KR101910144B1 - Substrate laminate, electronic device having the substrate laminate and method of manufacturing the same - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate laminate, an electronic device including the same, and a method of manufacturing the same.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a substrate laminate, an electronic device including the substrate laminate, and a method of manufacturing the substrate laminate.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate laminate, an electronic device including the same, and a method of manufacturing the same.

The organic light emitting device OLED typically comprises two electrodes and one or more organic layers positioned between the electrodes.

When a voltage is applied between the first electrode and the second electrode, holes from the first electrode and electrons from the second electrode flow into the organic material layer, respectively, in the organic light emitting device having such a structure, excitons, which emit photons corresponding to energy differences as they fall back to the ground state.

According to such a principle, the organic light emitting element generates visible light, and an information display element or an illumination element can be manufactured using the same.

Generally, the organic light emitting device can be manufactured by depositing a first electrode on a substrate, depositing one or more organic layers, and then depositing a second electrode. Therefore, in order to emit light generated in the organic layer, the electrode in a direction to emit light must be transparent. In order to emit light toward the first electrode, not only the first electrode but also the substrate must be transparent.

In a general organic light emitting device, only a part of the light emitted from the light emitting layer in the organic layer comes out into the air because the refractive index of the light emitting layer is about 1.8, which is larger than 1.0, which is the refractive index of air. Due to the difference in refractive index, light trapped in the organic layer having a refractive index of 1.8 is called a wave guide mode, light confined in a glass substrate (refractive index: about 1.5) having a refractive index lower than that of an organic substance, "He says.

Korean Patent Laid-Open Publication No. 10-2010-0125135

The present specification is intended to provide a substrate laminate, an electronic device including the same, and a method of manufacturing the same.

The present disclosure includes: 1) forming an inorganic film on a mold having a pattern; And 2) coating the curable resin composition on the inorganic film and curing the substrate to form a substrate.

The present invention also relates to a method of manufacturing an electronic device including forming an organic light emitting portion in which a first electrode, at least one organic material layer and a second electrode are sequentially laminated on a substrate laminate manufactured according to the method of manufacturing the substrate laminate, ≪ / RTI >

The present invention also provides an electronic device manufactured according to the method for manufacturing the electronic device.

According to another aspect of the present invention, there is provided a semiconductor device comprising: a substrate; And an inorganic film provided on one surface of the substrate provided with the pattern.

The present disclosure also relates to a mold having a pattern on one side; A substrate provided on the mold having the pattern; And an inorganic film provided between the mold and the substrate.

Further, the present specification relates to the substrate laminate; And an organic light emitting portion in which a first electrode, at least one organic material layer, and a second electrode are sequentially stacked on the other surface of the substrate stack.

Further, the present specification provides a display device including the electronic device.

Further, the present specification provides a lighting apparatus including the electronic device.

The substrate laminate according to one embodiment of the present invention may have a lens integrally formed on one surface thereof and can be light extracted by a simple process.

The substrate laminate according to one embodiment of the present invention has an advantage of minimizing the loss of light caused by the refractive index difference between the substrate and air.

1 is a flowchart of a method of manufacturing an electronic device according to an embodiment of the present invention.
2 is an optical microphotograph of a substrate stack according to one embodiment of the present disclosure;
3 is a cross-sectional view of a mold having a pattern according to one embodiment of the present disclosure;

Hereinafter, the present invention will be described in detail.

The present disclosure includes: 1) forming an inorganic film on a mold having a pattern; And

2) coating the curable resin composition on the inorganic film and curing the substrate to form a substrate.

In one embodiment of the present disclosure, prior to step 1), preparing a mold having a pattern may be included.

The method for producing the mold having the pattern can be formed by a general method in the art. For example, the mold may be formed by extrusion molding in a mold, by etching a pattern by photolithography, or by a printing method such as inkjet or roll printing, but is not limited thereto.

The material of the mold is not particularly limited as long as it can maintain the shape of the pattern. For example, metals such as iron, aluminum, nickel, copper and the like; Elastic materials such as polyurethane, siloxane resin, polydimethylsiloxane (PDMS) and the like; Or plastics such as PET, PS, PP, and the like.

The pattern may be a relief pattern or a relief pattern, and the pattern may have a regular pattern or an irregular relief pattern.

The shape of the pattern is not particularly limited as long as the shape of the pattern is capable of extracting light. For example, the pattern may be irregular irregularities, or may be a convex lens or concave lens-shaped pattern.

At this time, the detailed form is not limited as long as the pattern formed by the pattern of the mold can function as a lens to collect or disperse light. For example, the lens may be a lenticular lens having a semi-circular cross-sectional shape or a prismatic lens having a triangular cross-sectional shape. Specifically, it may be a lenticular lens as shown in 1) or 2) shown in FIG. 3, or a prism lens having a triangular sectional shape.

The pattern of the mold may be a spaced or continuous pattern between each pattern. Specifically, a continuous pattern, more specifically, a continuous convex lens or a concave lens-shaped pattern.

When the pattern of the mold is a lenticular lens having a semi-circular cross-sectional shape, the diameter of the semicircle may be 1 nm or more and 1 mm or less. If necessary, it may be 1 nm or more and 100 μm or less.

In this specification, the pattern may be a concavo-convex having a height difference. Concretely, irregularities having irregular height differences as shown by 4 in FIG. 3 may be used.

When the curable resin composition to be described later is directly coated on the mold having the pattern, dewetting may occur due to a difference in surface energy between the mold and the curable resin composition, which may make coating difficult.

At this time, dewetting refers to a state in which the coated surface is not smooth, but is corroded into a lump of irregular or irregular shape.

Also, when the curable resin composition to be described later is directly coated on the mold having the pattern and cured, it may be difficult to separate the cured substrate from the mold depending on the material of the mold. For example, when the material of the mold is nickel, it is difficult to separate the substrate from the mold.

On the other hand, it is possible to increase the surface energy of the surface to which the curable resin composition is connected by forming an inorganic film on the mold having the pattern.

The surface energy of the inorganic film was 50 erg / cm < ² > More than 80 erg / cm ² ≪ / RTI >

One surface of the inorganic film is in contact with the pattern of the mold, the other surface of the inorganic film is in contact with the substrate, and the surface of the inorganic film in contact with the pattern of the mold and the opposite surface thereof all have a pattern corresponding to the pattern of the mold. That is, even if an inorganic film is formed on the mold, the surface on which the inorganic film is formed retains the pattern of the mold.

When the curable resin composition is coated on the inorganic film, dewetting does not occur, coating is uniformly performed, and the cured resin composition can be easily separated from the mold.

In the step 1), the inorganic film may be formed by a method such as a sputtering method, a wet coating method, or a chemical vapor deposition method.

In the step 1), the inorganic film may be produced using an oxide or nitride of Si. Specifically, SiO ₂ , SiN, SiO _x N _y and the like can be used, and SiO ₂ is preferable.

The thickness of the inorganic film may be 1 nm or more and 100 nm or less. In this case, the surface energy can be controlled so that dewetting does not occur while the curable resin composition is coated, without deforming the shape of the pattern of the mold.

The composition of the curable resin composition is not particularly limited as long as it does not have a problem in using as a substrate laminate after curing after coating on an inorganic film having a pattern.

For example, the curable resin composition may be a polyacrylate, a polypropylene (PP), a polyethylene terephthalate (PET), a polyethylene ether phthalate, a polyethylene phthalate, Polybutylene phthalate, polyethylene naphthalate (PEN), polycarbonate (PC), polystyrene (PS), polyether imide, polyether sulfone, And may include at least one of polydimethylsiloxane (PDMS), polyetheretherketone (PEEK), polyimide (PI), and polyamic acid (PAA)

The curable resin composition may be coated to a thickness of 10 nm or more and 10 cm or less based on protrusions on which the pattern protrudes in the mold.

The method of curing the curable resin composition is not particularly limited as long as the composition can be cured, but it may include a step of pre-baking to evaporate the solvent in the curable resin composition and a step of post-baking to cure the curable resin composition have.

The conditions of the prebaking may be 20 to 60 minutes or less at a temperature of 80 to 120 DEG C, and the postbake conditions may be 20 to 60 minutes at 200 to 350 DEG C can do.

One surface of the formed substrate is flat and the other surface is formed with a pattern corresponding to the pattern of the mold. The pattern is formed to be capable of extracting light, and its shape is not limited. For example, the pattern may be a convex lens or a concave lens.

The lens may be a lenticular lens having a semi-circular cross-sectional shape or a prism lens having a triangular cross-sectional shape.

The pattern of the substrate can be a pattern with a gap or a continuous pattern between each pattern. Specifically, a continuous pattern, more specifically, a continuous convex lens or a concave lens-shaped pattern.

When the pattern of the substrate is a lenticular lens having a semi-circular cross-sectional shape, the diameter of the semicircle may be 1 nm or more and 1 mm or less. If necessary, it may be 1 nm or more and 100 占 퐉 or less.

One side of the substrate laminate manufactured according to the manufacturing method of the present invention is flat, the other side has a pattern, and the substrate and the pattern are integrally manufactured without a separate process for forming a pattern on the substrate. In this case, it is possible to manufacture a substrate having a pattern without a separate process for forming a pattern on the substrate, which is advantageous in that the process is simple and the cost is reduced.

The pattern on the substrate can perform a light extracting function, and light in a glass mode trapped in the substrate among light generated in the electronic device can be extracted to the outside.

The substrate may be transparent or opaque, but is preferably transparent.

The light transmittance of the substrate may be 50% or more and, if necessary, 80% or more.

The light extractability of the substrate may be 80% or more.

According to one embodiment of the present disclosure, the method may further include forming a barrier layer on the substrate after the step 2). Specifically, the method may further include forming a barrier layer on a surface of the substrate where no pattern is formed.

The barrier layer is a layer for preventing penetration from oxygen, moisture and the like. If the barrier layer is capable of doing so, the method of forming the barrier layer and the material are not limited. For example, the barrier layer may be formed by depositing a metal or a metal oxide by ALD (Atomic Layer Deposition).

In the atomic layer deposition method, vapor of a metal film or a precursor of a metal oxide film is absorbed on a substrate in which an inorganic film is formed in a vacuum chamber. At this time, the precursor chemically reacts with the reactive group in the inorganic film formed on the substrate. Subsequently, the reaction product is introduced into the chamber under the condition promoting the reaction with the precursor adsorbed on the substrate to form a desired metal film or metal oxide film.

When the metal film or the metal oxide film is multi-layered, the step of exposing the substrate to the vapor of the precursor and the step of reacting the precursor absorbed in the substrate with the reactant may be repeated at least twice. When a multilayer metal film or a metal oxide film is repeatedly formed as described above, the respective layers may be formed of the same material or different materials.

The growth by the atomic layer deposition method is in contrast to the growth by a physical vapor deposition (PVD) method such as a general chemical vapor deposition (CVD) method, a vacuum deposition method, a sputtering method, and an ion plating method. Specifically, the growth by the chemical vapor deposition method and the physical vapor deposition method starts and proceeds at a limited number of nucleation sites on the surface of the substrate, so that a columnar microstructure having a boundary line between the columns is formed, Can happen. On the other hand, the atomic layer deposition method can produce a very thin film adhering to the surface of the substrate without gaps, and thus can have extremely low gas permeability.

The present disclosure includes: 1) forming an inorganic film on a mold having a pattern;

2) coating the curable resin composition on the inorganic film and curing to form a substrate; And

3) forming an organic light emitting portion in which a first electrode, at least one organic material layer, and a second electrode are sequentially stacked on the substrate.

Here, the description of the mold, the inorganic film, the thermosetting resin and the substrate overlapping with the method of producing the substrate laminate is the same.

The method of forming the first electrode, the at least one organic material layer, and the second electrode is not particularly limited and may be manufactured by a technique commonly used in the art.

A metal oxide or a metal oxide having conductivity or an alloy thereof is deposited on the substrate stack by using a physical vapor deposition (PVD) method such as sputtering or e-beam evaporation, And an organic material layer including a hole injecting layer, a hole transporting layer, a light emitting layer and an electron transporting layer is formed thereon by a solution coating method such as a vacuum evaporation method, spin coating, dip coating, inkjet printing, screen printing, spraying or roll coating And thereafter depositing a material usable as a second electrode thereon.

The material of the first electrode, the organic material layer, and the second electrode is not particularly limited, and materials commonly used in the art can be used.

And forming a sealing portion covering the outside of the organic light emitting portion.

If the sealing portion covers the outside of the organic light emitting portion and the organic light emitting portion can be sealed, the sealing method and material are not particularly limited.

For example, it can be pressed by a sealing film, vapor-deposited with a metal or a metal oxide, or coated and cured by sealing the resin composition.

In one embodiment of the present specification, the method may further include the step of installing a mold having a pattern on the carrier substrate before the step (1).

In one embodiment of the present invention, the step of separating the carrier substrate after the step (3) may further comprise separating the carrier substrate. At this time, the method of separating the carrier substrate can use a method known in the art such as a knife, a laser, etc., and can be easily separated even with a knife.

In one embodiment of the present invention, the method further includes the step of removing the mold having the pattern after the formation of the sealing portion covering the outside of the organic light emitting portion after the organic light emitting portion is formed on the substrate laminate .

When the mold having the pattern is removed from the substrate, the inorganic film located between the substrate and the mold may be separated from the substrate with the mold or an inorganic film may remain on the substrate depending on the affinity between the substrate and the mold. At this time, if the inorganic layer remains on the substrate after removing the mold having the pattern from the substrate, the inorganic layer may function as a barrier layer to block moisture, oxygen, and the like.

In one embodiment of the present invention, after forming the sealing portion covering the outside of the organic light emitting portion after forming the organic light emitting portion on the substrate stack, the mold provided on the carrier substrate is removed from the substrate together with the carrier substrate Step < / RTI >

In one embodiment of the present invention, the method may further include forming a sealing portion covering the outside of the organic light emitting portion before removing the carrier substrate.

The material is not particularly limited as long as the sealing portion covers the outside of the organic light emitting portion and can seal the organic light emitting portion. For example, it can be pressed by a sealing film, vapor-deposited with a metal or a metal oxide, or coated and cured by sealing the resin composition.

In one embodiment of the present disclosure, the seal may be deposited by atomic layer deposition of a metal or metal oxide.

In one embodiment of the present disclosure, the sealing portion may be a metal layer or a metal oxide layer of two or more layers formed by atomic layer deposition.

In one embodiment of the present disclosure, the sealing portion seals at least the outside of the organic light emitting portion, and may seal the outside of the organic light emitting portion as well as the exposed portion of the substrate stacked body.

In one embodiment of the present disclosure, there is provided a method of manufacturing a semiconductor device, comprising: floating a substrate laminate on which an organic light emitting portion is formed from a ground using a fin after a carrier substrate is separated; And forming a metal layer or a metal oxide layer on the outer side of the organic light emitting portion and the outer side of the substrate stacked body by atomic layer deposition and sealing.

At this time, the outer side of the substrate stack includes a portion where the organic light emitting portion is not formed, a surface opposite to the surface where the organic light emitting portion is formed, and a side face. Specifically, the outside of the organic light emitting portion and the outside of the substrate laminate mean the front surface of the electronic device.

As shown in Fig. 1, the method includes the steps of: a) preparing a mold having a pattern; b) forming an inorganic film of SiO ₂ by a sputtering method on the mold; c) coating a polyamic acid on the inorganic film and then curing to form a substrate; d) sequentially stacking an organic light emitting portion on the substrate, the organic light emitting portion, the first electrode, the organic material layer, and the second electrode; e) forming a sealing portion covering the outside of the organic light emitting portion; And f) removing the mold from the substrate.

The present invention provides an electronic device manufactured according to the method of manufacturing the substrate laminate.

According to an embodiment of the present invention, there is provided a substrate laminate in which a pattern is integrally provided on one surface.

In this case, the fact that the pattern is integrally formed on one surface means that the pattern is formed on one surface of the substrate at the time of manufacturing the substrate, so that the material of the substrate and the pattern are the same and there is no interface between the substrate and the pattern.

The pattern may be a convex lens or a concave lens.

And an inorganic film provided on one surface of the substrate having the pattern thereon.

According to another embodiment of the present invention, there is provided a semiconductor device comprising: a substrate; And

And an inorganic film provided on one surface of the substrate provided with the pattern.

The inorganic film may be provided on a part of one surface of the substrate provided with the pattern, or may be provided on the entire surface.

The pattern may be a convex lens or a concave lens.

In yet another embodiment of the present disclosure, a mold having a pattern on one side;

A substrate provided on the mold having the pattern; And

And an inorganic film provided between the mold and the substrate.

The pattern may be a relief pattern or a relief pattern, and the pattern may have a regular pattern or an irregular relief pattern.

The shape of the pattern is not particularly limited as long as the shape of the pattern is capable of extracting light. For example, the pattern may be irregular irregularities, or may be a convex lens or concave lens-shaped pattern.

The shape of the lens is not limited as long as it can function to collect or disperse light. For example, the lens may be a lenticular lens having a semi-circular cross-sectional shape or a prismatic lens having a triangular cross-sectional shape.

The lens may be spaced or continuous in the form of a lens between each lens. It may be a pattern of a continuous lens shape.

When the lens has a shape of a lenticular lens having a semicircular cross-sectional shape, the diameter of the semicircle may be 1 nm or more and 1 mm or less. If necessary, it may be 1 nm or more and 100 μm or less.

As shown in FIG. 2, when the lens is in the form of a lenticular lens having a semi-circular cross-sectional shape, it can be manufactured as shown in the photograph of the optical microscope.

In this specification, the pattern may be a concavo-convex having a height difference.

One surface of the inorganic film is in contact with the pattern of the mold, the other surface of the inorganic film is in contact with the substrate, and the surface of the inorganic film in contact with the pattern of the mold and the opposite surface thereof all have a pattern corresponding to the pattern of the mold.

The inorganic film may include an oxide or nitride of Si. Specifically, SiO ₂ , SiN, SiO _x N _y and the like can be used, and SiO ₂ is preferable.

The thickness of the inorganic film may be 1 nm or more and 100 nm or less. In this case, the shape of the pattern is maintained even after the deposition of the inorganic film by the pattern of the mold.

The substrate laminate or substrate may be formed of a material selected from the group consisting of polyacrylate, polypropylene (PP), polyethylene terephthalate (PET), polyethylene ether phthalate, polyethylene phthalate, Polybutylene phthalate, polyethylene naphthalate (PEN), polycarbonate (PC), polystyrene (PS), polyether imide, polyether sulfone, polydimethyl A material selected from the group consisting of polydimethyl siloxane (PDMS), polyether etherketone (PEEK), polyimide (PI), and combinations thereof.

In this specification, the substrate may be a stack of two or more substrates on one side of which a pattern is integrally formed.

According to an embodiment of the present invention, the substrate laminate may have a water vapor transmission rate of 10 ^-1 g / m ² Day or less, specifically 10 ^-3 g / m ² Day or less, specifically 10 ^-5 g / m ² Day or less. In this case, the organic light emitting portion provided on the substrate stack body described later can be protected from moisture.

According to one embodiment of the present disclosure, the light transmittance of the substrate laminate may be 50% or more, specifically 80% or more. In this case, even when the substrate laminate is applied to a substrate of an electronic device through which light should pass, there is an advantage that light can be transmitted.

A substrate laminate according to the present invention; And

And an organic light emitting portion in which a first electrode, at least one organic material layer, and a second electrode are sequentially stacked on the other surface of the substrate stacked body.

As used herein, " substrate laminate " includes at least a substrate, and may further include a functional layer formed on at least one of the one side and the other side of the substrate. The functional layer may be an inner barrier layer, an outer barrier layer, a light extraction layer, a flat layer, an adhesive layer, or the like.

The first electrode may be an anode or a cathode, and the second electrode may be an anode or a cathode, as opposed to the first electrode. That is, when the first electrode is an anode, the second electrode is a cathode, and when the first electrode is a cathode, the second electrode may be an anode.

When the voltage is applied between the two electrodes, holes are injected in the anode, electrons are injected into the organic layer in the anode, and electrons are injected into the organic layer when the injected holes and electrons meet each other An exciton is formed, and light is emitted when the exciton falls back to the ground state.

The organic material layer may have a multi-layer structure composed of different materials in order to improve the efficiency and stability of the organic electronic device. For example, the organic material layer may include a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer.

The materials of the anode, cathode, and organic layer are not particularly limited as long as they can function as an anode, a cathode, and an organic layer, respectively. Materials commonly used in the art can be used.

In the present specification, the expression " sequentially " means a sequence in which the first electrode, the organic layer, and the second electrode are relatively formed on the substrate.

In this specification, the first electrode and the organic layer are in contact with each other, the organic layer is in contact with the second electrode, or the organic layer is in contact with at least one of the substrate and the first electrode, between the first electrode and the organic layer, An intermediate electrode, or the like may be added.

And a sealing part covering the outside of the organic light emitting part.

The material is not particularly limited as long as the sealing portion covers the outside of the organic light emitting portion and can seal the organic light emitting portion.

For example, it can be pressed by a sealing film, vapor-deposited with a metal or a metal oxide, or coated and cured by sealing the resin composition.

In one embodiment of the present disclosure, the seal may be formed by depositing a metal or a metal oxide by atomic layer deposition.

In one embodiment of the present disclosure, the sealing portion may be a metal layer or a metal oxide layer of two or more layers formed by atomic layer deposition.

In one embodiment of the present disclosure, the sealing portion seals at least the outside of the organic light emitting portion, and may seal the outside of the organic light emitting portion as well as the exposed portion of the substrate stacked body.

In one embodiment of the present invention, there is provided a method of manufacturing a light emitting device, comprising: floating a substrate laminate formed with an organic light emitting portion from a ground using a fin after forming an organic light emitting portion or after separating a carrier substrate; And forming a metal layer or a metal oxide layer on the outer side of the organic light emitting portion and the outer side of the substrate stacked body by atomic layer deposition and sealing.

At this time, the outer side of the substrate stack includes a portion where the organic light emitting portion is not formed, a surface opposite to the surface where the organic light emitting portion is formed, and a side face.

And a light extracting layer between the substrate stack and the first electrode.

In this specification, the light extracting layer is not particularly limited as long as it can induce light scattering and improve light extraction efficiency of the device. In one embodiment, the light extracting layer may be a structure in which scattering particles are dispersed in the binder. In another embodiment, the light extracting layer may be a structure for scattering light by a projection structure such as a plurality of lenses or the like.

The light extracting layer may be formed directly by a method such as spin coating, bar coating or slit coating, or may be formed in a film form.

In this specification, the light extracting layer may further include a flat layer provided on the light extracting layer.

Examples of the electronic device include, but are not limited to, an organic light emitting device, an organic solar cell, an organic photoconductor (OPC), and an organic transistor.

In this specification, the steps of forming a substrate laminate by forming an inorganic film and a substrate on a mold having the pattern formed thereon; And a step of sequentially forming at least one of the barrier layer, the light extracting layer and the organic light emitting portion on the substrate laminate is a plate-to-plate process or a roll-to-plate process Alternatively, a roll-to-roll process may be used. Particularly, since the present invention can manufacture an electronic device by using a roll-to-roll process, there is a feature that the process cost can be reduced.

In one embodiment of the present invention, the electronic device may be an organic light emitting device.

The electronic device may be a flexible organic light emitting device. In this case, the substrate stack includes a flexible material. For example, a substrate of glass, plastic or film type in the form of a thin film which can be bent can be used.

The material of the plastic substrate is not particularly limited, but may be selected from the group consisting of polyacrylate, polypropylene (PP), polyethylene terephthalate (PET), polyethylene ether phthalate, polyethylene phthalate ), Polybuthylene phthalate, polyethylene naphthalate (PEN), polycarbonate (PC), polystyrene (PS), polyether imide, polyether sulfone ), Polydimethyl siloxane (PDMS), polyether etherketone (PEEK), polyimide (PI), and combinations thereof. The plastic substrate may be used in the form of a single layer or a multilayer.

Further, the present specification provides a display device including the electronic device.

The display device includes a backlight unit and a pixel portion, and the electronic device may be included in at least one of the backlight unit and the pixel portion.

Further, the present specification provides a lighting apparatus including the electronic device.

The illumination device may be a white illumination device or a colored illumination device. At this time, according to the required illumination color, the emission color of the electronic device of the present specification can be adjusted and included in the illumination device.

Claims (32)

1) forming an inorganic film on a mold having a pattern, the face contacting the pattern of the mold and the opposite face thereof having a pattern corresponding to the pattern of the mold; And
2) coating the curable resin composition on the inorganic film and then curing to form a substrate having a flat surface on one side and a pattern corresponding to the pattern on the other side and the pattern and the substrate being integrally formed; Gt; The method according to claim 1, wherein one side of the inorganic film is in contact with the pattern of the mold, and the other side of the inorganic film is in contact with the substrate. The method according to claim 1, wherein the curable resin composition is selected from the group consisting of polyacrylate, polypropylene (PP), polyethylene terephthalate (PET), polyethylene ether phthalate, But are not limited to, polyethylene phthalate, polybuthylene phthalate, polyethylene naphthalate (PEN), polycarbonate (PC), polystyrene (PS), polyether imide, poly Wherein the substrate laminate comprises at least one of polyether sulfone, polydimethyl siloxane (PDMS), polyether etherketone (PEEK), polyimide (PI), and combinations thereof. ≪ / RTI > The method of claim 1, comprising preparing a mold having a pattern using polydimethylsiloxane (PDMS) prior to step 1). The method according to claim 1, wherein the pattern is a convex lens or a concave lens-like pattern. The method according to claim 5, wherein the lens is a lenticular lens having a semicircular cross-sectional shape or a prismatic lens having a triangular cross-sectional shape. The method according to claim 1, wherein in the step (1), the inorganic film is formed by a sputtering method, a wet coating method, or a chemical vapor deposition method. The method according to claim 1, wherein in the step (1), the inorganic film is made of an oxide or nitride of Si. The method according to claim 1, wherein the inorganic film has a thickness of 1 nm or more and 100 nm or less. 2. The method of claim 1, further comprising forming a barrier layer on the substrate after step (2). The method according to claim 1, wherein the surface energy of the inorganic film is not less than 50 erg / cm ^{2 and not} more than 80 erg / cm ² . A method of manufacturing an electronic device, comprising: forming an organic light emitting portion in which a first electrode, at least one organic material layer, and a second electrode are sequentially laminated on a substrate laminate manufactured according to any one of claims 1 to 11. The method of manufacturing an electronic device according to claim 12, further comprising the step of forming a sealing portion covering the outside of the organic light emitting portion. 13. The method of manufacturing an electronic device according to claim 12, further comprising the step of removing the mold having the pattern from the substrate after forming the organic light emitting portion on the substrate laminate. An electronic device manufactured according to the manufacturing method of claim 12. delete delete delete A mold having a pattern on one side;
A substrate having a pattern on one side and a pattern on the other side corresponding to the pattern of the mold, the pattern being integrated with the substrate; And
And an inorganic film provided between the mold and the substrate, the face being in contact with the pattern of the mold, and the opposite face thereof all having a pattern corresponding to the pattern of the mold. 21. The substrate stack of claim 19, wherein the pattern is a convex lens or a concave lens. 21. The substrate stack of claim 20, wherein the lens is a lenticular lens having a semicircular cross-sectional shape or a prismatic lens having a triangular cross-sectional shape. The substrate laminate according to claim 19, wherein one side of the inorganic film is in contact with the pattern of the mold and the other side of the inorganic film is in contact with the substrate. 21. The substrate laminate according to claim 19, wherein the inorganic film comprises an oxide or nitride of Si. The substrate laminate according to claim 19, wherein the inorganic film has a thickness of 1 nm or more and 100 nm or less. 21. The method of claim 19, wherein the substrate is selected from the group consisting of polyacrylate, polypropylene (PP), polyethylene terephthalate (PET), polyethylene ether phthalate, polyethylene phthalate, poly Polybutylene phthalate, polyethylene naphthalate (PEN), polycarbonate (PC), polystyrene (PS), polyether imide, polyether sulfone, poly Wherein the substrate laminate comprises at least one of a polydimethyl siloxane (PDMS), a polyetheretherketone (PEEK), a polyimide (PI), and a combination thereof. The substrate stack of claim 19; And
And an organic light emitting portion in which a first electrode, at least one organic material layer, and a second electrode are sequentially stacked on the other surface of the substrate stack. 27. The electronic device of claim 26, further comprising a light extraction layer between the substrate stack and the first electrode. 29. The electronic device of claim 27, further comprising a planarizing layer disposed on the light extracting layer. 27. The electronic device of claim 26, wherein the electronic device is an organic light emitting device. 27. The electronic device of claim 26, wherein the electronic device is a flexible organic light emitting device. A display device comprising an electronic device according to claim 26. A lighting device comprising the electronic device of claim 26.

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