KR101903408B1 - Solar cell module, method for manufacturing the solar cell module - Google Patents

Abstract

The present invention provides a printed circuit board having a first surface and a second surface facing each other in opposite directions and having an electrode connection portion on the first surface and a circuit wiring electrically connected to the electrode connection portion on the second surface, A circuit board; At least one solar cell mounted on the first surface and electrically connected to the electrode connection portion; And an electronic component mounted on the printed circuit board and electrically connected to the circuit wiring, wherein the electronic component includes an electric device configured to be driven by electric power generated in the solar cell, and an electric device configured to control electric power generated in the solar cell And the second surface is mounted on the second surface.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a solar cell module,

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a solar cell module that is formed to produce power using light and a method of manufacturing the same.

Solar cells are formed to convert light energy into electrical energy. Generally, a solar cell is composed of a P-type semiconductor and an N-type semiconductor, and when the light is shined, the charge moves and a potential difference is generated.

A solar cell module refers to a module that is equipped with a solar cell and is configured to produce power from light. A module means a unit such as a machine or a system, and refers to an independent apparatus assembled with various electronic parts or mechanical parts and having a specific function. Therefore, it can be understood that the solar cell module is an independent device having a function of producing a power from light by having a solar cell.

A small solar cell module used as a driving power source for electronic components typically has a printed circuit board, a solar cell, a protection layer formed on the front surface of the solar cell, and a sealing layer formed between the solar cell and the protection layer . At least one solar cell is mounted on a printed circuit board and electrically connected to the electrode connection portion of the printed circuit board, and the solar cell is sealed by the protective layer and the sealing layer.

When a solar cell module is used in an electronic device, it is possible to use an indoor light supplied from a fluorescent lamp or an LED without using a separate power cable to the electronic device, or 2) Can be driven. Therefore, in comparison with a conventional electronic device in which a separate power cable must be connected, there is no limitation on the installation place of the electronic device having the solar cell module.

However, despite these advantages, there are some problems to be improved in the conventional solar cell module.

First, component mounting must be done manually. Since the conventional solar cell module has a weak structure, it has not been possible to apply high temperature surface mounting technology (SMT) in the process of manufacturing the solar cell module or in another process using the solar cell module. Instead, the conventional solar cell module is designed to mount parts by hand, which makes it very difficult to ensure the reliability of the process and the operation speed is also very slow.

Next, conventional solar cell modules do not have sufficient light transmittance. Since the solar cell module generates electric power by using the light incident on the solar cell, high light transmittance is an essential precondition for improving the efficiency of the solar cell module. However, conventional solar cell modules have limitations in improving the light transmittance.

Accordingly, there is a need for a new approach to the structure and manufacturing method of the solar cell module to solve such a conventional problem.

A first object of the present invention is to propose a solar cell module in which components can be automatically mounted. The present invention is to propose a solar cell module having a sealing layer that is not melted or deformed even in a process using high temperature surface mounting technology.

A second object of the present invention is to provide a sealing layer having a higher light transmittance than the laminated structure of the polymer protective layer and the EVA sealing layer, and a solar cell module forming the outermost layer with the sealing layer.

A third object of the present invention is to propose a method of manufacturing a solar cell module having the sealing layer mentioned in the first and second objects and a method of manufacturing an electronic device having the solar cell module.

A fourth object of the present invention is to provide a sensor module that can utilize both sides of a printed circuit board for mounting a solar cell or the like, and circuit components, and a manufacturing method thereof, as an example of a solar cell module.

The solar cell module of the present invention includes a sealing layer formed of a material containing a silicon material. The encapsulating layer is formed to cover the solar cell or the primer layer to protect the solar cell. Silicone materials are made to have sufficient heat resistance even in processes using high temperature surface mounting technology up to 250 ° C. The primer layer is formed between the solar cell and the encapsulation layer to enhance the bonding strength between the solar cell and the encapsulation layer.

The solar cell module includes a solar cell mounted on a printed circuit board and the sealing layer. The solar cell module may optionally include a dam layer forming the rim of the encapsulant layer. The dam layer is bonded to one surface of the printed circuit board. The dam layer is for preventing the liquid seal layer material from flowing out of the printed circuit board in the process of manufacturing the solar cell module.

The liquid sealing layer raw material may include not only silicone but also a curing agent for curing liquid silicone and a UV blocking agent for protecting the solar cell from ultraviolet rays.

The encapsulant layer has high light transmittance at all wavelengths. The sealing layer has a light transmittance of 80% or more with respect to light having a wavelength of 300 nm, a light transmittance of 91 to 93% with respect to light having a wavelength of 350 nm, and a light transmittance of 93 to 94 % Light transmittance. The sealing layer also has a light transmittance of 91 to 94% with respect to visible light.

The sealing layer may have a thickness of 200 to 1,000 占 퐉 in order to protect the solar cell and have a sufficient light transmittance. The shape of the encapsulating layer may be plane, irregular or dome-shaped.

A method of manufacturing a solar cell module of the present invention includes a step of heat curing a liquid sealing layer material made of a material containing silicon by dispensing. The manufacturing method of the electronic device can be divided into two embodiments according to the viscosity of the sealing layer material.

The manufacturing method of the first embodiment includes: preparing a printed circuit board having an electrode connection portion; The method comprising the steps of: forming a dam layer on one surface of a printed circuit board and mounting at least one solar cell; Dispensing the encapsulating layer raw material to cover the solar cell with a liquid encapsulating layer raw material comprising a material containing silicon; Thermally curing the encapsulating layer raw material to form an encapsulating layer; And cutting the solar cell module aggregate formed by the preparing step and the thermosetting step to a unit size of the solar cell module.

In the first embodiment, the liquid sealing layer raw material has a viscosity of 10 Pa · s or less so as to have sufficient spreadability.

The manufacturing method of the second embodiment includes: preparing a printed circuit board having an electrode connection portion; Mounting at least one solar cell on one side of the printed circuit board; Dispensing the encapsulating layer raw material to cover the solar cell with a liquid encapsulating layer raw material comprising a material containing silicon; Thermally curing the encapsulating layer raw material to form an encapsulating layer; And cutting the solar cell module aggregate formed by the preparing step and the heat exchanging step to a unit size of the solar cell module.

In the second embodiment, the liquid sealing layer raw material has a viscosity of 40 Pa · s or less so as not to flow to the outside of the printed circuit board.

The conditions for thermally curing the encapsulating layer raw material may vary depending on the type of silicon contained in the encapsulating layer raw material. Heat is applied to the encapsulating layer raw material for about 30 to 150 minutes at about 130 to 170 to cure the encapsulating layer raw material to form an encapsulating layer.

Since the solar cell module thus manufactured does not melt or deform the sealing layer even in a process of applying surface mounting technology for mounting components by applying heat at a high temperature in a furnace, . In this case, the temperature applied to the solar cell module in the process using surface mounting technology is 200 ~ 250 ℃.

The present invention utilizes both sides of a printed circuit board for mounting parts, so that a solar cell or the like is laminated on a first surface of a printed circuit board, and circuit components are mounted on a second surface. Accordingly, the integrated sensor module can be implemented. The first surface and the second surface are opposite to each other, an electrode connection portion is formed on the first surface, and a circuit wiring is formed on the second surface. The solar cell and the sealing layer are mounted on the first surface, and the sensor portion and the circuit component are mounted on the second surface.

A solar cell which is arranged to face the first surface in a direction in which light is supplied, a solar cell which needs to receive light is mounted on the first surface, and a circuit component which does not need to receive light is mounted on the second surface.

The printed circuit board may be formed in a multilayer structure, and the circuit wiring of the printed circuit board includes an inner wiring layer formed inside the multilayer structure and an outer wiring layer formed on the outer surface. The inner layer wiring and the outer layer wiring are connected to each other through the multilayer structure, and are also connected to the electrode connection portion of the first surface.

The sensor portion may be selectively mounted on the first or second side of the main printed circuit board depending on whether it needs to be exposed to light or an external environment. The infrared sensor, the ultrasonic sensor and the illuminance sensor are mounted on the first surface since they must be exposed to light or an external environment. The temperature sensor, the humidity sensor and the gas sensor are mounted on the second side since they do not need to be exposed to light or an external environment.

The battery is coupled to the second surface and electrically connected to the circuit wiring, and is configured to store the power produced by the solar cell.

The printed circuit board can be protected by a case and a window. A coupling portion may be formed in the case, and the coupling portion is configured to fix the printed circuit board to the inside of the case.

According to the present invention having the above-described structure, since it includes a sealing layer formed of a material containing silicon, it has sufficient heat resistance even in a process using surface mounting technology. Therefore, even if the solar cell module of the present invention is mounted on the main printed circuit board by the process of applying the high temperature surface mounting technology together with the circuit components, the fusion or deformation of the sealing layer can be prevented from occurring.

Further, since the encapsulating layer of the present invention has higher light transmittance than the laminated structure of the polymer protective layer and the EVA encapsulating layer in all the light wavelength regions, it is possible to improve the light amount of light incident on the solar cell and improve the efficiency of the solar cell .

The present invention also provides a method of forming a sealing layer using 1) a dam layer and a low viscosity sealing layer raw material, or 2) using a high viscosity sealing layer raw material without a dam layer, A solar cell module applicable to the surface mounting technology of the present invention can be manufactured. In addition, the solar cell module thus manufactured can be mounted on the main printed circuit board of an electronic device such as a sensor module through surface mounting technology without melting or deforming.

When a sealing layer is formed of a material containing silicon, both sides of the printed circuit board can be used for mounting solar cells and circuit parts, respectively. Accordingly, a solar cell or the like may be mounted on the first surface of the printed circuit board, and an integrated sensor module may be formed by mounting circuit components on the second surface.

This is an unexpected effect in a solar cell module having a polymer protective layer and an EVA encapsulating layer, and is an advantageous effect as a result of replacing the polymer protective layer and the EVA encapsulating layer with the silicone encapsulating layer of the present invention.

1A and 1B are perspective views of the solar cell module of the present invention viewed from different directions.
2 is a sectional view showing the solar cell module of the first embodiment.
3 is a sectional view of a solar cell module showing a modification of the first embodiment.
4 is a sectional view of a solar cell module showing another modification of the first embodiment.
5 is a sectional view showing the solar cell module of the second embodiment.
6 is a cross-sectional view of a solar cell module according to a modification of the second embodiment.
7 is a cross-sectional view of a solar cell module according to another modification of the second embodiment.
8 is a graph showing the light transmittance of the sealing layer formed of a material containing silicon according to the wavelength.
FIG. 9 is a sequence showing a process of manufacturing the solar cell module of the first embodiment.
FIGS. 10A to 10G are conceptual diagrams showing a process of manufacturing a solar cell module according to the manufacturing method of the solar cell module shown in FIG.
11A to 11H are cross-sectional views illustrating a process of manufacturing a solar cell module according to a manufacturing method of the solar cell module shown in FIG.
12 is a flowchart showing a process of manufacturing the solar cell module according to the second embodiment.
13A to 13E are conceptual diagrams showing a process of manufacturing a solar cell module according to the manufacturing method of the solar cell module shown in FIG.
14A to 14F are cross-sectional views illustrating a process of manufacturing a solar cell module according to a manufacturing method of the solar cell module shown in FIG.
15 is a flowchart showing a manufacturing method of an electronic apparatus having a solar cell module.
16A and 16B are perspective views of a first embodiment of an integrated sensor module having a solar cell and circuit components viewed from different directions.
17 is a cross-sectional view of a sensor module including a case and a window.
18A and 18B are perspective views showing a second embodiment of an integrated sensor module including a solar cell and circuit components in different directions.
19 is a sectional view of a sensor module including a case and a window.
20 is a flowchart showing a manufacturing method of the sensor module.
21A to 21C are cross-sectional views illustrating a process of manufacturing the sensor module according to the method of manufacturing the sensor module shown in FIG.
Fig. 22 is a sequence showing another manufacturing method of the sensor module. Fig.
23A to 23C are sectional views showing a process of manufacturing the sensor module according to the manufacturing method of the sensor module shown in FIG.

1A and 1B are perspective views of the solar cell module 100 of the present invention viewed from different directions.

The solar cell module 100 includes a solar cell 120 and is configured to produce power from light. A module means a unit such as a machine or a system, and refers to an independent apparatus assembled with various electronic parts or mechanical parts and having a specific function. Therefore, it can be understood that the solar cell module 100 refers to an independent device having a function of generating power from light by having the solar cell 120.

The solar cell module 100 includes a printed circuit board 110, a solar cell 120, an encapsulant layer 130, a dam layer 140, output terminals 151 and 152, . Hereinafter, each configuration will be described in order.

The printed circuit board 110 supports the entire solar cell module 100 and is electrically connected to the solar cell 120. The printed circuit board 110 is formed of an insulating material. The electrode portion of the solar cell 120 and the electrode connecting portion 160 of the printed circuit board 110 are electrically connected to each other. However, in the remaining region except for the region where the electrode connecting portion 160 is formed, .

The printed circuit board 110 has a first surface and a second surface facing each other. The first side may be referred to as the front side or the top side, and the second side may be referred to as the back side or the bottom side. An electrode connection portion 160 electrically connected to the solar cell 120 is exposed on the first surface of the printed circuit board 110 and an output terminal for outputting power collected from the solar cell 120 is formed on the second surface 151 and 152 are exposed. However, the output terminals 151 and 152 may be exposed on the first surface of the printed circuit board 110, as shown in FIG. 1B.

The electrode connection unit 160 is configured to connect a plurality of solar cells 121, 122, 123, and 124 to each other in series. For example, a plurality of electrode connection portions 162, 163, and 164 are disposed between the solar cells 121, 122, 123, and 124, and each of the electrode connection portions 162, 163, The batteries 121 and 122 (122 and 123) (123 and 124) are electrically connected to each other. The electrode connection portion 160 is electrically connected to the output terminals 151 and 152.

The solar cell 120 is mounted on the printed circuit board 110 and the electrode unit of the solar cell 120 is electrically connected to the electrode connection unit 160 of the printed circuit board 110. The solar cell 120 may be mounted on the first surface of the printed circuit board 110 so that the solar cell 120 partially covers the electrode connection portion 160 formed on the first surface of the printed circuit board 110 . The electrical connection structure between the electrode portion of the solar cell 120 and the electrode connecting portion 160 of the printed circuit board 110 will be described later with reference to FIG. 2 to FIG.

A plurality of solar cells 121, 122, 123, and 124 may be provided in one solar cell module 100. The plurality of solar cells 121, 122, 123, and 124 may be spaced apart from each other on the same plane. The plurality of solar cells 121, 122, 123, and 124 may be connected to each other in series by electrode connection units 162, 163, and 164. Although the number of the solar cells 121, 122, 123 and 124 is shown as one solar cell module 100 in FIG. 1A, the number and arrangement of the solar cells 121, 122, 123, And may vary depending on the design of the battery module 100.

The solar cell 120 is formed to convert light energy into electric energy. Generally, the solar cell 120 is composed of a P-type semiconductor and an N-type semiconductor, and when the light is shined, the charge moves to generate a potential difference.

A structure in which both electrodes of each solar cell 120 are formed on the opposite surface of the light receiving surface (or the light condensing surface) of the solar cell 120 may be referred to as a back contact structure. The solar cells 121, 122, 123, and 124 shown in FIGS. 1A and 1B are connected in series to each other by the electrode connection portions 162, 163, and 164, 124 are formed on opposite sides of the light receiving surface. Therefore, the solar cells 121, 122, 123, and 124 shown in FIGS. 1A and 1B are classified as solar cells having a back contact structure.

In contrast, the structure in which electrodes are formed on the light receiving surface and the opposite surface of the solar cell, respectively, is classified into a general structure. In a typical structure, an electrode of a solar cell and another electrode of a solar cell adjacent to the solar cell (the two electrodes have different polarities) are connected in series by separate conductors.

The sealing layer 130 is formed to cover the solar cell 120 to protect the solar cell 120 from external impact or moisture. When a plurality of solar cells 121, 122, 123, and 124 are provided, the sealing layer 130 may cover all of the plurality of solar cells 121, 122, 123, and 124.

The sealing layer 130 is formed to be transparent. The amount of light transmitted to the solar cell 120 may increase as the transparency of the sealing layer 130 increases because the solar cell 120 produces electric power using light.

A primer layer (not shown) may be formed between the sealing layer 130 and the solar cell 120 to bond the sealing layer 130 to the solar cell 120. However, when the sealing layer 130 has an adhesive force by itself, the sealing layer 130 is not separated from the solar cell 120 even without a primer layer. Therefore, the primer layer is not an essential configuration of the solar cell module 100, but is an optional configuration.

In order to solve the problems of the conventional solar cell module, the sealing layer 130 of the present invention is formed of a material containing silicon.

A material containing silicon means that other materials besides silicon can be added. Here, the other material is, for example, at least one of a curing agent for curing the liquid silicone in the process of manufacturing the solar cell module 100, an ultraviolet screening agent for shielding ultraviolet rays incident on the solar cell, . In the present invention, the kind of the curing agent, ultraviolet screening agent and adhesive is not particularly limited.

Silicone has higher heat resistance than polymer protective layer and EVA (ethylene-vinyl acetate copolymer) adhesive layer. Accordingly, the solar cell module 100 having the sealing layer 130 formed of a material containing silicon does not cause the problem of fusion or deformation of the sealing layer 130 due to heat even in a process of applying a high-temperature surface mounting technique . The temperature of the process of applying the surface mounting technology is 250 ° C. at maximum, because silicon has sufficient heat resistance at this temperature.

Therefore, according to the present invention having the sealing layer 130 made of a material including silicon, the solar cell module 100 can be applied to a high-temperature surface mounting technique, and a separate printed circuit board (a separate printed circuit board (Not shown), and it is also possible to mount a circuit component by applying a high-temperature surface mounting technique to the printed circuit board 110 of the solar cell module 100. FIG.

The solar cell module 100 of the present invention has an outermost layer of a silicon sealing layer 130 on a solar cell 120. Since the conventional solar cell module has the function of a protective layer as well as the sealing layer and the protection layer, the solar cell module 100 of the present invention has a separate protection over the silicon sealing layer 130 No layer is required.

The outermost layer formed only of the silicon encapsulation layer 130 may have a thinner thickness than the encapsulation layer and the protective layer separately. Accordingly, the present invention can increase the light amount of light reaching the solar cell 120 compared to the prior art, thereby improving the efficiency of the solar cell module 100. This effect is related to the light transmittance of the silicon sealing layer 130, which will be described later with reference to the graph of FIG.

The sealing layer 130 preferably has a thickness of 200 to 1,000 mu m. When the thickness of the sealing layer 130 is thinner than 200 탆, it is difficult to protect the solar cell 120 sufficiently. Therefore, in order to protect the solar cell 120, the thickness of the sealing layer 130 is preferably 200 탆 or more. On the other hand, if the thickness of the sealing layer 130 exceeds 1,000 mu m, the light transmittance may decrease and the efficiency of the solar cell module 100 may be lowered. Therefore, it is preferable that the thickness of the sealing layer 130 does not exceed 1,000 mu m.

The dam layer 140 is bonded to one surface of the printed circuit board 110. One surface of the printed circuit board 110 indicates a surface on which the solar cell 120 and the sealing layer 130 are formed. The solar cell 120 and the sealing layer 130 are formed on the first surface and the first surface and the second surface of the printed circuit board 110, respectively. According to this description, the dam layer 140 is bonded to the first side of the printed circuit board 110.

The dam layer 140 is formed on the rim of the sealing layer 130. The dam layer 140 supports the rim of the sealing layer 130 and protects the rim of the solar cell 120 and the sealing layer 130.

The dam layer 140 is intended to prevent the liquid seal layer material from flowing out of the printed circuit board 110 in the process of manufacturing the solar cell module 100 originally. Therefore, if the liquid seal layer material has a sufficiently high viscosity, the dam layer 140 is not required, and in this case, the dam layer 140 may be an optional configuration, not an essential configuration.

Hereinafter, various structures of the solar cell module will be described. Sectional view of the solar cell module shown in Figs. 2 to 7 corresponds to a cross-sectional view of the solar cell module cut along the line A-A of Fig. 1 and viewed from one side.

2 is a sectional view showing the solar cell module 200 of the first embodiment.

The printed circuit board 210 has an electrode connection part 260 and the electrode connection part 260 is exposed on the first surface of the printed circuit board 210. The electrode connection portions 260 are disposed to be spaced apart from each other and connect the solar cells 221, 222, 223, and 224 in series. Each of the solar cells 221, 222, 223 and 224 has two electrodes 221a and 221b (222a and 222b) (223a and 223b) (224a and 224b) having different polarities.

2, when the solar cell module 200 includes four solar cells 221, 222, 223, and 224, five solar cells 221, 222, 223, and 224 are connected in series Electrode connection portions 261, 262, 263, 264 and 265 are formed, and three electrode connection portions 262, 263 and 264 are formed between the two solar cells 221, 222 and 223, 223 And 224, respectively. For convenience of explanation, the four solar cells 221, 222, 223, and 224 are respectively referred to as a first solar cell to a fourth solar cell 221, 222, 223, and 224 from the left, The connection portions 261, 262, 263, 264 and 265 are referred to as a first electrode connection portion to a fifth electrode connection portion 261, 262, 263, 264 and 265, respectively.

The first solar cell 221 has electrode portions 221a and 221b including a cathode 221a and an anode 221b and the cathode 221a and the anode 221b are spaced apart from each other on the opposite surface of the light- . When the first solar cell 221 is mounted on the printed circuit board 210, the cathode 221a is connected to the first electrode connection portion 261 and the anode 221b is connected to the second electrode connection portion 262.

The second solar cell 222 has electrode portions 222a and 222b each composed of a cathode 222a and an anode 222b and the cathode 222a and the anode 222b are spaced apart from each other on the opposite surface of the light- . When the second solar cell 222 is mounted on the printed circuit board 210, the cathode 222a is connected to the second electrode connection part 262, and the anode 222b is connected to the third electrode connection part 263.

The third solar cell 223 has electrode portions 223a and 223b composed of a cathode 223a and an anode 223b and the cathode 223a and the anode 223b are formed on opposite surfaces of the light- . When the third solar cell 223 is mounted on the printed circuit board 210, the cathode 223a is connected to the third electrode connection part 263 and the anode 223b is connected to the fourth electrode connection part 264.

The fourth solar cell 224 includes electrode portions 224a and 224b composed of a cathode 224a and an anode 224b and the cathode 224a and the anode 224b are disposed on opposite sides of the light receiving surface . When the fourth solar cell 224 is mounted on the printed circuit board 210, the cathode 224a is connected to the fourth electrode connection portion 264 and the anode 224b is connected to the fifth electrode connection portion 265. [

The electrode connection portions 261, 262, 263, 264 and 265 and the output terminals 251 and 252 formed on the second surface of the printed circuit board 210 are electrically connected to each other. The printed circuit board 210 may have a structure such as a through hole or a via hole and the electrode connection portions 261 and 265 at both ends may be electrically connected to each other through wiring Output terminals 251 and 252, respectively. For example, the first electrode connection part 261 is connected to one output terminal 251, and the fifth electrode connection part 265 is connected to the other output terminal 252. Wiring other than the electrode connection portion may be formed inside the printed circuit board 210.

A plurality of solar cells 221, 222, 223 and 224 are mounted on the first surface of the printed circuit board 210 and a plurality of solar cells 221, 222, 223 and 224 are mounted on the plurality of solar cells 221, 222, 223, and 224 are formed. The upper surface of the sealing layer 230 shown in Fig. 2 has a planar structure.

A primer layer 280 may be formed between the solar cell 220 and the sealing layer 230 to enhance adhesion. The primer layer 280 is formed to adhere the sealing layer 230 to the solar cell 220. However, as described above, the primer layer 280 is not an essential constituent of the solar cell module 200.

A dam layer 240 is formed on the rim on the printed circuit board 210. The dam layer 240 has a height higher than the side surface of the sealing layer 230 and can define an area of the sealing layer. The outer boundary of the solar cell module 200 may be formed by the dam layer 240.

3 is a cross-sectional view of a solar cell module 300 showing a modification of the first embodiment.

Compared with the solar cell module 200 shown in FIG. 2, the solar cell module 300 shown in FIG. 3 has the same structure as the solar cell module 200 shown in FIG. 2, but the structure of the sealing layer 330 is somewhat different. Unlike the encapsulation layer 230 of the solar cell module 200 shown in FIG. 2 having a planar structure, the encapsulation layer 330 of the solar cell module 300 shown in FIG. 3 is partially uneven.

The concavity and convexity of the sealing layer 330 is formed on the rim of each of the solar cells 321, 322, 323, and 324. For example, irregularities may be formed between the left end and the right end of the solar cell 320, between the two solar cells (between 321 and 322, between 322 and 323, and between 323 and 324).

When the sealing layer 330 has irregularities, the thickness of the sealing layer 330 becomes thinner than that of the flat sealing layer 230 (see FIG. 2), so that the light transmittance of the sealing layer 330 is increased . Accordingly, the amount of light incident on the solar cell 320 can be increased, and the efficiency of the solar cell module 300 can be increased.

The configuration not illustrated in FIG. 3 refers to the description of FIG. 3, reference numeral 310 denotes a printed circuit board, reference numerals 321 to 324 denote first to fourth solar cells, reference numeral 340 denotes a dam layer, and reference numerals 351 and 352 denote output terminals. Reference numeral 360 denotes an electrode connection portion, reference numerals 361 to 365 denote first to fifth electrode connection portions, and reference numeral 380 denotes a primer layer.

4 is a cross-sectional view of a solar cell module 400 showing another modification of the first embodiment.

Compared with the solar cell module 200 shown in FIG. 2, the solar cell module 400 shown in FIG. 4 has the same structure as the solar cell module 200 shown in FIG. 2, but the structure of the sealing layer 430 is somewhat different. Unlike the sealing layer 230 of the solar cell module 200 shown in FIG. 2 having a planar structure, the sealing layer 430 of the solar cell module 400 shown in FIG. 4 is not a planar structure, and a round shape like a dome.

The thickness of the sealing layer 430 is the thickest at the center of each of the solar cells 421, 422, 423 and 424 and thinner toward the left and right ends of the solar cells 421, 422, 423 and 424. The thickness of the sealing layer 430 is the thinnest at the left and right ends of the respective solar cells 421, 422, 423 and 424 and between the two solar cells (between 421 and 422, between 422 and 423 and between 423 and 424).

When the thickness of the sealing layer 430 is increased, the light transmittance of the sealing layer 430 may be somewhat lowered, but the solar cell 420 can be more safely protected from physical external forces. There is a high possibility that the physical external force applied to the solar cell 420 is mainly concentrated in the center portion of the respective solar cells 421, 422, 423, and 424 rather than the left and right ends thereof. Therefore, each solar cell 421, 422, 423, and 424 can be sufficiently protected if the thickness of the sealing layer 430 is large at a position facing the center of each of the solar cells 421, 422, 423, and 424. Also, if the thickness of the sealing layer 430 at the left and right ends of each solar cell 421, 422, 423, and 424 is reduced, the decrease in light transmittance can be somewhat suppressed.

The configuration not illustrated in FIG. 4 refers to the description of FIG. In FIG. 4, reference numeral 410 denotes a printed circuit board, 421 to 424 denotes a first solar cell to a fourth solar cell, 440 denotes a dam layer, and 451 and 452 denote output terminals. Reference numeral 460 denotes an electrode connecting portion, 461 to 465 denote a first electrode connecting portion to a fifth electrode connecting portion, and 480 denotes a primer layer.

5 is a sectional view showing the solar cell module 500 of the second embodiment.

5 is the same as that of the solar cell module 200 shown in FIG. 2 except that the solar cell module 500 shown in FIG. 5 has the same structure as that of the dam layers 240, 340, 440, Figs. 2 to 4). The dam layer is intended to prevent the seal layer raw material from flowing out of the printed circuit board in the course of forming the seal layer by hardening the liquid seal layer raw material.

If the liquid seal layer material has a sufficiently high viscosity, it may not flow out of the printed circuit board 510. Accordingly, when the sealing layer 530 is formed of the sealing layer material having a sufficiently high viscosity, the sealing layer 530 can be manufactured in the solar cell module 500 without a dam layer. A sufficiently high viscosity will be described later.

The size of the solar cell module 500 can be reduced even if the solar cell 521, 522, 523, and 524 have the same area as the dam layer is removed from the rim of the sealing layer 530. For example, the solar cell module 500 shown in FIG. 5 is smaller than the solar cell module 200 shown in FIG. 2 by the width of the dam layer 240.

The efficiency of the solar cell module 500 is determined based on the total size of the solar cell module 500. Accordingly, if the size of the solar cell module 500 is small, the efficiency is high as long as the solar cells 521, 522, 523, and 524 having the same area are provided. Accordingly, when the size of the solar cell module 500 is reduced by the width of the dam layer, the efficiency of the solar cell module 500 can be improved by the ratio.

The configuration not illustrated in FIG. 5 refers to the description of FIG. Reference numerals 521 to 524, which are not illustrated in FIG. 5, refer to first to fourth solar cells, and reference numerals 551 and 552 denote output terminals. Reference numeral 560 denotes an electrode connection portion, 561 to 565 denotes a first electrode connection portion to a fifth electrode connection portion, and 580 denotes a primer layer.

6 is a cross-sectional view of a solar cell module 600 showing a modification of the second embodiment.

6 is the same as that of the solar cell module 500 shown in FIG. 5, but the structure of the sealing layer 630 is somewhat different from that of the solar cell module 500 shown in FIG. Unlike the encapsulation layer 530 of the solar cell module 500 shown in FIG. 5 having a planar structure, the encapsulation layer 630 of the solar cell module 600 shown in FIG. 6 has an uneven part as a whole .

Unevenness of the sealing layer 630 is formed at the edges of the solar cells 621, 622, 623, and 624, respectively. Concaves and convexes may be formed between the left end and the right end of each of the solar cells 621, 622, 623, and 624, and between two solar cells (between 621 and 622, between 622 and 623, and 623 and 624).

When the sealing layer 630 has irregularities, the thickness of the sealing layer 630 becomes thinner than that of the flat sealing layer 630, so that the light transmittance of the sealing layer 630 is increased. Accordingly, the amount of light incident on the solar cell 620 can be increased, and the efficiency of the solar cell module 600 can be increased.

The configuration not described in FIG. 6 refers to the description of FIG. 6, reference numeral 610 denotes a printed circuit board, reference numerals 621 to 624 denote first to fourth solar cells, and reference numerals 651 and 652 denote output terminals. Reference numeral 660 denotes an electrode connection portion, 661 to 665 denotes a first electrode connection portion to a fifth electrode connection portion, and 680 denotes a primer layer.

7 is a cross-sectional view of a solar cell module 700 showing another modification of the second embodiment.

7 is similar to the solar cell module 500 shown in FIG. 5, the remaining structure is the same, but the structure of the sealing layer 730 is somewhat different. Unlike the sealing layer 530 of the solar cell module 500 shown in FIG. 5 having a planar structure, the sealing layer 730 of the solar cell module 700 shown in FIG. 7 is not a planar structure, and a round shape like a dome.

The thickness of the sealing layer 730 is the thickest at the center of each of the solar cells 721, 722, 723 and 724 and thinner toward the left and right ends of the solar cells 721, 722, 723 and 724. The thickness of the sealing layer 730 is the thinnest at the left and right ends of the respective solar cells 721, 722, 723 and 724 and between the two solar cells (between 721 and 722, between 722 and 723 and between 723 and 724).

The light transmittance of the sealing layer 730 in the thick region of the sealing layer 730 may be somewhat lowered, but the solar cell can be more safely protected from the physical external force.

The configuration not illustrated in FIG. 7 refers to the description of FIG. 7, reference numeral 710 denotes a printed circuit board, reference numerals 721 to 724 denote first to fourth solar cells, and reference numerals 751 and 752 denote output terminals. Reference numeral 760 denotes an electrode connection portion, reference numerals 761 to 765 denote first to fifth electrode connection portions, and reference numeral 780 denotes a primer layer.

8 is a graph showing the light transmittance of the sealing layer formed of a material containing silicon according to the wavelength.

The horizontal axis of the graph indicates the wavelength (nm) of light incident on the solar cell, and the vertical axis indicates the light transmittance (%) of the sealing layer.

The solar cell module is made to produce electric power using the light incident on the solar cell. Therefore, the higher the light transmittance of the encapsulating layer covering the solar cell, the higher the efficiency of the solar cell module. However, since ultraviolet rays have stronger energy than visible light or infrared rays, they may cause damage to the solar cell. For this reason, it has been described that the sealing layer may include a UV-blocking agent.

Referring to the graph of FIG. 8, as the wavelength of light becomes longer, the light transmittance of the encapsulation layer gradually increases, but the light transmittance becomes relatively constant from the wavelength of about 600 nm.

The sealing layer made of a material including silicon has a light transmittance of 80% or more with respect to light having a wavelength of 300 nm, and more strictly has a light transmittance of 85% or more. As compared with the case where the polymer protective layer and the EVA adhesive layer have a light transmittance lower than 80% with respect to light having a wavelength of 300 nm, the light transmittance of the sealing layer made of a material containing silicon is high.

Further, the sealing layer made of a material containing silicon has a light transmittance of 91 to 93% with respect to light having a wavelength of 350 nm. As compared with the case where the polymer protective layer and the EVA adhesive layer have a light transmittance lower than 91% with respect to light having a wavelength of 350 nm, the light transmittance of the sealing layer made of a material containing silicon is high.

Further, the sealing layer made of a material containing silicon has a light transmittance of 93 to 94% with respect to light having a wavelength of 400 to 780 nm. Compared with the case where the polymer protective layer and the EVA adhesive layer have a light transmittance lower than 91% with respect to light having a wavelength of 400 to 780 nm, the light transmittance of the sealing layer made of a material containing silicon is high.

Further, the sealing layer made of a material containing silicon has a light transmittance of 91 to 94% with respect to visible light. It is difficult to clearly set the range of the visible ray because the range of the wavelength that can feel the light by the eyes differs from person to person, but the light having the wavelength of about 380 to 800 nm corresponds to the visible ray. As compared with the case where the polymer protective layer and the EVA adhesive layer have a light transmittance lower than 91% with respect to visible light, the light transmittance of the sealing layer made of a material containing silicon is high.

These results show that the sealing layer made of a material containing silicon has higher light transmittance than the polymer protective layer and the EVA adhesive layer at all wavelengths. Therefore, the sealing layer can increase the amount of light incident on the solar cell than the polymer protective layer and the EVA adhesive layer, so that a solar cell module with higher efficiency than the conventional one can be realized.

Hereinafter, a manufacturing method of the solar cell module described above will be described.

FIG. 9 is a sequence showing a process of manufacturing the solar cell modules 200, 300, 400 (see FIGS. 2 to 4) of the first embodiment. FIGS. 10A to 10G are conceptual diagrams showing a process of manufacturing a solar cell module according to the manufacturing method of the solar cell module shown in FIG. 11A to 11H are cross-sectional views illustrating a process of manufacturing a solar cell module according to a manufacturing method of the solar cell module shown in FIG.

FIGS. 10A to 10G show a process of manufacturing a plurality of solar cell modules, and FIGS. 11A to 11H show a process of manufacturing one of the plurality of solar cell modules.

Referring to FIG. 9, first, in order to manufacture a solar cell module, a printed circuit board having an electrode connection portion is prepared (S110). 10A and 11A correspond to the step S110 in FIG.

Referring to FIG. 10A, the printed circuit board 810 is divided into a plurality of regions, and an electrode connection portion 860 is formed in each region. The electrode connection portion 860 may be soldered. The wiring other than the electrode connecting portion 860 may be formed inside the printed circuit board 810.

The electrode connection portion 860 includes a first electrode connection portion 861 to a fifth electrode connection portion 865. The first electrode connection portion 861 to the fifth electrode connection portion 865 are spaced apart from each other. The number of the electrode connection portions 861, 862, 863, 864, and 865 may vary depending on the design of the solar cell module.

10A shows the first side of the printed circuit board 810 and the second side of the printed circuit board 810 can be seen in FIG. Referring to FIG. 11A, an electrode connection portion 860 is exposed to a first surface of a printed circuit board 810, and output terminals 851 and 852 are formed on a second surface of a printed circuit board 810. The output terminals 851 and 852 may be formed on one side and the other side of the second surface, respectively, as shown in FIG. 11A. In addition, the output terminals 851 and 852 may be formed on one side of the second surface, or may be formed on the first surface or the first surface and the second surface, respectively.

Referring again to FIG. 9, a dam layer is formed on one side of the printed circuit board (S120). One surface of the printed circuit board means the first surface on which the solar cell is to be mounted. 10B, 10C and 11B correspond to the step S120 of FIG.

Referring to FIG. 10B, the dam layer is formed by attaching the unit grid assembly 840 'to the first surface of the printed circuit board 810. The size of the unit grid assembly 840 'has a size corresponding to the printed circuit board 810, and each unit grid has a size corresponding to a unit size of the solar cell module. A hole is formed in each unit grid, and each unit grid forms a rim of the hole. And a plurality of unit lattices are gathered to form one aggregate 840 '.

Fig. 10C is a modification of Fig. 10B. Referring to FIG. 10C, the unit grid of the unit grid assembly 840 '' is formed to a size that can cover each of the solar cells to be mounted on the printed circuit board 810. Each unit grid is formed for each solar cell frame. Between each solar cell, a boundary is formed by the unit cell assembly 840 ".

The unit grid assembly 840 ', 840' 'may be bonded to the printed circuit board 810 by an adhesive.

For example, the unit grid assembly 840 ', 840' 'and the printed circuit board 810 may be formed of FR4 (FR), and the printed circuit board 810 may be formed of a material similar to that of the printed circuit board 810. The unit grid assembly 840' : Frame Retardent) glass epoxy. In addition, the unit grid assembly 840 ', 840' 'may be formed of at least one of various materials such as ceramic, metal, and the like.

Referring to FIG. 11B, a dam layer 840 is formed by attaching a unit grid assembly to a first surface of a printed circuit board 810. A unit grid is formed on the rim of the printed circuit board 810.

Since a hole is formed in the unit grid, the first surface of the printed circuit board 810 on which the solar cell will be mounted is partially exposed through the unit grid. The area exposed through the unit cell may be referred to as the exposed area of the printed circuit board 810.

Referring again to FIG. 9, at least one solar cell is mounted for each exposed region of the printed circuit board exposed through the unit cells (S130). The solar cell is mounted on the first surface of the printed circuit board, and the number of solar cells may vary depending on the design of the solar cell module. FIGS. 10D and 11C correspond to step S130 in FIG.

Referring to FIG. 10D, four solar cells 821, 822, 823, and 824 are mounted for each exposed region of the printed circuit board 810 exposed through the unit grid. Referring to FIG. 11C, each of the solar cells 821, 822, 823, and 824 is disposed apart from each other. The electrode connecting portion 860 formed on the printed circuit board 810 and the electrode portions 821a, 821b, 822a, 822b, 823a, 823b, 824a, and 824b of the solar cell 820 are physically contacted and electrically connected to each other . The order of the step of forming the dam layer 840 and the step of mounting the solar cell 820 may be reversed.

Referring again to FIG. 9, a primer layer is formed on the solar cell (S140). The primer layer is for bonding the sealing layer to the solar cell. FIG. 11D corresponds to step S140 in FIG.

Referring to FIG. 11D, a primer layer 880 is formed on the solar cells 821, 822, 823, and 824. Step S140 of forming the primer layer 880 is performed to spray and thermally cure the primer material on the solar cells 821, 822, 823, and 824. Thermal curing of the primer material is performed by heat-treating the primer material at 90 to 110 ° C for 20 to 40 minutes.

However, since the primer layer 880 is not an essential constituent in the solar cell module, the step of forming the primer layer (S140) is not an essential step in the manufacturing method of the solar cell module. Accordingly, step S140 of forming the primer layer may be omitted, and step S150 may be followed immediately after the step S130 of mounting the solar cell to dispense the sealing layer material.

Referring again to FIG. 9, after the step S130 of mounting the solar cell or after the step S140 of forming the primer layer, the liquid sealing layer material is dispensed (S150). If there is no primer layer, the sealing layer material is dispensed onto the solar cell, and if there is a primer layer, the sealing layer material is dispensed onto the primer layer. 10E, 11E, 11F and 11G correspond to the step S150 in FIG.

The liquid encapsulating layer raw material 830 'includes silicon, and may further include a curing agent, an ultraviolet screening agent, and an adhesive. For example, referring to FIG. 10E, the liquid silicone and the ultraviolet screening agent may be dispensed from the A dispenser, and the hardener may be dispensed from the B dispenser. If the liquid encapsulating layer raw material 830 'includes an adhesive, the encapsulating layer can be adhered to the solar cell 820 without the primer layer 880. The liquid encapsulating layer raw material 830 'is dispensed per exposure area of the printed circuit board 810.

Referring to FIG. 11E, the liquid encapsulating layer raw material 830 'may be evenly dispensed onto the solar cell 820 or the primer layer 880. When the sealing layer raw material 830 'is flat-dispensed, the thickness of the sealing layer can be uniformly formed. If the thickness of the encapsulation layer is not uniform, the encapsulation layer may have a partially low light transmittance. In order for the sealing layer raw material 830 'to be evenly dispensed, it must have sufficient spreadability, and the liquid sealing layer raw material 830' may have a low viscosity of 10 Pa · s or less so as to have sufficient spreadability.

If the liquid encapsulating layer raw material 830 'has a viscosity of 10 Pa · s or less, there is a risk of flowing out of the printed circuit board 810. However, the dam layer 840 previously formed on the printed circuit board 810 blocks the flow of the sealing layer material 830 '. Thus, the dam layer 840 can prevent the sealing layer material 830 'from flowing out of the printed circuit board 810.

Figs. 11F and 11G are modifications of Fig. 11E. Referring to FIG. 11F, the liquid encapsulating layer raw material 830 " has the thickest thickness in the middle portion and can be dispensed so as to have a thickness thinner toward both ends. The middle portion is the second solar cell 822 And both end portions indicate the left side of the first solar cell 821 and the right side of the fourth solar cell 824. The sealing layer material 830 " The shape to be fugged can be varied through viscosity control of the encapsulant material 830 ".

Referring to FIG. 11G, a unit lattice of the dam layer 840 is formed for each edge of each solar cell 821, 822, 823, and 824, and the sealing layer material 830 ' (822), (823), and (824).

Referring again to FIG. 9, the seal layer material of the liquid phase is thermally cured to form a seal layer (S160). FIG. 10F corresponds to step S160 of FIG.

Referring to FIG. 10F, a process of applying heat (Q) to a liquid encapsulating layer raw material 830 'to cure is illustrated. The conditions for thermally curing the liquid encapsulating layer raw material 830 'may vary depending on the silicon contained in the encapsulating layer raw material 830'. Generally, when the sealing layer material 830 'is heat-treated at 130 to 170 for 30 to 150 minutes, the sealing layer material 830' is cured to form the sealing layer 830 (see FIG. 10F). When the sealing layer 830 is formed, a solar cell module assembly is formed.

Referring again to FIG. 9, the solar cell module aggregate formed in steps S110 to S160 is cut to a unit size of the solar cell module (S170). Since the unit cell has a size corresponding to the solar cell module 100, the solar cell module assembly can be cut to a unit size of the solar cell module by cutting the solar cell module assembly with the unit cell as a boundary. FIG. 10F shows a process of cutting the solar cell module assembly to a unit size of the solar cell module 800. FIG. 11H shows a solar cell module 800 cut to a unit size.

FIG. 12 is a flowchart showing a process of manufacturing the solar cell module 500, 600, 700, and FIGS. 5 to 7 of the second embodiment. 13A to 13E are conceptual diagrams showing a process of manufacturing a solar cell module according to the manufacturing method of the solar cell module shown in FIG. 14A to 14F are cross-sectional views illustrating a process of manufacturing a solar cell module according to a manufacturing method of the solar cell module shown in FIG.

FIGS. 13A to 13F show a process of manufacturing a plurality of solar cell modules, and FIGS. 14A to 14F show a process of manufacturing one of the plurality of solar cell modules.

As described above, the solar cell modules 500, 600, and 700 of the second embodiment do not include the dam layers 240, 340, and 440 (see FIGS. 2 to 4). Therefore, the method of manufacturing the solar cell modules 500, 600, 700 of the second embodiment does not include the step of forming the dam layers 240, 340, 440, , ≪ / RTI > 400). Therefore, the description of the manufacturing method of the solar cell modules 200, 300, 400 of the first embodiment is the same as the one described above, and the repeated description will be omitted here.

Referring to FIG. 12, in order to manufacture a solar cell module, a printed circuit board having an electrode connection is first prepared (S210). 13A and 14A correspond to the step S210 of FIG.

13A, the printed circuit board 910 is divided into a plurality of regions, and electrode connection portions 960 are formed in the respective regions. The electrode connection portion 960 may be soldered. The wiring other than the electrode connection portion 960 may be formed inside the printed circuit board 910. [

The electrode connection portion 960 includes a first electrode connection portion 961 to a fifth electrode connection portion 965. The first electrode connection portion 961 to the fifth electrode connection portion 965 are spaced apart from each other. The number of electrode connection portions 961, 962, 963, 964, and 965 may vary depending on the design of the solar cell module.

13A shows the first side of the printed circuit board 910 and the second side of the printed circuit board 910 is shown in FIG. 14A. Referring to FIG. 14A, the electrode connection portion 960 is exposed to the first surface of the printed circuit board 910, and output terminals 951 and 952 are formed on the second surface of the printed circuit board 910. The output terminals 951 and 952 may be formed on one side and the other side of the second surface, respectively, as shown in FIG. 14A. Also, unlike the drawing, the output terminals 951 and 952 may be formed side by side on one side of the second surface, or may be formed on the first side or the first side and the second side, respectively.

Referring again to FIG. 12, the printed circuit board is divided into a plurality of regions having a unit size of the solar cell module, and at least one solar cell is mounted for each region (S230). The solar cell is mounted on the first surface of the printed circuit board, and the number of solar cells may vary depending on the design of the solar cell module. 13B and 14B correspond to the step S230 of FIG.

Referring to FIG. 13B, four solar cells 921, 922, 923, and 924 are mounted for each region of the printed circuit board 910. 14B, each of the solar cells 921, 922, 923, and 924 is physically and electrically connected to the electrode connection portion 860 formed on the first surface of the printed circuit board 910, The electrode connection portion 860 is soldered so that the solar cell 820 is bonded to the electrode connection portion 860 when the solar cell 820 is placed on the printed circuit board 810 and heated. However, the method of mounting the solar cell 820 on the printed circuit board 810 is not limited thereto, and the solar cell 820 may be mounted using solder paste or by soldering.

Referring again to FIG. 12, a primer layer is formed on the solar cell (S240). The primer layer is for bonding the sealing layer to the solar cell. FIG. 14C corresponds to step S240 in FIG.

Referring to FIG. 14C, a primer layer 980 is formed on the solar cell 920. The step of forming the primer layer is performed by arranging the primer material on the solar cell 920 and thermally curing it. Thermal curing of the primer material is performed by heat-treating the primer material at 90 to 110 ° C for 20 to 40 minutes.

However, since the primer layer 980 is not an essential component in the solar cell module, the step S240 of forming the primer layer 980 is not an essential step in the manufacturing method of the solar cell module. Therefore, the step S240 of forming the primer layer may be omitted, and the step S250 of dispensing the sealing layer material immediately after the step S230 of mounting the solar cell may be continued.

Referring again to FIG. 12, after the step S230 of mounting the solar cell or after the step S240 of forming the primer layer, the liquid sealing layer material is dispensed (S250). If there is no primer layer, the sealing layer material is dispensed onto the solar cell, and if there is a primer layer, the sealing layer material is dispensed onto the primer layer. 13C, 14D and 14E correspond to the step S250 of FIG.

The liquid encapsulating layer raw material 930 'includes a silicone material and may further include a curing agent, an ultraviolet blocking agent, and an adhesive. Referring to FIG. 13C, the liquid silicone material and the ultraviolet screening agent are dispensed from the A dispenser, and the hardener is dispensed from the B dispenser. The boundary of the sealing layer material 930 'may be formed for each boundary of each region of the printed circuit board 910 or for each of the solar cells 821, 822, 823, and 824.

Referring to FIG. 14D, the liquid encapsulating layer raw material 930 'preferably forms a droplet having an acute angle of contact on the solar cell 920 or on the primer layer 980. Also, the seal layer material 930 'should have a sufficiently high viscosity, so that the seal layer material 930' does not flow outside the printed circuit board 910 even without a dam layer. For this purpose, it is preferable that the liquid sealing layer material has a high viscosity of 40 Pa · s or more.

As the sealing layer material 930 'has a sufficiently high viscosity, the step of forming the dam layer (S120, see FIG. 9) in the method of manufacturing the solar cell module may be omitted. Accordingly, it is possible to reduce the number of processes, improve the economical efficiency of the manufacturing method, and improve the efficiency of the solar cell module. The efficiency improvement of the solar cell module has been described above.

Fig. 14E is a modification of Fig. 14D. 14E, the liquid encapsulating layer raw material 930 " has the greatest thickness at a position facing each of the solar cells 921, 922, 923 and 924, 921, 922, 923, and 924. The manner in which the encapsulation layer raw material 930 " is disengaged can be used to adjust the viscosity of the encapsulation layer raw material 930 " Referring to FIG. 12 again, the seal layer material of the liquid phase is thermally cured to form an encapsulation layer (S260). FIG. 13D corresponds to step S260 of FIG.

Referring to FIG. 13D, a process of applying heat (Q) to a liquid encapsulating layer raw material 930 'to cure is illustrated. The conditions for thermally curing the liquid encapsulating layer raw material 930 'may vary depending on the silicon contained in the encapsulating layer raw material 930'. Generally, heat treatment of the sealing layer raw material 930 'at 130 to 170 for 30 to 150 minutes causes the sealing layer raw material 930' to be cured to form the sealing layer 930 (see FIG. 13E). When the sealing layer 930 is formed, a solar cell module assembly is formed.

Referring again to FIG. 12, the solar cell module aggregate formed in steps S210 through S260 is cut to a unit size of the solar cell module (S270). FIG. 13E shows a process of cutting the solar cell module assembly to a unit size of the solar cell module. 14F shows a solar cell module 900 cut to a unit size.

The solar cell modules 100, 200, 300, 400, 500, 600, 700, 800, and 900 described above can be used for supplying electric power to electronic devices. Hereinafter, a method of manufacturing an electronic apparatus having a solar cell module will be described.

15 is a flowchart showing a manufacturing method of an electronic apparatus having a solar cell module.

First, a solar cell module having an encapsulation layer made of a material containing silicon is fabricated (S1100). The manufacturing method of the solar cell module will be described with reference to FIGS. 9 to 14F and the manufacturing method of the solar cell module 100, 200, 300, 400, 500, 600, 700, 800 , 900) refer to the description related to Figs. 1 to 8 above.

Next, the solar cell module is mounted on the main printed circuit board of the electronic device through a surface mounting technique (SMT) in which heat is applied to the furnace and the component is mounted on the main printed circuit board of the electronic device (S1200). The temperature applied to the solar cell module by the surface mount technology is about 200 to 250 DEG C, and the surface mounting technique is an automated process.

When the automation equipment puts the solar modules 100, 200, 300, 400, 500, 600, 700, 800, 900 and various devices or various circuits on the main printed circuit board and applies heat while passing the furnace, And various devices or various circuits are bonded to the main printed circuit board.

The solar cell module of the present invention has an encapsulating layer formed of a material containing silicon, and the silicon has a sufficient heat resistance even at the temperature of the process of applying the surface mounting technique. Therefore, even if the solar cell module is mounted on the main printed circuit board through the high-temperature surface mounting technique, there is no problem of fusion or deformation of the sealing layer.

Hereinafter, the sensor module will be described as an example of the solar cell module. The sensor module described below includes a solar cell and operates using power generated from the solar cell.

16A and 16B are perspective views of a first embodiment of an integrated sensor module 1000 including a solar cell and circuit components in different directions.

The sensor module 1000 includes a printed circuit board 1010, a solar cell 1020, a circuit component 1300, a sensor unit 1400, and a battery 1500.

The printed circuit board 1010 has a first surface and a second surface facing in opposite directions. A first side is shown in Figure 16a, and a second side is shown in Figure 16b. The first side may be named top side or front side, and the second side may be named bottom side or back side.

The printed circuit board 1010 has an electrode connection portion 1060 on a first surface thereof. The electrode connection portions 1062, 1063 and 1064 are arranged so as to be spaced from each other and to connect the solar cells 1021, 1022, 1023 and 1024 mounted on the first surface of the printed circuit board 1010 in series .

The printed circuit board 1010 has the circuit wiring 1011 on the second surface. The circuit wiring 1011 is a structure for electrically connecting the electronic parts mounted on the printed circuit board 1010. The electronic parts mean the various sensors of the sensor part 1400, the circuit parts 1300, and the battery 1500 do.

The electrode connection portion 1060 and the circuit wiring 1011 may be electrically connected to each other by wiring (not shown) formed in the printed circuit board 1010. A through hole or a via hole structure may be formed in the printed circuit board 1010 and wirings (not shown) disposed in the through holes or via holes may be connected to the electrode connection portion 1060 and the circuit wiring 1011, respectively have.

The solar cell 1020 is mounted on the first surface of the printed circuit board 1010 and electrically connected to the electrode connection portion 1060. 16A shows a configuration in which four solar cells 1021, 1022, 1023, and 1024 are mounted on a first surface of a printed circuit board 1010. As shown in FIG. Since the electrode connection portion 1060 and the circuit wiring 1011 are electrically connected to each other, the solar cell 1020 is also electrically connected to the circuit component 1300 and the battery 1500 described later.

The solar cell 1020 is made to produce electric power necessary for driving the circuit component 1300 and the sensor unit 1400 using light. Since the sensor module 1000 is driven using the power generated by the solar cell 1020, the sensor module 1000 can be continuously driven without a separate power cable.

Reference numeral 1030 denotes an encapsulating layer, and 1040 denotes a dam layer. The explanation for these is the one described above.

Referring to FIG. 16B, the circuit component 1300 is mounted on the second surface of the printed circuit board 1010 and electrically connected to the circuit wiring 1011. The circuit component 1300 includes various elements and various circuits for driving and controlling the sensor module 1000. For example, the circuit component 1300 may include a driver circuit, a charging circuit, an MPPT (Maximum Power Point Tracking) algorithm circuit, a DC to DC (boost, buck) Internet of Things), a sensor unit power source, a battery charging circuit, and the like. The type of the device and the circuit can be changed according to the design of the sensor module 1000.

The sensor unit 1400 corresponds to an example of an electric device driven by electric power generated in a solar cell. As the electric device is provided in the solar cell module, the solar cell module can operate as the sensor module 1000. In the present invention, the type of the electric device is not limited to the sensor unit 1400, and various devices may be provided according to the design of the solar cell module. This is not an explanation for the embodiments described herein.

The sensor unit 1400 is configured to detect a change in the measurement object. The measurement object means, for example, a physical quantity such as a concentration of a substance, light or ultrasonic waves, temperature or humidity.

The sensor portion 1400 may be mounted on the first surface and / or the second surface. The mounting position of the sensor unit 1400 may vary depending on whether light or exposure to the external environment is required. The sensor module 1000 is enclosed and protected by the case 2800 (see FIG. 17). However, only the first surface is exposed to light for receiving light of the solar cell 1020. Therefore, it is preferable that the sensor which needs to be exposed to light or the external environment is mounted on the first surface together with the solar cell 1020, and the sensor not to be mounted on the second surface for protection of the sensor.

For example, the temperature sensor is configured to sense the temperature through contact with air, and the humidity sensor is configured to sense humidity through contact with moisture contained in the air, and the gas sensor is contacted with the gas in the air, Or its concentration. Therefore, the temperature sensor, the humidity sensor and the gas sensor need not be exposed to light or an external environment. When a vent hole is formed in the case, air can flow through the vent hole and contact the temperature sensor, the humidity sensor, and the gas sensor mounted on the second surface.

16B shows a configuration in which the sensor unit 1400 is mounted on the second surface. When the sensor portion 1400 includes at least one of a temperature sensor, a humidity sensor and a gas sensor, it is preferable that the sensor portion 1400 is mounted on the second surface for protection of these sensors. In addition, when the sensor unit 1400 is mounted on the second surface, the first surface can be utilized for the arrangement of the solar cells 1020. [

The sensor module 1000 includes the battery 1500 coupled to the second side of the printed circuit board 1010 so that the power produced by the solar cell 1020 can be stored in the battery 1500. [ Light may not always exist depending on the environment, so that if the battery 1500 is not provided, the sensor module 1000 will be able to operate only at the time when light exists. However, since the sensor module 1000 includes the battery 1500, the power generated by the solar cell 1020 in the presence of light is stored in the battery 1500, and when the sensor module 1000 does not exist, Can be used for driving.

The sensor module 1000 described above uses the first surface of the printed circuit board 1010 to mount the solar cell 1020 and the second surface to the circuit component 1300, the sensor portion 1400, and the battery 1500 ), And so on.

In particular, the sensor module 1000 of the present invention can be formed by applying an automation process using a high-temperature surface mounting technique. The reason why both sides of the printed circuit board 1010 can be utilized for component mounting of the sensor module 1000 while applying an automation process using high temperature surface mounting technology is that the encapsulation layer 1030 is formed by automation using high temperature surface mounting technology This is because the process has a sufficient heat resistance.

The sensor module 1000 of the present invention has a sealing layer 1030 made of a material containing silicon and the sealing layer 1030 has a sufficient heat resistance even in a process using a surface mounting technique at a high temperature . The solar cell 1020 and the sealing layer 1030 are mounted on the first surface of the printed circuit board 1010 and the circuit component 1300 and the sensor unit 1400 are connected to each other through a process using a high- Or the like is mounted on the second surface, the sealing layer 1030 is not melted or deformed.

The sensor module 1000 of the present invention mounts the solar cell 1020 on the printed circuit board 1010 and forms the sealing layer 1030 without the thermocompression process of lamination so that the first surface of the printed circuit board 1010 It is also possible to first form the solar cell 1020 and the sealing layer 1030 on the second surface, and then mount the circuit component 1300 on the second surface through the surface mounting technique.

The solar cell 1020 and the encapsulation layer 1030 can be manufactured without the problem of melting or deforming the encapsulation layer 1030 and without the thermocompression bonding process for mounting the solar cell 1020 and forming the encapsulation layer 1030, And the order of the high-temperature process for mounting the circuit component 1300 and the like is also freely changeable.

1 to 7, output terminals are formed on the second surface of the printed circuit board. However, the sensor module 1000 described with reference to FIGS. 16A and 16B is formed on the second surface of the printed circuit board 1010, No output terminal is formed on the surface. The sensor module 1000 described here is configured such that the output terminal is already connected to the circuit component by the circuit wiring on the printed circuit board whereas the solar cell module described above is a structure that is assumed to be mounted on the main printed circuit board of the electronic device Structure. 16A and 16B illustrate a structure in which the solar cell 1020 and the circuit component 1300 are formed on different surfaces of the printed circuit board 1010. The solar cell 1020 and the circuit component 1300 are formed on the same surface of the printed circuit board 1010, And the circuit component 1300 are all mounted together.

17 is a cross-sectional view of a sensor module 2000 including a case 2800 and a window 2900. Fig. The sectional view of Fig. 17 corresponds to the line B-B of Fig. 16B.

The printed circuit board 2010 is formed into a multilayer structure. For example, a plurality of insulating layers may be sequentially stacked to form a multilayer structure of the printed circuit board 2010. The multilayer means that the circuit wirings 2011 provided on one printed circuit board 2010 are three-dimensionally layered and connected, and the number of layers can be two or more natural numbers.

The circuit wiring 2011 includes the inner wiring 2011a and the outer wiring 2011b. The circuit wiring 2011 shown in Fig. 16A is exposed on the second surface of the printed circuit board 2010 with the outer-layer wiring 2011b. The inner-layer wiring 2011a is formed for each layer of the multi-layer structure, and electrically connected to the electrode connecting portions 2061, 2062, and 2064 (the remaining reference numerals are omitted in the figure) of the first surface through the through- Lt; / RTI >

When the multilayered printed circuit board 2010 is used in the sensor module 2000, it is possible to realize high-density component mounting and wiring distance reduction. Accordingly, the printed circuit board 2010 of the multi-layer structure is suitable for miniaturization of the sensor module 2000.

The solar cell 2020 mounted on the first surface and the circuit component 2300 mounted on the second surface are electrically connected to each other through the outer layer wiring 2011b, the inner layer wiring 2011a penetrating the multilayer structure, and the electrode connecting portions 2061, 2062, As shown in FIG.

The case 2800 wraps the printed circuit board 2010 to protect the remaining configuration of the sensor module 2000. The case 2800 is configured to protect the remaining portion of the printed circuit board 2010 except for the front face. Vent holes 2801 and 2802 are formed in the case 2800 as described above.

Coupling portions 2810 and 2820 of the latch structure may be formed in the case 2800. [ When both ends of the printed circuit board 2010 are inserted into the grooves of the engaging portions 2810 and 2820, the printed circuit board 2010 can be fixed to the engaging portions 2810 and 2820.

The engaging portions 2810 and 2820 are formed on the printed circuit board 2010 so that the electronic components such as the circuit components 2301 and 2302 mounted on the second surface of the printed circuit board 2010 do not contact the bottom surface of the case 2800 Are spaced apart from the bottom surface of the case (2800) farther than the electronic components such as the circuit components (2301, 2302). When the printed circuit board 2010 is fixed by the engaging portions 2810 and 2820, the electronic components such as the circuit components 2301 and 2302 do not contact the bottom surface of the case 2800. [

The window 2900 is disposed to face the front surface of the solar cell 2020 so as to protect the solar cell 2020. The window 2900 is made of a transparent material so that light can be supplied to the solar cell 2020.

The printed circuit board 2010 on which the solar cell 2020 and the circuit components 2301 and 2302 are mounted is inserted into the space formed by the case 2800 and the window 2900 is mounted on the front surface of the solar cell 2020 The sensor module 2000 of a single product is formed.

20, 2021, 2021b, 2022a, 2023b, and 2024a denote electrode portions of the solar cell (reference numerals of remaining electrode portions are omitted in the drawing), reference numerals 2021, 2022, 2023, 2030 indicates the encapsulating layer, and 2080 indicates the primer layer. 2400 points to the sensor unit, and 2500 points to the battery.

18A and 18B are perspective views of a second embodiment of the integrated sensor module 3000 including the solar cell and the circuit components viewed from different directions.

The sensor module 3000 of the second embodiment is distinguished from the first embodiment in that it has a sensor portion 3400 mounted on the first surface. Therefore, the description overlapping with the sensor module 2000 of the first embodiment is the same as that described above.

The sensor module 3000 includes a printed circuit board 3010, a rear battery 3020, a circuit component 3300, a sensor portion 3400, and a battery 3500.

The sensor portion 3400 may be mounted on the first surface and / or the second surface. The mounting position of the sensor unit 3400 may be varied depending on the necessity of exposure to light or an external environment.

The infrared sensor is used to measure the presence or distance of objects using infrared rays, and the ultrasonic sensor measures the presence or the distance of objects using ultrasonic waves, and the illuminance sensor measures the brightness of light. Therefore, the infrared sensor, the ultrasonic sensor and the illuminance sensor must be exposed to light or an external environment, or they will lose their function as a sensor.

18A shows a configuration in which the sensor portion 3400 is mounted on the first surface. When the sensor unit 3400 includes at least one of an infrared sensor, an ultrasonic sensor, and an illuminance sensor, the sensor unit 3400 is preferably mounted on the first surface for performing the functions of these sensors. Accordingly, the sensor unit 3400 mounted on the first surface in FIG. 18A may correspond to at least one of an infrared sensor, an ultrasonic sensor, and an illuminance sensor.

Reference numerals 3011, 3021, and 3023 denote solar cells, reference numeral 3030 denotes an encapsulation layer, reference numeral 3040 denotes a dam layer, and reference numeral 3060 denotes an electrode connection portion. .

19 is a cross-sectional view of the case 4800, the window 4900, and the sensor module 4000 shown in Figs. 18A and 18B. The sectional view of Fig. 19 corresponds to the line C-C of Fig. 18B.

The printed circuit board 4010 is formed in a multi-layer structure. For example, a plurality of insulating layers may be sequentially stacked to form a multilayer structure of the printed circuit board 4010.

19 shows a configuration in which the solar cell 4020 and the sensor unit 4400 are mounted on the first surface of the printed circuit board 4010 and the circuit components 4301 and 4302 and the battery 4500 are mounted on the second surface It is showing.

Vent holes 4801 and 4802 may be selectively formed in the case 4800. [ For example, vent holes 4801 and 4802 may be omitted if the sensor unit 4400 includes only sensors that need to be exposed to light or an external environment such as an infrared sensor, an ultrasonic sensor, and an illuminance sensor. However, if the sensor portion 4400 includes sensors such as a temperature sensor, a humidity sensor, and a gas sensor that do not need to be exposed to light or an external environment, vent holes 4801 and 4802 may be provided in the case 4800 ).

The size of the groove formed in the left coupling portion 4801 has a size corresponding to the sum of the thickness of the printed circuit board 4010 and the thickness of the dam layer 4040 while the size of the groove formed in the right coupling portion 4802 Has a size corresponding to the thickness of the printed circuit board (4010). This is because there is no dam layer 4040 at the right end of the printed circuit board 4010.

Reference numerals 4011, 4022, and 4023 denote solar cells, and reference numerals 4021a, 4021b, 4022a, and 4023b denote reference numerals 4011, 4021b, 4022a, 4023b Reference numerals 4061, 4062, and 4063 denote electrode connection portions formed on a printed circuit board (reference numerals for remaining electrode connection portions are omitted in the drawing) And 4900 indicates a window.

Hereinafter, a method of manufacturing an electronic device having a solar module as an example of a sensor module will be described.

20 is a flowchart showing a manufacturing method of the sensor module.

21A to 21C are cross-sectional views illustrating a process of manufacturing the sensor module according to the method of manufacturing the sensor module shown in FIG.

Referring to FIG. 20, a printed circuit board having a first side and a second side is prepared (S2100). FIG. 21A corresponds to step S2100 in FIG.

Referring to FIG. 21A, the printed circuit board 2010 has a first surface and a second surface facing in opposite directions. The printed circuit board 2010 may have a multilayer structure. The circuit wiring 2011 of the printed circuit board 2010 is formed for each layer of the multilayer structure and includes the inner wiring 2011a and the outer wiring 2011b. The inner layer wiring 2011a and the outer layer wiring 2011b are connected to the electrode connecting portions 2061, 2062 and 2064 of the first surface through the multilayer structure through the through holes 2012 and the like.

Referring again to FIG. 20, a solar cell is mounted on a first surface of a printed circuit board and an encapsulating layer is formed on the solar cell (S2200). FIG. 21B corresponds to step S2200 in FIG.

Referring to FIG. 21B, a solar cell 2020 is mounted on a first surface of a printed circuit board 2010, and a sealing layer 2030 is formed on the solar cell 2020. A method of forming the solar cell 2020 and the sealing layer 2030 on the first surface of the printed circuit board 2010 has been described above with reference to FIGS. 9 to 14F. The dam layer 2040 and the primer layer 2080 have also been described.

Referring again to FIG. 20, a circuit component or the like is placed on the second surface of the printed circuit board and bonded through an automation process using high temperature surface mounting technology (S2300). FIG. 21C corresponds to step S2300 in FIG.

Referring to FIG. 21C, the circuit components 2301 and 2302, the sensor portion 2400, and the battery 2500 are mounted on the second surface of the printed circuit board 2010. Surface mount technology is implemented to apply heat to the printed circuit board 2010 by applying heat in the furnace. Surface mount technology consists of automated processes. Since the sealing layer has sufficient heat resistance, it is not melted or deformed even in a process using the surface mounting technique.

This should be explained in comparison with a solar cell module having an outermost layer composed of an EVA encapsulation layer and a polymer protective layer. (1) a case where a solar cell, an EVA encapsulating layer and a polymer protective layer (hereinafter referred to as a solar cell or the like) are first laminated on a printed circuit board and then a circuit component is mounted on the printed circuit board, and 2) a circuit component is mounted on a printed circuit board first, And a case in which a battery or the like is mounted.

If a solar cell or the like is first mounted on a printed circuit board as in the first case, the EVA encapsulating layer and the polymer protecting layer of the solar cell are melted or deformed in the subsequent mounting process of circuit components. Circuit components are mounted on a printed circuit board by high temperature surface mount technology and the EVA encapsulation layer and the polymer protective layer are melted or deformed at the temperature of surface mount technology.

If the circuit components are mounted on the printed circuit board as in the second case, it is difficult to mount the solar cell on the printed circuit board. The solar cell, the EVA encapsulating layer and the polymer protective layer have a laminated structure, because they form a laminated structure through a process called lamination. Lamination is a process of applying heat and pressing on both sides to form a laminate structure with a plurality of objects. When a circuit component is mounted on a printed circuit board, the printed circuit board is no longer flat and thus can not be pressed.

Reference numerals 2021, 2022, 2023 and 2024, which are not illustrated in FIGS. 21A to 21C, indicate solar cells, and reference numerals 2021a, 2021b, 2022a, 2023b and 2024a denote electrode portions of the solar cell .

Fig. 22 is a flowchart showing another manufacturing method of the sensor module. Fig.

23A to 23C are sectional views showing a process of manufacturing the sensor module according to the manufacturing method of the sensor module shown in FIG.

The manufacturing method of the sensor module shown in Fig. 22 is substantially the same as the manufacturing method of the sensor module described with reference to Fig. 20, except for the mounting order of the circuit components and the solar cell.

A configuration in which the sensor portion 4400 is mounted on the first surface and the circuit components 4301 and 4302 and the battery 4500 are mounted on the second surface by performing the automation process using the high temperature surface mounting technology once or continuously Is shown in Fig. 23B. 23C shows a structure in which the solar cell 4020 is mounted and the sealing layer 4030 is formed.

The order in which the circuit components 4300 and the solar cells 4020 are mounted on the printed circuit board 4010 may be reversed and the present invention is not limited to the problem that the sealing layer 4030 is melted or deformed even when the surface mounting technique is applied none.

4021b, 4022a, and 4023b are solar cells, 4021a, 4021b, 4022a, and 4023b are solar cells, 4021a, 4022b, and 4023b are solar cells, 4040 denotes a dam layer, and 4061, 4062 and 4064 denote electrode connecting portions (not shown in the drawing for the remaining electrode connecting portions).

The solar cell module and the electronic device having the solar cell module, the solar cell module and the method of manufacturing the electronic device described above are not limited to the configurations and the methods of the embodiments described above, All or some of the embodiments may be selectively combined.

Claims (16)

A printed circuit board having a first surface and a second surface facing each other in an opposite direction and having an electrode connection portion on the first surface and a circuit wiring electrically connected to the electrode connection portion on the second surface;
At least one solar cell mounted on the first surface and electrically connected to the electrode connection portion;
An electronic component mounted on the printed circuit board and electrically connected to the circuit wiring; And
And a case configured to receive the printed circuit board,
Wherein the electronic component includes any one of an electric device configured to be driven by electric power generated in the solar cell and a circuit component configured to control electric power generated in the solar cell, Mounted with surface mount technology,
Wherein the electrode connection portions are formed on the first surface of the printed circuit board so as to be spaced apart from each other, and the adjacent solar cells are connected in series,
A sealing layer formed to cover the solar cell and formed of a material containing silicon and an ultraviolet screening agent,
Wherein the sealing layer is a single layer directly contacting the solar cell and being an outermost layer adjacent to the outside,
Wherein the electric element comprises:
A communication unit for transmitting and receiving signals to and from an external device so as to implement the Internet of objects; And
And a sensor unit for sensing changes in concentration, light, ultrasound, temperature and humidity of the material so that the solar cell functions as a sensor module,
Wherein the case is formed with an engaging portion formed to fix the printed circuit board inside the case,
Wherein the engaging portion separates the printed circuit board from the bottom surface of the case by a distance greater than the height of the electronic component so that the electronic component mounted on the second surface of the printed circuit board does not contact the bottom surface of the case Solar module. delete The method according to claim 1,
Wherein the sensor unit includes at least one of a temperature sensor, a humidity sensor, and a gas sensor. The method of claim 3,
And a vent hole is formed in the case. The method according to claim 1,
The solar cell module includes a sensor unit,
Wherein the sensor unit includes at least one of a temperature sensor, a humidity sensor, and a gas sensor, and is mounted on the first surface. The method according to claim 1,
In the solar cell module,
And a battery mounted on the second surface and electrically connected to the circuit wiring, the battery configured to store electric power produced by the solar cell. The method according to claim 1,
In the solar cell module,
Further comprising a dam layer coupled to a first side of the printed circuit board,
Wherein the dam layer is formed at an edge of the sealing layer. The method according to claim 1,
The printed circuit board is formed in a multilayer structure,
The circuit wiring includes:
An inner layer wiring formed inside the multilayer structure; And
And an outer layer wiring exposed through the second surface and electrically connected to the inner layer wiring through the multilayer structure. The method according to claim 1,
In the solar cell module,
And a window formed of a transparent material and covering a solar cell accommodated in the case and coupled to the case. delete Preparing a printed circuit board having an electrode connection portion on a first surface and a circuit wiring on a second surface facing the opposite direction of the first surface;
Mounting a solar cell on the first surface so as to be electrically connected to the electrode connection portion, and then forming a sealing layer on the solar cell;
Mounting a circuit component or an electric device on the second surface using a surface mounting technique in which heat is applied in a furnace and the component is mounted at 200 to 250 ° C; And
Receiving the printed circuit board in a case,
Wherein the electrode connection portions are formed on the first surface of the printed circuit board so as to be spaced apart from each other, and the adjacent solar cells are connected in series,
The step of forming the sealing layer may include:
Wherein the sealing layer is made of a single layer that directly contacts the solar cell and is an outermost layer adjacent to the outside,
The step of mounting the electric device may include: a communication unit for transmitting and receiving signals to / from an external device to realize the object Internet; And
An electric element including a sensor part for sensing a change in density, light, ultrasound, temperature and humidity of a material so that the solar cell operates as a sensor module,
The step of accommodating the case may include forming an engaging portion formed to fix the printed circuit board to the inside of the case,
Wherein the engaging portion separates the printed circuit board from the bottom surface of the case by a distance greater than the height of the electronic component so that the electronic component mounted on the second surface of the printed circuit board does not contact the bottom surface of the case A method of manufacturing a solar cell module. Preparing a printed circuit board having an electrode connection portion on a first surface and a circuit wiring on a second surface facing the opposite direction of the first surface;
Mounting a circuit component or an electric device on the second surface using a surface mounting technique in which heat is applied in a furnace and the component is mounted at 200 to 250 ° C;
Mounting a solar cell on the first surface so as to be electrically connected to the electrode connection portion, and then forming a sealing layer on the solar cell; And
Receiving the printed circuit board in a case,
Wherein the electrode connection portions are formed on the first surface of the printed circuit board so as to be spaced apart from each other, and the adjacent solar cells are connected in series,
The step of forming the sealing layer may include:
Wherein the sealing layer is made of a single layer that directly contacts the solar cell and is an outermost layer adjacent to the outside,
The step of mounting the electric device may include: a communication unit for transmitting and receiving signals to / from an external device to realize the object Internet; And
An electric element including a sensor part for sensing a change in density, light, ultrasound, temperature and humidity of a material so that the solar cell operates as a sensor module,
The step of accommodating the case may include forming an engaging portion formed to fix the printed circuit board to the inside of the case,
Wherein the engaging portion separates the printed circuit board from the bottom surface of the case by a distance greater than the height of the electronic component so that the electronic component mounted on the second surface of the printed circuit board does not contact the bottom surface of the case A method of manufacturing a solar cell module. 13. The method according to claim 11 or 12,
The step of forming the sealing layer may include:
Attaching a unit grid to a first surface of the printed circuit board to form a dam layer;
Mounting at least one solar cell for each exposed region of the printed circuit board exposed through the unit grid;
Dispensing the encapsulating layer raw material for each exposed region of the printed circuit board so as to cover the solar cell with a liquid encapsulating layer raw material; And
And thermally curing the encapsulating layer raw material to form the encapsulating layer. 14. The method of claim 13,
Wherein the liquid sealing layer material has a viscosity of 10 Pa · s or less. 13. The method according to claim 11 or 12,
The step of forming the sealing layer may include:
Mounting at least one solar cell on a first surface of the printed circuit board;
Dispensing the encapsulating layer raw material to cover the solar cell with a liquid encapsulating layer raw material comprising a material containing silicon; And
And thermally curing the encapsulating layer raw material to form the encapsulating layer. 16. The method of claim 15,
Wherein the liquid sealing layer material has a viscosity of 40 Pa · s or more.

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