KR101832552B1 - Method, apparatus and system for a per-dram addressability mode - Google Patents

Abstract

Techniques and mechanisms for programming the operating mode of a DRAM device. In an embodiment, the memory controller stores the value in the mode register of the DRAM device, which specifies whether the DRAM per device addressing capability (PDA) mode of the DRAM device is enabled. The external contacts of the DRAM device are coupled to the memory controller device through the signal lines of the data bus. In another embodiment, the memory controller sends a signal to an external contact while the PDA mode of the DRAM device is enabled, which signal is for specifying that one or more features of the DRAM device are programmable.

Description

METHOD, APPARATUS AND SYSTEM FOR FOR PERM-DRAM ADDRESSABILITY MODE FOR ADDRESSABILITY MODE FOR DRAM,

Embodiments generally relate to programming dynamic random access memory (DRAM) devices. More specifically, certain embodiments provide a mechanism for setting the operating mode of a DRAM device.

In a conventional memory system of a computer or other such hardware platform, the rank control of memory devices is provided by a memory controller, where the instruction bus and / or other interconnects connect the memory controller to the DRAM dynamic random access memory) devices. Typically, such an instruction bus provides one or more command signals for instructions issued by a memory controller to each of the DRAM devices. In response, each of the DRAM devices in the rank detects the provided command signals and performs the respective executions on the provided command signals.

MEMORY SYSTEMS With the continued improvement in the design and manufacture of circuit logic, memory systems are becoming increasingly sensitive to operational inefficiencies. As a result, there is an increasing need to more accurately configure operational parameters for memory devices. However, the opportunity to provide greater accuracy in such configurations is limited in memory rank applications. For example, the architecture of a conventional memory rank - where dynamic random access memory (DRAM) devices share an instruction bus, address bus, chip select and / or the like - all DRAM devices in the rank Resulting in a response to the command. As a result, the instruction to change the operating parameters of one DRAM device in the rank will also change, for example, the operating parameters of all other DRAM devices in that rank.

The various embodiments of the present invention will be illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings.
1 is a block diagram illustrating elements of a memory system for accessing memory resources in accordance with an embodiment.
2 is a flow diagram illustrating elements of a method for transitioning a memory device between operating modes in accordance with an embodiment.
3 is a block diagram illustrating elements of a system for operating a rank of memory devices in accordance with an embodiment.
4 is a block diagram illustrating elements of a DRAM device for implementing an operating mode in accordance with an embodiment.
5 is a block diagram illustrating elements of a memory controller for accessing a DRAM device in accordance with an embodiment.
6 is a timing diagram illustrating elements of exchanges for programming a DRAM device in accordance with an embodiment.
7 is a timing diagram illustrating elements of the exchanges for programming a DRAM device in accordance with an embodiment.
8 is a timing diagram illustrating components of the exchanges for programming a DRAM device in accordance with an embodiment.
Figure 9A is a block diagram illustrating elements of a computing system for providing per-DRAM addressing capabilities in accordance with an embodiment.
Figure 9B is a block diagram illustrating elements of a computing system for providing per-DRAM addressing capabilities in accordance with an embodiment.

Embodiments provide various per-DRAM addressability (PDA) modes of dynamic random access memory (DRAM) devices. While the PDA mode is enabled on the DRAM device, the device may be enabled independently by the memory controller on a device-specific basis, for example, independently of any programming of one or more other memory devices of the rank including the DRAM device Can be programmed. Such programming may include setting one or more mode register values of the DRAM device to configure, for example, a reference voltage (Vref) value, an on-die termination (ODT) value, and / Prior to entering the PDA mode, the DRAM device may require write leveling, but certain embodiments are not limited in this respect.

The latest draft of the Joint Electron Devices Engineering Council (JEDEC) DDR4 specification allows device-specific programmability to be included in the rank of DRAM devices. While the DRAM device enables the PDA mode, the execution of one or more mode register set (MRS) instructions may be qualified based on some contacts of the data interface, such as DQ0, or other dedicated external contacts of the DRAM device . For purposes of illustration and not limitation, a PDA-enabled DRAM device may capture DQ0 using one or more data strobe signals, e.g., differential data strobe signals DQS_c and DQS_t. If the DRAM device determines that the value on DQ0 represents a particular logic state, e.g., a row (or "0"), the DRAM device may choose to execute the associated MRS instruction. Alternatively, if the DRAM device determines that the value on DQ0 represents a different logic state, e.g., high (or "1"), then the DRAM device may choose to ignore the associated MRS instruction. A memory controller that controls such DRAM devices may choose to drive all DQ bits to selectively program such DRAMs, for example, while some or all of the DRAM devices in the rank have their respective PDA modes enabled . In an embodiment, only MRS instructions are allowed to execute while the DRAM device has an enabled PDA mode.

The PDA mode of the DRAM device may be enabled, for example, by setting a bit A4 of the mode register MR3 to "1 ", for example, by storing a specified value in one or more bits of the mode register. Alternatively, or in addition, such a PDA mode may be used to specify one or more bits of the mode register that are differently specified (e.g., different) in conjunction with the contact DQ0 of the corresponding DRAM device receiving a signal (such as a logic "0 & For example, by setting bit A4 of the same mode register MR3 to "0 ". The organization of one such mode register, for example MR3, according to one embodiment is illustrated in Table 1 below:

In an embodiment, deviating the DRAM device from the PDA mode may require programming the entire mode register of the DRAM device, e.g., MR3, by an MRS instruction. This may affect some of the programmed addressability values per DRAM in the rank because the escape instruction is sent to the rank. To avoid such an effect, the PDA enable / disable control bit of the DRAM device may be located in a mode register that also does not have one or more other PDA mode controls. In the per-DRAM addressing capability mode, the DRAM device can capture DQ0 using DQS_t and DQS_c as in normal write operation. However, the dynamic ODT may not be supported, for example. So additional attention may be required in the ODT configuration. If RTT_NOM MR1 {A10: A9: A8} = Enable, the DDR4 SDRAM data termination may need to be controlled by the ODT pin, where such control is constrained by one or more timing parameters in Table 2 below Receive.

Since the PDA mode may be used to program the optimal Vref for the DRAM device, the DRAM device may incorrectly read the DQ level at the first edge of the data strobe signal DQS and / or at the last falling edge of the DQS before such programming . To reduce the likelihood of such errors, the DRAM device may sample DQ0 on either the first falling or second rising DQS edges. This may enable the normal implementation between the BC4 and BL8 modes on the DRAM device. The memory controller controlling the DRAM device may need to drive DQ0 with a 'stable low or high' during the data transfer length for one or both of the BC4 and BL8 cases.

Figure 1 illustrates elements of a memory system 100 for accessing memory resources in accordance with an embodiment. The memory system 100 may be any of a variety of desktop computers, laptop computers, handheld devices (e.g., of tablets, smartphones, palmtops and / or the like), servers, network access points, routers or other networking devices, But may be part of a hardware platform including, but not limited to, a smart TV, a digital video recorder (DVR), a video camera, a set-top box, and / or the like. In an embodiment, the memory system 100 includes a DRAM device 140 for storing data and a memory controller 105 for controlling the DRAM device 140. Memory controller 105 and DRAM device 140 are coupled to one or more interconnections of memory system 100 to facilitate exchange of, for example, data signals, command signals, address signals, and / Lt; / RTI >

For purposes of example and not limitation, the memory system 100 includes a data bus 130 coupled between the data interface 110 of the memory controller 105 and the data interface 145 of the DRAM device 140 can do. Additionally or alternatively, the memory system 100 may include a command / address bus 135 coupled between the command / address interface 115 and the command / address interface 150 of the DRAM device 140. Any of a variety of additional or alternative interconnections may couple memory controller 105 and DRAM device 140 in accordance with different embodiments. The instruction / address bus 135 may include multiple component buses, such as dedicated address buses and dedicated instruction buses, although some embodiments are not limited in this respect. For example, the instruction / address interface 115 may include multiple component interfaces, such as dedicated address interfaces and dedicated instruction interfaces, each of which combines with each of such component buses. Alternatively, or in addition, the instruction / address interface 150 may include multiple component interfaces, such as dedicated address interfaces and dedicated instruction interfaces, each for one of such component buses.

While some embodiments may not be limited in this respect, DRAM device 140 may include logic for operating with SDRAM (synchronous DRAM). In an embodiment, some or all of the data, command, and / or address communications between the memory controller 105 and the DRAM device 140 may conform to an interface specification such as a double data rate (DDR) SDRAM specification. For example, the memory controller 105 and the DRAM device 140 may be in accordance with the latest draft of the Joint Electron Devices Engineering Council (JEDEC) DDR4 SDRAM specification, based on the date of the present application.

One or more control signal lines (not shown) may further couple the memory controller 105 to the DRAM device 140. For example, and not by way of limitation, the memory controller 105 to DRAM device 140 may include a clock signal line, a data strobe signal line, a chip select signal line, an ODT signal line, and / or various additional or alternative control signal lines ≪ / RTI > may be further combined with each other by one or more of any of the above. In one or more operating modes of the DRAM device 140, some or all of such control signal lines may provide control of the DRAM device 140 in accordance with the prior art.

DRAM device 140 may include circuitry logic to provide various modes of operation of DRAM device 140. [ For example, DRAM device 140 may include a mode register 165 that includes one or more register bits (not shown) to store a value that specifies whether a particular mode of DRAM device 140 is enabled . DRAM device 140 may further include control logic 160 for operating based on values stored in one or more such bits of mode register 165. [ The control logic 160 is responsive to the value stored in the mode register 165 to cause the DRAM device 140 to receive instructions from the memory controller 105 that are received by the DRAM device 140, To be executed or to be executed prior to execution of this command.

In an embodiment, memory controller 105 includes access logic 120 for configuring DRAM device 140 for operation in a particular mode of operation. For example, the access logic 120 may issue a mode register set (MRS) command, or other such communication, to write to one register or more bits of the mode register 165. The memory controller 105 may further include configuration information 125 that describes, for example, the current mode of operation of the DRAM device 140, or otherwise may have access to configuration information. In an embodiment, the access logic 120 may further exchange DRAM devices 140 with data signals, address signals, command signals, control signals, and / or the like, Based on the current operating mode of the device 140.

In an embodiment, operation in the first mode may result in the DRAM device 140 selecting between executing the received command and preceding execution of the received command, Lt; RTI ID = 0.0 > 140 < / RTI > The first mode of operation may be distinguished from a second mode of operation in which the DRAM device 140 results in executing the received command independently, e.g., whether such a signal is received at the corresponding first external contact. As used herein, an "external contact" (or simply "contact" in brief) refers to any of a variety of pins, balls, pads, and / or other such electrical contact hardware.

Such an external contact may be, for example, the contact of the data interface 145 for coupling the DRAM device 140 to the data bus 130. For example, and not by way of limitation, the data interface 145 may include external contacts DQ0, ..., DQX, each of which will be associated with a respective signal line of the data bus 130. In such an embodiment, the control logic 160 may receive a signal 155 representative of a signal received at a particular one of DQ0, ..., DQX, e.g., a signal received at DQ0, Is a condition for deciding whether to execute an associated command.

In the illustrated scenario of one embodiment, the mode register 165 is configured such that, at some point in time, the input 155 selects between the control logic 160 executing the received instruction and the execution of the corresponding received instruction Lt; RTI ID = 0.0 > 1 < / RTI > Such a first operating mode may be referred to, for example, as a "data dependent execution mode ". Alternatively, or in addition, the mode register 165 may be coupled to a second (second) signaling or signal for signaling the execution of the received command independent of any particular signal for which the control logic 160 is provided as input 155 at some other time You can store another value that specifies the operating mode. Such a second mode of operation may be referred to as a " data agnostic execution mode ".

As discussed herein, the data dependent execution mode may allow the DRAM device 140 to operate in the rank of the DRAM devices, for example while the DRAM device 140 is in the data dependent execution mode, And may serve as an analog of an addressing signal for addressing the DRAM device 140 specifically from among multiple DRAM devices. Thus, such a data-dependent mode of execution is also referred to herein as a per-DRAM addressability capability (PDA) mode.

2 illustrates elements of a method 200 for transitioning a memory device between operating modes according to an embodiment. The method 200 may be implemented by a DRAM device having some or all of the features of the DRAM device 140. For example, the method 200 may be executed in response to one or more exchanges between such a DRAM device and a memory controller having some or all of the features of the memory controller 105.

Instead, the method 200 may be implemented by a memory controller to control such a DRAM device. For example, the method 200 may represent various transmissions of communications from a memory controller having some or all of the features of the memory controller 105. Such communications may include an instruction to be sent to the DRAM device to store in the mode register a value that specifies whether the per-DRAM addressing capability (PDA) mode of the DRAM device is enabled. Such communications may further include signaling an external contact of the DRAM device coupled to the memory controller device through a signal line of the data bus while the PDA mode of the DRAM device is enabled. Such a signal may specify the programmability of one or more features of the DRAM device to the DRAM device. This signal can specify, for example, whether an instruction sent with the signal can program one or more DRAM device features, that is, on a DRAM device specific basis.

In an embodiment, method 200 includes a non-PDA mode 205 of a DRAM device. As discussed with reference to the DRAM device 140, the non-PDA mode 205 may be used to perform a received instruction that is independent of whether a signal is received at a particular contact of the DRAM device, e.g., a data bus input, Lt; RTI ID = 0.0 > DRAM < / RTI > In contrast, PDA mode 210 may include alternate configurations for selecting between a DRAM device executing such a received command and a preceding execution of the corresponding received command, Lt; RTI ID = 0.0 > of < / RTI >

To illustrate certain aspects of various embodiments, non-PDA mode 205 and PDA mode 210 may be implemented in a DRAM device that processes instructions of a particular instruction type, i.e., mode register set (MRS) Lt; / RTI > However, the non-PDA mode 205 and the PDA mode 210 may additionally or alternatively be applied to DRAM devices that process instructions of one or more other instruction types. In an embodiment, while in the non-PDA mode 205, the DRAM device may execute at least all of the instructions of the particular instruction type received at the DRAM device, e.g. all MRS instructions. For example, while in the non-PDA mode 205, the DRAM device may be configured to execute all commands it receives.

At some point in time, the DRAM device may execute a mode register set command MRS [PDA] 215 that transitions the DRAM device from the non-PDA mode 205 to the PDA mode 210 while in the non-PDA mode 205 have. For example, the execution of MRS [PDA] 215 may write a value to the mode register of the DRAM device that specifies that PDA mode 210 is enabled.

In an embodiment, the execution of the MRS [PDA] 215 initially puts the DRAM device in the ready state 220 of the PDA mode 210. [ During the ready state 220, the DRAM device may be configured to detect the reception of any command of the command type to which the PDA mode 210 is applied, for example, to detect any MRS command received from the memory controller have. In response to detecting such an instruction while in PDA mode 210, the DRAM device may choose between executing the received instruction and preceding such execution. Such a selection may depend, for example, on whether a particular input of the DRAM device receives a particular signal with the received command.

For example, and not by way of limitation, a DRAM device may detect the reception of a set of signals MRS + DQN 230 from a memory controller. A set of signals MRS + DQN 230 is coupled to the one or more command signals for the MRS command and the data interface contact DQN of the DRAM device, together with one or more command signals, For example, a logic high ("1") signal. Although the particular embodiment is not limited in this respect, the various signals of the MRS + DQN 230 may be received by the DRAM device at different times. In response to detecting the MRS + DQN 230, the DRAM device may transition to a state 235 preceding the execution of the MRS instruction indicated by the MRS + DQN 230. For example, the DRAM device flushes the information associated with the MRS instruction without any execution of the MRS instruction, and returns to the ready state 220.

Alternatively or additionally, the DRAM device may detect the reception of a set of signals MRS + NOT (DQN) 240 from the memory controller. The set of signals MRS + NOT (DQN) 240 may include, for example, one or more command signals for the MRS command and another specific signal asserted on the same contact DQN, together with one or more command signals And a logic low ("0") signal. Although the particular embodiment is not limited in this respect, the various signals of the MRS + NOT (DQN) 240 may be received by the DRAM device at different times. In response to detecting the MRS + NOT (DQN) 240, the DRAM device may transition to state 245 for execution of the MRS instruction indicated by MRS + NOT (DQN)

The MRS command indicated by the MRS + NOT (DQN) 240 indicates that the execution of the command MRS [NOT (PDA)) will cause the execution of the command to transition the DRAM device from the state 245 of the PDA mode 210 to the non- ] (225). For example, the execution of MRS [NOT (PDA)] 225 may write a value to the mode register of the DRAM device that specifies that the non-PDA mode 205 is enabled. Alternatively, the DRAM device may execute some other MRS instructions that do not change the PDA mode 210 of the DRAM device, and may transition from the state 245 to the ready state 220.

FIG. 3 illustrates elements of memory system 300 for accessing memory resources in accordance with an embodiment. In an embodiment, memory system 300 includes some or all of the features of memory system 100. For example, the memory system 300 may include a memory controller 320 having some or all of the features of the memory controller 105. Alternatively or additionally, the memory system 300 may include a DRAM device 330a and a DRAM device 330b, each of which may include some or all of the features of the various DRAM devices 140.

The memory controller 320 is coupled to one or more interconnects of the memory system 300 to facilitate the exchange of, for example, data signals, command signals, address signals, control signals, May be variously coupled to the devices 330a and 330b. The interconnection of the memory controller 320 to the DRAM devices 330a and 330b may be for the operation of the DRAM devices 330a and 330b in the rank 310 of DRAM devices.

For example, the memory system 300 may include a data bus 322 that includes a plurality of data signal lines for variously connecting the DRAM device 330a and the DRAM device 330b, respectively, to the data interface 322 of the memory controller 320, Lt; RTI ID = 0.0 > 350 < / RTI > For example, and not by way of limitation, the data bus 350 may be configured to receive the contacts d0, ..., DQX of the data interface 322, respectively, of the data contacts DQ0, ..., DQX of the DRAM device 330a. , dx can be combined. In addition, or alternatively, the data bus 350 may include contacts d (x + 1), ..., DQX of the data interface 322, respectively, for each of the data contacts DQ0, ..., DQX of the DRAM device 330b. ., d (2x + 1). Any of a variety of additional or alternate interconnection arrangements may couple the data interface 322 to the DRAM devices 330a, 330b, in accordance with different embodiments. Alternatively, or additionally, the data interface 322 may include one or more additional contacts (not shown) for various combinations with one or more other DRAM devices of the rank 310.

The memory system 300 includes an address for coupling the address interface 324 of the memory controller 320 to both the address contacts A0: AY of the DRAM device 330a and the address contacts A0: AY of the DRAM device 330b Bus 340 may be further included. Alternatively, or additionally, the memory system 300 may include an instruction interface 326 of the memory controller 320 with the command contacts C0: CZ of the DRAM device 330a and the command contacts C0: CZ of the DRAM device 330b And a command bus 345 for coupling to all.

The DRAM devices of rank 310 may each include a separate logic for implementing the various modes of operation. For example, a first mode of one such DRAM device may provide that the DRAM device selects between executing the received command and preceding execution of the received command, Depends on whether it is provided with a specific contact of the DRAM device, e.g., a command received via a data contact. In an embodiment, the second mode of the DRAM device may provide for the DRAM device to execute a received command regardless of whether a particular signal is provided with the command via the particular contact.

To illustrate features of certain embodiments, such a first mode is discussed herein for each of the external contacts DQ0 of the DRAM devices 330a, 330b. However, the features of the first mode may be implemented with different ones of the other contacts of the DRAM devices 330a, 330b, e.g., another of the contacts DQ0, ..., DQX, in different embodiments.

In an embodiment, the DRAM device 330a is configured to condition the execution of a command received from the command interface 326, depending on whether a particular signal is provided on DQ0 with the received command, while operating in the first mode ). For example, the DRAM device 330a may execute the received command in response to detecting that the first logic state is signaled through its DQ0, or alternatively the different logic state may signal through its DQ0 The execution of the received command may be preceded by the execution of the received command.

Such a first mode of operation may, for example, provide per-DRAM addressability within the rank 310 of the memory system 300. For example, and not by way of limitation, the memory controller 320 may configure the DRAM devices 330a and 330b to operate in the PDA mode, respectively. For example, the memory controller 320 may store values in the respective mode registers of the DRAM devices 330a, 330b, each of which specifies that the PDA mode is enabled.

While both of the DRAM devices 330a and 330b are operating in the PDA mode, the memory controller 320 may not send command signals to each of the DRAM devices 330a and 330b, for example, via the command bus 345 You can issue commands, including. In connection with sending such command signals, the memory controller 320 may additionally send one or more signals via the data bus 350 to each of the DRAM devices 330a, 330b.

In their respective PDA modes, DRAM devices 330a and 330b may evaluate signals received via their respective DQ0 contacts, such that such DQ0 contacts may be accessed by the corresponding DRAM device in the command interface 326, And to act independently as an addressing example for the corresponding one of the DRAM devices 330a and 330b to independently determine whether to perform some execution on the command signals received from the DRAM devices 330a and 330b.

In an exemplary embodiment, the memory controller 320 may send signals to the DQ0 contacts of the DRAM devices 330a, 330b, respectively, through the contacts d0, d (x + l) of the data interface 322 . Such signals may result in none of the DRAM devices 330a and 330b performing some execution of the command signals that each of the DRAM devices 330a and 330b receives from the command interface 326 , Only one of the DRAM devices 330a and 330b will result in each of the DRAM devices 330a and 330b performing some execution on the command signals it receives from the command interface 326, , 330b may all result in some execution of the command signals that the DRAM devices 330a, 330b each receive from the command interface 326. [

FIG. 4 illustrates elements of a DRAM device 400 for determining whether to implement a PDA mode according to an embodiment. The DRAM device 400 may include some or all of the features of one of the memory devices 300a, 300b, for example. In an embodiment, the DRAM device 400 is an SDRAM device. Alternatively, or in addition, the DRAM device 400 may include logic for operating as a DDR memory device, for example, a low voltage DDR (LPDDR) device. For example, the DRAM device 400 may be a DDR4 SDRAM device and / or an LPDDR4 SDRAM device.

In an embodiment, DRAM device 400 includes an array of memory cells 405 for storing data, which array 405 is arranged in rows and columns (not shown). The DRAM device 400 may further include one or more interfaces for interconnecting the memory controller and the DRAM device 400 to provide such memory controller with access to the array 405. [

For purposes of example and not limitation, DRAM device 400 may include a command interface 410 for exchanging command signals with a memory controller via an instruction bus. Alternatively, or in addition, the DRAM device 400 may include an address interface 420 for exchanging address signals with the memory controller via an address bus. Alternatively, or in addition, the DRAM device 400 may include a data interface 415 for exchanging data and / or other signals with the memory controller via the data bus. In an exemplary embodiment, data interface 415 includes external electrical contacts DQ0, ..., DQX (e.g., pins, balls, pads, and / or the like) for coupling with one or more signal lines of such a data bus ).

In an embodiment, the DRAM device 400 further comprises one or more external contacts for exchange of control signals. For purposes of example and not limitation, DRAM device 400 includes a chip select contact CS 470 for receiving a chip select signal for enabling operation of DRAM device 400, and / or a DRAM device 400 A clock signal contact CLK 472 (or, alternatively, a pair of differential CLK contacts) for receiving a clock signal to adjust the operation of the clock signal contact CLK 472. [ Alternatively, or in addition, the DRAM device 400 may include a data strobe contact DQS 474 (or alternatively, a data strobe contact) for receiving a data strobe signal to indicate when data is being sent on the data bus. Die differential contact DQS contacts), and / or an on-die termination contact ODT 476 that receives a signal indicative of an impedance match for application to one or more signal lines of the IC of the DRAM device 400 . The DRAM device 400 may include any of a variety of additional or alternative external contacts for control signaling, according to different embodiments.

The DRAM device 400 may include execution logic 425 for accessing the array 405 to at least partially execute the instructions represented by the instruction information received via the instruction interface 410. [ In one embodiment, execution logic 425 includes circuitry to access memory cells of such arrangement 405 in accordance with the prior art, in one or more of the operating modes of DRAM device 400. For example and not by way of limitation, the execution logic 425 may include one or more decoder logic (e.g., row decoder, column decoder, etc.) buffers, sense amplifiers and / or memory cells of the array 405 Read, write, erase, refresh, or otherwise access any of the various mechanisms.

The DRAM device 400 determines whether in the one or more operating modes of the DRAM device 400 access to the array 405 by the execution logic 425 occurs to service execution of some instruction issued by the memory controller The control logic 430 may further include a control logic 430 that qualifies the control logic 430. For example, Although some embodiments are not limited in this respect, some or all of control logic 430 may be incorporated into execution logic 425. [ The control logic 430 may operate based at least in part on the availability state of the PDA current mode of the DRAM device 400. [ Such enablement may be, for example, a configuration state (e.g., a state in which the memory controller is stored in the DRAM device 400 by a value PDA 450 that stores in the mode register 460 in the configuration state 455 455). While the DRAM device 400 is in the PDA mode, the control logic 430 determines whether the execution logic 425 receives and operates on command signals received via the command interface 410, Lt; RTI ID = 0.0 > and / or < / RTI > Such a determination may be based, for example, on whether a particular signal is received via a particular external contact of the DRAM device 400 in association with the command signals.

Control logic 430 is a high-level representation of logic in accordance with one embodiment for implementing PDA mode functionality. However, control logic 430 may include any of a variety of additional or alternative circuit logic to implement such functionality. In an exemplary embodiment, control logic 430 may be used to selectively gate, switch, latch, or otherwise transfer (or transfer such command signals from command interface 410 to execution logic 425 Gate logic 435 to prevent the < / RTI > Control logic 430 may further include combinatorial logic 440 represented by a diagrammatic AND gate to selectively signal whether gate logic 435 allows or disables such transmission of command signals . In an embodiment, combinatorial logic 440 indicates that gate logic 435 will pass all command signals to execution logic 425 whenever input PDA 450 is equal to a value indicating that the PDA mode is not enabled Signaling. Alternatively, or in addition, the signaling of the combinational logic 440 for the gate logic 435 to transmit command signals, when the input PDA 450 is equal to a value indicating that the PDA mode is enabled, For example, signal DQN 445 may be received from an external contact of data interface 415. For example, signal DQN 445 may be received at some external contact of the DRAM device in association with the received command signals. In an embodiment, DQN 445 represents the signal received at DQ0.

In an exemplary embodiment, the PDA 450 is a single bit directly input to the combinational logic 440 and the DQN 445 is logically inverted at the input of the combinatorial logic 440. However, any of a variety of additional or alternative inputs may be provided to the combinational logic 440. For example, the PDA 450 may instead include multiple bits that will cause the combinational logic 440 to compare with a predetermined value corresponding to a particular PDA mode type (or to a particular non-PDA mode type). Alternatively, or in addition, the combinatorial logic 440 may be a non-inverting input, for example, the transfer of a command signal to the execution logic 425 may indicate a high (e.g., "1 & Is shown to combinatorial logic 440 by DQN 445.

While the PDA mode is enabled, the control logic 430 may selectively allow or prevent programmability of one or more features of the DRAM device 400. For example, and not by way of limitation, during such PDA mode, the programmability of some operating state OP 465 is determined, at least in part, by the control logic 430, which detects the particular logic state of the DQN 445, You can delete it. In response to detecting that the OP 465 is to be programmable based on the DQN 445, the control logic 430 may be programmed to process the command signals to change the value of the OP 465, And may signal the execution logic 425 to execute the MRS instruction. For example, and not by way of limitation, the execution logic 425 may include a resistor value to be associated with a particular on-die termination setting, a voltage level to be associated with some voltage reference Vref, and / Alternative configurations can be changed.

FIG. 5 illustrates elements of a memory controller 500 for accessing a DRAM memory device in accordance with an embodiment. Memory controller 500 may include some or all of the features of memory controller 105, for example.

The memory controller 500 may include a host interface 525 for exchanging communications with one or more host processors of the hardware platform on which the memory controller 500 will operate, for example. In an embodiment, the memory controller 500 will access the DRAM device instead of such a host processor, for example, if the DRAM device includes some or all of the features of the DRAM device 400. [ The DRAM device may be one of the ranks of the DRAM devices controlled by the memory controller 500, although the specific embodiment is not limited in this respect.

The memory controller 500 may include one or more interfaces for exchanging command signals, address signals, data signals, and / or control signals with such DRAM devices. For example, and not by way of limitation, the memory controller 500 includes a data interface 505 for coupling with a data bus, an address interface 510 for coupling to an address bus, and a command interface 515 ). ≪ / RTI > The memory controller 500 may communicate with the DRAM devices, for example, when the control signals include one or more of CS, CLK, DQS, ODT, and / or other such control signals (Not shown) for external connection.

In an embodiment, memory controller 500 includes memory access logic 520 for accessing one or more resources of a DRAM device. For example, the memory access logic 520 may be implemented as part of the DRAM device and instructions, address, data, and / or the like, to access memory arrays of DRAM devices and / And / or control signals to exchange control signals. The memory access logic 520 may configure the DRAM device for operation in the PDA mode. For example, the memory access logic 520 may issue an MRS instruction to store a value in the one or more mode register bits of the DRAM device that specifies that the PDA mode is enabled.

The memory access logic 520 issues yet another instruction while the PDA mode of the DRAM device is enabled, for example, issuing another instruction to program one or more features of the DRAM device. Such programming of one or more features of the DRAM device may include a memory controller 500 that asserts a signal on a particular external contact of the data interface 505, for example, Or as a condition for choosing whether to precede execution of that other instruction.

To facilitate such programming of a DRAM device, the memory controller 500 may include one or more registers for storing configuration information 530 that describes the current state of one or more DRAM devices, or other such storage medium . ≪ / RTI > For example, the configuration information 530 may store a value (e.g., a boolean value of "true" or "false") that specifies that one or more DRAM devices controlled by the memory controller 500 are present in the PDA mode PDA state 532 for < / RTI > Additionally or alternatively, the configuration information 530 may store, for each of one or more DRAM devices controlled by the memory controller 500, a respective set of information describing one or more operating parameter values of the corresponding DRAM device .

For example and not by way of limitation, configuration information 530 may store a first information set 540 for device DRAM_1 and / or a second information set 545 for device DRAM_2. The identifier field ID 534 of the first information set 540 may store an identifier for DRAM_1 and / or the ID 534 of the second information set 545 may store an identifier for DRAM_2. Alternatively, or additionally, the operational parameter field OP_1 536 of the first set of information 540 may identify that the operational parameter OP_1 for DRAM_1 is configured for the value Val_1, and / or the second information set 545, OP_1 536 may identify that the operational parameter OP_1 for DRAM_2 is configured for the value Val_2. The memory controller 500 may include any of a variety of additional or alternative configuration information, in accordance with different embodiments.

Enabling each of the PDA modes of DRAM_1 and DRAM_2 enables the memory access logic 520 to issue signals for the MRS instruction that DRAM_1 executes and MRS command signals that DRAM_2 will ignore, . Alternatively or additionally, the memory access logic 520 may issue signals for the MRS instruction to set MRS command signals, e.g., OP_1 to the value Val_2, that DRAM_1 will ignore and DRAM_2 will execute. The selective execution of each such MRS instruction by either DRAM_1 or DRAM_2 can be accomplished, for example, by sending either one signal to the external contact DQN of DRAM_1 and another signal to the corresponding external contact DQN of DRAM_2 to the data interface 505, < / RTI >

6 illustrates elements of a timing diagram 600 for programming a DRAM device in accordance with an embodiment. Timing diagram 600 may illustrate an exemplary exchange between memory controller 105 and DRAM device 140, for example. In an embodiment, exchanges in timing diagram 600 place the DRAM device in the PDA mode and selectively access the DRAM device while the device is in PDA mode.

To illustrate certain aspects of the different embodiments, timing diagram 600 shows a set of specific signals with respect to a differential clock signal comprising component clock signals CK_c, CK_t. For example, timing diagram 600 includes differential data strobe signals DQS_t and DQS_c that the memory controller displays to the DRAM device when valid signals are being asserted on the data bus.

The timing diagram 600 further includes an input signal provided to the external contact DQ0 of the DRAM device. In the exemplary embodiment represented by the timing diagram 600, the DRAM device, when in the PDA mode, selects the input signal at DQ0 as a condition for selecting between executing the instruction and preceding the execution of the instruction, . The timing diagram 600 further includes an on-die termination control signal ODT that indicates to the DRAM device when the memory controller is to implement a particular impedance match, e. G., To facilitate signal exchange in a particular direction on one or more interconnects. . For example, the impedance matching state RTT of the DRAM device, shown in timing diagram 600, can be varied in response to the ODT.

Timing diagram 600 further includes sets of signals MRS 610, MRS 620, and MRS 630, each associated with a different respective mode register setting command issued by the memory controller. For example, the set of signals MRS 610 may include command signals that the memory controller describes to the DRAM device the corresponding command. The MRS 610 may further include one or more address signals and / or control signals associated with such command signals, for example, such address signals and / Lt; RTI ID = 0.0 > DRAM device < / RTI > For example, and not by way of limitation, the MRS 610 may further include one or more of a row address selection (RAS) signal, a column address selection (CAS) signal, a write enable (WE) . Similar signals may be variously included in one or both of MRS 620 and MRS 630.

In the illustrated scenario, the MRS 610 displays a mode register setup command for configuring the DRAM device to operate in the PDA mode. For example, and not by way of limitation, a DRAM device may include a mode register (such as mode register MR3) with a dedicated bit (such as bit A4) to configure the per-DRAM addressing capability. The MRS instruction 610 may write a value, e.g., a logic "1" value, to MR3 [A4] to specify that the PDA is enabled in the DRAM device. Although a particular embodiment is not limited in this respect, the MRS 610 may specify a value to be stored in MR3 [A4] by an address signal from the memory controller.

After issuing the MRS 610 for enabling the PDA mode of the DRAM device, the memory controller may be ready to program one or more features of the DRAM device. Such programming may be specific to a DRAM device, or may be specific only to a subset of DRAM devices, for example in a rank that includes the corresponding DRAM device. For example, and not by way of limitation, the ODT signal may include a transition of the DRAM device to some nominal impedance matching configuration RTT_NOM that facilitates reading of signals provided to the DRAM device via the data bus in some parked impedance match configuration RTT_PARK May be asserted with the MRS 610 to initiate. In an embodiment, the assertion of the ODT signal is timed based on a direct ODT turn on latency DODTLon, e.g., describing the additive latency AL and the column address strobe write latency CWL. For example, the DODTLon may be equivalent to two clock cycles less than the sum of AL and CWL.

Programming of the DRAM device in the PDA mode may include issuing the MRS 620 only after the memory controller has some minimum delay tMOD (e.g., ~ 4 clock cycles) required between successive MRS instructions. The memory controller may provide one or more additional signals on the data bus to facilitate execution of the instructions indicated by MRS 620. [ The memory controller may, for example, delay the AL + CWL to indicate to the DRAM device that one or more data bus lines carry valid signals associated with processing instructions displayed by the MRS 620. [ DQS_c, < / RTI > and DQS_t. Because the device is in PDA mode, the DRAM device may evaluate DQ0 in response to DQS_c, DQS_t, as a condition to determine whether to execute the instruction displayed by MRS 620 or precede such an execution. If the DRAM device wishes to perform such an operation, the memory controller asserts a signal (e. G., A logic low ("0") - to indicate such on the data bus signal line that couples to the external contact DQ0 of the DRAM device. can do. The asserted signal of DQ0 may serve as an example for addressing a DRAM device that enables the programmability of one or more features of, for example, a DRAM device. Assertion of the signal on DQ0 may be timed to account for the latency tPDA_S at DQ0 that is seated low before DQS_t and DQS_c are polled by the DRAM device. In an embodiment, the DRAM device completes the transition from RTT_PARK to RTT_NOM in time to read signals of DQ0 and any other data bus signal lines to which the DRAM device is coupled to the DRAM device.

In the example of timing diagram 600, the memory controller operates in burst length 8 mode when the data bus signals associated with the instructions for MRS 620 are provided over eight cycles of CK_c, CK_t. The memory controller can prepare the end of such eight cycles, for example, when the ODT signal is deasserted to cause the DRAM device to transition back from RTT_NOM to RTT_PARK. Deasserting the ODT signal may be timed, for example, to resolve the direct ODT turn off latency DODTLoff. Although a particular embodiment is not limited in this respect, DODTLoff may be equivalent to, for example, two clock cycles smaller than the sum of AL and CWL. Alternatively or additionally, DQ0 can be deasserted in time to reach a logic high immediately at the end of 8 clock cycles. For example, the deassertion of DQ0 may be timed to resolve the latency tPDA_H when DQ0 rises to a logic high.

After receiving the data bus signals for the command of the MRS 620, the DRAM device may execute instructions, for example, to program one or more features of the DRAM device. For example, the execution of an instruction for MRS 620 may be performed by writing one or more mode registers of a DRAM device for associating a resistance value with an on-die termination setting, associating a voltage value with a Vref parameter, can do. The memory controller may subsequently issue an MRS 630 of some next MRS instruction for the DRAM device to process after some minimum delay tMOD_PDA before the next MRS instruction can be sent, for example.

FIG. 7 illustrates elements of a timing diagram 700 for programming a DRAM device in accordance with an embodiment. Timing diagram 700 may illustrate an exemplary exchange between memory controller 105 and DRAM device 140, for example. In an embodiment, exchanges in the timing diagram 700 are performed by a memory system that also performs exchanges in the timing diagram 600.

Timing diagram 700 includes signals corresponding to those of timing diagram 600, e.g., differential clock signals CK_c, CK_t, differential data strobe signals DQS_t and DQS_c, DQ0 signal, ODT signal, and RTT status. At the beginning of the timing diagram 700, the PDA mode of the DRAM device has already been enabled, for example, in accordance with the technique illustrated in the timing diagram 600.

The memory controller may issue an instruction to program the memory device to disable the PDA mode. Programming of the DRAM device to disable the PDA mode may be accomplished by programming the memory controller with a set of some signals MRS (4) to write the value "0" to the mode register bit MR3 [4] 710). ≪ / RTI > One or more other signals may be exchanged to facilitate such programming. For example, and not by way of limitation, the ODT signal may be asserted to initiate a DRAM device transition from RTT_PARK to RTT_NOM to read signals provided to the DRAM device via the data bus. In an embodiment, the ODT signal is timed to resolve the DODTLon, e. G., Before the MRS 710.

The memory controller may provide one or more additional signals on the data bus to execute the instructions indicated by the MRS 710. [ In an embodiment, the memory controller may be configured to select one of the differential data lines to indicate to the DRAM device that after one or more delays of, for example, AL + CWL, one or more data bus lines carry the valid signals associated with processing the instruction represented by MRS 710 It may begin to cycle the data strobe signals DQS_c, DQS_t. Because this device is in PDA mode, the DRAM device may evaluate DQ0 in response to DQS_c, DQS_t as a condition for determining whether to execute or precede the instruction displayed by MRS 710. [ If the DRAM device wishes to perform such an execution, the memory controller may assert a signal, e.g., a logic low ("0 "), to indicate such on the data bus signal line coupling with the external contact DQ0 of the DRAM device . The asserted signal of DQ0 may serve as an example for addressing a DRAM device that enables, for example, the programmability of one or more features of the DRAM device. The assertion of the signal on DQ0 may be timed to resolve the latency tPDA_S. In an embodiment, the DRAM device completes the transition from RTT_PARK to RTT_NOM in time to read signals of DQ0 and any other data bus signal lines to which the DRAM device is coupled to the DRAM device.

In the exemplary case shown in timing diagram 700, the memory controller operates in burst length 8 mode when the data bus signals associated with the command for MRS 710 are provided over eight cycles of CK_c, CK_t. The memory controller may be prepared in advance for the end of such an 8-cycle if, for example, the DRAM device is de-asserted for the ODT signal to transition back from RTT_NOM to RTT_PARK. Deasserting the ODT signal can be timed, for example, to resolve the DODTLoff. Alternatively or additionally, DQ0 may be deasserted in time to reach a logic high state immediately at the end of its eight clock cycles. For example, the deassertion of DQ0 may be timed to resolve tPDA_H.

After receiving signals for the command of the MRS 710 via the data bus signal lines, the DRAM device may execute instructions for programming one or more features of the DRAM device, for example. For example, the execution of an instruction for MRS 710 may write a value to MR3 [A4] (or other such PDA mode position) specifying that the PDA mode is to be disabled in the DRAM device. The memory controller may subsequently issue some valid instructions 720 for processing by the DRAM device, e.g., after a minimum delay tMOD_PDA.

FIG. 8 illustrates elements of a timing diagram 800 for programming a DRAM device in accordance with an embodiment. Timing diagram 800 may illustrate an exemplary exchange between memory controller 105 and DRAM device 140, for example. The exchanges of the timing diagram 800 may represent an alternative to the exchanges of the timing diagram 600, for example, where the memory controller is configured to receive a burst (BC) burst for transmitting data on four cycles of the differential clock signals CK_c and CK_t chop) mode.

To illustrate certain aspects of the different embodiments, the timing diagram 800 shows the differential clock signals CK_c, CK_t, differential data strobe signals DQS_t and DQS_c and DQ0 signals corresponding to those of the timing diagram 600. At the beginning of the timing diagram 800, the PDA mode of the DRAM device is disabled. In an embodiment, the memory controller may issue a set of signals MRS 810 that includes some or all of the features of the MRS 610 to enable the PDA mode of the DRAM device. After enabling such PDA mode, the memory controller may issue a set of signals MRS 820 that includes some or all of the features of MRS 620 to program one or more features of the DRAM device. For example, the MRS 820 may be issued only after some minimum delay tMOD following the issuance of the MRS 810.

In an embodiment, the memory controller may be configured to compare the differential data to indicate to the DRAM device that after one or more AL + CWL delays, one or more data bus lines carry valid signals associated with processing the instruction indicated by the MRS 820, It may begin to cycle the strobe signals DQS_c, DQS_t. Because this device is in PDA mode, the DRAM device may evaluate DQ0 in response to DQS_c, DQS_t as a condition to determine whether to execute the instruction indicated by MRS 820 or to precede such an execution . Such an evaluation of DQ0 is similar to the timing diagram 600 except that DQ0 in the timing diagram 800 remains low for only four cycles of the differential clock signals CK_c and CK_t due to the memory controller operating in the BC mode Quot; DQ0 " in Fig.

After receiving signals for the command of the MRS 820 via the data bus signal lines, the DRAM device may execute instructions for programming one or more features of the DRAM device, for example. For example, the execution of an instruction for MRS 820 may be performed by one or more mode registers of a DRAM device to associate a resistance value with an on-die termination setting, to associate a voltage value with a Vref parameter, and / And the like. The memory controller may subsequently issue an MRS 830 for another instruction to be processed by the DRAM device, e.g., the MRS 830 is issued only after a minimum delay tMOD_PDA.

9A and 9B are block diagrams illustrating selected aspects of computing systems 900 and 1000, respectively. The computing system 900 includes a processor 910 coupled with interconnect 920. In some embodiments, the terms processor and CPU may be used interchangeably. In one embodiment, processor 910 is a processor in the XEON (TM) processor family available from Intel Corporation of Santa Clara, California. In alternative embodiments, other processors may be used. In yet another alternative embodiment, the processor 910 may include multiple processor cores.

In one embodiment, chip 930 is a component of the chipset. Interconnect 920 may be a point-to-point interconnect, or it may be connected to more than one chip (e.g., of a chipset). Chip 930 includes a memory controller 940 that can be coupled to the main system memory (e.g., as shown in FIG. 1). In an alternative embodiment, memory controller 940 may be on the same chip as processor 910, as shown in FIG. 9B.

Memory system 944 may provide computing memory 900 (and computing system 1000) with main memory. In some embodiments, each memory device 946 in the rank of memory system 944 includes control logic 948. [ As discussed herein, control logic 948 may enable memory device 946 to operate in PDA mode. In addition, memory controller 940 may include access logic 942. [ In some embodiments, the access logic 942 enables the memory controller 940 to configure one or each of the memory devices 946 in the ranks to operate in the PDA mode, respectively. As discussed herein, the access logic 942 may further provide device specific programming of an individual memory device 946. [

An input / output (I / O) controller 950 controls the flow of data between the processor 910 and one or more I / O interfaces (e.g., wired and wireless network interfaces) and / . For example, in the illustrated embodiment, the I / O controller 950 controls the flow of data between the processor 910 and the wireless transmitter and receiver 960. In an alternative embodiment, memory controller 940 and I / O controller 950 may be integrated into a single controller. I / O controller 950 may be coupled to chipset 930, for example, via interconnect 931. The computing system 900 may further include an I / O device 970 that is coupled directly or indirectly to the I / O controller 950 to provide input / output exchanges by a user. For example, the I / O device 970 may include one or more of a keyboard, a mouse, a trackball, a pen, a touch screen, a display, a monitor, a speaker, a printer and /

In one aspect, a DRAM device includes a memory array, an external contact for coupling the DRAM device to a signal line of the data bus, and a memory for storing a value that specifies whether the DRAM device's per-DRAM addressability mode (PDA) Mode registers. The DRAM device further includes control logic coupled to the mode register, wherein the control logic is operable, during the detection of the signal received via the external contact, to program the one or more features of the DRAM device, It will clear the possibility.

In an embodiment, the control logic for conditioning the programmability of one or more features includes control logic for selecting between executing the received command and prior to executing the received command based on detection of the signal do. In an embodiment, the control logic for conditioning the programmability of one or more features includes control logic for conditional execution of any mode register set command.

In an embodiment, the DRAM device is a DDR4 SDRAM device. In an embodiment, the DRAM device is an LPDDR4 SDRAM device. In an embodiment, the programmability of one or more features includes programmability of on-die termination parameters. In an embodiment, the programmability of one or more features includes programmability of voltage reference parameters.

In another aspect, a memory controller device includes a data interface for coupling a memory controller device to an external contact of a DRAM device via a signal line of the data bus. The memory controller further includes memory access logic for storing, in the mode register of the DRAM device, a value that specifies whether the DRAM device's per-DRAM addressability capability (PDA) mode is enabled. The memory access logic is further to send a signal to an external contact via the data interface while the PDA mode of the DRAM device is enabled, to specify whether one or more features of the DRAM device are programmable.

In an embodiment, in response to a signal, the DRAM device selects between executing the received command and preceding execution of the received command. In an embodiment, while the PDA mode of the DRAM device is enabled, the memory access logic is further to provide device specific programming of the on-die termination parameters of the DRAM device. In an embodiment, while the PDA mode of the DRAM device is enabled, the memory access logic is further to provide device specific programming of the voltage reference parameters of the DRAM device. In an embodiment, the DRAM device is a DDR4 SDRAM device. In an embodiment, the DRAM device is an LPDDR4 SDRAM device. In an embodiment, the memory controller is integrated with the processor in an integrated circuit.

In an embodiment, the memory controller further comprises a command interface for coupling to both the DRAM device and another DRAM device, wherein the memory access logic further sends a command signal to the DRAM device and to another DRAM device via the command interface . The memory access logic is further intended to cause the DRAM device to send a first signal for execution of the instruction indicated by the instruction signal via the data interface and to cause the other DRAM device to execute any instruction indicated by the instruction signal To transmit via the data interface.

In one aspect, a method is implemented in a memory controller, the method comprising storing a value in a mode register of a DRAM device, wherein the value is indicative of whether the DRAM device's per-DRAM addressability mode (PDA) Wherein an external contact of the DRAM device is coupled to the memory controller device through a signal line of the data bus. The method further includes sending a signal to an external contact while the PDA mode of the DRAM device is enabled, the signal for specifying that one or more features of the DRAM device are programmable.

In an embodiment, in response to a signal, the DRAM device selects between executing the received command and prior to executing the received command. In an embodiment, the method further comprises providing device specific programming of an on-die termination parameter of the DRAM device while the PDA mode of the DRAM device is enabled. In an embodiment, the method further comprises providing device specific programming of a voltage reference parameter of the DRAM device while the PDA mode of the DRAM device is enabled. In an embodiment, the DRAM device is a DDR4 SDRAM device. In an embodiment, the DRAM device is an LPDDR4 SDRAM device. In an embodiment, the memory controller is integrated with the processor in an integrated circuit.

In an embodiment, the method includes sending a command signal to the DRAM device and another DRAM device via an instruction bus, sending a first signal through the data bus for the DRAM device to execute a command indicated by the command signal, and Further comprising the step of the other DRAM device sending a second signal via the data bus to precede the execution of any instruction indicated by the instruction signal.

In one aspect, the system includes a DRAM device including a data bus and a memory array, an external contact for coupling a DRAM device to a signal line of the data bus, and a mode register. The DRAM device further includes control logic coupled to the mode register, wherein during the DRAM device's per-DRAM addressability mode (PDA) mode, the control logic controls the DRAM Is intended to condition the programmability of one or more features of the device. The system further includes a memory controller including a data interface coupled to the external contacts via a signal line and memory access logic for storing in the mode register a value specifying whether the PDA mode of the DRAM device is enabled, The access logic is to send additional signals to the external contacts.

In an embodiment, in response to a signal, the DRAM device selects between executing the received command and prior to executing the received command. In an embodiment, while the PDA mode of the DRAM device is enabled, the memory access logic is to further provide device specific programming of the on-die termination parameters of the DRAM device. In an embodiment, while the PDA mode of the DRAM device is enabled, the memory access logic is to further provide device specific programming of the voltage reference parameters of the DRAM device. In an embodiment, the DRAM device is a DDR4 SDRAM device. In an embodiment, the memory controller is integrated with the processor in an integrated circuit.

In an embodiment, the memory controller further comprises a command interface for coupling to both the DRAM device and another DRAM device, wherein the memory access logic further comprises means for receiving the command signal via a command interface to the DRAM device and to other DRAM devices For sending a first signal to a DRAM device for executing a command indicated by the command signal, via a data interface, and for causing the other DRAM device to precede the execution of any command indicated by the command signal 2 signal over the data interface.

In another aspect, a method includes fabricating a memory controller device of an integrated circuit, wherein the memory controller includes a data interface for coupling the memory controller device through a signal line of the data bus to an external contact of the DRAM device . The memory controller further includes memory access logic for storing, in a mode register of the DRAM device, a value that specifies whether the DRAM device's per-DRAM addressability capability (PDA) mode is enabled. The memory access logic is further to send a signal to the external contact via the data interface while the PDA mode of the DRAM device is enabled, to specify whether one or more features of the DRAM device are programmable.

In an embodiment, in response to a signal, the DRAM device selects between executing the received command and prior to executing the received command. In an embodiment, while the PDA mode of the DRAM device is enabled, the memory access logic is further to provide device specific programming of the voltage reference parameters of the DRAM device. In an embodiment, the memory controller further includes a command interface for coupling to both the DRAM device and another DRAM device, wherein the memory access logic further sends a command signal to the DRAM device and to other DRAM devices via the command interface . The memory access logic is further for the DRAM device to send a first signal for executing the instruction indicated by the command signal through the data interface and also for the other DRAM device to execute any instruction indicated by the command signal And to send a second signal for precedence through the data interface.

In one aspect, the system includes an SDRAM device, wherein the SDRAM device includes a memory array, and a mode register for holding at least one mode register bit, wherein the value of the at least one mode register bit is a per- Mode is enabled, where one or more features of the SDRAM device may be programmed if the SDRAM device is in the per-DRAM addressability mode. The system further includes a memory controller coupled to the SDRAM device and the memory controller includes instructions and control logic capable of issuing a command to transition the SDRAM to the per-DRAM addressability mode.

In an embodiment, the memory controller further includes instructions and control logic for programming an on-die termination value for the SDRAM device. In an embodiment, the memory controller further comprises instructions and control logic for programming the voltage reference (Vref) for the SDRAM device. In an embodiment, the SDRAM device is a DDR4 SDRAM device. In an embodiment, the SDRAM device is an LPDDR4 SDRAM device.

In one aspect, an SDRAM device includes a memory array, instruction decoder logic for receiving and decoding instructions from a memory controller, and a mode register for holding at least one mode register bit, wherein the value of the at least one mode register bit is Where the per-DRAM addressability mode is enabled, where one or more features of the SDRAM device may be programmed if the SDRAM device is in the per-DRAM addressability mode.

In an embodiment, the mode register may be programmed with a device specific on-die termination value if the per-DRAM addressability capability mode is enabled. In an embodiment, the mode register may be programmed with a device specific voltage reference (Vref) value if the per address per DRAM capability mode is enabled. In an embodiment, the SDRAM device is an LPDDR4 SDRAM device.

In one aspect, the memory controller includes an input / output interface for coupling the memory controller to one or more SDRAM devices, and instructions and control logic that can issue commands to transition the SDRAM device into the per-DRAM addressability mode. do.

In an embodiment, the memory controller is integrated onto the same integrated circuit as the processor. In an embodiment, the memory controller further includes instructions and control logic for programming an on-die termination value for the SDRAM device. In an embodiment, the memory controller further comprises instructions and control logic for programming a voltage reference (Vref) for the SDRAM device. In an embodiment, the memory controller may control a DDR4 compliant SDRAM device.

 Techniques and architectures for operating memory devices are described herein. In this description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the specific embodiments. It will be apparent, however, to one skilled in the art that the specific embodiments may be practiced without these details. In other instances, structures and devices are shown in block diagram form in order not to obscure the description.

 Reference in the specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. The appearances of the phrase "in one embodiment " appearing in various places in the specification are not necessarily all referring to the same embodiment.

 Part of the detailed description may be presented in terms of a method and symbolic representation of operation on data bits in a computer memory. These methods and expressions are the means used by those skilled in the art of computing to most effectively convey the gist of the work to those skilled in the art. The method is here and generally regarded as a self-contradictory sequence of operations yielding the desired result. Operations are those that require physical manipulation of physical quantities. Usually, though not necessarily, such quantities take the form of electrical or magnetic signals capable of storage, transmission, combination, comparison, and other manipulations. Sometimes it has been found convenient to refer to these signals as bits, values, elements, symbols, letters, terms, numbers, or the like, for reasons of common usage.

 It should be borne in mind, however, that all of these and similar terms are to be associated with the appropriate physical quantities and are merely convenient indicia to apply to such quantities. Unless specifically stated otherwise than clear from the foregoing description, throughout the description, discussions utilizing terms such as " processing "or " calculating & Manipulates data represented by physical (electronic) quantities in registers and memories of a computer system and similarly expresses this data in physical quantities within computer system memory or registers or other such information storage, transmission, or display devices ≪ RTI ID = 0.0 > and / or < / RTI > other data to be processed.

Certain embodiments are also related to apparatus for performing the operations herein. Such a device may be specially constructed for the required purpose, or it may comprise a general purpose computer selectively activated or reconfigured by a computer program stored in the computer. Such a computer program may be stored on any type of disk, including floppy disks, optical disks, CD-ROMs and magneto-optical disks, ROMs, RAMs such as DRAMs, EPROMs, EEPROMs, magnetic or optical cards, Readable storage medium, such as but not limited to any type of media coupled to a computer system bus.

 The methods and displays provided herein are not inherently related to any particular computer or other device. It will be evident from the teachings herein that various general purpose systems may be used with the programs or it may be convenient to construct a more specialized apparatus for performing the operations of the required method. The structures required for various of these systems will be revealed from this description. Also, specific embodiments have not been described with reference to any particular programming language. It will be appreciated that a variety of programming languages may be used to implement the teachings of such embodiments as described herein.

 In addition to the discussion herein, various modifications to the disclosed embodiments and implementations thereof may be made without departing from the scope thereof. Therefore, the examples and examples herein should be construed in an illustrative sense rather than a restrictive sense. The scope of the present invention should be determined with reference to the following claims only.

Claims (44)

1. A dynamic random access memory (DRAM) device comprising:
Memory array;
An external contact for coupling the DRAM device to the signal line DQ0 of the data bus;
A mode register for storing a value indicating whether a per-DRAM addressability (PDA) mode of the DRAM device is enabled, wherein the PDA mode is a mode register of a rank of a plurality of DRAM devices including the DRAM device Only the selected DRAM devices are instructed to process a command to change a configuration setting, and the rank of the plurality of DRAM devices is set such that the memory access instructions are executed in parallel (in parallel) when the PDA mode is not enabled Said plurality of DRAM devices in parallel; And
The control logic coupled to the mode register
/ RTI >
While the PDA mode of the DRAM device is enabled, the control logic conditions the programmability of one or more features of the DRAM device upon detection of a signal received via DQ0 and, based on the logical value of DQ0 Selecting between the execution of a received instruction and the abort of execution of the received instruction, wherein the control logic is operable to select DQ0 as the first falling edge of the data strobe signal or the data < RTI ID = 0.0 > A DRAM device sampling at the second rising edge of the strobe signal. delete delete 2. The DRAM device of claim 1, wherein the DRAM device comprises a DDR4 SDRAM device. 2. The DRAM device of claim 1, wherein the DRAM device comprises an LPDDR4 SDRAM device. 2. The DRAM device of claim 1, wherein the programmability of the one or more features comprises programmability of an on-die termination parameter. 2. The DRAM device of claim 1, wherein the programmability of the one or more features comprises programmability of voltage reference parameters. A memory controller device comprising:
A data interface for coupling the memory controller device to an external contact of the DRAM device via a signal line DQ0 of the data bus; And
Memory access logic for storing in a mode register of the DRAM device a value that specifies whether a per-DRAM addressing capability (PDA) mode of the DRAM device is enabled, the PDA mode comprising a plurality of DRAM devices Wherein a rank of the plurality of DRAM devices indicates that the selected plurality of DRAM devices in the rank of the plurality of DRAM devices are to process instructions for changing configuration settings, Lt; RTI ID = 0.0 > DRAM &
/ RTI >
Wherein the memory access logic further sends a signal to the external contact via the data interface while the PDA mode of the DRAM device is enabled, the signal specifying whether one or more features of the DRAM device are programmable, Causes the DRAM device to select between execution of an instruction sent from the memory controller and abort of execution of the instruction based on a logical value of DQ0, and the control logic of the DRAM device determines the logical value of DQ0 Sampling the falling edge of the data strobe signal on the first falling edge of the data strobe signal or the second rising edge of the data strobe signal. delete 9. The memory controller device of claim 8, wherein while the PDA mode of the DRAM device is enabled, the memory access logic further provides device specific programming of on-die termination parameters of the DRAM device. 9. The memory controller device of claim 8, wherein while the PDA mode of the DRAM device is enabled, the memory access logic further provides device specific programming of the voltage reference parameter of the DRAM device. 9. The memory controller device of claim 8, wherein the DRAM device comprises a DDR4 SDRAM device. 9. The memory controller device of claim 8, wherein the DRAM device comprises an LPDDR4 SDRAM device. 9. The memory controller device of claim 8, wherein the memory controller is integrated with an integrated circuit along with the processor. delete A method in a memory controller comprising:
Storing a value in a mode register of a DRAM device, the value specifying whether the DRAM device's per-DRAM addressability capability (PDA) mode is enabled and the external contact of the DRAM device to a data bus Wherein the PDA mode indicates that only selected DRAM devices in a rank of a plurality of DRAM devices including the DRAM device are to process instructions for changing a configuration setting, The rank including the plurality of DRAM devices in parallel executing all memory access instructions in parallel when the PDA mode is not enabled; And
Sending a signal through DQ0 while the PDA mode of the DRAM device is enabled, the signal for specifying that one or more features of the DRAM device are programmable, and transmitting the signal causes the DRAM device to transmit a DQ0 Wherein the control logic of the DRAM device selects between DQ0 to DQ0 to determine the logic value of DQ0, At the first falling edge of the data strobe signal or the second rising edge of the data strobe signal,
≪ / RTI > delete 17. The method of claim 16,
Providing device-specific programming of the on-die termination parameters of the DRAM device while the PDA mode of the DRAM device is enabled
≪ / RTI > 17. The method of claim 16,
Providing device specific programming of a voltage reference parameter of the DRAM device while the PDA mode of the DRAM device is enabled
≪ / RTI > 17. The method of claim 16, wherein the DRAM device comprises a DDR4 SDRAM device. 17. The method of claim 16, wherein the DRAM device comprises an LPDDR4 SDRAM device. 17. The method of claim 16, wherein the memory controller is integrated with an integrated circuit together with a processor. delete Data bus;
A DRAM device, comprising:
Memory array;
An external contact for coupling the DRAM device to a signal line DQ0 of the data bus;
Mode register; And
Wherein the control logic comprises control logic coupled to the mode register, wherein the control logic is operable, during detection of a signal received via the external contact, Wherein the PDA mode indicates that only selected DRAM devices in a rank of a plurality of DRAM devices including the DRAM device process an instruction to change a configuration setting, Of the DRAM devices comprises a plurality of said DRAM devices in parallel executing all of the memory access instructions in parallel when the PDA mode is not enabled and said control logic is operable to execute the received instructions based on the logical value of DQ0 And the abandonment of the execution of the received command, The logic samples DQ0 at the first falling edge of the data strobe signal or the second rising edge of the data strobe signal to determine the logical value of DQ0; And
A memory controller, the memory controller comprising:
A data interface coupled to the external contacts via the signal line; And
And memory access logic for storing in the mode register a value that specifies whether the PDA mode of the DRAM device is enabled, the memory access logic further for sending a signal to the external contact,
/ RTI > delete 25. The system of claim 24, wherein while the PDA mode of the DRAM device is enabled, the memory access logic further provides device specific programming of on-die termination parameters of the DRAM device. 25. The system of claim 24, wherein while the PDA mode of the DRAM device is enabled, the memory access logic further provides device specific programming of voltage reference parameters of the DRAM device. 25. The system of claim 24, wherein the DRAM device comprises a DDR4 SDRAM device. 25. The system of claim 24, wherein the memory controller is integrated with an integrated circuit together with a processor. delete delete delete delete delete delete delete delete delete delete delete delete delete delete delete

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