KR101890424B1 - Mainboard able to replace cpu and architechecture the same - Google Patents

Abstract

The present invention relates to a motherboard and a CPU connection architecture capable of directly detaching and replacing a plurality of CPUs regardless of a main board type, A circuit board forming an installation hole to be opened by the main heat sink and being arranged in parallel and spaced apart from the main heat sink; A bios mounted on the circuit board so as to be detachably connected to a circuit kit modular which receives a signal of a CPU mounted on a CPU socket and outputs the processed signal in accordance with a designation process; And a CPU heatsink having a main body for covering and dissipating the CPU and a leg extending from the main body through the circuit board and connected to the main heat sink at the lower end.

Description

The main board and CPU connection architecture that can replace various kinds of CPUs.

The present invention relates to a motherboard and a CPU connection architecture capable of directly detaching and replacing a plurality of CPUs regardless of a main board type.

The computer includes a hard disk for storing data, a CPU for calculating data for processing, a RAM for temporarily storing data of the hard disk for quick processing of the CPU, a graphics card for converting digital data into a video signal and transmitting the video signal to a monitor And a main board for connecting the hard disk, the CPU, the RAM, and the graphics card to each other, and a VGA card and a sound card for improving the execution environment of the computer. Here, the main board includes a general circuit board, and the circuit board includes various types of PCI slots for mounting a graphics card or the like.

In addition, various types of heat sinks for heat dissipation may be installed in the main board or each of the components installed in the main board or the like. In addition, various auxiliary components may be added.

The CPU has a variety of code names for each production process. The code names include a core name of a single core such as Northwood, Prescott and Sydermill, and a code name of a dual core such as Smithfield, Presler and Conroe.

Of course, according to each core name, various specifications, operation speed, FSB and cache, etc., and various kinds of CPUs are available through this. Of course, in the future, the kind of CPU will be further diversified through continuous development.

Meanwhile, the CPU is mounted on the main board via a CPU socket. However, as described above, CPUs vary in size, speed, FSB, and cache according to code names and so on. Therefore, the motherboard on which the CPU is mounted can not be manufactured in conformity with the mounted CPU. That is, the conventional main board has to be manufactured in a pair with the corresponding CPU, and when the CPU is replaced for the purpose of increasing the specification of the computer, it is inevitable to replace the entire main board constituting the base of the computer.

These technical limitations were caused by the perception that the CPU replacement was a computer replacement, and it was the reason that only the CPU could not be replaced with maintaining the signal connection with the existing electronic components.

Prior Art Document 1. Patent Publication No. 10-1997-0071190 (published Nov. 7, 1997)

Accordingly, the present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide an electronic apparatus and a computer system, which can replace a CPU without detaching and replacing a main board itself as well as electronic components for operating a computer. In order to make signal connection easier, we have provided a variety of CPU-replaceable motherboards and motherboard architecture that can change the VGA card to VGA chipset by changing the CPU socket to detachable detachable type and removing the PCI slot of the main board This is a problem to be solved.

According to an aspect of the present invention,

A heat sink main heat sink;

A circuit board forming an installation hole to be opened by the main heat sink and being arranged in parallel and spaced apart from the main heat sink;

A bios mounted on the circuit board so as to be detachably connected to a circuit kit modular which receives a signal of a CPU mounted on a CPU socket and outputs the processed signal in accordance with a designation process; And

And a CPU heatsink including a main body for covering and dissipating the CPU and a leg extending from the main body through the circuit board and having a lower end connected to the main heat sink.

According to another aspect of the present invention,

A heat sink main heat sink;

A circuit board forming an installation hole to be opened by the main heat sink and being arranged in parallel and spaced apart from the main heat sink;

A CPU socket mounted on the main heat sink in the installation hole, the CPU socket further receiving a signal from the CPU and processing and outputting the signal in accordance with a designated process;

A CPU mounted on the CPU socket;

A bios that is detachably connected to the circuit kit module through a communication cable and mounted on the circuit board; And

And a CPU heatsink including a main body which covers and dissipates the CPU and a leg which is drawn out from the main body and passes through the circuit board and whose lower end is connected to the main heat sink.

According to the present invention, not only the electronic parts for computer operation but also the main board itself can be replaced without replacing the CPU, and signal connection between the CPU and the main board can be easily effected in such a replacement process.

In addition, IDE system HDD system can change the AHCI system using SSD 2TB, it is possible to build integrated multimedia system, and it can be applied to all O / S.

1 is a partial cross-sectional view schematically showing a state where a CPU is mounted on a main board according to the present invention,
FIG. 2 is a plan view schematically showing a mounting configuration of a CPU and electronic parts constituting a computer on a main board according to the present invention,
3 is a block diagram illustrating a configuration of a CPU connection architecture according to the present invention,
4 is a plan view schematically showing another implementation of a CPU and electronic parts constituting a computer on a main board according to the present invention,
5 is a perspective view showing a rear surface of a circuit board according to the present invention,
6 is an exploded perspective view schematically showing the installation of the CPU heat sink in the main board according to the present invention,
FIG. 7 is a partial cross-sectional view showing a schematic view in which one embodiment of the CPU heatsink shown in FIG. 6 is installed in the main heat sink,
FIG. 8 is a partial cross-sectional view showing a schematic view of another embodiment of a CPU heat sink according to the present invention installed on a main heat sink.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other features and advantages of the present invention will become more apparent from the following detailed description of the present invention when taken in conjunction with the accompanying drawings, There will be. The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It is to be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but on the contrary, is intended to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 is a partial cross-sectional view schematically showing a state in which a CPU is installed on a main board according to the present invention. FIG. 2 is a schematic view showing a main part of a main board according to the present invention, FIG. 3 is a block diagram illustrating a configuration of a mainboard architecture according to the present invention.

The main board 100 of the present embodiment includes various elements such as a CPU 300 such as a COTEX CPU constituting a computer, a BIOS 400 and memories 600 and 700, a VGA card 500, a graphics and a sound card 700 A circuit board 130 for interconnecting and integrating electronic components such as a printed circuit board (PCB) and the like; A main heat sink 110 adjacent to and connected to the circuit board 130 so as to dissipate heat generated during operation of the computer; A heat transfer plate 120 connected to the main heat sink 110 to transfer the heat to support the CPU socket 200 to the main heat sink 110; A heat sink 141 which is in contact with the CPU 300 to receive heat from the CPU 300 and a leg 142 which is connected to the main heat sink 110 through the circuit board 130, (140).

In this embodiment, the main board 100 is further provided with a Cortex A7, which is a micro-chipset, so that a best specification that can be exerted on a general personal computer can be constructed. The main board 100 is equipped with a Cortex A7, Android CPU and MCU can be managed as a whole. In addition, since the CPU 300 and the CPU socket 200 are freed from the circuit board 130 of the main board 100, the overall size of the main board 100 can be reduced to at least 9 cm x 9 cm. Therefore, it can be extended to various devices such as navigation, black box, car pc, smart phone, car main board.

The CPU socket 200 of the present embodiment for communicably connecting the CPU 300 includes a pin module 210 composed of a plurality of pins for signal connection with the CPU 300, And a circuit kit modulator 220 for communicating with the CPU 300 and communicating the signal to the BIOS 400. The CPU 300 senses the temperature change of the heat transfer plate 120 and senses the driving environment of the CPU 300, (230). It is preferable that the heat transfer plate sensor 230 is integrally formed in the CPU socket 200 so as to process the heat transfer plate 230 according to the specification of the CPU 300. In order to sense the heat generation temperature of the heat transfer plate 120, . The heat plate sensor 230 configured in this way communicates with a dedicated electronic component or the like and senses the environment of the heat conductive plate 120 in accordance with the setting process and correspondingly stops the operation of the computer in order to reduce the load on which the related electronic component or program solution is being driven Or to output a warning window or the like.

The circuit kit module 220 is communicably connected to the BIOS 400 mounted on the circuit board 130 through a dedicated communication cable 410 and is connected to the CPU socket 300 Receives the signal, processes it according to the setting process, and outputs it to the bios 400 or other electronic components that are communicably connected. This is to allow the CPU 300 in the CPU connection architecture of the present embodiment to communicate with the electronic components without being mounted directly on the circuit board 130.

In the BIOS 400 of the present embodiment, a communication cable 410 for connection to the CPU socket 200 is drawn out, and a terminal of the communication cable 410 is connected to the CPU socket 200 A connector 411 for communication with the circuit kit modular 220 is configured. At this time, since the connector 411 can be attached to or detached from the circuit kit modular 220, the CPU socket 200 including the CPU 300 can be easily separated. In other words, since there is no additional configuration for connection between the circuit board 130 and the CPU 300 except for the detachment between the connector 411 and the circuit kit modular 220, and furthermore, the mechanical fastening can be simplified, It is possible to easily replace the existing CPU 300 installed in the own computer with the new CPU 300 without replacing the circuit board 130.

For this purpose, the BIOS 400 according to the present embodiment can install a dedicated BIOS program for each specification for communication with the various CPUs. In addition, when communication between the connector 411 and the circuit kit module 220 is started, It is possible to automatically recognize the specifications of the personal computer 300 and select and execute a dedicated program. Also, since the BIOS 400 is a basic device for controlling the operation of the circuit board 130, it is possible to operate various kinds of electronic components mounted on the circuit board 130 smoothly without confusion even when the CPU 300 is replaced .

The main heat sink 110 and the circuit board 130 constitute linkers 111 and 111 'for maintaining a gap between them and for ensuring smooth heat dissipation. The linkers 111 and 111' To the main heat sink 110 directly. In addition, the generated heat of the circuit board 130 is circulated outside through a space separated from the main heat sink 110. In addition, the main heat sink 110 also receives a part of heat circulated and radiates heat to the outside.

In addition, the circuit boards 130 and 130 'of this embodiment form mounting holes 131 in the area where the CPU 300 is to be positioned, and on the upper surface of the main heat sink 110 where the mounting holes 131 are located, (120). A CPU socket 200 is mounted on the heat transfer plate 120, and a CPU 300 is mounted on the CPU socket 200.

However, since the CPU 300 also generates a lot of heat during its operation, the CPU 300 further includes a CPU heatsink 140 to dissipate heat. In the related art, a relatively large and electrically driven separate cooler is installed in the CPU 300, but in this embodiment, the CPU heatsink 140 is seated on the CPU 300. The CPU heatsink 140 for this purpose includes a main body 141 of a CPU heatsink 140 that covers the CPU 300 and a leg 142 that is drawn out from the main body 141 and installed in the main heat sink 110 . The through holes 132 through which the legs 142 of the CPU heat sink 140 pass are formed in the circuit boards 130 and 130 'of the present embodiment.

Subsequently, the main heat sink 110 constitutes an anchor 112 for installation of the legs 142. As shown in FIG. 1, the anchor 112 holds the end of the leg 142 passing through the circuit board 130 and fixes the CPU heatsink 140 so as to maintain the position.

The above-described connection architecture of the circuit board 130, the CPU 300, and the main heat sink 110 and the CPU heat sink 140 allows the heat generated in the circuit board 130 and the electronic components and the like to flow smoothly in the main heat sink 110 And the heat generated in the CPU 300 can be dissipated smoothly by the CPU heat sink 140 and the main heat sink 110 so that the CPU 300 and the circuit board 130 and the electronic components can be smoothly The driving environment can be maintained.

FIG. 4 is a plan view schematically showing another embodiment of a CPU and electronic parts constituting a computer on a main board according to the present invention, and FIG. 5 is a perspective view showing a rear surface of a circuit board according to the present invention.

The main board of the present embodiment additionally includes a VGA heat sink 150 to the VGA card 500. The VGA heat sink 150 includes a main body 510 for covering and discharging the VGA card 500, And constitutes a leg 152 that is drawn out to be connected to the main heat sink 110. The configuration and the installation structure of the VGA heat sink 150 are the same as those of the CPU heatsink 140, and a description thereof will be omitted here.

The VGA card 500 according to the present embodiment is formed by drilling the position of the circuit board 130 on which the VGA card 500 is installed to form a mounting hole (not shown) And the VGA card 500 is placed at that position. The VGA card 500 constitutes a VGA connection kit 510 for communication with the circuit board 130 and the circuit board 130 constitutes a connector 160 corresponding thereto. The connector 160 is connected to the BIOS 400 and other related electronic components such as the circuit board 400 and the graphics card so as to form a dedicated communication cable 161 for detachment / attachment with the VGA connection kit 510 do.

As a result, the VGA card 500 can be easily replaced according to the specification change without changing the circuit board 130, and the performance of the computer can be adjusted through this.

In addition, the main board 100 removes a PCI slot for mounting the VGA card 500 on the circuit board 130, and replaces the PCI slot with a VGA chipset method corresponding to the socket. In response to this, an upgraded system is constructed so that all the devices connected to the CPU 300 and the main board 100 can be smoothly returned to the remaining part of the BIOS 400 with stable sourcing such as Northbridge / Southbridge. If the main board 100 is changed to the above-described graphics chipset system, the cooling fan of the graphics card can be removed. Of course, the heat sink is reinforced to compensate for heat radiation, which is a function of the cooling fan.

For reference, VGA chipset is GT 730, 740. GTX 750 750TI, GTX 970, GTX 1060, GTX 1070, GTX 1080 and the like can be illustrated.

Subsequently, the main board 100 of this embodiment arranges the main heat sink 110 so as to be spaced apart from the circuit board 130 in order to add a new heat radiation function in place of the cooling fan. At this time, one or two first heat dissipating holes 133 for cooling the CPU 300 are formed at a position where the CPU 300 is located in the main heat sink 110, and one Or two or more second heat dissipating holes 134 are formed.

FIG. 6 is an exploded perspective view schematically showing the installation of the CPU heat sink in the main board according to the present invention, and FIG. 7 is a schematic view of an embodiment of the CPU heat sink shown in FIG. 6 installed in the main heat sink And Fig.

The legs 142 of the CPU heatsink 140 of the present embodiment are configured such that a pair of spaced support rods 142a and 142a ' (142b) are formed, and are made of an elastic material having flexibility.

The anchors 112 supporting the legs 142 include an insertion groove 112a into which the lower end of the leg 142 is inserted and a locking tab 142b of the leg 142 inserted into the insertion groove 112a Thereby forming a latching groove 112b which is formed to be engaged.

At this time, the protruding width of the engaging step 142b is longer than the diameter of the insertion groove 112a. When the engaging step 142b is inserted into the insertion groove 112a and engaged with the engaging groove 112b, 112).

7 (a), the leg 140 of the CPU heatsink 140 is passed through the through hole 132 of the circuit board 130 and the insertion groove 112a of the anchor 112 The supports 142a and 142a 'of the legs 142 receive the pressure of the anchor 112 received by the engaging jaws 142b when they are inserted into the through hole 132 and the insertion groove 112a, respectively When the engaging protrusion 142b is engaged with the engaging groove 112b as shown in FIG. 7 (b), the supports 142a and 142a 'are restored to their original shape by their own elasticity, .

When the operator then has to replace the CPU 300, the support bars 142a and 142a 'of the legs 142 are pressed by fingers, and the support tabs 142a and 142a' (112b) through which the legs 142 can be easily removed from the anchors 112.

FIG. 8 is a partial cross-sectional view showing a schematic view of another embodiment of a CPU heat sink according to the present invention installed on a main heat sink.

The leg 142 of the present embodiment has a pair of support rods 142a and 142a 'spaced apart from each other and has a ∩' shape and is arranged side by side, and a lower end of the leg 142b has a protruding protrusion 142b protruding outward As shown in Fig. 8 (a), it is formed in a shape of gradually dimming which is gradually adjacent to the lower end in a normal state as shown in Fig. 8 (a).

The CPU heatsink 140 of the present embodiment further includes a locker 143 for adjusting the distance between the supports 142a and 142a 'of the legs 142. [ The locker 143 includes an expansion member 143a made of a metal having a relatively large coefficient of thermal expansion and disposed so as to be able to move up and down between the support rods 142a and 142a ' And a lead-out member 143b penetrating the upper end of the lead frame 142. A handle 143d may be formed at the upper end of the drawing member 143b so that the user can easily operate the drawing member 143b.

Since the expansion member 143a must be capable of moving upward and downward smoothly between the supports 142a and 142a ', the guide rails 142c may be formed on the inner surface of the expansion members 143a in contact with the expansion members 143a. A connection member 143c corresponding to the guide rail 142c may be formed on the outer surface of the corresponding position of the guide rail 142c.

8 (a), when the lockers 143 are lifted up to the upper layer, the support members 142a and 142a 'are brought into contact with the lower ends of the support members 142a and 142a' So that the user can easily insert the supports 142a and 142a 'into the through hole 132 and the insertion groove 112a.

When the lockers 143 are forcibly lowered as shown in FIG. 8 (b) after the support rods 142a and 142a 'are inserted into the insertion grooves 112a of the anchors 112, the support rods 142a and 142a' The support tabs 142a and 142a 'are tightly fixed to the anchors 112 through the engagement grooves 112b. Further, the expansion member 143a pushes the supporting members 142a and 142a 'against each other while being expanded due to heat generated by the driving environment of the computer, thereby closely contacting the anchor 112 with the stable state of the CPU heat sink 140 It can be further stabilized.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

100; Main board 110; Main heat sinks 111 and 111 '; Linker
112; Anchor 112a; An insertion groove 112b; Latching groove
120; A heat transfer plate 130; A heat transfer plate 131; Installation ball
132; Through hole 140; CPU heatsink 141; main body
142; Legs 142a, 142a '; A support table 142b; Jaw
142c; Guide rails 143; Locker 143a; The expansion member
150; VGA heat sink 152; Legs 160; connector
161; A communication cable 200; CPU socket 210; Pin modular
220; Circuit kit modulator 230; A heating plate sensor 300; CPU
400; Bios 410; Communication cable 411; connector
500; VGA card 600, 700; Memory 700 '; Sound card

Claims (7)

A heat sink main heat sink; A circuit board disposed in parallel and spaced apart from the main heat sink; A bios mounted on the circuit board so as to be detachably connected to a circuit kit modular which receives a signal of a CPU mounted on a CPU socket and outputs the processed signal in accordance with a designation process; And a CPU heatsink including a main body for covering and dissipating the CPU and legs extending from the main body and passing through the circuit board and connected to the main heat sink,
Wherein the circuit board includes a through hole through which the leg of the CPU heatsink penetrates;
The legs of the CPU heatsink further include a pair of supports spaced apart from each other and arranged side by side. The legs of the CPU heatsink have hooks protruding outwardly at the lower end thereof, And is made of an elastic material;
And a locker which is composed of a metal expansion member arranged to be able to move upward and downward between the supports and having a relatively large thermal expansion rate and a drawing member drawn upward of the expansion member and passing through the upper end of the leg,
The main heat sink further includes an anchor in which an insertion groove into which the lower end of the leg is inserted and an engagement groove in which the engagement jaw of the leg inserted into the insertion groove is engaged,
Which can be replaced by a variety of CPUs. delete The method according to claim 1,
Further comprising a heat transfer plate installed in the main heat sink where the mounting hole of the circuit board is located for heat transfer of the CPU socket;
Which can be replaced by a variety of CPUs. delete delete A heat sink main heat sink; A circuit board disposed in parallel and spaced apart from the main heat sink; A CPU socket further comprising a circuit kit modular that receives a signal of a CPU and processes it according to a designated process and outputs the processed result; A CPU mounted on the CPU socket; A bios that is detachably connected to the circuit kit module through a communication cable and mounted on the circuit board; And a CPU heatsink including a main body for covering and dissipating the CPU and legs extending from the main body through the circuit board and having a lower end connected to the main heat sink,
Wherein the circuit board includes a through hole through which the leg of the CPU heatsink penetrates, the through hole being formed by forming an installation hole to be opened by the main heat sink to locate the CPU socket;
The legs of the CPU heatsink further include a pair of supports spaced apart from each other and arranged side by side. The legs of the CPU heatsink have hooks protruding outwardly at the lower end thereof, And is made of an elastic material;
And a locker which is composed of a metal expansion member arranged to be able to move upward and downward between the supports and having a relatively large thermal expansion rate and a drawing member drawn upward of the expansion member and passing through the upper end of the leg,
The main heat sink further includes an anchor in which an insertion groove into which the lower end of the leg is inserted and an engagement groove in which the engagement jaw of the leg inserted into the insertion groove is engaged,
A variety of CPU interchangeable CPU connection architectures. The method according to claim 6,
Further comprising a heat transfer plate installed in a main heat sink where a mounting hole of the circuit board is located for heat transfer of the CPU socket;
The CPU socket further includes a heat transfer plate sensor for sensing a temperature change of the heat transfer plate and outputting a sensing result according to a setting process;
A variety of CPU interchangeable CPU connection architectures.

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