KR101791675B1 - Electrostatic chuck for controlling chucking and dechucking of mask - Google Patents

Electrostatic chuck for controlling chucking and dechucking of mask Download PDF

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Publication number
KR101791675B1
KR101791675B1 KR1020150077255A KR20150077255A KR101791675B1 KR 101791675 B1 KR101791675 B1 KR 101791675B1 KR 1020150077255 A KR1020150077255 A KR 1020150077255A KR 20150077255 A KR20150077255 A KR 20150077255A KR 101791675 B1 KR101791675 B1 KR 101791675B1
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South Korea
Prior art keywords
base
substrate
dielectric layer
electrostatic chuck
mask
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KR1020150077255A
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Korean (ko)
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KR20160141501A (en
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강창수
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강창수
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Priority to KR1020150077255A priority Critical patent/KR101791675B1/en
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Publication of KR101791675B1 publication Critical patent/KR101791675B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

TECHNICAL FIELD The present invention relates to an electrostatic chuck, and an electrostatic chuck according to an embodiment of the present invention includes a base portion of a metal material including a coil; And a dielectric layer coated on one surface of the base portion. The substrate can be attached to or detached from the dielectric layer by generating an electrostatic force by applying a positive electrode or a negative electrode to the dielectric layer of the electrostatic chuck, When a voltage or current is applied to the coil, a magnetic field is generated, the mask is chucked to the substrate, and when the voltage or current applied to the coil of the base is interrupted, the magnetic field is extinguished and the mask is dechucked from the substrate .

Description

ELECTROSTATIC CHUCK FOR CONTROLLING CHUCKING AND DECHUCKING OF MASK < RTI ID = 0.0 >

TECHNICAL FIELD The present invention relates to an electrostatic chuck, and more particularly, to an electrostatic chuck capable of chucking or de-chucking a mask using an electro-chucked electrostatic chuck.

A chuck is a place where a substrate is placed in a vacuum chamber of a semiconductor or a display manufacturing equipment and is used for a semiconductor wafer or a glass in a process such as etching or thin film deposition for manufacturing a semiconductor device, Or as a device for clamping a substrate such as a display panel or the like.

Hereinafter, a wafer, a glass, or a panel will be referred to as a " substrate ".

The chuck can be classified into a mechanical chuck, an electrostatic chuck, and a vacuum chuck according to a method of chucking a substrate.

Electrostatic chuck refers to a method of fixing a substrate by applying a potential to a chuck to generate an electrostatic force that attracts a potential opposite to that of the substrate.

Electrostatic chucks are classified into monopolar and bipolar types according to the number of electrodes and classified into Coulomb and Johnsem-Rahb types according to the operation mechanism.

In the monopolar type, a positive electrode and a pair of negative electrodes face each other with a dielectric layer sandwiched therebetween. In the bipolar type, positive and negative electrodes are alternately arranged in the lateral direction.

The distinction between Coulomb type and Johnson-Labe type is distinguished by the magnitude of the resistivity existing between the electrodes and the mechanism is very different. Generally, the resistivity of the Johnson-Rabe type electrostatic chuck dielectric layer is in the range of 10 9 to 10 13 Ω cm, and in the case of 10 15 Ω cm or more, it is considered to be a coulomb type.

1 is a configuration diagram showing an electrostatic chuck according to a conventional technique.

Referring to FIG. 1, an electrostatic chuck 100 according to the related art is composed of a base 10 and a film 20.

The electrostatic chuck 100 according to the related art has a problem in that the surface of the mask is contaminated by the contact between the mask 40 and the clamp because the electrostatic chuck 100 has to contact the clamp to fix the mask 40.

In addition, since the electrostatic chuck 100 according to the related art fixes the mask 40 with a clamp, the fixing force locally acts on a part of the electrostatic chuck 100, causing a problem of warping of the mask 40. [

1, when a warp phenomenon occurs in the mask 40, a desired pattern may not be deposited on the substrate 30 when the substrate 30 is subjected to a deposition process using the pattern of the mask 40, There is a problem that defects occur.

It is an object of the present invention to provide an electrostatic chuck capable of controlling chucking or dechucking of a mask as well as a substrate by electrically controlling the electrostatically charged electrostatic chuck.

The object of the present invention is to minimize the damage and contamination of the substrate due to the contact with the mask surface and to prevent warpage of the mask by electrically controlling the electrostatically charged electrostatic chuck.

Further, the present specification aims to remarkably increase the yield of the substrate production and significantly reduce the manufacturing cost compared with the conventional process by arranging the electrostatic chuck on both sides.

According to an embodiment of the present invention, an electrostatic chuck is an electrostatic chuck for chucking or de-chucking a substrate, the electrostatic chuck including: a base portion of a metal material including a coil; And a dielectric layer coated on one surface of the base portion. The substrate can be attached to or detached from the dielectric layer by generating an electrostatic force by applying a positive electrode or a negative electrode to the dielectric layer of the electrostatic chuck, When a voltage or current is applied to the coil, a magnetic field is generated, the mask is chucked to the substrate, and when the voltage or current applied to the coil of the base is interrupted, the magnetic field is extinguished and the mask is dechucked from the substrate The electrostatic chuck further includes a switch unit for applying or interrupting a voltage or a current to the coil of the base unit and a control unit for controlling the amount of voltage or current applied to the coil of the base unit can do.

In addition, the controller may adjust a voltage or an amount of current to be applied to the coil of the base according to the size, thickness, or type of the mask.

Also, the dielectric layer may be a PI (polyimide) film.

The base portion may include a first base, a second base, and a magnetic force shielding material inserted between the first base and the second base, wherein the dielectric layer is coated on one surface of each of the first base and the second base A first dielectric layer and a second dielectric layer, wherein the first dielectric layer and the first base may be arranged opposite the second dielectric layer and the second base.

In addition, the first base and the second base may be arranged so as to face each other up and down or right and left.

According to the embodiment of the present invention, the chucking or dechucking of the mask from the substrate by using the electrolized electrostatic chuck has the effect of minimizing the contamination of the substrate due to the contact of the mask surface and preventing the substrate from warping.

In addition, according to the embodiments of the present invention, it is possible to prevent chucking or dechucking of a mask used for manufacturing a substrate such as a semiconductor wafer, glass, or display panel to a substrate, thereby preventing errors in the manufacturing process, It is effective.

According to the embodiments of the present invention, the electrostatic chuck is arranged in both the upper and lower sides or the left and right sides and used simultaneously or sequentially, thereby remarkably increasing the yield of the substrate production and significantly reducing the manufacturing cost compared to the conventional process.

1 is a configuration diagram showing an electrostatic chuck according to a conventional technique.
2 is a configuration diagram showing an electrostatic chuck according to a first embodiment of the present invention.
3 (a) is a configuration diagram showing an electrostatic chuck according to a second embodiment of the present invention.
3 (b) is a configuration diagram showing an electrostatic chuck according to a third embodiment of the present invention.
4 is a reference view showing a process of processing a substrate in an electrostatic chuck according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

In describing the embodiments, descriptions of techniques which are well known in the technical field to which this specification belongs and which are not directly related to this specification are not described. This is for the sake of clarity without omitting the unnecessary explanation and without giving the gist of the present invention.

For the same reason, some of the components in the drawings are exaggerated, omitted, or schematically illustrated. Also, the size of each component does not entirely reflect the actual size. In the drawings, the same or corresponding components are denoted by the same reference numerals.

Hereinafter, an electrostatic chuck according to a first embodiment of the present invention will be described with reference to FIG.

2 is a configuration diagram showing an electrostatic chuck according to a first embodiment of the present invention.

Referring to FIG. 2, the electrostatic chuck 200 according to the first embodiment of the present invention includes a base 110 and a dielectric layer 120.

The dielectric layer 120 is formed of a dielectric material and may be a film of polyimide or the like and is coated on one surface of the base 110 to chuck the substrate to the electrostatic chuck 200. That is, when a positive electrode or a negative electrode is applied to the dielectric layer 120 of the electrostatic chuck 200, a dielectric material is polarized in the dielectric layer 120, and an electric field is formed between the substrate 130 and the base 110. Therefore, the substrate 130 is chucked to the electrostatic chuck 200 through the dielectric layer 120 because the base 110 and the substrate 130 have opposite electric potentials across the film to generate an electrostatic force.

The base 110 is made of electrolized metal. In other words, the coils may be arranged in a zigzag or various shapes inside the base 110, and both ends of the coils protrude to the outside of the base 110 so that power can be applied to the coils. When a voltage or a current is applied to both ends of the coil, the electrolized base 110 is magnetized while current flows to attract (chuck) the mask 140. In addition, when the current or voltage applied to the coil is cut off, the electrolized base 110 is non-magnetized and can naturally detach (de-chuck) the mask 140 that has been chucked.

The mask 140 is made of a magnetic material having a property of being attracted by a magnetic force, and for example, an iron-nickel alloy such as invar, nickel, or the like can be used as a magnetic material. The Invar has a low thermal expansion coefficient and is suitable as a material for a mask. Further, the mask 140 may be made of two or more magnetic materials. For example, it can be assumed that the pattern region of the mask 140 is made of Ni, and the frame region is made of invar. The material of the mask 140 is not limited to metal, and a magnetic material such as an inorganic compound may be used.

The substrate 130 is chucked by the electrostatic chuck 200 through the dielectric layer 120 and the electrostatic chuck 200 is fixed to the electrostatic chuck 200 by applying a positive or negative electrode to the dielectric layer 120 of the electrostatic chuck 200. [ A voltage or current is applied to the coil of the base 110 and the mask 140 is chucked to the substrate 130 by the electromagnetic force of the electrolized base 110.

Therefore, the mask 140 can be uniformly tightly fixed to the substrate 130 without using a mechanical means such as a clamp. Through this, a precise manufacturing process such as etching and vapor deposition of the substrate can be easily performed.

When the manufacturing process of the substrate is completed, the electromagnetic force of the electrolized base 110 is removed by blocking the voltage or current applied to the coil of the base 110, so that the mask 140 is easily detached from the substrate 130 . At this time, the mask 140 is naturally dechucked from the substrate 130 while preventing the substrate 130 from being separated from the electrostatic chuck 200 or being unintentionally dechucked due to dechucking of the mask 140, .

The electrostatic chuck 200 includes a switch unit (not shown) that applies or cuts off a voltage or a current to or from a coil of the base 110, and a switch unit (not shown) that adjusts the amount of voltage or current applied to the coil of the base 110. [ And a control unit (not shown). In addition, a second control unit (not shown) may be included to control the substrate 130 to be chucked or dechucked by the electrostatic chuck 200 through the dielectric layer 120. That is, the second control unit can control the substrate to be chucked / dechucked through the dielectric layer, and the first control unit can control the mask to be chucked / dechucked through the base.

At this time, the second control unit may adjust the amount of voltage or the amount of current applied from the power source according to the type of the substrate 130. [ In addition, the first control unit may adjust the amount of voltage or the amount of current applied from the power source according to the size, thickness, type, etc. of the mask 140.

According to another embodiment of the present invention, the electrostatic chuck may include a sensing unit (not shown) capable of sensing the size, thickness, type, etc. of the substrate 130 or the mask 140. The sensing unit senses the type and size of an object (substrate, mask) to be chucked and dechucked to a static cloth, and transmits the sensed object to the control unit. The control unit controls the applied current or voltage magnitude . For example, when the thickness of the masks 170 and 180 is 0.5 mm, the amount of current applied is 6 mA, and when the thickness of the masks 170 and 180 is 0.4 mm, the amount of current applied is adjusted to 3 mA. It can be assumed.

Hereinafter, the electrostatic chuck according to the second embodiment and the third embodiment of the present invention will be described with reference to FIG.

3 (a) is a configuration diagram showing an electrostatic chuck according to a second embodiment of the present invention.

3 (a), the electrostatic chuck 300 according to the second embodiment of the present invention includes a first base 210, a second base 220, a first dielectric layer 230, a second dielectric layer 240 And a magnetic force shielding material 290.

The first dielectric layer 230 is attached to the upper surface of the first base 210 and the second dielectric layer 240 is attached to the lower surface of the second base 220. That is, the first and second bases 210 and 220 are vertically arranged so that the first dielectric layer 230 and the first base 210 are disposed on the opposite sides of the second dielectric layer 240 and the second base 220 . At this time, the magnetic force shielding material 290 is inserted between the first base 210 and the second base 220 to magnetically separate the first base 210 and the second base 220 and eliminate the interference.

When a voltage or current is applied to the electrostatic chuck 300, the first substrate 250 is chucked in the first dielectric layer 230, and the second substrate 260 is chucked in the second dielectric layer 240. The first mask 270 is chucked to the first substrate 250 by the first base 210 and the second mask 280 is chucked to the second substrate 260 by the second base 220. [ do. On the other hand, when voltage or current is interrupted in the electrostatic chuck 300, the first substrate 250 is dechucked in the first dielectric layer 230 and the second substrate 260 is dechucked in the second dielectric layer 240. The first mask 270 is dechucked on the first substrate 250 by the first base 210 and the second mask 280 is dechucked on the second substrate 260 by the second base 220. [ Dechucked. The process of chucking or dechucking the substrates 250 and 260 and the masks 270 and 280 is not described in detail with reference to FIG.

In addition, the electrostatic chuck 300 may further include a control unit for controlling a voltage or a current to be applied or cut off from the power source. This will be described in detail with reference to FIG.

3 (b) is a configuration diagram showing an electrostatic chuck according to a third embodiment of the present invention.

Referring to FIG. 3B, the electrostatic chuck 300 according to the third embodiment of the present invention includes a first base 210, a second base 220, a first dielectric layer 230, a second dielectric layer 240 And a magnetic force shielding material 290.

The first dielectric layer 230 is attached to the right side of the first base 210 and the second dielectric layer 240 is attached to the left side of the second base 220 respectively. That is, the first and second bases 210 and 220 are arranged on the left and right sides so that the first dielectric layer 230 and the first base 210 are disposed on the opposite sides of the second dielectric layer 240 and the second base 220 . At this time, the magnetic force shielding material 290 is inserted between the first base 210 and the second base 220 to magnetically separate the first base 210 and the second base 220 and eliminate the interference.

When a voltage or current is applied to the electrostatic chuck 300, the first substrate 250 is chucked in the first dielectric layer 230, and the second substrate 260 is chucked in the second dielectric layer 240. The first mask 270 is chucked to the first substrate 250 by the first base 210 and the second mask 280 is chucked to the second substrate 260 by the second base 220. [ do. On the other hand, when voltage or current is interrupted in the electrostatic chuck 300, the first substrate 250 is dechucked in the first dielectric layer 230 and the second substrate 260 is dechucked in the second dielectric layer 240. The first mask 270 is dechucked on the first substrate 250 by the first base 210 and the second mask 280 is dechucked on the second substrate 260 by the second base 220. [ Dechucked. The process of chucking or dechucking the substrates 250 and 260 and the masks 270 and 280 is not described in detail with reference to FIG.

In addition, the electrostatic chuck 300 may further include a control unit for controlling a voltage or a current to be applied or cut off from the power source. This will be described in detail with reference to FIG.

By arranging the first base 210 and the second base 220 right and left as shown in FIG. 3 (b), the influence of gravity on chucking or dechucking of the substrates 250 and 260 and the masks 270 and 280 Can be eliminated.

4 is a reference view showing a process of processing a substrate in an electrostatic chuck according to an embodiment of the present invention.

Referring to FIG. 4, processing of the substrates 250 and 260 in the electrostatic chuck 300 is performed in the chamber 330. The chamber 330 includes a vacuum chamber.

The dies 310 and 320 can be moved up and down or left and right to replace the substrates 250 and 260 or the masks 270 and 280. The dies 310 and 320 may also be arranged on opposite sides so that the substrates 250 and 260 or the masks 270 and 280 arranged on both sides can be replaced.

A gas supply pipe for introducing a process gas from the outside into the chamber 330 may be disposed on the upper portion of the chamber 330 through the inside and the outside of the chamber 330.

A showerhead for generating plasma by applying high-frequency power supplied from the outside to the process gas introduced into the chamber 330 may be provided on the upper portion of the chamber 330. The substrates 250 and 260 are processed by the plasma.

Further, a vacuum hole may be formed in the lower part of the chamber 330 to communicate with the outside in order to discharge the particles generated during the processing of the substrates 250 and 260 by the plasma to the outside of the chamber 230 through suction. have.

It will be understood by those skilled in the art that the present specification may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. The scope of the present specification is defined by the appended claims rather than the foregoing detailed description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents are included in the scope of the present specification Should be interpreted.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It is not intended to limit the scope of the specification. It will be apparent to those skilled in the art that other modifications based on the technical idea of the present invention are possible in addition to the embodiments disclosed herein.

100, 200, 300: electrostatic chucks 10, 110, 210, 220: base
20, 120, 230, 240: dielectric layer, film 30, 130, 250, 260:
40, 140, 270, 280: mask 290: magnetic force shielding material
310, 320: die 330: chamber

Claims (6)

In an electrostatic chuck for chucking or de-chucking a substrate,
A base portion of a metal material including a coil; And
A dielectric layer coated on one surface of the base portion;
A sensing unit having a circuit pattern formed on one surface thereof and capable of sensing a size, a thickness, and a type of the substrate and a mask to be chucked to the substrate;
A first controller for controlling the amount of voltage and current applied to the coil according to the size, thickness, and type of the mask and the substrate detected by the sensing unit; and a controller for controlling the substrate to be chucked or dechucked A control unit including a second control unit for controlling the second control unit; And
And a switch portion for applying or blocking a voltage or an electric current to the coil of the base portion to chuck or defocus the substrate,
The base portion may further include a first base, a second base, and a magnetic force shielding member interposed between the first base and the second base, wherein the dielectric layer is formed of a material coated on one surface of each of the first base and the second base, 1 dielectric layer and a second dielectric layer,
Wherein the base is disposed on both surfaces of the magnetic force shielding material, and the base is formed on the one surface of the base in the order of the dielectric layer, the substrate,
The substrate can be attached to or detached from the dielectric layer by generating an electrostatic force by applying an anode or a cathode to the dielectric layer of the electrostatic chuck,
A magnetic field is generated by applying a voltage or an electric current to the coil of the base portion, the mask is chucked by the substrate, and when the voltage or current applied to the coil of the base portion is cut off, the magnetic field is extinguished, Wherein the electrostatic chuck is detacked.
delete delete The method according to claim 1,
Wherein the dielectric layer is a PI (polyimide) film.
delete The method according to claim 1,
Wherein the first base and the second base are arranged so as to be opposed to each other in the vertical direction or in the lateral direction.
KR1020150077255A 2015-06-01 2015-06-01 Electrostatic chuck for controlling chucking and dechucking of mask KR101791675B1 (en)

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KR1020150077255A KR101791675B1 (en) 2015-06-01 2015-06-01 Electrostatic chuck for controlling chucking and dechucking of mask

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KR101791675B1 true KR101791675B1 (en) 2017-10-30

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KR102072893B1 (en) * 2017-12-26 2020-02-03 주식회사 야스 Touch plate integrated magnet plate with switching magnet and alignment system using it

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3175333B2 (en) * 1992-06-15 2001-06-11 日新電機株式会社 Substrate processing equipment

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3175333B2 (en) * 1992-06-15 2001-06-11 日新電機株式会社 Substrate processing equipment

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