성된 걸림돌기(111)를 통해 안착된 상태가 안정적으로 유지된다.8, when the lowering of the first lift block 123 is completed, the wafer carrier C is seated on the upper surface of the seating member 110, and the wafer carrier C is mounted on the upper surface of the seating member 110 111) is stably maintained.

아울러, 수평이동부재(150)가 동작하면서 수직지지대(121)는 원위치로 복귀한다. 수직지지대(121)가 원위치로 복귀함에 따라서 웨이퍼 캐리어(C)에 대한 홀더(130)의 홀딩상태는 해제된다.In addition, while the horizontal moving member 150 is operated, the vertical support 121 returns to its original position. As the vertical support 121 returns to its original position, the holding state of the holder 130 with respect to the wafer carrier C is released.

도 9에 도시된 바와 같이, 수직지지대(121)의 복귀가 완료된 이후 안착부재(110)의 회전된 상태로 안착된 웨이퍼 캐리어(C)는 로봇(미도시) 또는 무인운반차(미도시)를 통해 각 단위 공정으로 투입된다.9, after the return of the vertical support 121 is completed, the wafer carrier C, which is seated in the rotated state of the seating member 110, is rotated by a robot (not shown) or an unmanned conveyor (not shown) To be fed into each unit process.

이와 같이, 도면을 참조하여 본 발명의 바람직한 실시예에 대해 상술하였으나 본 발명은 전술한 실시예에 한정되지 않으며, 본 발명이 속하는 기술분야에서 통상의 지식을 가진자가 본 발명의 사상을 벗어나지 않고 변형 가능하며, 이러한 변형은 본 발명의 권리범위에 속할 것이다.While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be takeners of ordinary skill in the art, And such variations are within the scope of the present invention.

110...안착부재 120...승강부재
121...수직지지대 122...수직이동유닛
123...제1승강블록 130...홀더
131...본체 132...밀착단
140...회전부재 141...제2승강블록
142...모터 150...수평이동부재
C...웨이퍼 캐리어110 ... seat member 120 ... lifting member
121 ... vertical support 122 ... vertical movement unit
123 ... First lift block 130 ... Holder
131 ... main body 132 ... tight contact end
140 ... rotating member 141 ... second lift block
142 ... motor 150 ... horizontally moving member
C ... wafer carrier

Claims (3)

웨이퍼 캐리어가 안착되는 안착부재와, 상기 안착부재의 좌우 양측에 각각 위치하는 승강부재와, 상기 승강부재에 설치되어 안착부재에 안착된 웨이퍼 캐리어를 홀딩하는 홀더와, 상기 홀더를 회전시키는 회전부재와, 상기 승강부재를 안착부재측으로 접근시키는 수평이동부재를 포함하며;
상기 승강부재가 수직지지대와, 상기 수직지지대에 설치된 수직이동유닛과, 상기 수직이동유닛을 따라 승강하는 제1승강블록을 구비하고;
상기 회전부재가 상기 제1승강블록에 일측이 고정된 상태로 상기 제1승강블록을 따라 승강하는 제2승강블록과, 회전축이 웨이퍼 캐리어의 측면을 향하도록 상기 제2승강블록에 설치된 모터를 구비하며;
상기 홀더가 모터의 회전축에 결합된 것을 특징으로 하는 반도체 웨이퍼 캐리어 회전장치.A holder for holding a wafer carrier mounted on the elevating member and holding the wafer carrier; a rotating member for rotating the holder; and a holding member for holding the wafer carrier, And a horizontal moving member for moving the elevating member toward the seating member side;
Wherein the elevating member includes a vertical support unit, a vertical movement unit installed on the vertical support unit, and a first lift block moving up and down along the vertical movement unit;
A second lift block for moving the rotary member along the first lift block with one side fixed to the first lift block and a motor provided on the second lift block such that the rotary shaft faces the side of the wafer carrier ;
And the holder is coupled to the rotation shaft of the motor. 삭제delete 제 1항에 있어서,
상기 홀더는 모터의 회전축과 결합되는 본체와, 상기 안착부재에 안착된 웨이퍼 캐리어의 측면에 밀착되도록 상기 본체로부터 돌출된 복수의 밀착단으로 구성된 것을 특징으로 하는 반도체 웨이퍼 캐리어 회전장치.The method according to claim 1,
Wherein the holder comprises a main body coupled to a rotation shaft of the motor and a plurality of closely contacting ends protruding from the main body so as to be in close contact with a side surface of the wafer carrier seated on the seating member.
KR1020160173873A 2016-12-19 2016-12-19 Apparatus for rotating semiconductor wafer carrier KR101912836B1 (en)

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Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101213538B1 (en) * 2011-06-28 2012-12-24 (주) 씨앤아이테크놀로지 A cassete for loading display pannels, rotating apparatus having the same and driving method thereof

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101213538B1 (en) * 2011-06-28 2012-12-24 (주) 씨앤아이테크놀로지 A cassete for loading display pannels, rotating apparatus having the same and driving method thereof

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