KR101815758B1 - Novel compound, adhesive composition, adhesive film and display device - Google Patents

Novel compound, adhesive composition, adhesive film and display device Download PDF

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KR101815758B1
KR101815758B1 KR1020160033925A KR20160033925A KR101815758B1 KR 101815758 B1 KR101815758 B1 KR 101815758B1 KR 1020160033925 A KR1020160033925 A KR 1020160033925A KR 20160033925 A KR20160033925 A KR 20160033925A KR 101815758 B1 KR101815758 B1 KR 101815758B1
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compound
adhesive film
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KR20170109833A (en
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문두경
김두헌
성현아
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건국대학교 산학협력단
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07DHETEROCYCLIC COMPOUNDS
    • C07D271/00Heterocyclic compounds containing five-membered rings having two nitrogen atoms and one oxygen atom as the only ring hetero atoms
    • C07D271/02Heterocyclic compounds containing five-membered rings having two nitrogen atoms and one oxygen atom as the only ring hetero atoms not condensed with other rings
    • C07D271/101,3,4-Oxadiazoles; Hydrogenated 1,3,4-oxadiazoles
    • C07D271/1071,3,4-Oxadiazoles; Hydrogenated 1,3,4-oxadiazoles with two aryl or substituted aryl radicals attached in positions 2 and 5
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C69/00Esters of carboxylic acids; Esters of carbonic or haloformic acids
    • C07C69/52Esters of acyclic unsaturated carboxylic acids having the esterified carboxyl group bound to an acyclic carbon atom
    • C07C69/533Monocarboxylic acid esters having only one carbon-to-carbon double bond
    • C07C69/54Acrylic acid esters; Methacrylic acid esters
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
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    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper

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Abstract

본 발명은 신규한 화합물, 이를 포함하는 점착 조성물, 상기 점착 조성물로 형성된 점착 필름 및 상기 점착 필름을 포함하는 디스플레이 장치에 관한 것으로, 본 발명에 따른 신규한 화합물은, 분자 구조상 디페닐옥사디아졸(diphenyl-oxadiazile) 주쇄와 연결고리로 에스터기 및 열중합이 가능한 말단기를 갖는 단량체를 공중합하여 얻어지는 공중합체인 아크릴계 화합물로서, 열적 안정성 및 광학적 특성이 우수하며, 이를 포함하는 점착 필름은 우수한 투명성, 열안정성 및 유연성 등을 구현할 수 있다.The present invention relates to a novel compound, a pressure sensitive adhesive composition containing the same, a pressure sensitive adhesive film formed of the pressure sensitive adhesive composition, and a pressure sensitive adhesive film. The present invention relates to a novel compound according to the present invention, diphenyl-oxadiazile) backbone and a monomer having an ester group and a terminal group capable of thermopolymerization with a linking ring, and is excellent in thermal stability and optical properties, and the pressure-sensitive adhesive film comprising the acrylic compound is excellent in transparency, heat Stability and flexibility can be realized.

Description

신규한 화합물, 점착 조성물, 점착 필름 및 디스플레이 장치{Novel compound, adhesive composition, adhesive film and display device}TECHNICAL FIELD [0001] The present invention relates to a novel compound, a pressure sensitive adhesive composition, a pressure sensitive adhesive film,

본 발명은 신규한 화합물, 이를 포함하는 점착 조성물, 상기 점착 조성물로 형성된 점착 필름 및 상기 점착 필름을 포함하는 디스플레이 장치에 관한 것이다.
The present invention relates to a novel compound, a pressure sensitive adhesive composition containing the same, a pressure sensitive adhesive film formed of the pressure sensitive adhesive composition, and a display device including the pressure sensitive adhesive film.

최근 디스플레이 관련 기술의 발달과 함께, 접거나, 롤(Roll) 형상으로 말거나, 고무줄처럼 늘리는 등, 사용 단계에서 변형 가능한 디스플레이 장치들이 연구 및 개발되고 있다. 이들 디스플레이는 다양한 형태로 변형 가능하기 때문에, 사용 단계에서의 디스플레이의 대형화 요구와 휴대를 위한 디스플레이의 소형화의 요구를 모두 만족시킬 수 있다. With the recent development of display related technologies, display devices which can be deformed at the use stage such as folding, rolling, or stretching like rubber are being studied and developed. Since these displays can be modified into various forms, it is possible to satisfy both demands for enlargement of the display at the use stage and miniaturization of the display for carrying.

변형 가능한 디스플레이 장치는 미리 설정된 형태로 변형될 수 있을 뿐 아니라, 사용자의 요구에 상응하여 또는 디스플레이 장치가 사용되는 상황의 필요에 맞추어 다양한 형태로 변형될 수 있다. 따라서, 디스플레이의 변형된 형태를 인식하고, 인식한 형태에 대응하여 디스플레이 장치를 제어할 필요가 있다.The deformable display device can be modified into various forms in accordance with the requirements of the user or the situation in which the display device is used. Therefore, it is necessary to recognize the deformed shape of the display and to control the display device in accordance with the recognized shape.

한편, 변형 가능한 디스플레이 장치는 변형에 따라 디스플레이 장치의 각 구성이 손상될 문제가 있기 때문에, 이러한 디스플레이 장치의 각 구성들은 폴딩(Folding) 신뢰성 및 안정성을 만족해야 한다.On the other hand, since the deformable display device has a problem that each configuration of the display device is damaged according to the modification, each of the configurations of the display device must satisfy the folding reliability and stability.

이러한 변형 가능한 디스플레이 장치에 대한 높아진 기대 수준을 맞추기 위해서는 보다 뛰어난 유연성이 높은 터치패널이 필요하며 이를 위한 광학용 점착 필름이 필요하다.In order to meet the increased expectations for such deformable display devices, a more flexible touch panel is required and an optical adhesive film is required for this.

광학용 점착 필름 소재는 디스플레이 장치의 각 구성들 간의 접합을 해주는 역할 이외에 굴절률 정합을 해줌으로써 난반사를 줄여 시인성을 향상시키고, 디스플레이 모듈의 내충격성 또는 강성을 향상시키는 목적으로 사용하는 재료로서, 우수한 점착력, 내열성, 기계적 특성, 광투과율, 광학적 특성을 만족하는 광학용 점착 필름이 필요한 실정이다.
The optical adhesive film material is a material used for the purpose of improving the visibility by reducing the diffuse reflection and enhancing the impact resistance or rigidity of the display module by performing refractive index matching in addition to bonding between the respective constituents of the display device. , Heat resistance, mechanical properties, light transmittance, and optical properties.

한국공개특허 제2006-0072086호Korean Patent Publication No. 2006-0072086

본 발명은 신규한 화합물, 이를 포함하는 점착 조성물, 상기 점착 조성물로 형성된 점착 필름 및 상기 점착 필름을 포함하는 디스플레이 장치에 관한 것으로, 열적 안정성 및 광학적 특성이 우수한 신규한 화합물을 포함하는 아크릴계 점착 조성물을 제공하고자 한다.
The present invention relates to a novel compound, a pressure sensitive adhesive composition containing the same, a pressure sensitive adhesive film formed of the pressure sensitive adhesive composition, and a display device including the pressure sensitive adhesive film. The present invention relates to an acrylic pressure sensitive adhesive composition containing a novel compound having excellent thermal stability and optical properties. .

본 발명은 열적 안정성 및 광학적 특성이 우수한 신규한 화합물의 하나의 예로서, The present invention is an example of a novel compound having excellent thermal stability and optical properties,

하기 화학식 1의 구조를 나타내는 화합물을 제공할 수 있다.A compound represented by the following formula (1) can be provided.

[화학식 1][Chemical Formula 1]

Figure 112016027446947-pat00001
Figure 112016027446947-pat00001

상기 화학식 1에서,In Formula 1,

R1은 수소 원자, 탄소수 1 내지 30의 알킬기, 탄소수 1 내지 30의 알콕시기, 탄소수 6 내지 30의 아릴기 또는 탄소수 1 내지 30의 헤테로아릴기를 나타내고,R 1 represents a hydrogen atom, an alkyl group having 1 to 30 carbon atoms, an alkoxy group having 1 to 30 carbon atoms, an aryl group having 6 to 30 carbon atoms, or a heteroaryl group having 1 to 30 carbon atoms,

상기 R1의 수소들 중 하나 이상은 각각 독립적으로 탄소수 1 내지 30의 알킬기 또는 탄소수 1 내지 30의 알콕시기로 치환 또는 비치환되고,At least one of the hydrogen of the R 1 are each independently substituted or unsubstituted alkoxy group having 1 to 30 carbon atoms or an alkyl group having 1 to 30,

R2는 하기 화학식 2를 나타내고,R 2 represents the following formula (2)

[화학식 2](2)

Figure 112016027446947-pat00002
Figure 112016027446947-pat00002

상기 화학식 2에서, In Formula 2,

R3은 메틸아크릴레이트 또는 메틸메타아크릴레이트를 나타내며,R 3 represents methyl acrylate or methyl methacrylate,

n은 1 내지 15의 정수이다.
n is an integer of 1 to 15;

또한, 본 발명은 상기 화합물을 포함하는 점착 조성물을 제공할 수 있다.
Further, the present invention can provide a pressure-sensitive adhesive composition comprising the compound.

또한, 본 발명은 상기 점착 조성물로 형성된 점착 필름을 제공할 수 있다.
Further, the present invention can provide an adhesive film formed from the adhesive composition.

또한, 본 발명은 상기 점착 필름을 포함하는 디스플레이 장치를 제공할 수 있다.
In addition, the present invention can provide a display device including the adhesive film.

본 발명에 따른 신규한 화합물은, 분자 구조상 디페닐옥사디아졸(diphenyl-oxadiazile) 주쇄와 연결고리로 에스터기 및 열중합이 가능한 말단기를 갖는 단량체를 공중합하여 얻어지는 공중합체인 아크릴계 화합물로서, 열적 안정성 및 광학적 특성이 우수하며, 이를 포함하는 점착 필름은 우수한 투명성, 열안정성 및 유연성 등을 구현할 수 있다.
The novel compound according to the present invention is an acrylic compound which is a copolymer obtained by copolymerizing a diphenyl-oxadiazine main chain in the molecular structure with a monomer having an ester group and a terminal group capable of thermopolymerization with a linking ring, And optical properties, and the pressure-sensitive adhesive film containing the same can realize excellent transparency, thermal stability and flexibility.

도 1 및 2는 각각 일 실시예에서 제조된 화합물의 1H-NMR 스펙트럼이다.
도 3 내지 5는 각각 일 실시예에서 제조된 화합물의 UV-vis 투과 스펙트럼이다.
도 6은 일 실시예에서 제조된 화합물의 DSC 스펙트럼이다.
Figures 1 and 2 are 1 H-NMR spectra of the compounds prepared in one embodiment, respectively.
Figures 3 to 5 are UV-vis transmission spectra of the compounds prepared in one embodiment, respectively.
Figure 6 is a DSC spectrum of the compound prepared in one embodiment.

본 발명은 다양한 변경을 가할 수 있고 여러 가지 실시예를 가질 수 있는 바, 특정 실시예들을 도면에 예시하고 상세한 설명에 상세하게 설명하고자 한다.While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail.

그러나, 이는 본 발명을 특정한 실시 형태에 대해 한정하려는 것이 아니며, 본 발명의 사상 및 기술 범위에 포함되는 모든 변경, 균등물 내지 대체물을 포함하는 것으로 이해되어야 한다.It should be understood, however, that the invention is not intended to be limited to the particular embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

본 발명에서, "포함한다" 또는 "가지다" 등의 용어는 명세서상에 기재된 특징, 숫자, 단계, 동작, 구성요소, 부품 또는 이들을 조합한 것이 존재함을 지정하려는 것이지, 하나 또는 그 이상의 다른 특징들이나 숫자, 단계, 동작, 구성요소, 부품 또는 이들을 조합한 것들의 존재 또는 부가 가능성을 미리 배제하지 않는 것으로 이해되어야 한다.
In the present invention, the terms "comprises" or "having ", and the like, specify that there is a feature, number, step, operation, component, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

이하, 본 발명에 대하여 구체적으로 설명하기로 한다.Hereinafter, the present invention will be described in detail.

본 발명은 신규한 화합물, 이를 포함하는 점착 조성물, 상기 점착 조성물로 형성된 점착 필름 및 상기 점착 필름을 포함하는 디스플레이 장치에 관한 것으로, The present invention relates to a novel compound, a pressure sensitive adhesive composition containing the same, a pressure sensitive adhesive film formed of the pressure sensitive adhesive composition, and a pressure sensitive adhesive film,

상기 화합물은, 분자 구조상 디페닐옥사디아졸(diphenyl-oxadiazile) 주쇄와 연결고리로 에스터기 및 열중합이 가능한 말단기를 갖는 단량체를 공중합하여 얻어지는 공중합체인 아크릴계 화합물일 수 있다.The above compound may be an acrylic compound which is a copolymer obtained by copolymerizing a diphenyl-oxadiazine main chain in a molecular structure with a monomer having an ester group and a terminal group capable of thermopolymerization with a linking ring.

예를 들어, 상기 화합물은 하기 화학식 1의 구조를 나타낼 수 있다.For example, the compound may have a structure represented by the following formula (1).

[화학식 1][Chemical Formula 1]

Figure 112016027446947-pat00003
Figure 112016027446947-pat00003

상기 화학식 1에서,In Formula 1,

R1은 수소 원자, 탄소수 1 내지 30의 알킬기, 탄소수 1 내지 30의 알콕시기, 탄소수 6 내지 30의 아릴기 또는 탄소수 1 내지 30의 헤테로아릴기를 나타내고,R 1 represents a hydrogen atom, an alkyl group having 1 to 30 carbon atoms, an alkoxy group having 1 to 30 carbon atoms, an aryl group having 6 to 30 carbon atoms, or a heteroaryl group having 1 to 30 carbon atoms,

상기 R1의 수소들 중 하나 이상은 각각 독립적으로 탄소수 1 내지 30의 알킬기 또는 탄소수 1 내지 30의 알콕시기로 치환 또는 비치환되고,At least one of the hydrogen of the R 1 are each independently substituted or unsubstituted alkoxy group having 1 to 30 carbon atoms or an alkyl group having 1 to 30,

R2는 하기 화학식 2를 나타내고,R 2 represents the following formula (2)

[화학식 2](2)

Figure 112016027446947-pat00004
Figure 112016027446947-pat00004

상기 화학식 2에서, In Formula 2,

R3은 메틸아크릴레이트 또는 메틸메타아크릴레이트를 나타내며,R 3 represents methyl acrylate or methyl methacrylate,

n은 1 내지 15의 정수이다.n is an integer of 1 to 15;

본 발명에서, "아릴기"는 방향족 탄화수소로부터 유도된 1가의 치환기로 정의된다.In the present invention, the "aryl group" is defined as a monovalent substituent derived from an aromatic hydrocarbon.

상기 아릴기의 구체적인 예로서는, 페닐기(phenyl group), 나프틸기(naphthyl group), 안트라세닐기(anthracenyl group), 페난트릴기(phenanathryl group), 나프타세닐기(naphthacenyl group), 피레닐기(pyrenyl group), 톨릴기(tolyl group), 바이페닐기(biphenylyl group), 터페닐기(terphenylyl group), 크리세닐기(chrycenyl group), 스피로바이플루오레닐(spirobifluorenyl group), 플루오란테닐(fluoranthenyl group), 플루오레닐기(fluorenyl group), 페릴레닐기(perylenyl group), 인데닐기(indenyl group), 아줄레닐기(azulenyl group), 헵타레닐기(heptalenyl group), 페날레닐기(phenalenyl group), 페난트레닐기(phenanthrenyl group) 등을 들 수 있다.Specific examples of the aryl group include a phenyl group, a naphthyl group, an anthracenyl group, a phenanthryl group, a naphthacenyl group, a pyrenyl group, A tolyl group, a biphenylyl group, a terphenyl group, a chrycenyl group, a spirobifluorenyl group, a fluoranthenyl group, a fluorene group, A perfluoroalkyl group, a fluorenyl group, a perylenyl group, an indenyl group, an azulenyl group, a heptalenyl group, a phenalenyl group, a phenanthrenyl group, group).

"헤테로아릴기"는 단환 또는 축합환으로부터 유도된 "방향족 복소환" 또는 "헤테로사이클릭"을 나타낸다. 상기 헤테로아릴기는, 헤테로 원자로서 질소(N), 황(S), 산소(O), 인(P), 셀레늄(Se) 및 규소(Si) 중에서 적어도 하나를 포함할 수 있다."Heteroaryl group" refers to an "aromatic heterocycle" or "heterocyclic" derived from a monocyclic or fused ring. The heteroaryl group may include at least one of nitrogen (N), sulfur (S), oxygen (O), phosphorus (P), selenium (Se), and silicon (Si) as a heteroatom.

상기 헤테로아릴기의 구체적인 예로서는, 피롤릴기, 피리딜기, 피리다지닐기, 피리미디닐기, 피라지닐기, 트리아졸릴기, 테트라졸릴기, 벤조트리아졸릴기, 피라졸릴기, 이미다졸릴기, 벤즈이미다졸릴기, 인돌릴기, 이소인돌릴기, 인돌리지닐기, 푸리닐기, 인다졸릴기, 퀴놀릴기, 이소퀴놀리닐기, 퀴놀리지닐기, 프탈라지닐기, 나프틸리디닐기, 퀴녹살리닐기, 퀴나졸리닐기, 신놀리닐기, 프테리디닐기, 이미다조트리아지닐기, 피라지노피리다지닐기, 아크리디닐기, 페난트리디닐기, 카르바졸릴기, 카르바졸리닐기, 피리미디닐기, 페난트롤리닐기, 페나시닐기, 이미다조피리디닐기, 이미다조피리미디닐기, 피라졸로피리디닐기, 피라졸로피리디닐기 등을 포함하는 함질소 헤테로 아릴기; 티에닐기, 벤조티에닐기, 디벤조티에닐기 등을 포함하는 황함유 헤테로 아릴기; 푸릴기, 피라닐기, 사이클로펜타피라닐기, 벤조푸라닐기, 이소벤조푸라닐기, 디벤조푸라닐기 등을 포함하는 함산소 헤테로 아릴기 등을 들 수 있다. 또한, 상기 헤테로 아릴기의 구체적인 예로서는, 티아졸릴기, 이소티아졸릴기, 벤조티아졸릴기, 벤즈티아디아졸릴기, 페노티아지닐기, 이속사졸릴기, 푸라자닐기, 페녹사지닐기, 옥사졸릴기, 벤조옥사졸릴기, 옥사디아졸릴기, 피라졸로옥사졸릴기, 이미다조티아졸릴기, 티에노푸라닐기, 푸로피롤릴기, 피리독사지닐기 등의 적어도 2개 이상의 헤테로 원자를 포함하는 화합물들을 들 수 있다.Specific examples of the heteroaryl group include pyrrolyl, pyridyl, pyridazinyl, pyrimidinyl, pyrazinyl, triazolyl, tetrazolyl, benzotriazolyl, pyrazolyl, imidazolyl, An imidazolyl group, an isoindolyl group, an indolizinyl group, a pyridyl group, an indazolyl group, a quinolyl group, an isoquinolinyl group, a quinolizinyl group, a phthalazinyl group, a naphthyridinyl group, A carbazolyl group, a pyrrolidinyl group, a pyrrolidinyl group, a pyrrolidinyl group, a pyrrolidinyl group, a pyrrolidinyl group, a pyrrolidinyl group, an imidazolyl group, A nitrogen-containing heteroaryl group including a phenanthryl group, a phenanthrolinyl group, a phenacyl group, an imidazopyridinyl group, an imidazopyrimidinyl group, a pyrazolopyridinyl group, a pyrazolopyridinyl group and the like; A sulfur-containing heteroaryl group including a thienyl group, a benzothienyl group, a dibenzothienyl group and the like; An oxygen-containing heteroaryl group including a furyl group, a pyranyl group, a cyclopentapyranyl group, a benzofuranyl group, an isobenzofuranyl group, a dibenzofuranyl group and the like. Specific examples of the heteroaryl group include a thiazolyl group, an isothiazolyl group, a benzothiazolyl group, a benzothiadiazolyl group, a phenothiazinyl group, an isoxazolyl group, a furazanyl group, a phenoxazinyl group, A compound containing at least two heteroatoms such as a benzyl group, a benzyl group, a benzyl group, a benzyl group, a benzyl group, a benzyl group, a benzyl group, a benzyl group, a benzyl group, a benzyl group, .

"알킬기"는 직쇄(linear) 또는 분지(branched) 상 포화탄화수소로부터 유도된 작용기로 정의된다."Alkyl group" is defined as a functional group derived from a linear or branched saturated hydrocarbon.

상기 알킬기의 구체적인 예로서는, 메틸기(methyl group), 에틸기(ethyl group), n-프로필기(n-propyl group), 이소프로필기(iso-propyl group), n-부틸기(n-butyl group), sec-부틸기(sec-butyl group), t-부틸기(tert-butyl group), n-펜틸기(n-pentyl group), 1,1-디메틸프로필기(1,1-dimethylpropyl group), 1,2-디메틸프로필기, 2,2-디메틸프로필기, 1-에틸프로필기, 2-에틸프로필기, n-헥실기, 1-메틸-2-에틸프로필기, 1-에틸-2-메틸프로필기, 1,1,2-트리메틸프로필기, 1-프로필프로필기, 1-메틸부틸기, 2-메틸부틸기, 1,1-디메틸부틸기, 1,2-디메틸부틸기, 2,2-디메틸부틸기, 1,3-디메틸부틸기, 2,3-디메틸부틸기, 2-에틸부틸기, 2-메틸펜틸기, 3-메틸펜틸기 등을 들 수 있다.
Specific examples of the alkyl group include a methyl group, an ethyl group, an n-propyl group, an iso-propyl group, an n-butyl group, butyl group, a sec-butyl group, a tert-butyl group, an n-pentyl group, a 1,1-dimethylpropyl group, , 2-dimethylpropyl group, 2,2-dimethylpropyl group, 1-ethylpropyl group, 2-ethylpropyl group, n-hexyl group, Methylpropyl group, 1-methylbutyl group, 2-methylbutyl group, 1,1-dimethylbutyl group, 1,2-dimethylbutyl group, 2,2- Dimethylbutyl group, 1,3-dimethylbutyl group, 2,3-dimethylbutyl group, 2-ethylbutyl group, 2-methylpentyl group and 3-methylpentyl group.

하나의 예로서, 상기 화학식 1로 나타내는 화합물은,As one example, the compound represented by the above formula (1)

R1은 수소 원자, 탄소수 1 내지 10의 알킬기, 탄소수 1 내지 10의 알콕시기, 탄소수 6 내지 10의 아릴기 또는 탄소수 1 내지 10의 헤테로아릴기를 나타내고,R 1 represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, or a heteroaryl group having 1 to 10 carbon atoms,

상기 R1의 수소들 중 하나 이상은 각각 독립적으로 탄소수 1 내지 10의 알킬기 또는 탄소수 1 내지 10의 알콕시기로 치환 또는 비치환되고,At least one of the hydrogen of the R 1 are each independently substituted or unsubstituted alkoxy group having 1 to 10 carbon atoms or an alkyl group having 1 to 10 carbon atoms of,

R2는 하기 화학식 2를 나타내고,R 2 represents the following formula (2)

[화학식 2](2)

Figure 112016027446947-pat00005
Figure 112016027446947-pat00005

상기 화학식 2에서, In Formula 2,

R3은 메틸아크릴레이트 또는 메틸메타아크릴레이트를 나타내며,R 3 represents methyl acrylate or methyl methacrylate,

n은 1 내지 10의 정수인 화합물일 수 있다.
and n is an integer of 1 to 10.

다른 하나의 예로서, 상기 화학식 1로 나타내는 화합물은,As another example, the compound represented by the general formula (1)

R1은 수소 원자 또는 탄소수 1 내지 10의 알킬기를 나타내고,R 1 represents a hydrogen atom or an alkyl group having 1 to 10 carbon atoms,

R2는 하기 화학식 2를 나타내고,R 2 represents the following formula (2)

[화학식 2](2)

Figure 112016027446947-pat00006
Figure 112016027446947-pat00006

상기 화학식 2에서, In Formula 2,

R3은 메틸아크릴레이트를 나타내며,R 3 represents methyl acrylate,

n은 1 내지 5의 정수인 화합물일 수 있다.
and n is an integer of 1 to 5.

화학식 1로 나타내는 화합물은 하기 구조 1 내지 6으로 이루어진 그룹으로부터 선택되는 1 종 이상일 수 있다.The compound represented by the formula (1) may be at least one selected from the group consisting of the following structures 1 to 6.

<구조 1><Structure 1>

Figure 112016027446947-pat00007
Figure 112016027446947-pat00007

<구조 2><Structure 2>

Figure 112016027446947-pat00008
Figure 112016027446947-pat00008

<구조 3><Structure 3>

Figure 112016027446947-pat00009
Figure 112016027446947-pat00009

<구조 4><Structure 4>

Figure 112016027446947-pat00010
Figure 112016027446947-pat00010

<구조 5><Structure 5>

Figure 112016027446947-pat00011
Figure 112016027446947-pat00011

<구조 6><Structure 6>

Figure 112016027446947-pat00012

Figure 112016027446947-pat00012

상기 화합물은 400 내지 800 nm 파장 영역에서 광투과도가 90% 이상일 수 있다. 구체적으로, 400 내지 800 nm 파장 영역은 가시광선 영역을 의미할 수 있다. 이때, 본 발명에 따른 화합물은 가시광선 영역에서 광투과도가 90% 이상으로, 예를 들어, 상기 광투과도는 90 내지 100%, 95 내지 100% 또는 96 내지 100% 범위를 만족할 수 있다. 이와 같이, 상기 화합물은 가시광선 영역에 대한 광투가도가 우수하여, 광학 분야의 소재로서 용이하게 사용될 수 있다.
The compound may have a light transmittance of 90% or more in a wavelength region of 400 to 800 nm. Specifically, a wavelength region of 400 to 800 nm may mean a visible light region. At this time, the compound according to the present invention may have a light transmittance of 90% or more, for example, 90 to 100%, 95 to 100% or 96 to 100% in the visible light region. Thus, the compound is excellent in light transmission to the visible light region and can be easily used as a material in the optical field.

상기 화합물은 시차주사열량법(DSC: Differential Scanning Calorimetry) 분석 시, 100℃ 이상에서 하나 이상의 흡열 피크를 가질 수 있다. 예를 들어, 상기 화합물은 시차주사열량법 분석 시, 100 내지 160℃, 100 내지 140℃ 또는 100 내지 120℃ 범위에서 하나 이상의 흡열 피크를 가질 수 있다. 상기 시차주사열량법 분석 시, 100℃ 이상에서 하나 이상의 흡열 피크를 가짐으로써, 화합물이 이루는 입자의 내부 결정성이 부여되며, 우수한 광학적 특성과 함께, 고온에서 열처리할 시, 향상된 열안정성을 확보할 수 있다.
The compound may have one or more endothermic peaks at 100 캜 or higher in differential scanning calorimetry (DSC) analysis. For example, the compound may have one or more endothermic peaks at 100 to 160 ° C, 100 to 140 ° C, or 100 to 120 ° C in differential scanning calorimetry analysis. In the differential scanning calorimetry analysis, by having at least one endothermic peak at 100 ° C or higher, the internal crystallinity of the particles formed by the compound is imparted, and excellent thermal stability is ensured by heat treatment at a high temperature .

본 발명은 상기 화합물을 포함하는 점착 조성물을 제공할 수 있다. 예를 들어, 상기 점착 조성물은, 상기 화합물을 비롯하여, 가교제 등을 더 포함할 수 있으며, 상기 가교제를 포함한 부가물에 대해서는 구체적으로 한정하지 않는다. 이때, 상기 화합물은 점착 조성물 100 중량부에 대하여, 10 내지 60 중량부를 포함할 수 있다. 예를 들어, 상기 화합물은 10 내지 50 중량부, 10 내지 40 중량부를 포함할 수 있다. 상기 범위 내의 함량으로 화합물을 포함하는 점착 조성물은, 우수한 점착능을 구현할 수 있다. The present invention can provide a pressure-sensitive adhesive composition comprising the compound. For example, the pressure-sensitive adhesive composition may further include a crosslinking agent and the like, including the compound, and the adduct including the crosslinking agent is not specifically limited. At this time, the compound may include 10 to 60 parts by weight based on 100 parts by weight of the adhesive composition. For example, the compound may include 10 to 50 parts by weight and 10 to 40 parts by weight. The adhesive composition containing the compound in the content within the above range can realize excellent adhesive ability.

또한 본 발명은, 상기 점착 조성물을 이용하여 형성된 점착 필름을 제공할 수 있다. Further, the present invention can provide an adhesive film formed using the adhesive composition.

상기 점착 필름은 -20℃ 내지 90℃의 온도 범위에서 측정한 평균 손실 탄성률이 104 내지 106 Pa일 수 있다. 이와 같이, 본 발명에 따른 점착 필름은, 넓은 온도 구간에서 손실 탄성률의 변화가 적어, 매우 유연하며, 굽힘 신뢰성이 우수할 수 있다. 상기 점착 필름의 -20℃ 내지 90℃의 온도 범위에서 측정한 손실 탄성률은 예를 들어, 104 내지 8 x 105, 104 내지 3 x 105 또는 104 내지 105 범위일 수 있다.The pressure-sensitive adhesive film may have an average loss elastic modulus of 10 4 to 10 6 Pa measured in a temperature range of -20 ° C to 90 ° C. As described above, the pressure-sensitive adhesive film according to the present invention has a small loss elastic modulus change over a wide temperature range, is very flexible, and can be excellent in bending reliability. The loss elastic modulus of the adhesive film measured at a temperature range of -20 캜 to 90 캜 may be in the range of, for example, 10 4 to 8 x 10 5 , 10 4 to 3 x 10 5, or 10 4 to 10 5 .

상기 점착 필름은 광학용 투명 점착 필름(Optical Clear Adhesive)일 수 있다. 구체적으로, 광학 분야에서 사용되는 점착 필름으로 사용되기 위해서는 빛의 경로에 방해가 되지 않으며, 광투과성이 우수해야 하는 등의 특성이 요구된다.The adhesive film may be an optical clear adhesive film (Optical Clear Adhesive). Specifically, in order to be used as a pressure-sensitive adhesive film used in the optical field, it is required to have such properties as not to interfere with the path of light, and to have excellent light transmittance.

예를 들어, 상기 광학용 투명 점착 필름은 디스플레이와 보호기판 또는 터치 패널을 접합해 주는 역할 이외에 굴절률 정합(Index Matching)을 해줌으로써 난반사를 줄여 시인성을 향상시키고, 내충격성 또는 디스플레이 모듈의 강성을 향상시키는 목적으로 사용되는 재료일 수 있다.For example, the optical transparent adhesive film serves to bond the display with the protective substrate or the touch panel, and performs index matching to improve the visibility by reducing the diffuse reflection and improve the impact resistance or rigidity of the display module Or the like.

또한, 최근 유연한 디스플레이 장치의 높아진 기재 수준을 맞추기 위해서는 점착 필름의 유연성 또한 요구된다. 이에 대해, 본 발명에 따른 점착 필름은 우수한 광학 특성을 비롯하여 유연성을 갖추고 있어, 광학용 투명 점착 필름으로서 유용하게 사용될 수 있다.
In addition, flexibility of an adhesive film is also required in order to meet the heightened substrate level of flexible display devices in recent years. On the other hand, the pressure-sensitive adhesive film of the present invention has excellent optical properties and flexibility and can be used as a transparent pressure-sensitive adhesive film for optical applications.

본 발명은 상기 점착 필름을 포함하는 디스플레이 장치를 제공할 수 있다. 상기 디스플레이는 장치는 구체적으로 한정되지 않으며, 예를 들어, LCD(liquid crystal display), CRT(cathode ray tube), PDP(plasma display panel), FED(field emission display) 및 OLED(organic light emitting diode) 등을 포함할 수 있으며, 실생활에서 TV, 컴퓨터, 노트북, 네비게이션, 스마트 폰, 테블릿 PC, 전자책 및 손목시계 등에 적용될 수 있다. The present invention can provide a display device including the adhesive film. The display device is not particularly limited and may be a liquid crystal display (LCD), a cathode ray tube (CRT), a plasma display panel (PDP), a field emission display (FED) And can be applied to a TV, a computer, a notebook, a navigation, a smart phone, a tablet PC, an e-book, and a wrist watch in a real life.

하나의 예로서, 상기 디스플레이 장치는, 디스플레이; 터치패널; 및 보호기판을 포함하는 구조를 가질 수 있으며,As one example, the display device may include: a display; Touch panel; And a protective substrate,

상기 점착 필름은 디스플레이 장치와 터치패널 사이 및 터치패널과 보호기판 사이에 형성될 수 있다.The adhesive film may be formed between the display device and the touch panel, and between the touch panel and the protection substrate.

본 발명에 따른 점착 필름을 이용하여 디스플레이 장치, 터치패널 및 보호기판 등의 디스플레이 장치의 구성 요소를 점착함으로써, 우수한 광학 특성으로 인해 디스플레이 장치의 효율 저하를 방지할 수 있다.By adhering the components of the display device such as the display device, the touch panel, and the protective substrate using the adhesive film according to the present invention, it is possible to prevent the deterioration of the efficiency of the display device due to the excellent optical characteristics.

상기 디스플레이 장치는 폴더블(foldable) 디스플레이 장치일 수 있다. The display device may be a foldable display device.

상기 폴더블(foldable) 디스플레이란, 종이처럼 접혔다 폈다는 반복할 수 있도록 설계되어, 접힘 부분이 곡률 반경이 5mm 이내인 플렉시블 디스플레이를 의미할 수 있다. The foldable display means a flexible display in which a folded portion is designed to be folded like a paper so that the folded portion has a radius of curvature of 5 mm or less.

폴더블(foldable) 디스플레이에 사용되는 점착 필름은 기존 점착 필름과는 달리 굽힌 신뢰성을 만족해야 하는데, 이러한 굽힘 신뢰성이 우수하기 위해서는 넓은 온도 구간에서 손실 탄성률의 변화가 적은 것이 바람직하다.Unlike the conventional adhesive film, the adhesive film used for the foldable display must satisfy the bending reliability. In order to have excellent bending reliability, it is preferable that the change in the loss elastic modulus is small in a wide temperature range.

이에 대해, 본 발명에 따른 점착 필름은 상기 설명한 바와 같이, 손실 탄성률이 104 내지 106 Pa 범위로, 폴더블 디스플레이에서 요구하는 조건을 만족할 수 있다.
On the other hand, as described above, the pressure-sensitive adhesive film according to the present invention has a loss elastic modulus ranging from 10 4 to 10 6 Pa and can satisfy the conditions required in the foldable display.

이하 실시예 등을 통해 본 발명을 더 상세히 설명한다. 본 발명의 실시예 등은 발명의 상세한 설명을 위한 것일 뿐, 이에 의해 권리범위를 제한하려는 것은 아니다.
Hereinafter, the present invention will be described in more detail by way of examples and the like. The embodiments of the present invention are intended to be illustrative of the invention and are not intended to limit the scope of the invention.

실시예Example 1: <구조 1>의 화합물 제조 1: Preparation of compound of < structure 1 >

본 발명에 따른 구조 1의 화합물을 하기 반응식 1 내지 3을 통해 제조하였다. Compounds of structure 1 according to the invention are prepared via the following schemes 1 to 3.

[반응식 1][Reaction Scheme 1]

Figure 112016027446947-pat00013
Figure 112016027446947-pat00013

메톡시벤조니트릴(4-methoxybenzonitrile, TCI사) 5g, 소듐아지드(sodium azide, Aldrich사) 3.66g 및 암모늄클로라이드(mmonium chloride, Aldrich사) 3.01g를 혼합하고, 진공 후 질소 치환한 후에 디메틸폼아마이드(DMF, Aldrich사)에 녹이고 100℃에서 20 시간 동안 교반하였다. 그런 다음, 상온으로 식힌 후 증류수 하이드로젠클로라이드(HCl, 삼천사)를 넣고 반응 종결 후, 필터하여 화합물 A(5-4(methoxyphenyl)-2H-tetrazole) 4.74g(71%)를 얻었다. 5 g of 4-methoxybenzonitrile (TCI), 3.66 g of sodium azide (Aldrich) and 3.01 g of ammonium chloride (mmonium chloride, Aldrich) were mixed, and after nitrogen substitution in vacuum, dimethylform Amide (DMF, Aldrich) and stirred at 100 ° C for 20 hours. Thereafter, the reaction solution was cooled to room temperature, distilled water was added thereto, and the reaction was terminated by filtration to obtain 4.74 g (71%) of Compound A (5-4 (methoxyphenyl) -2H-tetrazole).

화합물 A 4.74g 및 터트-부틸벤조일클로라이드(4-tert-butylbenzoyl chloride, Aldrich사) 5.97ml를 혼합하고, 진공 후 질소 치환한 후 교반하였다. 그런 다음, 피리딘(pyridine, Aldrich사) 44ml을 혼합하고, 115℃에서 2 시간 동안 교반 후, 상온으로 식혀 반응을 종결 하였다. 그런 다음, 필터한 후 컬럼 정제하여 화합물 B(2-4(tert-butylphenyl)-5-(4-methoxyphenyl)-1,3,4-oxadiazole) 7.9g(95%)를 얻었다.4.74 g of Compound A and 5.97 ml of 4-tert-butylbenzoyl chloride (Aldrich) were mixed, and the mixture was purged with nitrogen after vacuum, and then stirred. Then, 44 ml of pyridine (Aldrich) was mixed, stirred at 115 ° C for 2 hours, cooled to room temperature, and the reaction was terminated. Then, the solution was filtered to obtain a compound (B) (2-4 (tert-butylphenyl) -5- (4-methoxyphenyl) -1,3,4-oxadiazole (7.9 g, 95%).

화합물 B 7.9g을 메틸클로라이드(methyl chloride, Aldrich사) 76ml에 녹이고 진공 치환 후 -78℃로 내려 보론트리브로마이드(boron tribromide, Aldrich사) 52ml를 천천히 첨가하였다. 그런 다음, 온도를 0℃로 올려 3 시간 동안 교반한 후, 상온에서 14 시간 교반하였다. 그런 다음, 이써(ether, 덕산사)와 증류수로 반응 종결한 후에 추출하고 컬럼 정제하여 화합물 C(4-(5-4(tert-butylphenyl)-1,3,4-oxadiazole-2-yl)phenol) 6.9g(91%)을 얻었다. 7.9 g of compound B was dissolved in 76 ml of methyl chloride (Aldrich), and after vacuum replacement, 52 ml of boron tribromide (Aldrich) was slowly added to the solution at -78 캜. Then, the temperature was raised to 0 캜 and stirred for 3 hours, followed by stirring at room temperature for 14 hours. Then, the reaction was terminated with ether (Duksan Co., Ltd.) and distilled water, followed by extraction and column purification to obtain the compound C (4- (5- (tert-butylphenyl) -1,3,4-oxadiazole- ) (6.9 g, 91%).

[반응식 2][Reaction Scheme 2]

Figure 112016027446947-pat00014
Figure 112016027446947-pat00014

포타슘카보네이트(K2CO3, Aldrich사) 12.4g, 에틸 4-하이드록시벤조에이트(ethyl 4-hydroxybenzoate, Aldrich사) 5g을 진공 후 질소 치환한 후에 디메틸폼아마이트(DMF, 삼천사)에 녹이고 6-클로로헥산올(6-chlorohexan-1-ol, Alfa aesar사) 8.00 ml를 천천히 첨가한 후 마이크로웨이브(microwave) 장비에서 90℃, 300 W로 3 시간 동안 교반하였다. 반응 종결 후 유기물을 추출하고, 재결정하여 화합물 D(ethyl 4-(6-hydroxyhexyloxy)benzoate) 6g을 얻었다.12.4 g of potassium carbonate (K 2 CO 3 , Aldrich) and 5 g of ethyl 4-hydroxybenzoate (Aldrich) were purged with nitrogen and then dissolved in dimethylformoamate (DMF, 8.00 ml of 6-chlorohexan-1-ol (Alfa aesar) was added slowly and the mixture was stirred in a microwave apparatus at 90 ° C and 300 W for 3 hours. After the completion of the reaction, the organic material was extracted and recrystallized to obtain 6 g of compound D (ethyl 4- (6-hydroxyhexyloxy) benzoate).

상기 얻어진 화합물 D 5g, 메탄올(methanol, 삼천사), 포타슘하이드록사이드(KOH, 삼천사) 5.05g 및 증류수 50ml를 넣고 교반하면서 투명해질 때까지 에탄올(ethanol, 삼천사)을 넣고 75℃에서 24 시간 교반하였다. 반응 종결 후 하이드로겐클로라이드(HCl, 삼천사) 60ml와 증류수 120ml를 넣고 감압 제거한 후에 메탄올(methanol, 삼천사)에 재결정하여 화합물 E(4-(6-hydroxyhexyloxy)benzoic acid) 6.77g을 얻었다.5 g of the obtained compound D, 5.05 g of methanol (methanol), potassium hydroxide (KOH, Sangen), and 50 ml of distilled water were added and ethanol was added thereto while stirring until the mixture became transparent. Lt; / RTI &gt; After completion of the reaction, 60 ml of hydrogen chloride (HCl, triple helium) and 120 ml of distilled water were added, and the mixture was evaporated under reduced pressure. The residue was recrystallized from methanol to obtain 6.77 g of 4- (6-hydroxyhexyloxy) benzoic acid.

상기 얻어진 화합물 E 3g을 무수 테트라하이드로퓨란(THF, 삼천사) 60ml에 녹이고 트리에틸아민(trimethylamine, Acros사) 3.51ml를 넣고 0℃로 온도를 내린 후 30분간 교반하였다. 무수 테트라하이드로퓨란(THF, 삼천사) 12ml에 아크릴로일 클로라이드(acryloyl chloride, TCI사) 2.05ml를 녹여 0℃에서 천천히 넣고 1 시간 동안 교반한 후 상온으로 올리면서 24 시간 동안 교반하였다. 그런 다음, 반응 종결 후 감압 제거하고, 컬럼 정제하여 화합물 F(4-(6-(acryloyloxy)hexyloxy)benzoic acid) 1.66g을 얻었다.3 g of the obtained compound E was dissolved in 60 ml of anhydrous tetrahydrofuran (THF, THF), 3.51 ml of triethylamine (Acros) was added, the temperature was lowered to 0 ° C, and the mixture was stirred for 30 minutes. 2.05 ml of acryloyl chloride (TCI) was dissolved in 12 ml of anhydrous tetrahydrofuran (THF, THF), stirred at 0 ° C for 1 hour, stirred for 24 hours while being warmed to room temperature. After completion of the reaction, the reaction mixture was removed under reduced pressure, and the obtained product was subjected to column purification to obtain 1.66 g of compound F (4- (6- (acryloyloxy) hexyloxy) benzoic acid.

[반응식 3][Reaction Scheme 3]

Figure 112016027446947-pat00015
Figure 112016027446947-pat00015

화합물 F 1.0g를 메틸클로라이드(methyl chloride, Aldrich사) 100ml에 녹이고, 디사이클로헥실카보디아미드(N,N-dicyclohexylcarbodiamide Aldrich사) 0.77g과 디메틸아미노피리딘(dimethylaminopyridine Aldrich사) 0.41g을 넣고 교반하였다. 그런 다음, 메틸클로라이드(methyl chloride, Aldrich사)에 녹인 화합물 C 1.01g 천천히 첨가해 준 후 상온에서 24 시간 동안 교반하였다. 반응 종결 후 유기물을 추출하고 컬럼 정제하여 화합물 구조 1(4-(5-(4-tert-butylphenyl)-1,3,4-oxadiazol-2-yl)phenyl-4-(6-(acryloyloxy)hexyloxy)benzoate) 1.2g(62%)을 얻었다. 1.0 g of Compound F was dissolved in 100 ml of methyl chloride (Aldrich), 0.77 g of dicyclohexylcarbodiamide (Aldrich) and 0.41 g of dimethylaminopyridine (Aldrich) were added and stirred . Then, 1.01 g of Compound C dissolved in methyl chloride (Aldrich) was added slowly, followed by stirring at room temperature for 24 hours. After the completion of the reaction, the organic material was extracted and subjected to column purification to obtain the compound structure 1 (4- (5- (4-tert-butylphenyl) -1,3,4-oxadiazol- ) benzoate (62%).

이때, 상기 제조된 구조 1의 1H-NMR 스펙트럼은 하기 도 1을 통해 확인할 수 있다.
At this time, 1 H-NMR spectrum of the prepared structure 1 can be confirmed by referring to FIG.

실시예Example 2: <구조 2>의 화합물 제조 2: Preparation of compounds of < structure 2 >

본 발명에 따른 구조 2의 화합물을 하기 반응식 4 내지 5를 통해 제조하였다. Compounds of structure 2 according to the invention are prepared via the following schemes 4 to 5.

[반응식 4] [Reaction Scheme 4]

Figure 112016027446947-pat00016
Figure 112016027446947-pat00016

포타슘카보네이트(K2CO3, Aldrich사) 12.4g, 에틸 4-하이드록시벤조에이트(ethyl 4-hydroxybenzoate, Aldrich사) 5g을 진공 후 질소 치환한 후에 디메틸폼아마이트(DMF, 삼천사)에 녹이고 4-클로로부탄올(4-chlorobutan-1-ol, Alfa aesar사) 6.5 ml를 천천히 첨가한 후 마이크로웨이브(microwave) 장비에서 90℃, 300 W로 3 시간 동안 교반하였다. 반응 종결 후 유기물을 추출하고, 재결정하여 화합물 D2(ethyl 4-(4-hydroxybutoxy)benzoate) 5g을 얻었다.12.4 g of potassium carbonate (K 2 CO 3 , Aldrich) and 5 g of ethyl 4-hydroxybenzoate (Aldrich) were purged with nitrogen and then dissolved in dimethylformoamate (DMF, 6.5 ml of chlorobutanol (4-chlorobutan-1-ol, Alfa aesar) was added slowly and the mixture was stirred in a microwave apparatus at 90 ° C and 300 W for 3 hours. After completion of the reaction, the organic material was extracted and recrystallized to obtain 5 g of compound D2 (ethyl 4- (4-hydroxybutoxy) benzoate).

상기 얻어진 화합물 D2 5g, 메탄올(methanol, 삼천사), 포타슘하이드록사이드(KOH, 삼천사) 5.05g 및 증류수 50ml를 넣고 교반하면서 투명해질 때까지 에탄올(ethanol, 삼천사)을 넣고 75℃에서 24 시간 교반하였다. 반응 종결 후 하이드로겐클로라이드(HCl, 삼천사) 60ml와 증류수 120ml를 넣고 감압 제거한 후에 메탄올(methanol, 삼천사)에 재결정하여 화합물 E2(4-(4-hydroxybutoxy)benzoic acid) 5.2 g을 얻었다.5 g of the compound D2 obtained above, methanol (methanol), 5.05 g of potassium hydroxide (KOH, triangles) and 50 ml of distilled water were added and ethanol was added thereto while stirring until the mixture became transparent. Lt; / RTI &gt; After completion of the reaction, 60 ml of hydrogen chloride (HCl, triple helium) and 120 ml of distilled water were added, and the mixture was evaporated under reduced pressure. The residue was recrystallized from methanol to obtain 5.2 g of 4- (4-hydroxybutoxy) benzoic acid.

상기 얻어진 화합물 E2 4 g을 무수 테트라하이드로퓨란(THF, 삼천사) 60ml에 녹이고 트리에틸아민(trimethylamine, Acros사) 5.5 ml를 넣고 0℃로 온도를 내린 후 30분간 교반하였다. 무수 테트라하이드로퓨란(THF, 삼천사) 12ml에 아크릴로일 클로라이드(acryloyl chloride, TCI사) 3.2 ml를 녹여 0℃에서 천천히 넣고 1 시간 동안 교반한 후 상온으로 올리면서 24 시간 동안 교반하였다. 그런 다음, 반응 종결 후 감압 제거하고, 컬럼 정제하여 화합물 F2 (4-(4-(acryloyloxy)butoxy)benzoic acid) 2.36g을 얻었다.4 g of the obtained compound E2 was dissolved in 60 ml of anhydrous tetrahydrofuran (THF, THF), 5.5 ml of triethylamine (Acros) was added, the temperature was lowered to 0 ° C and the mixture was stirred for 30 minutes. 3.2 ml of acryloyl chloride (TCI) was dissolved in 12 ml of anhydrous tetrahydrofuran (THF, THF), stirred at 0 ° C for 1 hour, stirred for 24 hours while being warmed to room temperature. Then, after completion of the reaction, the reaction mixture was removed under reduced pressure, and the resultant product was subjected to column purification to obtain 2.36 g of compound F2 (4- (4- (acryloyloxy) butoxy) benzoic acid).

[반응식 5]  [Reaction Scheme 5]

Figure 112016027446947-pat00017
Figure 112016027446947-pat00017

화합물 F2 2.0g을 메틸클로라이드(methyl chloride, Aldrich사) 100 ml에 녹이고, 디사이클로헥실카보디아미드(N,N-dicyclohexylcarbodiamide Aldrich사) 1.56g 및 디메틸아미노피리딘(dimethylaminopyridine Aldrich사) 0.1g을 혼합하여 교반하였다. 그런 다음, 메틸클로라이드(methyl chloride, Aldrich사)에 녹인 화합물 C 1.2g을 천천히 첨가해 준 후 상온에서 24 시간 동안 교반하였다. 반응 종결 후 유기물을 추출하고 컬럼 정제하여 화합물 구조 2(4-(4-(4-(5-(4-tert-butylphenyl)-1,3,4-oxadiazol-2-yl)benzoyl)phenoxy)butyl acrylate) 1.3g을 얻었다.2.0 g of the compound F2 was dissolved in 100 ml of methyl chloride (Aldrich), 1.56 g of dicyclohexylcarbodiamide (Aldrich) and 0.1 g of dimethylaminopyridine (Aldrich) were mixed Lt; / RTI &gt; Subsequently, 1.2 g of Compound C dissolved in methyl chloride (Aldrich) was slowly added thereto, followed by stirring at room temperature for 24 hours. After the completion of the reaction, the organic material was extracted and subjected to column purification to obtain the compound structure 2 (4- (4- (4- (5- (4-tert-butylphenyl) -1,3,4-oxadiazol- 2-yl) benzoyl) phenoxy) butyl acrylate).

이때, 상기 제조된 구조 2의 1H-NMR 스펙트럼은 하기 도 2를 통해 확인할 수 있다.
At this time, the 1 H-NMR spectrum of the prepared structure 2 can be confirmed by referring to FIG.

실시예Example 3: <구조 3>의 화합물 제조 3: Preparation of compound of <structure 3>

본 발명에 따른 구조 3의 화합물을 하기 반응식 6 내지 7을 통해 제조하였다. Compounds of structure 3 according to the invention are prepared via the following schemes 6 to 7.

[반응식 6][Reaction Scheme 6]

Figure 112016027446947-pat00018
Figure 112016027446947-pat00018

화합물 A 4g 및 부틸바이페닐 카보닐 클로라이드(4'-butylbiphenyl-4-carbonyl chloride, Aldrich사) 6.2g 를 혼합하고, 진공 후 질소 치환한 후 교반하였다. 그런 다음, 피리딘(pyridine, Aldrich사) 44ml을 혼합하고, 115℃에서 2 시간 동안 교반 후, 상온으로 식혀 반응을 종결 하였다. 그런 다음, 필터한 후 컬럼 정제하여 화합물 B2 (2-(4'-butylbiphenyl-4-yl)-5-(4-methoxyphenyl)-1,3,4-oxadiazole) 8.5g를 얻었다.4 g of Compound A and 6.2 g of 4'-butylbiphenyl-4-carbonyl chloride (Aldrich) were mixed, and the mixture was purged with nitrogen after vacuum, and then stirred. Then, 44 ml of pyridine (Aldrich) was mixed, stirred at 115 ° C for 2 hours, cooled to room temperature, and the reaction was terminated. Thereafter, the solution was filtered and then purified by column to obtain 8.5 g of compound B2 (2- (4'-butylbiphenyl-4-yl) -5- (4-methoxyphenyl) -1,3,4-oxadiazole.

화합물 B2 8.3g을 메틸클로라이드(methyl chloride, Aldrich사) 76ml에 녹이고 진공 치환 후 -78℃로 내려 보론트리브로마이드(boron tribromide, Aldrich사) 55ml를 천천히 첨가하였다. 그런 다음, 온도를 0℃로 올려 3 시간 동안 교반한 후, 상온에서 14 시간 교반하였다. 그런 다음, 이써(ether, 덕산사)와 증류수로 반응 종결한 후에 추출하고 컬럼 정제하여 화합물 C2(4-(5-(4'-butylbiphenyl-4-yl)-1,3,4-oxadiazol-2-yl)phenol) 7.2g을 얻었다.8.3 g of compound B2 was dissolved in 76 ml of methyl chloride (Aldrich), and after vacuum replacement, 55 ml of boron tribromide (Aldrich) was slowly added thereto at -78 캜. Then, the temperature was raised to 0 캜 and stirred for 3 hours, followed by stirring at room temperature for 14 hours. Then, the reaction was terminated with ether (Duksan Co., Ltd.) and distilled water, and the resultant was extracted and subjected to column purification to obtain a compound C2 (4- (5- (4'-butylbiphenyl-4-yl) -1,3,4-oxadiazol- -yl) phenol).

[반응식 7][Reaction Scheme 7]

Figure 112016027446947-pat00019
Figure 112016027446947-pat00019

화합물 F 2g를 메틸클로라이드(methyl chloride, Aldrich사) 100ml에 녹이고, 디사이클로헥실카보디아미드(N,N-dicyclohexylcarbodiamide Aldrich사) 1.2g과 디메틸아미노피리딘(dimethylaminopyridine Aldrich사) 0.41g을 넣고 교반하였다. 그런 다음, 메틸클로라이드(methyl chloride, Aldrich사)에 녹인 화합물 C2 2.4g 천천히 첨가해 준 후 상온에서 24 시간 동안 교반하였다. 반응 종결 후 유기물을 추출하고 컬럼 정제하여 화합물 구조 3(6-(4-(4-(5-(4'-butylbiphenyl-4-yl)-1,3,4-oxadiazol-2-yl)benzoyl)phenoxy)hexyl acrylate) 2.1g을 얻었다.
2 g of Compound F was dissolved in 100 ml of methyl chloride (Aldrich), 1.2 g of dicyclohexylcarbodiamide (Aldrich) and 0.41 g of dimethylaminopyridine (Aldrich) were added and stirred. Then, 2.4 g of Compound C2 dissolved in methyl chloride (Aldrich) was slowly added thereto, followed by stirring at room temperature for 24 hours. After completion of the reaction, the organic material was extracted and subjected to column purification to obtain the compound structure 3 (6- (4- (5- (4'-butylbiphenyl-4-yl) -1,3,4-oxadiazol- phenoxy) hexyl acrylate.

실시예Example 4: <구조 4>의 화합물 제조 4: Preparation of compound of <Structure 4>

본 발명에 따른 구조 4의 화합물을 하기 반응식 8을 통해 제조하였다. The compounds of structure 4 according to the invention are prepared via the following reaction scheme 8:

[반응식 8][Reaction Scheme 8]

Figure 112016027446947-pat00020
Figure 112016027446947-pat00020

화합물 F2 1.8g를 메틸클로라이드(methyl chloride, Aldrich사) 100ml에 녹이고, 디사이클로헥실카보디아미드(N,N-dicyclohexylcarbodiamide Aldrich사) 0.91g과 디메틸아미노피리딘(dimethylaminopyridine Aldrich사) 0.41g을 넣고 교반하였다. 그런 다음, 메틸클로라이드(methyl chloride, Aldrich사)에 녹인 화합물 2.2g 천천히 첨가해 준 후 상온에서 24 시간 동안 교반하였다. 반응 종결 후 유기물을 추출하고 컬럼 정제하여 화합물 구조 4(6-(4-(4-(5-(4'-butylbiphenyl-4-yl)-1,3,4-oxadiazol-2-yl)benzoyl)phenoxy)hexyl acrylate) 2.1g을 얻었다.
1.8 g of the compound F2 was dissolved in 100 ml of methyl chloride (Aldrich), 0.91 g of dicyclohexylcarbodiamide (Aldrich) and 0.41 g of dimethylaminopyridine (Aldrich) were added and stirred . Then, 2.2 g of the compound dissolved in methyl chloride (Aldrich) was slowly added thereto, followed by stirring at room temperature for 24 hours. After completion of the reaction, the organic material was extracted and subjected to column purification to obtain the compound structure 4 (6- (4- (5- (4'-butylbiphenyl-4-yl) -1,3,4-oxadiazol- phenoxy) hexyl acrylate.

실시예Example 5: <구조 5>의 화합물 제조 5: Preparation of compound of < structure 5 >

본 발명에 따른 구조 5의 화합물을 하기 반응식 9 내지 10을 통해 제조하였다. Compounds of Structure 5 according to the invention are prepared via the following Schemes 9-10.

[반응식 9][Reaction Scheme 9]

Figure 112016027446947-pat00021
Figure 112016027446947-pat00021

화합물 A5 g및 부톡시바이페닐 카보닐 클로라이드(4'-butoxybiphenyl-4-carbonyl chloride, Aldrich사) 6.1g 를 혼합하고, 진공 후 질소 치환한 후 교반하였다. 그런 다음, 피리딘(pyridine, Aldrich사) 44ml을 혼합하고, 115℃에서 2 시간 동안 교반 후, 상온으로 식혀 반응을 종결 하였다. 그런 다음, 필터한 후 컬럼 정제하여 화합물 B3(2-(4'-butoxybiphenyl-4-yl)-5-(4-methoxyphenyl)-1,3,4-oxadiazole) 7.8g를 얻었다.5 g of Compound A and 6.1 g of 4'-butoxybiphenyl-4-carbonyl chloride (Aldrich) were mixed, and the mixture was purged with nitrogen after the vacuum, and then stirred. Then, 44 ml of pyridine (Aldrich) was mixed, stirred at 115 ° C for 2 hours, cooled to room temperature, and the reaction was terminated. Thereafter, the resultant was filtered and purified by column to obtain 7.8 g of compound B3 (2- (4'-butoxybiphenyl-4-yl) -5- (4-methoxyphenyl) -1,3,4-oxadiazole.

화합물 B3 7.6g을 메틸클로라이드(methyl chloride, Aldrich사) 76ml에 녹이고 진공 치환 후 -78℃로 내려 보론트리브로마이드(boron tribromide, Aldrich사) 52ml를 천천히 첨가하였다. 그런 다음, 온도를 0℃로 올려 3 시간 동안 교반한 후, 상온에서 14 시간 교반하였다. 그런 다음, 이써(ether, 덕산사)와 증류수로 반응 종결한 후에 추출하고 컬럼 정제하여 화합물 C3(4-(5-(4'-butoxybiphenyl-4-yl)-1,3,4-oxadiazol-2-yl)phenol) 6.5g을 얻었다.7.6 g of compound B3 was dissolved in 76 ml of methyl chloride (Aldrich), and after vacuum replacement, 52 ml of boron tribromide (Aldrich) was slowly added to the solution at -78 캜. Then, the temperature was raised to 0 캜 and stirred for 3 hours, followed by stirring at room temperature for 14 hours. Then, the reaction was terminated with ether (Duksan Co., Ltd.) and distilled water, followed by extraction and column purification to obtain a compound C3 (4- (5- (4'-butoxybiphenyl-4-yl) -1,3,4-oxadiazol- -yl) phenol.

[반응식 10][Reaction Scheme 10]

Figure 112016027446947-pat00022
Figure 112016027446947-pat00022

화합물 F 1.5g를 메틸클로라이드(methyl chloride, Aldrich사) 100ml에 녹이고, 디사이클로헥실카보디아미드(N,N-dicyclohexylcarbodiamide Aldrich사) 0.92g과 디메틸아미노피리딘(dimethylaminopyridine Aldrich사) 0.41g을 넣고 교반하였다. 그런 다음, 메틸클로라이드(methyl chloride, Aldrich사)에 녹인 화합물 C3 1.8g 천천히 첨가해 준 후 상온에서 24 시간 동안 교반하였다. 반응 종결 후 유기물을 추출하고 컬럼 정제하여 화합물 구조 5(6-(4-(4-(5-(4'-butoxybiphenyl-4-yl)-1,3,4-oxadiazol-2-yl)benzoyl)phenoxy)hexyl acrylate) 1.4g을 얻었다.
1.5 g of Compound F was dissolved in 100 ml of methyl chloride (Aldrich), 0.92 g of dicyclohexylcarbodiamide (Aldrich) and 0.41 g of dimethylaminopyridine (Aldrich) were added and stirred . Subsequently, 1.8 g of Compound C3 dissolved in methyl chloride (Aldrich) was slowly added thereto, followed by stirring at room temperature for 24 hours. After completion of the reaction, the organic material was extracted and subjected to column purification to obtain a compound structure 5 (6- (4- (5- (4'-butoxybiphenyl-4-yl) -1,3,4-oxadiazol- phenoxy) hexyl acrylate.

실시예Example 6: <구조 6>의 화합물 제조 6: Preparation of compound of < structure 6 >

본 발명에 따른 구조 6의 화합물을 하기 반응식 11을 통해 제조하였다. The compounds of Structure 6 according to the present invention were prepared via the following Scheme 11.

[반응식 11][Reaction Scheme 11]

Figure 112016027446947-pat00023
Figure 112016027446947-pat00023

화합물 F2 2g를 메틸클로라이드(methyl chloride, Aldrich사) 100ml에 녹이고, 디사이클로헥실카보디아미드(N,N-dicyclohexylcarbodiamide Aldrich사) 1.2 g과 디메틸아미노피리딘(dimethylaminopyridine Aldrich사) 0.41g을 넣고 교반하였다. 그런 다음, 메틸클로라이드(methyl chloride, Aldrich사)에 녹인 화합물 C3 1.8g 천천히 첨가해 준 후 상온에서 24 시간 동안 교반하였다. 반응 종결 후 유기물을 추출하고 컬럼 정제하여 화합물 구조 6(4-(4-(4-(5-(4'-butoxybiphenyl-4-yl)-1,3,4-oxadiazol-2-yl)benzoyl)phenoxy)butyl acrylate) 1.6g을 얻었다.
2 g of the compound F2 was dissolved in 100 ml of methyl chloride (Aldrich), 1.2 g of dicyclohexylcarbodiamide (Aldrich) and 0.41 g of dimethylaminopyridine Aldrich were added and stirred. Subsequently, 1.8 g of Compound C3 dissolved in methyl chloride (Aldrich) was slowly added thereto, followed by stirring at room temperature for 24 hours. After completion of the reaction, the organic material was extracted and subjected to column purification to obtain the compound structure 6 (4- (4- (5- (4'-butoxybiphenyl-4-yl) -1,3,4-oxadiazol- phenoxy) butyl acrylate.

실험예Experimental Example 1 One

상기 실시예 1, 실시예3 및 실시예 4에서 제조한 구조 1, 구조 3 및 구조 4의 화합물에 대한 UV-vis 투과 스펙트럼을 하기 도 3 내지 5에 나타내었다. 구체적으로, 구조 1에 대한 UV-vis 투과 스펙트럼은 도 3에 나타내었고, 구조 3에 대한 UV-vis 투과 스펙트럼은 도 4에 나타내었으며, 구조 4에 대한 UV-vis 투과 스펙트럼은 도 5에 나타내었다. The UV-vis transmission spectra of the compounds of Structure 1, Structure 3 and Structure 4 prepared in Examples 1, 3 and 4 are shown in FIGS. Specifically, the UV-vis transmission spectrum for Structure 1 is shown in FIG. 3, the UV-vis transmission spectrum for Structure 3 is shown in FIG. 4, and the UV-vis transmission spectrum for Structure 4 is shown in FIG. 5 .

도 3 내지 5를 참조하면, 본 발명에 따른 화합물은 가시광선 파장 영역인 400 내지 800 nm 파장 영역에서의 광투과도가 평균 95% 이상인 것을 확인할 수 있었다.
3 to 5, it was confirmed that the compounds according to the present invention had an average transmittance of 95% or more in the wavelength region of 400 to 800 nm, which is a visible light wavelength region.

실험예Experimental Example 2 2

상기 실시예 1에서 제조한 구조 1의 화합물에 대한 DSC(시차주사 열량측정) 스펙트럼을 하기 도 6에 나타내었다. 도 6을 참조하면, 100℃ 이상에서 하나 이상의 피크가 관찰되었고, 이를 통해, 본 발명에 따른 화합물은 고온에서의 열안정성이 우수한 것을 확인할 수 있었다.
The DSC (differential scanning calorimetry) spectrum of the compound of Structure 1 prepared in Example 1 is shown in FIG. Referring to FIG. 6, one or more peaks were observed at 100 ° C or higher, indicating that the compounds according to the present invention had excellent thermal stability at high temperatures.

실험예Experimental Example 3 3

상기 실시예 1 내지 6에서 제조한 구조 1 내지 구조6의 화합물을 이용하여 점착 필름을 제조하였고, 상기 점착 필름에 대한 손실 탄성률을 동적기계적분석(DMA)를 이용하여 측정하였다. 구체적으로, -20 내지 90℃의 온도 범위에서 측정한 손실 탄성률의 평균을 측정하였고, 그 결과는 하기 표 1과 같다.Adhesive films were prepared using the compounds of Structures 1 to 6 prepared in Examples 1 to 6, and the loss elastic modulus of the adhesive films was measured by dynamic mechanical analysis (DMA). Specifically, the average of the loss elastic modulus measured in the temperature range of -20 to 90 캜 was measured, and the results are shown in Table 1 below.

손실 탄성률 (Pa)Loss modulus (Pa) 실시예 1Example 1 5 x 104 5 x 10 4 실시예 2Example 2 5 x 104 5 x 10 4 실시예 3Example 3 9 x 104 9 x 10 4 실시예 4Example 4 8 x 104 8 x 10 4 실시예 5Example 5 6 x 104 6 x 10 4 실시예 6Example 6 7 x 104 7 x 10 4

상기 표 1을 참조하면, 본 발명에 따른 화합물을 이용하여 제조한 점착 필름은 손실 탄성률이 104 내지 106 Pa 범위를 만족하고, 최소, 5 x 104 Pa의 손실 탄성률을 나타내는 것을 알 수 있다. 이를 통해, 본 발명에 따른 점착 필름은 굽힘 신뢰성이 우수하다는 것을 알 수 있다.
Referring to Table 1, it can be seen that the pressure-sensitive adhesive film prepared using the compound according to the present invention satisfies the loss elastic modulus in the range of 10 4 to 10 6 Pa and exhibits a loss modulus at the minimum of 5 x 10 4 Pa . Thus, it can be seen that the adhesive film according to the present invention is excellent in bending reliability.

실험예Experimental Example 4 4

상기 실시예 1 내지 6에서 제조한 구조 1 내지 구조 6의 화합물을 이용하여 점착 필름을 제조하였고, 이렇게 제조된 각각의 점착 필름을 상온에서 4 내지 20회 곡률반경 10 mm로 접었다 폈다를 반복하였다. 그런 다음, 상기 각각의 점착 필름의 구브러짐 및 기포 들뜸의 발생 여부를 육안으로 관찰하였으나, 상기와 같은 결함은 나타나지 않았다.Adhesive films were prepared using the compounds of Structures 1 to 6 prepared in Examples 1 to 6, and the adhesive films thus prepared were repeatedly folded at a room temperature for 4 to 20 times with a radius of curvature of 10 mm. Then, whether or not the bulging and bubble flooding of each of the adhesive films were observed was visually observed, but such defects were not observed.

Claims (13)

하기 화학식 1의 구조를 나타내는 화합물을 포함하는 점착 조성물로 형성되며,
-20℃ 내지 90℃의 온도 범위에서 측정한 평균 손실 탄성률이 5x104 내지 9x104 Pa인 점착 필름:
[화학식 1]
Figure 112017079843058-pat00040

상기 화학식 1에서,
R1은 탄소수 1 내지 10의 알킬기, 또는 탄소수 6 내지 10의 아릴기를 나타내고,
상기 R1의 수소들 중 하나 이상은 각각 독립적으로 탄소수 1 내지 10의 알콕시기로 치환 또는 비치환되고,
R2는 하기 화학식 2를 나타내고,
[화학식 2]
Figure 112017079843058-pat00041

상기 화학식 2에서,
n은 1 내지 5의 정수이다.
A pressure-sensitive adhesive composition comprising a compound represented by the following formula (1)
The average loss modulus measured at -20 ℃ to a temperature range of 90 ℃ 5x10 4 to 9x10 4 Pa of pressure-sensitive adhesive film:
[Chemical Formula 1]
Figure 112017079843058-pat00040

In Formula 1,
R 1 represents an alkyl group having 1 to 10 carbon atoms or an aryl group having 6 to 10 carbon atoms,
At least one of the hydrogen of the R 1 are each independently a substituted or unsubstituted alkoxy group having 1 to 10 carbon atoms,
R 2 represents the following formula (2)
(2)
Figure 112017079843058-pat00041

In Formula 2,
n is an integer of 1 to 5;
제 1 항에 있어서, 상기 화학식 1에서,
R1은 t-부틸, n-부틸, 또는 부톡시 치환된 페닐을 나타내고,
R2는 하기 화학식 2를 나타내고,
[화학식 2]
Figure 112017079843058-pat00042

상기 화학식 2에서,
n은 1 내지 5의 정수인 점착 필름.
The compound according to claim 1, wherein in formula (1)
R 1 represents t-butyl, n-butyl, or butoxy-substituted phenyl,
R 2 represents the following formula (2)
(2)
Figure 112017079843058-pat00042

In Formula 2,
and n is an integer of 1 to 5.
제 2 항에 있어서,
상기 화학식 2에서,
n은 2 또는 3의 정수인 점착 필름.
3. The method of claim 2,
In Formula 2,
and n is an integer of 2 or 3.
제 1 항에 있어서,
화학식 1로 나타내는 화합물은 하기 구조 1 내지 6으로 이루어진 그룹으로부터 선택되는 1 종 이상인 점착 필름.
<구조 1>
Figure 112017016413737-pat00028

<구조 2>
Figure 112017016413737-pat00029

<구조 3>
Figure 112017016413737-pat00030

<구조 4>
Figure 112017016413737-pat00031

<구조 5>
Figure 112017016413737-pat00032

<구조 6>
Figure 112017016413737-pat00033

The method according to claim 1,
Wherein the compound represented by the formula (1) is at least one selected from the group consisting of the following structures 1 to 6.
<Structure 1>
Figure 112017016413737-pat00028

<Structure 2>
Figure 112017016413737-pat00029

<Structure 3>
Figure 112017016413737-pat00030

<Structure 4>
Figure 112017016413737-pat00031

<Structure 5>
Figure 112017016413737-pat00032

<Structure 6>
Figure 112017016413737-pat00033

제 1 항에 있어서,
화학식 1로 나타내는 화합물은 400 내지 800 nm 파장 영역에서 광투과도가 90% 이상인 점착 필름.
The method according to claim 1,
Wherein the compound represented by the general formula (1) has a light transmittance of 90% or more in a wavelength region of 400 to 800 nm.
제 1 항에 있어서,
화학식 1로 나타내는 화합물은 시차주사열량법(DSC: Differential Scanning Calorimetry) 분석 시, 100℃ 이상에서 하나 이상의 흡열 피크를 갖는 점착 필름.
The method according to claim 1,
The compound represented by the general formula (1) has at least one endothermic peak at 100 占 폚 or higher during DSC (Differential Scanning Calorimetry) analysis.
삭제delete 삭제delete 삭제delete 제 1 항에 있어서,
점착 필름은 광학용 투명 점착 필름(Optical Clear Adhesive)인 점착 필름.
The method according to claim 1,
The adhesive film is an optical clear adhesive film (Optical Clear Adhesive).
제 1 항에 따른 점착 필름을 포함하는 디스플레이 장치.
A display device comprising the adhesive film according to claim 1.
제 11 항에 있어서,
상기 디스플레이 장치는, 디스플레이; 터치패널; 및 보호기판을 포함하며,
상기 점착 필름은 디스플레이 장치와 터치패널 사이 및 터치패널과 보호기판 사이에 형성되는 디스플레이 장치.
12. The method of claim 11,
The display device includes: a display; Touch panel; And a protective substrate,
Wherein the adhesive film is formed between the display device and the touch panel and between the touch panel and the protection substrate.
제 11 항에 있어서,
디스플레이 장치는 폴더블(foldable) 디스플레이 장치인 디스플레이 장치.
12. The method of claim 11,
Wherein the display device is a foldable display device.
KR1020160033925A 2016-03-22 2016-03-22 Novel compound, adhesive composition, adhesive film and display device KR101815758B1 (en)

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Publication number Priority date Publication date Assignee Title
JP2007057609A (en) * 2005-08-22 2007-03-08 Fujifilm Corp Retardation film
JP2007241070A (en) * 2006-03-10 2007-09-20 Fujifilm Corp Optical anisotropic film, retardation plate and liquid crystal display device
US20150034871A1 (en) * 2013-07-31 2015-02-05 Jnc Petrochemical Corporation Polymerizable compound having oxygen-containing five-membered ring, liquid crystal composition and liquid crystal display device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007057609A (en) * 2005-08-22 2007-03-08 Fujifilm Corp Retardation film
JP2007241070A (en) * 2006-03-10 2007-09-20 Fujifilm Corp Optical anisotropic film, retardation plate and liquid crystal display device
US20150034871A1 (en) * 2013-07-31 2015-02-05 Jnc Petrochemical Corporation Polymerizable compound having oxygen-containing five-membered ring, liquid crystal composition and liquid crystal display device

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