KR101899986B1 - Hybrid machining equipment for defect removal - Google Patents

Abstract

[0001] The present invention relates to a combined machining apparatus capable of removing a cutting defect by using a laser, and more particularly to a combined machining apparatus capable of removing a machining defect occurring on a lower surface of a workpiece at the same time as machining, Equipment. The present invention relates to a combined machining apparatus having a function of removing a cutting defect using a laser, comprising: a base portion on an upper side to which a workpiece is fixed by a jig; A guide portion extending along an upper surface of the base portion; A manipulator unit moving to the working position along the guide unit; A machining portion coupled to the manipulator portion and configured to process the material to be processed; And a laser unit coupled to the manipulator unit so as to be positioned on the same center axis as the processing unit, wherein the laser unit irradiates a laser to a machining defect occurring on the lower surface of the material to be processed to remove the laser beam.

Description

HYBRID MACHINING EQUIPMENT FOR DEFECT REMOVAL <br> <br> <br> Patents - stay tuned to the technology HYBRID MACHINING EQUIPMENT FOR DEFECT REMOVAL

The present invention relates to a combined machining equipment complex machining apparatus capable of removing cutting defects using a laser, and more particularly, to a machining apparatus capable of removing machining defects occurring on a lower surface of a workpiece at the same time as machining, The present invention relates to a multi-processing apparatus and a multi-processing apparatus.

In the combined processing equipment, the processing module, the inspection module, the post-processing module, etc. may be mounted on the head portion, and the module mounted on the head portion may be replaced according to the process. More specifically, the complex machining apparatus performs machining on the workpiece while the machining module is mounted on the head, and replaces the machining module mounted on the head with the inspection module to detect the position of machining defects . Then, the inspection module mounted on the head part is replaced with a post-processing module to remove machining defects in the workpiece. As described above, since the module mounted on the head is required to be replaced in order to perform each process, the time required until the defect caused by machining is removed is prolonged.

Further, in the case where the material to be processed is a carbon fiber composite material, machining defects such as burrs, fibers, and delaminations frequently occur below the holes when the material to be processed is subjected to hole processing. In such a case, there is a problem that it is difficult to remove machining defects located on the lower surface of the material to be processed by using the head portion provided on the upper side of the material to be processed. And since carbon fiber reinforced plastics are vulnerable to high temperature heat, when processed by a laser, thermal deformation may occur. Therefore, it is difficult to apply a laser to a complex processing equipment such as a carbon fiber-reinforced plastic for processing a workpiece susceptible to thermal deformation, despite the advantage of being capable of rapid processing.

Japanese Unexamined Patent Publication No. 2006-049384 (2006.02.16)

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems occurring in the prior art, and it is an object of the present invention to provide a combined machining apparatus capable of removing machining defects occurring on the lower surface of a workpiece at the same time as machining.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not intended to limit the invention to the precise form disclosed. There will be.

According to an aspect of the present invention, there is provided an apparatus for manufacturing a semiconductor device, including: a base portion to be fixed on a top side thereof with a jig; A guide portion extending along an upper surface of the base portion; A manipulator unit moving to the working position along the guide unit; A machining portion coupled to the manipulator portion and configured to process the material to be processed; And a laser part coupled to the manipulator part so as to be positioned on the same center axis as the machining part, wherein the laser part irradiates a laser to a machining defect occurring on the lower surface of the material to be processed to remove the laser. The present invention provides a combined machining apparatus for cutting defects using a cutting tool.

In the embodiment of the present invention, the material to be processed may be a carbon fiber composite material.

In the embodiment of the present invention, the manipulator unit may include: a sliding unit that is seated on the guide unit and slides to a working position; A rotating unit coupled to an upper portion of the sliding unit, the rotating unit being rotatable in one direction or another direction; An arm unit coupled to the rotating unit and rotating forward or backward; And a holder unit coupled to the arm unit and coupled to the processing unit and the laser unit.

In the embodiment of the present invention, the arm unit may include: a first arm coupled at one end to the rotation unit and pivoting forward or backward with the rotation unit as a rotation axis; A second arm coupled at one end to the other end of the first arm and pivoting forward or backward with the first arm as a pivot; A third arm coupled at one end to the other end of the second arm and rotatable in one direction or another direction; And a fourth arm that is coupled to the other end of the third arm and is pivotally moved forward or backward with the third arm as a pivot axis.

In an embodiment of the present invention, the holder unit may include: a first coupling unit coupled to one end of the arm unit and extending to have a predetermined length; A second coupling member provided below the first coupling member and having a predetermined length; And a support having one end of the first coupling member and one end of the second coupling member connected to each other, wherein the machining unit is coupled to the first coupling unit and the laser unit is coupled to the second coupling unit.

In the embodiment of the present invention, the support may be configured such that the length of the support is adjustable so that the workpiece is positioned between the first and second assemblies.

In the embodiment of the present invention, the laser unit may include a camera unit for recognizing a position of the machining defect occurring on the lower surface of the material to be processed; And a laser unit located on the same center axis as the machining unit and irradiating laser to the machining defects recognized by the camera unit to remove the laser.

According to an aspect of the present invention, there is provided an apparatus for manufacturing a semiconductor device, including: a base portion to be fixed on a top side thereof with a jig; A pair of first guide portions provided on both sides of the upper surface of the base portion and extending in the longitudinal direction of the base portion; One or more second guide portions provided on the inner side of the pair of first guide portions and extending in the longitudinal direction of the base portion; A third guide part coupled to an upper side of the second guide part and slidable in a longitudinal direction of the second guide part, the third guide part extending in a width direction of the base part; A gantry portion that is seated on the pair of first guide portions and moves to a machining position along the first guide portion; A laser unit which is provided in the third guide unit and is moved to the processing position by the second guide unit and the third guide unit; And a machining portion coupled to the gantry portion so as to be movable in the longitudinal direction of the gantry portion, wherein the material to be processed is disposed below the processing portion and above the laser portion, and the laser portion is formed on the lower surface of the material to be processed And a laser beam is applied to the machining defects.

In the embodiment of the present invention, the laser unit may include: a camera unit for recognizing a position of processing defects occurring on a lower surface of the material to be processed; A laser unit for irradiating the processing defects with a laser to remove the processing defects; And a control unit for controlling the laser unit to be located on the same central axis as the processing unit.

In the embodiment of the present invention, the control unit may control the movement of the laser unit so that the laser unit moves to a predetermined processing position.

In an embodiment of the present invention, an X-ray module is mounted on the camera unit, and the X-ray module recognizes the position of the processing unit by irradiating the processing unit with X-ray.

In the embodiment of the present invention, the control unit controls the movement of the second guide part, the third guide part and the laser unit so that the laser unit moves along the machining part recognized by the X-ray module .

According to the embodiments of the present invention, the laser portion is provided on the lower side of the material to be processed, and it is easy to remove machining defects on the lower surface of the material to be processed. Particularly, in the case of a material to be processed, which is a carbon fiber composite material, machining defects occur in the lower side of the hole when the hole is machined by the machining portion. At this time, since the laser portion is located below the material to be processed, it is easy to remove machining defects such as burrs, fibers, peeling, etc. formed under the holes. According to the embodiments of the present invention, It is possible to immediately remove defects occurring in the laser-part-to-be-processed material located in the lower portion of the material to be processed immediately after the processing of the additional material to be processed.

Further, according to the embodiments of the present invention, the laser part irradiates the laser with only the minimum necessary energy to remove machining defects of the material to be processed, so that the material to be processed can be prevented from being deformed due to thermal influence, It is possible to quickly remove machining defects. Specifically, in the case of a carbon fiber composite material, the shape of a processing defect has a long and thin fiber form. Therefore, the energy required to remove the laser-induced machining defects is very small compared to the energy required to process the material to be processed. Therefore, when the laser unit uses only a minimum amount of energy that can remove machining defects, defects such as thermal deformation can be prevented from occurring in the material to be processed.

Further, since the energy output of the laser part is very small, additional defects such as thermal deformation do not occur in the material to be processed even when the processing defect and the laser beam are simultaneously irradiated with the material to be processed. Therefore, even if the position where the laser unit is irradiated is not precisely controlled, it is easy to selectively remove only machining defects

Further, according to the first embodiment of the present invention, since the machining portion and the laser portion are provided on the same central axis in the manipulator portion, it is possible to immediately remove the machining defects caused by the machining portion .

It should be understood that the effects of the present invention are not limited to the above effects and include all effects that can be deduced from the detailed description of the present invention or the configuration of the invention described in the claims.

FIG. 1 is a perspective view of a combined machining apparatus of a laser cutting method according to a first embodiment of the present invention. FIG.
FIG. 2 is a front view of a combined machining apparatus for cutting defects using a laser according to a first embodiment of the present invention. FIG.
FIG. 3 is a perspective view of a combined machining apparatus of a cutting-processing defect removing function using a laser according to a second embodiment of the present invention.
FIG. 4 is a front view of a complex machining apparatus for cutting defects using a laser according to a second embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.

Throughout the specification, when a part is referred to as being "connected" (connected, connected, coupled) with another part, it is not only the case where it is "directly connected" "Is included. Also, when an element is referred to as "comprising ", it means that it can include other elements, not excluding other elements unless specifically stated otherwise.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, the terms "comprises" or "having" and the like refer to the presence of stated features, integers, steps, operations, elements, components, or combinations thereof, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view of a combined machining apparatus for cutting a machining defect using a laser according to a first embodiment of the present invention. FIG. 2 is a schematic view of a complex machining defect removing function using laser according to the first embodiment of the present invention. It is a front view of the processing equipment.

1 and 2, a multi-processing machine 100 having a laser-based cutting function eliminating function according to the first embodiment includes a base 110, a guide 120, a manipulator 130, A processing unit 140, and a laser unit 150. [

The base portion 110 may have a flat top surface and may have a hexahedron shape. However, the shape of the base 110 is not limited to the illustrated shape, and the workpiece W may be fixed by the jig 105 on the upper side. Here, the workpiece W refers to an object to be processed by the complex machining apparatus 100 having a function of removing a cutting defect by using a laser. The workpiece W includes a carbon fiber composite material such as carbon fiber reinforced plastic (CFRP). However, the material to be processed W is not limited to the carbon fiber composite material, and may include all the metal metals. The jig 105 may be provided in the form of a flexible jig having a universal joint so as to support the workpiece W in close contact with the lower surface of the workpiece W having a curved surface, . The jig 105 is fixed to the workpiece W, but a plurality of the workpieces W may be disposed on the center side of the workpiece W. [

The manipulator unit 130 is coupled to the guide unit 120 and the guide unit 120 may be provided in the form of a guide groove or a guide rail to allow the manipulator unit 130 to slide and move. The guide part 120 is provided so as to extend along the upper surface of the base part 110 so that the manipulator 130 moves along the outer periphery of the work W and performs machining on the work W can do.

The manipulator unit 130 slides and moves to the working position along the guide unit 120 and includes the sliding unit 131, the rotation unit 132, the arm unit 133 and the holder unit 138.

The sliding unit 131 is positioned at the lowermost end of the manipulator unit 130 and is seated on and coupled to the guide unit 120 and slides along the guide unit 120 to move the manipulator unit 130 to a predetermined working position .

The rotation unit 132 may be coupled to an upper portion of the sliding unit 131, and may be rotatable in one direction or another direction with respect to the center. More specifically, when the sliding unit 131 moves to a predetermined working position, the rotating unit 132 can be rotated so that the machining unit 140 faces the workpiece W. [ In particular, the rotating unit 132 can be rotated so that the machining portion 140 is positioned above the predetermined machining position.

The arm unit 133 is coupled to the upper side of the rotation unit 132 and can be rotated forward or backward to move the machining unit 140 and the laser unit 150 to a predetermined machining position, A second arm 135, a third arm 136, and a fourth arm 137. The first arm 134, the second arm 135, the third arm 136,

The first arm 134 may be provided in a bar shape having a predetermined length and may be provided so that one end thereof is coupled to the rotation unit 132 and may be rotated forward or backward with the rotation unit 132 as a rotation shaft have. The second arm 135 has a predetermined length and one end of the first arm 134 is coupled to the other end of the first arm 134 and the other end of the first arm 134 is pivoted forward or rearward . One end of the third arm 136 is coupled to the other end of the second arm 135, and the third arm 136 is rotatable in one direction or another direction. The fourth arm 137 may have one end connected to the other end of the third arm 136 and the other end of the third arm 136 as a pivot shaft so as to be pivotable forward or backward.

The first arm 134 to the fourth arm 137 provided as described above move the machining unit 140 and the laser unit 150 to a predetermined machining position and perform machining such as hole machining on the workpiece W Respectively.

The holder unit 138 is coupled to the arm unit 133 and may be provided to couple the machining unit 140 and the laser unit 150 together. Specifically, the holder unit 138 includes a first coupling body 138a, a second coupling body 138b, and a support body 138c.

The first coupling member 138a is coupled to one end of the arm unit 133 and may be extended to have a predetermined length. More specifically, the first coupling member 138a may be vertically coupled to the end of the fourth arm 137, and may be provided in a bar shape having a predetermined length. The second coupling member 138b may be provided on the lower side of the first coupling member 138a and may have a predetermined length. At this time, the second coupling member 138b may be formed in the same shape as the first coupling member 138a, and may be provided in parallel with the first coupling member 138a. The support body 138c can fix the first and second assemblies 138a and 138b by connecting the ends of the first and second assemblies 138a and 138b. The holder unit 138 thus formed may be in the form of a rectangular hollow having an inner side and an open side. The machining unit 140 may be coupled to the lower side of the first coupling unit 138a and the laser unit 150 may be coupled to the upper side of the second coupling unit 138b. At this time, the machining unit 140 and the laser unit 150 may be disposed on the same central axis. However, the shape of the holder unit 138 is not limited to the embodiment, and the machining portion 140 and the laser portion 150 are located on the same central axis, and the machining and machining defects D ) Removal structure are all included in one embodiment. In addition, the support body 138c may have a length adjustable so that the workpiece W may be positioned between the first and second assemblies 138a and 138b. That is, the length of the support body 138c is adjusted so that the workpiece W can be positioned between the machining portion 140 and the laser portion 150 irrespective of the thickness of the workpiece W.

The machining unit 140 is coupled to the manipulator unit 130 and may be provided to process the material W to be processed. The machining unit 140 includes all the machining equipment such as a water jet and a CRD, and can process a hole or the like in the material to be processed W. [ Further, although not shown, the machining portion 140 may be provided at the position of the fourth arm 137. [ That is, the machining part 140 may be provided so that one end of the machining part 140 is coupled to the other end of the third arm 135 so as to rotate forward or backward with the other end of the third arm 135 as a turning shaft. In this case, the holder unit 138 is configured such that the first coupling member 138a is coupled to the lower side of the processing unit 140, so that the laser unit 150 provided in the second coupling member 138b is coaxial with the processing unit 140, As shown in FIG.

The laser unit 150 is coupled to the manipulator unit 130 so as to be positioned on the same central axis as the processing unit 140. More specifically, the laser part 150 is coupled to the upper side of the second coupling body 138b and can irradiate a laser beam to the machining defects D generated on the lower surface of the work W by the machining part 140 have. The laser unit 150 includes a camera unit 151 and a laser unit 152.

The camera unit 151 may be coupled to one side of the laser unit 152 and may recognize the position of the machining defect D generated on the lower surface of the workpiece W when the workpiece 140 is machined by the machining unit 140 can do. The camera unit 151 can be used to determine whether or not a machining defect D is generated by capturing an image of the lower surface of the work W and determining the position where the machining defect D is generated. The camera unit 151 irradiates the bottom surface of the workpiece W with infrared rays or ultrasonic waves to determine whether or not machining defects D generated on the lower surface of the workpiece W are generated, It may be replaced by locating. In addition, the position of the camera unit 151 is not limited to one embodiment, and may be provided in combination with the second coupling member 138b. That is, the camera unit 151 is included in one embodiment as long as it is capable of immediately recognizing the machining defects D generated on the lower surface of the workpiece W.

The laser unit 152 may be provided to be coupled to the second coupling member 138b so as to be positioned on the same center axis as the processing unit 140. The laser unit 152 may be configured to irradiate a laser beam onto the processing defect D recognized by the camera unit 151 Can be removed. At this time, the laser unit 152 is capable of removing the machining defects D, but it is possible to remove the machining defects D using the minimum energy. Specifically, in the case of the carbon fiber composite material, the shape of the processing defect (D) is in the form of a thin and long fiber. Therefore, the energy required for the laser unit 152 to remove machining defects D is very small compared to the energy required to process the workpiece W. [ Therefore, when the laser unit 152 uses only a minimum amount of energy capable of removing machining defects D, defects such as thermal deformation can be prevented from occurring in the workpiece W. [ Further, since the energy output of the laser unit 152 is very small, no additional defect such as thermal deformation occurs in the material to be processed W even when the laser beam is simultaneously irradiated on the machining defect D and the material to be processed W . Therefore, it is easy to selectively remove only the machining defect D even if the position to which the laser unit 152 is irradiated is not precisely controlled. Further, the laser unit 152 has less vibration than when the machining defect D is removed by using the cutting tool, and the machining defect D can be removed quickly.

In the combined processing apparatus 100 having the function of removing the cutting defects using the laser according to the first embodiment, the laser unit 152 of the laser unit 150 and the separate processing unit 140 are located on the same central axis And moved to the machining position by the holder unit 138 at the same time. In other words, it is not necessary to control the position of the laser unit 152 in order to remove machining defects D generated by the machining unit 140. Accordingly, the complex machining apparatus 100 having the function of removing defects using a laser does not need to perform a separate position control with respect to the laser part 150, so that the operation process is simple and the machining defect D can be removed quickly It is economical.

In the combined processing apparatus 100 of the present invention, the machining portion 140 is provided on the upper side of the material to be processed W, the laser beam is irradiated to the lower side of the material W to be processed, A portion 150 is provided. Therefore, the laser processing unit 100 of the present invention can remove the machining defects (D) from the laser unit 150 immediately after the workpiece W is processed. Particularly, when the material W to be processed is a carbon fiber composite material, machining defects D such as burrs, fibers, delaminations and the like are frequently generated under the holes. Therefore, when the workpiece W is a carbon fiber composite material, the laser part 150 located below the workpiece W is easier to remove the machining defects D generated on the lower side of the hole.

FIG. 3 is a perspective view of a combined machining apparatus for cutting defects using a laser according to a second embodiment of the present invention. FIG. 4 is a cross-sectional view of a complex machining defect removing function using laser according to a second embodiment of the present invention. It is a front view of the processing equipment.

As shown in FIGS. 3 and 4, the combined processing equipment 200 of the laser cutting method according to the second embodiment has a base 210, a first guide 220, A third guide unit 240, a gantry unit 250, a machining unit 260, and a laser unit 270. The first guide unit 240, the second guide unit 240,

The base portion 210 may have a flat top surface and may have a hexahedron shape. However, the base 210 is not limited to the shape shown in the figure, and all the workpiece W may be fixed to the workpiece W by the jig 205. Here, the material to be processed W refers to an object to be processed by the complex processing equipment 200 having a function of removing a cutting defect using a laser. The workpiece W includes a carbon fiber composite material. The jig 205 may be provided in the form of a flexible jig having a universal joint to closely contact the lower surface of the workpiece W having a curved surface so as to support the workpiece W and be adjustable in height . The jigs 205 may be fixed on the outer side of the workpiece W with a plurality of workpiece W fixed thereon.

The first guide portions 220 are provided on both sides of the upper surface of the base portion 210 and extend in the longitudinal direction of the base portion 210. The first guide unit 220 may be provided in the form of a guide rail so as to be slidable in a state where the gantry unit 250 to be described later is engaged.

The second guide portion 230 is provided inside the pair of first guide portions 220 and may extend in the longitudinal direction of the base portion 210. More specifically, the second guide portion 230 may be provided parallel to the first guide portion 220 and extend in the longitudinal direction of the base portion 210, as shown in FIG.

The third guide part 240 may be coupled to the upper side of the second guide part 230 and extend in the width direction of the base part 210. The third guide part 240 may be slidable in the longitudinal direction of the second guide part 230 on the second guide part 230.

However, the second guide portion 230 and the third guide portion 240 are not limited to one embodiment. For example, the second guide part 230 may be provided inside the first guide part 220, but may be provided in a direction perpendicular to the first guide part 220. The second guide part 230 may extend in the width direction of the base part 210 and the third guide part 240 may extend in the longitudinal direction of the base part 210. That is, the third guide unit 240 may be provided on the upper side of the second guide unit 230, and may extend in a direction perpendicular to the second guide unit 230.

The gantry portion 250 is seated on the pair of first guide portions 220 and can be moved to the machining position along the first guide portion 220. Specifically, the gantry section 250 includes a vertical member 251, a horizontal member 252, and a linear guide 253. The vertical members 251 are provided in a pair and vertically coupled to a pair of first guide portions 220 provided on both sides of the base portion 210. The horizontal member 252 may extend horizontally to interconnect the upper sides of the pair of vertical members 251. The linear guide 253 may be provided on the entire surface of the horizontal member 252 so as to extend in the longitudinal direction of the horizontal member 252. The linear guide 253 can be coupled to the machining portion 260 to move to a predetermined machining position while moving along the longitudinal direction of the linear guide 253. The gantry portion 250 thus formed can move the machining portion 260 in the longitudinal direction and the width direction of the base portion 210 toward a predetermined machining position.

The machining portion 260 is coupled to the linear guide 253 of the gantry portion 250 and can be provided to process the workpiece W as described above. The machining unit 260 includes machining equipment such as a cutting routing drilling (CRD), and can process a workpiece W such as a hole.

The laser part 270 is coupled to the upper side of the third guide part 240 and can be moved to the processing position by the second guide part 230 and the third guide part 240. That is, the workpiece W is positioned below the processed portion 260 and above the laser portion 270. The laser unit 270 includes a camera unit 271, a laser unit 272 and a control unit 273 so as to be able to irradiate and remove a processing defect D generated on the lower surface of the work W .

The camera unit 271 may be provided to be coupled to one side of the laser unit 272 and can recognize the position of processing defects occurring on the lower surface of the material W to be processed. At this time, the position of the camera unit 271 is not limited to that of the embodiment, but may be coupled to the upper side of the third guide unit 240 and move together with the laser unit 272. The camera unit 271 may be provided with an X-ray module (not shown). The X-ray module can irradiate X-ray to the machining unit 260 to recognize the position of the machining unit 260. In the case of a carbon fiber composite material, the permeability to X-rays is high. Therefore, when the workpiece W having high transmittance to the X-ray is processed, the position of the machining portion 260 positioned on the upper side of the workpiece W is traced and the laser unit 272 is moved to the camera unit 271 may include an X-ray module.

The laser unit 272 is coupled to the upper side of the third guide unit 240 and irradiates the machining defect D generated in the workpiece W to remove the machining defect D. That is, when a machining defect D is generated on the lower surface of the workpiece W processed by the machining unit 260 such as a hole or the like, the laser unit 272 performs machining defects D) can be removed. The laser unit 272 is slidable along the longitudinal direction of the third guide unit 240 when the laser unit 272 is coupled to the third guide unit 240. Then, the laser unit 272 is capable of removing the machining defects D, but it is possible to remove the machining defects D by using a minimum amount of energy. Specifically, in the case of the carbon fiber composite material, the shape of the processing defect (D) is in the form of a thin and long fiber. Therefore, the energy required for the laser unit 272 to remove the machining defect D is very small compared to the energy required for machining the workpiece W. [ Therefore, when the laser unit 272 uses only a minimum amount of energy capable of removing the machining defects D, defects such as thermal deformation can be prevented from occurring in the workpiece W. [ Further, since the energy output of the laser unit 272 is very small, no additional defect such as thermal deformation occurs in the material to be processed W even when the laser beam is simultaneously irradiated on the machining defect D and the material to be processed W . Therefore, even if the position to which the laser unit 272 is irradiated is not precisely controlled, it is easy to selectively remove the machining defect D only. Further, the laser unit 272 has less vibration than when the machining defect D is removed by using the cutting tool, and the machining defect D can be removed quickly.

The control unit 273 can be provided in the laser unit 272 and can be controlled so that the laser unit 272 is located on the same central axis as the processing unit 260. [ The control unit 273 controls the second guide part 230, the third guide part 240 and the laser unit 272 so that the laser unit 272 moves along the machining part 260 recognized by the X-ray module. It is possible to control the movement of the arm 272. For example, the control unit 273 may move the third guide unit 240 in the longitudinal direction of the base unit 210 along the second guide unit 230 toward the machining position. The control unit 273 causes the laser unit 272 moved together with the third guide unit 240 to move to the machining position along the width direction of the base unit 210 along the third guide unit 240 . The control unit 273 causes the laser unit 272 to be positioned on the same central axis as the machining unit 260 so that the machining defect D generated when the workpiece W is machined is detected by the laser unit 272 It can be removed immediately.

The combined processing equipment 200 of the laser cutting method according to the second embodiment of the present invention is provided with a machining portion 260 on the upper side of the material to be processed W A portion 270 is provided. Therefore, in the combined processing equipment 200 having the function of removing the cutting defects using the laser, the laser part 270 can remove the machining defects D immediately after the material to be processed W is processed. Particularly, when the material to be processed W is a carbon fiber composite material, processing defects D such as fibers and peeling occur frequently under the holes. Therefore, the laser part 270 located below the workpiece W is easier to remove the machining defects D generated under the hole when the workpiece W is a carbon fiber composite material.

It will be understood by those skilled in the art that the foregoing description of the present invention is for illustrative purposes only and that those of ordinary skill in the art can readily understand that various changes and modifications may be made without departing from the spirit or essential characteristics of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.

The scope of the present invention is defined by the appended claims, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

100: Cutting using laser Laser cutting machine
105: jig 110: base portion
120: guide part 130: manipulator part
131: sliding unit 132: rotating unit
133: cancer unit 134: first cancer
135: second arm 136: third arm
137: fourth arm 138: holder unit
138a: first coupling body 138b: second coupling body
138c: Support body 140:
150: laser unit 151: camera unit
152: laser unit
200: Cutting using laser Combined cutting machine with defects removal function
205: jig 210: base portion
220: first guide portion 221: guide rail
222: stopper 230: second guide portion
240: Third guide part 250: Gantry part
251: vertical member 252: horizontal member
253: Linear guide 260:
270: laser unit 271: camera unit
272: Laser unit 273: Control unit
W: Workpiece D: Machining defect

Claims (12)

delete delete delete delete delete delete delete A base portion to be fixed on the upper side by a jig;
A pair of first guide portions provided on both sides of the upper surface of the base portion and extending in the longitudinal direction of the base portion;
One or more second guide portions provided on the inner side of the pair of first guide portions and extending in the longitudinal direction of the base portion;
A third guide part coupled to an upper side of the second guide part and slidable in a longitudinal direction of the second guide part, the third guide part extending in a width direction of the base part;
A gantry portion that is seated on the pair of first guide portions and moves to a machining position along the first guide portion;
A laser unit which is provided in the third guide unit and is moved to the processing position by the second guide unit and the third guide unit; And
And a machining portion coupled to the gantry portion so as to be movable in the longitudinal direction of the gantry portion,
Characterized in that the work piece is provided so as to be positioned below the machining portion and above the laser portion, and the laser portion irradiates a laser to a machining defect occurring on the lower surface of the work piece, Complex machining equipment. 9. The method of claim 8,
The laser unit includes:
A camera unit for recognizing a position of a processing defect occurring on a lower surface of the material to be processed;
A laser unit for irradiating the processing defects with a laser to remove the processing defects; And
And a control unit for controlling the laser unit to be positioned on the same central axis as the machining unit. 10. The method of claim 9,
Wherein the control unit controls the movement of the laser unit so that the laser unit moves to a predetermined machining position. 10. The method of claim 9,
Wherein the X-ray module is mounted on the camera unit, and the X-ray module irradiates X-ray to the machining unit to recognize the position of the machining unit. Complex machining equipment. 12. The method of claim 11,
Characterized in that the control unit controls the movement of the second guide part, the third guide part and the laser unit so that the laser unit moves along the machining part recognized by the X-ray module Cutting using a multi-processing machine.

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