KR101891594B1 - Metal layer integrated solder, pcb integrated solder and solder bonding method including the same - Google Patents

Abstract

The present invention relates to a solder-integrated metal layer, a solder-integrated PCB including the same, and a solder joint method. The solder-integrated metal layer includes a metal layer including a metal thin film, a flux And a solder layer including the metal layer and the solder laminated and bonded to the flux layer.

Description

FIELD OF THE INVENTION [0001] The present invention relates to a solder-integrated metal layer, a solder-

The present invention relates to a solder-integrated metal layer, a solder-integrated PCB including the metal layer, and a solder bonding method. More particularly, the present invention relates to a solder-integrated metal layer capable of reducing the occurrence of defects in an electronic module bonding process, And to a solder-integrated PCB and solder bonding method including the same.

BACKGROUND ART [0002] Today, in the production of various electronic components, techniques for mounting electronic components such as chips using solder or producing semiconductor packages are widely used.

Particularly, in order to achieve miniaturization, light weight, and high performance of a device in accordance with the rapid development speed of electronic products, studies for formation of fine pitch solder joints are actively conducted.

A method of manufacturing a fine pitch solder joint by printing a solder paste using a mask corresponding to a position where a solder joint is formed and then reflowing the solder paste to form a solder joint are widely used.

In this case, the solder printing method requires a printing process using equipment such as a metal mask and a squeegee for printing the solder paste, which requires relatively large equipment and process control.

Such a problem is problematic in that it takes a lot of time and cost to manufacture an electronic module using the solder joint.

In addition, due to the nature of the metal mask fabrication and the squeegee printing method, there is a limitation in implementing fine pitch solders, and there is a high possibility that defects may occur in the mask removing process and the like.

Therefore, there is a problem that the yield is greatly lowered due to defects occurring in the solder printing method in order to cope with the fine pitch package required for downsizing, light weight, and high performance.

Disclosure of Invention Technical Problem [8] Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and an object of the present invention is to provide a solder integrated metal layer which can reduce defects in the electronic module bonding process by omitting the solder printing process, And to provide a solder joining method.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not intended to limit the invention to the precise form disclosed. There will be.

According to an aspect of the present invention, there is provided a solder-integrated metal layer comprising a metal layer including a metal thin film, a flux layer including a flux which is laminated and bonded to the metal layer, and a solder layer formed by laminating and bonding the metal layer and the flux layer. And a solder layer.

The flux layer may be disposed between the metal layer and the solder layer.

In addition, the flux layer may be formed of a plate-shaped flux film in which the flux is formed in a solid state.

The solder layer may be formed of a plate-shaped solder preform in which the solder is formed in a solid shape.

The solder integrated type PCB according to the present invention is a solder integrated PCB including the above-described solder integral type metal layer. The solder integral type PCB includes a metal layer, a flux layer, and a solder layer on a top surface of the PCB, The layers can be laminated and bonded.

Here, the solder-integrated metal layer may be formed to correspond to a portion to which the PCB is electrically connected.

Meanwhile, a solder bonding method according to the present invention is a solder bonding method including the above-described solder-integrated metal layer, comprising the steps of: providing a metal layer including the metal layer including the metal thin film; stacking the flux layer on the metal layer; And a solder layer laminating step of laminating and bonding the solder layer on the upper surface of the flux layer.

Here, the solder bonding method according to the present invention may further include a layer processing step of processing the solder-integrated metal layer into a form for electrical connection.

At this time, the layer processing step may include a removing process for removing an unnecessary portion from the plate-shaped solder integrated metal layer.

Meanwhile, the solder bonding method according to the present invention may further include a layer bonding step of laminating and bonding the solder-integrated metal layer on the electrical connection portion of the PCB.

At this time, the solder bonding method according to the present invention may further include a semiconductor bonding step of stacking the semiconductor having the solder bumps formed thereon so as to be in contact with the upper surface of the solder-integrated metal layer on the PCB.

The solder bonding method according to the present invention may further include a reflow step of heating the PCB and the semiconductor to melt and mix the solder layer and the flux layer on the PCB and the solder bumps of the semiconductor .

According to the solder-integrated metal layer, the solder-integrated PCB, and the solder bonding method according to the present invention, the following effects can be obtained.

First, it is possible to omit the solder printing process, thereby preventing defects occurring in the solder printing process.

Second, time and cost can be reduced by simplifying the electronic module bonding process.

Third, various types of electrical bonding and various compositions of solders can be applied to improve the versatility.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description of the claims.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a view showing the configuration of one embodiment of a solder-integrated metal layer according to the present invention. FIG.
2 is a view showing a configuration of one embodiment of a PCB with solder according to the present invention.
3 is a view showing an embodiment of a solder bonding method according to the present invention.
FIG. 4 is a view showing a step of providing a metal layer, a step of laminating a flux layer, and a step of laminating a solder layer according to an embodiment of a solder joining method according to the present invention.
5 is a view showing a layer bonding step of an embodiment of the solder bonding method according to the present invention.
6 is a view showing a layer processing step of a solder bonding method according to an embodiment of the present invention.
7 is a view showing a semiconductor junction step and a reflow step in one embodiment of a solder joining method according to the present invention.
8 is a view illustrating an electronic module bonded using the solder bonding method according to the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description of the present invention, the well-known functions or constructions are not described in order to simplify the gist of the present invention.

Moreover, in describing the present invention, terms indicating a direction such as forward / rearward or upward / downward are described in order that a person skilled in the art can clearly understand the present invention, and the directions indicate relative directions, It is not limited.

Solder all metal layer  And Solder all-in-one PCB

1 and 2, a structure of a solder-integrated metal layer and a solder-integrated PCB including the same according to the present invention will be described in detail.

Here, FIG. 1 is a view showing the construction of one embodiment of a solder-integrated metal layer according to the present invention, and FIG. 2 is a view showing the construction of a solder-integrated PCB according to the present invention.

First, an embodiment of the solder-integrated metal layer according to the present invention includes a metal layer 100, a flux layer 200, and a solder layer 300 as shown in FIG. 1, can do.

The metal layer 100 is provided at a portion electrically connected to the electronic module to be bonded using the solder, and may include a metal thin film.

The metal layer 100 may serve as a pad provided in an electrical connection portion of an electronic component such as a PCB and a semiconductor chip in a general electronic module package.

More specifically, in this embodiment, it may be advantageous to be formed of copper (Cu) material, and a plate-shaped metal thin film having a predetermined area may be applied.

The structure of the metal layer 100 is not limited to this embodiment, and various configurations can be applied as long as the electrical connection portions of the electronic module parts to be bonded by using the solder are provided so that they can be electrically connected easily.

On the other hand, the flux layer 200 may include a flux which is laminated and bonded to the metal layer 100 described above.

The flux layer 200 may be formed of a flux material used in general solder joints. When the solder joint is formed using the solder-integrated metal layer according to the present invention, the flux layer 200 is melted together with the solder, And the metal oxide film of the metal layer can be removed.

More specifically, in this embodiment, it may be advantageous that the flux layer 200 is formed of a plate-shaped flux film in which the flux is formed in a solid state.

That is, the solid-state flux layer 200 in the form of a film may be laminated on the upper surface of the metal thin film forming the metal layer 100 to be bonded to each other.

Such a structure can achieve the effect of forming a uniform flux layer 200 more easily than a process of forming the flux layer 200 in a relatively complicated manner.

The structure of the flux layer 200 is not limited to the embodiment described above and may be applied to a variety of materials to facilitate soldering bonding or to facilitate bonding of the metal layer 100 and the solder layer 300 to be described later If so, the composition may vary.

Meanwhile, the solder layer 300 may include a solder layered and bonded to the metal layer 100 and the flux layer 200 described above.

The solder layer 300 may be formed of a solder material generally used for a solder joint, and may be electrically connected to an electronic module using a solder-integrated metal layer according to the present invention.

More specifically, in this embodiment, the solder layer 300 may be formed by laminating solder on the upper surface of the above-described flux layer 200 and bonding them together.

That is, the flux layer 200 is disposed between the metal layer 100 and the solder layer 300, and the metal layer 100, the flux layer 200, and the solder layer 300 may be stacked.

At this time, it may be advantageous that the solder layer 300 is formed of a plate-shaped solder preform in which the solder is formed in a solid shape.

That is, a solid solder preform plate may be laminated on the upper surface of the solid film of the above-described flux layer 200 and bonded to each other.

This configuration eliminates a separate solder printing process and provides a relatively simple and uniform solder layer 300 formation.

The composition of the solder preform in the solder layer 300 may be a composition including lead and tin generally used for the solder, and the composition of the solder preform may be applied to the solder layer 300 in accordance with the characteristics of the electronic module to be bonded Solder preforms of various compositions can be applied.

In the structure of the solder-integrated metal layer according to the present invention including the above-described structure, a metal layer in which a solder layer is integrally formed is formed without performing a solder printing process, and a metal pad and a solder bump Can be obtained.

Therefore, it is possible to prevent the defects occurring in the solder printing process and simplify the electronic module bonding process, thereby reducing time and cost.

2, the PCB 100 includes a metal layer 100, a flux layer 200, a solder layer 300, and a solder layer 300. The solder layer 300 is formed of a solder layer 300, And a PCB 400. [0033] FIG.

The structure of the metal layer 100, the flux layer 200 and the solder layer 300 is the same as that of the metal layer 100, the flux layer 200 and the solder layer 300 of the solder- The detailed description will be omitted.

However, the solder-integrated PCB according to the present invention may be bonded to the upper surface of the PCB 400 in a state where the metal layer 100, the flux layer 200, and the solder layer 300 are stacked and joined together.

The PCB 400 may be configured to mount electronic components such as various semiconductor chips, and may be electrically connected to electronic components.

When the metal layer 100, the flux layer 200 and the solder layer 300 are laminated on the upper surface of the PCB 400 and bonded together, the metal layer 100, Layer 200 and solder layer 300 may be advantageously stacked in this order.

That is, a metal thin film of the metal layer 100 contacts a portion where the PCB 400 is to be electrically connected to form a bump pad, and a flux layer 200 and a solder layer 300 are provided on the metal layer 100 So that solder bumps can be formed.

At this time, it may be advantageous that the above-described solder-integrated metal layer is formed in a shape corresponding to a portion where the PCB 400 is electrically connected.

For this, the solder-integrated metal layer may be formed in a shape corresponding to the shape of the electrical connection portion of the PCB 400 from the manufacturing process, or may be formed by processing a plate-shaped solder-integrated metal layer having a predetermined area, It is possible.

The solder-integrated PCB according to the present invention including the above-described structure may be formed by forming a metal layer in which a solder layer is integrally formed without performing a solder printing process, And an effect of forming a solder bump can be obtained.

Therefore, it is possible to prevent the defects occurring in the solder printing process and simplify the electronic module bonding process, thereby reducing time and cost.

In addition, the solder monolithic metal layer can be applied to correspond to various types of electrical connection formed on the top surface of the PCB 400, and solders of various compositions can be applied, thereby improving the versatility.

Solder joint method

Next, referring to FIGS. 3 to 8, an embodiment of the solder bonding method according to the present invention will be described in detail.

3 is a view showing an embodiment of a solder bonding method according to the present invention.

4 is a view illustrating a step of providing a metal layer, a step of laminating a flux layer, and a step of laminating a solder layer according to an embodiment of the present invention. FIG. 5 is a view showing a solder joint method according to an embodiment of the present invention. And FIG. 6 is a view showing a layer processing step of a solder bonding method according to an embodiment of the present invention.

FIG. 7 is a view showing a semiconductor junction step and a reflow step in an embodiment of a solder joining method according to the present invention, and FIG. 8 is a view showing an electronic module bonded using the solder joining method according to the present invention.

As shown in FIG. 3, a solder bonding method according to the present invention includes a step of providing a metal layer (S100), a step of forming a flux Layer stacking step S200, a solder layer laminating step S300, a layer joining step S400, a layer processing step S500, a semiconductor junction step S600, and a reflow step S700.

The step of providing a metal layer (S100) may include a step of providing a metal layer (100) formed of a metal thin film, as shown in FIG.

Next, the flux layer laminating step (S200) may be a step of laminating and bonding the flux layer (200) on the upper surface of the metal layer (100) provided in the metal layer providing step (S100).

The solder layer laminating step S300 may be a step of laminating and bonding the solder layer 300 on the upper surfaces of the metal layer 100 and the flux layer 200 stacked in the flux layer laminating step S200 described above.

The flux layer 200 is bonded to the upper surface of the metal layer 100 and the flux layer 200 is bonded to the upper surface of the metal layer 100. In this case, It is advantageous that the solder layer 300 is laminated on the upper surface of the solder layer 300.

Through this process, the solder-integrated metal layer according to the present invention can be manufactured, and the metal pad and the solder bump can be formed in the solder joint of the electronic module using the solder-integrated metal layer.

Then, the layer joining step S400 may be a step of laminating and bonding the solder-integrated metal layer manufactured through the above-described process onto the PCB 400, as shown in FIG.

In this embodiment, the layer joining step (S400) laminate the solder-integrated metal layer formed in the form of a plate on the PCB 400, wherein the solder-integrated metal layer covers the electrical connection portion formed on the upper surface of the PCB 400 May be advantageously formed.

That is, the metal layer 100, the flux layer 200, and the solder layer 300 may be sequentially stacked on the electrical connection portion of the PCB 400.

Next, the layer processing step S500 may be a step of processing the shape of the solder-integrated metal layer bonded to the upper surface of the PCB 400, as shown in FIG.

More specifically, in the present embodiment, the layer processing step S500 may include a removing process (S510) of removing a part of the solder-integrated metal layer bonded to the upper surface of the PCB 400. [

At this time, the removing process (S510) may be a process of removing the solder monolithic metal layer corresponding to the remaining portion except for the electrical connection portion on the PCB 400. [

That is, the layer processing step (S500) can remove unnecessary portions from the plate-shaped solder-integrated metal layer, so that the solder-integrated metal layer has a shape for electrical connection of the PCB 400.

In this layer processing step (S500), various methods such as physically cutting the solder-integrated metal layer or etching through other treatments can be applied, and various methods can be applied as long as the solder-integrated metal layer can be processed to correspond to the electrical connection portion .

Also, a method of forming the solder-integrated metal layer from the process of manufacturing the solder-integrated metal layer to the shape corresponding to the shape of the electrical connection portion may be applied without such a process.

Next, the semiconductor junction step S600 may be a step of laminating the semiconductor C on which the solder bump S is formed, with the PCB 400 described above, as shown in Fig.

More specifically, a solder bump S in the form of solder balls may be disposed on one surface of the semiconductor C electrically connected to the PCB 400 so as to correspond to the electrical connection portion of the semiconductor C.

At this time, the semiconductor C may be stacked and disposed so that the solder bumps S are in contact with the upper surface of the solder-integrated metal layer disposed on the PCB 400 described above.

That is, the semiconductor C and the PCB 400 may be stacked so that the solder bumps S of the semiconductor C and the solder layer 300 of the solder-integrated metal layer are in contact with each other.

Then, the PCB 400 and the semiconductor C in the above-described stacked state can be heated through the reflow step S700.

The heat H applied in the reflow step S700 may melt the solder layer 300 on the PCB 400 and the solder bumps S of the flux layer 200 and the semiconductor C.

8, the molten solder layer 300, the flux layer 200, and the solder bumps S are mixed with each other to form a molten solder 500, and a portion contacting the metal layer 100 The intermetallic compound 510 may be formed.

This molten solder 500 can provide a path through which the PCB 400 and the semiconductor C are electrically connected to each other.

In the present embodiment, the solder-integrated metal layer according to the present invention is provided on one side of the mutually-bonded electronic module and the solder bump S on the other side is provided. However, And a solder-integrated metal layer according to the present invention.

Although the PCB 400 and the semiconductor C are laminated and bonded together in the present embodiment, the present invention is not limited to the above embodiments. For example, a plurality of semiconductors C may be stacked, have.

Since the solder bonding process according to the present invention including the above-described process is omitted, it is possible to prevent defects of the electronic module that may occur during the solder printing process.

In addition, since equipment and process control necessary for the solder printing process are not required, the time and cost required for the electronic module bonding process can be reduced.

In addition, it is possible to easily cope with various electrical bonding forms, and various compositions of the solder can be changed and applied, and the versatility can be greatly improved.

Although specific embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that the present invention is not limited to the disclosed embodiments, and that various modifications and changes may be made without departing from the spirit and scope of the present invention. It is self-evident to those of ordinary skill. Accordingly, it should be understood that such modifications or alterations should not be understood individually from the technical spirit and viewpoint of the present invention, and that modified embodiments fall within the scope of the claims of the present invention.

100: metal layer
200: flux layer
300: solder layer
400: PCB
500: molten solder
510: intermetallic compound

Claims (12)

delete delete delete delete delete delete Providing a metal layer including a metal layer including a metal thin film in the form of a plate;
A flux layer laminating step of laminating and bonding a flux layer formed of a plate type flux film on the upper surface of the metal layer so as to remove the metal oxide film formed on the surface of the metal layer;
A solder layer laminating step of laminating and bonding a solder layer on an upper surface of the flux layer;
A layer joining step of joining the metal layer of the plate-shaped solder monolithic metal layer formed by stacking the metal layer, the flux layer and the solder layer in this order so as to be laminated on the electrical connection portion of the PCB;
Removing the unnecessary portion of the solder-integrated metal layer corresponding to the remaining portion except for the electrical connection portion in order to process the solder-integrated metal layer for electrical connection;
A semiconductor bonding step of laminating a semiconductor formed with a solder bump on an upper surface of the solder-integrated metal layer on the PCB; And
A reflow step of heating the PCB and the semiconductor to melt and mix the solder layer and the flux layer on the PCB and the solder bumps of the semiconductor;
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