KR101881449B1 - Reflow soldering machine - Google Patents

Abstract

The present invention relates to a reflow soldering apparatus for an SMT process, which has little restriction on an installation space and is capable of mounting (soldering) components of a circuit board by LEDs without using gas, and more particularly, to a reflow device for mounting (soldering) a circuit board provided with a plurality of components. The reflow soldering device comprises: a main body unit in which a circuit board is able to move; a heat source unit which is disposed in the main body unit to irradiate light by power applied thereto and heat the component to be mounted on the circuit board so as to mount the component on the circuit board (PCB); and a controller which controls the main body unit and the heat source unit, wherein the controller controls a heat generation temperature of the heat source unit through photographing information including the height and a position of the component provided on the circuit board. The controller includes: a side camera provided in the main body unit and photographing a front surface or a back surface of the circuit board inserted into the main body unit, and then transmitting the photographed image to a microcomputer; a planar camera provided in the main body unit and photographing a plane of the circuit board inserted into the main body unit, and then transmitting the photographed image to the microcomputer; and a heat source power unit applying different power values to the heat source unit through the photographed image transmitted to the microcomputer so as to generate heat with different heat generation temperatures.

Description

[0001] REFLOW SOLDERING MACHINE [

The present invention relates to a reflow soldering apparatus for an aerial process, which is capable of mounting (soldering) components of a circuit board with LEDs without using a gas, and has a limited installation space.

In general, a reflow soldering machine used in a SMT (Surface Mount Technology) process is a soldering process in which a lead frame and a printed circuit board (PCB) are attached to each other, or a small electronic component such as a semiconductor chip or a resistance chip is mounted on a PCB, Is a device for attaching the solder paste to the PCB through a process of heating or cooling.

1, the conventional reflow soldering machine includes a transfer part 11, an oven 12, an evacuation part 14, and the like in an integrally formed chamber 10, The PCB 30 having the solder paste applied to the transfer unit 11 is transferred by the conveyor of the transfer unit 11 and is preheated and heated by the oven 12, Process. A lead frame, a semiconductor chip, or the like is soldered onto the PCB 30.

Thereafter, the PCB 30 passes through the exhaust part 14, and the carbonized gas of the solder paste generated by the melting of the solder is recovered and discharged. The solder is cooled and solidified, thereby soldering the PCB 30.

However, such a conventional reflow soldering machine is too large to be installed in space, and the amount or pressure of the gas supplied by the influence of external devices is not stably provided, so that the gas supplied into the oven 12 is always supplied The solder is not supplied in a uniform state, resulting in poor solderability of the PCB 30.

Korean Registered Utility Model No. 20-0450996 (Notice date: November 16, 2010)

SUMMARY OF THE INVENTION The present invention has been proposed in order to solve the above-mentioned problems, and it is an object of the present invention to provide a reflow soldering machine in which mounting of a PCB (soldering) is easy without space restriction on the iron, .

According to an aspect of the present invention, there is provided a reflow soldering apparatus for reflow soldering a reflow soldering apparatus for soldering a circuit board having a plurality of components, the reflow soldering apparatus including: A heat source unit provided in the main body unit for irradiating illumination with a power source applied thereto and heating the component to be mounted on the circuit board to mount the component on the circuit board PCB, And a controller for controlling the heat source unit and controlling the heat generation temperature of the heat source unit through photographing information including a height and a position of the component provided on the circuit board, wherein the controller is provided in the main body unit, A side camera for photographing a front surface or a back surface of the circuit board which is drawn into the inside and transmitting the photographed image to the microcomputer, A plane camera for photographing a plane of the circuit board drawn into the main body and transmitting the photographed image to the microcomputer, a power supply unit for supplying power to the heat source unit through the photographed image transmitted to the microcomputer, And a heat source power unit for generating heat with different heat generation temperatures.

The main body is divided into a photographing space and a vacuum chamber by a partition wall having a hollow shape, and the side camera and the plane camera are provided to photograph the photographing space part. The vacuum cleaner according to any one of claims 1 to 3, wherein the vacuum cleaner comprises a vacuum cleaner and a vacuum cleaner. A conveyor belt that is rotatably disposed at the lower portion and moves the circuit board drawn into the photographing space portion to the inside of the vacuum chamber and moves the circuit board having the component mounted thereon to the outside of the lower body by the heat source portion, .

The upper body may further include a pressure pad for absorbing vibrations derived from the conveyor belt for pressing the outer surface of the heat source unit provided inside the vacuum chamber or inside the upper body to move the circuit board .

The heat source unit may include a plurality of insertion holes formed in a plate shape and having a length in the horizontal or vertical direction, a heat source plate and a bar electrically connected to the heat source power source unit, And a plurality of LEDs arranged in the lower portion to illuminate the plurality of LEDs so as to have different heat generating temperatures according to power values applied from the heat source power source portion in the longitudinal direction, wherein the heat source power portion supplies power to the plurality of LEDs individually So that each of the LEDs can operate with different heat generation temperatures.

According to the present invention, since the moving distance for moving the circuit board to mount the components differently from the conventional one is short, restrictions on the installation space are extremely small, and depending on the positions and heights of the parts provided on the circuit board, It is possible to mount the circuit board on the circuit board in such a manner that damage to the component can be prevented by a large number of LEDs that generate heat.

1 shows a conventional reflow soldering machine;
2 shows a reflow soldering apparatus for an SMT process according to the present invention.
3 is a sectional view of Fig. 2; Fig.
4 is a cross-sectional view showing a main body of a reflow soldering apparatus for smith process according to the present invention.
5 is an enlarged view of Fig.
6 is a view showing a heat source providing plate and a lighting bar of a heat source unit for a reflow soldering apparatus for an SMT process according to the present invention.
7 is a conceptual view showing a controller for a reflow soldering apparatus for an SMT process according to the present invention.
Fig. 8 is a functional relationship diagram of a side camera and a plane camera according to Fig. 7; Fig.
9 is a view showing photographing information photographed by a side camera and a plane camera according to FIG. 8. FIG.
FIG. 10 is a view showing a state in which a microcomputer controls a heat source power unit based on photographing information of FIG. 9, and a direct upper area and a non-control area are set.
11 is a view showing a state in which the LEDs of the upper right zone and the non-control zone of FIG. 10 are operated.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, reflow soldering apparatus for smith process according to the present invention (hereinafter, briefly referred to as a reflow apparatus) will be described in detail with reference to the accompanying drawings.

2 and 3, the reflow apparatus 1 according to the present invention may include a main body 100, a heat source 200, and a controller 300.

4 and 5, the main body 100 includes a circuit board 300 having a plurality of components C provided with a controller 300 and a heat source unit 200 to be described later, The upper body 120 and the conveyor belt 130 in a configuration for photographing a PCB and providing a work space that can be mounted by a heat source.

For example, the lower body 110 is formed so as to have a hollow shape as a whole, and the inside of the lower body 110 is divided into a photographing space 112 and a vacuum chamber 113 Respectively.

A circuit board PCB moving from the outside enters the first imaging space part 112 and moves to the vacuum chamber 113 on both sides of the lower body 110 and the circuit board PCBs) can be moved by the conveyor belt 130 to the outside of the lower body 110. The first doors 115 are opposed to each other.

At this time, the intermediate door 116, which is opposed to each other and is openable and closable, is formed between the first doors 115 facing each other on the partition wall 111 partitioning the photographing space part 112 and the vacuum chamber 113, The hot air generated in the vacuum chamber 113 enters the photographing space 112 and does not interfere with the side camera 320 or the plane camera 330 described later. It is preferable that a heat insulating material (not shown) is further provided on an end surface of the barrier rib 111.

A lateral camera 320 is installed on the front and rear surfaces of the photographing space 112 so as to be controlled by the controller 300 and is mounted on the circuit board PCB Allow front / back / plane to be shot at one time.

The upper part of the vacuum chamber 113 is opened to form a first seating step 114 on which a diffusion glass 230 to be described later can be installed. .

A plurality of through holes are formed in both sides of the diffusion glass 230 so that waste heat in the vacuum chamber 113 can be introduced by suction of the exhaust fan 121.

The diffusing glass 230 is used to transmit the heat temperature (150 to 300 ° C) to the circuit board (PCB) for mounting the component C through the illumination of each of the LEDs 221 irradiated so as to have a straight- And an embossing (not shown) having a downward arc shape is formed on a surface facing the LED 221 so that the diffusion effect can be maximized.

A driving motor 131 for operating the controller 300 from outside or rotating the conveyor belt 130 is installed in the lower portion of the lower body 110 so that the circuit board PCB is mounted on the photographing space 112 To the vacuum chamber 113. The mounting space 117 may be formed in the vacuum chamber 113 so that the vacuum chamber 113 can be moved sequentially.

The installation space 117 allows the imaging space 112 and the vacuum chamber 113 to form an independent space in the imaging space 112 and the vacuum chamber 113 by the bottom panel forming the vacuum chamber 113 .

The upper body 120 is opened to communicate with the inside of the vacuum chamber 113 so that the upper body 120 can be separated from the upper portion of the vacuum chamber 113 so that airtightness can be maintained inside the vacuum chamber 113 .

A second seating step 122 is formed in the upper body 120 so that the heat source unit 200 having a plate shape as a whole can be provided and a plurality of exhaust fans 121 So that the waste heat generated in the vacuum chamber 113 can be exhausted to the outside of the main body 100.

An exhaust path 123 communicating with the exhaust fan 121 may be formed on the inner surface of the upper body 120 so that waste heat can be smoothly exhausted by the exhaust fan 121. In the exhaust path 123, An inlet is formed on the inner surface of the upper body 120 so that the waste heat in the vacuum chamber 113 can be sucked from the lower part of the second mounting jaw 122 and the outlet is connected to the exhaust fan 121, So that it can be discharged through the exhaust fan 121.

In addition, the exhaust fan 121 is not operated during the operation time for mounting the component C and the circuit board (PCB) in the vacuum chamber 113 through the heat source unit 200, but is temporarily operated after the mounting The heat loss of the heat source unit 200 is minimized. Although not shown, the waste heat absorbed through the exhaust fan 121 is collected through a duct (not shown), purified and exhausted to the outside of the workplace.

Further, the second door 125 may be provided on the upper portion of the upper body 120 so as to be rotatable by a hinge or the like so that the plate-shaped heat source unit 200 can be easily separated from and coupled to the upper body 120 have.

At this time, under the second door 125, the heat source unit 200, which absorbs vibration transmitted to the heat source unit 200 by the operation of the conveyor belt 130 and is seated on the second seating unit 122, It is preferable that the pressing pad 124 made of a material such as rubber is formed so as to be fixed by the pressing pad 124. [

The pressure pad 124 is further formed to protrude downward below the upper body 120 so as to be equally applicable to the diffusion glass 230 so as to be seated on the first seating jaw 114 of the vacuum chamber 113 And may be provided to pressurize the outer surface of the diffusion glass 230.

The conveyor belt 130 is divided into the photographing space 112, the vacuum chamber 113 and the space portion 117. The conveyor belt 130 is disposed inside the photographing space 112 from outside the lower body 110, PCB is moved to the inside of the vacuum chamber 113 and the circuit board PCB moved into the vacuum chamber 113 is moved to the inside of the vacuum chamber 113, And to be easily moved to the outside of the lower body 110 again.

The conveyor belt 130 includes a plurality of rollers 132 and a moving belt 133 provided in the driving motor 131, the image pickup space 112 and the vacuum chamber 113 provided in the installation space 117, A plurality of rollers 132 are rotatably and axially coupled to the lower body 110 adjacent to each other and a moving belt 133 is formed on the outer surface of each of the rollers 132 in a ring shape, So as to surround the outer surface of the roller 132 so as to be rotatable by the driving motor 131.

The driving motor 131 is connected to at least one of the plurality of rollers 132 by a chain or the like so that the plurality of rollers 132 are rotated at a time to rotate the moving belt 133.

2 and 6, the heat source unit 200 may provide different temperatures depending on the height of the component C provided on the circuit board PCB moved into the vacuum chamber 113 And a light source providing plate 210 and an illumination bar 220 in a configuration for minimizing damage to the component C and being mounted so as to be electrically connected to a circuit board (PCB).

For example, the heat source providing plate 210 is formed to have a plate shape as a whole and the lower surface thereof is supported by the second seating step 122 described above and the upper surface thereof is supported by the pressure pad 124 formed below the second door 125 So that it can be installed in the upper body 120.

At this time, it is preferable that the heat source providing plate 210 is formed such that the insertion holes 211 for inserting the illumination bars 220 to be described later are adjacent to each other in the widthwise or lengthwise direction.

In addition, the heat source providing plate 210 is provided on the upper body 120 so as to be electrically connected to the heat source power source 340 of the controller 300, through the lighting bar 220 inserted through the insertion hole 211, A circuit is formed so that the LEDs 221 are electrically connected to the heat source providing plate 210 to be controlled individually.

In addition, the illumination bar 220 is formed to have a bar shape as a whole so that the outer surface thereof can be inserted into the insertion hole 211 in a shape fitting manner. A plurality of LEDs 221 can be separated / A plurality of fitting grooves 222 are formed in the longitudinal direction.

The terminals of the LED 221 coupled to the respective fitting grooves 222 are coupled to the connection terminals formed on the bottom surface of the insertion hole 211 so that the plurality of LEDs 221 are connected by the heat source power unit 340 Respectively, so that they can generate heat with different temperatures according to the applied power (difference in resistance value).

The plurality of lighting bars 220 provided on the heat source providing plate 210 are installed in the heat source providing plate 210 such that the LEDs 221 are arranged in a grid pattern as a whole, The upper body 120 may have different standards according to the standard of the printed circuit board (PCB).

2 and 7, the controller 300 includes a side camera 320, a flat camera 330, and a side camera 320 for controlling the main body 100 and the heat source 200, The microcomputer 310 includes a heat source power unit 340 and controls the side camera 320, the flat camera 330 and the heat source power unit 340 as a whole.

Herein, the microcomputer 310 controls the exhaust fan 121 so that components and circuit boards are mounted in the vacuum chamber 113 through the heat source power supply unit 340, and then the waste heat is discharged to the outside of the main body 100 So that it can be discharged.

For example, at least one side camera 320 may be installed on the outer surface of the lower body 110 so as to photograph the inside of the photographing space 112, so that the front or back side of the circuit board (PCB) And transfers the photographing information to the microcomputer 310 (see Fig. 8).

Although not shown, the side camera 320 or the planar camera 330 described later can adjust the lens (not shown) according to the overall specification of the circuit board (PCB) So that the exact position and height of the component C can be analyzed according to the specification of the circuit board PCB.

The plane camera 330 is installed on the upper surface of the lower body 110 so as to photograph the inside of the photographing space 112 and photographs the plane of the circuit board PCB drawn into the photographing space 112, And transmits the information to the microcomputer 310.

In addition, the heat source power unit 340 is configured to individually control each of the LEDs 221 under the control of the microcomputer 310 based on the photographing information acquired by the microcomputer 310. [

The microcomputer 310 recognizes the height of each component C and the position of the component C in the circuit board PCB through the photographing information, And the heating temperature is controlled by varying the heating temperature according to the height of the component C so that the damage to the component C is minimized so that it can be mounted on the circuit board PCB .

The height of each component recognized by the microcomputer 310 means an interval between the upper surface P of the component C and the surface of the LED 221 or the diffusion glass 230. In the detailed description of the present invention, The interval between the upper end points P on the lower surface of the glass 230 is defined as corresponding component heights h1, h2 and h3 (see FIG. 11).

8 to 11, when a circuit board (PCB) is drawn into the image taking space 112 by the conveyor belt 130, the side camera 320 and the plane camera 330 are connected to the corresponding circuit (PCB), and transfers the photographed image information to the microcomputer 310. [0050] FIG.

Then, the microcomputer 310, which has received the image information, combines the image information with the comparison data to generate the image data of the component 1 (C1), the component 2 (C2), and the component 3 (C3) The photographing information analyzing the height and the position is obtained.

Finally, the microcomputer 310 determines whether the corresponding component 1 (C1), component 2 (C2), and component 3 (C3) among the plurality of LEDs 221 provided in the heat source unit 200 The microcomputer 310 controls the heat source power supply unit 340 based on the distinction information so as to distinguish between the LED 221 located in the upper right zone Z1 and the LED 221 ' Different power values are applied so that the heat generation temperatures of the LEDs 221 and 221 'may be different from each other based on the Z1 and Z2.

At this time, the heat generation temperature of the LED 221 belonging to the control zone Z1 can be applied also according to the height of the components C1, C2, C3 included in the shooting information, So that it can be maximized.

For example, as shown in the figure, the height h2 of the part 2 (C2) is higher than the heights h1 and h3 of the parts 1 (C1) and 3 (C3) Is lower than the height h1 of the component 1 (C1), the heat source power supply unit 340 applies the power so that the difference in the heat generation temperature becomes the component 2 <component 1 <component 3.

In addition, the heating temperature of the LED 221 'corresponding to the non-control zone Z2 in the present invention is a temperature at which a plurality of components C1, C2, and C3 provided on the circuit board PCB can be mounted it means.

The reflow apparatus 1 according to the present invention having the above-described structure has a very small restriction on the installation space because the moving distance of the circuit board (PCB) to mount the component C is different from the conventional one And a plurality of LEDs 221 that generate heat at different temperatures depending on the positions and heights of the components C mounted on the circuit board PCB to prevent the components C from being damaged. It is possible to implement the mounting.

The specific embodiments of the present invention have been described above. It is to be understood, however, that the spirit and scope of the invention are not limited to these specific embodiments, but that various changes and modifications may be made without departing from the spirit of the invention, If you are a person, you will understand.

Therefore, it should be understood that the above-described embodiments are provided so that those skilled in the art can fully understand the scope of the present invention. Therefore, it should be understood that the embodiments are to be considered in all respects as illustrative and not restrictive, The invention is only defined by the scope of the claims.

1: Reflow soldering apparatus for smith process according to the present invention
100: main body 110: lower body
111: partition wall 112:
113: vacuum chamber 114: first seating chin
115: first door 116: middle door
117: installation space part 120: upper body
121: exhaust fan 122: second seating chin
123: exhaust path 124: pressure pad
130: Conveyor belt 131: Driving motor
132: roller 133: moving belt
200: heat source part 210: heat source providing plate
211: Insertion ball 220: Lighting bar
221: LED 222:
230: diffusion glass 300: controller
310: Microcomputer 320: Side camera
330: plane camera 340: heat source unit
C: Component PCB: Circuit board

Claims (4)

1. A reflow apparatus for mounting (soldering) a circuit board having a plurality of components,
A main body 100 on which the circuit board PCB is movable;
(C) is mounted on the circuit board (PCB), and the component (C) is mounted on the circuit board A heat source unit 200 mounted on the PCB; And
The temperature of the heat source 200 can be controlled through the photographing information including the height and the position of the component C provided on the circuit board PCB by controlling the main body 100 and the heat source 200, And a controller (300)
The controller (300)
A side camera 320 provided in the main body 100 for photographing the front or back side of the circuit board PCB drawn into the main body 100 and transmitting the photographed image to the microcomputer 310, A planar camera 330 provided in the main body and photographing the plane of the circuit board PCB drawn into the main body 100 and transmitting the photographed image to the microcomputer 310, And a heat source power unit (340) for applying different power values to the heat source unit (200) through the transmitted photographed images to generate heat having different heat generation temperatures,
The main body 100 includes:
The side camera 320 and the plane camera 330 are divided into a photographing space 112 and a vacuum chamber 113 by partition walls 111 provided in the inside, A lower body 110 for taking a picture of the part 112;
A plurality of exhaust fans 121 are installed on the lower body 110 so as to be able to be separated and coupled to open and close the vacuum chamber 113 and to discharge waste heat generated in the vacuum chamber 113 to the outside, An upper body 120 having the heat source unit 200 therein; And
A circuit board PCB which is rotatably disposed under the lower body 110 and is drawn into the image taking space 112 is moved into the vacuum chamber 113 and the heat source unit 200 And a conveyor belt (130) for moving the circuit board (PCB), which has been mounted on the lower body (C), to the outside of the lower body (110).
delete The method according to claim 1,
The upper body 120
The heat source unit 200 provided in the vacuum chamber 113 or the conveyor belt 100 for moving the circuit board PCB by pressing the outer surface of the heat source unit 200 provided inside the upper body 120 Further comprising a pressure pad (124) for absorbing vibrations derived from the substrate (130).
The method according to claim 1,
The heat source unit 200 includes:
A heat source plate 210 having a plurality of insertion holes 211 formed in a plate shape and having a length in the horizontal or vertical direction and electrically connected to the heat source power supply unit 340; And
A plurality of LEDs which are formed in a bar shape so as to be inserted into the insertion holes 211 so as to have a different heating temperature according to a power supply value applied by the heat source power supply unit 340 in the longitudinal direction, And an illumination bar (220) in which a light source (221) is arranged,
Wherein the heat source power supply unit 340 applies power to each of the plurality of LEDs 221 so that each of the LEDs 221 can operate with different heat generation temperatures. Device.

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