KR101803147B1 - Method of manufacturing microfluidic device with increased adhesion strength between substrate and film - Google Patents
Method of manufacturing microfluidic device with increased adhesion strength between substrate and film Download PDFInfo
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- KR101803147B1 KR101803147B1 KR1020150117529A KR20150117529A KR101803147B1 KR 101803147 B1 KR101803147 B1 KR 101803147B1 KR 1020150117529 A KR1020150117529 A KR 1020150117529A KR 20150117529 A KR20150117529 A KR 20150117529A KR 101803147 B1 KR101803147 B1 KR 101803147B1
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- substrate body
- microfluidic device
- film
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- manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
- B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
- B01L2200/10—Integrating sample preparation and analysis in single entity, e.g. lab-on-a-chip concept
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
- B01L2200/12—Specific details about manufacturing devices
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- Chemical Kinetics & Catalysis (AREA)
- Dispersion Chemistry (AREA)
- Analytical Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- Hematology (AREA)
- Clinical Laboratory Science (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
The present invention relates to a method of manufacturing a microfluidic device, and more particularly, to a method of manufacturing a microfluidic device in which a bonding force between a substrate and a film is enhanced.
Specifically, the method according to the present invention includes the step of treating an air plasma at a high voltage and frequency on the surface of a substrate body, and by increasing the surface energy of the substrate body through the step, It is expected that mass production of a microfluidic device which can be used under a high pressure applied condition through the method of the present invention is expected.
Description
The present invention relates to a method of manufacturing a microfluidic device, and more particularly, to a method of manufacturing a microfluidic device in which a bonding force between a substrate and a film is enhanced.
As the quality of life improves, interest in the individual's health and environment is increasing. This interest is reflected in the point-of-care (POC) devices and LOC Lab-On-a-Chip). Many of these POC / LOC devices include microfluidic devices, and much attention has been focused on the development of biochips and biosensors based on microfluidic devices.
Actually, due to the breakthrough of the technologies that make up the sensing technology and the microfluidic device, the element technology capable of satisfying the functions required by the biochip and the biosensor is at a considerable level. On the other hand, the development of a packaging technology that integrates these technologies to produce a finished product is less than the required level. As a major obstacle to the development of such a packaging technology, biochips and biosensors are intended for biological samples that are highly sensitive to temperature, pressure, and chemicals, and that the upper / lower plate bonding process, taking into account the characteristics of biological samples, It is pointed out that it is necessary.
Specifically, the microfluidic device is composed of a substrate body including a microstructure to which a microfluid can flow, and a film covering the substrate body. In order to manufacture the microfluidic device, a process of bonding the film to the substrate body is indispensably required . Conventionally, a solvent bonding method, a lamination method, and a hot-pressing method have been used to dissolve and adhere the surface of an object to be bonded with a chemical substance. However, a method using a chemical substance is a method in which a biological sample There is a possibility that a functional problem may be caused. In the method using lamination and high-temperature compression molding, the surface energy of the substrate body is low and the bonding strength with the film is weak. Accordingly, the microfluidic device manufactured by the conventional method is difficult to use under conditions of high temperature and pressure, and thus it has been limited to use as a biochip and a biosensor for a biological sample.
Therefore, studies for solving the above problems have been actively carried out. For example, a method of manufacturing a microfluidic device based on ultasonic welding (Korean Patent Laid-open No. 10-2009-0064936), a glass- (Korean Patent Laid-Open No. 10-2010-0014611) have been reported, but these have not yet been reported.
SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a method of manufacturing a semiconductor device, comprising: a) preparing a substrate body including a chamber and a flow path; b) treating an air plasma on the surface of the substrate body; And c) bonding the film to the surface of the processed substrate body.
However, the technical problem to be solved by the present invention is not limited to the above-mentioned problems, and other matters not mentioned can be clearly understood by those skilled in the art from the following description.
In order to achieve the above object, the present invention provides a method of manufacturing a microfluidic device including the steps of:
a) providing a substrate body comprising a chamber and a flow path;
b) treating an air plasma on the surface of the substrate body; And
c) bonding the film onto the surface of the processed substrate body.
In one embodiment of the present invention, the substrate body is made of a material selected from the group consisting of polystyrene, polyacrylate, polyethylene terephthalate, polyethylene ether phthalate, polyethylene phthalate, But are not limited to, polybutylene phthalate, polyethylene naphthalate, polycarbonate, polyether imide, polyether sulfone, polyetheretherketone and polyimide. And the like.
In another embodiment of the present invention, the step b) may be performed at a voltage of 20000 to 50000V.
As another embodiment of the present invention, the step b) may be carried out under the condition of 300 to 500 KHz.
As another embodiment of the present invention, the step b) may increase the surface energy of the substrate body.
In another embodiment of the present invention, the film may be coated with ethylene vinyl acetate.
The method according to the present invention includes the step of treating an air plasma at a high voltage and frequency on a surface of a substrate body to increase the surface energy of the substrate body through the step to increase the bonding force with the film have. The method of the present invention solves instability due to low bonding force which has been pointed out as a problem of the prior art, and is expected to be effectively utilized for mass production of a microfluidic device which can be used under increasing pressure.
1 is a schematic view showing a schematic process of a method of manufacturing a microfluidic device according to the present invention.
2 is a view illustrating a substrate body according to an embodiment of the present invention.
The microfluidic device is used as a core component of a biochip or a biosensor. Accordingly, various studies have been made on a manufacturing technology of a microfluidic device having various types or functions. However, in spite of these efforts, in the production of microfluidic devices, there is a limitation in utilization as a biochip due to a low bonding force between the substrate and the film, that is, between the upper and lower plates.
Accordingly, the present inventors have made efforts to improve the bonding force between the substrate body and the film. As a result, an air plasma is processed on the surface of the substrate body at a high voltage and frequency, It is possible to improve the bonding force with the film, and the present invention has been completed.
Accordingly, the present invention provides a method of manufacturing a microfluidic device including the following steps, and a schematic process of a manufacturing method according to the present invention is shown in FIG. 1:
a) providing a substrate body comprising a chamber and a flow path;
b) treating an air plasma on the surface of the substrate body; And
c) bonding the film onto the surface of the processed substrate body.
The term 'microfluidic device' used in the present invention is composed of a substrate body and a film covering the substrate, and the substrate provides a space through which microfluids flow, mix, or react. Such a microfluidic device is applied to such fields as a micro automatic analysis system, for example, a biosensor, a biochip, a high throughput screening (HTS) system, and a combinatorial chemistry system.
According to the method for manufacturing a microfluidic device of the present invention, since the surface energy of the substrate body is increased, the bonding strength between the substrate body and the film can be improved. As a result, Can be mass-produced.
Hereinafter, each step of the manufacturing method according to the present invention will be described in detail.
In step a), a substrate body including a chamber and a flow path through which the microfluid can flow is prepared.
In the present invention, the substrate body may be made of plastic, and is preferably made of plastic such as polystyrene, polyacrylate, polyethylene terephthalate, polyethylene ether phthalate, polyethylene (polyethylene) polyether sulfone, polyether etherketone, polyether sulfone, polyether sulfone, polyether sulfone, polyether sulfone, phthalate, polybuthylene phthalate, polyethylene naphthalate, polycarbonate, polyether imide, But are not limited to, polyimide.
In addition, the substrate body is a structure for providing a space capable of receiving and flowing the microfluid, and for this purpose, it may include a microstructure such as a chamber and a flow path as shown in Fig. In order to manufacture the substrate body including the microstructure, an injection molding method in which a material is injected into a metal mold and solidified or hardened (cured) can be manufactured. However, It is not.
In step b), the surface of the substrate body prepared by step a) is treated with air plasma.
In the conventional method of manufacturing a microfluidic device, the low surface energy of the surface of the substrate body is an important cause of the weak bonding force between the surface of the substrate body and the film. Thus, in the present invention, C = NH groups are formed on the surface of the substrate body by increasing the surface energy by discharging the surface of the substrate body with air plasma, and as a result, .
In the present invention, the air plasma may be an air plasma in which N 2 and O 2 gases are mixed, and the step b) is preferably carried out under a voltage condition of 20000 to 50000 V and / or a condition of 300 to 500 KHz But is not limited thereto.
In step c), the film is bonded onto the surface of the substrate body processed by step b).
In the present invention, the laminate structure of two layers is formed by bonding the film to the surface of the substrate body in the step b).
Examples of the film for forming the laminated structure include polyethylene, polystyrene, polyamide (nylon), polyester, polyvinyl chloride, ethylene (ethylene) vinyl acetate copolymer, acrylic resin, polycarbonate, etc., and the film may be coated with ethylene vinyl acetate, but is not limited thereto.
As a bonding method for forming the laminated structure, a thermal welding method such as spin welding, hot air welding, and ultrasonic welding may be preferably used. More preferably, a thermal welding method using a hot roller laminator may be used, But is not limited thereto.
The present invention can be carried out by adding manufacturing processes already known in the art in connection with the production of microfluidic devices. For example, a step of removing a film not bonded to the surface of the substrate body may be additionally included.
It will be understood by those skilled in the art that the foregoing description of the present invention is for illustrative purposes only and that those of ordinary skill in the art can readily understand that various changes and modifications may be made without departing from the spirit or essential characteristics of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.
Claims (6)
comprising the steps of: a) preparing a substrate body made of plastic, comprising a chamber and a flow path;
b) treating an air plasma on the surface of the substrate body at a voltage of 20000 to 50000 V and a frequency of 300 to 500 KHz; And
c) bonding a film coated with ethylene vinyl acetate onto the surface of the processed substrate body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150117529A KR101803147B1 (en) | 2015-08-20 | 2015-08-20 | Method of manufacturing microfluidic device with increased adhesion strength between substrate and film |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150117529A KR101803147B1 (en) | 2015-08-20 | 2015-08-20 | Method of manufacturing microfluidic device with increased adhesion strength between substrate and film |
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| Publication Number | Publication Date |
|---|---|
| KR20170022483A KR20170022483A (en) | 2017-03-02 |
| KR101803147B1 true KR101803147B1 (en) | 2017-11-29 |
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| KR1020150117529A KR101803147B1 (en) | 2015-08-20 | 2015-08-20 | Method of manufacturing microfluidic device with increased adhesion strength between substrate and film |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102049153B1 (en) * | 2017-12-14 | 2019-11-26 | 인제대학교 산학협력단 | Panel bonding method in microfluidic chip using release film |
| WO2019107763A1 (en) * | 2017-11-28 | 2019-06-06 | 인제대학교 산학협력단 | Microfluidic device capable of removing microbubbles in channel by using porous thin film, sample injection device for preventing inflow of bubbles, and method for bonding panel of microfluidic element by using mold-releasing film |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100868769B1 (en) * | 2007-06-07 | 2008-11-17 | 삼성전자주식회사 | Microfluidic chip and fabricating method of the same |
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- 2015-08-20 KR KR1020150117529A patent/KR101803147B1/en active IP Right Grant
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100868769B1 (en) * | 2007-06-07 | 2008-11-17 | 삼성전자주식회사 | Microfluidic chip and fabricating method of the same |
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| KR20170022483A (en) | 2017-03-02 |
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