KR101880305B1 - Cleaning composition using electronic material - Google Patents

Abstract

More particularly, the present invention relates to a cleaning liquid composition for electronic materials, which comprises silsesquioxane, an organic acid and an organic amine and is excellent in removing organic contaminants and particles present on the surface of a glass substrate or a metal film, The present invention relates to a cleaning liquid composition for electronic materials, which is excellent in corrosion prevention effect against metal wiring such as aluminum.

Description

CLEANING COMPOSITION USING ELECTRONIC MATERIAL [0001]

The present invention relates to a cleaning liquid composition for electronic materials.

An electronic material used for a semiconductor device, a liquid crystal display such as a FPD, etc. is manufactured through various processes, and specific examples thereof include a film forming process, an exposure process, a wiring etching process, and the like. Particles having a size of 1 탆 or less are adhered to cause contamination of the substrate. When the following process steps are carried out with such contaminants adhering to the substrate, pinholes, pits, wirings, and bridges of the film are generated, thereby significantly decreasing the production yield of products. Therefore, cleaning for removing such contaminants is carried out between respective processes, and various cleaning liquids have been introduced for this purpose.

Korean Patent Registration No. 10-0503231 discloses a semiconductor and TFT-LCD detergent composition comprising a specific alkanolamine compound, an organic solvent, a chelate compound, a nonionic surfactant, and water. However, since it contains a chelate compound that causes color change, color change of the detergent and precipitation during long-term use occur, and there is a problem that aluminum method is difficult.

Korean Patent Publication No. 2007-0107242 relates to a copper molybdenum detergent which is limited in its use due to no effect on aluminum and has a problem of low neutralizing or weakly acidic detergency as compared with an alkaline detergent.

Korean Patent No. 10-0503231 Korea Patent Publication No. 2007-0107242

Disclosure of Invention Technical Problem [8] The present invention has been made to solve the above-mentioned problems of the prior art, and it is an object of the present invention to provide a method of manufacturing a semiconductor device, which is excellent in removing organic contaminants or particles that contaminate a glass substrate or a metal film in a process of manufacturing an electronic material, It is an object of the present invention to provide a cleaning liquid composition which is excellent in corrosion resistance against metal wiring such as aluminum.

In order to achieve the above object, the present invention provides a cleaning liquid composition for electronic materials comprising silsesquioxane, an organic acid and an organic amine represented by the following general formula (1).

[Chemical Formula 1]

_{(R 1 SiO 3/2)} n

In Formula 1, n is an integer of 8 to 100, and R ₁ is independently of each other hydrogen, alkyl, alkylene, allyl, allylene or functional alkyl, alkylene, allyl,

INDUSTRIAL APPLICABILITY The cleaning liquid composition for an electronic material of the present invention is excellent in the ability to remove organic contaminants and particles present on the surface of a glass substrate such as an electronic material or a metal film surface and is excellent in corrosion resistance against metal wirings such as aluminum and aluminum alloy The effect is excellent. In addition, since it contains a large amount of water, handling is easy and environmentally advantageous.

Hereinafter, the present invention will be described in detail.

The present invention provides a cleaning liquid composition for electronic materials comprising silsesquioxane represented by the following general formula (1), an organic acid and an organic amine.

[Chemical Formula 1]

_{(R 1 SiO 3/2)} n

In Formula 1, n is an integer of 8 to 100, and R ₁ is independently of each other hydrogen, alkyl, alkylene, allyl, allylene or functional alkyl, alkylene, allyl,

Further, the cleaning liquid composition for electronic materials preferably contains 0.001 to 5% by weight of silsesquioxane, 0.01 to 10% by weight of organic acid, 0.05 to 10% by weight of organic amine, and the balance of water, based on the total weight of the cleaning liquid composition desirable.

In addition, the cleaning liquid composition for electronic materials preferably further comprises a water-soluble organic solvent, and the water-soluble organic solvent is preferably contained in an amount of 0.05 to 40% by weight based on the total weight of the cleaning composition.

Specifically, the silsesquioxanes represented by Formula 1 have thermal stability, durability and corrosion inhibition properties and are generally used for the development of coating fillers and organic-inorganic composite materials. However, in the present invention, By adding it to the composition, the system effect of the metal wiring is excellent.

It is preferable that the silsesquioxane is contained in an amount of 0.001 wt% to 5 wt% with respect to the total weight of the detergent composition, and when the content of the silsesquioxane is less than 0.001 wt% %, The coating remains on the surface of the metal wiring.

At this time, the silsesquioxanes may have various structures such as a random type, a ladder type, a cage type, and a partial cage type, and the structure thereof is not particularly limited.

In the case of the present invention, the organic acid preferably has an organic phosphoric acid compound or a polycarboxylic acid copolymer and has a contaminant removal and system effect.

The organophosphorus compound exhibits an excellent effect for removing organic contaminants or particles located on a glass substrate and has a metal corrosion prevention effect.

Specifically, the organic acid is selected from the group consisting of aminotri (methylenephosphonic acid), ethylidene diphosphonic acid, 1-hydroxyethylidene-1,1-diphosphonic acid, 1-hydroxypropylidene- (Methylenephosphonic acid), 1,2-propylene diamine tetra (methylenephosphonic acid), dodecylaminbis (methylenephosphonic acid), nitrotris (Methylenephosphonic acid), ethylenediamine bis (methylenephosphonic acid), ethylenediamine tetra (methylenephosphonic acid), hexenediamine tetra (methylenephosphonic acid), diethylenetriaminepenta (methylenephosphonic acid), cyclohexanediamine tetra Phosphonic acid), hydroxyphosphonoacetic acid, and 2-phosphinic acid butane-1,2,4-tricarboxylic acid.

In addition, the polycarboxylic acid copolymer serves to prevent corrosion of the metal by forming an overcoat layer on the surface of the metal to suppress excessive reaction between the metal and the alkali ion.

Specifically, the organic acid preferably includes a polycarboxylic acid copolymer represented by the following formula (2).

(2)

Wherein R ₂ to R ₄ independently represent hydrogen, methyl group, ethyl group or - (CH ₂ ) _m COOM ₂ , and M ₁ and M ₂ independently represent hydrogen, an alkali metal, an alkaline earth metal or an ammonium group And m ₁ and m ₂ are independently an integer of 0 to 2.

At this time, the ammonium group is an ammonium (NH ₄ ^+), but also meant to include also ammonium, one or more of the hydrogen atoms bonded to the nitrogen atom is substituted by other substituents, and, for example, the ammonium group may include alkyl ammonium.

The alkali metal is preferably Li, Na, K, Rb, Cs or Fr, and the alkaline earth metal is preferably Ca, Sr, Ba, or Ra.

Specific examples of the polycarboxylic acid copolymer include polyacrylic acid polymer (PAA), polymethyl (meth) acrylic acid copolymer (PMAA), polyacrylic acid maleic acid copolymer (PAMA), poly (methyl methacrylate) PAMAA), a polymaleic acid copolymer (PMA), a polymethyl (meth) acrylic acid maleic acid copolymer (PMAMA), and salts thereof.

The organic acid is preferably contained in an amount of 0.01 to 10% by weight based on the total weight of the cleaning liquid composition. If the content of the organic acid is less than 0.01% by weight, not only the corrosion resistance against the metal wiring becomes insufficient, If it is more than 10% by weight, the particle detergency is lowered due to a decrease in pH, and the rinse force is lowered due to an increase in the viscosity of the cleaning liquid.

The organic amine is preferably represented by the following formula (3) or (4).

(3)

[Chemical Formula 4]

In the above formula (3) or (4), R ₅ to R ₁₁ independently represent hydrogen; An alkyl group having 1 to 10 carbon atoms which is unsubstituted or substituted with an amino group; An alkyl group having 1 to 10 carbon atoms substituted with an amino group substituted with an alkyl group having 1 to 4 carbon atoms; An alkenyl group having 2 to 10 carbon atoms; A hydroxyalkyl group having 1 to 10 carbon atoms; An alkyl group having 1 to 10 carbon atoms which is substituted with a carboxyl group or a hydroxy group and is substituted with an alkoxy group having 1 to 10 carbon atoms; An amino group substituted or unsubstituted with an alkyl group having 1 to 4 carbon atoms; A phenyl group substituted or unsubstituted with an alkyl group having 1 to 4 carbon atoms; Or a benzyl group substituted or unsubstituted with an alkyl group having 1 to 4 carbon atoms, and two adjacent groups in R ₅ to R ₁₁ may be bonded to each other to form a ring. In Formula 4, R ₁₂ is an unsubstituted alkylene group having 1 to 10 carbon atoms.

The organic amine may be selected from the group consisting of methylamine, ethylamine, monoisopropylamine, n-butylamine, sec-butylamine, isobutylamine, t-butylamine, pentylamine, dimethylamine, diethylamine, dipropylamine, But are not limited to, aliphatic amines such as diethylamine, diisopropylamine, dibutylamine, diisobutylamine, methylethylamine, methylpropylamine, methylisopropylamine, methylbutylamine, methylisobutylamine, trimethylamine, , 2-aminoethanol, 2- (ethylamino) ethanol, 2-ethylhexylamine, diethanolamine, triethanolamine, monopropanolamine, - (methylamino) ethanol, N-methylethanolamine, N-methyldiethanolamine, N, N-dimethylethanolamine, N, N-diethylaminoethanol, 2- Amino-2-propanol, 2-amino-1-propanol, 3- (Butoxymethyl) dimethylamine, (methoxymethyl) dimethylamine, (methoxymethyl) dimethylamine, butoxymethyldimethylamine, (Methoxymethyl) aminoethanol, methyl (methoxymethyl) aminoethanol, methyl (methoxymethyl) aminoethanol, and the like. (2-hydroxyethyl) piperazine, 1- (2-aminoethyl) piperazine, 1- (2-hydroxyethyl) Methylpiperazine, 1-amino-4-methylpiperazine, 1-benzylpiperazine, 1-phenylpiperazine, N (3-aminopropyl) morpholine, , N, N ', N'-tetramethylpropanediamine, N, N, N', N'-tetramethylhexanediamine, , N'-tetramethylethylenediamine, and at least one selected from the group consisting of Aminoethanol), N-methylethanolamine, N-methyldiethanolamine, N, N-diethanolamine, N, N ', N', N'-tetramethylethylenediamine, N, N-diethylaminoethanol and 2- N ', N'-tetramethylhexanediamine, N, N, N', N'-tetraethylmethanediamine and N, N ', N'-tetramethylethylene Diamine. ≪ / RTI >

The amount of the organic amine is preferably 0.05 to 10% by weight, more preferably 0.1 to 5% by weight based on the total weight of the cleaning liquid composition. The pH of the cleaning liquid composition containing the organic amine is preferably pH 7 to pH 13, more preferably pH 8 to pH 11.

If the content of the organic amine is less than 0.05% by weight, a satisfactory cleaning effect can not be attained. If the content of the organic amine exceeds 10% by weight, the pH is increased and the corrosion to aluminum or aluminum alloy wiring increases. There is a problem to drop.

A water-soluble organic solvent may be further included in the cleaning liquid composition containing the silsesquioxane, the organic acid, and the organic amine. At this time, the water-soluble organic solvent serves to dissolve organic contaminants and lowers the surface tension of the cleaning liquid to increase the wettability to the glass substrate, thereby improving the cleaning power.

The water-soluble organic solvent is preferably at least one selected from the group consisting of a proton-polar solvent and an aprotic polar solvent. Specifically, as the protonic polar solvent, at least one solvent selected from the group consisting of ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monoisopropyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene Ethylene glycol monomethyl ether, glycol monoisopropyl ether, diethylene glycol monobutyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, triethylene glycol monoisopropyl ether, triethylene glycol monobutyl ether, polyethylene glycol monomethyl ether, polyethylene glycol Propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, tripropylene glycol monomethyl ether and propylene glycol monomethyl ether acetate, with the aprotic polar solvent, N-methylpyrrole (NMP), N-ethylpyrrolidone, 1,3-dimethyl-2-imidazolidinone, 1,3-dipropyl-2-imidazolidinone,? -Butyrolactone, dimethylsulfoxide N, N-dimethylformamide, acetamide, N-methylacetamide, N, N-dimethylacetate, N, N-dimethylacetamide, Amide, N- (2-hydroxyethyl) acetamide, 3-methoxy-N, N-dimethylpropionamide, 3- (2-ethylhexyloxy) -N, N- -N, N-dimethylpropionamide, and the like.

The increase in the amount of the protonic polar solvent improves the removal performance of the detergent by water, thereby solving the problem that the contaminants remain on the surface, and since the aprotic polar solvent can improve the removal of organic contaminants, desirable.

When the water-soluble organic solvent is contained in the cleaning liquid composition, it is preferably contained in an amount of 0.05 to 40% by weight, more preferably 0.5 to 20% by weight based on the total weight of the cleaning liquid composition. If the content of the water-soluble organic solvent is less than 0.05% by weight, an increase in the solubility of the cleaning liquid composition to organic contaminants can not be expected. If it exceeds 40% by weight, the performance of the cleaning liquid deteriorates.

Further, the cleaning liquid composition may further include deionized water. The deionized water contained in the cleaning liquid composition of the present invention improves the activity of the basic compound to increase the cleaning speed of the organic contaminants and particles. The organic contaminants remaining on the substrate during the rinsing process with the deionized water, Particles can be removed quickly and completely.

Hereinafter, the present invention will be described in detail by way of examples.

However, the following examples are illustrative of the present invention, and the present invention is not limited to the following examples.

≪ Example 1 >

0.5 weight% of (3- (2-aminoethyl) aminopropyl) methoxytriminated silsesquioxane as the silsesquioxane, 1-hydroxyethylidene-1,1-diphosphonic acid (HEDP) 2.0% by weight of water, 0.5% by weight of N, N, N ', N'-tetramethylpropanediamine as an organic amine, 10.0% by weight of N-methylpyrrolidone (NMP) To prepare a cleaning liquid.

≪ Example 2 >

In Example 1, 1.0 wt% of (3- (2-aminoethyl) aminopropyl) methoxytriminated silsesquioxane was used instead of 0.5 wt% of 1-hydroxyethylidene- A cleaning solution was prepared in the same manner as in Example 1 except that 1.0% by weight was used instead of 2.0% by weight of HEDP, and 20.0% by weight was used instead of 10.0% by weight of N-methylpyrrolidone (NMP).

≪ Example 3 >

In Example 1, 1.0 wt% of N, N, N ', N'-tetramethylpropane (1.0 wt%) was added instead of 0.5 wt% of (3- Except that diethylene glycol monobutyl ether (BDG) 10.0% by weight was used in place of 0.5% by weight of diamine and 10.0% by weight of N-methylpyrrolidone (NMP) instead of 0.5% by weight of diamine. .

<Example 4>

In Example 1, 1.0 wt% of N, N, N ', N'-tetramethylpropane (1.0 wt%) was added instead of 0.5 wt% of (3- Instead of 0.5% by weight of diamine, 15.0% by weight of diethylene glycol monobutyl ether (BDG) was used instead of 0.5% by weight of N, N, N ', N'-tetramethylhexanediamine and 10.0% To prepare a cleaning liquid. &Lt; tb &gt; &lt; TABLE &gt;

&Lt; Example 5 >

In the same manner as in Example 1 except that 2.0 wt% of (3- (2-aminoethyl) aminopropyl) methoxytriminated silsesquioxane was used instead of 0.5 wt% of 1-hydroxyethylidene- 1.0% by weight of a polyacrylic acid maleic acid copolymer (PAMA) and 0.5% by weight of N, N, N ', N', N'-tetramethylpropanediamine instead of 2.0% -Tetramethylhexanediamine in an amount of 1.0% by weight based on the weight of the cleaning solution.

&Lt; Example 6 >

In the same manner as in Example 1 except that 2.0 wt% of (3- (2-aminoethyl) aminopropyl) methoxytriminated silsesquioxane was used instead of 0.5 wt% of 1-hydroxyethylidene- N, N ', N', N'-tetramethylpropane diamine was used instead of 3.0 wt% of polyacrylic acid maleic acid copolymer (PAMA) and 0.5 wt% of N, N, -Tetramethylhexanediamine (2.0% by weight), and N-methylpyrrolidone (NMP) (10.0% by weight) instead of 15.0% by weight.

&Lt; Example 7 >

In the same manner as in Example 1 except that 2.0 wt% of (3- (2-aminoethyl) aminopropyl) methoxytriminated silsesquioxane was used instead of 0.5 wt% of 1-hydroxyethylidene- 1.0% by weight of a polyacrylic acid maleic acid copolymer (PAMA) and 0.5% by weight of N, N, N ', N', N'-tetramethylpropanediamine instead of 2.0% Except that diethylene glycol monobutyl ether (BDG) 10.0% by weight was used instead of 1.0% by weight of tetraethylmethanediamine and 10.0% by weight of N-methylpyrrolidone (NMP) .

&Lt; Example 8 >

In the same manner as in Example 1 except that 2.0 wt% of (3- (2-aminoethyl) aminopropyl) methoxytriminated silsesquioxane was used instead of 0.5 wt% of 1-hydroxyethylidene- N, N ', N', N'-tetramethylpropane diamine was used instead of 3.0 wt% of polyacrylic acid maleic acid copolymer (PAMA) and 0.5 wt% of N, N, Except that diethylene glycol monobutyl ether (BDG) 15.0% by weight was used instead of 1.0% by weight of tetraethylmethanediamine and 10.0% by weight of N-methylpyrrolidone (NMP) .

&Lt; Example 9 >

Except that 2.0% by weight of N, N, N ', N'-tetramethylpropane (NMP) was used in place of 0.5% by weight of the above (3- (2-aminoethyl) aminopropyl) methoxytriminated silsesquioxane. 10.0 wt.% Of diethylene glycol monobutyl ether (BDG) was used instead of 2.0 wt.% Of N, N, N ', N'-tetramethylhexanediamine and 10.0 wt.% Of N-methylpyrrolidone (NMP) instead of 0.5 wt. To prepare a cleaning liquid. &Lt; tb &gt; &lt; TABLE &gt;

&Lt; Example 10 >

1.0% by weight of (3- (2-aminoethyl) aminopropyl) methoxytriminated silsesquioxane as the silsesquioxane, 1-hydroxyethylidene-1,1-diphosphonic acid (HEDP) 2.0% by weight of water, 2.0% by weight of N, N, N ', N'-tetramethylhexanediamine and an amount of water as organic amine were mixed and stirred to prepare a cleaning liquid.

&Lt; Comparative Example 1 &

2.0 wt% of 1-hydroxyethylidene-1,1-diphosphonic acid (HEDP), 1.0 wt% of N, N, N ', N'-tetramethylhexanediamine, N-methylpyrrolidone % By weight and the remaining amount of water were mixed and stirred to prepare a cleaning liquid.

&Lt; Comparative Example 2 &

1.0% by weight of (3- (2-aminoethyl) aminopropyl) methoxytriminated silsesquioxane, 0.5% by weight of N, N, N ', N'-tetramethylhexanediamine, NMP) and the remaining amount of water were mixed and stirred to prepare a cleaning liquid.

Silsesquioxane Organic acid Organic amine Water-soluble organic solvent water Kinds content Kinds content Kinds content Kinds content Example 1 a-1 0.5 b-1 2.0 c-1 0.5 d-1 10.0 Balance Example 2 a-1 1.0 b-1 1.0 c-1 0.5 d-1 20.0 Balance Example 3 a-1 1.0 b-1 2.0 c-1 1.0 d-2 10.0 Balance Example 4 a-1 1.0 b-1 2.0 c-2 0.5 d-2 15.0 Balance Example 5 a-1 2.0 b-2 1.0 c-2 1.0 d-1 10.0 Balance Example 6 a-1 2.0 b-2 3.0 c-2 2.0 d-1 15.0 Balance Example 7 a-1 2.0 b-2 1.0 c-3 1.0 d-2 10.0 Balance Example 8 a-1 2.0 b-2 3.0 c-3 1.0 d-2 15.0 Balance Example 9 a-1 2.0 b-1 2.0 c-2 2.0 d-2 10.0 Balance Example 10 a-1 1.0 b-1 2.0 c-2 2.0 - - Balance Comparative Example 1 a-1 - b-1 2.0 c-2 1.0 d-1 10.0 Balance Comparative Example 2 a-1 1.0 b-1 - c-2 1.0 d-1 15.0 Balance a-1: (3- (2-aminoethyl) aminopropyl) methoxytriminated silsesquioxane
b-1: 1-Hydroxyethylidene-1,1-diphosphonic acid (HEDP)
b-2: Polyacrylic acid maleic acid copolymer (PAMA)
c-1: N, N, N ', N'-tetramethylpropanediamine
c-2: N, N, N ', N'-tetramethylhexanediamine
c-3: N, N, N ', N'-tetraethylmethanediamine
d-1: N-methylpyrrolidone (NMP)
d-2: Diethylene glycol monobutyl ether (BDG)

<Experimental Example 1>

A glass substrate coated with aluminum to a thickness of 2000 占 was dipped in the cleaning liquids prepared in Examples 1 to 10 and Comparative Examples 1 and 2 for 30 minutes, respectively. At this time, the temperature of the cleaning liquid was 40 DEG C, and the thickness of the aluminum film applied to the glass substrate was measured before and after dipping, and the respective dissolution rates were measured from the change in thickness, and the evaluation thereof is shown in Table 2 below.

Al etching rate (Å / min) Example 1 ○ Example 2 ○ Example 3 ○ Example 4 ○ Example 5 ◎ Example 6 ◎ Example 7 ○ Example 8 ○ Example 9 ○ Example 10 ○ Comparative Example 1 X Comparative Example 2 X Aluminum corrosion
⊚: excellent (less than 2 Å / minute)
Good: Good (less than 5 A / min)
DELTA: insufficient (less than 10 ANGSTROM / minute)
X: poor (10 Å / min or more)

As shown in Table 2, the cleaning liquids of Examples 1 to 10 had an etching speed of less than 5 ANGSTROM / min, which was effective in preventing corrosion. However, the cleaning liquids of Comparative Examples 1 and 2 had an etching rate 1 to 10, and the effect on corrosion prevention is low.

<Experimental Example 2>

To evaluate the removability of the organic contaminants, the glass substrate was scratched with a fingerprint of human on a 5 cm x 5 cm glass substrate, and the contaminated substrate was cleaned with the spray type glass substrate cleaner for 2 minutes at 40 ° C in Examples 1, 6, washed with ultrapure water for 30 seconds, and then dried with nitrogen. Thereafter, the presence or absence of removal of organic contaminants was evaluated, and the results are shown in Table 3 below.

In order to evaluate the removability of the contaminants, a glass substrate formed to a size of 5 cm x 5 cm was allowed to stand in the air for 3 days for contaminating, and the contaminated substrate was cleaned using a spray type glass substrate cleaner for 1 minute at 40 ° C, 3 to 6 cleaning liquids, washed with ultrapure water for 30 seconds, and then dried with nitrogen. Then, the degree of removal of contaminants was evaluated by the contact angle reduction amount before cleaning and after cleaning using a contact angle measuring apparatus, and the results are shown in Table 3 below.

Organic fingerprint Contact angle Example 1 ○ ○ Implementation 3 ○ ○ Example 4 ○ ○ Example 5 ○ ◎ Example 6 ○ ◎ When the organic fingerprint is removed (○), when the fingerprint is not removed (x)
Decrease in contact angle by 40 ° or more (⊚), decrease in 40 ° to 30 ° (◯), decrease in 30 ° to 20 ° (Δ)

As shown in Table 3, it can be seen that all the cleaning solutions of Examples 1 and 3 to 6 have the ability to remove organic contaminants, and that the contact angle is reduced by 30 ° or more, indicating the ability to remove contaminants.

<Experimental Example 3>

The substrate was cleaned with the cleaning liquids of Examples 1 and 3 to 6 using a spray-type glass substrate cleaning apparatus at 40 DEG C for 2 minutes, cleaned for 30 seconds in ultrapure water, Lt; / RTI &gt;

Table 4 shows the degree of occurrence of corrosion in the aluminum pattern after cleaning.

Aluminum pattern corrosion Example 1 ○ Example 3 ○ Example 4 ○ Example 5 ○ Example 6 ○ Aluminum pattern corrosion:
No corrosion (∘), slight corrosion (△), large amount of corrosion (X)

As shown in Table 4, it can be confirmed that the cleaning liquids of Examples 1 and 3 to 6 of the present invention are excellent in corrosion resistance against an aluminum pattern.

Claims (12)

1. A cleaning liquid composition for aluminum and aluminum alloy corrosion inhibiting and electronic materials, comprising silsesquioxane, organic acid and organic amine represented by the following formula (1).
[Chemical Formula 1]
(R ₁ SiO _3/2 ) _n
In Formula 1, n is an integer of 8 to 100, and R ₁ is independently selected from hydrogen, alkyl, alkylene, allyl, allylene, substituted alkyl, alkylene, allyl, and allylene. The cleaning composition for an aluminum and aluminum alloy corrosion preventing and electronic material according to claim 1, wherein the cleaning liquid composition further comprises a water-soluble organic solvent. The cleaning liquid composition for aluminum and aluminum alloy corrosion prevention and electronic material according to claim 1 or 2, further comprising deionized water in the cleaning liquid composition. The cleaning composition according to claim 1, further comprising aluminum and an aluminum alloy containing 0.001 to 5 wt% of silsesquioxane, 0.01 to 10 wt% of organic acid, 0.05 to 10 wt% of organic amine, A cleaning liquid composition for corrosion prevention and electronic materials. The cleaning liquid composition for aluminum and aluminum alloy according to claim 4, further comprising 0.05 to 40% by weight of a water-soluble organic solvent based on the total weight of the cleaning liquid composition. [3] The method of claim 1, wherein the organic acid is selected from the group consisting of aminotri (methylenephosphonic acid), ethylidene diphosphonic acid, 1-hydroxyethylidene-1,1-diphosphonic acid, 1-hydroxypropylidene- (Methylenephosphonic acid), 1,2-propylene diamine tetra (methylenephosphonic acid), dodecylaminobis (methylenephosphonic acid), and the like. , Nitrotris (methylenephosphonic acid), ethylenediamine bis (methylenephosphonic acid), ethylenediaminetetra (methylenephosphonic acid), hexenediamine tetra (methylenephosphonic acid), diethylenetriaminepenta (methylenephosphonic acid), cyclohexanediamine Tetra (methylenephosphonic acid), hydroxyphosphonoacetic acid, and 2-phosphinic acid butane-1,2,4-tricarboxylic acid. The aluminum and aluminum alloy corrosion-resistant and electronic materials Cleaning composition. The cleaning liquid composition for an aluminum and aluminum alloy corrosion preventing and electronic material according to claim 1, wherein the organic acid is a polymer of a carboxylic acid compound represented by the following formula (2).
(2)

Wherein R ₂ to R ₄ independently represent hydrogen, methyl group, ethyl group or - (CH ₂ ) _m COOM ₂ , and M ₁ and M ₂ independently represent hydrogen, an alkali metal, an alkaline earth metal or an ammonium group And m ₁ and m ₂ are independently an integer of 0 to 2. [7] The polymer of claim 7, wherein the polymer of the carboxylic acid compound is selected from the group consisting of polyacrylic acid polymer (PAA), polymethyl (meth) acrylic acid copolymer (PMAA), polyacrylic acid maleic acid copolymer (PAMA) (PMMA), a polymethyl (meth) acrylic acid maleic acid copolymer (PMAMA), and salts thereof. A cleaning liquid composition for electronic materials. The cleaning liquid composition for an aluminum and aluminum alloy corrosion preventing and electronic material according to claim 1, wherein the organic amine is represented by the following Chemical Formula 3 or Chemical Formula 4.
(3)

[Chemical Formula 4]

In the general formulas (3) and (4), R ₅ to R ₁₁ independently of one another are hydrogen (provided that R ₅ to R ₇ can not all be hydrogen); An alkyl group having 1 to 10 carbon atoms which is unsubstituted or substituted with an amino group; An alkyl group having 1 to 10 carbon atoms substituted with an amino group substituted with an alkyl group having 1 to 4 carbon atoms; An alkenyl group having 2 to 10 carbon atoms; A hydroxyalkyl group having 1 to 10 carbon atoms; An alkyl group having 1 to 10 carbon atoms which is substituted with a carboxyl group or a hydroxy group and is substituted with an alkoxy group having 1 to 10 carbon atoms; An amino group substituted or unsubstituted with an alkyl group having 1 to 4 carbon atoms; A phenyl group substituted or unsubstituted with an alkyl group having 1 to 4 carbon atoms; Or a benzyl group substituted or unsubstituted with an alkyl group having 1 to 4 carbon atoms, two adjacent groups in R ₅ to R ₁₁ may be bonded to each other to form a ring, and R ₁₂ in the formula (4) To 10 carbon atoms. 2. The method of claim 1, wherein the organic amine is selected from the group consisting of methylamine, ethylamine, monoisopropylamine, n-butylamine, sec-butylamine, isobutylamine, t-butylamine, pentylamine, dimethylamine, diethylamine, di Examples of the amines include amines such as propylamine, diisopropylamine, dibutylamine, diisobutylamine, methylethylamine, methylpropylamine, methylisopropylamine, methylbutylamine, methylisobutylamine, trimethylamine, triethylamine, Monoethanolamine, diethanolamine, triethanolamine, monopropanolamine, 2-aminoethanol, 2- (ethylamino) ethylamine, diethylamine, diethylamine, N, N-dimethylaminoethanol, N, N-diethylaminoethanol, 2- (2-aminoethylamino) - 1-amino-2-propanol, 2-amino-1- (Butoxymethyl) diethylamine, (methoxymethyl) diethylamine, (methoxymethyl) dimethylamine, (3-amino-1- (Methoxymethyl) dimethylamine, (methoxymethyl) diethanolamine, (hydroxyethyloxymethyl) diethylamine, methyl (methoxymethyl) aminoethane, methyl (methoxymethyl) (2-aminoethyl) piperazine, 1- (2-aminoethoxy) ethanol, Methylpiperazine, 1-amino-4-methylpiperazine, 1-benzylpiperazine, 1- (2-methylpiperazin- N, N, N ', N'-tetramethylpropanediamine, N, N, N', N'-tetramethylhexanediamine, N, , N, N ', N'-tetramethylethylenediamine Aluminum and aluminum alloys corrosion-resistant and cleaning liquid composition for an electronic material, characterized in that more than one. The cleaning liquid composition for an aluminum and aluminum alloy corrosion preventing and electronic material according to claim 2, wherein the water-soluble organic solvent is at least one selected from the group consisting of a proton-polar solvent and an aprotic polar solvent. [3] The method according to claim 2, wherein the water-soluble organic solvent is selected from the group consisting of ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monoisopropyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, Ethylene glycol monomethyl ether, ethylene glycol monoisopropyl ether, diethylene glycol monobutyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, triethylene glycol monoisopropyl ether, triethylene glycol monobutyl ether, polyethylene glycol monomethyl ether, polyethylene Propylene glycol monomethyl ether, propylene glycol monomethyl ether acetate, N-methylpyrrolidone (NMP), N-ethylpyrrolidone, N-methylpyrrolidone, 1,3-dimethyl-2-imidazolidinone, 1,3-dipropyl-2-imidazolidinone,? -Butyrolactone, dimethylsulfoxide (DMSO), sulfolane, triethyl phosphate, tributyl phosphate , N, N-dimethylformamide, acetamide, N-methylacetamide, N, N-dimethylacetamide, N- (2-hydroxyethyl) (2-ethylhexyloxy) -N, N-dimethylpropionamide and 3-butoxy-N, N-dimethylpropionamide Wherein the composition is at least one selected from the group consisting of aluminum and aluminum alloys.