KR101874226B1 - Flexible device and method for manufacturing of flexible inductor - Google Patents
Flexible device and method for manufacturing of flexible inductor Download PDFInfo
- Publication number
- KR101874226B1 KR101874226B1 KR1020170008564A KR20170008564A KR101874226B1 KR 101874226 B1 KR101874226 B1 KR 101874226B1 KR 1020170008564 A KR1020170008564 A KR 1020170008564A KR 20170008564 A KR20170008564 A KR 20170008564A KR 101874226 B1 KR101874226 B1 KR 101874226B1
- Authority
- KR
- South Korea
- Prior art keywords
- temperature
- inductor
- temperature sensor
- sacrificial layer
- flexible
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 10
- 238000004519 manufacturing process Methods 0.000 title abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 72
- 238000012546 transfer Methods 0.000 claims abstract description 16
- 230000007935 neutral effect Effects 0.000 claims abstract description 13
- 238000009713 electroplating Methods 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 239000004642 Polyimide Substances 0.000 claims description 8
- 229920001721 polyimide Polymers 0.000 claims description 8
- 238000000059 patterning Methods 0.000 claims description 7
- 238000000151 deposition Methods 0.000 claims description 6
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 3
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium oxide Inorganic materials O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 claims description 3
- PVADDRMAFCOOPC-UHFFFAOYSA-N oxogermanium Chemical compound [Ge]=O PVADDRMAFCOOPC-UHFFFAOYSA-N 0.000 claims description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 3
- 238000004528 spin coating Methods 0.000 claims description 3
- 238000005259 measurement Methods 0.000 abstract description 29
- 230000005540 biological transmission Effects 0.000 abstract description 7
- 239000010408 film Substances 0.000 description 19
- 239000000463 material Substances 0.000 description 10
- 229910052732 germanium Inorganic materials 0.000 description 6
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 6
- 238000004891 communication Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 5
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- -1 polyacylate Polymers 0.000 description 3
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000006355 external stress Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000004299 exfoliation Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002759 woven fabric Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/40—Structural association with built-in electric component, e.g. fuse
- H01F27/402—Association of measuring or protective means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F38/00—Adaptations of transformers or inductances for specific applications or functions
- H01F38/14—Inductive couplings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/32—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying conductive, insulating or magnetic material on a magnetic film, specially adapted for a thin magnetic film
- H01F41/34—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying conductive, insulating or magnetic material on a magnetic film, specially adapted for a thin magnetic film in patterns, e.g. by lithography
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/006—Printed inductances flexible printed inductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/40—Structural association with built-in electric component, e.g. fuse
- H01F27/402—Association of measuring or protective means
- H01F2027/406—Temperature sensor or protection
Abstract
The present invention relates to a flexible device including a temperature sensor array and an inductor formed on a flexible substrate, and a method of manufacturing an inductor in which a neutral plane is formed by transfer films attached on upper and lower sides, Electroplating can be used to supply power from a wireless power transmission module. By measuring the average temperature of a measurement object through a temperature sensor array, errors of different resistance values of the temperature sensors can be reduced have.
Description
More particularly, the present invention relates to a flexible device including a temperature sensor array and an inductor formed on a flexible substrate, and a method of manufacturing a flexible device having a neutral plane To a method of manufacturing an inductor formed thereon.
An electronic device (electronic device) includes one or more circuit boards, and a typical circuit board uses a planar substrate that mechanically supports the electronic components.
Electronic components may include, for example, resistors, capacitors, switches, batteries and other more complex integrated circuit components, i. E., A microprocessor, and the circuit board generally includes a plastic substrate and a glass substrate.
Since a conventional electronic device uses a plastic substrate or a glass substrate, there is a limitation in the application range because of the flexibility. Therefore, in recent years, flexible devices fabricated to be bent by using a flexible substrate instead of a plastic substrate or a glass substrate have been developed.
In general, an inductor is used in a flexible device. In particular, recently, with the emergence of System-on-Chip (SoC) related technology, a packaging technology that unifies various devices into a single chip has been developed, and an inductor having a small structure, low manufacturing cost, and excellent characteristics is required .
In order to meet such a necessity, Korean Patent Laid-Open Publication No. 10-2014-0089595 entitled " Method of manufacturing an electric inductor and related inductor device "is disclosed.
However, the prior art discloses a structure in which a conductive layer is formed on a dielectric layer and adjacent metal portions of the conductive layer are bonded together to form an electric inductor. In the case of using for a wireless power communication requiring a thick metal thickness, There is a disadvantage that the metal can be peeled off because the substrate is not resistant to heat. In addition, it is not suitable for supplying power to a flexible device because it is easily damaged when an impact is applied.
An object of the present invention is to provide a method of manufacturing a flexible device and a flexible inductor capable of receiving and supplying power from a wireless power transmission module by producing an electronic device using electroplating on a flexible substrate.
Another object of the present invention is to provide a method of manufacturing a flexible device and a flexible inductor in which an inductor is manufactured on a flexible substrate to supply power received from an external wireless power communication system wirelessly to the flexible device to charge the battery will be.
It is another object of the present invention to provide a flexible device and a method of manufacturing a flexible inductor, which can mitigate external stress due to bending by forming a neutral plane using transfer films on the upper and lower portions of the inductor.
It is another object of the present invention to provide a method and apparatus for measuring an average temperature for a measurement object requiring temperature control from a temperature sensor array including a plurality of temperature sensors formed in multi-channels, And a manufacturing method of the flexible device and the flexible inductor.
A flexible device according to an embodiment of the present invention includes a plurality of temperature sensors formed on a flexible substrate and a plurality of channels, wherein the temperature sensor includes a terminal for measuring a resistance value with respect to a temperature of a measurement object, Which is formed on the flexible substrate by forming a neutral plane by a temperature sensor array formed on upper and lower portions and a transfer film attached to upper and lower portions thereof and receiving power wirelessly from an external device to supply the temperature sensor array to the temperature sensor array, .
The inductor can be patterned by depositing metal on the flexible substrate formed on the sacrificial layer through electroplating.
The inductor may be fabricated by patterning the flexible substrate and then forming the neutral film by the transfer film attached to the upper portion and the transfer film attached to the lower portion after the sacrificial layer is removed.
The sacrificial layer can be separated from the rigid substrate by contact with water.
Wherein each of the plurality of temperature sensors is formed by transferring the multi-channel patterned by a photolithography process onto the flexible substrate, wherein the multi-channel is formed by depositing a platinum (Pt) film on a film formed of a polyimide solution Pt) thin film.
Each of the plurality of temperature sensors may include the multi-channel formed in a meander pattern.
The temperature sensor array may be formed in a patch-like structure by being connected to an IC circuit formed on the flexible substrate.
A method of manufacturing an inductor according to an embodiment of the present invention includes the steps of forming a sacrificial layer on a hard substrate, forming a flexible substrate on the sacrificial layer, patterning the inductor on the flexible substrate, Attaching a transfer film to an upper portion of the substrate, separating the sacrificial layer, and attaching the transfer film to a lower portion of the flexible substrate on which the sacrificial layer is separated to form a neutral plane.
The sacrificial layer may be formed by spin-coating any one of water-soluble polyvinyl alcohol and germanium oxide (Ge 2 O 3 ) on the hard substrate to form the sacrificial layer.
The patterning may include depositing a metal on the flexible substrate through electroplating to pattern the inductor.
The step of separating the sacrificial layer may separate the sacrificial layer from the rigid substrate through contact with water.
According to an embodiment of the present invention, an electronic device is manufactured using electroplating on a flexible substrate to receive and supply power from a wireless power transmission module.
According to an embodiment of the present invention, an inductor may be fabricated on a flexible substrate to supply power received from an external wireless power communication system wirelessly to the flexible device to charge the battery.
Also, according to the embodiment of the present invention, a neutral surface using a transfer film is formed on the upper and lower portions of the inductor, thereby alleviating external stress caused by bending.
According to an embodiment of the present invention, an average temperature for a measurement object requiring temperature control is measured from a temperature sensor array including a plurality of temperature sensors formed in multi-channels, and an error Can be reduced.
1 shows an embodiment of a flexible device according to an embodiment of the present invention.
2 is a view for explaining an embodiment of a temperature sensor array according to an embodiment of the present invention.
3A and 3B show the results of the resistance value according to the temperature change of the measurement object measured from one temperature sensor.
4A and 4B show the results of the average value according to the temperature change of the measurement object measured from the temperature sensor array formed of a plurality of temperature sensors.
5 shows a result of a deviation of a measured object from a temperature sensor array formed of a plurality of temperature sensors according to a temperature change.
6 is a flowchart illustrating a method of manufacturing an inductor according to an embodiment of the present invention.
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings and accompanying drawings, but the present invention is not limited to or limited by the embodiments.
The terminology used herein is for the purpose of illustrating embodiments and is not intended to be limiting of the present invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. It is noted that the terms "comprises" and / or "comprising" used in the specification are intended to be inclusive in a manner similar to the components, steps, operations, and / Or additions.
As used herein, the terms "embodiment," "example," "side," "example," and the like should be construed as advantageous or advantageous over any other aspect or design It does not.
Also, the term 'or' implies an inclusive or 'inclusive' rather than an exclusive or 'exclusive'. That is, unless expressly stated otherwise or clear from the context, the expression 'x uses a or b' means any of the natural inclusive permutations.
Also, the phrase "a" or "an ", as used in the specification and claims, unless the context clearly dictates otherwise, or to the singular form, .
Furthermore, the terms first, second, etc. used in the specification and claims may be used to describe various elements, but the elements should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.
Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.
In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear. The terminology used herein is a term used for appropriately expressing an embodiment of the present invention, which may vary depending on the user, the intent of the operator, or the practice of the field to which the present invention belongs. Therefore, the definitions of these terms should be based on the contents throughout this specification.
1 shows an embodiment of a flexible device according to an embodiment of the present invention.
Referring to FIG. 1, a
To this end, the
The
In addition, the
Accordingly, the
The
According to the embodiment, the
IC circuits can process signal filtering, amplification, digitization, and processing functions by using integration techniques, and in some embodiments may be integrated and multi-functional integrated circuit sensors have.
Hereinafter, the
2 is a view for explaining an embodiment of a temperature sensor array according to an embodiment of the present invention.
2, a
Each of the plurality of
The multichannel 122 may be formed in a meander pattern that is meandering to cover a relatively large area.
According to an embodiment, the multi-channel 122 may be a meander pattern with a helical, rectangular loop, a pair of intermeshed meander patterns, a pair of separate concentric circular patterns formed in the outer helix, A meander pattern with a small rectangular loop formed in a large loop, a meander pattern with a small circular or tapered loop formed in a large loop, and a series of spiral patterns with a common central axis The pattern may be formed in any one of the patterns, and the patterns of the above-described types may be arranged in a matrix form in series or parallel, so that the shape, the type, and the number of the patterns are not limited thereto.
In addition, the multi-channel 122 may be a negative temperature coefficient thermistor.
For example, the multi-channel 122 may use a printed NTC (Negative Temperature Coefficient) thermistor, but is not limited to a printed NTC thermistor.
According to an embodiment, the multi-channel 122 is equally applicable to any flexible temperature sensor in which the resistance varies with temperature and can be a PTC (Positive Temperature Coefficient) thermistor, a Resistance Temperature Device (RTD) Or any device fabricated on a substrate material.
The
The terminal 123 may be connected to both ends of the multi-channel 122 and may measure the resistance value of the measurement object.
For example, the terminal 123 may be formed on each of the plurality of
The
More specifically, the
The
For example, the average temperature calculating unit may be included in the
According to an embodiment, the average temperature calculator may measure an average temperature of a plurality of temperature sensors after excluding a specific temperature sensor among the plurality of
For example, when the measurement object has a large area or a temperature difference largely occurs in a part of the property of the object to be measured, the average temperature calculator receives a resistance value having a different value from each of the plurality of
As another example, the average temperature calculator may calculate the average temperature of the remaining
As another example, the average temperature calculator may calculate the average value of the temperature (e.g., the average value of the temperature) based on the resistance value sensed from the remaining temperature sensors after excluding the temperature sensor showing a sudden temperature change exceeding a predetermined reference among the plurality of
1, an
The
For example, a sacrificial layer is formed on a hard substrate, a
Thereafter, a transfer film is formed on the patterned
For example, the rigid substrate may be a glass substrate, and the sacrificial layer may be a germanium (Ge) material. Since germanium materials are easily soluble in water, they can be immersed in water to separate the sacrificial layer.
The
For example, the
3A and 3B show the results of the resistance value according to the temperature change of the measurement object measured from one temperature sensor.
More specifically, FIG. 3A is a graph showing a resistance value of a measurement object measured at intervals of 10 DEG C from 30 DEG C to 80 DEG C using a temperature sensor array including one temperature sensor, FIG. And the resistance value of the object to be measured is measured at intervals of 1 占 폚 from 30 占 폚 to 40 占 폚 at intervals of 0.5 占 폚 from 36 占 폚 to 38 占 폚 using a temperature sensor array including a sensor.
Referring to FIGS. 3A and 3B, it can be seen that the resistance value also increases in proportion to an increase in temperature, and it is possible to more accurately detect a change in the resistance value as the measurement interval becomes narrower (or the measurement time becomes shorter) .
Also, it can be seen that the temperature sensor array including one temperature sensor has a limit to measure an accurate temperature for a measurement object to be measured, because the temperature accuracy varies with the attachment position or area of the measurement object.
4A and 4B show the results of the average value according to the temperature change of the measurement object measured from the temperature sensor array formed of a plurality of temperature sensors.
FIG. 4A is a graph showing a result of a resistance according to a temperature change of a measurement object using a temperature sensor array including one temperature sensor, and FIG. 4B is a graph showing a result of using a temperature sensor array including four temperature sensors And the results of the resistance value and the average value of each sensor according to the temperature change of the measurement object.
4A and 4B, it is confirmed that the accuracy and reliability of the average value of the temperatures calculated from the temperature sensor arrays constituted by four temperature sensors is higher than that of the temperature sensor array constituted by one temperature sensor as shown in FIG. 4A .
5 shows a result of a deviation of a measured object from a temperature sensor array formed of a plurality of temperature sensors according to a temperature change.
More specifically, FIG. 5 is a graph showing a deviation result measured at a temperature change from 0 DEG C to 50 DEG C using a temperature sensor array including one temperature sensor and a temperature sensor array including four temperature sensors to be.
Referring to FIG. 5, when measuring the average value of the temperature of the measurement object based on the resistance value measured from the temperature sensor array including four temperature sensors, the temperature of the measurement object is measured using one temperature sensor It can be seen that the deviation is smaller than when.
Accordingly, in the case of calculating the average temperature of a measurement object using a temperature sensor array formed of a plurality of temperature sensors, as compared with a temperature sensor array including one temperature sensor, errors due to external factors are small, A high accuracy temperature can be measured constantly.
6 is a flowchart illustrating a method of manufacturing an inductor according to an embodiment of the present invention.
Referring to FIG. 6, a sacrificial layer is formed on a rigid substrate in
Step 610 may be a step of spin-coating any one of water-soluble polyvinyl alcohol and germanium oxide (Ge 2 O 3 ) on the hard substrate to form the sacrificial layer.
The hard substrate may be a glass substrate, and the sacrificial layer may be a substrate (layer) formed of a germanium (Ge) material.
At
The flexible substrate may be a flexible substrate made of a solution type polyimide material. The polyimide has a high melting point of 600 ° C, which ensures thermal stability and is suitable for producing inductors for wireless power transmission by electroplating.
In
Step 630 may be a step of patterning the inductor by depositing metal on the flexible substrate through electroplating.
According to the embodiment, the inductor may be patterned on a flexible substrate on which the temperature sensor array is formed.
In
Step 640 may be the step of separating the sacrificial layer from the hard substrate through contact with water.
The sacrificial layer is formed of a germanium material, and since the germanium material easily dissolves in water, it can be immersed in water to separate the sacrificial layer.
If not a sacrificial layer of germanium material, according to an embodiment, step 640 may be a step of separating the sacrificial layer through mechanical exfoliation.
At
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. For example, it is to be understood that the techniques described may be performed in a different order than the described methods, and / or that components of the described systems, structures, devices, circuits, Lt; / RTI > or equivalents, even if it is replaced or replaced.
Therefore, other implementations, other embodiments, and equivalents to the claims are also within the scope of the following claims.
100: Flexible device
110: Flexible substrate
120: Temperature sensor array
121: Temperature sensor
122: Multi-channel
123: Terminal
130: Inductor
200: Wireless power communication system
210: external inductor
Claims (11)
Forming a flexible substrate on the sacrificial layer using a polyimide solution;
Patterning the inductor on the flexible substrate;
Attaching a transfer film on top of the patterned flexible substrate and separating the sacrificial layer; And
And attaching the transfer film to a lower portion of the flexible substrate on which the sacrificial layer is separated to form a neutral plane,
The step of forming the sacrificial layer
Forming a sacrificial layer by spin-coating any one of water-soluble polyvinyl alcohol and germanium oxide (Ge 2 O 3 ) on the hard substrate
Wherein the inductor is made of a metal.
The step of patterning
And depositing a metal on the flexible substrate through electroplating to pattern the inductor.
The step of separating the sacrificial layer
And separating the sacrificial layer from the rigid substrate through contact with water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020170008564A KR101874226B1 (en) | 2017-01-18 | 2017-01-18 | Flexible device and method for manufacturing of flexible inductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020170008564A KR101874226B1 (en) | 2017-01-18 | 2017-01-18 | Flexible device and method for manufacturing of flexible inductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR101874226B1 true KR101874226B1 (en) | 2018-07-04 |
Family
ID=62912864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020170008564A KR101874226B1 (en) | 2017-01-18 | 2017-01-18 | Flexible device and method for manufacturing of flexible inductor |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR101874226B1 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101635135B1 (en) * | 2013-12-04 | 2016-06-30 | 이병정 | Wireless charging receiver module |
-
2017
- 2017-01-18 KR KR1020170008564A patent/KR101874226B1/en active IP Right Grant
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101635135B1 (en) * | 2013-12-04 | 2016-06-30 | 이병정 | Wireless charging receiver module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102036600B (en) | A substrate layer adapted to carry sensors, actuators or electrical components | |
| US20160370210A1 (en) | Modular flexible sensor array | |
| KR101210088B1 (en) | Protection circuit module including thermistor and battery pack with same | |
| JP5703842B2 (en) | Non-contact power supply with temperature sensor | |
| EP3525279A1 (en) | Thermistors on flexible layers and its use for temperature measurements within a battery pack | |
| KR20150002633A (en) | Battery with temperature adjustment function | |
| EP2811271B1 (en) | Infrared sensor | |
| JP6468398B2 (en) | Deep thermometer | |
| JP2006078478A (en) | Film temperature sensor and substrate for temperature measurement | |
| US11262256B2 (en) | Sensor elements on thin foil/films | |
| US9320145B2 (en) | Assembling and packaging a discrete electronic component | |
| CN113167662B (en) | Device with integrated circuit and sensor and method of forming the same | |
| CN108650782B (en) | flexible circuit board and terminal equipment | |
| KR101874226B1 (en) | Flexible device and method for manufacturing of flexible inductor | |
| JP2011040330A (en) | Temperature sensor, battery pack and method of manufacturing the temperature sensor | |
| KR101129924B1 (en) | Method for fabricating water level sensor | |
| KR101922247B1 (en) | Wearable device | |
| KR20110120849A (en) | Method for fabricating water level sensor and structure of the same | |
| KR20220042224A (en) | Flexible passive electronic component and method for producing same | |
| KR101916138B1 (en) | Inductor forming method and flexible device | |
| KR101148630B1 (en) | Structure of water level sensor | |
| US20210208007A1 (en) | Stick-on thermometer | |
| CN107256746A (en) | The manufacture method and chip type thermal resistor of chip type thermal resistor | |
| CN216524498U (en) | Integrated strain gauge for three-dimensional force sensor | |
| US20050232334A1 (en) | Temperature sensor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GRNT | Written decision to grant |